JP4893705B2 - Electronic equipment - Google Patents

Description

  The present invention relates to an electronic apparatus in which an opening of a case having a container shape having an opening on one end side is shielded by an electronic component mounting surface of a substrate.

  This type of electronic device generally has a container shape having an opening on one end side, a case having a terminal through which an electric signal flows at an opening edge located around the opening, and one surface larger in size than the opening And an electronic part is mounted on the one surface side, and a terminal through which an electric signal flows is exposed on the one surface side, the one surface of the substrate and the opening of the case are opposed to each other, and the opening In a state where the lid is covered with the substrate, one surface of the substrate and the opening edge of the case are connected.

  Specifically, a hybrid IC product or the like is generally used to connect a board on which an electronic component is mounted to a connector case. In this case, when connecting and sealing the board and the case, the terminal welding process, packing Insert and close the lid with the substrate. According to this, although electrical connection and sealing are ensured, there are problems such as a long process and poor sealing due to poor fitting of the packing.

Here, conventionally, as described in Patent Document 1, a method aimed at connection / sealing between an element and a circuit board has been proposed. In this device, after the element and the circuit board are electrically connected by bumps, the periphery is sealed with a resin member. In this case, the electrical connection and the sealing are also performed in separate steps. I have to.
JP 2000-216660 A

  The present invention has been made in view of the above problems, with the opening of the case having a terminal through which an electrical signal flows at the opening edge covered with the surface on which the electronic component is mounted on the substrate, In an electronic device in which the board and the case are electrically connected, the mechanical and electrical connection between the board and the case, and further the sealing of the opening of the case by the board can be easily performed without causing a sealing failure. The purpose is to.

  In order to achieve the above object, in the first aspect of the present invention, the terminal (23) of the substrate (20) and the terminal (13) of the case (10) are provided at positions facing each other. Between the one surface (21) of the (20) and the opening edge (12) of the case (10), a hermetic connection member (40) for sealing and connecting the space surrounds the opening (11). The hermetic connecting member (40) is provided between the terminal (23) of the substrate (20) and the terminal (13) of the case (10) and is in contact with both terminals (13, 23). A conductive member (41) made of a conductive material for electrically connecting (13, 23), a surface (21) of the substrate (20) and a case (10) located around the conductive member (41). And the resin member (42) made of a resin material for bonding the opening edge (12) of the Made is characterized in that is.

  According to this, in a state where the sealing connection member (40) is interposed between the one surface (21) of the substrate (20) and the opening edge portion (12) of the case (10), the bonding is performed between them. Since both terminals (13, 23) are electrically connected, the mechanical and electrical connection between the substrate (20) and the case (10), and further the opening (11) of the case (10) by the substrate (20). ) Can be easily performed without causing poor sealing.

  Here, in the invention according to claim 2, the terminal (23) of the substrate (20) is provided on one surface (21) of the substrate (20), and the terminal (23) of the inside of the substrate (20). A thermal conductive member (24) harder than the substrate (20) and excellent in thermal conductivity is embedded in a portion located immediately below the substrate (20).

  According to this, when the space is bonded between the one surface (21) of the substrate (20) and the opening edge (12) of the case (10) with the hermetic connection member (40) interposed therebetween, The portion of the terminal (23) of the substrate (20) can be prevented from being dented by the pressurization at the time of adhesion, and the heat at the time of adhesion is efficiently applied to the hermetic connection member (40) through the heat conductive member (24). It is possible to improve the connectivity.

  In the invention according to claim 3, the outer peripheral end portion of the one surface (21) of the substrate (20) protrudes from the opening portion (11) of the case (10) and the opening edge portion (12 of the case (10). ) In the opening edge (12) of the case (10), and the opening (11) in the opening edge (12) of the case (10) is close to the opening (11) in the opening edge (12). A recessed portion (16) having a step surface (16a) in the depth direction of the opening (11) with respect to a portion far from the substrate, and the outer peripheral end of one surface (21) of the substrate (20) The end surface (25) of the substrate (20) facing the bottom surface (16b) of the recess (16) and orthogonal to one surface (21) of the substrate (20) is facing the step surface (16a) of the recess (16). In the state, the outer peripheral end of one surface (21) of the substrate (20) enters the recess (16). In addition, the resin member (42) in the hermetic connection member (40) is interposed between the substrate (20) and the case (10) in the recess (16), and from the one surface (21) of the substrate (20). It is characterized by a bent shape that is bent at a corner portion constituted by one surface (21) and an end surface (25) and continuously extends to the end surface (25).

