JP2011096926A

JP2011096926A - Circuit board, connector, and electronic apparatus

Info

Publication number: JP2011096926A
Application number: JP2009250955A
Authority: JP
Inventors: Masahito Kawabata; 理仁川端; Seiji Yamaguchi; 盛司山口
Original assignee: Panasonic Corp
Current assignee: Panasonic Corp
Priority date: 2009-10-30
Filing date: 2009-10-30
Publication date: 2011-05-12

Abstract

<P>PROBLEM TO BE SOLVED: To provide a circuit board, a connector, and an electronic apparatus wherein flatness and mounting strength can be assured. <P>SOLUTION: A recess 122 is formed in the mounting surface 121 of a mother board (main board) 101, and then a semiconductor package component 108 and an LCR chip component 107 are soldered to the bottom face of the recess 122. A relay connector (frame) 103 having a flange 125 formed therein is positioned on the boundary of the recess 122 and the mounting surface 121, and soldered to the bottom face of the recess 122 and the mounting surface 121. Furthermore, a connector board 104 is soldered to the upper surface of the relay connector 103, and a card connector (card slot) 102 into which a card (UIM, micro SD) 105 is inserted is mounted on the upper surface of the connector board 104. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、回路基板、コネクタおよび電子機器に関し、特に、カードコネクタ用中継コネクタを基板の凹部に備えた回路基板に関する。 The present invention relates to a circuit board, a connector, and an electronic device, and more particularly to a circuit board provided with a card connector relay connector in a recess of the board.

従来から産業機器、電子機器、電気機器等に用いられるチップ形電子部品及びそれを用いた印刷配線板において、チップ形電子部品取扱の容易性、半田付けの確実性、印刷配線板の薄型化を実現するために、例えば、鍔付チップ形電子部品及びそれを用いた印刷配線板が知られている。 Conventional chip-type electronic components used in industrial equipment, electronic equipment, electrical equipment, etc. and printed wiring boards using the same, facilitated handling of chip-type electronic parts, soldering reliability, and thinner printed wiring boards In order to achieve this, for example, a brazed chip-type electronic component and a printed wiring board using the same are known.

図１３（Ａ）は、従来の鍔付チップ形電子部品の簡略斜視図であり、図１３（Ｂ）は、従来の印刷配線基板と鍔付チップ形電子部品の簡略取付断面図である。従来の鍔付チップ形電子部品４及びそれ用いた印刷配線基板５は、チップ部品１の下部に鍔部３を付け、チップ部品１の上部は印刷配線基板５の凹部６に埋設し、鍔部３を印刷配線基板５の表面に出し接続したことで、薄型化を実現するものである（例えば、特許文献１参照）。 FIG. 13A is a simplified perspective view of a conventional soldered chip electronic component, and FIG. 13B is a simplified sectional view of a conventional printed wiring board and a soldered chip electronic component. A conventional flanged chip-type electronic component 4 and a printed wiring board 5 using the same are provided with a flange 3 at the bottom of the chip component 1, and the top of the chip component 1 is embedded in a recess 6 of the printed wiring board 5. Thinning is realized by connecting 3 to the surface of the printed wiring board 5 and connecting it (see, for example, Patent Document 1).

また、電子部品を搭載し複数の回路基板間を接続する三次元基板間接続構造体とその製造方法およびそれを用いた立体回路装置において、反りなどの機械的変形のある複数の回路基板間を薄型で確実に接続するとともに、電磁シールド機能を備えた三次元基板間接続構造体とその製造方法およびそれを用いた立体回路装置が知られている。 In addition, in a three-dimensional inter-substrate connection structure that mounts electronic components and connects a plurality of circuit boards, a manufacturing method thereof, and a three-dimensional circuit device using the same, a plurality of circuit boards that are mechanically deformed such as warping A three-dimensional inter-substrate connection structure having a thin and reliable connection and an electromagnetic shielding function, a manufacturing method thereof, and a three-dimensional circuit device using the same are known.

図１４（Ａ）は、従来の三次元基板間接続構造体２ａの構成を示す平面図、図１４（Ｂ）は、図１４（Ａ）のＡ−Ａ線断面図、図１４（Ｃ）は、図１４（Ａ）のＢ−Ｂ線断面図、図１４（Ｄ）は、図１４（Ａ）のＣ−Ｃ線断面図である。また、図１４（Ｅ）は、第１の回路基板２４と接合した三次元基板間接続構造体２ａを第２の回路基板２６と接続する前の状態を示す断面図、図１４（Ｆ）は、第１の回路基板２４と接合した三次元基板間接続構造体２ａを第２の回路基板２６に接合した時の状態を示す断面図である。また、図１４（Ｇ）は、従来の立体回路装置５４の構成を示す斜視図、図１４（Ｈ）は、図１４（Ｇ）の部分拡大断面図である。 14A is a plan view showing a configuration of a conventional three-dimensional inter-substrate connection structure 2a, FIG. 14B is a cross-sectional view taken along line AA in FIG. 14A, and FIG. 14A is a cross-sectional view taken along the line BB in FIG. 14A, and FIG. 14D is a cross-sectional view taken along the line CC in FIG. FIG. 14E is a cross-sectional view showing a state before connecting the three-dimensional inter-substrate connection structure 2a bonded to the first circuit board 24 to the second circuit board 26, and FIG. FIG. 5 is a cross-sectional view showing a state when the three-dimensional inter-substrate connection structure 2a bonded to the first circuit board 24 is bonded to the second circuit board 26. FIG. 14G is a perspective view showing a configuration of a conventional three-dimensional circuit device 54, and FIG. 14H is a partially enlarged cross-sectional view of FIG. 14G.

従来の三次元基板間接続構造体２ａは、反りなどの機械的変形のある複数の回路基板間を薄型で確実に接続するとともに、電磁シールド機能を向上させるために、三次元基板間接続構造体２ａの少なくとも片側の面の電極１８ａ，２０ａにバンプ２２を形成し、基板２４の反りを吸収するものである（例えば、特許文献２参照）。 The conventional three-dimensional inter-substrate connection structure 2a is a thin and reliable connection between a plurality of circuit boards that have mechanical deformation such as warping, and also improves the electromagnetic shielding function. Bumps 22 are formed on the electrodes 18a and 20a on at least one surface of 2a to absorb warpage of the substrate 24 (see, for example, Patent Document 2).

また、携帯電子機器などに使用される電子部品付き基板をさらに薄型化するため、基板上に中継コネクタを介してその上にコネクタ基板をとりつけ、その下の空間にさらに電子部品をつけることが試みられている。 In addition, in order to further reduce the thickness of boards with electronic components used in portable electronic devices etc., an attempt is made to attach a connector board on the board via a relay connector and further attach electronic parts to the space below the board. It has been.

特開昭５８−１５７１９１号公報JP 58-157191 A 特開２００８−１５９９８３号公報JP 2008-159983 A

しかしながら、特許文献１に記載の鍔付チップ形電子部品４及びそれ用いた印刷配線基板５は、単に凹部６に鍔付チップ形電子部品４を入れるものであり、特許文献２に記載の三次元基板間接続構造体２ａとその製造方法およびそれを用いた立体回路装置５４は、中継コネクタの機能はあるが凹部を形成する記載はない。このようにいずれの引用文献でも、配置する部品を増やしながら薄型化をするには限界があった。 However, the soldered chip electronic component 4 described in Patent Document 1 and the printed wiring board 5 using the soldered chip electronic component 4 are obtained by simply placing the soldered chip electronic component 4 in the recess 6. The inter-board connection structure 2a, the manufacturing method thereof, and the three-dimensional circuit device 54 using the same have a function as a relay connector, but there is no description of forming a recess. As described above, any cited document has a limit in reducing the thickness while increasing the number of components to be arranged.

本発明は、上記従来の事情に鑑みてなされたものであって、中継コネクタの枠体にフランジ部を設け、枠体を基板の凹部の底面に取り付け、フランジ部を基板の実装面に接合することにより、平坦性、強度を確保することができる回路基板、コネクタおよび電子機器を提供することを目的とする。 The present invention has been made in view of the above-described conventional circumstances. A flange portion is provided on the frame body of the relay connector, the frame body is attached to the bottom surface of the concave portion of the substrate, and the flange portion is joined to the mounting surface of the substrate. Accordingly, an object of the present invention is to provide a circuit board, a connector, and an electronic device that can ensure flatness and strength.

