JP3716726B2 - Electronic component case and manufacturing method thereof - Google Patents

Electronic component case and manufacturing method thereof Download PDF

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Publication number
JP3716726B2
JP3716726B2 JP2000265013A JP2000265013A JP3716726B2 JP 3716726 B2 JP3716726 B2 JP 3716726B2 JP 2000265013 A JP2000265013 A JP 2000265013A JP 2000265013 A JP2000265013 A JP 2000265013A JP 3716726 B2 JP3716726 B2 JP 3716726B2
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Japan
Prior art keywords
frame member
base plate
electronic component
terminal portion
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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JP2000265013A
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Japanese (ja)
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JP2002076159A (en
Inventor
良治 杉浦
正幸 桜井
健一 増田
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Hitachi AIC Inc
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Hitachi AIC Inc
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Filing date
Publication date
Application filed by Hitachi AIC Inc filed Critical Hitachi AIC Inc
Priority to JP2000265013A priority Critical patent/JP3716726B2/en
Priority to TW090120100A priority patent/TW521555B/en
Priority to US09/930,944 priority patent/US6777612B2/en
Priority to KR10-2001-0049730A priority patent/KR100462138B1/en
Priority to CNB011258101A priority patent/CN1237861C/en
Publication of JP2002076159A publication Critical patent/JP2002076159A/en
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Publication of JP3716726B2 publication Critical patent/JP3716726B2/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]

Description

【０００１】
【発明の属する技術分野】
本発明は、素子を気密封止するのに適した電子部品ケースおよびその製造方法に関する。
【０００２】
【従来の技術】
例えば、弾性表面波素子等を電子部品ケースに封止するには、この弾性表面波素子の特性を損ねないように、電子ケース内でケースを構成する部材等に接触しないようにして気密封止されているとともに、素子と電気的に接続された端子部が電子ケースの外側に導出されていなければならない。この種の電子部品ケースとしては、セラミックスケースを用いるものが広く知られている。すなわち、表面実装型の弾性表面波フィルタは、セラミックケース内に弾性表面波素子がチップマウントされ、ワイヤーボンディングを行った後に蓋を溶接し封止している。
【０００３】
【発明が解決しようとする課題】
しかしながら、上述した従来の電子部品ケースでは、セラミックケース自体が高価なうえ、相対的に小型化に適さないために、安価でかつ小型のデバイスを作成することが困難であった。
【０００４】
本発明は上記した従来の問題に鑑みなされたものであり、その目的とするところは、安価でかつ小型の電子部品ケースおよびその製造方法を提供することにある。
【０００５】
【課題を解決するための手段】
