JP7118632B2 - Microphone package and microphone device - Google Patents

Description

The present invention relates to a microphone package and a microphone device having a space in which a microphone element is accommodated.

2. Description of the Related Art Small communication devices such as mobile phones use a microphone device including a microphone element that utilizes a change in capacitance and a piezoelectric effect. A microphone device is configured by mounting a microphone element in a package having a container portion capable of accommodating the microphone element. The container part has an opening. Sound (sound waves in the air) enters the container from the outside through this opening, and this sound is converted into an electric signal by a microphone element. An electric signal is transmitted to an external electric circuit via conductors such as wiring provided in the package, and is subjected to processing appropriately selected from recording, modulation, reproduction, and the like.

In recent years, in order to reduce the size and increase the functionality of microphone devices, it has been proposed to accommodate a MEMS element that functions as a microphone element and a semiconductor integrated circuit element that processes electrical signals together in a single container. (See Patent Document 1, for example).

Special Table 2015-530790

In the conventional technology described above, there is a possibility that electromagnetic interaction may occur between the microphone element and the semiconductor integrated circuit element accommodated in one container. Such interactions tend to generate noise in, for example, microphone elements.

A microphone package according to one aspect of the present invention has a through hole penetrating from an upper surface to a lower surface, and has a first mounting portion in a region including the through hole on the upper surface. A base portion having a second mounting portion in a region adjacent to the through hole, an upper frame portion positioned on an upper surface of the base portion so as to surround the first mounting portion in plan view, and a lower surface of the base portion. and a lower frame portion positioned to surround the second mounting portion in a plan view, and the through hole includes a first through portion positioned on the upper surface side of the base and the A second through portion located on the lower surface side and smaller than the first through portion in a plan view and included in the first through portion, and an inner surface of the through hole on the second mounting portion side and a stepped portion provided in the first through portion, and the second through portion is arranged such that the stepped portion is sandwiched between the second mounting portion and the second mounting portion in plan view. at a position farther from the second mounting portion .

A microphone device according to one aspect of the present invention includes a microphone package configured as described above, a microphone element mounted on the first mounting portion so as to overlap with the through hole in a plan view, and a semiconductor element mounted apart from the through-hole, a lid closing the opening of the upper frame, and a cover having an opening above the microphone element, closing the opening of the lower frame. and a sealing body.

According to one aspect of the microphone package of the present invention, the first mounting portion is provided on the upper surface of the base in the area including the through hole, and the second mounting portion is provided on the lower surface of the base in the area adjacent to the through hole. have. In other words, the microphone element and the semiconductor element can be separately mounted on the first mounting portion and the second mounting portion positioned with the base portion interposed therebetween, and the respective functional portions are located on opposite sides of each other with the base portion interposed therebetween. can be mounted facing the Furthermore, the through-holes are located on the upper surface side of the base and on the lower surface side of the base. and a stepped portion provided on the inner surface of the through hole on the side of the second mounting portion . Therefore, it is possible to provide a microphone package that facilitates effectively reducing the possibility of electromagnetic interaction between the microphone element and the semiconductor element.

According to the microphone device of one aspect of the present invention, since it includes the microphone package having the above configuration, the possibility of electromagnetic interaction between the microphone element and the semiconductor element is effectively reduced. , improvement of the SN (signal-noise) ratio, etc., can be provided.

1 is a cross-sectional view showing a microphone package and a microphone device according to an embodiment of the present invention; FIG. FIG. 2 is a cross-sectional view of the microphone package and the microphone device shown in FIG. 1 taken along line AA; FIG. 3 is a cross-sectional view showing a first modification of the microphone package and the microphone device shown in FIG. 1; 2 is a cross-sectional view showing a second modification of the microphone package and microphone device shown in FIG. 1; FIG. FIG. 8 is a cross-sectional view showing a third modification of the microphone package and the microphone device shown in FIG. 1; FIG. 8 is a cross-sectional view showing a fourth modification of the microphone package and microphone device shown in FIG. 1; It is a schematic diagram which shows the effect of the microphone apparatus of embodiment of this invention.

A microphone package and a microphone device according to embodiments of the present invention will be described with reference to the accompanying drawings. It should be noted that the distinction between top and bottom in the following description is for convenience of explanation, and does not limit the top and bottom when the microphone package or microphone device is actually used.

FIG. 1 is a sectional view showing a microphone package and a microphone device according to an embodiment of the present invention. FIG. 2 is a cross-sectional view of the microphone package and the microphone device shown in FIG. 1, taken along line AA.