本発明の回路基板は、実装面と、前記実装面に設けられた凹部とを含む基板と、第１接続端子が配置された第１接続面と、前記第１接続端子に電気的に接続された第２接続端子が配置された第２接続面と、前記第１接続面と前記第２接続面とを接続する側面とを含む枠体および前記側面から突出したフランジ部と、を有するコネクタと、前記基板の前記凹部の内部に配置された電子部品と、を備え、前記枠体は前記電子部品を内部に備え、前記第２接続面は前記凹部の底面に接合され、前記フランジ部は前記実装面に接合される。 The circuit board of the present invention is electrically connected to the first connection terminal, a board including a mounting surface and a recess provided in the mounting surface, a first connection surface on which the first connection terminal is disposed, and the first connection terminal. A connector including a second connection surface on which the second connection terminals are disposed, a frame body including a side surface connecting the first connection surface and the second connection surface, and a flange portion protruding from the side surface; An electronic component disposed inside the recess of the substrate, the frame includes the electronic component inside, the second connection surface is joined to a bottom surface of the recess, and the flange portion is Bonded to the mounting surface.

上記構成によれば、コネクタにフランジ部を形成し、フランジ部を凹部がない一般基板と同じ平坦性と剛性を確保している基板の実装面に接合するので、平坦性と実装強度が向上するとともに、基板の凹部に電子部品が実装されるので、凹部の深さ分だけ薄型化できる。 According to the above configuration, the flange portion is formed on the connector, and the flange portion is joined to the mounting surface of the substrate that secures the same flatness and rigidity as the general substrate having no recess, so that the flatness and mounting strength are improved. At the same time, since the electronic component is mounted in the recess of the substrate, the thickness can be reduced by the depth of the recess.

また、本発明の回路基板において、前記電子部品は、前記凹部の底面に配置される。 In the circuit board of the present invention, the electronic component is disposed on the bottom surface of the recess.

上記構成によれば、コネクタ、電子部品が凹部の底面に配置されるので、凹部の深さ分だけ薄型化し、平坦性および実装強度を確保することができる。 According to the said structure, since a connector and an electronic component are arrange | positioned at the bottom face of a recessed part, it can reduce in thickness by the depth of a recessed part, and can ensure flatness and mounting strength.

また、本発明の回路基板において、前記フランジ部は第１のフランジ部と第２のフランジ部とを備える。 In the circuit board according to the present invention, the flange portion includes a first flange portion and a second flange portion.

上記構成によれば、実装強度が必要な辺に対応してフランジ部を配置することができる。 According to the said structure, a flange part can be arrange | positioned corresponding to the edge | side where mounting strength is required.

また、本発明の回路基板において、前記第２のフランジ部は前記第１のフランジ部と対向する位置に配置される。 In the circuit board of the present invention, the second flange portion is disposed at a position facing the first flange portion.

上記構成によれば、フランジが並んだ方向の応力に対して実装強度を強くすることができる。 According to the said structure, mounting strength can be strengthened with respect to the stress of the direction where the flange was located in a line.

また、本発明の回路基板において、前記第１のフランジの前記側面からの突出の長さは、前記第２のフランジの前記側面からの突出の長さより大きい。 In the circuit board of the present invention, the length of the first flange protruding from the side surface is greater than the length of the second flange protruding from the side surface.

上記構成によれば、実装強度をより強くしたいところのフランジの突出量を大きくすることができる。 According to the said structure, the protrusion amount of the flange of the place which wants to make mounting strength stronger can be enlarged.

また、本発明の回路基板において、前記枠体と前記電子部品の間において前記底面から前記実装面まで立ち上がる壁部が設けられる。 In the circuit board of the present invention, a wall portion is provided between the frame body and the electronic component so as to rise from the bottom surface to the mounting surface.

上記構成によれば、壁部により、コネクタと他の電子部品を分離するので、電子部品の高さに適合するように凹部の深さを別々に設定することができる。また、壁部により、樹脂が電子部品の方へ流れ込まないように堰き止めることができる。 According to the said structure, since a connector and another electronic component are isolate | separated by a wall part, the depth of a recessed part can be separately set so that it may suit the height of an electronic component. Further, the wall portion can be dammed so that the resin does not flow toward the electronic component.

また、本発明の回路基板において、前記壁部の最上面が前記実装面と同一面にあり、前記壁部の上面に前記フランジ部が接合される。 In the circuit board of the present invention, the uppermost surface of the wall portion is flush with the mounting surface, and the flange portion is joined to the upper surface of the wall portion.

上記構成によれば、フランジ部が凹部の内側にあるので、コネクタを小型化し、実装面積を削減することができる。 According to the said structure, since a flange part exists inside a recessed part, a connector can be reduced in size and a mounting area can be reduced.

また、本発明の回路基板において、前記基板を第１基板とするとともに、第１及び第２の面を備える第２基板を備え、前記第２基板の前記第２の面が、前記コネクタの前記第１接続面に接合される。 In the circuit board according to the present invention, the board may be a first board, and may include a second board having first and second faces, and the second face of the second board may be the connector of the connector. Bonded to the first connection surface.

上記構成によれば、第２基板の第２の面をコネクタの第１接続面に接合し、平坦性および実装強度を確保することができる。 According to the said structure, the 2nd surface of a 2nd board | substrate can be joined to the 1st connection surface of a connector, and flatness and mounting strength can be ensured.

また、本発明の回路基板において、前記電子部品は、前記第２基板の前記第２の面に配置される。 In the circuit board of the present invention, the electronic component is disposed on the second surface of the second substrate.

上記構成によれば、電子部品を第２基板の第２の面に配置し、凹部内にはコネクタ以外の電子部品を実装しないので、凹部に要求される平坦性精度が緩和される。 According to the above configuration, since the electronic component is disposed on the second surface of the second substrate and no electronic component other than the connector is mounted in the recess, the flatness accuracy required for the recess is relaxed.

また、本発明の回路基板において、前記電子部品を第１電子部品とするとともに、第２電子部品を更に備え、第２電子部品は、前記第２基板の前記第１の面に配置される。 In the circuit board of the present invention, the electronic component is a first electronic component, and further includes a second electronic component, and the second electronic component is disposed on the first surface of the second substrate.

上記構成によれば、第２電子部品を第２基板の第１の面に配置し、平坦性および実装強度を確保することができる。 According to the said structure, a 2nd electronic component can be arrange | positioned on the 1st surface of a 2nd board | substrate, and flatness and mounting strength can be ensured.

また、本発明の回路基板において、前記第２電子部品がカードコネクタである。 In the circuit board of the present invention, the second electronic component is a card connector.

上記構成によれば、平坦性および実装強度が確保できるので、カードコネクタの取扱性を向上することができる。 According to the above configuration, since flatness and mounting strength can be ensured, the handleability of the card connector can be improved.

また、本発明の回路基板において、前記第１のフランジ部は、前記カードコネクタの挿入口に対応して配置される。 Moreover, the circuit board of this invention WHEREIN: The said 1st flange part is arrange | positioned corresponding to the insertion port of the said card connector.

上記構成によれば、第１のフランジ部がカードコネクタの挿入口に対応して配置されるので、カードの抜き差しに対する実装強度を強めることができる。 According to the said structure, since the 1st flange part is arrange | positioned corresponding to the insertion port of a card connector, the mounting strength with respect to insertion / extraction of a card | curd can be strengthened.

また、本発明の回路基板において、前記凹部の側面と前記枠体との間に樹脂が充填される。 In the circuit board of the present invention, a resin is filled between the side surface of the recess and the frame.

上記構成によれば、凹部の側面と枠体との間に樹脂が充填されるので、コネクタの周囲全体が樹脂補強され実装強度が向上する。 According to the said structure, since resin is filled between the side surface of a recessed part, and a frame, the whole circumference | surroundings of a connector are resin-reinforced and mounting strength improves.

また、本発明の回路基板において、前記フランジ部には前記凹部に通じる開口部を備える。 In the circuit board according to the present invention, the flange portion includes an opening communicating with the concave portion.

上記構成によれば、開口部から樹脂を充填し、コネクタの周囲全体の実装強度を強めることができる。 According to the said structure, resin can be filled from an opening part and the mounting strength of the whole circumference | surroundings of a connector can be strengthened.

また、本発明の回路基板において、前記開口部は第１の開口部と第２の開口部からなる。 In the circuit board according to the present invention, the opening includes a first opening and a second opening.

上記構成によれば、第１の開口部から樹脂を充填し第２の開口部から空気を抜くので、コネクタの周囲全体に樹脂を注入することができる。 According to the above configuration, since the resin is filled from the first opening and the air is extracted from the second opening, the resin can be injected into the entire periphery of the connector.

また、本発明の回路基板において、前記樹脂は前記枠体を囲む。 In the circuit board of the present invention, the resin surrounds the frame.

上記構成によれば、樹脂が枠体を囲むので、コネクタの周囲全体の実装強度を強めることができる。 According to the above configuration, since the resin surrounds the frame, the mounting strength of the entire periphery of the connector can be increased.

また、本発明の回路基板において、前記枠体の内部に充填された内部樹脂を備える。 Moreover, the circuit board of the present invention includes an internal resin filled in the frame.

