CN117812805A

CN117812805A - Preparation method of packaging structure and packaging structure

Info

Publication number: CN117812805A
Application number: CN202211177521.5A
Authority: CN
Inventors: 林维信; 郭志
Original assignee: Hongqisheng Precision Electronics Qinhuangdao Co Ltd; Avary Holding Shenzhen Co Ltd
Current assignee: Hongqisheng Precision Electronics Qinhuangdao Co Ltd; Avary Holding Shenzhen Co Ltd
Priority date: 2022-09-26
Filing date: 2022-09-26
Publication date: 2024-04-02

Abstract

The application provides a preparation method of a packaging structure, which comprises the following steps: providing a substrate unit comprising a circuit board, a first element and a first packaging layer, wherein the circuit board comprises a first conductive circuit layer, the first element is arranged on the circuit board and is electrically connected with the first conductive circuit layer, and the first packaging layer covers the first element and the first conductive circuit layer; forming an opening penetrating through the first packaging layer, wherein part of the first conductive circuit layer is exposed out of the opening; forming a conductive adhesive layer at least on the openings; laminating a conductive layer on the conductive adhesive layer; forming a window penetrating at least the conductive layer, and forming a second conductive circuit layer on the conductive layer after forming the window, thereby obtaining an intermediate; forming a second element electrically connected with the second conductive circuit layer on the intermediate body, wherein at least part of the first packaging layer is arranged between the first element and the second element; and forming a second packaging layer on the second conductive circuit layer. The preparation method is beneficial to improving the yield and reducing the preparation cost. The application also provides a packaging structure.

Description

Preparation method of packaging structure and packaging structure

Technical Field

The application relates to the field of circuit board packaging, in particular to a preparation method of a packaging structure and the packaging structure.

Background

The conventional packaging technology generally comprises the steps of preparing two circuit boards with electronic components packaged therein, laminating the two circuit boards, soldering solder balls on the solder joints, and filling an insulating adhesive layer between the two circuit boards to cover the solder balls.

However, for convenience of soldering, the packaging layer of the circuit board at the bottom only packages the electronic component, so that the solder joint of the circuit board is exposed, and the packaging layer of the circuit board at the top generally packages the whole surface of the substrate, thereby leading to different widths of the packaging layers of different circuit boards, different size requirements on the packaged jig, and increasing the manufacturing cost. Moreover, soldering the circuit board can lead to warpage of the circuit board, affecting yield of the product.

Disclosure of Invention

In view of this, the present application provides a method for manufacturing a package structure that facilitates improving yield and reducing manufacturing costs.

In addition, the application also provides a packaging structure.

The application provides a preparation method of a packaging structure, which comprises the following steps:

providing a substrate unit, wherein the substrate unit comprises a circuit board, a first element and a first packaging layer, the circuit board comprises a first conductive circuit layer, the first element is arranged on the circuit board and is electrically connected with the first conductive circuit layer, and the first packaging layer covers the first element and the first conductive circuit layer;

opening an opening penetrating through the first packaging layer, wherein the opening avoids the first element in a first direction, and part of the first conductive circuit layer is exposed out of the opening;

filling conductive glue material at least in the openings and curing to form a conductive glue layer;

pressing a conductive layer on the conductive adhesive layer, wherein the conductive adhesive layer is connected with the first conductive circuit layer and the conductive layer;

forming a window penetrating at least the conductive layer, wherein the window avoids the opening in the first direction, part of the first packaging layer is exposed out of the window, and the conductive layer forms a second conductive circuit layer after the window is formed, so that an intermediate is obtained;

forming a second element on the intermediate body and enabling the second element to be electrically connected with the second conductive circuit layer, wherein at least part of the first packaging layer is arranged between the first element and the second element in a second direction perpendicular to the first direction;

and forming a second packaging layer on the second conductive circuit layer, wherein the second packaging layer covers the second element and is exposed out of the first packaging layer of the window.