A flat base 1 having an upper surface and a lower surface opposite to the upper surface, an upper frame 2 positioned on the upper surface of the base 1, and a lower frame 3 positioned on the lower surface of the base 1, A base portion as the microphone device 10 is configured. The upper surface of the base 1 includes a first mounting portion 1a, and the lower surface of the base 1 includes a second mounting portion 1b. Further, the base 1 has a through hole 1c extending from the upper surface to the lower surface (that is, in the thickness direction). The first mounting portion 1a is, for example, a portion of the upper surface of the base portion 1 on which the microphone element 4 is mounted, and the second mounting portion 1b is, for example, a portion of the lower surface of the base portion 1 on which the semiconductor integrated circuit element 5 is mounted. be.

That is, the base portion 1 has a through hole 1c penetrating in the thickness direction, and has mounting portions on the upper and lower surfaces where the upper and lower openings of the through hole 1c are located. In the following description, the first mounting portion 1a and the second mounting portion 1b may be simply referred to as mounting portions without distinguishing between them. Also, the semiconductor integrated circuit element 5 is simply referred to as a semiconductor element 5 . The semiconductor element 5 is, for example, an ASIC (application specific integrated circuit).

A microphone device 20 is basically configured by mounting a microphone element 4 and a semiconductor element 5 on a microphone package 10 . In the microphone device 20 , the opening of the upper frame portion 2 (the opening above the base portion) is covered with a lid 6 . The opening of the lower frame portion 3 (opening on the lower side of the base portion) is covered with a sealing body 7 . The sealing body 7 closes the opening of the lower frame portion 3 , but the lid body 6 has an opening portion 6 a that communicates with the opening of the upper frame portion 2 . External sound information (sound waves) reaches the microphone element 4 through the opening 6a and is converted into an electrical signal by the microphone element 4. FIG. This electrical signal is transmitted to the semiconductor element 5 and subjected to various processing. The through hole 1c of the base 1 has a function of facilitating the conversion of the sound wave into an electric signal. These details of the microphone device 20 will be described later.

The upper frame portion 2 is positioned on the upper surface of the base portion 1 so as to surround the first mounting portion 1a in plan view. Further, the lower frame portion 3 is positioned on the lower surface of the base portion 1 so as to surround the second mounting portion 1b in plan view.

In the example shown in FIGS. 1 and 2, the outer surfaces of the base portion 1, the upper frame portion 2 and the lower frame portion 3 are located on the same plane, and are connected in a so-called flush manner. Also, in this example, the base 1 is integrated with the upper frame 2 and the lower frame 3, respectively. 1 and 2 can be regarded as a form having recesses (there are no reference numerals for recesses) on the upper and lower surfaces of a rectangular parallelepiped substrate.

According to the microphone package 10 of such an embodiment, the microphone element 4 and the semiconductor element 5 are separately mounted on the first mounting portion 1a and the second mounting portion 1b positioned with the base portion 1 interposed therebetween. can be done. In addition, the microphone element 4 and the semiconductor element 5 can be mounted such that their functional portions face opposite sides of each other with the base portion 1 interposed therebetween. Therefore, it is possible to provide a microphone package 10 that facilitates effectively reducing the possibility of electromagnetic interaction between the microphone element 4 and the semiconductor element 5 .

The functional surface of the microphone element 4 is, for example, a portion that vibrates due to an external sound wave and has a function of capturing this vibration as a change in electrical information such as capacitance. The functional side of the semiconductor element 5 is the side on which a semiconductor integrated circuit having functions such as calculation, memory and electrical connection is located.

The base portion 1, the upper frame portion 2 and the lower frame portion 3 are made of a material such as a ceramic material or an organic resin material. Also, the base portion 1, the upper frame portion 2, and the lower frame portion 3 may be formed of a composite material containing a plurality of types of these materials. Also, the base portion 1, the upper frame portion 2, and the lower frame portion 3 may be made of different materials.

The base portion 1, the upper frame portion 2, and the lower frame portion 3 may be made of a metal material as long as it is not necessary to consider electrical insulation between conductors such as wiring conductors to be described later. together with the above-mentioned ceramic materials and organic resin materials. For example, the upper frame portion 2 and the lower frame portion 3, in which conductors such as wiring conductors for external connection are not arranged, may be made of a metal material.