上記構成によれば、枠体の内部に充填された内部樹脂を備えるので、コネクタ内部の実装強度を強めることができる。 According to the said structure, since the internal resin with which the inside of the frame was filled is provided, the mounting strength inside a connector can be strengthened.

また、本発明の回路基板において、前記内部樹脂の頂面は、前記実装面と前記第２基板の前記第１の面の間である。 In the circuit board of the present invention, the top surface of the internal resin is between the mounting surface and the first surface of the second substrate.

上記構成によれば、内部樹脂の頂面が実装面と第２基板の第１の面の間であるので、樹脂が外部に漏れ出すことがなく、前記第１基板の強度・剛性の劣る部分（厚みの薄い部分、すなわち凹部）を樹脂で補強することができる。 According to the above configuration, since the top surface of the internal resin is between the mounting surface and the first surface of the second substrate, the resin does not leak to the outside, and the portion where the strength and rigidity of the first substrate are inferior (Thin portions, ie, recesses) can be reinforced with resin.

また、本発明のコネクタは、第１接続端子が配置された第１接続面と、前記第１接続端子に電気的に接続された第２接続端子が配置された第２接続面と、前記第１接続面と前記第２接続面とを接続する側面と、前記側面から突出したフランジ部と、を備える。 The connector of the present invention includes a first connection surface on which a first connection terminal is disposed, a second connection surface on which a second connection terminal electrically connected to the first connection terminal is disposed, A side surface connecting the first connection surface and the second connection surface; and a flange portion protruding from the side surface.

上記構成によれば、コネクタは基板の実装面に接合されるフランジ部を有するので、はんだ付け強度が向上し、基板の凹部にコネクタ、電子部品を実装することにより凹部の深さ分だけ薄型化し、平坦性および実装強度を確保することができる。 According to the above configuration, since the connector has the flange portion joined to the mounting surface of the board, the soldering strength is improved, and the connector and the electronic component are mounted on the concave portion of the board, thereby reducing the thickness by the depth of the concave portion. In addition, flatness and mounting strength can be ensured.

また、本発明のコネクタにおいて、前記フランジ部は、前記第１接続面と略同一面を備える。 Moreover, the connector of this invention WHEREIN: The said flange part is equipped with a substantially the same surface as a said 1st connection surface.

上記構成によれば、フランジ部は第１接続面と略同一面を備えるので、基板に実装した場合の平坦性を確保することができる。 According to the said structure, since a flange part is provided with a substantially the same surface as a 1st connection surface, the flatness at the time of mounting on a board | substrate is securable.

また、本発明の電子機器は、上記記載のいずれかの回路基板またはコネクタを備えるものである。 An electronic apparatus according to the present invention includes any one of the circuit boards or connectors described above.

上記構成によれば、基板の凹部に電子部品を実装し、コネクタのフランジ部を基板の実装面に接合することにより、平坦性および実装強度を確保することができる。 According to the said structure, flatness and mounting strength are securable by mounting an electronic component in the recessed part of a board | substrate, and joining the flange part of a connector to the mounting surface of a board | substrate.

以上説明したように、本発明にかかる回路基板、コネクタおよび電子機器によれば、コネクタにフランジ部を形成し、フランジ部を基板の実装面に接合するので、はんだ付け強度が向上するとともに、基板の凹部に電子部品が実装されるので、凹部の深さ分だけ薄型化し、平坦性および実装強度を確保することができる。 As described above, according to the circuit board, the connector, and the electronic device according to the present invention, the flange portion is formed on the connector and the flange portion is joined to the mounting surface of the substrate. Since the electronic component is mounted in the recess, the thickness can be reduced by the depth of the recess, and flatness and mounting strength can be ensured.

本実施の形態にかかるカードコネクタ用中継コネクタを凹部に備えた回路基板等の上面図Top view of a circuit board or the like provided with a relay connector for card connector according to the present embodiment in a recess 本実施の形態にかかるカードコネクタ用中継コネクタを凹部に備えた回路基板等の上面図Top view of a circuit board or the like provided with a relay connector for card connector according to the present embodiment in a recess 本実施の形態にかかるカードコネクタ用中継コネクタを凹部に備えた回路基板の実装構造断面図（１）−１Cross-sectional view of a mounting structure of a circuit board provided with a relay connector for card connector according to this embodiment in a recess (1) -1 本実施の形態にかかるカードコネクタ用中継コネクタを凹部に備えた回路基板の実装構造断面図（１）−２Cross-sectional view of a mounting structure of a circuit board provided with a relay connector for card connector according to the present embodiment in a recess (1) -2 本実施の形態にかかるカードコネクタ用中継コネクタを凹部に備えた回路基板の改良型Ａの実装構造断面図（１）−１Sectional view of mounting structure of improved type A of circuit board provided with relay connector for card connector according to this embodiment in recess (1) -1 本実施の形態にかかるカードコネクタ用中継コネクタを凹部に備えた回路基板の改良型Ｂの実装構造断面図（１）−１Sectional view of mounting structure of improved type B of circuit board provided with recess for card connector relay connector according to this embodiment (1) -1 本実施の形態にかかるカードコネクタ用中継コネクタを凹部に備えた回路基板の改良型Ｃの実装構造断面図（１）−１Sectional view of mounting structure of improved type C of circuit board provided with relay connector for card connector according to this embodiment in recess (1) -1 本実施の形態にかかるカードコネクタ用中継コネクタを凹部に備えた回路基板の実装構造断面図（１）−１Cross-sectional view of a mounting structure of a circuit board provided with a relay connector for card connector according to this embodiment in a recess (1) -1 本実施の形態において４辺全てに接続端子を設けたフランジ部のある枠状の中継コネクタIn this embodiment, a frame-shaped relay connector having a flange portion provided with connection terminals on all four sides 本実施の形態にかかるカードコネクタ用中継コネクタを凹部に備えた回路基板の実装構造上面図A top view of a circuit board mounting structure having a relay connector for card connector according to the present embodiment provided in a recess. カードコネクタ用中継コネクタを凹部に備えた回路基板の実装構造上面図Top view of circuit board mounting structure with card connector relay connector in recess 本実施の形態にかかるカードコネクタ用中継コネクタを凹部に備えた回路基板の実装構造断面図（１）−２Cross-sectional view of a mounting structure of a circuit board provided with a relay connector for card connector according to the present embodiment in a recess (1) -2 従来の鍔付チップ形電子部品の簡略斜視図および簡略取付断面図Simplified perspective view and simplified cross-sectional view of a conventional brazed chip-type electronic component 従来の三次元基板間接続構造体の構成を示した説明図Explanatory drawing showing the configuration of a conventional 3D inter-substrate connection structure

携帯電話などの各種電子機器に使用される基板の更なる薄型化を図るため、引用文献で開示されているような技術が提案されている。そして最近においては、基板に凹部を設け、そこに電子部品を実装する、いわゆるキャビティ基板実装が行われている。ところが、凹部の底面は通常の積層工程（プレスなど）を経た一般基板の表層面に比べ、平坦性が悪く、大型の半導体パッケージ部品やモジュール部品、あるいは、高背で大型の中継コネクタ部品を実装することが困難であり、かつ凹部は基板厚みが薄いため、凹部底面の剛性強度が低く、実装の上で問題がある。 In order to further reduce the thickness of a substrate used in various electronic devices such as a mobile phone, a technique disclosed in the cited document has been proposed. In recent years, so-called cavity substrate mounting has been performed in which a recess is provided in a substrate and an electronic component is mounted thereon. However, the bottom surface of the recess is not flat compared to the surface of a general substrate that has undergone a normal lamination process (such as pressing), and large semiconductor package parts and module parts or high-profile, large relay connector parts are mounted. In addition, since the recess has a thin substrate thickness, the rigidity strength of the bottom surface of the recess is low, which causes a problem in mounting.

すなわち、（１）基板の凹部の底面（薄肉部）に中継コネクタ部品を実装すると、実装体の平面精度や実装強度保証が困難である。また、（２）周辺部品と狭隣接に高密度実装された高背で大型の中継コネクタ部品周囲に補強樹脂を精度良く供給することは困難である。さらに、（３）中継コネクタ部品上にコネクタ基板およびカードコネクタを実装すると、カード挿入部での耐押し強度を確保することが困難である。 That is, (1) If the relay connector part is mounted on the bottom surface (thin wall portion) of the concave portion of the substrate, it is difficult to ensure the planar accuracy and mounting strength of the mounting body. In addition, (2) it is difficult to accurately supply the reinforcing resin around the high-profile large-sized relay connector component that is densely mounted in the vicinity of the peripheral component. Furthermore, (3) when the connector board and the card connector are mounted on the relay connector part, it is difficult to ensure the pressing strength at the card insertion portion.

