JP2010045315A - Method for manufacturing electronic controller, and electronic controller - Google Patents

Method for manufacturing electronic controller, and electronic controller Download PDF

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Publication number
JP2010045315A
JP2010045315A JP2008210115A JP2008210115A JP2010045315A JP 2010045315 A JP2010045315 A JP 2010045315A JP 2008210115 A JP2008210115 A JP 2008210115A JP 2008210115 A JP2008210115 A JP 2008210115A JP 2010045315 A JP2010045315 A JP 2010045315A
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JP
Japan
Prior art keywords
substrate
connector
hole
circuit
electronic control
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Granted
Application number
JP2008210115A
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Japanese (ja)
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JP5187065B2 (en
Inventor
Toru Nomura
徹 野村
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Denso Corp
株式会社デンソー
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Priority to JP2008210115A priority Critical patent/JP5187065B2/en
Publication of JP2010045315A publication Critical patent/JP2010045315A/en
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Publication of JP5187065B2 publication Critical patent/JP5187065B2/en
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/4847Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/13Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304Transistor
    • H01L2924/1305Bipolar Junction Transistor [BJT]
    • H01L2924/13055Insulated gate bipolar transistor [IGBT]

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic controller capable of securing engagement with a mating connector, and capable of restraining connection reliability between a terminal and a circuit from getting low, and to provide a method for manufacturing the same. <P>SOLUTION: This electronic controller 100 includes: a substrate 10 mounted with an element 12 constituting the circuit; a connector 30 with the terminal 31 held in a housing 32; and a sealing resin part 50 for coating a circuit side exposed portion of the terminal and the circuit, A penetrated-through substrate 11 has a through-hole 14 in another portion different from an element mounted portion, the connector has a projected portion 30a inserted into the through-hole and projected toward a reverse face side of the penetrated-through substrate. The housing and the penetrated-through substrate are bondedly fixed to surround the through-hole, the sealing resin part is arranged to cover the element mounted portion of the penetrated-through substrate, including a portion 30b exposed from the through-hole and the circuit, and the projected portion of the connector and a peripheral portion adjacent to the projected portion of the connector on a reverse face of the penetrated-through substrate are projected from the sealing resin part. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an electronic control device manufacturing method and an electronic control device.
  For example, Patent Documents 1 and 2 show electronic control devices that are arranged in harsh environments (installability, heat resistance, oil resistance, etc.) such as a vehicle engine room and a transmission and control an engine, an automatic transmission, and the like. Thus, a structure in which a circuit configured on a substrate is covered with a sealing resin such as an epoxy resin has been proposed.
  In Patent Document 1, an electronic circuit board (board) on which electronic components are mounted and a terminal portion (terminal) of a connector is soldered is placed in a mold, and a paste-like resin is poured in a vacuum state, By heating and curing, an electronic circuit device (electronic control device) in which the electronic circuit board and the electronic component are covered with a protective resin (sealing resin) is obtained.
In Patent Document 2, an electronic circuit board (board) on which an electronic component is mounted and an external terminal (terminal) of a connector is wire-connected is placed in a mold, and the electronic component is formed by a transfer molding method or a compression molding method. An engine control unit for an automobile (electronic control device) in which an exposed portion on the circuit side of an external terminal including a circuit connecting portion and a circuit configured on an electronic circuit board is covered with an epoxy resin molding material (sealing resin) ).
JP 2006-41071 A JP 2006-41071 A
  By the way, as shown in Patent Documents 1 and 2, in a conventional electronic control device having a connector and sealed with a sealing resin, at least a counterpart connector in the connector in a direction substantially perpendicular to the thickness direction of the substrate. The fitting site with the (external connector) is located outside the outer peripheral edge of the substrate. For this reason, in order to secure the fitting between the connector and the counterpart connector, the mold is brought into contact with the housing of the connector (see FIG. 3 of Patent Document 1 and FIG. 1 (h) of Patent Document 2), and the counterpart in the housing. The fitting portion with the connector is not covered with the sealing resin. Further, at least the die on the element mounting surface side of the substrate is brought into contact with only the connector (housing).
  In order to prevent the fitting part of the housing from being covered with the sealing resin by bringing the mold into contact with each other in this way, in general, in order to prevent burrs of the sealing resin, The tolerance is assumed to be negative from zero. Therefore, there is a risk that the mold will strongly hit the housing due to variations in the dimensions of the circuit board and the connector, mounting variations between the circuit board and the connector, and the housing may be damaged. In this case, the fitting with the counterpart connector cannot be ensured. Further, the stress acting on the housing may reduce the reliability of the connection portion between the terminal and the circuit (for example, the land at the end of the wiring).
  SUMMARY OF THE INVENTION In view of the above problems, the present invention provides an electronic control device manufacturing method and an electronic control device that can ensure fitting with a mating connector and suppress a decrease in reliability of a connection portion between a terminal and a circuit. With the goal.
  In order to achieve the above-mentioned object, the invention according to claim 1 is configured to electrically connect a circuit on which a device is mounted and configured on a substrate and a terminal of a connector held in a housing, and a connection portion between the circuit A method for manufacturing an electronic control device in which a circuit including an exposed portion on a circuit side in a terminal including a terminal and a circuit including a connection portion with the terminal is sealed with a sealing resin, and an element is provided only on one surface as a substrate. A preparatory step for preparing a through-board that is mounted and having a through-hole at a site different from the device mounting site, and the connector through-hole so that the mating site with the mating connector protrudes to the back side of the device mounting surface of the through-board After inserting and fixing at least a part of the facing portion between the outer surface of the housing and the through substrate in an annular shape so as to surround the through hole, the exposed portion and circuit on the circuit side of the terminal exposed through the through hole When A structure is disposed on one of a pair of molds constituting a mounting process and a transfer molding machine, or a compression molding machine, which are electrically connected to form a structure including a substrate including a through-hole substrate and a connector. Thereafter, the pair of molds are clamped and pressurized, and the element forming surface side of the through-hole substrate is covered with a sealing resin so as to include the connector part and the element exposed through the through hole, and the circuit side of the terminal And a molding step for sealing the circuit. In the preparatory process, in the state after the mounting process, in a direction substantially perpendicular to the thickness direction of the through board, a through hole is formed at a predetermined position so that the through board surrounds the periphery of the connector housing. A through-substrate is prepared, and in the molding process, as a mold on the back surface side of the element mounting surface of the through-substrate, there is a recess corresponding to the protruding portion of the connector, and a portion facing the opening peripheral portion of the recess on the back surface of the through-substrate It uses the metal mold | die which contacts with.
  As described above, according to the present invention, in the state after the mounting process, the connector housing is formed in a direction (hereinafter simply referred to as the vertical direction) substantially perpendicular to the thickness direction of the through-hole substrate (hereinafter simply referred to as the thickness direction). A through-substrate having a through hole at a predetermined position is prepared so that the through-substrate surrounds and surrounds the adjacent substrate. Then, the connector is fixed to the through board in a state inserted into the through hole, and the connector part exposed to the element mounting surface side of the through board through the through hole, that is, the housing part and terminal exposed to the element mounting surface side The exposed portion on the circuit side of the substrate is sealed by covering the element mounting surface side of the through substrate with a sealing resin together with the circuit including the element. Therefore, in the molding process, the exposed portion on the element mounting surface side of the connector does not contact the mold.
  Moreover, while preparing the above penetration board, it has a recessed part corresponding to the protrusion part of the connector to the back side as a metal mold | die on the back side of a penetration board, and opposes the opening surrounding part of the recessed part in the back surface of a penetration board. The molding process is performed using a mold that comes into contact with the part. Therefore, the through substrate serves as a stopper, and strong contact between the mold and the protruding portion of the connector is suppressed. Thereby, damage to a housing can be suppressed and a fitting with the other party connector can be secured. Moreover, it can suppress that the reliability of the connection part of a terminal and a circuit falls by the stress which a housing receives from a metal mold | die.
  Further, as described above, since the mold that contacts the portion surrounding the opening surrounding portion of the recess on the back surface of the through-substrate is used as the mold on the back surface side of the through-substrate, the sealing resin adheres to the protruding portion of the connector. Can be suppressed. In addition, since at least a part of the portion of the connector facing the outer surface of the housing and the through-hole substrate is bonded and fixed in an annular shape so as to surround the through-hole, the through-hole is sealed from the element mounting surface side to the back surface side. It is possible to prevent the sealing resin from leaking and the sealing resin from adhering to the protruding portion of the connector (the fitting portion with the mating connector). Also by these, a fitting with the other party connector is securable.