この目的を達成するために、請求項１に係る発明は、ベース板、枠部材およびカバーとによって素子を気密封止する空間を設けた電子部品ケースであって、前記ベース板、枠部材およびカバーを銅張積層板によって形成し、前記ベース板の上面に設けられ素子を実装する内部実装用端子部と、前記ベース板の下面に設けられた外部接続用端子部と、前記ベース板に設けられ前記内部実装用端子部と外部接続用端子部とを電気的に接続する貫通接続穴と、この貫通接続穴内に充填される充填材とを備え、この充填材の上下面を前記内部実装用端子部と外部接続用端子部とで覆い、前記ベース板の銅箔を剥離した部位と前記枠部材の銅箔を剥離した部位とを接着したものである。
したがって、内部実装用端子部と外部接続用端子部とを電気的に接続する貫通接続穴をベース板の側面から導出することがない。
【０００６】
また、請求項２に係る発明は、請求項１に係る発明において、前記ベース板、枠部材およびカバーを銅張積層板で形成し、枠部材の銅張積層板に素子を収容する収容孔を設け、これら銅張積層板の銅箔を剥離し、互いに剥離した部位を接着することにより、前記ベース板と枠部材の収容孔とカバーとによって素子を気密封止する空間を形成したものである。
したがって、互いに接着される銅張積層板の表面に接着しやすい粗面が形成できる。
【０００７】
【発明の実施の形態】
以下、本発明の実施の形態を図を用いて説明する。図１は本発明に係る電子部品ケースの製造方法のうち、前半の工程を説明するための断面図である。図２は本発明に係る電子部品ケースの製造方法のうち、中半の工程を説明するための断面図である。図３は本発明に係る電子部品ケースの製造方法のうち、後半の工程を説明するための断面図である。図４は同じく電子部品ケースの組立方法を説明するための分解斜視図である。
【０００８】
図１（ａ）において、全体を符号１で示すものはベース板としての両面銅張積層板であって、絶縁樹脂板２の両面に銅箔３，３が張り付けられている。同図（ｂ）に示すように、この両面銅張積層板１にドリルによって貫通穴４，４を穿孔した後に、同図（ｃ）に示すように、銅によるパネルめっきを行い銅めっき膜５を銅箔３上に形成するとともに、貫通穴４，４内の側壁にも銅めっき膜５を形成し、貫通接続穴６，６を形成する。
【０００９】
同図（ｄ）に示すように、エッチングによって貫通接続穴６の周囲に貫通接続穴６と電気的に接続される上面端子部７と下面端子部８とを形成する。このとき、上面端子部７と下面端子部８が形成された部位以外、すなわち、両面銅張積層板１の銅箔３が剥離された部位９の表面には粗面が形成される。次に、同図（ｅ）に示すように、貫通接続穴６内に絶縁樹脂材１０を充填し、穴埋めを行う。
【００１０】
図２（ａ）に示すように、絶縁樹脂材１０の上下の露呈部を覆い、かつ上面端子部７と下面端子部８と覆うように金属めっき膜を形成することにより、内部実装用端子部１２と外部接続用端子部１３が形成される。同図（ｂ）に示すように、内部実装用端子部１２上にバンプ１６を介して電子部品であるフリップチップ１５を内部実装用端子部１２上に実装する。ここで、貫通接続穴６がバンプ１６の実装位置に位置付けられている。したがって、フリップチップ１５の全長Ｌ１に対して、一対の貫通接続穴６，６間のピッチＬ２を小さく形成することができる。
【００１１】
図４において、１８は枠部材としての大判の両面銅張積層板であって、この両面銅張積層板の銅箔（図示せず）を剥離することにより、上下両面に粗面１８ａ，１８ｂが形成されている。また、この枠部材１８には、絶縁樹脂板２上に実装されたフリップチップ１５に対応して多数（図中においては便宜上４個）の長方形の収容孔１８ｃが設けられ、かつこの枠部材１８の厚みＴはフリップチップ１５の厚みｔよりも大きく形成されている。
【００１２】
図４において、２０はカバーとしての銅張積層板であって、下面の銅箔（図示せず）を剥離することにより、下面２０ａに粗面が形成されている。同図および図２（ｃ）に示すように、枠部材１８の収容孔１８ｃ内にフリップチップ１５を収容させるようにして、枠部材１８によって絶縁樹脂板２上を覆い、枠部材１８の下面１８ｂと絶縁樹脂板２の銅箔３が剥離された部位９とを対接させ、当該対接部を加熱し、かつ加圧することによって互いに接着する。
【００１３】
カバー２０によって枠部材１８上を覆い、下面２０ａを枠部材１８の上面１８ａとを対接させ、接着剤によって互いに接着する。図３（ａ）に示すように、絶縁樹脂板２と枠部材１８の収容孔１８ｃとカバー２０とによってフリップチップ１５を気密封止する空間２２を有する電子ケース２１が形成される。
【００１４】
このように、互いに対接する枠部材１８の下面１８ｂと絶縁樹脂板２の銅箔３が剥離された部位９および枠部材１８の上面１８ａとカバー２０の下面２０ａとに粗面が形成されていることにより、互いの接着力が向上するので、空間２２内の気密性が向上する。また、貫通接続穴６内を絶縁樹脂材１０によって充填したことによっても、空間２２内の気密性が向上する。
【００１５】
また、フリップチップ１５を封止する空間２２を形成するのに、安価な両面銅張積層板１と、枠部材１８およびカバー２０として安価な両面銅張積層板および銅張積層板とによって形成したので、安価に形成することができる。また、内部実装用端子部１２と外部接続用端子部１３との電気的な接続を貫通接続穴６によって行ったことにより、これら両端子部１２，１３を接続する導体を電子部品ケース２１の側方に設けなくてよいから幅方向の寸法Ｌ３を小さく形成することができる。従来のセラミックスケースの場合には小型化に限界があったが、因みに、本実施の形態で述べた方法によって製造した電子部品ケース２６は、幅、奥行き、高さが２．５×２×１．７（ｍｍ）の寸法に形成することができた。