本発明は、上記事情に鑑みてなされたものであって、中継コネクタの枠体にフランジ部を設け、枠体を基板の凹部の底面に取り付け、フランジ部を基板の実装面に接合することにより、平坦性、強度を確保することが試みられている。 The present invention has been made in view of the above circumstances, by providing a flange portion on the frame of the relay connector, attaching the frame to the bottom surface of the concave portion of the substrate, and joining the flange portion to the mounting surface of the substrate. Attempts have been made to ensure flatness and strength.

図１は、本実施の形態にかかるカードコネクタ用中継コネクタを凹部に備えた回路基板を示す図であり、図１（Ａ）はその実装構造上面図、図１（Ｂ）はマザー基板（メイン基板）１０１、図１（Ｃ）は中継コネクタ１０３を示す。 1A and 1B are diagrams showing a circuit board provided with a card connector relay connector according to the present embodiment in a recess, FIG. 1A is a top view of its mounting structure, and FIG. 1B is a mother board (main board). Substrate) 101, FIG. 1C shows a relay connector 103. FIG.

図１（Ｂ）に示すように、マザー基板（メイン基板）１０１には凹部（マザー基板キャビティ部）１２２が設けられ、凹部１２２の底面に、ＬＣＲチップ部品１０７および半導体パッケージ部品１０８が実装される。 As shown in FIG. 1B, the mother substrate (main substrate) 101 is provided with a recess (mother substrate cavity) 122, and the LCR chip component 107 and the semiconductor package component 108 are mounted on the bottom surface of the recess 122. .

また、図１（Ｃ）に示すように中継コネクタ１０３は、枠体および梁部からなり、中継コネクタ１０３の裏面には中継コネクタ段差境界１０９を有する段差が設けられる。段差境界１０９の外側の枠体部（後述するフランジ部１２５）は、図１（Ｂ）に示すマザー基板（メイン基板）１０１の凹部１２２の外側の実装面（後述する１２１）と接合される。段差境界１０９の内側の枠体部と梁部とは凹部１２２の底面に向け突出しており、凹部１２２の底面と接合される。すなわち、中継コネクタ１０３は、マザー基板１０１上に、中継コネクタ段差境界１０９が凹部１２２に勘合するように接合される。 As shown in FIG. 1C, the relay connector 103 includes a frame body and a beam portion, and a step having a relay connector step boundary 109 is provided on the back surface of the relay connector 103. A frame body portion (a flange portion 125 described later) outside the step boundary 109 is joined to a mounting surface (121 described later) outside the concave portion 122 of the mother substrate (main substrate) 101 shown in FIG. The frame part and the beam part inside the step boundary 109 protrude toward the bottom surface of the recess 122 and are joined to the bottom surface of the recess 122. That is, the relay connector 103 is joined on the mother board 101 so that the relay connector step boundary 109 fits into the recess 122.

マザー基板（メイン基板）１０１に重ねられた中継コネクタ１０３の上には、図１（Ａ）に示すコネクタ基板１０４が接合され、コネクタ基板１０４にはカードコネクタ（カードスロット）１０２が搭載される。カードコネクタ（カードスロット）１０２には、ＵＩＭ（User Identity Module）、マイクロＳＤ（Secure Digital）等のカード１０５が装着可能である。なお、図１中の断面（１）−１は後述する図３に示し、断面（１）−２は後述する図４に示す。 A connector board 104 shown in FIG. 1A is joined on the relay connector 103 superimposed on the mother board (main board) 101, and a card connector (card slot) 102 is mounted on the connector board 104. A card 105 (UIM (User Identity Module), micro SD (Secure Digital), etc.) can be attached to the card connector (card slot) 102. In addition, the cross section (1) -1 in FIG. 1 is shown in FIG. 3 mentioned later, and the cross section (1) -2 is shown in FIG. 4 mentioned later.

図２は、本実施の形態にかかるカードコネクタ用中継コネクタを凹部に備えた回路基板を示し、図２（Ａ）はその実装構造上面図、図２（Ｂ）はコネクタ基板１０４を示す。 2 shows a circuit board provided with the relay connector for card connector according to the present embodiment in the recess, FIG. 2A shows a top view of the mounting structure, and FIG. 2B shows the connector board 104.

図２（Ｂ）に示すように、コネクタ基板１０４にはカードコネクタ（カードスロット）１０２が搭載され、カードコネクタ（カードスロット）１０２が搭載されたコネクタ基板１０４が図２（Ａ）に示す中継コネクタ１０３の上部へ実装される。 As shown in FIG. 2B, a card connector (card slot) 102 is mounted on the connector board 104, and the connector board 104 on which the card connector (card slot) 102 is mounted is a relay connector shown in FIG. It is mounted on the upper part of 103.

図２（Ａ）に示すように、マザー基板（メイン基板）１０１には凹部１２２が設けられ、凹部１２２の底面にはＬＣＲチップ部品１０７および半導体パッケージ部品１０８が実装される。 As shown in FIG. 2A, the mother substrate (main substrate) 101 is provided with a recess 122, and the LCR chip component 107 and the semiconductor package component 108 are mounted on the bottom surface of the recess 122.

中継コネクタ１０３は厚さ方向に段差が設けられ、中継コネクタ段差境界１０９の内側が、凹部１２２の底面に接合される。中継コネクタ段差境界１０９の外側と凹部境界（マザー基板キャビティ部境界）１１０の間隙に封止材１１１が注入され、中継コネクタ１０３とマザー基板（メイン基板）１０１の接合が補強される。 The relay connector 103 is provided with a step in the thickness direction, and the inside of the relay connector step boundary 109 is joined to the bottom surface of the recess 122. The sealing material 111 is injected into the gap between the outside of the relay connector step boundary 109 and the recess boundary (mother substrate cavity boundary) 110, and the junction between the relay connector 103 and the mother substrate (main substrate) 101 is reinforced.

このように本実施の形態では、中継コネクタ１０３と凹部１２２との間隙を利用するので封止樹脂が注入し易くなっており、また、全周に容易に行き渡る構造になっており樹脂供給量が安定する。 As described above, in this embodiment, since the gap between the relay connector 103 and the recess 122 is used, it is easy to inject the sealing resin, and the structure easily spreads all around the resin supply amount. Stabilize.

図３は、本実施の形態にかかるカードコネクタ用中継コネクタを凹部に備えた回路基板の実装構造断面図（１）−１（図１の１点鎖線に対応）を示す。マザー基板（メイン基板）１０１の実装面１２１には凹部１２２が形成され、その凹部１２２の底面に、半導体パッケージ部品１０８およびＬＣＲチップ部品１０７がはんだ付けされる。 FIG. 3 is a cross-sectional view (1) -1 (corresponding to the one-dot chain line in FIG. 1) of a circuit board provided with a relay connector for card connector according to the present embodiment in a recess. A recess 122 is formed in the mounting surface 121 of the mother substrate (main substrate) 101, and the semiconductor package component 108 and the LCR chip component 107 are soldered to the bottom surface of the recess 122.

凹部１２２と実装面１２１の境界には、接続端子１２８を有したフランジ部１２５が形成された中継コネクタ（枠体）１０３が位置決めされ、凹部１２２の底面および実装面１２１にはんだ付けされる。また、中継コネクタ１０３の上面にコネクタ基板１０４がはんだ付けされ、コネクタ基板１０４の上面にカード（ＵＩＭ，マイクロＳＤ）１０５が挿入されるカードコネクタ（カードスロット）１０２が実装される。 A relay connector (frame body) 103 in which a flange portion 125 having a connection terminal 128 is formed is positioned at the boundary between the recess 122 and the mounting surface 121, and is soldered to the bottom surface of the recess 122 and the mounting surface 121. A connector substrate 104 is soldered on the upper surface of the relay connector 103, and a card connector (card slot) 102 into which a card (UIM, micro SD) 105 is inserted is mounted on the upper surface of the connector substrate 104.

すなわち本実施の形態にかかる回路基板は、マザー基板（第１基板）１０１と、コネクタ基板（第２基板）１０４と、マザー基板１０１およびコネクタ基板１０４を接続する中継コネクタ（コネクタ）１０３とを有し、マザー基板１０１は、実装面１２１に設けられた凹部１２２を有する。 That is, the circuit board according to the present embodiment includes a mother board (first board) 101, a connector board (second board) 104, and a relay connector (connector) 103 that connects the mother board 101 and the connector board 104. The mother substrate 101 has a recess 122 provided on the mounting surface 121.

中継コネクタ１０３は、第１接続端子１２３が配置された第１接続面１２４と、第１接続端子１２３に電気的に接続された第２接続端子１２７が配置された第２接続面１２６と、第１接続面１２４と第２接続面１２６とを接続する側面とを含む枠体および側面から突出し、マザー基板１０１と接続する接続端子１２８を有したフランジ部１２５とを有する。 The relay connector 103 includes a first connection surface 124 on which the first connection terminal 123 is disposed, a second connection surface 126 on which the second connection terminal 127 electrically connected to the first connection terminal 123 is disposed, A frame including a side surface that connects the first connection surface 124 and the second connection surface 126 and a flange portion 125 that protrudes from the side surface and has a connection terminal 128 that connects to the mother substrate 101.

