JP3126297B2 - Resin-sealed semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resin-sealed semiconductor device which can prevent the adhesion of a heat sink to a metal substrate from being marred by a step between a resin case and the substrate and enhance the adhesion to bring out effectively the heat disspation property. SOLUTION: A resin-sealed semiconductor device has a structure wherein power semiconductor elements 2 and an integrated circuit element 3 for control, which are mounted on a metal substrate 1 and are connected with each other through fine metal wires 4, are surrounded with a resin case 5, housed in the case 5, and sealed with sealing resin 6, and notch parts 13 are respectively formed in each mounting part 9 of the case 5 as deformable regions. Even in the case where a step is generated between the case 5 and the substrated 1 by these notch parts 13, the step is relaxed by the deformation of the substrate 1 by deforming the substrate 1 at the places of the notch parts 13, where the thickness of the resin becomes thin when the substrate 1 is mounted to a heat sink 8 with bolts 11 or screws, and the substrate 1 can be made to bond and fix on the heat sink 8 as it keeps a flatness. As a result, the dissipation of heat to the heat sink 8 is effectively conducted.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin-sealed semiconductor device used for motor control called an intelligent power module containing a power semiconductor element, a control integrated circuit element, and the like, and more particularly to the resin-sealed semiconductor device. The present invention relates to a resin-encapsulated semiconductor device having a mounting portion suitable for effectively dissipating heat generated inside to the outside.

[0002]

2. Description of the Related Art As shown in FIG. 6, a conventional resin-encapsulated semiconductor device has a power semiconductor element 2 and a control integrated circuit element 3 mounted on a metal substrate 1 and connected by thin metal wires 4. It was housed in a resin case 5 and sealed with a sealing resin 6, and an external terminal 7 for external connection was provided so as to protrude outside the sealing resin. The resin-encapsulated semiconductor device is attached to the heat radiating plate 8 by inserting a bolt 1 into a mounting hole 10 of a mounting portion 9 provided at an end of the resin case 5.
1 (or screw) or the like. Also, with respect to the dissipation of heat generated in the resin-encapsulated semiconductor device to the outside, the gap between the resin-encapsulated semiconductor device and the radiator plate 8 is filled with heat-dissipating grease 12 to enhance heat radiation. Was.

[0003]

However, in a resin-encapsulated semiconductor device in which a metal substrate on which a power semiconductor element and a control integrated circuit element are mounted is surrounded by a resin case, the resin case and the metal substrate are integrated. Is not enough,
The mounting portion of the resin case and the mounting surface of the metal substrate may be displaced, or a step may occur between the resin case and the metal substrate. This is due to deformation during the molding of the resin case or an error during the integration operation of the resin case and the metal substrate. When the surface of the metal substrate is attached to the heat sink, the adhesiveness between the heat sink and the metal substrate is reduced due to the step, and the heat radiation characteristic (thermal resistance) is deteriorated. Also, with a step between the resin case and the metal substrate,
Tightening with the bolts causes stress between the resin case and the sealing resin, which may cause separation between the resin case and the sealing resin, thereby impairing reliability.

SUMMARY OF THE INVENTION The present invention solves the above-mentioned conventional problems, and prevents a step formed between a resin case and a metal substrate from deteriorating the adhesiveness between the heat sink and the metal substrate. Further, it is an object of the present invention to provide a resin-encapsulated semiconductor device capable of effectively performing heat dissipation by improving adhesive fixability.

[0005]

SUMMARY OF THE INVENTION The resin-sealed semiconductor of the present invention.
The body device uses multiple electronic devices to solve the conventional problems.
The component is placed on the conductive material, and the resin case is
In the resin-encapsulated semiconductor device having the
The mounting part for mounting the heat sink provided on the surface can be deformed
The deformable area is made of a flexible material.
Is formed. Further, the resin-encapsulated semiconductor device of the present invention
Has multiple electronic components and external terminals for external connection
Metal substrate, the plurality of electronic components and the external terminals
Is fixed to the metal substrate, and the heat sink is removed.
A resin case having a mounting portion for
The plurality of electronic components on the metal substrate in the case and the outside
Resin mold half made of resin that seals the area with the terminal
A conductor device, comprising: a mounting provided on the resin case.
The barrier has a deformable area, and the deformable area is
The region is formed of a flexible material.

[0006]

[Action] From the flexible material to the mounting part at the end of the resin case
By forming a deformable region consisting for Installing put unit, when installed tightened to the heat radiating plate by bolts or screws to deform only the attachment portion itself, a variation of the mounting portion such displacement by the step The heat radiation plate and the metal substrate are bonded flat to improve the adhesiveness with the heat radiation plate. As a result, heat dissipation can be effectively performed. In addition, since the displacement due to the step is alleviated by the deformation of the mounting portion, the stress caused by the displacement between the resin case and the sealing resin can be suppressed, and the separation between the resin case and the sealing resin can be prevented.

[0007]

An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a structural view showing a resin-encapsulated semiconductor device of the present embodiment. A power semiconductor element 2 and a control integrated circuit element 3 are mounted on a metal substrate 1 which is a conductive material. Are enclosed in a resin case 5 and sealed with a sealing resin 6, and external terminals 7 are provided for external connection.
Are provided to protrude outside the sealing resin. The mounting of the resin-encapsulated semiconductor device on the heat sink 8 is as follows.
This is performed by using a bolt 11 (or a screw) or the like in a mounting hole 10 of a mounting portion 9 provided at an end of the resin case 5. Here, in the present embodiment, in the configuration of the attachment portion 9 provided at the end of the resin case 5, a notch 13 is provided in the attachment portion 9 as a region where the attachment portion 9 can be deformed.