  According to this, it is possible to increase the contact area between the hermetic connection member (40) and the substrate (20) and the case (10) which are connected members, leading to an improvement in adhesive strength.

  In addition, the code | symbol in the bracket | parenthesis of each means described in the claim and this column is an example which shows a corresponding relationship with the specific means as described in embodiment mentioned later.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following embodiments, parts that are the same or equivalent to each other are given the same reference numerals in the drawings in order to simplify the description.

(First embodiment)
FIG. 1 is a diagram showing a schematic configuration of an electronic device S1 according to the first embodiment of the present invention. In FIG. 1, (a) is a sectional view of the electronic device S1, and (b) is a case 10 in (a). The top view which looked at the opening part 11 of this, and the sealing connection member 40 from the said opening part 11 side, (c) is an enlarged view of A part enclosed with the circle | round | yen in (a).

  The electronic device S1 of the present embodiment is roughly configured to include a case 10, a substrate 20 on which the electronic component 30 is mounted, and a hermetic connection member 40 that electrically and mechanically connects the case 10 and the substrate 20. Has been.

  The case 10 has a container shape having an opening 11 on one end (the lower end in FIG. 1A), and is formed of, for example, an epoxy resin. That is, the case 10 has a bottomed cylindrical shape. In the case 10, as shown in FIG. 1C, a terminal 13 through which an electrical signal flows is provided on the opening edge 12 positioned around the opening 11.

  The terminal 13 of the case 10 is hereinafter referred to as the case terminal 13, but is made of a metal or conductor paste such as copper, iron, or aluminum that is insert-molded in the case 10. A large part 14 such as an electrolytic capacitor or a coil is accommodated in the opening 11 of the case 10 and fixed to the case 10.

  Here, the large component 14 and the case terminal 13 are electrically connected to each other through an internal wiring (not shown) insert-molded inside the case 10. As shown in FIG. 1A, a lead pin 15 is provided on the side opposite to the opening 11 of the case 10 (the upper end side in FIG. 1A).

  The lead pin 15, the large component 14 and the case terminal 13 are electrically connected by the internal wiring. Further, the lead pin 15 is connected to an external wiring or the like (not shown) so as to be electrically connected to the outside. That is, the case 10 of the present embodiment is configured as a connector case that connects the electronic device S1 to the outside.

  The substrate 20 is a wiring substrate such as a ceramic substrate or a printed circuit board, and an electronic component 30 is mounted on one surface 21 which is one plate surface. Here, the one surface 21 of the substrate 20 has a larger planar size than the opening 11 of the case 10.

  Here, as shown in FIG. 1 (b), the opening 11 has a rectangular opening shape, and the substrate 20 is omitted in FIG. 1 (b), but the planar shape of the substrate 20 is A rectangular shape that is slightly larger than the rectangular opening 11 can be used. That is, the board | substrate 20 covers the opening part 11 of the case 10 in the one surface 21, and the said one surface 21 is such a size.

  The electronic component 30 is not particularly limited, and examples thereof include an IC chip, a chip capacitor, and a resistor. For example, a metal plate (not shown) may be attached to the other surface 22 which is the other plate surface opposite to the one surface 21 of the substrate 20.

  Further, a terminal (hereinafter referred to as a substrate terminal) 23 through which an electric signal flows is provided in the peripheral portion of the one surface 21 of the substrate 20. The board terminal 23 is the same as a terminal provided on a general wiring board, and is made of copper, aluminum, or the like.

  The one surface 21 of the substrate 20 and the opening 11 of the case 10 are arranged to face each other, and the opening 11 is covered with the substrate 20. In other words, the one surface 21 of the substrate 20 faces the opening 11 of the case 10, and the peripheral portion of the one surface 21 protruding from the opening 11 faces the opening edge 12 of the case 10. ing.

  In this way, the inside and the outside of the case 10 are blocked by the substrate 20 that covers the opening 11. Thus, the surface 21 of the substrate 20 and the opening edge 12 of the case 10 are connected in a state where the opening 11 of the case 10 is closed by the substrate 20.

  Here, as shown in FIG. 1, the outer peripheral end portion of the one surface 21 of the substrate 20 protrudes from the opening portion 11 of the case 10. A peripheral portion of the one surface 21 including an outer peripheral end portion of the one surface 21 of the substrate 20 is opposed to a portion near the opening 11 in the opening edge 12 of the case 10.

