JP6666048B2 - Circuit board device - Google Patents

Description

  The present application relates to a circuit board device provided with a resin frame.

  For various reasons such as improvement of insulation, improvement of heat dissipation, improvement of moisture resistance, improvement of heat cycle resistance, and improvement of heat shock resistance, circuit boards on which electrical components are mounted are made of electrical components or wiring with potting resin. Sealing has been performed. In addition, there are various types of packages of electric components mounted on a circuit board, and when a semiconductor element such as a transistor or a diode is taken as an example, a bare chip is directly mounted on a wiring layer of the circuit board by soldering or the like. There are various forms such as a form in which wiring is performed by wire bonding or a lead frame, and a form in which a molded package product in which a bare chip is molded is mounted on a circuit board by soldering or the like.

  Conventionally, as disclosed in Patent Literature 1, for example, as a circuit board device sealed with a potting resin material, a resin frame and a circuit board are bonded with an adhesive to prevent the potting resin material from flowing out. A form of prevention is known. The circuit board device sealed with this potting resin material is manufactured in such a sequence that the electric components are electrically connected to the circuit board by soldering or the like by a reflow process and then the resin frame is bonded to the circuit board via an adhesive. What was done is known.

JP 2017-92059 A

  However, after the electrical components are electrically connected to the circuit board by a reflow process by soldering or the like, when the resin frame is bonded by an adhesive or the like, the resin frame is held by the resin frame by integral molding such as insert molding or outsert molding. The electrode terminal for electrically connecting the circuit board device and the external circuit needs to be connected to a pattern or an electric component on the circuit board by wire bonding, and there is a problem that a bonding step and a wire bonding step are separately required.

  In addition, electrode terminals for electrically connecting the circuit board device held by the resin frame to the external circuit by integral molding such as insert molding or outsert molding, and laser soldering devices for patterning or electric components on the circuit board are used. In the case of using and connecting by soldering, there is a problem that a bonding step and a laser soldering step are required.

  Furthermore, when connecting the electrode terminals in the reflow step, a holding member for the electrode terminals and a sealing member are required, and the number of components or the fixing area of each member increases, and the bonding step is reduced. There are issues that are required separately.

  Furthermore, when soldering is printed on a circuit board, electrical components are arranged, an adhesive is applied, and a resin frame with electrode terminals is assembled and a reflow process is performed, a general process for mounting components on a circuit board is performed. In addition, there is a problem that an adhesive application step is required.

  The present application discloses a technique for solving the above-described problem, and aims to provide a circuit board device that can mount an electric component, an electrode terminal, and a resin frame on a circuit board only by a reflow process. Is what you do.

A circuit board device disclosed in the present application has an electrical component, an electrode terminal connected to an external circuit, and a circuit base, and a wiring layer to which the electrical component and the electrode terminal are attached via a connection member, and a circuit board having an insulating layer for insulating said wiring layer and the circuit substrate, the circuit board, the electrical component, said wiring layer, and the sealing resin material either covering at least a portion of the electrode terminal, A resin frame for holding the electrode terminals and preventing the sealing resin material from flowing out with the circuit board , wherein the resin frame is connected to the wiring layer via the connection member. It has a metal frame .

  According to the circuit board device disclosed in the present application, a wiring layer including an electric component, an electrode terminal connected to an external circuit, and a circuit substrate, and having the electric component and the electrode terminal attached via a connection member And a circuit board having an insulating layer that insulates the circuit substrate and the wiring layer, and a potting resin material that covers at least a part of each of the circuit board, the electric component, the wiring layer, and the electrode terminal, A resin frame for holding the electrode terminals and preventing the potting resin material from flowing out with the circuit board is provided, so that the electric components, the electrode terminals, and the resin frame can be mounted on the circuit board only by the reflow process. A circuit board device is obtained.