Examples of the ceramic material include aluminum oxide sintered bodies, aluminum nitride sintered bodies, silicon nitride sintered bodies, mullite sintered bodies and glass ceramic sintered bodies. Further, examples of organic resin materials include epoxy resins, polyimide resins and silicone resins. Examples of metal materials include iron-nickel alloys, iron-nickel-cobalt alloys, copper, copper-based alloys, and stainless steel.

The base portion 1, the upper frame portion 2 and the lower frame portion 3 can be manufactured as follows if they are made of a ceramic material such as an aluminum oxide sintered body. First, raw material powders such as aluminum oxide, silicon oxide, calcium oxide and magnesium oxide are kneaded together with an organic solvent and a binder to prepare a slurry. Next, after molding this slurry into a sheet by a method such as a doctor blade method, the sheet is cut into a predetermined shape and size to produce a plurality of green sheets. This shape is, for example, a frame shape or a flat plate shape, and a through portion corresponding to the through hole 1c is also formed in the green sheet by a method such as punching using a die. After that, these green sheets are laminated one above the other as required and fired at a temperature of about 1300-1600°C. Through the above steps, the base portion 1, the upper frame portion 2 and the lower frame portion 3 can be manufactured.

The base 1, the upper frame 2 and the lower frame 3 can be manufactured as follows if they are made of a ceramic material such as epoxy resin. First, an uncured resin raw material is filled in molds having the shapes of the base portion 1, the upper frame portion 2, and the lower frame portion 3, respectively. Thereafter, the base portion 1, the upper frame portion 2, and the lower frame portion 3 can be manufactured by a method of heating and curing the uncured resin material in the mold.

Moreover, the upper frame portion 2 and the lower frame portion 3 can be manufactured as follows if they are made of a metal material such as an iron-nickel-cobalt alloy. First, a plate-shaped or block-shaped metal raw material is prepared. After that, the raw material is subjected to metal processing such as rolling, cutting, cutting, polishing and etching to obtain a desired shape and size. The upper frame portion 2 and the lower frame portion 3 can be manufactured by the above method.

As described above, the microphone device 20 of the embodiment of the present invention includes the microphone package 10 configured as described above, the microphone element 4 mounted on the first mounting portion 1a so as to overlap the through hole 1c in plan view, The second mounting portion has a semiconductor element 5 mounted away from the through hole. The microphone device 20 also includes a cover 6 that closes the opening of the upper frame 2 and has an opening 6a above the microphone element 4, and a sealing body 7 that closes the opening of the lower frame 3. It has

The microphone element 4 is housed in a container surrounded by the base 1 , the upper frame 2 and the lid 7 . External sound information (sound waves) reaches the microphone element 4 housed in the container through the opening 6 a of the lid 6 . The microphone element 4 is, for example, a MEMS element, and has a microfabricated diaphragm on the upper surface of a semiconductor substrate. A sound wave entering the container through the opening 6a vibrates the diaphragm, and the vibration is converted into an electric signal by a change in capacitance or the like. That is, the diaphragm or the like, which is the functional surface of the microphone element 4, faces upward.

The through hole 1c of the base 1 has a function of facilitating conversion of this sound into an electrical signal. Therefore, the first mounting portion 1a is set in a region including the through hole 1c. That is, the microphone element 4 is mounted on the portion where the through hole 1c is present. Since the through hole 1 c is provided on the lower side of the microphone element 4 , the space below the diaphragm or the like is relatively large so as to include the portion surrounded by the lower frame portion 3 . As a result, the volume change rate of the space below the microphone element 4 due to vibration is reduced, and the vibration of the diaphragm is facilitated. In other words, the microphone device 20 can effectively capture sound waves and convert them into electric signals, which is advantageous for improving sensitivity.

In other words, the microphone package 10 and the microphone device 20 of the embodiment are provided below the microphone element 4 with the lower surface of the base 1 and the inner surface of the lower frame 3 as a space for facilitating the detection of sound waves. It has an enclosed space.

Further, the microphone package 10 and the microphone device 20 of the embodiment can accommodate the semiconductor element 5 in the space as described above. Therefore, it is easy to increase the detection sensitivity of sound waves, and it is possible to effectively reduce the size in a plan view.

The through-hole 1 c has a circular shape in plan view, for example, and has a circumference located inside the outer edge of the microphone element 4 . That is, it is set so that the through hole 1c is included in the microphone element 4 in plan view. With such a configuration, it is possible to enhance the effects of improving the sensitivity of detecting sound waves and reducing the size of the microphone element 4 as described above.