  A portion near the opening 11 in the opening edge 12 of the case 10 is a recess 16. The recess 16 is recessed in the depth direction of the opening 11 as compared to a portion farther from the opening 11 than the recess 16 in the opening edge 12. A step surface 16 a exists between the portion of the opening edge 12 that is far from the opening 11 and the recess 16.

  In other words, the recess 16 is formed by recessing the inner peripheral portion of the opening edge 12 with respect to the outer peripheral portion with the step surface 16 a, and the planar shape of the recess 16 is an annular shape surrounding the opening 11. Has become.

  Here, the depth direction of the opening 11 is the vertical direction in FIGS. 1 (a) and 1 (c). 1C, the bottom surface 16b of the recess 16 is a surface that is located on the bottom side in the recess direction of the recess 16 and is orthogonal to the depth direction of the opening 11, and the step surface of the recess 16 16 a is a surface parallel to the depth direction of the opening 11, that is, a side surface of the recess 16.

  As shown in FIG. 1C, the outer peripheral end portion of the one surface 21 of the substrate 20 faces the bottom surface 16 b of the recess 16. Further, the outer peripheral end surface of the substrate 20, that is, the end surface 25 of the substrate 20 orthogonal to the one surface 21 of the substrate 20 faces the step surface 16 a of the recess 16. In this state, the outer peripheral end portion of the one surface 21 of the substrate 20 enters the recess 16.

  As described above, in the recess 16 of the opening edge 12 of the case 10, the one surface 21 of the substrate 20 and the opening edge 12 of the case 10 face each other. In such a state of facing arrangement, the substrate terminal 23 and the case terminal 13 are provided at positions facing each other, as shown in FIG. Here, the case terminal 13 is provided to be exposed on the bottom surface 16 b of the recess 16 as the opening edge 12.

  In FIG. 1C, the terminals 13 and 23 are in a position facing each other. However, as long as a conductive member 41 to be described later contacts the terminals 13 and 23, they may be slightly shifted from each other. That is, in the state where the one surface 21 of the substrate 20 and the opening edge 12 of the case 10 are opposed to each other, if there is an area where the substrate terminal 23 and the case terminal 13 overlap, a part of both the terminals 13 and 23 is provided. Do not have to overlap.

  The planar arrangement pattern of the substrate terminals 23 and the case terminals 13 is substantially shown in FIG. In FIG. 1B, the planar shape of the hermetic connection member 40 is shown, and here, it is a rectangular frame shape. The conductive member 41 of the hermetic connection member 40 is shown as a plurality of circles arranged in a rectangular frame. The arrangement of the conductive member 41 is substantially the same as the arrangement of the terminals 13 and 23. It is equivalent.

  In the present embodiment, the hermetic connection member 40 is provided between the one surface 21 of the substrate 20 and the opening edge 12 of the case 10. The hermetic connecting member 40 hermetically connects the one surface 21 of the substrate 20 and the opening edge 12 of the case 10 facing each other, and has a planar rectangular frame shape as described above, and the opening 12 Is provided around.

  That is, the substrate 20 shields the opening 11 by the one surface 21, but the peripheral portion of the one surface of the substrate 20 protrudes from the opening 11 and is in contact with the hermetic connection member 40. Further, with respect to the case 10, a hermetic connection member 40 is disposed in a planar annular recess 16 that is the opening edge 12.

  The hermetic connection member 40 is formed by integrating a resin member 42 having a planar rectangular frame shape and a conductive member 41 embedded therein. The conductive member 41 is made of a conductive material such as metal paste, Cu, solder, Cu + solder.

  In addition, the sealing connection member 40 has a rectangular frame shape as a whole, but each conductive member 41 has a column shape extending in the thickness direction of the sealing connection member 40 and is exposed from the resin member 42 on both surfaces in the thickness direction. is doing. Since each conductive member 41 is at a position corresponding to both terminals 13 and 23, it is interposed between both terminals 13 and 23, contacts each terminal 13 and 23 at the exposed portion, and both terminals 13 , 23 are electrically connected.

  Since there are a plurality of the terminals 13 and 23 described above, there are a plurality of conductive members 41 corresponding thereto. However, if the terminals 13 and 23 are one set, the number of the conductive members 41 may be one. In the example of FIG. 1, each conductive member 41 is cylindrical, but may be a prism.

  The resin member 42 is not particularly limited as long as it is made of a resin material capable of bonding the substrate 20 and the case 10. For example, a thermoplastic resin or a thermosetting resin, specifically, epoxy or glass epoxy is used. Or a non-woven epoxy, a mixture of polyimide and an active resin layer, and the like.