マザー基板（メイン基板）１０１の凹部１２２の内部、すなわち中継コネクタ（枠体）１０３の内部には、半導体パッケージ部品１０８およびＬＣＲチップ部品１０７等の電子部品が配置される。 Electronic components such as the semiconductor package component 108 and the LCR chip component 107 are arranged in the recess 122 of the mother substrate (main substrate) 101, that is, in the relay connector (frame) 103.

中継コネクタ（枠体）１０３の第２接続面１２６は凹部１２２の底面に接合され、フランジ部１２５の接続端子１２８は、一般基板と同じ平坦性と剛性を確保している実装面１２１に接合される。また、コネクタ基板１０４の上面に、カード（ＵＩＭ，マイクロＳＤ）１０５が挿入されるカードコネクタ１０２が実装される。 The second connection surface 126 of the relay connector (frame body) 103 is joined to the bottom surface of the recess 122, and the connection terminal 128 of the flange portion 125 is joined to the mounting surface 121 that ensures the same flatness and rigidity as the general substrate. The A card connector 102 into which a card (UIM, micro SD) 105 is inserted is mounted on the upper surface of the connector substrate 104.

このように本実施の形態によれば、中継コネクタ１０３は、マザー基板（メイン基板）１０１の実装面１２１にフランジ部１２５の接続端子１２８が接合されるので、カードコネクタ１０２の実装品質が確保でき、また、凹部１２２の底面に第２接続面１２６が接合されるので、はんだ付け強度が向上するとともに、凹部（キャビティ）１２２の深さ分だけ実装体が薄型化する。 As described above, according to the present embodiment, the connection connector 128 of the flange portion 125 is joined to the mounting surface 121 of the mother board (main board) 101 in the relay connector 103, so that the mounting quality of the card connector 102 can be ensured. In addition, since the second connection surface 126 is joined to the bottom surface of the recess 122, the soldering strength is improved and the mounting body is made thinner by the depth of the recess (cavity) 122.

図４は、本実施の形態にかかるカードコネクタ用中継コネクタを凹部に備えた回路基板の実装構造断面図（１）−２（図１の１点鎖線に対応）を示す。本実施の形態において、マザー基板（メイン基板）１０１の実装面１２１に凹部１２２が形成され、その凹部１２２の底面に、半導体パッケージ部品１０８およびＬＣＲチップ部品１０７がはんだ付けされる。 FIG. 4 is a cross-sectional view (1) -2 (corresponding to the one-dot chain line in FIG. 1) of the circuit board having the relay connector for card connector according to the present embodiment provided in the recess. In the present embodiment, a recess 122 is formed on the mounting surface 121 of the mother substrate (main substrate) 101, and the semiconductor package component 108 and the LCR chip component 107 are soldered to the bottom surface of the recess 122.

凹部１２２と実装面１２１の境界には、第１のフランジ部１３１および第２のフランジ１３２が形成された中継コネクタ（枠体）１０３が位置決めされ、凹部１２２の底面および実装面１２１にはんだ付けされる。また、中継コネクタ１０３の上面にコネクタ基板１０４がはんだ付けされ、コネクタ基板１０４の上面に、カード挿入口１３３からカード（ＵＩＭ，マイクロＳＤ）１０５が挿入されるカードコネクタ（カードスロット）１０２が実装される。 A relay connector (frame body) 103 in which the first flange portion 131 and the second flange 132 are formed is positioned at the boundary between the recess 122 and the mounting surface 121 and is soldered to the bottom surface of the recess 122 and the mounting surface 121. The The connector board 104 is soldered to the upper surface of the relay connector 103, and the card connector (card slot) 102 into which the card (UIM, micro SD) 105 is inserted from the card insertion port 133 is mounted on the upper surface of the connector board 104. The

本実施の形態では、強度をより強くしたいところのフランジの突出量を大きくする。すなわち、第1のフランジ部１３１は、カードコネクタ１０２のカード挿入口１３３に対応して配置され、第１のフランジ１３１の側面からの突出の長さは、第２のフランジ１３２の側面からの突出の長さより大きい。 In the present embodiment, the protruding amount of the flange where the strength is desired to be increased is increased. That is, the first flange portion 131 is disposed corresponding to the card insertion port 133 of the card connector 102, and the length of the protrusion from the side surface of the first flange 131 is the length from the side surface of the second flange 132. Greater than the length of

これによりカード挿入口１３３の実装強度が向上するので、カード１０５の抜き差し応力に対する耐性が向上する。また、マザー基板（メイン基板）１０１の実装面１２１にフランジ部１２５の接続端子１２８が接合されるので、カードコネクタ１０２の平坦性が確保でき、また、凹部１２２の底面に第２接続面１２６が接合されるので、凹部の深さ分だけ実装体が薄型化を図ることができる。 As a result, the mounting strength of the card insertion slot 133 is improved, and the resistance of the card 105 to the insertion / extraction stress is improved. Further, since the connection terminal 128 of the flange portion 125 is joined to the mounting surface 121 of the mother substrate (main substrate) 101, the flatness of the card connector 102 can be secured, and the second connection surface 126 is formed on the bottom surface of the recess 122. Since it is joined, the mounting body can be made thinner by the depth of the recess.

図５は、本実施の形態にかかるカードコネクタ用中継コネクタを凹部に備えた回路基板の改良型Ａの実装構造断面図（１）−１（図１の１点鎖線に対応）である。本実施の形態では、凹部１２２内に壁部１３６が形成され、中継コネクタ１０３と、半導体パッケージ部品１０８およびＬＣＲチップ部品１０７等の電子部品を分離する。これにより、凹部１２２内には、中継コネクタ１０３とマザー基板（メイン基板）１０１とに挟まれた部分に小キャビティ１３５ができる。 FIG. 5 is a sectional view (1) -1 (corresponding to the one-dot chain line in FIG. 1) of the improved type A of the circuit board provided with the card connector relay connector according to the present embodiment in the recess. In the present embodiment, a wall 136 is formed in the recess 122 and separates the relay connector 103 and electronic components such as the semiconductor package component 108 and the LCR chip component 107. As a result, a small cavity 135 is formed in the recess 122 at a portion sandwiched between the relay connector 103 and the mother board (main board) 101.

マザー基板（メイン基板）１０１の実装面１２１に凹部１２２が形成され、その凹部１２２の底面に、半導体パッケージ部品１０８およびＬＣＲチップ部品１０７がはんだ付けされる。凹部１２２と実装面１２１の境界には、フランジ部１２５が形成された中継コネクタ（枠体）１０３が位置決めされ、凹部１２２の底面および実装面１２１にはんだ付けされる。また、中継コネクタ１０３の上面にコネクタ基板１０４がはんだ付けされ、コネクタ基板１０４の上面に、カード（ＵＩＭ，マイクロＳＤ）１０５を収納したカードコネクタ（カードスロット）１０２が実装される。 A recess 122 is formed in the mounting surface 121 of the mother substrate (main substrate) 101, and the semiconductor package component 108 and the LCR chip component 107 are soldered to the bottom surface of the recess 122. A relay connector (frame body) 103 in which a flange portion 125 is formed is positioned at the boundary between the recess 122 and the mounting surface 121, and is soldered to the bottom surface of the recess 122 and the mounting surface 121. A connector board 104 is soldered on the upper surface of the relay connector 103, and a card connector (card slot) 102 containing a card (UIM, micro SD) 105 is mounted on the upper surface of the connector board 104.

本実施の形態によれば、小キャビティ１３５を樹脂封止することで、中継コネクタ１０３の周囲全体が補強され強度が向上する。また、壁部１３６により、中継コネクタ（ＭＩＤ）１０３と他の電子部品の実装部を分離するので、実装部品の高さに適合するように凹部１２２の深さと小キャビティ１３５の深さを別々に設定することができる。また、壁部１３６により、注入した樹脂が電子部品の実装部の方へ流れ込まないように堰き止めることができる。なお、小キャビティ１３５内へのはんだ供給は、ディスペンス方式（エアによるクリームはんだの押し出し）または、中継コネクタ１０３へのクリームはんだ転写により行うことができる。あるいは、はんだ粒子入りの絶縁性樹脂を用いて、ローカルリフロー方式で接合してもよい。 According to the present embodiment, by sealing the small cavity 135 with resin, the entire periphery of the relay connector 103 is reinforced and the strength is improved. In addition, the wall 136 separates the relay connector (MID) 103 and the mounting part of the other electronic components, so that the depth of the recess 122 and the depth of the small cavity 135 are separately adjusted to match the height of the mounting part. Can be set. Further, the wall 136 can be dammed so that the injected resin does not flow toward the mounting part of the electronic component. The solder can be supplied into the small cavity 135 by a dispensing method (cream solder extrusion by air) or by transfer of cream solder to the relay connector 103. Or you may join by a local reflow system using the insulating resin containing a solder particle.

