JP5186102B2

JP5186102B2 - Microphone package manufacturing method and microphone package

Info

Publication number: JP5186102B2
Application number: JP2006317932A
Authority: JP
Inventors: 利彦高畑; 貞幸角; 裕志河田; 岳司吉田; 直樹牛山
Original assignee: Panasonic Corp; Matsushita Electric Industrial Co Ltd
Current assignee: Panasonic Corp; Panasonic Holdings Corp
Priority date: 2005-11-25
Filing date: 2006-11-27
Publication date: 2013-04-17
Anticipated expiration: 2026-11-27
Also published as: JP2007174635A

Description

本発明は、携帯電話、補聴器、車載用の音響センサ、超音波センサの受波装置などに用いられるシリコンマイクロホンチップを用いたマイクロホンパッケージに関する。 The present invention relates to a microphone package using a silicon microphone chip used for a mobile phone, a hearing aid, an on-vehicle acoustic sensor, a receiving device for an ultrasonic sensor, and the like.

近年、従来のエレクトレットコンデンサマイクロホンに比べて小型薄型軽量化が可能で耐環境性に優れたシリコンマイクロホンチップを用いたマイクロホンパッケージが注目されている。このようなマイクロホンパッケージとして、印刷回路基板に凹部を形成し、その凹部を圧力リファレンスを提供するキャビティとしたものが知られている（例えば、特許文献１参照）。
特表２００４−５３７１８２号公報 In recent years, a microphone package using a silicon microphone chip, which can be reduced in size, weight and weight as compared with a conventional electret condenser microphone and has excellent environmental resistance, has attracted attention. As such a microphone package, a package in which a concave portion is formed in a printed circuit board and the concave portion is used as a cavity for providing a pressure reference is known (for example, see Patent Document 1).
JP-T-2004-537182

しかしながら、上述した特許文献１に示されるようなマイクロホンパッケージにおいては、印刷回路基板にキャビティや、キャビティと外界との通気を行って音響特性を維持するためのリーク孔等の音響特性に影響を及ぼす形状を精度良く設けることは難しく、小型化等が困難である。またシリコンマイクロホンチップと信号処理用の電子部品が同一平面上に存在するので、昨今求められる小型化への対応に関して形状的に限界がある。 However, in the microphone package as shown in Patent Document 1 described above, the acoustic characteristics such as the cavity and the leak hole for maintaining the acoustic characteristics by ventilating the cavity and the outside through the printed circuit board are affected. It is difficult to provide the shape with high accuracy, and it is difficult to reduce the size. In addition, since the silicon microphone chip and the electronic component for signal processing exist on the same plane, there is a limit in shape in terms of dealing with the downsizing required recently.

本発明は、上記課題を解消するものであって、寸法精度の安定したリーク孔とキャビティを備えて音響特性を良好に保持すると共に、製造が容易で小型化かつ安価に実現できるシリコンマイクロホンチップを用いたマイクロホンパッケージの製造方法及びマイクロホンパッケージを提供することを目的とする。 The present invention solves the above-described problem, and provides a silicon microphone chip that has a leak hole and a cavity with stable dimensional accuracy, and that has good acoustic characteristics, and that can be easily manufactured, reduced in size, and inexpensively. An object of the present invention is to provide a method of manufacturing a used microphone package and a microphone package.

上記課題を達成するために、請求項１の発明は、印刷回路基板と、音響信号を受信して電気容量の変化を生じるシリコンマイクロホンチップと、前記シリコンマイクロホンチップの電気容量の変化を電気信号に変換し出力する電子部品と、を備えたマイクロホンパッケージの製造方法であって、印刷回路基板上に電子部品を実装する実装基板形成工程と、電子部品実装後の前記印刷回路基板の実装面上の所定の位置にシート状の銅箔付き絶縁性基材を加熱加圧して積層し積層基板を形成する積層工程と、前記積層した積層基板に導通用及び通気口用の貫通孔を形成する孔開け工程と、前記孔開け後の積層基板に回路形成を行う回路形成工程と、前記回路形成後の積層基板上に前記シリコンマイクロホンチップを実装するチップ実装工程と、を備え、前記電子部品は前記シリコンマイクロホンチップと前記印刷回路基板との間の前記絶縁性基材に埋め込まれ、かつ、前記電子部品と前記シリコンマイクロホンチップとが互いに上下に重なるように配置され、前記積層工程は、凸部を有する加圧用金型を用いることにより、前記積層基板上に音響特性を付与するキャビティ構造を形成し、かつキャビティ構造の上面の周囲を平坦に形成し、前記孔開け工程は、パンチング、レーザ光加工、またはドリル加工によって行われ、前記積層工程の後に、前記積層基板の壁面に該積層基板の厚み方向に沿って凹部を形成し、前記凹部にグランドとなる回路パターンを形成する工程、をさらに備えるものである。 In order to achieve the above object, the invention of claim 1 is a printed circuit board, a silicon microphone chip that receives an acoustic signal to cause a change in electric capacity, and a change in electric capacity of the silicon microphone chip as an electric signal. A method of manufacturing a microphone package comprising: an electronic component for conversion and output; a mounting substrate forming step for mounting an electronic component on a printed circuit board; and a mounting surface of the printed circuit board after mounting the electronic component A laminating step in which a laminated substrate is formed by heating and pressurizing a sheet-like insulating base with copper foil at a predetermined position, and a hole for forming a through hole for conduction and a vent is formed in the laminated substrate. A circuit forming step of forming a circuit on the laminated substrate after drilling, and a chip mounting step of mounting the silicon microphone chip on the laminated substrate after forming the circuit. For example, the electronic component is embedded in said insulating substrate between the printed circuit board and the silicon microphone chip and the electronic component and the silicon microphone chip is arranged so as to overlap one above the other, wherein In the laminating step , a cavity structure for imparting acoustic characteristics is formed on the laminated substrate by using a pressurizing mold having a convex portion , and the periphery of the upper surface of the cavity structure is formed flat, and the perforating step Is performed by punching, laser beam processing, or drilling, and after the laminating step, a concave portion is formed on the wall surface of the laminated substrate along the thickness direction of the laminated substrate, and a circuit pattern serving as a ground is formed in the concave portion. And a forming step .