  The resin member 42 is positioned around the conductive member 41 to bond the one surface 21 of the substrate 20 and the opening edge 12 of the case 10. Specifically, as shown in FIG. 1 (b), one surface 21 of the substrate 20 and the opening edge of the case 10 at a portion of the sealed connection member 40 where the conductive member 41 does not exist and only the resin member 42 exists. The resin member 42 is in contact with both of the portions 12 and bonding is performed.

  In other words, the hermetic connection member 40 is disposed in an annular shape so as to surround the opening 11 by being interposed between the one surface 21 of the substrate 20 and the opening edge 12 of the case 10. The conductive member 41 and the resin member 42 are arranged in parallel in the direction connecting the one surface 21 of the substrate 20 and the opening edge 12 of the case 10.

  The conductive member 41 is located between the substrate terminal 23 and the case terminal 13, is in contact with the terminals 13, 23, and electrically connects the terminals 13, 23. The resin member 42 Is for bonding the one surface 21 of the substrate 20 and the opening edge portion 12 of the case 11 at a position other than the terminals 13 and 23.

  Such a sealing connection member 40 insert-molds the conductive member 41 during molding of the resin member 42 or pierces the resin member 42 molded into a sheet shape, and inserts the conductive member 41 into the hole. Or by forming a hole in the resin member 42 formed into a sheet shape and forming it by printing or the like. Also, copper plating is applied to the hole, and solder plating or printing / flow soldering is performed thereon. Formed with. As a result, a hermetic connection member 40 in which both the members 41 and 42 are integrated is formed.

  Next, a method for manufacturing the electronic device S1 of the present embodiment will be described with reference to FIG. FIG. 2 is a process diagram showing the manufacturing method. 2A is a schematic sectional view showing a state in which the substrate 20 and the case 10 are opposed to each other, and FIG. 2B is an enlarged view of the vicinity of the outer peripheral end portion of the one surface 21 of the substrate 20 in FIG. The figure shown, (c) is a figure which shows the state after connecting through the sealing connection member 40 from the state of (b).

  First, a case 10 having a container shape having an opening 11 and having a case terminal 13 at an opening edge 12 is prepared, and the large component 14 is fixed to the case 10. If the electronic device does not require the large component 14, components such as the large component 14 may not be fixed to the case 10.

  On the other hand, a substrate 20 having substrate terminals 23 on one surface 21 side is prepared, and an electronic component 30 is mounted on the one surface 21 via a die mount material or the like, and wire bonding or solder reflow is performed as necessary.

  Using the case 10 and the substrate 20 thus prepared, as shown in FIG. 2, the one surface 21 of the substrate 20 and the opening 11 of the case 10 are opposed to each other, and the opening 11 is covered with the substrate 20. At this time, the substrate terminal 23 and the case terminal 13 are opposed to each other, and the hermetic connection member 40 is provided between the one surface 21 of the substrate 20 and the opening edge 12 of the case 10 so as to surround the opening 11.

  Here, as the sealing connection member 40, as described above, a member in which the conductive member 41 and the resin member 42 are integrated is used. Then, the conductive member 41 of the sealed connection member 40, the board terminal 23, and the case terminal 13 are aligned so that the conductive member 41 is in contact with both terminals 13 and 23 between the terminals 13 and 23. Then, the sealing connection member 40 is arranged.

  Subsequently, in this state, the one surface 21 of the substrate 20 and the opening edge 12 of the case 10 are bonded by the resin member 42 by heating and pressurizing. As a result, electrical connection between the terminals 13 and 23 by the conductive member 41 and mechanical connection by the resin member 42 are performed, and as shown in FIG. Connection with is completed.

  By the way, according to the present embodiment, the sealing connection member 40 is interposed between the one surface 21 of the substrate 20 and the opening edge 12 of the case 10, and the terminals 13 and 23 are bonded to each other. Are electrically connected. Therefore, the mechanical and electrical connection between the substrate 10 and the case 10 can be performed in a single process, and the space between the substrate 20 and the case 10 is sealed by the annular hermetic connection member 40, so that the opening is provided. The portion 11 can be easily sealed without causing a sealing failure.

(Second Embodiment)
FIG. 3 is a schematic cross-sectional view showing the main part of the electronic device according to the second embodiment of the present invention, in which the case 10, the substrate 20, and the hermetic connection member 40 are disassembled. The present embodiment is different from the first embodiment in that the board terminal 13 is changed, and here, the difference will be mainly described.