  In addition, as described in claim 2, in the molding step, as a mold on the back surface side of the through substrate, a mold that contacts the back surface of the through substrate and exposes the entire back surface of the through substrate from the sealing resin is used. Also good. According to this, the mold structure can be simplified.
  According to a third aspect of the present invention, in the molding step, a mold having a concave portion that separates from the protruding portion of the connector may be used as the mold on the back surface side of the through-hole substrate even during pressurization. According to this, since the connector and the mold do not come into contact with each other, the fitting with the mating connector can be surely ensured, and the reliability of the connecting portion between the terminal and the circuit can be suppressed.
  According to a fourth aspect of the present invention, the connector housing includes an insertion portion that is inserted into the through hole, and a hook portion that is coupled to one end of the insertion portion and that is engaged with the periphery of the through hole on the element mounting surface of the through substrate. In the mounting process, the connector can be inserted into the through-hole from the element mounting surface side of the through-board with the insertion portion as the head so that the flange is locked around the through-hole in the element mounting surface of the through-board. preferable.
  According to this, when the element mounting surface side of the through-hole substrate is covered with the sealing resin in the molding process in order to lock the flange portion of the housing on the element mounting surface of the through-hole substrate, a pressurized sealing resin is used. However, even if the connector is pushed from the element mounting surface side to the back surface side, it is possible to secure the fixed state of the connector with respect to the connector and the through-hole substrate. Therefore, the rattling of the connector at the time of molding can be suppressed, the fitting with the mating connector can be ensured, and the deterioration of the reliability of the connection portion between the terminal and the circuit can be suppressed.
  According to the fifth aspect of the present invention, in the mounting step, at least a facing portion between the flange portion and the element mounting surface of the through substrate may be bonded and fixed so as to surround the through hole. When the pressurized sealing resin pushes the connector from the element mounting surface side to the back surface side, a compressive force acts on the bonded portion. On the other hand, a shearing force acts on the bonding portion at the opposite portion between the insertion portion and the through hole wall surface of the through substrate. Therefore, when the facing portion between the flange portion and the element mounting surface of the through-hole substrate is bonded and fixed in a ring shape, the rattling of the connector at the time of molding can be more effectively suppressed.
  According to a sixth aspect of the present invention, the substrate may include only one circuit substrate having wirings constituting a circuit and having an element mounted on only one surface, and the circuit substrate may be used as a through substrate. According to this, the configuration of the electronic control device can be simplified. In addition, the size of the electronic control device can be reduced in the thickness direction.
  According to a seventh aspect of the present invention, the substrate includes a circuit board having wiring constituting a circuit and having an element mounted thereon, and a metal plate having a heating element as an element mounted only on one surface. In the preparation process, only the metal plate may be used as a through-hole substrate, and in the molding process, the entire circuit board may be covered with a sealing resin. According to this, since a plurality of substrates are arranged in multiple layers in the thickness direction, the size of the electronic control device can be reduced in the vertical direction. Moreover, since the metal plate is used as the through substrate, the heat of the heating element can be efficiently radiated from the back surface side of the through substrate.
  9. A male type having two metal plates as a substrate, wherein a female connector is bonded and fixed to one metal plate, and a female type is paired to the other metal plate in the mounting process. After the connector is bonded and fixed, the structure may be formed such that the element mounting surfaces of the two metal plates face each other and the circuit board is disposed between the metal plates. According to this, the heat of a heat generating element can be efficiently radiated from two metal plates. Further, since the connectors are provided at both ends in the thickness direction, the physique of the electronic control device can be downsized in the vertical direction, compared to providing all the connectors only at one end side.
  In addition, as described in claim 9, after the molding step, a female type connector and a male type connector are connected, and a plurality of molded structures are stacked to form a multilayer structure. Also good. According to this, an electronic control device with a large circuit scale can be formed by connecting the female connector and the male connector.
  As described in claim 10, in the molding process, a plurality of structures are arranged in a pair of molds, and are collectively sealed with a sealing resin to form a single assembly. You may provide the isolation | separation process cut | disconnected by the magnitude | size containing a number of structures. Thus, an electronic control device of any size can be obtained by forming one aggregate using a so-called MAP (Mold Array Package) method and separating the aggregate into a size including an arbitrary number of structures. Can do.
  Next, according to the eleventh aspect of the present invention, there is provided an exposed portion and a terminal on the circuit side in a terminal including a connection portion between a substrate on which an element constituting the circuit is mounted, a connector in which the terminal is held in the housing, and the circuit. And an encapsulating resin part that covers a circuit including a connecting part, and an element is mounted only on one surface as a substrate and has a through hole at a part different from the element mounting part The connector includes a through board, and the connector has a projecting part that is inserted into the through hole and projects to the back surface side of the through board, including a mating part with the mating connector, and adjacent to the housing in the vertical direction. The through-board is located on the outer surface of the housing and at least a part of the facing portion of the through-board is annularly bonded and fixed so as to surround the through-hole, and the sealing resin portion of the connector exposed from the through-hole The portion including the position and the circuit and covering the element mounting surface of the through-hole substrate, and the portion including the protruding portion of the connector and the peripheral portion adjacent to the protruding portion of the connector on the back surface of the through-hole substrate are exposed from the sealing resin portion. It is characterized by.
  The electronic control device according to the present invention is obtained by using the invention described in claim 1, and its operation and effect are the same as the operation and effect of the invention described in claim 1, and therefore the description thereof is omitted. To do.
  The inventions according to claims 12 to 17 are obtained by using the inventions according to claims 2 and 4 to 8, respectively, and the effects thereof are the inventions according to claims 2 and 4 to 8. Since this is the same as the operational effect, description thereof is omitted.
  The terminal may have a terminal having one end connected to a circuit on the circuit board side and the other end connected to a circuit on the metal plate side. According to this, the circuit board circuit and the metal plate circuit can be electrically connected to form a single circuit.
  As claimed in claim 19, as a terminal, it has a first terminal connected only to a circuit on the metal plate side and a second terminal connected only to a circuit on the circuit board side, the second terminal is more It is good also as a structure with a larger cross-sectional area than a 1st terminal. Generally, the cross-sectional area of a terminal (power system terminal) connected to a circuit on the metal plate side including a heating element is larger than the cross-sectional area of other terminals (signal system terminals). Thus, the multilayer structure in which the circuit board is supported on the metal plate via the terminals can be further stabilized.
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
(First embodiment)
FIG. 1 is a cross-sectional view showing a schematic configuration of the electronic control device according to the first embodiment of the present invention. FIG. 2 is a plan view showing a schematic configuration of the through-hole substrate.
  As shown in FIG. 1, the electronic control device 100 includes a substrate 10 including at least the through-hole substrate 11, a connector 30 fixed to the through-hole substrate 11, and a sealing resin portion 50. The electronic control device 100 according to the present embodiment is suitable as a vehicle-mounted electronic control device such as an automatic transmission.
  A substrate 10 is a substrate on which an element 12 constituting a circuit is mounted. In the present embodiment, as shown in FIG. 1, the element 12 constituting a circuit has one surface 11a (hereinafter simply referred to as a surface 11a). Only the through substrate 11 having the through hole 14 at a site different from the device mounting site (circuit forming site). This through-hole 14 is in a state in which the connection part with the circuit in the terminal 31 of the connector 30 is exposed on the front surface 11a side of the through-hole board 11 and the fitting part with the counterpart connector is exposed on the back surface 11b side of the through-hole board 11. The connector 30 is fixed to the penetrating substrate 11 so that the penetrating substrate 11 is positioned adjacent to and around the housing 32 of the connector 30. The through hole 14 is formed in a direction (hereinafter simply referred to as the vertical direction) substantially perpendicular to the thickness direction of the through substrate 11 (hereinafter simply referred to as the thickness direction) in a state where the connector 30 is bonded and fixed to the through substrate 11. 2), the sealing resin adheres to the protruding portion of the connector 30 on the back surface 11b side in a molding process to be described later, so that the through-hole substrate 11 surrounds and surrounds the housing 32 of the connector 30. In order to suppress this, it is formed at a predetermined position of the through-hole substrate 11 so that the mold presses the peripheral portion of the housing 32 on the back surface 11b of the through-hole substrate 11.