図６は、本実施の形態にかかるカードコネクタ用中継コネクタを凹部に備えた回路基板の改良型Ｂの実装構造断面図（１）−１（図１の１点鎖線に対応）である。本実施の形態において、マザー基板（メイン基板）１０１の実装面１２１には凹部１２２が形成され、その凹部１２２内には、マザー基板１０１の実装面１２１と同一面（同一高さ）に、壁部１３６が形成され、中継コネクタ１０３と、半導体パッケージ部品１０８およびＬＣＲチップ部品１０７等の電子部品を分離する。これにより凹部１２２内には、中継コネクタ１０３とマザー基板（メイン基板）１０１とに挟まれた部分に小キャビティ１３５ができる。ここで、壁部１３６は、実装面１２１と同じ高さにあるので、基板製造工程（積層プレス工程など）により、実装面１２１と同じ平坦性が確保されている。 6 is a cross-sectional view (1) -1 (corresponding to the one-dot chain line in FIG. 1) of the improved type B of the circuit board provided with the card connector relay connector according to the present embodiment in the recess. In the present embodiment, a recess 122 is formed in the mounting surface 121 of the mother substrate (main substrate) 101, and a wall is formed in the recess 122 on the same surface (the same height) as the mounting surface 121 of the mother substrate 101. A portion 136 is formed to separate the relay connector 103 from electronic components such as the semiconductor package component 108 and the LCR chip component 107. As a result, a small cavity 135 is formed in the recess 122 at a portion sandwiched between the relay connector 103 and the mother board (main board) 101. Here, since the wall 136 is at the same height as the mounting surface 121, the same flatness as that of the mounting surface 121 is ensured by the substrate manufacturing process (such as a laminating press process).

中継コネクタ（枠体）１０３には、内側に向けた接続端子１２８を有したフランジ部１２５が形成され、フランジ部１２５の接続端子１２８が壁部１３６の上面（実装面）にはんだ付けされる。また、中継コネクタ１０３の上面にコネクタ基板１０４がはんだ付けされ、コネクタ基板１０４の上面に、カード（ＵＩＭ，マイクロＳＤ）１０５を収納したカードコネクタ（カードスロット）１０２が実装される。 The relay connector (frame) 103 is formed with a flange portion 125 having an inward connection terminal 128, and the connection terminal 128 of the flange portion 125 is soldered to the upper surface (mounting surface) of the wall portion 136. A connector board 104 is soldered on the upper surface of the relay connector 103, and a card connector (card slot) 102 containing a card (UIM, micro SD) 105 is mounted on the upper surface of the connector board 104.

本実施の形態によれば、中継コネクタ１０３を小型化し、実装面積を削減することができる。また、小キャビティ１３５を封止材で封止することで、中継コネクタ１０３の周囲全体が樹脂補強され強度が向上する。さらに、壁部１３６により、中継コネクタ１０３と他の部品実装部を分離するので、実装部品の高さに適合するように凹部１２２の深さと小キャビティ１３５の深さを別々に設定することができる。また、壁部１３６により、注入した樹脂が電子部品の実装部の方へ流れ込まないように堰き止めることができる。なお、小キャビティ１３５内へのはんだ供給は、ディスペンス方式（エアによるクリームはんだの押し出し）または、中継コネクタへのクリームはんだ転写により行うことができる。あるいは、はんだ粒子入りの絶縁性樹脂を用いて、ローカルリフロー方式で接合してもよい。 According to the present embodiment, the relay connector 103 can be downsized and the mounting area can be reduced. Further, by sealing the small cavity 135 with a sealing material, the entire periphery of the relay connector 103 is reinforced with resin and the strength is improved. Further, since the relay connector 103 and the other component mounting portion are separated by the wall 136, the depth of the concave portion 122 and the depth of the small cavity 135 can be set separately to match the height of the mounted component. . Further, the wall 136 can be dammed so that the injected resin does not flow toward the mounting part of the electronic component. In addition, the solder supply into the small cavity 135 can be performed by a dispense method (extrusion of cream solder by air) or by transfer of cream solder to the relay connector. Or you may join by a local reflow system using the insulating resin containing a solder particle.

図７は、本実施の形態にかかるカードコネクタ用中継コネクタを凹部に備えた回路基板の改良型Ｃの実装構造断面図（１）−１（図１の１点鎖線に対応）である。本実施の形態において、マザー基板（メイン基板）１０１の実装面１２１には凹部１２２が形成され、凹部１２２と実装面１２１の境界には、フランジ部１２５が形成された中継コネクタ（枠体）１０３が位置決めされ、凹部１２２の底面および実装面１２１にはんだ付けされる。 FIG. 7 is a cross-sectional view (1) -1 (corresponding to the one-dot chain line in FIG. 1) of the improved type C of the circuit board provided with the card connector relay connector according to the present embodiment in the recess. In the present embodiment, a recess 122 is formed in the mounting surface 121 of the mother substrate (main substrate) 101, and a relay connector (frame) 103 in which a flange portion 125 is formed at the boundary between the recess 122 and the mounting surface 121. Is positioned and soldered to the bottom surface of the recess 122 and the mounting surface 121.

中継コネクタ１０３の上面には、コネクタ基板１０４がはんだ付けされ、コネクタ基板１０４の下面に半導体パッケージ部品１０８およびＬＣＲチップ部品１０７（第1電子部品）がはんだ付けされる。また、コネクタ基板１０４の上面には、カード（ＵＩＭ，マイクロＳＤ）１０５を収納したカードコネクタ（カードスロット）１０２（第２電子部品）が実装される。 The connector substrate 104 is soldered to the upper surface of the relay connector 103, and the semiconductor package component 108 and the LCR chip component 107 (first electronic component) are soldered to the lower surface of the connector substrate 104. A card connector (card slot) 102 (second electronic component) containing a card (UIM, micro SD) 105 is mounted on the upper surface of the connector substrate 104.

本実施の形態によれば、コネクタ基板１０４の下面に電子部品を実装し、凹部１２２の底面には中継コネクタ１０３以外の電子部品を実装しないので、要求される平坦性精度が緩和される。 According to the present embodiment, since the electronic component is mounted on the lower surface of the connector substrate 104 and no electronic component other than the relay connector 103 is mounted on the bottom surface of the recess 122, the required flatness accuracy is eased.

図８は、本実施の形態にかかるカードコネクタ用中継コネクタを凹部に備えた回路基板の実装構造断面図（１）−１（図１の１点鎖線に対応）である。マザー基板（メイン基板）１０１の実装面１２１には凹部１２２が形成され、その凹部１２２の底面に、半導体パッケージ部品１０８およびＬＣＲチップ部品１０７等の電子部品がはんだ付けされ、さらに、半導体パッケージ１０８は封止材１４２で補強される。 FIG. 8 is a cross-sectional view (1) -1 (corresponding to the one-dot chain line in FIG. 1) of a circuit board provided with a relay connector for card connector according to the present embodiment in a recess. A recess 122 is formed on the mounting surface 121 of the mother substrate (main substrate) 101, and electronic components such as the semiconductor package component 108 and the LCR chip component 107 are soldered to the bottom surface of the recess 122. Reinforced with a sealing material 142.

凹部１２２と実装面１２１の境界には、マザー基板１０１と接続する接続端子１２８を有したフランジ部１２５が形成された中継コネクタ（枠体）１０３が位置決めされ、凹部１２２の底面および実装面１２１にはんだ付けされるとともに、マザー基板（メイン基板）１０１との間隙が封止材１４２で封止される。中継コネクタ１０３の上面には、封止材ボイド回避用空気穴兼半導体パッケージ部品封止材注入穴１４１が形成されたコネクタ基板１０４がはんだ付けされ、コネクタ基板１０４の上面にカード（ＵＩＭ，マイクロＳＤ）１０５が挿入されるカードコネクタ（カードスロット）１０２が実装される。 At the boundary between the recess 122 and the mounting surface 121, a relay connector (frame body) 103 having a flange portion 125 having a connection terminal 128 connected to the mother board 101 is positioned, and the bottom surface of the recess 122 and the mounting surface 121 are positioned. While being soldered, the gap with the mother board (main board) 101 is sealed with a sealing material 142. A connector substrate 104 having a sealing material void avoidance air hole / semiconductor package component sealing material injection hole 141 formed thereon is soldered to the upper surface of the relay connector 103, and a card (UIM, micro SD) is mounted on the upper surface of the connector substrate 104. ) 105 is inserted into the card connector (card slot) 102.