Optionally, the step of forming the conductive adhesive layer includes:

filling conductive adhesive in the open holes and curing to form first adhesive layers, wherein part of the first adhesive layers are filled in the open holes and connected with the first conductive circuit layers;

a conductive column is arranged on the first adhesive layer in the opening;

and coating conductive adhesive on the first packaging layer and curing to form a second adhesive layer, wherein the second adhesive layer also covers the conductive column, the first adhesive layer and the second adhesive layer form the conductive adhesive layer, and the window is further penetrated through the second adhesive layer.

Optionally, the second conductive circuit layer includes a first portion and a second portion other than the first portion, the first portion overlaps with the first element in the second direction and is used for installing the second element, an end portion of the conductive pillar, which is away from the first conductive circuit layer, is convexly disposed on the first packaging layer, a projection of at least one conductive pillar on the first portion is located in a range of the first portion, the window is located in the first direction and further avoids the first element, and the second adhesive layer connects the first portion and a portion corresponding to the first portion to the first packaging layer.

Optionally, forming the second element and electrically connecting the second element to the second conductive trace layer specifically includes:

forming the second element on the first portion;

a wire is bonded between the second portion and the second element.

Optionally, along the first direction, a width of the first portion is greater than or equal to a width of the second element.

Optionally, the circuit board further includes a third conductive trace layer opposite to the first conductive trace layer in the second direction, and after the second encapsulation layer is formed, the preparation method further includes:

and forming a solder ball on the third conductive circuit layer, wherein the solder ball is convexly arranged on the third conductive circuit layer along the direction opposite to the second direction.

The application also provides a packaging structure, which comprises a circuit board, a first element, a first packaging layer, a conductive adhesive layer, a second conductive circuit layer, a second element and a second packaging layer;

the circuit board comprises a first conductive circuit layer, and the first element is arranged on the circuit board and is electrically connected with the first conductive circuit layer;

the first packaging layer covers the first element and the first conductive circuit layer, an opening is formed in the first packaging layer, the opening avoids the first element in the first direction, and part of the first conductive circuit layer is exposed out of the opening;

the conductive adhesive layer is at least arranged in the open hole and is connected with the first conductive circuit layer and the second conductive circuit layer;

the second conductive circuit layer comprises a window exposing the first packaging layer, the second element is electrically connected with the second conductive circuit layer, and at least part of the first packaging layer is arranged between the first element and the second element in a second direction perpendicular to the first direction;

the second packaging layer is arranged on the second conductive circuit layer and also covers the second element and the first packaging layer exposed out of the window.

Optionally, the packaging structure further includes a conductive post, the conductive post includes a first glue layer and a second glue layer, the first glue layer is disposed in the opening and connected to the first conductive circuit layer, at least a portion of the conductive post is disposed in the opening, the conductive post is connected to the first glue layer and the second glue layer along the second direction, and the second glue layer is connected to the second conductive circuit layer.

Optionally, the second conductive circuit layer includes a first portion and a second portion other than the first portion, the first portion overlaps the first element in the second direction, the second element is disposed on a surface of the first portion away from the first conductive circuit layer, an end portion of the conductive pillar away from the first conductive circuit layer is protruding on the first encapsulation layer, a projection of at least one conductive pillar on the first portion is located in a range of the first portion, and the second adhesive layer connects the first portion and a portion corresponding to the first portion to the first encapsulation layer.

Optionally, the circuit board further includes a third conductive circuit layer opposite to the first conductive circuit layer in the second direction, and the packaging structure further includes a solder ball, where the solder ball is convexly disposed on the third conductive circuit layer along a direction opposite to the second direction.

Compared with the prior art, the packaging structure has the advantages that through forming the opening on the first packaging layer, at least forming the conductive adhesive layer in the opening, forming the window after laminating the conductive layer on the conductive adhesive layer to form the second conductive circuit layer, forming the second element on the second conductive circuit layer and covering the second element and the second packaging layer of the second conductive circuit layer. The first conductive circuit layer and the second conductive circuit layer are connected through the conductive adhesive layer, so that the welding process is reduced, the warping problem of the packaging structure caused by welding can be avoided, and the yield of the packaging structure is improved. In addition, the first packaging layer and the second packaging layer can be formed through the jig with the same size, so that the preparation cost can be reduced.