請求項２の発明は、印刷回路基板と、音響信号を受信して電気容量の変化を生じるシリコンマイクロホンチップと、前記シリコンマイクロホンチップの電気容量の変化を電気信号に変換し出力する電子部品と、を備えたマイクロホンパッケージの製造方法であって、印刷回路基板上に電子部品を実装する実装基板形成工程と、電子部品実装後の前記印刷回路基板の実装面上の所定の位置にシート状の銅箔付き絶縁性基材を加熱加圧して積層し積層基板を形成する積層工程と、前記積層した積層基板に導通用の貫通孔を形成する孔開け工程と、前記孔開け後の積層基板に回路形成を行う回路形成工程と、前記回路形成後の積層基板上に前記シリコンマイクロホンチップを実装するチップ実装工程と、前記回路形成工程とチップ実装工程の間の工程で前記積層した積層基板に通気口用の貫通孔を形成する工程と、を備え、前記電子部品は前記シリコンマイクロホンチップと前記印刷回路基板との間の前記絶縁性基材に埋め込まれ、かつ、前記電子部品と前記シリコンマイクロホンチップとが互いに上下に重なるように配置され、前記積層工程は、凸部を有する加圧用金型を用いることにより、前記積層基板上に音響特性を付与するキャビティ構造を形成し、かつキャビティ構造の上面の周囲を平坦に形成し、前記孔開け工程は、パンチング、レーザ光加工、またはドリル加工によって行われ、前記積層工程の後に、前記積層基板の壁面に該積層基板の厚み方向に沿って凹部を形成し、前記凹部にグランドとなる回路パターンを形成する工程、をさらに備えるものである。 The invention of claim 2 is a printed circuit board, a silicon microphone chip that receives an acoustic signal and causes a change in electric capacity, an electronic component that converts the change in electric capacity of the silicon microphone chip into an electric signal and outputs the electric signal, A mounting substrate forming step for mounting electronic components on a printed circuit board, and a sheet-like copper at a predetermined position on the mounting surface of the printed circuit board after mounting the electronic components A laminating step in which an insulating base material with foil is heated and pressed to form a laminated substrate, a drilling step in which through holes for conduction are formed in the laminated substrate, and a circuit on the laminated substrate after the drilling is performed. A circuit forming step for forming, a chip mounting step for mounting the silicon microphone chip on the laminated substrate after the circuit formation, and a process between the circuit forming step and the chip mounting step. Wherein the step of forming a laminated through hole for vent in the laminated substrate, wherein the electronic component is embedded in said insulating substrate between the printed circuit board and the silicon microphone chip, and in, The electronic component and the silicon microphone chip are arranged so as to overlap each other, and the laminating step has a cavity structure that imparts acoustic characteristics on the laminated substrate by using a pressing mold having a convex portion. formed, and to form flat around the upper surface of the cavity structure, the punching step, punching, laser beam machining, or made by drilling, after the laminating step, the laminated board on the wall surface of the laminated substrate Forming a recess along the thickness direction, and forming a ground circuit pattern in the recess .

請求項３の発明は、請求項１または請求項２に記載のマイクロホンパッケージの製造方法において、前記チップ実装工程の後に、外来ノイズ対策のシールドケースを前記積層基板に搭載する工程を備えるものである。 According to a third aspect of the present invention, in the method for manufacturing a microphone package according to the first or second aspect of the present invention, the method further includes a step of mounting a shield case against external noise on the multilayer substrate after the chip mounting step. .

請求項４の発明は、請求項１乃至請求項３のいずれか一項に記載のマイクロホンパッケージの製造方法において、前記積層工程時に、前記印刷回路基板上に予め他の印刷回路基板を積層するものである。 According to a fourth aspect of the present invention, in the method of manufacturing a microphone package according to any one of the first to third aspects, another printed circuit board is previously laminated on the printed circuit board in the lamination step. It is.

請求項５の発明は、請求項１乃至請求項４のいずれか一項に記載のマイクロホンパッケージの製造方法において、前記通気口用の貫通孔を前記シリコンマイクロホンチップの感知部から逸らした位置に作製するものである。 According to a fifth aspect of the present invention, in the method for manufacturing a microphone package according to any one of the first to fourth aspects, the through hole for the vent is made at a position deviating from the sensing portion of the silicon microphone chip. To do.

請求項６の発明は、請求項１乃至請求項５のいずれか一項に記載のマイクロホンパッケージの製造方法において、前記積層基板の壁面に当該積層基板の厚み方向に沿って凹部を設ける工程を備えるものである。 According to a sixth aspect of the present invention, in the method of manufacturing a microphone package according to any one of the first to fifth aspects, the method includes a step of providing a recess along the thickness direction of the multilayer substrate on the wall surface of the multilayer substrate. Is.

請求項７の発明は、印刷回路基板と、音響信号を受信して電気容量の変化を生じるシリコンマイクロホンチップと、前記シリコンマイクロホンチップの電気容量の変化を電気信号に変換し出力する電子部品と、を備えたマイクロホンパッケージの製造方法であって、前記シリコンマイクロホンチップの形成時に当該シリコンマイクロホンチップに通気口用の貫通孔を形成する工程と、印刷回路基板上に電子部品を実装する実装基板形成工程と、電子部品実装後の前記印刷回路基板の実装面上の所定の位置にシート状の銅箔付き絶縁性基材を加熱加圧して積層し積層基板を形成する積層工程と、前記積層した積層基板に導通用の貫通孔を形成する孔開け工程と、前記孔開け後の積層基板に回路形成を行う回路形成工程と、前記回路形成後の積層基板上に前記シリコンマイクロホンチップを実装するチップ実装工程と、を備え、前記電子部品は前記シリコンマイクロホンチップと前記印刷回路基板との間の前記絶縁性基材に埋め込まれ、かつ、前記電子部品と前記シリコンマイクロホンチップとが互いに上下に重なるように配置され、前記積層工程は、凸部を有する加圧用金型を用いることにより、前記積層基板上に音響特性を付与するキャビティ構造を形成し、かつキャビティ構造の上面の周囲を平坦に形成し、前記孔開け工程は、パンチング、レーザ光加工、またはドリル加工によって行われ、前記積層工程の後に、前記積層基板の壁面に該積層基板の厚み方向に沿って凹部を形成し、前記凹部にグランドとなる回路パターンを形成する工程、をさらに備えるものである。 The invention of claim 7 is a printed circuit board, a silicon microphone chip that receives an acoustic signal to cause a change in electric capacity, an electronic component that converts the change in electric capacity of the silicon microphone chip into an electric signal and outputs the electric signal, A method of manufacturing a microphone package comprising: a step of forming a through hole for a vent in the silicon microphone chip when the silicon microphone chip is formed; and a mounting substrate forming step of mounting electronic components on the printed circuit board A laminating step in which a laminated substrate is formed by heating and pressing a sheet-like insulating substrate with copper foil at a predetermined position on the mounting surface of the printed circuit board after mounting electronic components; A hole forming step of forming a through hole for conduction in the substrate, a circuit forming step of forming a circuit in the laminated substrate after the hole formation, and a lamination after the circuit formation Comprising a chip mounting step of mounting the silicon microphone chip on the board, wherein the electronic component is embedded in said insulating substrate between the printed circuit board and the silicon microphone chip, and said electronic component The silicon microphone chip is disposed so as to overlap each other, and the laminating step forms a cavity structure that imparts acoustic characteristics on the laminated substrate by using a pressurizing mold having a convex portion , and The periphery of the upper surface of the cavity structure is formed flat, and the drilling step is performed by punching, laser beam processing, or drilling, and after the stacking step, on the wall surface of the stacked substrate in the thickness direction of the stacked substrate. Forming a recess along the recess and forming a ground circuit pattern in the recess .