The through hole 1c is not limited to a circular shape in a plan view, and may be a square shape, a square shape with arc-shaped corners, an elliptical shape, or a combination of these shapes. Further, the through hole 1c may have the above-described shape in plan view, and may have a deformed portion such as unevenness on a part of the side or circumference. These shapes can be appropriately set according to conditions such as characteristics of the microphone element 4 to be used, application of the microphone device 20, desired sensitivity and productivity.

Since the microphone device 20 of the embodiment has the effects as described above, it is advantageous in ease of implementation in a small electronic device such as a mobile phone, improvement in voice sensitivity during a call, and reduction in noise. be able to.

As described above, the semiconductor element 5 performs various operations using electrical signals generated by conversion of sound waves by the microphone element 4 . This manipulation includes, for example, amplification, recording (recording), and radio transmission. For example, the amplified electrical signal is transmitted to a speaker and converted (demodulated) into sound again.

The microphone element 4 and the semiconductor element 5 are electrically connected to each other by wiring conductors 9 arranged on the base 1, the upper frame 2 and the lower frame 3, for example. The wiring conductor 9 also functions as a conducting path that electrically connects the semiconductor element 5 and an external electric circuit. In addition, in FIG. 1 and the like, only a portion of the wiring conductor 9 located on the lower surface of the lower frame portion 3, that is, on the outer surface is shown. This portion functions as a pad for connection with an external electric circuit.

Moreover, those of the wiring conductors 9 on the part other than the lower surface of the lower frame portion 3 are located, for example, from the upper surface of the base portion 1 to the lower surface of the base portion 1 through the base portion 1 in the thickness direction. In the example shown in FIG. 1 and the like, the microphone element 4 is electrically connected to a portion of the wiring conductor 9 located on the upper surface of the base 1 via a bonding wire or the like. A semiconductor element 5 is electrically connected to a portion of the wiring conductor 9 located on the lower surface of the base 1 via a bonding wire or the like. Thereby, the microphone element 4 and the semiconductor element 5 are electrically connected to each other. An electric signal (external sound wave, voice information) converted by the microphone element 4 is transmitted to the semiconductor element 5 through the wiring conductor 9, and after various operations are performed in the semiconductor element 5, it is transmitted through the wiring conductor 9 to the outside. It is transmitted to an electrical circuit (such as the speaker mentioned above).

The wiring conductor 9 is made of a metal material appropriately selected from metal materials such as molybdenum, manganese, tungsten, magnesium, copper, silver, palladium, gold, platinum, nickel, cobalt, and chromium. If the wiring conductor 9 is made of manganese and molybdenum, for example, it can be produced as follows. First, powder of a metal material containing manganese and molybdenum is kneaded with an organic solvent and a binder to prepare a metal paste. Next, this metal paste is printed in a predetermined pattern on the surface of the green sheet, which will be the substrate portion such as the base 1, by a method such as screen printing. After that, this metal paste is fired at a predetermined temperature to be baked onto the surface of the base 1 or the like, or fired together with the green sheet. Through the steps described above, the wiring conductor 9 can be formed on the base portion such as the base portion 1 .

The wiring conductor 9 may further have a plated layer of nickel, gold, or the like on its exposed surface. The plating layer can suppress oxidation corrosion of the wiring conductor 9 and improve properties such as solder wettability. If the base portion such as the base portion 1 is made of a resin material, for example, a copper thin film layer is attached to the surface of the resin material (the base portion 1, etc.), and a copper plating layer or the like is attached thereto ( The wiring conductor 9 can be formed by a so-called thickening method or the like.

FIG. 3 is a sectional view showing a first modification of the microphone package 10 and the microphone device shown in FIG. In this example, the through hole 1c is located on the upper surface side of the base portion 1 and on the lower surface side of the base portion 1, and is included in the first through portion 1ca in plan view. 2 through portions 1cb. The first through portion 1ca is larger in plan view than the second through portion 1cb, and is connected to the second through portion 1cb that penetrates from a part of the bottom to the lower surface of the base portion 1 . In other words, the through hole 1c has a stepped portion (the stepped portion is not labeled) on the inner surface according to the difference in size in plan view between the first through portion 1ca and the second through portion 1cb. there is

In this case, the connection between the upper surface side and the lower surface side of the base portion 1 is restricted to a narrower range at the step portion. Therefore, interference between the microphone element 4 located on the upper surface side of the base 1 and the semiconductor element 5 located on the lower surface side of the base 1 can be further reduced. In addition, it is possible to reduce the influence of external air entering the container through the opening 6a on the semiconductor integrated circuit element 5 positioned on the lower surface side of the base 1. FIG.