The thickness H of the resin between the mounting portion 9 and the main body of the resin case 5 is reduced by the cuts 13,
Even when the mounting portion 9 of the resin case 5 and the mounting surface of the metal substrate 1 are shifted or a step is generated between the resin case 5 and the metal substrate 1, the mounting portion 9 is mounted on the heat radiating plate 8 with the bolts 11 or screws. At this time, by deforming the cut portion 13 where the resin thickness is reduced, the step can be reduced by the deformation, and the metal substrate 1 and the heat sink 8 can be bonded and fixed while maintaining the flatness. As a result, there is no problem in dissipating the heat to the radiator plate 8, and the heat is radiated to the radiator plate 8 effectively.

In order to dissipate the heat generated in the resin-sealed semiconductor device to the outside, the resin-sealed semiconductor device, that is, the gap between the metal substrate 1 and the heat radiating plate 8 is radiated by the heat-radiating grease 1.
By burying with 2, the heat radiation is more effectively performed.

The notch 13, which is a deformable area of the mounting portion 9, may be a groove such as a V-shaped groove or a U-shaped groove. The entire area between the main body and the main body may be partial.
However, it is necessary to provide the notch 13 so that only the mounting portion 9 is deformed when it is fixed to the radiator plate by fastening with the bolt 11.

FIG. 2 shows the action of the cut 13 formed in the mounting portion 9 when there is a shift between the metal substrate 1 and the resin case 5.

As shown in FIG. 2, the step caused by the displacement is alleviated by the deformation of the mounting portion 9, so that the metal substrate 1 and the heat radiating plate 8 maintain the flatness and the area of the resin case 5 on the metal substrate 1 Can be bonded and fixed without generating stress. However, when there is no cut portion 13,
The deformation at the mounting portion 9 is not possible, and as shown in FIG. 3, the metal substrate 1 rises 14 with respect to the heat sink, or the resin case 5 itself is deformed as shown in FIG. The case 5 and the sealing resin 6 may cause peeling 15 due to stress.

Next, the heat dissipation (thermal resistance) of this embodiment will be described with reference to FIG. This FIG.
Using an aluminum radiator plate of × 15cm × 3cm,
The structure of the present embodiment with a power of 50 W and an application time of 10 minutes,
The figure also shows the results of measuring the respective thermal resistance values of each resin-encapsulated semiconductor device having a conventional structure.

As shown in FIG. 5, the thermal resistance is significantly different between the case where the cut portion 13 is formed in the mounting portion 9 of the resin case 5 as in this embodiment and the conventional structure. It can be seen that the structure in which the cuts 13 are formed has better heat dissipation.

Further, the deformable region of the mounting portion 9 may be formed of a deformable material, for example, a rubber material, a flexible resin, or the like, in addition to the cut portion 13 as described above. The effect of is obtained. Further, even if the mounting portion 9 itself is partially formed of a flexible resin or the like and the entire surface is formed, the same effect can be obtained by the same operation.

[0017]

According to the present invention, for example, a notch is formed as a deformable area in the mounting portion at the end of the resin case, and the mounting portion is fastened to the heat radiating plate with bolts or screws. In addition, only the mounting portion itself is deformed, a shift due to a step is reduced by the deformation of the mounting portion, the adhesiveness to the heat radiating plate is improved, and the heat radiation can be improved. In addition, since the displacement due to the step is alleviated by the deformation of the mounting part, the stress caused by the displacement generated between the resin case and the sealing resin can be suppressed,
Separation between the resin case and the sealing resin can also be prevented.

[Brief description of the drawings]

FIG. 1 is a configuration diagram showing a resin-sealed semiconductor device according to one embodiment of the present invention.

FIG. 2 is a diagram showing the operation of a resin-sealed semiconductor device according to one embodiment of the present invention.

FIG. 3 is a diagram showing the operation of a resin-sealed semiconductor device according to one embodiment of the present invention.

FIG. 4 is a diagram showing the operation of a resin-sealed semiconductor device according to one embodiment of the present invention.

FIG. 5 is a view showing the heat dissipation of the resin-sealed semiconductor device according to one embodiment of the present invention;

FIG. 6 is a configuration diagram showing a conventional resin-encapsulated semiconductor device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Metal substrate 2 Power semiconductor element 3 Control integrated circuit element 4 Fine metal wire 5 Resin case 6 Sealing resin 7 External terminal 8 Heat sink 9 Attachment part 10 Attachment hole 11 Bolt 12 Radiation grease 13 Cut part 14 Lifting 15 Peeling

────────────────────────────────────────────────── (5) References JP-A-59-168656 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01L 25/04

Claims (2)

(57) [Claims] 1. A plurality of electronic components are mounted on a conductive material,
In a resin-encapsulated semiconductor device having a structure in which an outer periphery is surrounded by a resin case, a mounting portion for mounting a heat sink provided in the resin case has a deformable region,
A resin-encapsulated semiconductor device, wherein the active region is formed of a flexible material . Wherein a plurality of electronic components, and the metal substrate mounted with an external terminal for external connection, it encloses the outer circumference of said plurality of electronic component and the <br/> external terminal, the metal substrate Fixed,
A resin case having a mounting portion for mounting a heat sink,
Wherein a region become more resin-sealed semiconductor device as sealed resin and the metal of the plurality of electronic components on a substrate in a resin case and the external terminal, the mounting portion is provided in the resin case It has a deformable region, wherein the variable
A resin-encapsulated semiconductor device , wherein a shapeable region is formed of a flexible material .