本実施の形態によれば、中継コネクタ１０３とマザー基板（メイン基板）１０１の間隙に封止材１４２を注入し、安定した精度良い樹脂量で補強できる。また、コネクタ基板１０４に封止材ボイド回避用空気穴兼半導体パッケージ部品封止材注入穴１４１が形成されているので、補強樹脂の熱硬化時に凹部内空気の熱膨張によりボイドが発生するのを防止できる。なお、コネクタ基板１０４の封止材ボイド回避用空気穴兼半導体パッケージ部品封止材注入穴１４１から、半導体パッケージ部品１０８へ封止材１４２をディスペンス方式で供給できる。 According to the present embodiment, the sealing material 142 is injected into the gap between the relay connector 103 and the mother board (main board) 101, and can be reinforced with a stable and accurate resin amount. Further, since the sealing substrate void avoidance air hole / semiconductor package component sealing material injection hole 141 is formed in the connector substrate 104, voids are generated due to the thermal expansion of the air in the recess when the reinforcing resin is thermally cured. Can be prevented. It is to be noted that the sealing material 142 can be supplied to the semiconductor package component 108 from the sealing material void avoidance air hole / semiconductor package component sealing material injection hole 141 of the connector substrate 104 by a dispensing method.

図９（Ａ）は、本実施の形態において４辺全てに接続端子１５３（図の上面電極），１５４（図の下面電極）を設けたフランジ部１５５のある枠状の中継コネクタ１５１を示し、接続端子１５３と、接続端子１５４は、枠体の外周（フランジ部を含む）側面で電気的に接続されている。図９（Ｂ）は、中継コネクタ１５１が接合される第１基板１６１を示す。なお、図１〜８に示した中継コネクタ１０３は接続端子を２辺に設けたものであり、上面接続と下面接続端子は、枠体の内周（図６では、フランジ部を含む）側面で電気的に接続されている。 FIG. 9A shows a frame-shaped relay connector 151 having a flange portion 155 provided with connection terminals 153 (upper surface electrodes) and 154 (lower surface electrodes in the drawing) on all four sides in the present embodiment. The connection terminal 153 and the connection terminal 154 are electrically connected on the outer periphery (including the flange portion) side surface of the frame. FIG. 9B shows the first substrate 161 to which the relay connector 151 is joined. The relay connector 103 shown in FIGS. 1 to 8 is provided with connection terminals on two sides, and the upper surface connection and the lower surface connection terminals are on the inner periphery of the frame (including the flange portion in FIG. 6). Electrically connected.

この中継コネクタ１５１には、枠体１５６の外側（または内側）にフランジ部１５５が形成され、枠体１５６の内側１５２に電子部品が配置される。第１接続面の第１接続端子１５３は、図１〜８に示したコネクタ基板１０４（第２基板）に接合される。第２接続面の第２接続端子１５４は、第１基板１６１の凹部１６０の底面１５９に接合される。フランジ部１５５の下面は、第１基板１６１の実装面１６２に接合される。 In the relay connector 151, a flange portion 155 is formed on the outer side (or inner side) of the frame body 156, and electronic components are arranged on the inner side 152 of the frame body 156. The first connection terminal 153 on the first connection surface is joined to the connector board 104 (second board) shown in FIGS. The second connection terminal 154 on the second connection surface is bonded to the bottom surface 159 of the recess 160 of the first substrate 161. The lower surface of the flange portion 155 is bonded to the mounting surface 162 of the first substrate 161.

図１０は、本実施の形態にかかるカードコネクタ用中継コネクタを凹部に備えた回路基板の実装構造上面図である。この回路基板は、中継コネクタの側面に樹脂封止口を設置したものである。すなわち、図１０（Ａ）に示すように、中継コネクタの側面に第１の開口部１７３および第２の開口部１７６を設け、第１の開口部１７３からディスペンサー１７１で樹脂１７２を供給する。樹脂１７２は、矢印１７７に示すようにフランジ１７４、１７５の下部にある間隙１７８、１７９を通って、対向する第２の開口部１７６まで流動する。これは、第２の開口部１７６が、空気穴の役割を果たしているためであり、図１０（Ｂ）に示すように、第１のフランジ部１７４および第２のフランジ部１７５と第１基板１８０との隙間１７８，１７９にも樹脂１７２が充填され、樹脂１７２が枠体を囲む。 FIG. 10 is a top view of a circuit board mounting structure in which the card connector relay connector according to the present embodiment is provided in a recess. In this circuit board, a resin sealing port is provided on the side surface of the relay connector. That is, as shown in FIG. 10A, a first opening 173 and a second opening 176 are provided on the side surface of the relay connector, and the resin 172 is supplied from the first opening 173 by the dispenser 171. The resin 172 flows through the gaps 178 and 179 at the lower portions of the flanges 174 and 175 as shown by the arrow 177 to the second opening 176 facing the resin 172. This is because the second opening 176 plays the role of an air hole. As shown in FIG. 10B, the first flange 174, the second flange 175, and the first substrate 180 are provided. The gaps 178 and 179 are also filled with the resin 172, and the resin 172 surrounds the frame.

図１１は、カードコネクタ用中継コネクタを凹部に備えた回路基板の実装構造上面図である。この回路基板は、中継コネクタの側面１箇所のみに樹脂封止口を設置したものである。すなわち、中継コネクタの側面に第１の開口部１７３のみを設け、第１の開口部１７３から、ディスペンサー１７１で樹脂１７２を供給する。樹脂１７２は、樹脂供給辺以外がフランジで覆われた場合（空気穴が無い場合）、矢印１８１に示すようにフランジ下部の間隙途中で流動が止まり、間隙全体には充填されずに、間隙の一部が空洞になる。 FIG. 11 is a top view of a circuit board mounting structure in which a card connector relay connector is provided in a recess. In this circuit board, a resin sealing port is provided only at one side of the relay connector. That is, only the first opening 173 is provided on the side surface of the relay connector, and the resin 172 is supplied from the first opening 173 by the dispenser 171. When the resin 172 is covered with a flange except for the resin supply side (when there is no air hole), the flow stops in the middle of the gap at the bottom of the flange as shown by the arrow 181 and the entire gap is not filled. A part becomes hollow.

図１２は、本実施の形態にかかるカードコネクタ用中継コネクタを凹部に備えた回路基板の実装構造断面図（１）−２（図１の１点鎖線に対応）である。第２の基板１８４には、中継コネクタの梁部１８８で仕切られたパーティション毎に樹脂供給用の開口部１８５を設置する。そして、それぞれの開口部１８５から内部樹脂１８２をディスペンサー１７１で供給する。 FIG. 12 is a cross-sectional view (1) -2 (corresponding to the one-dot chain line in FIG. 1) of the circuit board provided with the card connector relay connector according to the present embodiment in the recess. The second substrate 184 is provided with an opening 185 for supplying resin for each partition partitioned by the beam portion 188 of the relay connector. Then, the internal resin 182 is supplied from the respective openings 185 by the dispenser 171.

内部樹脂１８２は、第１基板１８０の実装面１８６以上（第１基板１８０の実装面１８６部の厚み以上）、第２基板１８４の第１の面１８３以下であり（内部樹脂１８２の頂面の取り得る範囲１８７）、開口部１８５から溢れ出ない。これにより第１基板１８０の強度の劣る部分（厚みの薄い部分、すなわち凹部）を樹脂で補強することができる。 The internal resin 182 is not less than the mounting surface 186 of the first substrate 180 (more than the thickness of the mounting surface 186 portion of the first substrate 180) and not more than the first surface 183 of the second substrate 184 (on the top surface of the internal resin 182). The possible range 187) does not overflow from the opening 185. Thereby, the inferior strength portion (thin thickness portion, that is, the concave portion) of the first substrate 180 can be reinforced with the resin.

以上説明したように、本実施の形態のカードコネクタ用中継コネクタを凹部に備えた回路基板は中継コネクタを有し、中継コネクタを平坦性の確保されたマザー基板表面（実装面）と平坦性にやや乏しい凹部下面の双方にはんだ付けすることで、凹部内実装後の平坦性、実装強度を確保する。また、中継コネクタ上に実装したコネクタ基板の下面に部品実装すれば、凹部底面の平坦性精度をより緩和できる。その結果、凹部の深さ分薄型化可能となる。 As described above, the circuit board provided with the card connector relay connector in the concave portion according to the present embodiment has the relay connector, and the relay connector is flat with the mother board surface (mounting surface) in which flatness is ensured. By soldering to both of the slightly lower surface of the recess, the flatness and mounting strength after mounting in the recess are ensured. In addition, if components are mounted on the lower surface of the connector board mounted on the relay connector, the flatness accuracy of the bottom surface of the recess can be further relaxed. As a result, the thickness can be reduced by the depth of the recess.