請求項８の発明は、請求項１乃至請求項７のいずれか一項に記載のマイクロホンパッケージの製造方法によって製造されたマイクロホンパッケージである。 The invention of claim 8 is a microphone package manufactured by the method for manufacturing a microphone package according to any one of claims 1 to 7 .

請求項１の発明によれば、印刷回路基板に絶縁性基材を積層し積層基板を形成できるので、容易かつ安価に積層基板を製造でき、導通用及び通気口用（リーク孔用）の孔が貫通孔の構造であるので、非貫通孔の形成に比べてより容易である。また、回路形成は、貫通孔内と積層基板の表面に行えばよく、これは従来のパターニング方法やめっき工程を用いて容易に行うことができる。シリコンマイクロホンチップを積層基板上に実装するので、実装が容易である。さらに、このような製造方法によると、一枚の印刷回路基板上に、多数のマイクロホンパッケージを一度に形成する、多数個取りの製造が行える。従って、寸法精度の安定したリーク孔を備えて音響特性を良好に保持すると共に、製造が容易で小型化かつ安価に実現できるシリコンマイクロホンチップを用いたマイクロホンパッケージを製造できる。本発明によれば、キャビティ構造が、工程を追加することなく容易に形成できる。また、金型の精度に従って、寸法精度のよいキャビティ構造を容易に形成できる。 According to the first aspect of the present invention, since the insulating substrate can be laminated on the printed circuit board to form the laminated substrate, the laminated substrate can be manufactured easily and inexpensively, and the holes for conduction and vent holes (for leak holes) can be manufactured. Is a through-hole structure, which is easier than forming a non-through-hole. In addition, the circuit formation may be performed in the through hole and on the surface of the laminated substrate, which can be easily performed using a conventional patterning method or a plating process. Since the silicon microphone chip is mounted on the laminated substrate, mounting is easy. Furthermore, according to such a manufacturing method, a large number of microphone packages can be manufactured in which a large number of microphone packages are formed at a time on a single printed circuit board. Accordingly, it is possible to manufacture a microphone package using a silicon microphone chip that has a leak hole with a stable dimensional accuracy and maintains good acoustic characteristics, and can be easily manufactured, downsized, and inexpensively. According to the present invention, the cavity structure can be easily formed without adding a process. Also, a cavity structure with good dimensional accuracy can be easily formed according to the accuracy of the mold.

請求項２の発明によれば、印刷回路基板に絶縁性基材を積層し積層基板を形成できるので、容易かつ安価に積層基板を製造でき、導通用及び通気口用（リーク孔用）の孔が貫通孔の構造であるので、非貫通孔の形成に比べてより容易である。また、回路形成は、貫通孔内と積層基板の表面に行えばよく、これは従来のパターニング方法やめっき工程を用いて容易に行うことができる。シリコンマイクロホンチップを積層基板上に実装するので、実装が容易である。さらに、このような製造方法によると、一枚の印刷回路基板上に、多数のマイクロホンパッケージを一度に形成する、多数個取りの製造が行える。従って、寸法精度の安定したリーク孔を備えて音響特性を良好に保持すると共に、製造が容易で小型化かつ安価に実現できるシリコンマイクロホンチップを用いたマイクロホンパッケージを製造できる。また、回路形成工程の後に通気口用の貫通孔を形成するので、回路形成工程のめっき処理などにおいて、通気口用の貫通孔に対する汚染防止などの保護をする必要がなく、清浄な貫通孔を形成できる。本発明によれば、キャビティ構造が、工程を追加することなく容易に形成できる。また、金型の精度に従って、寸法精度のよいキャビティ構造を容易に形成できる。 According to the invention of claim 2, since the insulating substrate can be laminated on the printed circuit board to form the laminated substrate, the laminated substrate can be manufactured easily and inexpensively, and the holes for conduction and vent holes (for leak holes) can be manufactured. Is a through-hole structure, which is easier than forming a non-through-hole. In addition, the circuit formation may be performed in the through hole and on the surface of the laminated substrate, which can be easily performed using a conventional patterning method or a plating process. Since the silicon microphone chip is mounted on the laminated substrate, mounting is easy. Furthermore, according to such a manufacturing method, a large number of microphone packages can be manufactured in which a large number of microphone packages are formed at a time on a single printed circuit board. Accordingly, it is possible to manufacture a microphone package using a silicon microphone chip that has a leak hole with a stable dimensional accuracy and maintains good acoustic characteristics, and can be easily manufactured, downsized, and inexpensively. In addition, since the through hole for the vent is formed after the circuit forming process, it is not necessary to protect the through hole for the vent in the plating process in the circuit forming process, and the clean through hole is not required. Can be formed. According to the present invention, the cavity structure can be easily formed without adding a process. Also, a cavity structure with good dimensional accuracy can be easily formed according to the accuracy of the mold.

請求項３の発明によれば、導電性のシールドケースを備えることにより、外来ノイズを遮蔽できる。 According to the invention of claim 3, external noise can be shielded by providing the conductive shield case.

請求項４の発明によれば、複数の機能を付加した多機能のマイクロホンパッケージを形成することができる。 According to the invention of claim 4 , a multi-function microphone package to which a plurality of functions are added can be formed.

請求項５の発明によれば、通気口を介してシリコンマイクロホンチップの感知部に及ぼされる汚染や損傷の原因を回避できる。 According to the fifth aspect of the present invention, it is possible to avoid the cause of contamination and damage exerted on the sensing part of the silicon microphone chip through the vent.

請求項６の発明によれば、例えば、凹部に導通パターンを形成しておき、シールドケースに突起部を形成して、その突起部を凹部に嵌合するようにすれば、外部に出っ張ることなく、接地用の回路を形成できる。 According to the invention of claim 6 , for example, if a conductive pattern is formed in the recess, a protrusion is formed in the shield case, and the protrusion is fitted into the recess, the protrusion does not protrude to the outside. A circuit for grounding can be formed.