  As such a through substrate 11, a so-called circuit board in which the element 12 is mounted only on one surface 11a (hereinafter, referred to as the surface 11a) can be employed. That is, an element 12 such as a microcomputer, an IC, a resistor, a capacitor, or a switching element is mounted only on one surface of a base material such as ceramic, resin, or a metal having an insulating layer disposed on a circuit configuration surface. It is possible to employ one provided with the wiring 13 constituting the above. Specifically, as shown in FIG. 1, a heating element 12a, a capacitor 12b, and a microcomputer 12c that generate heat when driving a power MOS, an IGBT, or the like are formed on a surface 11a of a substantially rectangular planar substrate 11 made of resin. And a wiring 13 that is electrically connected to the element 12 and constitutes a circuit is provided. And the through-hole 14 which penetrates to the back surface 11b is formed in the site | part different from the circuit formation site | part (the mounting site | part of the element 12, and the formation site of the wiring 13) in the surface 11a. The through hole 14 has a planar shape along the surface 11 a corresponding to the insertion portion 32 a of the housing 32 constituting the connector 30, as shown in FIG. 2, and the size thereof is the insertion portion 32 a. Is slightly larger than the insertion portion 32a. Then, as shown in FIG. 2, such through holes 14 are formed in the vicinity of opposite ends of the through-hole substrate 11 having a substantially rectangular plane. 1 indicates the end face of the through-hole substrate 11, the reference numeral 14a shown in FIGS. 1 and 2 indicates the hole wall surface of the through-hole substrate 11, and the reference numeral 15 shown in FIG. 1 indicates that the element 12 and the wiring 13 are electrically connected. 1, reference numeral 16 shown in FIG. 1 denotes a wire for electrically connecting the terminal 31 of the connector 30 and the circuit (element 12 or wiring 13).
  The connector 30 is made of a conductive material such as metal, and has a plurality of terminals 31 having at least one end connected to the circuit, and a housing 32 made of an electrically insulating material such as resin and holding the terminals 31. Then, in a state of being inserted into the through hole 14, at least a part of the facing portion between the outer surface of the housing 32 and the through substrate 11 is annularly bonded so as to surround the through hole 14 and is fixed to the through substrate 11. Yes. Further, in a state of being bonded and fixed to the through-hole substrate 11, a part of the portion including the fitting portion with the counterpart connector protrudes toward the back surface 11 b side of the through-hole substrate 11. That is, the connector 30 has a protruding portion 30a including a fitting portion with the counterpart connector. Further, the shape of the connector 30 (housing 32) is set so that the penetrating substrate 11 is positioned adjacent to the housing 32 of the connector 30 in the vertical direction in a state where the connector 30 (housing 32) is bonded and fixed to the penetrating substrate 11. Yes.
  As the terminal 31, one end is exposed to the front surface 11 a side of the through-hole substrate 11 and connected to the circuit, and the other end is exposed to the back surface 11 b side of the through-hole substrate 11, and the first terminal connected to the mating connector is not limited. Thus, the connector 30 performs a function of electrically connecting the circuit in the electronic control device 100 and the outside. In addition to the first terminal described above, a third terminal may be included that has both ends exposed to the surface 11a side of the through-hole substrate 11 and is connected to the circuit, that is, performs the same function as the wiring 13 constituting the circuit.
  In the present embodiment, the terminal 31 includes only the first terminal. That is, as shown in FIG. 1, one end 31 a of the terminal 31 is exposed on the surface 11 a side of the through-hole substrate 11 and connected to the circuit (element 12 or wiring 13), and the other end 31 b is connected to the through-hole substrate 11. Is exposed to the back surface 11b side and can be mated with the mating connector. In addition, the housing 32 is connected to one end of the insertion portion 32a and a portion of the insertion portion 32a into which the housing 32 is inserted, and an annular flange portion 32b that is locked around the through-hole in the surface 11a of the penetration substrate 11. (In other words, the flange portion). The insertion portion 32a has an outer peripheral shape that substantially matches the planar shape of the through hole 14 along the surface 11a, and its size is slightly smaller than the through hole 14, and the flange portion 32b has an outer peripheral end thereof. The through hole 14 substantially coincides with the planar shape and is larger than the through hole 14. The connector 30 is connected to the through-hole substrate 11 so as to surround the through-hole 14 at the opposite portion between the flange portion 32b and the surface 11b of the through-hole substrate 11 and the opposite portion between the insertion portion 32a and the hole wall surface 14a. (Housing 32) is bonded and fixed in an annular shape. In addition, the code | symbol 30b shown in FIG. 1 has shown the exposed part exposed to the surface 11a side of the penetration board | substrate 11 in the connector 30. FIG.
  The sealing resin portion 50 is a surface of the through-hole substrate 11 so as to seal the exposed portion on the circuit side of the terminal 31 including the connection portion (end portion 31a) with the circuit and the circuit including the connection portion with the terminal 31. This is a resin molded part made of a thermosetting resin that covers the surface 11a of the through-hole substrate 11 including the exposed portion 30b of the connector 30 and the circuit exposed to the 11a side. In addition, at least the protruding portion 30 a of the connector and the peripheral portion adjacent to the protruding portion 30 a on the back surface 11 b of the through-hole substrate 1 are exposed from the sealing resin portion 50. In the present embodiment, as shown in FIG. 1, the entire surface 11 a and the entire end surface 11 c of the through substrate 11 are covered with the sealing resin portion 50 made of epoxy resin, and include the protruding portion 30 a of the connector 30. The entire back surface 11b of the sealing resin portion 50 is exposed.
  Next, an example of a manufacturing method of the electronic control device 100 configured as described above will be described. FIG. 3 is a cross-sectional view illustrating a process for preparing a through-hole substrate in the manufacturing process of the electronic control device. FIG. 4 is a cross-sectional view showing a mounting process in the manufacturing process of the electronic control device. FIG. 5 is a cross-sectional view illustrating a molding process in the manufacturing process of the electronic control device.
  First, the preparatory process which prepares the penetration substrate 11 as the board | substrate 10 is implemented. Since the through-hole substrate 11 according to this embodiment is a so-called circuit board as described above, it can be formed using a known technique. For example, the circuit board having the wiring 13 on the surface 11a and the element 12 mounted on the surface 11a and electrically connected to the wiring 13 by reflow soldering or wire bonding is placed at a predetermined position by laser processing or the like. By forming the through hole 14, the through substrate 11 shown in FIG. 3 can be obtained. At this time, the formation position of the through hole 14 is different from the circuit formation portion composed of the element 12 and the wiring 13, and the through substrate 11 is adjacent to the housing 32 in the vertical direction adjacent to the housing 32 in a state where the connector 30 is fixed. Any position that surrounds it is acceptable. The formation timing of the through hole 14 is not limited to the above example. For example, the through hole 14 may be formed before the element 12 is mounted.
  Next, a mounting step is performed in which the connector 30 is bonded and fixed to the through-hole substrate 11 and the terminals 31 and the circuit are electrically connected. Specifically, the connector 30 is connected to the through hole 14 so that the connection portion with the circuit is exposed on the front surface 11a side of the through substrate 11 and the fitting portion with the counterpart connector protrudes on the back surface 11b side of the through substrate 11. In this state, at least a part of the facing portion between the outer surface of the housing 32 and the through substrate 11 is annularly bonded and fixed so as to surround the through hole 14. Then, an exposed portion (end portion 31a) on the circuit side of the terminal 31 exposed through the through hole 14 and the circuit (element 12 or wiring 13) are electrically connected by wire bonding or the like (for example, using ultrasonic waves). Connection), and the penetration substrate 11 and the connector 30 are mechanically and electrically connected to one structure 17.
  In the present embodiment, since the housing 32 of the connector 30 has the insertion portion 32a and the flange portion 32b, the connector 30 is inserted into the insertion portion so that the flange portion 32b is locked around the through hole in the surface 11a of the through-substrate 11. 32a is inserted into the through-hole 14 from the surface 11a side of the through-hole substrate 11 starting from the front side. And the opposing part of the collar part 32b and the surface 11a of the penetration board | substrate 11 is adhere | attached and fixed cyclically | annularly so that the through-hole 14 may be surrounded, and the site | part arrange | positioned in the penetration hole 14 in the insertion part 32a, and the penetration board | substrate 11 of FIG. The portion facing the hole wall surface 14 a is bonded and fixed in an annular shape so as to surround the through hole 14. In this bonding and fixing, for example, the adhesive 30 is applied in advance to the surface of the flange portion 32b facing the surface 11a and the portion disposed in the through hole 14 in the insertion portion 32a, whereby the connector 30 is connected to the through substrate. 11 can be adhered and fixed.