Drawings

FIG. 1 is a cross-sectional view of a substrate unit according to an embodiment of the present disclosure;

FIG. 2 is a cross-sectional view of an opening formed in the substrate unit of FIG. 1;

FIG. 3 is a cross-sectional view of a first glue layer formed in the opening shown in FIG. 2;

FIG. 4 is a cross-sectional view of a conductive post formed on the first glue layer within the opening of FIG. 3;

FIG. 5 is a cross-sectional view of a second glue layer formed on the conductive post of FIG. 4;

FIG. 6 is a cross-sectional view of a conductive layer formed on the second glue layer shown in FIG. 5;

fig. 7 is a cross-sectional view of a window formed in the conductive layer to form a second conductive trace layer;

FIG. 8 is a cross-sectional view of a second component formed on the second conductive trace layer shown in FIG. 7;

fig. 9 is a cross-sectional view of a second lead formed on the second element and the second conductive trace layer shown in fig. 8;

fig. 10 is a cross-sectional view of a second encapsulation layer formed over the second conductive trace layer shown;

fig. 11 is a cross-sectional view of a solder ball formed on the third conductive trace layer of fig. 10.

Description of the main reference signs

Packaging structure 100

Circuit board 10

Substrate layer 11

First conductive trace layer 12

Third conductive line layer 13

First element 20

First lead 21

First encapsulation layer 30

Substrate unit 101

Opening 31

Conductive adhesive layer 40

First adhesive layer 41

Second adhesive layer 42

Second conductive line layer 50

First portion 51

Second portion 52

Conductive layer 501

Window 502

Intermediate 102

Second element 60

Second lead wire 61

Second encapsulation layer 70

Conductive post 80

Solder ball 90

Width W1, W2

First direction X

Second direction Y

The following detailed description will further illustrate the application in conjunction with the above-described figures.

Detailed Description

The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application.

It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. When an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present.

The application provides a preparation method of a packaging structure. The sequence of steps of the preparation method can be changed according to different requirements, and certain steps can be omitted or combined. The preparation method comprises the following steps:

step one: referring to fig. 1, a substrate unit 101 is provided, the substrate unit 101 including a circuit board 10, a first element 20, a first encapsulation layer 30, and a first lead 21. The circuit board 10 includes a first conductive trace layer 12, a base material layer 11, and a third conductive trace layer 13. The first conductive trace layer 12 and the third conductive trace layer 13 may be disposed on the substrate layer 11, respectively. Furthermore, the first conductive trace layer 12 may be exposed on one surface of the substrate layer 11, and the third conductive trace layer 13 may be exposed on the other surface opposite to the substrate layer 11. In other embodiments, the first conductive trace layer 12 and the third conductive trace layer 13 may be respectively stacked on two opposite surfaces of the substrate layer 11. The first element 20 is placed on the substrate layer 11 without the first conductive trace layer 12. The first lead 21 electrically connects the first element 20 and the first conductive trace layer 12. The first encapsulation layer 30 covers the first element 20 and the first conductive trace layer 12.

The materials of the first conductive trace layer 12, the third conductive trace layer 13 and the first lead 21 include, but are not limited to, copper. The material of the substrate layer 11 includes, but is not limited to, one of a liquid crystal polymer, a polyimide resin, a polyamide resin, and a polycarbonate resin. The material of the first encapsulation layer 30 includes, but is not limited to, a thermosetting resin such as epoxy. The first encapsulation layer 30 may be formed by thermally curing the thermosetting resin. The first element 20 includes, but is not limited to, a chip.

In further embodiments, the circuit board 10 may not include the third conductive trace layer 13. In other embodiments, the first element 20 may be fixed to the first conductive trace layer 12 by soldering bumps, such as by ball placement. In further embodiments, a recess (not shown) may be provided through the first conductive trace layer 12 and the substrate layer 11 on the circuit board 10 to position the first element 20 within the circuit board 10 and to electrically connect the first element 20 and the first conductive trace layer 12 through the first lead 21.