  As shown in FIG. 3, in this embodiment, the substrate 20 is a two-layer substrate in which an insulating layer 20 a made of resin, ceramic, or the like and a metal plate 20 b made of copper, iron, or the like are stacked. The other surface 22 is constituted by a metal plate 20b. The metal plate 20b may be attached to the other surface of the substrate 20 in the above embodiment by bonding or the like.

  Then, by separating a part of the metal plate 20b by etching or pressing, a lead portion 20c that is electrically independent from the metal plate 20b is formed. The lead portion 20 c and the electronic component 30 on the one surface 21 side of the substrate 20 are electrically connected via a wiring 20 d such as a through hole in the substrate 20.

  Further, as shown in FIG. 3, the lead portion 20 c protrudes from the end surface 25 of the substrate 20 to the outside of the substrate 20 and has a surface exposed to the one surface 21 side of the substrate 20. And the board | substrate terminal 13 which consists of metal plating etc. is provided in the surface exposed to the one surface 21 side of the board | substrate 20 in this lead part 20c.

  In this embodiment, electrical / mechanical connection is performed between the lead portion 20c and the open end portion 12 of the case 10 via the hermetic connection member 40. Thereby, similarly to the above-described embodiment, the mechanical and electrical connection between the substrate 10 and the case 10 and the sealing of the opening 11 by the substrate 20 can be easily performed without causing a sealing failure.

(Third embodiment)
FIG. 4 is a schematic cross-sectional view showing the main part of the electronic device according to the third embodiment of the present invention, in which the case 10, the substrate 20, and the hermetic connection member 40 are disassembled. The present embodiment is devised in terms of giving energy for bonding the resin member 42 of the hermetic connection member 40, and can be applied to each of the above embodiments.

  For example, if the case 10 in FIG. 4 is made of a transparent resin that transmits laser light, for example, a transparent epoxy resin, the sealing connection member 40 can be irradiated with the laser light through the case 10, and the resin is generated by the energy. The member 42 can be cured. In this case, the entire case 10 may not be a transparent resin, and only the portion irradiated to the hermetic connection member 40 may be a transparent resin.

  Further, heat may be applied by local friction by applying an ultrasonic wave from the other surface 22 of the substrate 20 to the sealed connection member 40. In the above embodiment, the hermetic connection member 40 is heated by an oven or the like. However, according to these methods, only the hermetic connection member 40 can be substantially partially heated.

(Fourth embodiment)
FIG. 5 is a schematic cross-sectional view showing the main part of the electronic device according to the fourth embodiment of the present invention, in which the case 10, the substrate 20, and the hermetic connection member 40 are disassembled. The state in which the three members 10, 20, 40 are overlapped and connected from the state of FIG. 5 is the same as the states of (b) to (c) of FIG. In the present embodiment, the differences from the first embodiment will be mainly described.

  As shown in FIG. 5, the substrate 20 of the present embodiment is a two-layer substrate in which an insulating layer 20a made of resin, ceramic or the like and a metal plate 20b made of copper, iron or the like are laminated, as in FIG. The other surface 22 of the substrate 20 is constituted by a metal plate 20b.

  Here, the substrate terminal 23 is provided on the one surface 21 of the substrate 20, but a thermally conductive member 24 is embedded in a portion of the inside of the substrate 20 that is located immediately below the substrate terminal 23. The heat conductive member 24 is configured as a convex portion in which a part of the metal plate 20b is protruded by pressing or etching, and is harder than the substrate 20 and excellent in heat conductivity.

  Actually, if the metal plate 20b constituting the heat conductive member 24 is made of copper, iron, or the like, the heat conductive member 24 is harder than the substrate 20 and has excellent heat conductivity. The metal plate 20b having such a heat conductive member 24 may be integrated with the insulating layer 20a when the insulating layer 20a made of, for example, resin or ceramic is formed.

  And in this embodiment, the case 10 and the board | substrate 20 are connected through the sealing connection member 40 like the said 1st Embodiment using the board | substrate 20 with which the heat conductive member 24 was embedded in this way. Then, the electronic device of this embodiment is completed.

  According to the present embodiment, the resin member 42 of the hermetic connection member 40 is bonded when the space 20 is bonded between the one surface 21 of the substrate 20 and the opening edge 12 of the case 10 with the hermetic connection member 40 interposed therebetween. Usually, heating and pressurization are performed in order to perform adhesion by the above.