  Then, after the obtained structure 17 is arranged in one of the pair of molds 71 and 72 (fixed mold) constituting the transfer molding machine or the compression molding machine, the pair of molds 71 and 72 are molded. A molding step is performed in which the surface 11a side of the through-hole wiring board 11 is covered with a sealing resin so as to seal the exposed portion 30b of the connector and the circuit. That is, the sealing resin part 50 is formed. In this molding process, the mold on the back surface 11b side of the through-hole substrate 11 has a recess corresponding to the protruding portion 30a of the connector 30 and comes into contact with the portion facing the opening peripheral portion of the recess on the back surface 11b of the through-hole substrate 11. Use a mold.
  In the present embodiment, the molding process is performed using a transfer molding method. Further, the substrate 10 has only one through-hole substrate 11, and the structure 17 is disposed so that the back surface 11 b of the through-hole substrate 11 faces the fixed lower mold 71. Here, the lower die 71 serves as a cavity forming surface that forms a cavity 73 with the upper die 72 that forms a pair, and a flat portion 71a that is in contact with the back surface 11b of the through-hole substrate 11, and the flat portion 71a. It has a recess 71b which is recessed and separated from the protruding portion 30a of the connector 30 with a predetermined clearance. Therefore, in a state where the structure 17 is disposed on the lower mold 71, a portion excluding a portion facing the recess 71 b on the back surface 11 b of the through-hole substrate 11, that is, almost the entire surface of the back surface 11 b is in contact with the flat portion 71 a of the lower mold 71. The protruding portion 30a of the connector 30 is separated from the lower mold 71. Further, the clearance between the protruding portion 30a of the connector 30 and the recess 71b is such that the protruding portion 30a of the connector 30 contacts the recess 71b (lower die 71) even when the upper mold 72 and the lower mold 71 are pressed after clamping. It is set not to. Furthermore, the cavity forming surface of the upper mold 72 is formed so that the sealing resin portion 50 integrally covers the entire surface 11a and end surface 11c of the through-hole substrate 11 so as to seal the exposed portion 30b of the connector 30 and the circuit. It has a so-called pan bottom shape and is separated from the structure 17. Then, as shown in FIG. 5, the movable upper mold 72 is moved, the upper mold 72 and the lower mold 71 are clamped, and the resin material is passed through a gate (not shown) under heating and pressurization. The sealing resin portion 50 is formed by pouring into the cavity 73 and thermosetting the resin material. Therefore, the exposed portion 30b of the connector 30 and the entire surface 11a of the through-hole substrate 11 including the circuit are covered with the sealing resin portion 50, and the protruding portion 30a of the connector 30 and the entire back surface 11b of the through-hole substrate 11 are covered with the sealing resin portion. 50 is exposed. Thus, the electronic control device 100 shown in FIG. 1 can be obtained.
  Next, effects of the characteristic portions of the electronic control device 100 and the manufacturing method thereof according to the present embodiment will be described. First, in the present embodiment, in the vertical direction, the through-hole board 11 having the through hole 14 for fixing the connector 30 at a predetermined position so that the through-hole board 11 surrounds and surrounds the housing 32 of the connector 30. prepare. Therefore, even if the upper mold 72 is not brought into contact with the portion of the housing 32 exposed on the surface 11a side (the flange portion 32b), the portion of the terminal 31 exposed on the surface 11a side (including the end portion 31a) and the circuit are sealed. It can be sealed with the resin part 50. In addition, a lower mold 71 having a concave portion 71b corresponding to the protruding portion 30a of the connector 30 and a flat portion 71a in contact with a portion facing the opening peripheral portion of the concave portion 71b on the back surface 11b of the through-hole substrate 11 is used. . Therefore, when the upper mold 72 and the lower mold 71 are clamped, the through-hole substrate 11 serves as a stopper, and strong contact between the lower mold 71 and the protruding portion 30 a of the connector 30 is suppressed. Thereby, damage to housing 32 can be controlled and fitting with connector 30 and the other party connector can be secured. Moreover, it can suppress that the reliability of the connection part of the terminal 31 (end part 31a) and a circuit falls by the stress which the housing 32 receives from the lower mold | type 71. FIG.
  Further, in the present embodiment, the lower mold 71 is a flat surface that surrounds the portion surrounding the opening portion of the recess 71 b on the back surface 11 b of the through-hole substrate 11 and the protruding portion 30 a of the connector 30 as a cavity forming surface. It has a portion 71a. Therefore, since the protruding portion 30a of the connector 30 is surrounded by the contact portion between the back surface 11b of the through-hole substrate 11 and the flat portion 71a of the lower mold 71, it is possible to suppress the resin material from adhering to the protruding portion 30a of the connector 30. Can do. Furthermore, at least a part of the facing portion of the connector 30 between the housing 32 and the through substrate 11 is bonded and fixed in an annular shape so as to surround the through hole 14. Therefore, in the molding process, it is possible to prevent the resin material from leaking through the through hole 14 from the front surface 11 a side to the back surface 11 b side of the through substrate 11 and adhere to the protruding portion 30 a of the connector 30. Also by these, fitting with the connector 30 and the other party connector is securable.
  As described above, according to the present embodiment, it is possible to secure the fitting with the mating connector and suppress the deterioration of the reliability of the connecting portion between the terminal 31 and the circuit. In particular, in the present embodiment, even when the portion corresponding to the concave portion 71b of the through-hole substrate 11 that is not supported by the lower mold 71 is bent at the time of pressurizing the resin material into the cavity 73, the concave portion 71b and the protruding portion are formed. Since the protruding portion 30a of the connector 30 and the lower mold 71 do not come into contact with each other due to the clearance of 30a, the fitting with the mating connector can be reliably ensured and the reliability of the connection portion between the terminal and the circuit can be suppressed. . Further, in the present embodiment, in order to expose the entire back surface 11b of the through-hole substrate 11 from the sealing resin portion 50, the lower mold 71 is configured to have only a flat portion 71a and a concave portion 71b as a cavity forming surface. it can. That is, the mold structure can be simplified.
  Further, in the present embodiment, the housing 32 of the connector 30 has the insertion portion 32a and the flange portion 32b, and the connector 30 is inserted into the through-hole 14 from the surface 11a side of the through-substrate 11 with the insertion portion 32a as the head. The connector 30 is bonded and fixed to the penetrating substrate 11 in a state where 32b is locked to the surface 11a. Accordingly, in the molding process, even if the pressurized resin material pushes the connector 30 from the front surface 11a side to the back surface 11b side, the flange portion 32b of the housing 32 functions as an anchor. While having a clearance with the recess 71b), the connector 30 can be prevented from being displaced and the connector 30 can be secured to the penetrating substrate 11. That is, rattling of the connector 30 at the time of molding can be suppressed, the fitting with the mating connector can be secured, and a decrease in reliability of the connection portion between the terminal 31 and the circuit can be suppressed.
  In particular, in the present embodiment, in the configuration employing the housing 32 having the insertion portion 32a and the flange portion 32b, the facing portion between the flange portion 32b and the surface 11a of the through-hole substrate 11 is bonded and fixed in an annular shape so as to surround the through hole 14. is doing. Here, when the pressurized resin material pushes the connector 30 from the front surface 11 a side to the back surface 11 b side, a compressive force acts on the bonding portion between the flange portion 32 b and the through-hole substrate 11. On the other hand, a shearing force acts on the bonding portion between the insertion portion 32 a and the hole wall surface 14 a of the through-hole substrate 11. Therefore, in this embodiment, rattling of the connector 30 during molding can be more effectively suppressed.
  In the present embodiment, a circuit board is employed as the through-hole substrate 11 so that the substrate 10 has only one through-hole board 11. Therefore, the configuration of the electronic control device 100 can be simplified. In addition, the size of the electronic control device 100 can be reduced in the thickness direction.