請求項７の発明によれば、印刷回路基板に絶縁性基材を積層し積層基板を形成できるので、容易かつ安価に積層基板を製造でき、導通用の孔が貫通孔の構造であるので、非貫通孔の形成に比べてより容易である。また、回路形成は、貫通孔内と積層基板の表面に行えばよく、これは従来のパターニング方法やめっき工程を用いて容易に行うことができる。シリコンマイクロホンチップを積層基板上に実装するので、実装が容易である。さらに、このような製造方法によると、一枚の印刷回路基板上に、多数のマイクロホンパッケージを一度に形成する、多数個取りの製造が行える。従って、製造が容易で小型化かつ安価に実現できるシリコンマイクロホンチップを用いたマイクロホンパッケージを製造できる。また、通気口用の貫通孔をシリコンマイクロホンチップに形成するので、半導体製造工程により、微細で精巧な通気口用の貫通孔を形成でき、寸法精度の安定したリーク孔を備えて音響特性を良好に保持したマイクロホンパッケージを製造できる。本発明によれば、キャビティ構造が、工程を追加することなく容易に形成できる。また、金型の精度に従って、寸法精度のよいキャビティ構造を容易に形成できる。 According to the invention of claim 7 , since the insulating substrate can be laminated on the printed circuit board to form the laminated substrate, the laminated substrate can be manufactured easily and inexpensively, and the hole for conduction has a structure of a through hole. It is easier than forming non-through holes. In addition, the circuit formation may be performed in the through hole and on the surface of the laminated substrate, which can be easily performed using a conventional patterning method or a plating process. Since the silicon microphone chip is mounted on the laminated substrate, mounting is easy. Furthermore, according to such a manufacturing method, a large number of microphone packages can be manufactured in which a large number of microphone packages are formed at a time on a single printed circuit board. Therefore, it is possible to manufacture a microphone package using a silicon microphone chip that can be easily manufactured, reduced in size, and inexpensively. In addition, since the through hole for the vent is formed in the silicon microphone chip, the fine and elaborate through hole for the vent can be formed by the semiconductor manufacturing process, and the acoustic characteristics are excellent with the leak hole having a stable dimensional accuracy. Can be produced. According to the present invention, the cavity structure can be easily formed without adding a process. Also, a cavity structure with good dimensional accuracy can be easily formed according to the accuracy of the mold.

請求項８の発明によれば、寸法精度の安定したリーク孔とキャビティを備えて音響特性の良好な小型化かつ安価なマイクロホンパッケージを提供できる。 According to the eighth aspect of the present invention, it is possible to provide a miniaturized and inexpensive microphone package having a leak hole and a cavity with stable dimensional accuracy and good acoustic characteristics.

以下、本発明の一実施形態に係るマイクロホンパッケージの製造方法及びマイクロホンパッケージについて、図面を参照して説明する。図１（ａ）（ｂ）は本発明の一実施形態に係るマイクロホンパッケージ１を示し、図２はパッケージ１の要部を示す。マイクロホンパッケージ１は、印刷回路基板２と、音響信号を受信して電気容量の変化を生じるシリコンマイクロホンチップ３と、シリコンマイクロホンチップ３の電気容量の変化を電気信号に変換し出力する電子部品４と、シリコンマイクロホンチップ３の上部全面を覆うように配置されたシールドケース５と、印刷回路基板２の実装面上の所定の位置に加熱加圧して積層したシート状の絶縁性基材１０と、を備えている。 Hereinafter, a microphone package manufacturing method and a microphone package according to an embodiment of the present invention will be described with reference to the drawings. 1A and 1B show a microphone package 1 according to an embodiment of the present invention, and FIG. The microphone package 1 includes a printed circuit board 2, a silicon microphone chip 3 that receives an acoustic signal and causes a change in electric capacity, and an electronic component 4 that converts the electric capacity change of the silicon microphone chip 3 into an electric signal and outputs the electric signal. A shield case 5 disposed so as to cover the entire upper surface of the silicon microphone chip 3, and a sheet-like insulating substrate 10 laminated by heating and pressing at a predetermined position on the mounting surface of the printed circuit board 2. I have.

このマイクロホンパッケージ１は、直方体形状を有し、上面中央の受音用の開口５１から音響信号（空気中を伝播する音）を取り込み、その信号を電気信号に変換して、下部の電極（回路パターン）から電気信号として出力する。マイクロホンパッケージ１は、携帯電話、補聴器、車載用の音響センサ、超音波センサの受波装置などに用いられる。以下、各部の構成を説明する。 The microphone package 1 has a rectangular parallelepiped shape, takes an acoustic signal (sound propagating in the air) from the sound receiving opening 51 at the center of the upper surface, converts the signal into an electrical signal, and converts the lower electrode (circuit) Pattern) as an electrical signal. The microphone package 1 is used for a mobile phone, a hearing aid, an in-vehicle acoustic sensor, a receiving device for an ultrasonic sensor, and the like. Hereinafter, the configuration of each unit will be described.

マイクロホンチップ３は、例えば、半導体製造技術を用いてシリコンウエハを加工することにより作製される。マイクロホンチップ３は、基台部３１と、振動膜３２と、スペーサ３３と、固定膜３４とを備えている。基台部３１には、受音開口３０が形成されており、振動膜３２は、受音開口３０に臨む側に設けられている。固定膜３４は、スペーサ３３を介して振動膜３２に重ねて設けられており、振動膜３２と固定膜３４との間には、間隙が設けられている。基台部３１及びスペーサ３３は絶縁性であり、振動膜３２及び固定膜３４は導電性である。 The microphone chip 3 is produced, for example, by processing a silicon wafer using a semiconductor manufacturing technique. The microphone chip 3 includes a base 31, a vibration film 32, a spacer 33, and a fixed film 34. A sound receiving opening 30 is formed in the base portion 31, and the vibration film 32 is provided on the side facing the sound receiving opening 30. The fixed film 34 is provided so as to overlap the vibration film 32 via the spacer 33, and a gap is provided between the vibration film 32 and the fixed film 34. The base 31 and the spacer 33 are insulative, and the vibration film 32 and the fixed film 34 are conductive.

印刷回路基板２は、略矩形の平板状をした絶縁性の基板と、基板の上下両面に形成した回路パターン２１，２２と、基板の上下の回路パターン２１，２２を電気的に接続するように形成したスルーホール２０とを備えている。印刷回路基板２には、電子部品４、例えば、電界効果トランジスタや２端子素子が実装される。また、印刷回路基板２には、シリコンマイクロホンチップ３の固定膜３４側に設けられたキャビティ１１に連通するリーク孔１２が形成されている。 The printed circuit board 2 is configured to electrically connect an insulating board having a substantially rectangular flat plate shape, circuit patterns 21 and 22 formed on both upper and lower surfaces of the board, and circuit patterns 21 and 22 on the upper and lower sides of the board. The formed through hole 20 is provided. On the printed circuit board 2, an electronic component 4, for example, a field effect transistor or a two-terminal element is mounted. The printed circuit board 2 has a leak hole 12 communicating with the cavity 11 provided on the fixed film 34 side of the silicon microphone chip 3.