Step two: referring to fig. 1 and 2, an opening 31 penetrating the first encapsulation layer 30 is formed on the substrate unit 101. The opening 31 avoids the first element 20 in the first direction X. A portion of the first conductive trace layer 12 is exposed through the opening 31. The openings 31 may be formed by means of mechanical openings or laser openings. In this embodiment, the openings 31 are disposed on opposite sides of the first member 20 along the extending direction of the circuit board 10. In further embodiments, the opening 31 may be disposed at one side of the first member 20 along the extending direction of the circuit board 10. In other embodiments, the openings 31 may be disposed around the periphery of the first member 20.

Step three: referring to fig. 3, the conductive paste is filled in the openings 31 and cured to form the first paste layer 41. The first adhesive layer 41 connects the first conductive trace layer 12 and fills a portion of the first opening 31. That is, the surface of the first adhesive layer 41 away from the first conductive trace layer 12 is lower than the opening of the opening 31. The conductive paste includes, but is not limited to, conductive fillers and resins. Specifically, the first adhesive layer 41 includes, but is not limited to, anisotropic conductive adhesive film.

Step four: referring to fig. 4, a conductive post 80 is disposed on the first glue layer 41 within the opening 31. The end of the conductive post 80 facing away from the first conductive circuit layer 12 is protruding from the first encapsulation layer 30. The material of the conductive post 80 may be a metal or a metal alloy. Such as copper or copper alloys.

In other embodiments, the end of the conductive post 80 may be flush with the first encapsulation layer 30 or recessed into the first encapsulation layer 30. In other embodiments, the conductive posts 80 may not be provided.

Step five: referring to fig. 5, a conductive paste is coated on the first encapsulation layer 30 to form a second paste layer 42. The second glue layer 42 also covers the conductive pillars 80. The first glue layer 41 and the second glue layer 42 form a conductive glue layer 40. The material of the second glue layer 42 includes, but is not limited to, a resin and a conductive filler. Specifically, the second adhesive layer 42 includes, but is not limited to, anisotropic conductive adhesive films. The materials of the first adhesive layer 41 and the second adhesive layer 42 may be different or the same.

In other embodiments, the conductive posts 80 may be omitted, in which case the openings 31 may be directly filled with conductive paste and cured to form the conductive paste layer 40. The material of the conductive paste layer 40 may be the same as that of the first paste layer 41. The conductive adhesive layer 40 may be flush with the opening 31 or the conductive adhesive layer 40 may protrude from the first conductive circuit layer 12 toward the first encapsulation layer 30 and further cover the first encapsulation layer 30.

Step six: referring to fig. 6, a conductive layer 501 is laminated on the second adhesive layer 42 so that the second adhesive layer 42 is connected to the conductive layer 501. The conductive layer 501 and the first conductive circuit layer 12 are in circuit communication through the first glue layer 41, the conductive post 80 and the second glue layer 42. The first adhesive layer 41 and the second adhesive layer 42 are matched with the conductive posts 80 to facilitate the connection of wires between conductive fillers in the conductive adhesive. The material of the conductive layer 501 includes, but is not limited to, a metal or metal alloy, such as copper or copper alloy.

In another embodiment, in the case of omitting the conductive post 80, the conductive layer 501 is laminated on the conductive adhesive layer 40, and at this time, the conductive adhesive layer 40 connects the first conductive circuit layer 12 and the conductive layer 501. The first conductive circuit layer 12 and the conductive layer 501 are electrically connected through the conductive adhesive layer 40.

The first encapsulation layer 30 around the openings 31 may provide insulation protection for the first glue layer 41, the combination of the conductive pillars 80 and the second glue layer 42, or the conductive glue layer 40. Therefore, the technical solution provided by the present application does not require additional underfilling to provide insulation protection.