  In the present embodiment, an example in which the concave portion 71b of the lower mold 71 has a predetermined clearance between the protruding portion 30a of the connector 30 is shown. However, the lower mold 71 (the wall surface of the recess 71b) may be in contact with the protruding portion 30a of the connector 30. Even in such a configuration, since the flat portion 71a of the lower mold 71 is in contact with the back surface 11b of the through-hole substrate 11, the lower mold 71 and the lower mold 71 are compared with the configuration in which only the connector 30 is in contact with the lower mold 71 (molds 71, 72). Strong contact with the protruding portion 30a of the connector 30 can be suppressed. However, in the contact state, the connector 30 receives an external force from the lower mold 71. Therefore, for example, as shown in FIG. 6, a buffer member 74 is disposed between the lower mold 71 (the wall surface of the recess 71 b) and the protruding portion 30 a of the connector 30 to reduce the external force transmitted from the lower mold 71 to the connector 30. It is preferable to do so. FIG. 6 is a cross-sectional view showing a modification of the molding process.
  Further, in the present embodiment, an example has been shown in which the portion of the back surface 11b of the penetrating substrate 11 excluding the portion facing the recess 71b, that is, the substantially entire surface of the back surface 11b is in contact with the flat portion 71a of the lower mold 71. However, the lower mold 71 may be at least in contact with a portion of the back surface 11b of the through-hole substrate 11 that faces the opening peripheral portion of the recess 71b. That is, it is only necessary that at least the periphery of the protruding portion 30 a of the connector 30 and the protruding portion 30 a on the back surface 11 b of the through-hole substrate 11 is exposed from the sealing resin portion 50. According to this, adhesion of the resin material to the protrusion part 30a of the connector 30 can be suppressed. Further, strong contact between the lower mold 71 and the protruding portion 30a of the connector 30 can be suppressed.
  In addition, in the through substrate 11 in which the element 12 is mounted only on the surface 11a, an example in which the entire surface 11a and the entire end surface 11c are covered with the sealing resin portion 50 is shown. However, the end face 11c may be exposed. Moreover, since the exposed part 30b and the circuit (element 12 and wiring 13) of the connector 30 should just be coat | covered with the sealing resin part 50, a part (for example, edge part) of the surface 11a is from the sealing resin part 50. An exposed configuration may be used.
  Further, in the present embodiment, an example in which the electronic control device 100 is configured by covering one structure 17 with the sealing resin portion 50 has been described. However, in the present embodiment, as described above, in the vertical direction, the through board 11 is positioned adjacent to the housing 32 of the connector 30 and around the housing 32. In other words, the connector is located inside the end surface 11c of the through board 11. 30 is located. Therefore, a plurality of structural bodies 17 are arranged in a pair of molds 71 and 72, and are collectively sealed with a resin material to form a single aggregate 18, and after the molding process, the aggregate 18 is formed into an arbitrary number of structures. The electronic control device 100 having an arbitrary size may be obtained by separating the body 17 into a size including the body 17. For example, in the example shown in FIG. 7, the aggregate 18 has 16 structures 17, and the electronic control device 100 a having one structure 17, An electronic control device 100b having a structure 17 and an electronic control device 100c having six structures 17 are obtained. Thus, an electronic control device having an arbitrary size can be obtained by forming one aggregate 18 using a so-called MAP (Mold Array Package) method and separating the aggregate 18 into a size including an arbitrary number of structures 17. Can be obtained. FIG. 7 is a plan view showing a separation step in the manufacturing process of the electronic control device.
(Second Embodiment)
Next, 2nd Embodiment of this invention is described based on FIGS. FIG. 8 is a cross-sectional view illustrating a schematic configuration of the electronic control device according to the second embodiment. FIG. 9 is a plan view showing a schematic configuration of the through-hole substrate. In FIG. 9, for the sake of convenience, the sealing resin portion 50 is indicated by a broken line, and the removed portion of the through-hole substrate 11 is indicated by a two-dot chain line. FIG. 10 is a cross-sectional view illustrating a process for preparing a through-hole substrate in the manufacturing process of the electronic control device. FIG. 11 is a cross-sectional view illustrating a connector mounting process in the manufacturing process of the electronic control device. FIG. 12 is a cross-sectional view showing a circuit board mounting process in the manufacturing process of the electronic control device. FIG. 13 is a cross-sectional view illustrating a molding process in the manufacturing process of the electronic control device.
  Since the electronic control device according to the second embodiment is often in common with the electronic control device shown in the first embodiment, the detailed description of the common parts will be omitted below, and different parts will be described mainly. In addition, the same code | symbol shall be provided to the element same as the element shown in 1st Embodiment.
  In 1st Embodiment, the example which has only the penetration board | substrate 11 which provided the through-hole 14 in the circuit board as the board | substrate 10 was shown. On the other hand, the present embodiment is characterized in that the substrate 10 has a metal plate together with the circuit substrate, and the metal plate is adopted as the through substrate 11.
  As shown in FIG. 8, the electronic control device 100 includes a through substrate 11 on which the element 12 is mounted only on the surface 11 a and a circuit substrate 19 as the substrate 10. As the through substrate 11 according to the present embodiment, a substrate in which a heating element 12a as the element 12 is mounted on a surface 11a of a metal plate made of aluminum, copper, iron, or the like can be employed. The through-hole board 11 includes a plurality of element mounting portions 11d each having one heating element 12a mounted thereon, and a connector mounting portion 11e to which the connector 30 is fixed through the through-hole 14, and this embodiment Then, the four element mounting portions 11d are sandwiched between the two connector mounting portions 11e. The mounting portions 11d and 11e are insulated and mechanically separated from each other by an insulating separation portion 11f in which a resin material constituting the sealing resin portion 50 is filled in a groove penetrating the through substrate 11. Are combined. The heating element 12a is mounted on the element mounting portion 11d, the through hole 14 is provided in the connector mounting portion 11e, and the connector 30 is inserted into the through hole 14 via the adhesive 33. It is fixed. In addition, the area | region 11g enclosed with the dashed-two dotted line is the removal site | part removed after the molding process. That is, the through-hole substrate 11 according to this embodiment is a so-called lead frame, and as shown in FIG. 9, a part of the element mounting part 11 d and a part of the connector mounting part 11 e are separated from the sealing resin part 50. Exposed.
  The circuit board 19 has substantially the same configuration as the circuit board as the through-hole board 11 shown in the first embodiment. A different point is that the through hole 14 is not provided and the connector 30 is not mounted, and the mounting surface of the element 12 is the front surface 19a of the circuit board 19 (the back surface opposite to the front surface 11a of the through substrate 11). The circuit board 19 is entirely covered with the sealing resin portion 50, and the terminal 31 has a through hole 20 through which the terminal 31 is inserted. In the present embodiment, as shown in FIG. 8, the element 12 is mounted on the front surface 19a and the back surface 19b of the circuit board 19 and the wiring 13 is provided, whereby a circuit is configured. In addition, the code | symbol 12d shown in FIG. 8 is a thick film resistance. Further, in the vicinity of the end face of the circuit board 19, a through hole 20 penetrating from the front surface 19 a to the back surface 19 b is provided corresponding to the terminal 31.
  In the present embodiment, the connector 30 fixed to the through-hole substrate 11 has a second terminal as a terminal 31 together with the first terminal and the third terminal described above. Specifically, as the terminal (terminal 31 shown in FIG. 8) whose one end 31b is connected to the counterpart connector, the other end 31a is electrically connected to the heating element 12a via the wire 16 and the other end 31a. Has a second terminal electrically connected to the circuit of the circuit board 19. Further, as a third terminal (not shown) whose both ends are exposed to the surface 11a side of the through-hole substrate 11 and connected to the circuit, one end is connected to the heating element 12a and the other end is configured on the circuit board 19 ( It has a terminal electrically connected to the element 12 or the wiring 13). More specifically, one end side of the second terminal and the third terminal is exposed from the housing 32 of the connector 30 to the surface 11 a side of the through-hole substrate 11, and is positioned above the through-hole substrate 11 and away from the through-hole substrate 11. It extends to the circuit board 19, penetrates the through hole 20 of the circuit board 19, and is exposed to the surface 19 a side of the circuit board 19. And it is joined via the solder 21 with the land of the edge part of the wiring 13 which comprises a circuit. In the case where the heating element 12a is electrically connected to the element mounting portion 11d of the through-hole substrate 11, one end 31a of the terminal 31 may be electrically connected to the element mounting portion 11d.
  As shown in FIG. 8, the circuit board 19 is supported on the through-hole substrate 11 by a plurality of terminals 31 connected to the circuit of the circuit board 19. Then, a part of the surface 11a and a part of the end face 11c of the through-hole substrate 11 including the exposed portion 30b of the connector 30 and the heating element 12a and the entire circuit board 19, that is, the entire circuit configured on the circuit board 19, are sealed. It is collectively covered with the stop resin portion 50.