絶縁性基材１０は、エポキシ樹脂等の有機樹脂に無機フィラーを高密度充填した樹脂シートからなるシート状の絶縁材であり、印刷回路基板２の実装面上の所定の位置に加熱加圧して積層されている（図５、後述）。この絶縁性基材１０は、印刷回路基板２に実装された電子部品４を包み込み、これらを保護するように形成されるとともに、構造材としての機械的強度を備えて構成されている。絶縁性基材１０の上面は、平坦な外周に囲まれて凹部が形成されており、この凹部がキャビティ１１を構成している。 The insulating substrate 10 is a sheet-like insulating material made of a resin sheet in which an inorganic filler such as an epoxy resin is filled with an inorganic filler at a high density, and is heated and pressed at a predetermined position on the mounting surface of the printed circuit board 2. They are stacked (FIG. 5, described later). The insulating base material 10 is formed so as to wrap and protect the electronic components 4 mounted on the printed circuit board 2 and has mechanical strength as a structural material. The upper surface of the insulating substrate 10 is surrounded by a flat outer periphery to form a recess, and this recess constitutes the cavity 11.

また、この絶縁性基材１０には、印刷回路基板２と共に貫通するスルーホール２０と、キャビティ１１に通じる通気口（以下、リーク孔１２）とが形成されている。絶縁性基材１０の上面には回路パターン２３が形成されておいる。回路パターン２３は、スルーホール２０に接続されて、さらに、例えば、印刷回路基板２の回路パターン２１，２２などに、所定の回路を形成するように必要に応じて電気的に接続されている。 Further, the insulating base material 10 is formed with a through hole 20 penetrating with the printed circuit board 2 and a vent hole (hereinafter referred to as a leak hole 12) communicating with the cavity 11. A circuit pattern 23 is formed on the upper surface of the insulating substrate 10. The circuit pattern 23 is connected to the through hole 20 and further electrically connected to the circuit patterns 21 and 22 of the printed circuit board 2 as necessary so as to form a predetermined circuit.

絶縁性基材１０の上面には、上述の回路パターン２３に電気的に接続して、シリコンマイクロホンチップ３が実装されている。シリコンマイクロホンチップ３は、例えば、ボールやスタックなど突起電極Ｂを用いて、フリップチップ実装されている。シリコンマイクロホンチップ３の外周は、封止樹脂３５によって封止され、これにより、キャビティ１１が、リーク孔１２を除いて、封止された状態と成っている。 A silicon microphone chip 3 is mounted on the upper surface of the insulating base material 10 so as to be electrically connected to the circuit pattern 23 described above. The silicon microphone chip 3 is flip-chip mounted using, for example, protruding electrodes B such as balls and stacks. The outer periphery of the silicon microphone chip 3 is sealed with a sealing resin 35, whereby the cavity 11 is sealed except for the leak hole 12.

このリーク孔１２は、キャビティ１１を外部空間と連通してキャビティ１１の内圧／外圧差を調整するための経路である。これらキャビティ１１及びリーク孔１２は、マイクロホンパッケージ１の音響信号の受音特性を向上するためのものである。優れた受音特性を得るには、キャビティ１１を大きくし、また、リーク経路をキャビティ１１の大きさに対して十分に細くするのが望ましいとされているが、本マイクロホンパッケージ１は、そのような望ましい構造を有している。 The leak hole 12 is a path for communicating the cavity 11 with the external space and adjusting the internal pressure / external pressure difference of the cavity 11. The cavity 11 and the leak hole 12 are for improving the sound receiving characteristic of the acoustic signal of the microphone package 1. In order to obtain excellent sound reception characteristics, it is desirable to make the cavity 11 large and to make the leak path sufficiently narrow with respect to the size of the cavity 11. It has a desirable structure.

シールドケース５は、導電性材料で形成され、箱形の形状を有してシリコンマイクロホンチップ３の上部全面を覆うように配置されている。その上部中央には、受音用の開口５１が設けられている。シールドケース５は、シリコンマイクロホンチップ３の機械的保護をすると共に、シリコンマイクロホンチップ３の感知部（振動膜３２及び固定膜３４）や電子部品４への電磁ノイズをシールドするものである。このため、シールドケース５は、絶縁性基材１０の上面に設けられた回路パターン２３のうち、グランド電極となるパターンに電気的に、半田や導電性接着剤によって（不図示）接続されている。 The shield case 5 is formed of a conductive material, has a box shape, and is disposed so as to cover the entire upper surface of the silicon microphone chip 3. An opening 51 for receiving sound is provided at the upper center. The shield case 5 mechanically protects the silicon microphone chip 3 and shields electromagnetic noise to the sensing part (vibration film 32 and fixed film 34) and the electronic component 4 of the silicon microphone chip 3. For this reason, the shield case 5 is electrically connected to a pattern to be a ground electrode among the circuit patterns 23 provided on the upper surface of the insulating substrate 10 by solder or conductive adhesive (not shown). .

次に、マイクロホンパッケージ１の製造工程を説明する。図３は製造工程のフローを示し、図４（ａ）（ｂ）乃至図１０は製造段階におけるマイクロホンパッケージ１を示す。まず、図３により、製造工程の概要を説明する。マイクロホンパッケージ１の製造方法は、印刷回路基板２上に電子部品４を実装する実装基板形成工程（Ｓ１）と、電子部品実装後の印刷回路基板２の実装面上の所定の位置にシート状の銅箔付き絶縁性基材１０を加熱加圧して積層し積層基板を形成する積層工程（Ｓ２）と、積層した積層基板に導通用及び通気口用の貫通孔を形成する孔開け工程（Ｓ３）と、孔開け後の積層基板に回路形成を行う回路形成工程（Ｓ４）と、回路形成後の積層基板上にシリコンマイクロホンチップ３を実装するチップ実装工程（Ｓ５）とを備えている。以下、各工程毎に説明する。 Next, the manufacturing process of the microphone package 1 will be described. FIG. 3 shows a flow of the manufacturing process, and FIGS. 4A, 4B to 10 show the microphone package 1 in the manufacturing stage. First, the outline of the manufacturing process will be described with reference to FIG. The manufacturing method of the microphone package 1 includes a mounting substrate forming step (S1) for mounting the electronic component 4 on the printed circuit board 2, and a sheet-like shape at a predetermined position on the mounting surface of the printed circuit board 2 after mounting the electronic component. A laminating step (S2) in which the insulating base material 10 with copper foil is heated and pressed to form a laminated substrate, and a hole forming step (S3) in which through holes for conduction and vent holes are formed in the laminated substrate. And a circuit forming step (S4) for forming a circuit on the laminated substrate after drilling, and a chip mounting step (S5) for mounting the silicon microphone chip 3 on the laminated substrate after forming the circuit. Hereinafter, each step will be described.