The base 1 including the stepped portion can be manufactured, for example, by the following method. That is, in the manufacturing process of the base portion 1 described above, the base portion 1 is manufactured by laminating and firing a plurality of green sheets, and the opening dimensions of the through portions provided in the respective green sheets are made different from each other. be able to. A stepped portion can be provided in the through hole 1c according to the difference in the opening size of the through portion.

In the example shown in FIG. 3, the through hole 1c has a smaller opening size on the lower side (the horizontal surface of the step faces upward), but the reverse is also possible. In the form shown in FIG. 3, since the opening of the through hole 1c on the side of the microphone element 4 is relatively large, it is advantageous in providing a relatively large space immediately below the microphone element 4 to facilitate vibration of the diaphragm. . It is also advantageous in that a relatively large area for mounting the semiconductor element 5 on the lower surface side of the base portion 1 can be secured.

The dimension (opening dimension) of the through-hole 1c including the stepped portion in plan view is, for example, a portion with a large opening diameter of 0.3 to 1.0 mm in diameter, and a portion with a small opening diameter of about 0.1 to 0.5 mm in diameter. .

In addition, the microphone package 10 and the microphone device 20 of the embodiment may further include a ground conductor layer 8 located inside the base 1 along the upper and lower surfaces. When the ground conductor layer 8 is positioned on the base portion 1, the effect of reducing electromagnetic interference between the upper surface side and the lower surface side of the base portion 1 can be enhanced.

In this case, the ground conductor layer 8 may cover the entire base portion 1 in plan view, or may cover only the first mounting portion 1a, the second mounting portion 1b, and their surroundings. If the ground conductor layer 8 covers substantially the entire area of the base 1 in plan view, the effect of reducing the electromagnetic interference can be enhanced. Further, if the ground conductor layer 8 includes a non-formed portion in a part of the base 1 in plan view, it is advantageous for improving the adhesion between the insulating layers forming the base 1 .

The ground conductor layer 8 can be formed, for example, by using the same metal material as the wiring conductor 9 and by the same method. The ground conductor layer 8 may be electrically led out to the upper surface of the upper frame portion 2 or the lower surface of the lower frame portion 3 or the like via wiring for grounding (not shown). The stability of the ground potential in the ground conductor layer 8 may be improved by electrically connecting this lead-out portion to the external ground potential.

1 to 3, the base portion 1, the upper frame portion 2 and the lower frame portion 3 are integrated. If the base portion 1, the upper frame portion 2 and the lower frame portion 3 are made of a ceramic material, the base portion 1, the upper frame portion 2 and the lower frame portion 3, which are formed as a laminate of green sheets, are fired simultaneously to form the base body. part is manufactured. In this case, it can also be considered that the base portion is configured by a rectangular parallelepiped ceramic sintered body having concave portions at the top and bottom.

When the base portion 1, the upper frame portion 2 and the lower frame portion 3 are integrated, it is advantageous in terms of improving the mechanical strength of the base portion. It is also advantageous in improving the productivity of the base portion. Further, in the process of mounting the microphone element 4 and the semiconductor element 5 on the upper and lower surfaces of the base 1, the microphone element 4 and the semiconductor element 5 are surrounded and protected by the upper frame portion 2 and the lower frame portion 3. It is possible to effectively reduce the possibility that the microphone element 4 and the semiconductor element 5 will accidentally collide with other processing equipment and be damaged in the step of joining the lid body 6 and the sealing body 7 (described later). That is, it is advantageous for manufacturing a microphone device 20 with high reliability.

In the microphone package 10 and the microphone device 20 of the above-described embodiments, the lid 6 and the sealing body 7 are made of, for example, the same ceramic material as the base 1, the upper frame 2 and the lower frame 3, organic It can be made of a material appropriately selected from resin materials and metal materials. The material constituting the lid 6 and the sealing body 7 may be the same kind of material as the base 1, the upper frame 2 and the lower frame 3, or may be a different material.

The lid body 6 and the sealing body 7 are attached to the frame-shaped upper surface of the upper frame portion 2 and the lower frame portion 3 by a bonding material (not shown) such as a brazing material such as silver solder, a glass material, or an organic resin adhesive. is joined to the frame-shaped lower surface of the When the joining surfaces of the lid body 6 and the sealing body 7 and the frame-shaped upper surface of the upper frame part 2 and the lower surface of the lower frame part 3 are made of a ceramic material, when these are joined by a brazing material, A base metal layer for brazing may be provided in advance on the joint surface. The base metal layer can be formed, for example, by using the same metal material as the wiring conductor 9 described above and by the same method.