Step seven: referring to fig. 6 and 7, a window 502 penetrating the conductive layer 501 and the second adhesive layer 42 is formed, and a portion of the first encapsulation layer 30 is exposed from the window 502. The conductive layer 501 forms the second conductive line layer 50 after the window 502 is opened. The window 502 is arranged in the first direction X avoiding the opening 31 and the first element 20, resulting in an intermediate body 102. The fenestration 502 may be formed by etching the conductive layer 501 and laser removing the second glue layer 42. Referring to fig. 7, the second conductive trace layer 50 includes a first portion 51 and a second portion 52 other than the first portion 51, and the first portion 51 may overlap the first element 20 in a second direction Y perpendicular to the first direction X. The first portion 51 is used for mounting the second element 60 (see fig. 8). The projection of at least one of the conductive posts 80 onto the first portion 51 is within the confines of the first portion 51. The second adhesive layer 42 is further connected to the first portion 51 and a portion of the first encapsulation layer 30 corresponding to the first portion 51, so that the second adhesive layer 42 covers two adjacent surfaces of the conductive post 80 corresponding to the first portion 51, which is beneficial to improving the adhesion stability of the first portion 51.

In another embodiment, when the conductive adhesive layer 40 is directly formed in the opening 31, the conductive layer 501 is pressed onto the conductive adhesive layer 40, and when the conductive adhesive layer 40 does not cover the first encapsulation layer 30, the window 502 may only penetrate the conductive layer 501, and the window 502 may be formed by etching or laser ablation.

The application can realize the electrical connection of the first conductive circuit layer 12 and the second conductive circuit layer 50 by coating the glue material and curing to form the conductive glue layer 40, and compared with the scheme of the solder ball in the prior art, the problem of warping caused by soldering can be avoided.

Step eight: referring to fig. 7 and 8, the second member 60 is formed on the intermediate body 102. In this embodiment, the second element 60 is disposed on a surface of the first portion 51 facing away from the first conductive trace layer 12. The first element 20 and the second element 60 overlap in the second direction Y. In the second direction Y, the first portion 51, the second glue layer 42 and the first encapsulation layer 30 are arranged between the first element 20 and the second element 60. Along the first direction X, the width W1 of the first portion 51 is greater than or equal to the width W2 of the second element 60. The width of the first portion 51 is arranged to facilitate heat dissipation from the second element 60.

The first element 20 and the second element 60 may be of the same type or of different types. The second element 60 includes, but is not limited to, a chip.

In other embodiments, the window 502 may be disposed only away from the opening 31, so that the first encapsulation layer 30 outside the opening 31 is exposed out of the window 502. The second element 60 may be disposed on a surface of the first encapsulation layer 30 facing away from the first conductive trace layer 12. As long as at least a portion of the first encapsulation layer 30 is disposed between the first element 20 and the second element 60 in the second direction Y to achieve insulation isolation of the first element 20 and the second element 60.

Step nine: referring to fig. 9, a second lead 61 is soldered between the second portion 52 and the second member 60 to electrically connect the second member 60 to the second conductive trace layer 50. The material of the second lead 61 includes, but is not limited to, a metal or an alloy. Such as copper or copper alloys.

In other embodiments, the second lead 61 may not be provided, and the second element 60 may be soldered to the first portion 51 by solder.

Step ten: referring to fig. 10, a second encapsulation layer 70 is formed on the second conductive trace layer 50. The second encapsulation layer 70 covers the second element 60 and the first encapsulation layer 30 exposed through the window 502. The second encapsulation layer 70 is connected to the first encapsulation layer 30 through the second conductive trace layer 50, so that the encapsulation stability of the first encapsulation layer 30 and the second encapsulation layer 70 can be improved. In addition, since the first encapsulation layer 30 and the second encapsulation layer 70 both cover the entire area of the circuit board 10, the first encapsulation layer 30 and the second encapsulation layer 70 can be prepared using the same-sized jig, thereby reducing the manufacturing cost. The material of the second encapsulation layer 70 includes, but is not limited to, a thermosetting resin such as epoxy. The second encapsulation layer 70 may be formed by thermally curing the thermosetting resin.

Step eleven: referring to fig. 11, solder balls 90 are formed on the third conductive trace layer 13 to form a package structure 100. The solder balls 90 are protruding from the third conductive circuit layer 13 along the direction opposite to the second direction Y. The solder balls 90 may be formed on the third conductive trace layer 13 by soldering. The solder balls 90 may be solder balls.

In further embodiments, the package structure 100 may not include the solder balls 90.