図４（ａ）（ｂ）は印刷回路基板２を示す。印刷回路基板２の上面（図４（ａ））には、上述のステップＳ１において、電子部品４が実装される。電子部品４は、導電性接着剤又は半田で接合して印刷回路基板２実装される。印刷回路基板２の下面（図４（ｂ））には、マイクロホンパッケージ１から電気信号を取り出すための電極用回路パターン２１が形成されている。また、所定の電極部分以外には、例えば、ソルダーレジスト２５を塗布して被覆されている。なお、この図の状態の印刷回路基板２のスルーホール２０とリーク孔１２は、後工程で形成されるものである。 4A and 4B show the printed circuit board 2. The electronic component 4 is mounted on the upper surface (FIG. 4A) of the printed circuit board 2 in step S1 described above. The electronic component 4 is bonded with a conductive adhesive or solder and mounted on the printed circuit board 2. An electrode circuit pattern 21 for taking out an electrical signal from the microphone package 1 is formed on the lower surface of the printed circuit board 2 (FIG. 4B). Further, other than the predetermined electrode portion, for example, a solder resist 25 is applied and coated. In addition, the through hole 20 and the leak hole 12 of the printed circuit board 2 in the state of this figure are formed in a later process.

図５、図６はステップＳ２の積層工程、及びこの工程後の積層基板を示す。この工程において、電子部品４が実装された印刷回路基板２の上面に、銅箔６付きのシート状の絶縁性基材１０を載置し、これらを加熱した状態で、上面から金型７によって加圧する。この加熱加圧によって、図６に示すような積層基板が形成される。この工程で用いる金型７は、図５に示すように、キャビティ１１を形成するための凸部を有している。この、積層工程によって、上面の周囲が平坦で、かつ中央部にキャビティ１１が形成された積層基板が得られる。絶縁性基材１０の上面には、その表面形状に沿って、銅箔６が密着して積層されている。 5 and 6 show the lamination process in step S2 and the laminated substrate after this process. In this step, a sheet-like insulating base material 10 with a copper foil 6 is placed on the upper surface of the printed circuit board 2 on which the electronic component 4 is mounted, and these are heated by the mold 7 from the upper surface. Pressurize. By this heating and pressing, a laminated substrate as shown in FIG. 6 is formed. As shown in FIG. 5, the mold 7 used in this step has a convex portion for forming the cavity 11. By this laminating process, a laminated substrate having a flat top surface and a cavity 11 formed in the center is obtained. On the upper surface of the insulating base material 10, the copper foil 6 is laminated in close contact along the surface shape.

図７はステップＳ３の孔開け工程を示す。この工程において、上述の積層基板に、印刷回路基板２と絶縁性基材１０、及び銅箔６を貫通するリーク孔１２となる貫通孔、及びスルーホール用の貫通孔１３が、例えば、ピンＰを用いたパンチングによって形成される。この孔開けは、電子部品４のないところに行われる。また、必要に応じて、すなわち、印刷回路基板２の上面の回路パターン２２とスルーホール２０との接続が必要なところでは、回路パターン２２を貫通するように、孔開けが行われる。上述の孔開けの方法として、ピンＰによるパンチングの方法の他に、レーザ光加工やドリル加工といった穴加工方法を用いることができる。 FIG. 7 shows the drilling process of step S3. In this step, a through hole that becomes the leak hole 12 that penetrates the printed circuit board 2, the insulating base material 10, and the copper foil 6, and the through hole 13 for the through hole, for example, the pin P It is formed by punching using. This punching is performed in a place where the electronic component 4 is not present. Further, if necessary, that is, where connection between the circuit pattern 22 on the upper surface of the printed circuit board 2 and the through hole 20 is necessary, a hole is formed so as to penetrate the circuit pattern 22. As the above-described drilling method, in addition to the punching method using the pin P, a hole machining method such as laser beam machining or drilling can be used.

図８、図９は、ステップＳ４の回路形成工程を示す。この工程において、印刷回路基板の下面、及び絶縁性基材１０の上面の銅箔６に、所望の形状の回路パターン２１，２３が形成される。また、上述の貫通孔１３の内面にも導体膜が形成され、この導体膜によって積層基板の上下の回路パターン２１，２３、さらに印刷回路基板２の上面の回路パターン２２とが互いに電気的に接続される。貫通孔１３に導体膜を形成してスルーホール２０を形成する方法として、例えば、めっきが用いられる。貫通孔１３内に、例えば、導電性ペースト、半田、金属ピンなどの導電性材料を塗布、充填、挿入する方法によってスルーホールを形成してもよい。 8 and 9 show the circuit formation process in step S4. In this step, circuit patterns 21 and 23 having desired shapes are formed on the copper foil 6 on the lower surface of the printed circuit board and the upper surface of the insulating base material 10. In addition, a conductor film is also formed on the inner surface of the above-described through-hole 13, and this conductor film electrically connects the upper and lower circuit patterns 21 and 23 of the laminated substrate and the circuit pattern 22 on the upper surface of the printed circuit board 2 to each other. Is done. As a method for forming the through hole 20 by forming a conductor film in the through hole 13, for example, plating is used. A through hole may be formed in the through hole 13 by a method of applying, filling, and inserting a conductive material such as a conductive paste, solder, or a metal pin.

上面の銅箔６に対する回路パターン２３形成は、所定のフォトリソグラフィやエッチングによるパターン形成を経て行われる。また、レーザ光によるトリミングによって絶縁用境界を形成する方法を用いることもできる。印刷回路基板２の下面の回路パターン２１は、印刷回路基板２の形成時に形成しておけばよい。絶縁性基材１０の上面には、図９に示すように、シリコンマイクロホンチップ３の２つの電極（振動膜３２及び固定膜３４に接続される電極）に対応して２つの回路パターン２３が形成されている。 The circuit pattern 23 is formed on the copper foil 6 on the upper surface through pattern formation by predetermined photolithography or etching. Alternatively, a method of forming an insulating boundary by trimming with laser light can be used. The circuit pattern 21 on the lower surface of the printed circuit board 2 may be formed when the printed circuit board 2 is formed. As shown in FIG. 9, two circuit patterns 23 corresponding to the two electrodes (electrodes connected to the vibration film 32 and the fixed film 34) of the silicon microphone chip 3 are formed on the upper surface of the insulating substrate 10. Has been.

図１０は、ステップＳ５のチップ実装工程、及び、チップ実装工程の後に行う、外来ノイズ対策のシールドケース５を積層基板に搭載する工程を示す。これらの工程において、絶縁性基材１０の上面にシリコンマイクロホンチップ３を実装し、その後、シールドケース５を取り付けて、図１（ａ）（ｂ）に示したマイクロホンパッケージ１が完成する。このシールドケース５は、封止樹脂、導電性接着剤、又は、半田等で固定され封止される。 FIG. 10 shows a chip mounting process in step S5 and a process of mounting the shield case 5 against external noise on the multilayer substrate after the chip mounting process. In these steps, the silicon microphone chip 3 is mounted on the upper surface of the insulating substrate 10, and then the shield case 5 is attached to complete the microphone package 1 shown in FIGS. The shield case 5 is fixed and sealed with a sealing resin, a conductive adhesive, solder, or the like.