FIG. 2 is a perspective view of the circuit board device according to Embodiment 1. FIG. 2 is a sectional view taken along line AA of FIG. 1. FIG. 7 is a cross-sectional view illustrating a modification of the circuit board device according to Embodiment 1. FIG. 9 is a cross-sectional view illustrating another modification of the circuit board device according to Embodiment 1. FIG. 9 is a sectional view of a circuit board device according to a second preferred embodiment; FIG. 10 is a cross-sectional view illustrating a modification of the circuit board device according to Embodiment 2. FIG. 13 is a cross-sectional view showing Example 1 of the circuit board device according to Embodiment 3. FIG. 13 is a cross-sectional view illustrating Example 2 of the circuit board device according to Embodiment 3. FIG. 13 is a sectional view illustrating Example 3 of the circuit board device according to Embodiment 3; FIG. 14 is a cross-sectional view illustrating Example 4 of the circuit board device according to Embodiment 3. FIG. 14 is a cross-sectional view illustrating Example 4 of the circuit board device according to Embodiment 3. FIG. 14 is a cross-sectional view illustrating Example 4 of the circuit board device according to Embodiment 3. FIG. 14 is a sectional view illustrating Example 5 of the circuit board device according to Embodiment 3.

  Hereinafter, a circuit board device according to an embodiment of the present application will be described in detail with reference to the drawings. In the drawings, the same reference numerals indicate the same or corresponding parts. In addition, each drawing illustrates elements necessary for describing this embodiment, and does not necessarily indicate all actual elements.

Embodiment 1 FIG.
FIG. 1 is a perspective view showing a circuit board device according to the first embodiment, and FIG. 2 is a sectional view taken along line AA of FIG. As shown in FIGS. 1 and 2, the circuit board device according to the first embodiment includes a surface-mounted electrical component 1, an electrode terminal 2 connected to an external circuit, and an electrical component 1 via a connection member 3. A metal substrate 5, which is a circuit board to which the electrode portions 4 and the electrode terminals 2 are attached, a sealing resin material, for example, a potting resin material 6, and a structure for holding the electrode terminals 2 and preventing the potting resin material 6 from flowing out. Resin frame 7 is provided. Note that the potting resin material 6 seals the electrode portions 4 and the electrode terminals 2 of the electric component 1 and the wiring layer 8 of the metal substrate 5.

  The electric component 1 is, for example, a transistor or a diode mounted on a surface-mount type semiconductor package, a surface-mount type chip resistor or capacitor, a surface-mount type IC chip, or a metal plate for wiring. Mounted on The electrical connection of the electric component 1 is secured to the wiring layer 8 of the metal substrate 5 via the connection member 3. As the connection member 3, for example, solder or the like is used. Solder is sandwiched between metal members, and the metal members are joined by melting them in a reflow process or the like.

  The metal substrate 5 includes a wiring layer 8 connected to the connection member 3, a metal base 9 serving as a circuit base attached to a housing (not shown) of a product on which the circuit board device is mounted, and a wiring layer 8. And an insulating layer 10 for ensuring insulation between the metal substrate 9 and the metal base 9. The metal substrate 5 is formed by stacking a metal base 9, an insulating layer 10, and a wiring layer 8 in this order. The electrode terminal 2 is electrically connected to an external circuit (not shown) of a product on which the circuit board device is mounted via a connection member 3 to a wiring layer 8 of the metal substrate 5.

  For the resin frame 7, a resin such as a polyphenylene sulfide resin is used, for example. The resin frame 7 holds the electrode terminals 2 by integral molding, and is formed in a sealed form capable of sealing at least a part of the electrode portions 4 and the wiring layer 8 of the electric component 1 and at least a part of the electrode terminals 2 by the potting resin material 6. Have been.

  For example, a metal frame 11 formed by processing a sheet metal into a frame shape is used in a sealing form for sealing at least a part of the electrode portion 4 and the wiring layer 8 of the electric component 1 and the electrode terminal 2 with the potting resin material 6. The frame 11 is attached to the resin frame 7 by integral molding such as insert molding or the like, or by outsert molding. The metal frame 11 is connected to the wiring layer 8 of the metal substrate 5 via the connection member 3 in order to prevent the potting resin material 6 from flowing out of the gap between the resin frame 7 and the metal substrate 5.