【００１６】
次に、図３（ａ）に示すように、枠部材１８の中央に対応した一点鎖線で示した部位２３をライシング加工によって切断し、同図（ｂ）に示すように、電子部品ケース２１を１個のフリップチップ１５に対して１個の電子部品ケースに分割する。このように形成された電子部品ケース２１は、図示を省略したマザーボードのランド部に、外部接続用端子部１３が電気的に接続されることにより、マザーボード上に実装される。
【００１７】
フリップチップ１７をプリント配線板の上面端子部１２に電気的に接続するのに、バンプ１８を介して行ったが、ボンディングワイヤを介してもよく、種々の設計変更が可能である。また、貫通接続穴６をバンプ１６の実装位置に位置付けたが、バンプ１６の内側、外側にずらしてもよい。また、枠部材１８の収容孔１８ｃの形状は長方形に限らず種々の設計変更が可能である。また、枠部材１８、カバー２０にも導体層を形成し、この導体層とフリップチップ１５と電気的に接続してもよい。
【００１８】
【発明の効果】
以上説明したように、請求項１に係る発明によれば、内部実装用端子部と外部接続用端子部とを電気的に接続する貫通接続穴をベース板の側面から導出することがないので、小型化される。また、ベース板、枠部材およびカバーを絶縁樹脂材によって形成したことにより、安価に形成することができる。
【００１９】
さらに、空間へ収納した素子を枠部材やカバーで完全に密閉収納することにより、素子の耐防湿性、耐腐食性、密閉性を向上することができる。
【００２０】
また、請求項２に係る発明によれば、互いに接着される銅張積層板の表面に接着しやすい粗面が形成できるので、気密性が向上する。
【図面の簡単な説明】
【図１】 本発明に係る電子部品ケースの製造方法のうち、前半の工程を説明するための断面図である。
【図２】 本発明に係る電子部品ケースの製造方法のうち、中半の工程を説明するための断面図である。
【図３】 本発明に係る電子部品ケースの製造方法のうち、後半の工程を説明するための断面図である。
【図４】 本発明に係る電子部品ケースの組立方法を説明するための分解斜視図である。
【符号の説明】
１…両面銅張積層板、７…上面端子部、８…下面端子部、９…銅箔３が剥離された部位、１２…内部実装用端子部、１３…外部接続用端子部、１５…フリップチップ、１６…バンプ、１８…枠部材、１８ｃ…収容孔、２０…カバー、２１…電子部品ケース、２２…空間。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component case suitable for hermetically sealing an element and a method for manufacturing the same.
[0002]
[Prior art]
For example, in order to seal a surface acoustic wave element or the like in an electronic component case, it is hermetically sealed so as not to contact a member constituting the case in the electronic case so as not to impair the characteristics of the surface acoustic wave element. In addition, the terminal portion electrically connected to the element must be led out of the electronic case. As this type of electronic component case, one using a ceramic case is widely known. That is, in a surface-mount type surface acoustic wave filter, a surface acoustic wave element is chip-mounted in a ceramic case, and after wire bonding, a lid is welded and sealed.
[0003]
[Problems to be solved by the invention]
However, in the above-described conventional electronic component case, since the ceramic case itself is expensive and relatively unsuitable for downsizing, it is difficult to produce an inexpensive and small device.
[0004]
The present invention has been made in view of the above-described conventional problems, and an object thereof is to provide an inexpensive and small electronic component case and a method for manufacturing the same.