  Next, a method for manufacturing such an electronic control device 100 will be described. As in the first embodiment, first, a preparation process for preparing the through-hole substrate 11 is performed. Since the through-hole substrate 11 according to the present embodiment is a so-called lead frame as described above, it can be formed using a known technique. For example, by pressing a base material made of metal, as shown in FIG. 10, a through-hole substrate 11 having a through hole 14 and an insulating separation groove 22 and having an element mounting portion 11d and a connector mounting portion 11e is obtained. be able to. At this time, the formation position of the through hole 14 is different from the circuit formation portion formed of the heat generating element 12a, and is a position in which the through substrate 11 surrounds the periphery of the connector 32 in the vertical direction adjacent to the housing 32. If it is.
  Next, a mounting step is performed in which the connector 30 is bonded and fixed to the through-hole substrate 11 and the terminals 31 and the circuit are electrically connected. In this embodiment, since the circuit board 19 is included as the substrate 10, the connector mounting process and the circuit board mounting process are included as the mounting process. First, as shown in FIG. 11, a connector mounting process is performed. This process is substantially the same as the mounting process shown in the first embodiment. The difference is that only a part of the plurality of terminals 31 in the connector 30 is electrically connected to the circuit (the heating element 12a) configured in the through-hole substrate 11. In the present embodiment, as in the first embodiment, the connector 30 having the insertion portion 32a and the flange portion 32b is employed as the housing 32.
  After the connector is mounted, the circuit board 19 is mounted on the through-hole board 11 as shown in FIG. Specifically, the corresponding terminals 31 (second terminal and third terminal) are inserted through the through holes 20 of the circuit board 19 so that one end (the end 31a in FIG. 12) is exposed on the surface 19a side. The circuit board 19 is gripped and positioned by a robot arm or the like. Then, one end of the terminal 31 exposed on the surface 19a side of the circuit board 19 and the land of the wiring 13 provided around the opening of the through hole 20 are joined by, for example, laser soldering. As described above, the terminal 31 of the connector 30 and the through board 11 and the circuit board 19 are electrically connected to each other, and the through body 11, the circuit board 19, and the connector 30 are mechanically connected to one structure 23. Become.
  Next, after the obtained structure 23 is placed on one of 71 (fixed mold) of a pair of molds 71 and 72 constituting, for example, a transfer molding machine, the pair of molds 71 and 72 are clamped and added. A molding process is performed in which the surface 11a side of the through-hole substrate 11 is covered with a resin material so as to seal the exposed portion 30b of the connector and the circuit (the heating element 12a and the element 12 and the wiring 13 of the circuit board 19). That is, the sealing resin part 50 is formed. This molding process is substantially the same as the molding process shown in the first embodiment. The difference is that the entire circuit board 19 is covered with a resin material, and the end portions (element mounting portion 11d and a part of the connector mounting portion 11e and the removal portion 11g) of the through-hole substrate 11 as a lead frame are formed as dies 71 and 72. It is the point which stabilizes the structure 23 on both sides. By this molding process, a part of the surface 11a and the end surface 11c of the through-hole substrate 11 and the entire circuit board 19 are integrally covered with the sealing resin portion 50, and the exposed portion 30b of the connector 30 and the circuit are sealed with the sealing resin portion 50. Is sealed. In addition, the flat portion 11a of the lower mold 71 serves as a stopper, and the groove portion 22 is also filled with a resin material to form the insulating separation portion 11f.
  And each element mounting part 11d and the connector mounting part 11e are electrically isolate | separated by implementing the isolation | separation process which removes the removal site | part 11g exposed from the sealing resin part 50 among the penetration substrates 11. FIG. Thus, the electronic control device 100 shown in FIG. 8 can be obtained.
  As described above, also in the electronic control device 100 and the manufacturing method thereof according to the present embodiment, the same effects as those of the electronic control device 100 and the manufacturing method thereof shown in the first embodiment can be expected.
  Moreover, in this embodiment, since the several board | substrate 10 (11, 19) is multilayer-arranged in the thickness direction, the physique of the electronic control apparatus 100 can be reduced in a perpendicular direction. Moreover, since the metal plate is used as the through substrate 11, the heat of the heat generating element 12 a can be efficiently radiated from the back surface 11 b side of the through substrate 11. In particular, in the present embodiment, as shown in FIG. 8, the entire back surface 11b of the through-hole substrate 11 is exposed from the sealing resin portion 50 as in the first embodiment, so that the heat dissipation can be improved. .
  In the present embodiment, the terminal 31 includes a third terminal having one end connected to a circuit on the circuit board 19 side and the other end connected to a circuit (heating element 12a) on the through-substrate 11 side. The circuit of 19 and the circuit of the through-hole substrate 11 can be electrically connected to form a single circuit.
  In the present embodiment, as the terminal 31, the cross-sectional area relationship between the first terminal connected only to the circuit on the through-substrate 11 side and the second terminal connected only to the circuit on the circuit board side is particularly referred to. There wasn't. However, in general, the first terminal (power system terminal) connected to the heat generating element 12a is larger than the cross-sectional area of the other terminals (signal system terminals). On the other hand, for example, as shown in FIG. 14, the second terminal 31d may have a larger cross-sectional area than the first terminal 31c. With such a configuration, the structure 23 in which the circuit board 19 is supported on the through-hole substrate 11 via the second terminal 31d can be further stabilized. In the present embodiment, since the third terminal is included as the terminal 31, the third terminal may be larger than the first terminal 31c in cross-sectional area together with the second terminal 31d. FIG. 14 is a cross-sectional view showing a modification of the terminal. In FIG. 14, the sealing resin portion 50 is omitted for convenience.
  In the present embodiment, an example in which a part of the surface 11 a and the end surface 11 c of the through-hole substrate 11 is exposed from the sealing resin portion 50 has been described. However, as in the first embodiment, the entire surface 11 a and the entire end surface 11 c may be covered with the sealing resin portion 50.
  Moreover, in this embodiment, the example which applies the structure 23 to the structure (refer FIG. 1, FIG. 3-5) shown in 1st Embodiment was shown. However, the structure 23 may be applied to the modification (FIGS. 6 and 7) shown in the first embodiment.
(Third embodiment)
Next, a third embodiment of the present invention will be described with reference to FIGS. FIG. 15 is a cross-sectional view illustrating a schematic configuration of the electronic control device according to the third embodiment. FIG. 16 is a cross-sectional view illustrating a molding process in the manufacturing process of the electronic control device.
  Since the electronic control device according to the third embodiment is often in common with the electronic control device shown in the second embodiment, a detailed description of the common portions will be omitted, and different portions will be described mainly. In addition, the same code | symbol shall be provided to the element same as the element shown to said each embodiment.
  In the second embodiment, the electronic control device 100 includes one through-hole substrate 11 and one circuit board 19 as the substrate 10, and the structure 23 has a two-layer structure (two-story structure) of the through-substrate 11 and the circuit substrate 19. Example) is shown. On the other hand, in this embodiment, as shown in FIG. 15, the substrate 10 has two through-hole boards 11 and one circuit board 19, and one through-hole board 11 has a male type as in the above embodiments. The other connector 30c is bonded and fixed, and a female connector 30d that is paired with the male type is bonded and fixed to the other through-hole substrate 11. The two through-substrates 11 have a surface 11a opposed to each other, and a circuit board 19 is disposed between the through-substrates 11. That is, the structure 23 is characterized by a three-layer structure (three-story structure). The through-holes 11 have the entire surface 11a and the end surface 11c covered with the sealing resin portion 50 including the exposed portion 30b of the connector 30 and the heating element 12a, respectively, and the entire back surface 11b including the protruding portion 30a of the connector 30. It is exposed from the sealing resin portion 50. The entire circuit board 19 is covered with the sealing resin portion 50.
  Reference numeral 11h shown in FIG. 15 is a laser light irradiation groove for laser soldering the end 31a of the terminal 31 in the connector 30d and the land of the wiring 13 provided on the back surface 19b of the circuit board 19. In addition, the groove 11h is filled with a resin material like the insulating separation portion 11f. As shown in this embodiment, the laser light irradiation groove 11h may be provided as a through hole in the connector mounting portion 11e, or the connector mounting portion 11e and the through-hole substrate 11 adjacent to the mounting portion 11e. It may be provided so as to insulate and separate the end region.