  As the potting resin material 6, a silicone gel or an epoxy resin is used. The potting resin material 6 covers at least a part of each of the metal substrate 5, the electric component 1, the wiring layer 8, and the electrode terminal 2, and as described above, the electrode portion 4 and the electrode terminal 2 of the electric component 1, and the metal substrate 5 Is sealed. Further, since the potting resin material 6 needs to be filled in the gap between the electrode portion 4, the wiring layer 8, and the electrode terminal 2 of the electric component 1, it has low thixotropy at the time of filling, but after heating, it is heated or humid by moisture. By hardening or thickening, it stays around the electric component 1, the wiring layer 8, and the electrode terminal 2. Although the characteristics differ depending on the material, improvement in insulation, heat radiation, moisture resistance, heat cycle resistance, and heat shock resistance are attempted.

  According to the circuit board device configured as described above, in the reflow step of mounting the electric component 1 on the metal substrate 5 via the connection member 3, the electrical connection between the electric component 1 and the wiring layer 8 of the metal substrate 5, Electrical connection between the terminal 2 and the wiring layer 8 of the metal substrate 5 and mechanical connection between the sealed metal frame 11 and the sealing frame of the metal substrate 5 can be simultaneously performed.

  As described above, according to the circuit board device of the first embodiment, the electrode terminals 2 and the metal frame 11 are integrally provided on the resin frame 7 so that the electrode terminals 2 can be connected in the reflow step of soldering. Connecting the metal frame 11 to the wiring layer 8 of the metal substrate 5 via the connection member 3 at the same time as connecting the metal frame 11 to the wiring layer 8 of the metal substrate 5 and joining the resin frame 7 and the metal substrate 5. Can be. Therefore, the sealing form can be formed by the potting resin material 6 without performing the bonding step between the resin frame 7 and the metal substrate 5 using an adhesive or the like after the reflow step.

  Further, since the electrode terminals 2 are integrally formed on the resin frame 7, there is no need to perform electrical connection in a later step as compared with the step of connecting the wiring layers 8 and the electrode terminals 2 by wire bonding. In addition, the number of wire bonding steps can be reduced. Also, a resin frame 7 for sealing and a terminal holding structure for the electrode terminals 2 are separately provided, and the electrode terminals 2 are soldered in a reflow process, and the resin frame 7 is bonded to the circuit board with an adhesive in a later process. As compared with the configuration in which the number of components is reduced, the product size can be reduced by reducing the number of components and the mounting area accompanying the reduction in the number of components. Furthermore, compared to a configuration in which the resin frame 7 and the circuit board are bonded using an adhesive in the reflow process, the number of adhesive application steps can be reduced. Further, the wiring layer 8 to which the metal frame 11 is connected via the connecting member 3 may be used as a part of the circuit to reduce the number of wirings on the substrate.

  In the circuit board device according to the first embodiment, a metal plate having an I-shaped cross section is used for the metal frame 11, but a metal having an L-shaped cross section is used instead of the I-shaped cross section as shown in FIG. An L-shaped frame 12 may be used.

  Further, in the circuit board device according to the first embodiment, the metal frame 11 in the sealed form is used. However, instead of the metal frame 11, as shown in FIG. Alternatively, the metal plating 13 and the wiring layer 8 may be connected by a connection member 3 such as solder.

Embodiment 2 FIG.
Next, a circuit board device according to Embodiment 2 of the present application will be described.
FIG. 5 is a sectional view showing a circuit board device according to the second embodiment. The circuit board device according to the second embodiment differs from the first embodiment only in the sealing mode. Therefore, in the second embodiment, only different portions will be described, and descriptions of other portions will be omitted.

In the circuit board device according to the second embodiment, as a sealing form of the resin frame 7 and the metal substrate 5, the frame 14 is formed integrally with the resin frame 7 by insert molding or the like or by outsert molding. The frame 14 is formed of a resin material formed of a heat deformable material, and is formed of, for example, a thermoplastic elastomer.
According to the circuit board device configured as described above, the frame 14 is deformed in the reflow step of mounting the electric component 1 and the electrode terminal 2 on the metal substrate 5 via the connection member 3, so that the frame 14 and the metal The gap between the substrates 5 can be filled.