次に、図１１を参照して、マイクロホンパッケージ１の変形例を説明する。上述のマイクロホンパッケージ１では、通気口（リーク孔１２）が、マイクロホンパッケージ１、従って、シリコンマイクロホンチップ３の中央部に形成されている。図１１に示す絶縁性基材１０及びその下部の印刷回路基板２（合わせて積層基板）には、リーク孔１２が偏心位置に形成されている。このように、通気口用のリーク孔１２をシリコンマイクロホンチップの感知部から逸らした位置に作製することにより、リーク孔１２を介してシリコンマイクロホンチップ３の感知部に及ぼされる汚染や損傷の原因を回避できる。 Next, a modification of the microphone package 1 will be described with reference to FIG. In the above-described microphone package 1, the vent (leak hole 12) is formed at the center of the microphone package 1, and hence the silicon microphone chip 3. A leak hole 12 is formed at an eccentric position in the insulating base 10 shown in FIG. 11 and the printed circuit board 2 (also a laminated board) below the insulating base 10. In this way, by creating the leak hole 12 for the vent at a position deviating from the sensing part of the silicon microphone chip, the cause of the contamination or damage exerted on the sensing part of the silicon microphone chip 3 through the leak hole 12 is obtained. Can be avoided.

次に、図１２、図１３を参照して、マイクロホンパッケージ１のさらに他の変形例を説明する。このマイクロホンパッケージ１の絶縁性基材１０及びその下部の印刷回路基板２（合わせて積層基板）には、積層基板の壁面に積層基板の厚み方向に沿って凹部１６が設けられている。また、シールドケース５には、この凹部１６に挿通されるように突起部５２が形成されている。凹部１６には、グランドとなる回路パターン２４が形成されている。従って、シールドケース５の突起部５２を凹部１６に挿通して、固定と電気的な接合とが容易に行える。 Next, still another modification of the microphone package 1 will be described with reference to FIGS. The insulating substrate 10 of the microphone package 1 and the printed circuit board 2 below (including the laminated substrate) are provided with recesses 16 on the wall surface of the laminated substrate along the thickness direction of the laminated substrate. The shield case 5 is formed with a protrusion 52 so as to be inserted into the recess 16. A circuit pattern 24 serving as a ground is formed in the recess 16. Therefore, the protrusion 52 of the shield case 5 is inserted into the recess 16 so that fixing and electrical joining can be easily performed.

また、上述の構造によると、マイクロホンパッケージ１の外部に出っ張ることなく、接地用の回路を容易に形成できる。なお、このマイクロホンパッケージ１のシールドケース５は、突起部５２の他に、左右側面部に垂下する側板５３を有している。この側板は、シールドケース５を積層基板に取り付ける際に、シールドケース５と積層基板の相互の位置決めを容易にする効果がある。また、これらの図のシールドケース５の受音用の開口５１は、複数設けられているが、これらの数や寸法及び配置は、マイクロホンパッケージ１及びこれを構成するシリコンマイクロホンチップ３の機能や構成によって適宜設定されるものである。 In addition, according to the above-described structure, a grounding circuit can be easily formed without protruding outside the microphone package 1. The shield case 5 of the microphone package 1 has side plates 53 depending on the left and right side portions in addition to the protrusions 52. This side plate has an effect of facilitating the mutual positioning of the shield case 5 and the multilayer substrate when the shield case 5 is attached to the multilayer substrate. In addition, a plurality of sound receiving openings 51 of the shield case 5 in these drawings are provided, but the number, size, and arrangement of these are the functions and configurations of the microphone package 1 and the silicon microphone chip 3 constituting the same. Is set as appropriate.

なお、本発明は、上記構成に限られることなく種々の変形が可能である。例えば、積層工程時に、印刷回路基板２上に予め他の印刷回路基板を積層するようにしてもよい。これによれば、複数の機能を付加した多機能のマイクロホンパッケージ１を形成することができる。 The present invention is not limited to the above-described configuration, and various modifications can be made. For example, another printed circuit board may be laminated on the printed circuit board 2 in advance during the lamination process. According to this, the multi-function microphone package 1 to which a plurality of functions are added can be formed.

また、通気口用の貫通孔（リーク孔１２）の形成を孔開け工程で行わずに、回路形成工程とチップ実装工程の間の工程で行うようにしてもよい。これによれば、回路形成工程のめっき処理などにおいて、通気口用の貫通孔に対する汚染防止などの保護をする必要がなく、清浄な貫通孔を容易に形成できる。 Further, the through hole for the vent hole (leak hole 12) may be formed in a process between the circuit forming process and the chip mounting process without performing the hole forming process. According to this, it is not necessary to protect the through hole for the ventilation hole in the plating process or the like in the circuit forming process, and it is possible to easily form a clean through hole.

また、通気口用の貫通孔の形成を孔開け工程で行わずに、シリコンマイクロホンチップ３の形成時にシリコンマイクロホンチップ３に形成するようにしてもよい。これによれば、通常の半導体製造工程により、微細で精巧な通気口用の貫通孔を形成できる。 Further, the through hole for the air vent may not be formed in the drilling step, but may be formed in the silicon microphone chip 3 when the silicon microphone chip 3 is formed. According to this, a fine and elaborate through hole for a vent can be formed by a normal semiconductor manufacturing process.

また、電子部品４は、印刷回路基板２にフリップチップ実装やワイヤボンディング実装によって実装してもよい。また、シリコンマイクロホンチップ３を積層基板上にダイボンド剤で接合後、ワイヤボンディング実装するようにしてもよい。さらに、絶縁性基材１０は、必要に応じて複数積層してもよい。また、絶縁性基材１０に銅箔６を備えていないものでもよい。 The electronic component 4 may be mounted on the printed circuit board 2 by flip chip mounting or wire bonding mounting. Alternatively, the silicon microphone chip 3 may be mounted on the laminated substrate with a die bonding agent and then wire bonded. Furthermore, a plurality of insulating base materials 10 may be stacked as necessary. Further, the insulating substrate 10 may not be provided with the copper foil 6.