The opening 31 is formed on the first packaging layer 30, the conductive adhesive layer 40 is formed in the opening 31, the opening 502 is formed after the conductive layer 501 is pressed on the conductive adhesive layer 40 to form the second conductive circuit layer 50, and the second element 60 and the second packaging layer 70 covering the second element 60 and the second conductive circuit layer 50 are formed on the second conductive circuit layer 50. The first conductive trace layer 12 and the second conductive trace layer 50 are connected by the conductive adhesive layer 40, so that the soldering process is reduced, the warpage problem of the package structure 100 caused by soldering can be avoided, and the yield of the package structure 100 is improved. In addition, the present application can form the first and second encapsulation layers 30 and 70 by the same-sized jigs, and thus can reduce the manufacturing cost.

Referring to fig. 11, the present application also provides a package structure 100. The package structure 100 includes a circuit board 10, a first element 20, a first package layer 30, a conductive adhesive layer 40, a second conductive trace layer 50, a second element 60, and a second package layer 70. The circuit board 10 includes a first conductive trace layer 12 and a substrate layer 11. The first component 20 is disposed on the circuit board 10 and electrically connects the first conductive trace layer 12. In this embodiment, the first element 20 is disposed on the surface of the substrate layer 11 exposed from the first conductive trace layer 12. The package structure 100 further includes a first lead 21, and the first lead 21 electrically connects the first element 20 and the first conductive trace layer 12. In further embodiments, a recess may be provided in the circuit board 10 to place the first component 20 on the circuit board 10. In further embodiments, the first element 20 may be disposed on the first conductive trace layer 12. The package structure 100 may not include the first lead 21, and the first element 20 may be electrically connected to the first conductive trace layer 12 through a solder ball.

With continued reference to fig. 11, the first encapsulation layer 30 covers the first component 20 and the first conductive trace layer 12. The first encapsulation layer 30 is provided with an opening 31. The opening 31 avoids the first element 20 in the first direction X. A portion of the first conductive trace layer 12 is exposed through the opening 31. The conductive adhesive layer 40 is disposed at least in the opening 31 and connects the first conductive trace layer 12 and the second conductive trace layer 50. The second conductive trace layer 50 includes a window 502 exposing the first encapsulation layer 30. The second element 60 is electrically connected to the second conductive trace layer 50. At least a portion of the first encapsulation layer 30 is disposed between the first element 20 and the second element 60 in a second direction Y perpendicular to the first direction X. The second encapsulation layer 70 is disposed on the second conductive circuit layer 50 and covers the second element 60 and the first encapsulation layer 30 exposed from the window 502.

In some embodiments, with continued reference to fig. 11, the package structure 100 further includes conductive pillars 80. The conductive adhesive layer 40 includes a first adhesive layer 41 and a second adhesive layer 42. The first adhesive layer 41 is disposed in the opening 31 and connects the first conductive trace layer 12. At least a portion of the conductive posts 80 are disposed in the openings 31, and the conductive posts 80 connect the first adhesive layer 41 and the second adhesive layer 42 along the second direction Y. The second adhesive layer 42 is connected to the second conductive trace layer 50.

In further embodiments, the package structure 100 may not include the conductive pillars 80.

In some embodiments, with continued reference to fig. 11, the second conductive trace layer 50 includes a first portion 51 and a second portion 52 in addition to the first portion 51. The first portion 51 overlaps the first element 20 in the second direction Y. The second element 60 is disposed on a surface of the first portion 51 remote from the first conductive trace layer 12. The end of the conductive post 80 facing away from the first conductive circuit layer 12 is protruding from the first encapsulation layer 30. The projection of at least one of the conductive posts 80 onto the first portion 51 is within the confines of the first portion 51. The second adhesive layer 42 connects the first portion 51 and a portion of the first encapsulation layer 30 corresponding to the first portion 51.

In further embodiments, the fenestration 502 may expose all of the first encapsulation layer 30 outside of the aperture 31 such that the second element 60 may be disposed on a surface of the first encapsulation layer 30 remote from the first conductive trace layer 12.