  As described above, according to the circuit board device according to the second embodiment, the electric component 1 is connected to the metal substrate 5 by providing the resin frame 7 with the electrode terminal 2 and the sealed frame 14. 3, the electrode terminals 2 are connected to the wiring layer 8 of the metal substrate 5 in the reflow step of soldering, and at the same time, the frame 14 in a sealed form fills the gap with the metal substrate 5. Since the resin frame 7 and the metal substrate 5 are joined together, the sealing form of the potting resin material 6 is configured without performing the bonding step between the resin frame 7 and the metal substrate 5 using an adhesive or the like after the reflow process. be able to.

  Also, in a mode in which the electrode terminals 2 are integrally formed on the resin frame 7, it is necessary to secure electrical connection in a later step as compared with a step of securing the connection between the wiring layer 8 and the electrode terminals 2 by wire bonding. Therefore, the number of wire bonding steps can be reduced. Also, a resin frame 7 for sealing and a terminal holding structure for the electrode terminals 2 are separately provided, the electrode terminals 2 are soldered in a reflow process, and the resin frame 7 is bonded to the circuit board with an adhesive in a later process. The number of parts can be reduced as compared with the configuration in which the number of parts is reduced, and the product size can be reduced by reducing the mounting area accompanying the reduction in the number of parts. Also, compared to a configuration in which the resin frame 7 and the circuit board are bonded using an adhesive in the reflow step, the number of steps of applying the adhesive can be reduced.

  In the second embodiment, the heat-deformable material is used for the sealing mode. However, as shown in FIG. 6, instead of the heat-deformable material, a rubber molding frame 15 or the like is integrally molded with the resin frame 7 by insert molding or the like. Alternatively, the gap between the resin frame 7 and the metal substrate 5 may be filled by outsert molding.

Embodiment 3 FIG.
The first and second embodiments show an example of the circuit board device according to the present application, and may take various other forms.
(Example 1)
For example, in the first and second embodiments, the case where the sealing of the resin frame 7 and the metal substrate 5 and the connection of the electrode terminals 2 and the wiring layer 8 are simultaneously performed in the reflow process has been described. Only the sealing of the resin frame 7 and the metal substrate 5 is performed in the reflow process, and the connection between the wiring layer 8 and the electrode terminals 2 and a part of the connection between the electric component 1 such as a semiconductor bare chip and the wiring layer 8 are bonded in the wire bonding process. Wire 16 may be used. The other configuration is the same as that of the first or second embodiment, and the description is omitted.

(Example 2)
As shown in FIG. 8, the resin frame 7 is provided with fixing terminals 17 for fixing the resin frame 7 and the metal substrate 5, and the resin frame 7 and the metal substrate 5 are fixed after the reflow process, so that the resin The strength of the sealing form between the frame 7 and the metal substrate 5 may be ensured, and the vibration durability of the circuit board device may be improved. The other configuration is the same as that of the first or second embodiment, and the description is omitted.

(Example 3)
Further, as shown in FIG. 9, the connection terminals 18 for electrically connecting the wiring layers 8, the wiring layers 8 and the electric components 1, the electric components 1, or both of them are formed by insert molding. Of the metal substrate 5 and the resin frame 7 by electrically connecting to the wiring layer 8 of the metal substrate 5 via the connecting member 3 at the same time during the reflow process. A circuit may be provided three-dimensionally in an out-of-plane direction of the substrate 5. Other configurations are the same as those in the first or second embodiment, and the description is omitted.

(Example 4)
As shown in FIG. 10, FIG. 11, or FIG. 12, a positioning member 19 may be provided on the resin frame 7 to limit the displacement of the resin frame 7 and the metal substrate 5 in and out of the substrate plane. .
The positioning member 19 covers the outer shape of the metal substrate 5 or at least a part of the hole formed in the metal substrate 5, or restricts the positions of the resin frame 7 and the metal substrate 5 in the in-plane and out-plane directions of the substrate. I do. Note that reference numeral 20 in FIG. 12 indicates a housing, and other configurations are the same as those in the first or second embodiment, and a description thereof will be omitted.