  As described above, when the electronic control device 100 having a three-story structure in which the circuit board 19 is disposed between the two through-substrates 11 in the thickness direction is employed, the heat of the heating element 12a is generated from the two through-substrates 11. Can be efficiently dissipated. Further, since the connectors 30 (30c, 30d) are provided on both the upper and lower sides in the thickness direction, the physique of the electronic control device 100 can be reduced in the vertical direction as compared to the case where all the connectors 30 are provided only on one side.
  In addition, since the male connector 30c is provided on one side in the thickness direction and the female connector 30d is provided on the other side, a plurality of electronic controls are provided by connecting the male connector 30c and the female connector 30d. The device 100 can be connected to form an electronic control device with a large circuit scale.
  The electronic control device 100 having such a configuration can be formed as follows, for example. First, similarly to the second embodiment described above, the through substrate 11 is prepared. At this time, in the present embodiment, as the through substrate 11 on the side where the terminal 31 of the connector 30 is first connected to the circuit of the circuit substrate 19, the one having the laser light irradiation groove 11 h is employed. The laser beam irradiation groove 11h can be formed together with the groove 22 constituting the insulating separation portion 11f by, for example, pressing. The laser light irradiation groove 11h is formed at the end 31a of the terminal 31 when the laser soldering is performed between the terminal 31 of the connector 30 fixed to the other through-hole substrate 11 and the circuit of the circuit board 19. Any position may be used as long as it irradiates the solder joint between the wiring 13 and the land of the wiring 13. In the present embodiment, in the through substrate 11 on the side to which the male connector 30c is bonded and fixed, a laser beam irradiation groove 11h is formed outside the through holes 14 in the direction in which the two through holes 14 are arranged. ing.
  Next, a mounting process is performed. The male connector 30c as the connector 30 is bonded and fixed to the corresponding through board 11 and the terminal 31 of the connector 30c and the circuit of the circuit board 19 are electrically connected. The process up to obtaining the two-story structure 23 supported on the substrate 11 is the same as in the second embodiment. In the present embodiment, apart from the above steps, the female connector 30d is bonded and fixed to the corresponding through-hole substrate 11. And the terminal 31 of the connector 30d fixed to the penetration substrate 11 and the circuit of the circuit board 19 in the said structure 23 are electrically connected. Specifically, the circuit board 19 is held by a robot arm or the like so that the corresponding terminals 31 (second terminal and third terminal) are inserted through the through holes 20 of the circuit board 19 and one end is exposed to the back surface 19b side. Position. And the penetration board which has male connector 30c in the joined part by solder 21 of the end of terminal 31 exposed to the back 19b side of circuit board 19, and the land of wiring 13 provided around the opening of through hole 20 The laser beam is irradiated through the 11 laser beam irradiation groove 11h and soldered. As a result, the circuit board 19 is supported on the through board 11 by the terminals 31, and the through board 11 having the female connector 30d is supported on the circuit board 19 by the terminals 31. Become.
  Next, a molding process is performed. In the case of the present embodiment, since the structure 23 has the through-substrates 11 on both the upper and lower sides in the thickness direction, the upper mold 72 is in contact with the back surface 11b of the through-substrate 11 having the female connector 30d on the cavity forming surface. A flat portion 72a to be formed and a concave portion 72b that is recessed with respect to the flat portion 72a and separated from the protruding portion 30a of the connector 30d with a predetermined clearance are employed. In addition, these flat part 72a and the recessed part 72b comprise the bottom part of the pot bottom shape in the upper mold | type 72, and the site | part shown to the code | symbol 72c comprises the side wall part of a pot bottom shape. Therefore, in this molding step, the exposed portion 30b of the connector 30 and the entire circuit (the heating element 12a and the circuit board 19) are integrally covered with the sealing resin portion 50, as in the second embodiment. Further, the flat portion 71a of the lower mold 71 and the flat portion 72a of the upper mold 72 serve as stoppers, respectively, and the groove 22 and the laser light irradiation groove 11h are filled with the resin material.
  If there is a removed portion 11g exposed from the sealing resin portion 50 in the through-hole substrate 11, the removed portion 11g is removed to electrically separate each element mounting portion 11d and the connector mounting portion 11e. . Thus, the electronic control device 100 shown in FIG. 15 can be obtained.
  The preferred embodiments of the present invention have been described above. However, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present invention.
  In the present embodiment, an example is shown in which one through substrate 11 has two through holes 14 and two connectors 30 are bonded and fixed. However, the numbers of the through holes 14 and the connectors 30 are not limited to the above example.
  In this embodiment, the housing 32 of the connector 30 showed the example which has the insertion part 32a and the collar part 32b. However, the form of the housing 32 is not limited to the above example. For example, what is inserted and fixed from the back surface 11b side to the front surface 11a side in the through-hole substrate 11 may be employed. However, in order to suppress the rattling of the connector 30 due to the pressurized resin material when forming the sealing resin portion 50, it is preferable to adopt a configuration as shown in this embodiment.
It is sectional drawing which shows schematic structure of the electronic controller which concerns on 1st Embodiment. It is a top view which shows schematic structure of a penetration substrate. It is sectional drawing which shows the preparatory process of a penetration substrate among the manufacturing processes of an electronic control apparatus. It is sectional drawing which shows a mounting process among the manufacturing processes of an electronic control apparatus. It is sectional drawing which shows a mold process among the manufacturing processes of an electronic control apparatus. It is sectional drawing which shows the modification of a mold process. It is a top view which shows a isolation | separation process among the manufacturing processes of an electronic control apparatus. It is sectional drawing which shows schematic structure of the electronic controller which concerns on 2nd Embodiment. It is a top view which shows schematic structure of a penetration substrate. It is sectional drawing which shows the preparatory process of a penetration substrate among the manufacturing processes of an electronic control apparatus. It is sectional drawing which shows a connector mounting process among the manufacturing processes of an electronic control apparatus. It is sectional drawing which shows a circuit board mounting process among the manufacturing processes of an electronic control apparatus. It is sectional drawing which shows a mold process among the manufacturing processes of an electronic control apparatus. It is sectional drawing which shows the modification of a terminal. It is sectional drawing which shows schematic structure of the electronic controller which concerns on 3rd Embodiment. It is sectional drawing which shows a mold process among the manufacturing processes of an electronic control apparatus.
Explanation of symbols
DESCRIPTION OF SYMBOLS 10 ... Board | substrate 11 ... Through-substrate 12 ... Element 12a ... Heating element 14 ... Through-hole 19 ... Circuit board 30 ... Connector 30a ... Projection part 30b ... Exposure Part 31 ... Terminal 32 ... Housing 50 ... Sealing resin part 100 ... Electronic control unit

Claims (19)

  1. The circuit on which the element is mounted and the terminal of the connector held in the housing are electrically connected to the terminal of the connector held in the housing, and the exposed portion on the circuit side of the terminal including the connection portion with the circuit, and the terminal A method of manufacturing an electronic control device in which the circuit including the connecting portion is sealed with a sealing resin,
    As the substrate, the element is mounted only on one surface, and a preparation step of preparing a through substrate having a through hole in a portion different from the mounting portion of the device;
    The connector is inserted into the through-hole so that the mating site with the mating connector protrudes from the back surface side of the element mounting surface of the through-substrate, and at least a part of the opposed portion between the outer surface of the housing and the through-substrate Including the through-substrate, by electrically connecting the circuit-side exposed portion of the terminal exposed through the through-hole and the circuit. A mounting step in which the substrate and the connector are one structure;
    After placing the structure on one of a pair of molds constituting a transfer molding machine or a compression molding machine, the pair of molds are clamped and pressed, and the element forming surface side of the through-substrate is And a molding step for sealing the circuit, and an exposed portion of the terminal on the circuit side, which is covered with the sealing resin so as to include the portion of the connector exposed through the element and the through hole. ,
    In the preparatory step, in the state after the mounting step, in a direction substantially perpendicular to the thickness direction of the through-hole substrate, adjacent to the connector housing and surrounding the periphery of the through-hole substrate at a predetermined position. Preparing the through substrate having a through hole;
    In the molding step, as a mold on the back surface side of the element mounting surface in the through-substrate, there is a recess corresponding to the protruding portion of the connector, and a portion facing the opening peripheral portion of the recess on the back surface of the through-substrate A method of manufacturing an electronic control device, wherein a mold that contacts is used.