（ａ）は本発明の一実施形態に係るマイクロホンパッケージの断面図、（ｂ）は同パッケージの斜視図。(A) is sectional drawing of the microphone package which concerns on one Embodiment of this invention, (b) is a perspective view of the package. 同上パッケージの要部断面図。Sectional drawing of the principal part of a package same as the above. 同上パッケージの製造方法を説明するフローチャート。The flowchart explaining the manufacturing method of a package same as the above. （ａ）は同上パッケージの印刷回路基板の上面図、（ｂ）は同下面図。(A) is a top view of the printed circuit board of the same package, (b) is the bottom view. 同上パッケージの製造工程における積層工程を説明する断面図。Sectional drawing explaining the lamination | stacking process in the manufacturing process of a package same as the above. 同上製造工程における積層工程後の積層基板の断面図。Sectional drawing of the laminated substrate after the lamination process in a manufacturing process same as the above. 同上製造工程における孔開け工程を説明する積層基板の断面図。Sectional drawing of the laminated substrate explaining the drilling process in a manufacturing process same as the above. 同上製造工程における回路形成工程後の積層基板の断面図。Sectional drawing of the laminated substrate after the circuit formation process in a manufacturing process same as the above. 同上製造工程における回路形成工程後の積層基板の上面図。The top view of the laminated substrate after the circuit formation process in a manufacturing process same as the above. 同上製造工程におけるチップ実装工程を説明するマイクロホンパッケージの分解断面図。The exploded sectional view of the microphone package explaining the chip mounting process in a manufacturing process same as the above. 同上パッケージの変形例を説明する積層基板の上面図。The top view of the laminated substrate explaining the modification of a package same as the above. 同上パッケージの他の変形例を説明するマイクロホンパッケージの分解斜視図。The disassembled perspective view of the microphone package explaining the other modification of a package same as the above. 図１２のパッケージの組立後の斜視図。The perspective view after the assembly of the package of FIG.

Explanation of symbols

１マイクロホンパッケージ
２印刷回路基板
３マイクロホンチップ
４電子部品
５シールドケース
７金型
１０絶縁性基板
１１キャビティ構造
１２貫通孔（リーク孔）
１６凹部 DESCRIPTION OF SYMBOLS 1 Microphone package 2 Printed circuit board 3 Microphone chip 4 Electronic component 5 Shield case 7 Mold 10 Insulating board 11 Cavity structure 12 Through-hole (leak hole)
16 recess

Claims

Manufacture of a microphone package comprising a printed circuit board, a silicon microphone chip that receives an acoustic signal and generates a change in electric capacity, and an electronic component that converts the electric capacity change of the silicon microphone chip into an electric signal and outputs the electric signal A method,
A mounting board forming process for mounting electronic components on a printed circuit board;
A laminating step in which a laminated substrate is formed by heating and pressurizing a sheet-like insulating substrate with copper foil at a predetermined position on the mounting surface of the printed circuit board after electronic component mounting; and
A hole forming step of forming through holes for conduction and ventilation holes in the laminated substrate,
A circuit forming step for forming a circuit on the laminated substrate after the hole is formed;
A chip mounting step of mounting the silicon microphone chip on the laminated substrate after the circuit formation,
The electronic component is embedded in the insulating base between the silicon microphone chip and the printed circuit board, and the electronic component and the silicon microphone chip are arranged so as to overlap each other,
In the laminating step , a cavity structure that imparts acoustic characteristics is formed on the laminated substrate by using a pressurizing mold having convex portions , and the periphery of the upper surface of the cavity structure is formed flat ,
The drilling step is performed by punching, laser beam processing, or drilling,
A step of forming a recess in the wall surface of the multilayer substrate along the thickness direction of the multilayer substrate and forming a circuit pattern serving as a ground in the concave portion after the lamination step ; Production method.

Manufacture of a microphone package comprising a printed circuit board, a silicon microphone chip that receives an acoustic signal and generates a change in electric capacity, and an electronic component that converts the electric capacity change of the silicon microphone chip into an electric signal and outputs the electric signal A method,
A mounting board forming process for mounting electronic components on a printed circuit board;
A laminating step in which a laminated substrate is formed by heating and pressurizing a sheet-like insulating substrate with copper foil at a predetermined position on the mounting surface of the printed circuit board after electronic component mounting; and
Forming a through hole for conduction in the laminated substrate, and
A circuit forming step for forming a circuit on the laminated substrate after the hole is formed;
A chip mounting step of mounting the silicon microphone chip on the laminated substrate after the circuit formation;
Forming a through hole for a vent in the laminated substrate laminated in the step between the circuit forming step and the chip mounting step,
The electronic component is embedded in the insulating base between the silicon microphone chip and the printed circuit board, and the electronic component and the silicon microphone chip are arranged so as to overlap each other,
In the laminating step , a cavity structure that imparts acoustic characteristics is formed on the laminated substrate by using a pressurizing mold having convex portions , and the periphery of the upper surface of the cavity structure is formed flat ,
The drilling step is performed by punching, laser beam processing, or drilling,
A step of forming a recess in the wall surface of the multilayer substrate along the thickness direction of the multilayer substrate and forming a circuit pattern serving as a ground in the concave portion after the lamination step ; Production method.

3. The method of manufacturing a microphone package according to claim 1, further comprising a step of mounting a shield case against external noise on the multilayer substrate after the chip mounting step.

4. The method of manufacturing a microphone package according to claim 1, wherein another printed circuit board is laminated in advance on the printed circuit board in the laminating step. 5.

5. The method of manufacturing a microphone package according to claim 1, wherein the through hole for the air vent is formed at a position deviating from the sensing portion of the silicon microphone chip. 6.

The method for manufacturing a microphone package according to any one of claims 1 to 5, further comprising a step of providing a recess in the wall surface of the multilayer substrate along a thickness direction of the multilayer substrate.

Manufacture of a microphone package comprising a printed circuit board, a silicon microphone chip that receives an acoustic signal and generates a change in electric capacity, and an electronic component that converts the electric capacity change of the silicon microphone chip into an electric signal and outputs the electric signal A method,
Forming a through hole for a vent in the silicon microphone chip when the silicon microphone chip is formed;
A mounting board forming process for mounting electronic components on a printed circuit board;
A laminating step in which a laminated substrate is formed by heating and pressurizing a sheet-like insulating substrate with copper foil at a predetermined position on the mounting surface of the printed circuit board after electronic component mounting; and
Forming a through hole for conduction in the laminated substrate, and
A circuit forming step for forming a circuit on the laminated substrate after the hole is formed;
A chip mounting step of mounting the silicon microphone chip on the laminated substrate after the circuit formation,
The electronic component is embedded in the insulating base between the silicon microphone chip and the printed circuit board, and the electronic component and the silicon microphone chip are arranged so as to overlap each other,
In the laminating step , a cavity structure that imparts acoustic characteristics is formed on the laminated substrate by using a pressurizing mold having convex portions , and the periphery of the upper surface of the cavity structure is formed flat ,
The drilling step is performed by punching, laser beam processing, or drilling,
A step of forming a recess in the wall surface of the multilayer substrate along the thickness direction of the multilayer substrate and forming a circuit pattern serving as a ground in the concave portion after the lamination step ; Production method.

A microphone package manufactured by the method for manufacturing a microphone package according to any one of claims 1 to 7.