また、中継コネクタと凹部との間の間隙部については、フランジ部に複数の開口部を設けることで、補強樹脂の封止し易さと、補強樹脂の間隙部周回拡散性確保、補強樹脂の広がり抑制の効果があり、落下衝撃耐性を高め、実装強度を確保できる。 In addition, with respect to the gap between the relay connector and the recess, by providing a plurality of openings in the flange, it is easy to seal the reinforcing resin, ensure the diffusibility of the reinforcing resin around the gap, and spread the reinforcing resin. There is an effect of suppression, it is possible to enhance the drop impact resistance and secure the mounting strength.

さらに製造工程において、（１）カードモジュールを実装し、分割し、（２）凹部内およびマザー基板を同時に実装し（カードモジュール実装を含む）、（３）中継コネクタと凹部の隙間を樹脂封止することにより、封止樹脂の安定供給が可能になる。 Further, in the manufacturing process, (1) the card module is mounted and divided, (2) the recess and the mother board are mounted simultaneously (including the card module mounting), and (3) the gap between the relay connector and the recess is resin-sealed. By doing so, it becomes possible to stably supply the sealing resin.

また、上記において、中継コネクタ上にカードコネクタを実装する場合、カード挿入辺は、中継コネクタの一部であるフランジ部で受ける構造にする。これにより、カード挿入辺に下部には、コネクタ基板、中継コネクタフランジ部、およびマザー基板があるので、十分な剛性が確保され、十分な耐押し強度を確保できる。 Further, in the above, when the card connector is mounted on the relay connector, the card insertion side is configured to be received by the flange portion which is a part of the relay connector. Thereby, since there is a connector board, a relay connector flange part, and a mother board in the lower part on the card insertion side, sufficient rigidity is secured and sufficient push-proof strength can be secured.

以上、本発明の各種実施形態を説明したが、本発明は前記実施形態において示された事項に限定されず、特許請求の範囲及び明細書の記載、並びに周知の技術に基づいて、当業者がその変更・応用することも本発明の予定するところであり、保護を求める範囲に含まれる。 Although various embodiments of the present invention have been described above, the present invention is not limited to the matters shown in the above-described embodiments, and those skilled in the art will be able to understand based on the claims and the description of the specification and well-known techniques. Modifications and applications thereof are also planned by the present invention, and are included in the scope of seeking protection.

本発明は、カードコネクタ用中継コネクタを基板の凹部に備えた回路基板、コネクタおよび電子機器として利用可能である。 INDUSTRIAL APPLICABILITY The present invention can be used as a circuit board, a connector, and an electronic device provided with a card connector relay connector in a recess of the board.

１チップ部品
２，２’，１８ａ，２０ａ電極
２ａ三次元基板間接続構造体
３，３’ 鍔部
４鍔付チップ形電子部品
５印刷配線基板
６凹部
２２バンプ
２４第１の回路基板
２６第２の回路基板
５４立体回路装置
１０１マザー基板（メイン基板）
１０２カードコネクタ（カードスロット）
１０３，１５１中継コネクタ
１０４コネクタ基板
１０５カード
１０７ＬＣＲチップ部品
１０８半導体パッケージ部品
１０９中継コネクタ段差境界
１１０凹部境界（マザー基板キャビティ部境界）
１１１，１４２封止材
１２１，１６２，１８６実装面
１２２，１６０凹部（マザー基板キャビティ部）
１２３，１５３第１接続端子
１２４第１接続面
１２５，１５５フランジ部
１２６第２接続面
１２７，１５４第２接続端子
１２８接続端子
１３１，１７４第１のフランジ部
１３２，１７５第２のフランジ部
１３３カード挿入口
１３５小キャビティ
１３６壁部
１４１封止材ボイド回避用空気穴兼半導体パッケージ部品封止材注入穴
１５２枠体の内側
１５６枠体
１５７フランジ部の下面
１５８第１基板の実装面
１５９凹部の底面
１６１，１８０第１基板
１７１ディスペンサー（樹脂供給のための容器のみ示す）
１７２樹脂
１７３第１の開口部
１７６第２の開口部
１７７，１８１矢印（樹脂の流動方向を示す）
１７８，１７９隙間
１８２内部樹脂
１８５開口部
１８７内部樹脂の頂面の取り得る範囲
１８８梁部 DESCRIPTION OF SYMBOLS 1 Chip components 2, 2 ', 18a, 20a Electrode 2a Three-dimensional board | substrate connection structure 3, 3' A collar part 4 A chip-type electronic component 5 with a collar 5 Printed wiring board 6 Recess 22 Bump 24 1st circuit board 26 2nd Circuit board 54 Three-dimensional circuit device 101 Mother board (main board)
102 Card connector (card slot)
103, 151 Relay connector 104 Connector substrate 105 Card 107 LCR chip component 108 Semiconductor package component 109 Relay connector step boundary 110 Recess boundary (mother substrate cavity boundary)
111, 142 Sealant 121, 162, 186 Mounting surface 122, 160 Recess (mother substrate cavity)
123, 153 First connection terminal 124 First connection surface 125, 155 Flange portion 126 Second connection surface 127, 154 Second connection terminal 128 Connection terminal 131, 174 First flange portion 132, 175 Second flange portion 133 Card Insert port 135 Small cavity 136 Wall 141 Sealing material void avoidance air hole / semiconductor package component sealing material injection hole 152 Inside of frame 156 Frame 157 Bottom surface of flange 158 Mounting surface 159 of first substrate Bottom of recess 161,180 First substrate 171 Dispenser (only a container for resin supply is shown)
172 Resin 173 First opening 176 Second opening 177, 181 Arrow (indicates resin flow direction)
178, 179 Clearance 182 Internal resin 185 Opening 187 Possible range of top surface of internal resin 188 Beam

Claims

A substrate including a mounting surface and a recess provided in the mounting surface;
A first connection surface on which a first connection terminal is disposed; a second connection surface on which a second connection terminal electrically connected to the first connection terminal is disposed; and the first connection surface and the second connection. A connector including a frame body including a side surface connecting the surface and a flange portion protruding from the side surface;
An electronic component disposed inside the recess of the substrate,
The frame includes the electronic component therein, the second connection surface is bonded to the bottom surface of the recess, and the flange portion is bonded to the mounting surface.

The circuit board according to claim 1,
The electronic component is a circuit board disposed on a bottom surface of the recess.

The circuit board according to claim 1 or 2,
The said flange part is a circuit board provided with a 1st flange part and a 2nd flange part.

The circuit board according to claim 3,
The circuit board disposed at a position where the second flange portion faces the first flange portion.

The circuit board according to claim 3 or claim 4,
The length of the protrusion from the side surface of the first flange is larger than the length of the protrusion from the side surface of the second flange.

The circuit board according to any one of claims 1 to 5,
A circuit board provided with a wall portion rising from the bottom surface between the frame and the electronic component.

The circuit board according to claim 6,
A circuit board in which an uppermost surface of the wall portion is flush with the mounting surface, and the flange portion is bonded to an upper surface of the wall portion.

The circuit board according to any one of claims 1 to 7,
The substrate is a first substrate,
A second substrate comprising first and second surfaces;
A circuit board in which the second surface of the second substrate is joined to the first connection surface of the connector.

The circuit board according to claim 8, wherein
The electronic component is a circuit board disposed on the second surface of the second board.

The circuit board according to claim 8 or 9, wherein
The electronic component is a first electronic component,
A second electronic component;
The second electronic component is a circuit board disposed on the first surface of the second board.

The circuit board according to claim 10,
A circuit board in which the second electronic component is a card connector.

The circuit board according to claim 5 and claim 11,
The first flange portion is a circuit board disposed corresponding to the insertion slot of the card connector.

The circuit board according to any one of claims 1 to 12,
A circuit board filled with a resin between a side surface of the recess and the frame.

The circuit board of claim 13,
A circuit board provided with an opening leading to the recess in the flange portion.

15. The circuit board of claim 14, wherein
The opening is a circuit board including a first opening and a second opening.

The circuit board according to any one of claims 13 to 15,
The resin is a circuit board surrounding the frame.

The circuit board according to any one of claims 1 to 16,
A circuit board comprising an internal resin filled in the frame.

The circuit board according to claim 17, wherein
The top surface of the internal resin is a circuit board between the mounting surface and the first surface of the second substrate.

A first connection surface on which the first connection terminals are disposed;
A second connection surface on which a second connection terminal electrically connected to the first connection terminal is disposed;
A side surface connecting the first connection surface and the second connection surface;
A flange protruding from the side surface;
Connector with.

The connector according to claim 19, wherein
The flange portion is a connector having substantially the same surface as the first connection surface.

An electronic apparatus comprising the circuit board according to any one of claims 1 to 18 or the connector according to claim 19 or 20.