[0005]
[Means for Solving the Problems]
To achieve this object, the invention according to claim 1 is an electronic component case provided with a space for hermetically sealing an element by a base plate, a frame member and a cover, wherein the base plate, the frame member and the cover are provided. Formed by a copper clad laminate , provided on the upper surface of the base plate, and mounted on the base plate, an internal mounting terminal portion for mounting elements, an external connection terminal portion provided on the lower surface of the base plate, and the base plate A through-connection hole for electrically connecting the internal mounting terminal portion and the external connection terminal portion; and a filler filled in the through-connection hole, and the upper and lower surfaces of the filler are connected to the internal mounting terminal. And a portion where the copper foil of the base plate is peeled off and a portion where the copper foil of the frame member is peeled off .
Therefore, the through-connection hole that electrically connects the internal mounting terminal portion and the external connection terminal portion is not led out from the side surface of the base plate.
[0006]
The invention according to claim 2 is the invention according to claim 1, wherein the base plate, the frame member, and the cover are formed of a copper-clad laminate, and an accommodation hole that accommodates an element in the copper-clad laminate of the frame member is provided. A space for hermetically sealing the element is formed by the base plate, the housing hole of the frame member and the cover by peeling off the copper foils of these copper clad laminates and bonding the peeled portions to each other. .
Therefore, a rough surface that can be easily bonded can be formed on the surfaces of the copper clad laminates bonded to each other.
[0007]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a cross-sectional view for explaining the first half of the method for manufacturing an electronic component case according to the present invention. FIG. 2 is a cross-sectional view for explaining the middle half of the method for manufacturing an electronic component case according to the present invention. FIG. 3 is a cross-sectional view for explaining the latter half of the method for manufacturing an electronic component case according to the present invention. FIG. 4 is an exploded perspective view for explaining an assembly method of the electronic component case.
[0008]
In FIG. 1A, what is indicated by reference numeral 1 as a whole is a double-sided copper-clad laminate as a base plate, and copper foils 3 and 3 are attached to both sides of an insulating resin plate 2. As shown in FIG. 4B, after the through holes 4 and 4 are drilled in the double-sided copper clad laminate 1 with a drill, panel plating with copper is performed as shown in FIG. Is formed on the copper foil 3, and the copper plating film 5 is also formed on the side walls in the through holes 4, 4 to form the through connection holes 6, 6.
[0009]
As shown in FIG. 4D, the upper surface terminal portion 7 and the lower surface terminal portion 8 that are electrically connected to the through connection hole 6 are formed around the through connection hole 6 by etching. At this time, a rough surface is formed on the surface of the portion 9 where the copper foil 3 of the double-sided copper-clad laminate 1 is peeled off, other than the portion where the upper surface terminal portion 7 and the lower surface terminal portion 8 are formed. Next, as shown in FIG. 4E, the through-hole 6 is filled with an insulating resin material 10 to fill the hole.
[0010]
As shown in FIG. 2 (a), by forming a metal plating film so as to cover the upper and lower exposed portions of the insulating resin material 10 and the upper surface terminal portion 7 and the lower surface terminal portion 8, an internal mounting terminal portion is formed. 12 and an external connection terminal portion 13 are formed. As shown in FIG. 2B, the flip chip 15, which is an electronic component, is mounted on the internal mounting terminal portion 12 via the bump 16 on the internal mounting terminal portion 12. Here, the through-connection hole 6 is positioned at the mounting position of the bump 16. Therefore, the pitch L2 between the pair of through-connection holes 6 and 6 can be made smaller than the total length L1 of the flip chip 15.
[0011]
In FIG. 4, 18 is a large double-sided copper-clad laminate as a frame member. By peeling the copper foil (not shown) of this double-sided copper-clad laminate, rough surfaces 18a and 18b are formed on both upper and lower surfaces. Is formed. Further, the frame member 18 is provided with a large number (four in the drawing for convenience) of rectangular accommodating holes 18c corresponding to the flip chip 15 mounted on the insulating resin plate 2, and the frame member 18 The thickness T of the flip chip 15 is larger than the thickness t of the flip chip 15.