  When the hermetic connection member 40 is bonded by heating and pressing, the hard heat conductive member 24 supports the portion of the substrate terminal 23 on the substrate 20 from the side opposite to the bonding portion. Therefore, it can prevent as much as possible that the part of the board | substrate terminal 23 is dented by the pressurization at the time of the adhesion | attachment.

  In addition, due to the excellent thermal conductivity of the heat conductive member 24, heat at the time of bonding is efficiently transmitted to the bonded portion, that is, the sealed connection member 40 via the heat conductive member 24, so that the connectivity can be improved. And if this embodiment is applied in combination with the said 1st Embodiment or 3rd Embodiment, the effect of this embodiment and the effect of the said embodiment can be anticipated.

(Fifth embodiment)
FIG. 6 is a schematic cross-sectional view showing the main part of the electronic device according to the fifth embodiment of the present invention, in which the case 10, the substrate 20, and the hermetic connection member 40 are disassembled. In the present embodiment, similarly to the fourth embodiment, a thermally conductive member 24 is embedded in a portion of the inside of the substrate 20 that is located immediately below the substrate terminal 23.

  Here, as shown in FIG. 6, the heat conductive member 24 does not have to be a part of the metal plate 20 b as a convex portion, and is made of a metal material separate from the metal plate 20 b. It may be a thing. In this case, for example, a hole may be formed in the insulating layer 20a of the substrate 20 with a press or the like, and a metal material may be filled therein to form the heat conductive member 24.

  In the fourth and fifth embodiments, any substrate may be used as long as the thermal conductive member 24 is embedded in a portion of the substrate 20 located immediately below the substrate terminal 23. The two-layer substrate may not be used. For example, as the substrate 20, even if the metal plate 20b is omitted, the heat conductive member 24 may be formed by filling a metal material.

(Sixth embodiment)
FIG. 7 is a process diagram showing the main part of the method for manufacturing an electronic device according to the sixth embodiment of the present invention. FIG. Sectional drawing and (b) are schematic sectional drawings which show the state after each member 10,20,40 in (a) was assembled | attached and connected.

  In the present embodiment, as in the above embodiments, the outer peripheral end portion of the one surface 21 of the substrate 20 protrudes from the opening portion 11 of the case 10 and faces a portion near the opening portion 11 in the opening edge portion 12 of the case 10. is doing. Also here, the portion of the opening edge 12 of the case 10 near the opening 11 is the recess 16.

  In this state, when the substrate 20 and the case 10 are connected via the hermetic connection member 40, the outer peripheral end portion of the one surface 21 of the substrate 20 faces the bottom surface 16b of the recess 16 and the substrate 20 also in this embodiment. With the end face 25 facing the step surface 16 a of the recess 16, the outer peripheral end of the one surface 21 of the substrate 20 enters the recess 16.

  At this time, in the present embodiment, as shown in FIG. 7A, the hermetic connection member 40 is disposed at the opening edge 12 of the case 10 from the recess 16 to the outside of the recess 16 (the side away from the opening 11). ) To the size extended to.

  In particular, it is assumed that the size of the resin member 42 is increased at a portion extending outside the recess 16. That is, in this embodiment, as the hermetic connection member 40 before connection, the one in which the width of the rectangular frame-shaped hermetic connection member 40 is expanded outward by the resin member 42 is used as compared with the above-described embodiment.

  Then, after the connection, as shown in FIG. 7B, the resin member 42 in the hermetic connection member 40 is interposed between the substrate 20 and the case 10 in the recess 16, and one surface of the substrate 20. 21 is bent at a corner portion formed by the one surface 21 and the end surface 25 of the substrate 20, and has a bent shape extending continuously to the end surface 25.

  According to the present embodiment, when the hermetic connecting member 40 is bent, the contact area between the hermetic connecting member 40 and the substrate 20 as the connected member and the case 10 can be increased, leading to an improvement in adhesive strength. Further, the present embodiment may be applied in combination with each of the above embodiments.

(Other embodiments)
In each of the above embodiments, the opening edge 12 of the case 10 is configured as the recess 16, but the opening edge 12 may not be provided with a recess. FIG. 8 is a schematic cross-sectional view showing an example in which the opening edge portion 12 is a flat surface as another embodiment.

  In the example shown in FIG. 8, similarly to the first embodiment, the substrate 20 and the case 10 can be connected via the hermetic connection member 40, and the mechanical and electrical connection between the substrate 10 and the case 10 is possible. Furthermore, the opening 11 can be easily sealed with the substrate 20 without causing a sealing failure.