(Example 5)
In each of the embodiments described above, the circuit board of the metal base 9 constituting the metal board 5 has been described among the circuit board devices that can take various forms. However, the present invention is not limited to this. As shown, a circuit substrate other than the metal substrate 9 such as a glass epoxy substrate 21 made of a glass epoxy substrate may be used.

Although this application describes various exemplary embodiments and examples, the various features, aspects, and functions described in one or more embodiments may apply to particular embodiments. However, the present invention is not limited thereto, and can be applied to the embodiment alone or in various combinations.
Accordingly, innumerable modifications not illustrated are envisioned within the scope of the technology disclosed herein. For example, a case where at least one component is deformed, added or omitted, and a case where at least one component is extracted and combined with a component of another embodiment are included.

DESCRIPTION OF SYMBOLS 1 Electric component, 2 electrode terminals, 3 connection members, 4 electrode parts, 5 metal substrates, 6 potting resin materials, 7 resin frames, 8 wiring layers, 9 metal base materials, 10 insulating layers, 11 metal frames, 12 metal L-shapes Frame, 13 metal plating, 14 frame, 15 rubber frame, 16 bonding wire, 17 fixed terminal, 18 connection terminal, 19 positioning member, 20 housing, 21 glass epoxy board.

Claims (9)

Electrical components,
An electrode terminal connected to an external circuit;
A circuit board having a circuit substrate, and a wiring layer to which the electric component and the electrode terminal are attached via a connection member, and an insulating layer insulating the circuit substrate and the wiring layer,
A sealing resin material covering at least a part of the circuit board, the electric component, the wiring layer, and the electrode terminal;
A resin frame that holds the electrode terminals and prevents the sealing resin material from flowing out with the circuit board ,
The circuit board device , wherein the resin frame has a metal frame connected to the wiring layer via the connection member . The circuit board device according to claim 1 , wherein the metal frame is formed by integrally molding a sheet metal with the resin frame. The circuit board device according to claim 1 , wherein the metal frame is formed by applying metal plating to the resin frame. Electrical components,
An electrode terminal connected to an external circuit;
A circuit board having a circuit board, and a wiring layer to which the electric component and the electrode terminal are attached via a connection member, and an insulating layer for insulating the circuit board and the wiring layer,
A sealing resin material covering at least a part of the circuit board, the electric component, the wiring layer, and the electrode terminal;
A resin frame that holds the electrode terminals and prevents the sealing resin material from flowing out with the circuit board,
The circuit board device according to claim 1, wherein the resin frame has a rubber molded frame integrally formed with the resin frame and in close contact with the circuit board. Electrical components,
An electrode terminal connected to an external circuit;
A circuit board having a circuit substrate, and a wiring layer to which the electric component and the electrode terminal are attached via a connection member, and an insulating layer insulating the circuit substrate and the wiring layer,
A sealing resin material covering at least a part of the circuit board, the electric component, the wiring layer, and the electrode terminal;
A resin frame that holds the electrode terminals and prevents the sealing resin material from flowing out with the circuit board.
The resin frame, said resin frame and are integrally molded has a frame member provided between the circuit board and the resin frame, and the said frame body formed of a resin material which is molded by the thermal deformation member A circuit board device characterized by the above-mentioned. The resin frame includes a fixing terminal for fixing the resin frame and the circuit board,
The fixed terminal, while being integrally formed with the resin frame, the circuit board device according to any one of claims 1 5, characterized in that connected via the connecting member and the wiring layer. The resin frame includes a connection terminal that connects the wiring layer and the electric component,
The connection terminal, the circuit board device according to any one of claims 1 6, characterized in that said connected via a connecting member to at least a portion of the electrical component and the wiring layer. The resin frame, the circuit board device according to any one of claims 1 to 7, characterized in that it comprises a positioning member for limiting the substrate surface inside and outside direction of the positional deviation of the circuit board and the resin frame. 9. The circuit board device according to claim 8 , wherein the positioning member limits the displacement of the resin frame, the circuit board, and a housing to which the circuit board is attached in a direction in and out of the board surface.

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