[0012]
In FIG. 4, 20 is a copper clad laminate as a cover, and a rough surface is formed on the lower surface 20a by peeling a copper foil (not shown) on the lower surface. As shown in FIG. 2 and FIG. 2C, the flip chip 15 is accommodated in the accommodation hole 18 c of the frame member 18, and the insulating resin plate 2 is covered with the frame member 18, and the lower surface 18 b of the frame member 18. And the portion 9 from which the copper foil 3 of the insulating resin plate 2 is peeled off, and the contact portion is heated and pressurized to adhere to each other.
[0013]
The frame member 18 is covered with the cover 20, the lower surface 20 a is brought into contact with the upper surface 18 a of the frame member 18, and bonded to each other with an adhesive. As shown in FIG. 3A, an electronic case 21 having a space 22 for hermetically sealing the flip chip 15 is formed by the insulating resin plate 2, the accommodation hole 18 c of the frame member 18, and the cover 20.
[0014]
Thus, the rough surface is formed in the lower surface 18b of the frame member 18 which contacts each other, the portion 9 where the copper foil 3 of the insulating resin plate 2 is peeled off, the upper surface 18a of the frame member 18 and the lower surface 20a of the cover 20. Thereby, since the mutual adhesive force improves, the airtightness in the space 22 improves. Also, the airtightness in the space 22 is improved by filling the through-connection hole 6 with the insulating resin material 10.
[0015]
Further, in order to form the space 22 for sealing the flip chip 15, it is formed by an inexpensive double-sided copper-clad laminate 1, and inexpensive double-sided copper-clad laminate and copper-clad laminate as the frame member 18 and the cover 20. Therefore, it can be formed at low cost. Further, the electrical connection between the internal mounting terminal portion 12 and the external connection terminal portion 13 is performed by the through-connection hole 6, so that the conductor connecting the both terminal portions 12 and 13 is provided on the electronic component case 21 side. Therefore, the width direction dimension L3 can be reduced. In the case of a conventional ceramic case, there was a limit to miniaturization. Incidentally, the electronic component case 26 manufactured by the method described in this embodiment has a width, depth, and height of 2.5 × 2 × 1. It was able to be formed in the dimension of 0.7 (mm).
[0016]
Next, as shown in FIG. 3 (a), the part 23 indicated by the alternate long and short dash line corresponding to the center of the frame member 18 is cut by licing, and as shown in FIG. One flip chip 15 is divided into one electronic component case. The electronic component case 21 formed in this manner is mounted on the motherboard by electrically connecting the external connection terminal section 13 to a land section of the motherboard (not shown).
[0017]
The flip chip 17 is electrically connected to the upper surface terminal portion 12 of the printed wiring board via the bumps 18, but may be connected via bonding wires, and various design changes are possible. Further, although the through connection hole 6 is positioned at the mounting position of the bump 16, the through connection hole 6 may be shifted to the inside and the outside of the bump 16. Further, the shape of the receiving hole 18c of the frame member 18 is not limited to a rectangle, and various design changes can be made. Further, a conductor layer may be formed on the frame member 18 and the cover 20 and the conductor layer and the flip chip 15 may be electrically connected.
[0018]
【The invention's effect】
As described above, according to the invention according to claim 1, since the through-connection hole that electrically connects the internal mounting terminal portion and the external connection terminal portion is not led out from the side surface of the base plate, Miniaturized. In addition, since the base plate, the frame member, and the cover are formed of an insulating resin material, they can be formed at low cost.
[0019]
Furthermore, by completely enclosing the element housed in the space with a frame member or cover, the moisture resistance, corrosion resistance, and hermeticity of the element can be improved.
[0020]
Moreover, according to the invention which concerns on Claim 2, since the rough surface which is easy to adhere | attach can be formed on the surface of the copper clad laminated board mutually adhere | attached, airtightness improves.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view for explaining a first half step in an electronic component case manufacturing method according to the present invention.
FIG. 2 is a cross-sectional view for explaining a middle step in the method of manufacturing an electronic component case according to the present invention.
FIG. 3 is a cross-sectional view for explaining the latter half of the method for manufacturing an electronic component case according to the present invention.