  2.   In the molding step, as a mold on the back surface side of the through substrate, a mold that contacts the back surface of the through substrate and exposes the entire back surface of the through substrate from the sealing resin is used. A method for manufacturing the electronic control device according to claim 1.
  3.   2. The mold step according to claim 1, wherein a metal mold having the concave portion that separates from the protruding portion of the connector even during the pressurization is used as the metal mold on the back surface side of the through substrate. Item 3. A method for manufacturing an electronic control device according to Item 2.
  4. The housing of the connector has an insertion portion that is inserted into the through-hole, and a flange portion that is connected to one end of the insertion portion and engages around the through-hole in the element mounting surface of the through-substrate,
    In the mounting step, the connector is moved from the element mounting surface side of the through-board to the through-hole with the insertion portion as a head so that the flange is locked around the through-hole in the element mounting surface of the through-board. The method for manufacturing an electronic control device according to claim 1, wherein the electronic control device is inserted.
  5.   5. The method of manufacturing an electronic control device according to claim 4, wherein, in the mounting step, at least a facing portion between the flange portion and the element mounting surface of the through substrate is bonded and fixed so as to surround the through hole. .
  6. As the substrate, it has wiring that constitutes the circuit, and has only one circuit substrate on which the element is mounted only on one surface,
    The method for manufacturing an electronic control device according to claim 1, wherein the circuit board is the through-hole substrate.
  7. The circuit board has wiring that constitutes the circuit, the circuit board on which the element is mounted, and a metal plate on which the heating element as the element is mounted only on one surface,
    In the preparation step, only the metal plate is used as the through substrate,
    The method for manufacturing an electronic control device according to claim 1, wherein in the molding step, the entire circuit board is covered with the sealing resin.
  8. As the substrate, the two metal plates,
    In the mounting step, the female connector is bonded and fixed to one of the metal plates, and the male connector that is paired with the female mold is bonded and fixed to the other metal plate, and then the two metal plates are fixed. 8. The method of manufacturing an electronic control device according to claim 7, wherein the structure is formed such that the element mounting surfaces face each other and the circuit board is disposed between the metal plates.
  9.   9. The stacking step of connecting the female connector and the male connector after the molding step to form a plurality of molded structures into one multilayer structure is provided. The manufacturing method of the electronic control apparatus as described in any one of.
  10. In the molding step, a plurality of the structures are arranged in a pair of molds, and are collectively sealed with the sealing resin to form one aggregate,
    The method for manufacturing an electronic control device according to any one of claims 1 to 9, further comprising a separation step of separating the aggregate in a size including an arbitrary number of the structures after the molding step.
  11. A substrate on which elements constituting the circuit are mounted;
    A connector with a terminal held in the housing;
    An electronic control device comprising: an exposed portion on the circuit side of the terminal including the connection portion with the circuit; and a sealing resin portion covering the circuit including the connection portion with the terminal,
    As the substrate, the element is mounted only on one surface, and includes a through substrate having a through hole in a portion different from the mounting portion of the element,
    The connector has a protruding portion including a fitting portion with a mating connector, which is inserted into the through hole and protrudes to the back surface side of the element mounting surface of the through substrate, and is approximately in the thickness direction of the through substrate. In the vertical direction, the through substrate is located adjacent to and around the housing, and at least a part of the opposing portion of the outer surface of the housing and the through substrate is annularly bonded so as to surround the through hole. Fixed,
    The sealing resin portion is disposed so as to cover the element mounting surface of the through substrate including the portion of the connector exposed from the through hole and the circuit, and on the protruding portion of the connector and the back surface of the through substrate. An electronic control unit characterized in that a part including a peripheral part adjacent to the protruding part of the connector is exposed from the sealing resin portion.
  12.   The electronic control device according to claim 11, wherein the entire back surface of the through-hole substrate is exposed from the sealing resin portion.
  13.   The connector housing has an insertion portion inserted into the through-hole, and a flange portion connected to one end of the insertion portion and locked around the through-hole in the element mounting surface of the through-substrate. The electronic control device according to claim 11 or 12.
  14.   The electronic control device according to claim 13, wherein a facing portion between the flange portion and the element mounting surface of the through-substrate is bonded and fixed so as to surround the through-hole.
  15. As the substrate, it has wiring that constitutes the circuit, and has only a circuit board on which the element is mounted only on one surface,
    The electronic control device according to claim 11, wherein the circuit board is the through-hole board.
  16. The circuit board has wiring that constitutes the circuit, the circuit board on which the element is mounted, and a metal plate on which the heating element as the element is mounted only on one surface,
    Only the metal plate is the through substrate,
    The electronic control device according to claim 11, wherein the entire circuit board is covered with the sealing resin portion.
  17. As the substrate, the two metal plates,
    The female connector is bonded and fixed to one of the metal plates, and the male connector that is paired with the female plate is bonded and fixed to the other metal plate,
    The electronic control device according to claim 16, wherein the two metal plates are opposed to each other on an element mounting surface, and the circuit board is disposed between the metal plates.
  18.   18. The electronic control device according to claim 16, wherein the terminal includes a terminal having one end connected to a circuit on the circuit board side and the other end connected to a circuit on the metal plate side.
  19.   The terminal has a first terminal connected only to the circuit on the metal plate side and a second terminal connected only to the circuit on the circuit board side, and the second terminal has a larger cross-sectional area than the first terminal. The electronic control device according to claim 16 or claim 17, characterized in that:
JP2008210115A 2008-08-18 2008-08-18 Electronic control device manufacturing method and electronic control device Expired - Fee Related JP5187065B2 (en)

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012039072A (en) * 2010-07-15 2012-02-23 Seiko Instruments Inc Electronic circuit board, electronic component package and method of manufacturing electronic circuit board
JP2014007345A (en) * 2012-06-26 2014-01-16 Denso Corp Integrated circuit
JP2014192447A (en) * 2013-03-28 2014-10-06 Denso Corp Electronic control unit and manufacturing method of the same
NL2011638C2 (en) * 2013-10-18 2015-04-23 Sencio B V Integrated circuit package.
JP2016115697A (en) * 2014-12-11 2016-06-23 株式会社デンソー Electronic device
WO2016203784A1 (en) * 2015-06-19 2016-12-22 アピックヤマダ株式会社 Molding die, resin molding device, and resin molding method

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JPH02298060A (en) * 1989-05-12 1990-12-10 Sanyo Electric Co Ltd Hybrid integrated circuit device
JP2004111435A (en) * 2002-09-13 2004-04-08 Hitachi Car Eng Co Ltd Electric/electronic module having integral molding structure of connector and electronic part and method for molding the same
WO2005004563A1 (en) * 2003-07-03 2005-01-13 Hitachi, Ltd. Module and method for fabricating the same
JP2006294974A (en) * 2005-04-13 2006-10-26 Denso Corp Electronic equipment and its manufacturing method
JP2007157958A (en) * 2005-12-05 2007-06-21 Denso Corp Electronic device

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Publication number Priority date Publication date Assignee Title
JPH02298060A (en) * 1989-05-12 1990-12-10 Sanyo Electric Co Ltd Hybrid integrated circuit device
JP2004111435A (en) * 2002-09-13 2004-04-08 Hitachi Car Eng Co Ltd Electric/electronic module having integral molding structure of connector and electronic part and method for molding the same
WO2005004563A1 (en) * 2003-07-03 2005-01-13 Hitachi, Ltd. Module and method for fabricating the same
JP2006294974A (en) * 2005-04-13 2006-10-26 Denso Corp Electronic equipment and its manufacturing method
JP2007157958A (en) * 2005-12-05 2007-06-21 Denso Corp Electronic device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012039072A (en) * 2010-07-15 2012-02-23 Seiko Instruments Inc Electronic circuit board, electronic component package and method of manufacturing electronic circuit board
JP2014007345A (en) * 2012-06-26 2014-01-16 Denso Corp Integrated circuit
JP2014192447A (en) * 2013-03-28 2014-10-06 Denso Corp Electronic control unit and manufacturing method of the same
NL2011638C2 (en) * 2013-10-18 2015-04-23 Sencio B V Integrated circuit package.
JP2016115697A (en) * 2014-12-11 2016-06-23 株式会社デンソー Electronic device
WO2016203784A1 (en) * 2015-06-19 2016-12-22 アピックヤマダ株式会社 Molding die, resin molding device, and resin molding method

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