  Moreover, although the manufacturing method of the electronic device was shown also in each said embodiment, the form of these manufacturing methods is described collectively below.

  In this manufacturing method, as shown in the respective drawings, a case 10 having a container shape having an opening 11 on one end side and a terminal 13 through which an electric signal flows in an opening edge 12 positioned around the opening 11 is provided. And the substrate 20 on which the electronic component 30 is mounted on the one surface 21 side and the terminal 23 through which an electric signal flows is exposed on the one surface 21 side, and the one surface 21 of the substrate 20 and the opening of the case 10 are prepared. 13 is a method for manufacturing an electronic device in which one surface 21 of the substrate 20 and the opening edge 12 of the case 13 are connected in a state where the opening 13 is opposed to the substrate 13 and the opening 13 is covered with the substrate 20.

  And in such a manufacturing method, as a form of the 1st manufacturing method, first, the terminal 23 of the board | substrate 20 and the terminal 13 of the case 10 are provided in the mutually opposing position, The one surface 21 of the board | substrate 20, and the case 10 are provided. The hermetic connection member 40 is provided between the opening edge portion 12 and the opening edge portion 12 so as to surround the opening portion 11.

  Here, as the sealing connection member 40, a conductive member 41 made of a conductive material disposed corresponding to the terminal 23 of the substrate 20 and the terminal 13 of the case 10, and a resin material positioned around the conductive member 41. An integrated resin member 42 is used.

  The conductive member 41 is interposed between the terminals 13 and 23 to electrically connect the terminals 13 and 23 so as to be in contact with the terminals 13 and 23, and the resin member 42 and the one surface 21 of the substrate 20. The substrate 20 and the case 10 are connected by the hermetic connection member 40 so that the opening edge 12 of the case 10 is bonded. The above is the form of the first manufacturing method.

  The effect is that, with the sealing connection member 40 interposed between the one surface 21 of the substrate 20 and the opening edge 12 of the case 10, adhesion is performed therebetween and the terminals 13 and 23 are electrically connected. Therefore, the mechanical and electrical connection between the substrate 20 and the case 10 and the sealing of the opening 11 of the case 10 by the substrate 20 can be easily performed without causing a sealing failure.

  Further, in the second manufacturing method, in the first manufacturing method, when preparing the substrate 20, the terminal 23 of the substrate 20 is provided on the one surface 21 of the substrate 20, and the inside of the substrate 20 A thermal conductive member 24 that is harder than the substrate 20 and excellent in thermal conductivity is embedded in a portion located directly below the terminal 23.

  This corresponds to the manufacturing methods of the fourth and fifth embodiments. The effect is that when the surface 21 of the substrate 20 and the opening edge 12 of the case 10 are bonded via the hermetic connecting member 40, the portion of the terminal 23 of the substrate 20 is prevented from being dented by the pressure applied during bonding. In addition, the heat at the time of adhesion is efficiently transmitted to the hermetic connection member 40 via the heat conductive member 30, and the connectivity can be improved.

  Further, the third manufacturing method is applied to the first or second manufacturing method and corresponds to the manufacturing method of the sixth embodiment.

  That is, when the case 10 is prepared, the third manufacturing method is configured such that a portion near the opening 11 in the opening edge 12 of the case 10 is opened with respect to a portion far from the opening 11 in the opening edge 12. 11 is a concave portion 16 having a step surface 16a in the depth direction.

  When the one surface 21 of the substrate 20 and the opening edge portion 12 of the case 10 are opposed to each other through the hermetic connection member 40, the outer peripheral end portion of the one surface 21 that protrudes from the opening portion 11 of the case 10 is the recess 16. With the end face 25 of the substrate 20 facing the bottom surface 16 b and orthogonal to the one surface 21 of the substrate 20 facing the step surface 16 a of the recess 16, the outer peripheral end portion of the one surface 21 of the substrate 20 enters the recess 16.

  At this time, the hermetic connection member 40 is wider than the concave portion 16, and the hermetic connection member 40 and the case 20 are arranged so as to oppose the concave portion 16 and the portion outside the concave portion 16 of the opening edge portion 12. 10 between them.