FIG. 4 is an exploded perspective view for explaining a method of assembling an electronic component case according to the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Double-sided copper clad laminated board, 7 ... Upper surface terminal part, 8 ... Lower surface terminal part, 9 ... The site | part from which the copper foil 3 was peeled, 12 ... Internal mounting terminal part, 13 ... External connection terminal part, 15 ... Flip Chip: 16 ... Bump, 18 ... Frame member, 18c ... Accommodating hole, 20 ... Cover, 21 ... Electronic component case, 22 ... Space.

Claims (2)

ベース板、枠部材およびカバーとによって素子を気密封止する空間を設けた電子部品ケースであって、前記ベース板、枠部材およびカバーを銅張積層板によって形成し、前記ベース板の上面に設けられ素子を実装する内部実装用端子部と、前記ベース板の下面に設けられた外部接続用端子部と、前記ベース板に設けられ前記内部実装用端子部と外部接続用端子部とを電気的に接続する貫通接続穴と、この貫通接続穴内に充填される充填材とを備え、この充填材の上下面を前記内部実装用端子部と外部接続用端子部とで覆い、前記ベース板の銅箔を剥離した部位と前記枠部材の銅箔を剥離した部位とを接着したことを特徴とする電子部品ケース。An electronic component case provided with a space for hermetically sealing an element by a base plate, a frame member, and a cover, wherein the base plate, the frame member, and the cover are formed of a copper clad laminate, and are provided on the upper surface of the base plate The internal mounting terminal portion for mounting the element, the external connection terminal portion provided on the lower surface of the base plate, and the internal mounting terminal portion and the external connection terminal portion provided on the base plate are electrically connected. A through-connecting hole connected to the through-connecting hole, and a filler filled in the through-connecting hole, the upper and lower surfaces of the filler are covered with the internal mounting terminal portion and the external connecting terminal portion, and the copper of the base plate An electronic component case , wherein a portion where the foil is peeled off and a portion where the copper foil of the frame member is peeled off are adhered . 請求項１記載の電子部品ケースの製造方法において、前記ベース板、枠部材およびカバーを銅張積層板で形成し、枠部材の銅張積層板に素子を収容する収容孔を設け、これら銅張積層板の銅箔を剥離し、互いに剥離した部位を接着することにより、前記ベース板と枠部材の収容孔とカバーとによって素子を気密封止する空間を形成したことを特徴とする電子部品ケースの製造方法。  2. The method of manufacturing an electronic component case according to claim 1, wherein the base plate, the frame member, and the cover are formed of a copper-clad laminate, and an accommodation hole for accommodating an element is provided in the copper-clad laminate of the frame member. An electronic component case characterized in that a space for hermetically sealing the element is formed by the base plate, the housing hole of the frame member and the cover by peeling the copper foil of the laminated plate and bonding the peeled portions to each other Manufacturing method.
JP2000265013A 2000-08-25 2000-09-01 Electronic component case and manufacturing method thereof Expired - Lifetime JP3716726B2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2000265013A JP3716726B2 (en) 2000-09-01 2000-09-01 Electronic component case and manufacturing method thereof
TW090120100A TW521555B (en) 2000-08-25 2001-08-16 Electronic device sealing electronic element therein and manufacturing method thereof, and printed wiring board suitable for such electronic device
US09/930,944 US6777612B2 (en) 2000-08-25 2001-08-17 Electronic device sealing electronic element therein and manufacturing method thereof, and printed wiring board suitable for such electronic device
KR10-2001-0049730A KR100462138B1 (en) 2000-08-25 2001-08-18 Electronic device sealing electronic element therein and manufacturing method thereof, and printed wiring board suitable for such electronic device
CNB011258101A CN1237861C (en) 2000-08-25 2001-08-24 Electronic device of sealed electronic element and manufacturing method and printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000265013A JP3716726B2 (en) 2000-09-01 2000-09-01 Electronic component case and manufacturing method thereof

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JP2002076159A JP2002076159A (en) 2002-03-15
JP3716726B2 true JP3716726B2 (en) 2005-11-16

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Publication number Priority date Publication date Assignee Title
JP3955086B2 (en) 2005-02-10 2007-08-08 株式会社エレメント電子 Manufacturing method of substrate with bumps

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