In this embodiment, the package structure 100 further includes a second lead 61, and the second lead 61 electrically connects the second element 60 and the second portion 52. In other embodiments, the package structure 100 may not include the second lead 61, and the second element 60 may be electrically connected to the second conductive trace layer 50 by soldering a solder ball.

In this embodiment, the openings 31 are disposed on opposite sides of the first member 20 along the first direction X. In a further embodiment, the opening 31 may be provided on only one side of the first element 20 in the first direction X. In other embodiments, the openings 31 may be disposed around the circumference of the first member 20.

In some embodiments, with continued reference to fig. 11, the circuit board 10 further includes a third conductive trace layer 13 opposite the first conductive trace layer 12 in the second direction Y. The package structure 100 further includes solder balls 90. The solder balls 90 are disposed on the third conductive trace layer 13 in a direction opposite to the second direction Y. The solder balls 90 may be solder balls. In other embodiments, the material of the solder balls 90 may vary.

In further embodiments, the circuit board 10 may not include the third conductive trace layer 13, and the package structure 100 may not include the solder balls 90.

Since the materials of the first conductive trace layer 12, the base material layer 11, the second conductive trace layer 50, the conductive post 80, the first adhesive layer 41, the second adhesive layer 42, the conductive adhesive layer 40, the first encapsulation layer 30, the second encapsulation layer 70, the solder balls 90, the first lead 21 and the second lead 61, and the first element 20 and the second element 60 are the same as those of the method embodiment, they will not be described in detail herein.

The above description is only one preferred embodiment of the present application, but is not limited to this embodiment during actual application. Other variations and modifications of the present application, which are apparent to those of ordinary skill in the art, are intended to be within the scope of the present application.

Claims

1. The preparation method of the packaging structure is characterized by comprising the following steps:

2. The method of manufacturing a package structure of claim 1, wherein the step of forming the conductive adhesive layer comprises:

a conductive column is arranged on the first adhesive layer in the opening;

3. The method for manufacturing a package structure according to claim 2, wherein the second conductive trace layer includes a first portion and a second portion other than the first portion, the first portion overlaps the first element in the second direction and is used for mounting the second element, an end portion of the conductive post facing away from the first conductive trace layer protrudes from the first package layer, a projection of at least one of the conductive posts on the first portion is located in a range of the first portion, the window further avoids the first element in the first direction, and the second adhesive layer connects the first portion and a portion of the first package layer corresponding to the first portion.

4. The method of manufacturing a package structure according to claim 3, wherein forming the second element and electrically connecting the second element to the second conductive trace layer specifically comprises:

forming the second element on the first portion;

a wire is bonded between the second portion and the second element.

5. The method of manufacturing a package structure according to claim 3, wherein a width of the first portion is greater than or equal to a width of the second element along the first direction.

6. The method of manufacturing a package structure of claim 1, wherein the circuit board further comprises a third conductive trace layer opposite the first conductive trace layer in the second direction, the method further comprising, after forming the second package layer:

7. The packaging structure is characterized by comprising a circuit board, a first element, a first packaging layer, a conductive adhesive layer, a second conductive circuit layer, a second element and a second packaging layer;

8. The package structure of claim 7, further comprising a conductive post, the conductive post comprising a first glue layer and a second glue layer, the first glue layer disposed within the opening and connecting the first conductive trace layer, at least a portion of the conductive post disposed within the opening, and the conductive post connecting the first glue layer and the second glue layer along the second direction, the second glue layer connecting the second conductive trace layer.

9. The package structure according to claim 8, wherein the second conductive trace layer includes a first portion and a second portion other than the first portion, the first portion overlaps the first element in the second direction, the second element is disposed on a surface of the first portion away from the first conductive trace layer, an end portion of the conductive post away from the first conductive trace layer protrudes from the first package layer, a projection of at least one of the conductive posts on the first portion is located in a range of the first portion, and the second adhesive layer connects the first portion and a portion of the first package layer corresponding to the first portion.

10. The package structure of claim 7, wherein the circuit board further comprises a third conductive trace layer opposite the first conductive trace layer in the second direction, the package structure further comprising solder balls disposed on the third conductive trace layer in a direction opposite the second direction.