  Accordingly, at the time of connection, the resin member 42 in the hermetic connection member 40 is deformed into a bent shape that is bent at a corner portion formed by the one surface 21 and the end surface 25 from the one surface 21 of the substrate 20 and continuously extends to the end surface 25. . And the connection by the sealing connection member 40 is performed in this state. The above is the form of the third manufacturing method, and the effect is that the contact area between the hermetic connection member 40, the substrate 20 and the case 10 can be increased, leading to an improvement in adhesive strength.

  In each of the above embodiments, the case 10 may be, for example, a metal case or a resin-deposited metal other than those made of resin or ceramic. And may be electrically joined.

  The alignment of the sealing connection member 40 can be performed by image recognition or alignment. However, if the above-described recess 16 is provided, it is preferable that the recess 16 has a positioning guide function. Conversely, an alignment mark or the like may be formed on the substrate 20 side.

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows schematic structure of the electronic device which concerns on 1st Embodiment of this invention, (a) is sectional drawing of an electronic device, (b) is a top view of the opening part of a case in FIG. (C) is the A section enlarged view in (a). It is process drawing which shows the manufacturing method of the electronic device of 1st Embodiment. It is a schematic sectional drawing which shows the principal part of the electronic device which concerns on 2nd Embodiment of this invention. It is a schematic sectional drawing which shows the principal part of the electronic device which concerns on 3rd Embodiment of this invention. It is a schematic sectional drawing which shows the principal part of the electronic device which concerns on 4th Embodiment of this invention. It is a schematic sectional drawing which shows the principal part of the electronic device which concerns on 5th Embodiment of this invention. It is process drawing which shows the principal part of the manufacturing method of the electronic device which concerns on 6th Embodiment of this invention. It is a schematic sectional drawing which shows other embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Case 11 Case opening 12 Case opening edge 13 Case terminal 16 Recess 16a Recessed step surface 16b Recess bottom surface 20 Substrate 21 One side of substrate 23 Substrate terminal 24 Thermal conductive member 25 End surface 40 of substrate 40 Sealing connection member 41 Conductive member 42 Resin member

Claims (3)

A case (10) having a container shape having an opening (11) on one end side, and having a terminal (13) through which an electric signal flows in an opening edge (12) located around the opening (11);
The size of the one surface (21) is larger than the opening (11), the electronic component (30) is mounted on the one surface (21) side, and the terminal (23) through which an electric signal flows is the one surface (21) side. And a substrate (20) provided on
With the one surface (21) of the substrate (20) and the opening (11) of the case (10) facing each other, the opening (11) is covered with the substrate (20), and the substrate ( 20) In the electronic device in which the one surface (21) and the opening edge (12) of the case (10) are connected,
The terminal (23) of the substrate (20) and the terminal (13) of the case (10) are provided at positions facing each other,
Between the one surface (21) of the substrate (20) and the opening edge (12) of the case (10), a hermetic connection member (40) for sealing and connecting the space is provided in the opening ( 11)
The hermetic connection member (40) is interposed between the terminal (23) of the substrate (20) and the terminal (13) of the case (10) and is in contact with the terminals (13, 23). A conductive member (41) made of a conductive material that electrically connects both terminals (13, 23), and a surface (21) of the substrate (20) positioned around the conductive member (41); An electronic device comprising a resin member (42) made of a resin material that bonds the opening edge (12) of the case (10). The terminal (23) of the substrate (20) is provided on one surface (21) of the substrate (20),
A thermal conductive member (24) that is harder than the substrate (20) and excellent in thermal conductivity is embedded in a portion of the substrate (20) located immediately below the terminal (23). The electronic device according to claim 1. The outer peripheral end of one surface (21) of the substrate (20) protrudes from the opening (11) of the case (10), and the opening (12) in the opening edge (12) of the case (10). 11) Opposite the opposite part,
The portion of the case (10) near the opening (11) in the opening edge (12) is located closer to the opening (11) than the portion of the opening edge (12) far from the opening (11). ) Having a stepped surface (16a) in the depth direction and a recessed recess (16),
The outer peripheral end of one surface (21) of the substrate (20) faces the bottom surface (16b) of the recess (16) and is perpendicular to the one surface (21) of the substrate (20). With the end surface (25) facing the step surface (16a) of the recess (16), the outer peripheral end of one surface (21) of the substrate (20) enters the recess (16),
The resin member (42) in the hermetic connection member (40) is interposed between the substrate (20) and the case (10) in the concave portion (16), and the one surface of the substrate (20) ( The bent portion is bent at a corner portion formed by the one surface (21) and the end surface (21) from 21) and extends continuously to the end surface (25). An electronic device according to 1.

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