The opening 6a of the lid 6 is formed by, for example, mechanically punching or drilling a metal material or a ceramic material (including the state of a green sheet) that serves as the lid 6. can do. The opening 6a can also be formed by a method such as etching or laser processing. This processing method can be appropriately selected according to the type of material forming the lid 6, the shape and size of the opening 6a, and the like.

FIG. 4 is a sectional view showing a second modification of the microphone package 10 and the microphone device 20 shown in FIG. In FIG. 4, the same parts as those in FIG. 1 are given the same reference numerals. In the example shown in FIG. 4 , the base portion 1 and the upper frame portion 2 are separate bodies, and the frame-shaped lower surface of the upper frame portion 2 is joined to the outer peripheral portion of the upper surface of the base portion 1 . This bonding can be performed, for example, by using the same bonding material as in the above-described bonding between the cover 6 and the like and the base portion such as the upper frame portion 2 and the same method. Also in this example, as in the example shown in FIG. 1, the possibility of electromagnetic interaction between the microphone element 4 and the semiconductor element 5 can be effectively reduced.

Moreover, in the example shown in FIG. 4, the upper frame part 2 and the lid body 6 are integrated. The microphone element 3 is mounted on the microphone package 10 by joining the upper frame portion 2 to the base portion 1 on which the microphone element 4 is mounted. That is, in the example shown in FIG. 4, for example, after the microphone element 4 and the semiconductor element 5 are mounted on the upper surface and the lower surface of the base 1 respectively, the sealing body is placed on the lower surface of the lower frame 3 integrated with the base 1. 7 are joined, and the upper frame portion 2 (integrated with the lid 6) is joined to the upper surface of the base portion 1. As shown in FIG. The microphone device 20 can be manufactured by the above steps.

In the case of the form shown in FIG. 4, since the position and mounting state of the microphone element 4 after mounting (before joining the upper frame portion 2) can be easily seen, the mounting state of the microphone element 4 can be easily inspected. In addition, since the upper frame portion 2 and the lid 6 can be integrally made of, for example, a metal material, the opening 6a will not be blocked due to positional deviation of the lid 6 . In addition, it is advantageous for improving productivity.

FIG. 5 is a cross-sectional view showing a third modification of the microphone package 10 and the microphone device 20 shown in FIG. In FIG. 5, parts similar to those in FIG. 1 are given the same reference numerals. In the example shown in FIG. 5 , the base portion 1 and the lower frame portion 3 are separate bodies, and the frame-shaped upper surface of the lower frame portion 3 is joined to the outer peripheral portion of the lower surface of the base portion 1 . This bonding can be performed, for example, by using the same bonding material as used for bonding the sealing body 7 and the like to the base portion such as the lower frame portion 3, and by the same method. Also in this example, the possibility of electromagnetic interaction between the microphone element 4 and the semiconductor element 5 can be effectively reduced.

Moreover, in the example shown in FIG. 5, the lower frame part 2 and the sealing body 7 are integrated. The semiconductor element 4 is mounted on the microphone package 10 by joining the lower frame portion 3 to the base portion 1 on which the semiconductor element 5 is mounted. That is, in the example shown in FIG. 5, for example, after mounting the microphone element 4 and the semiconductor element 5 respectively on the upper and lower surfaces of the base 1, the cover 6 is mounted on the upper surface of the upper frame 2 integrated with the base 1. are joined, and the lower frame portion 3 (integrated with the sealing body 7) is joined to the lower surface of the base portion 1. As shown in FIG. The microphone device 20 can be manufactured by the above steps.

In the case of the form shown in FIG. 5, it is easy to see the mounted state of the semiconductor element after mounting (before the lower frame portion 3 is joined), so that it is easy to inspect the mounted state of the semiconductor element 5 . Moreover, since no bonding layer is required, the possibility of ground deterioration due to the bonding layer can be reduced.

FIG. 6 is a sectional view showing a fourth modification of the microphone package 10 and the microphone device 20 shown in FIG. In FIG. 6, the same parts as those in FIG. 1 are given the same reference numerals. In the example shown in FIG. 6, similarly to the example shown in FIG. 1, the base portion 1, the upper frame portion 2 and the lower frame portion 3 are integrated, and the separate lid body 6 and sealing body 7 are joined to this. ing. In the example shown in FIG. 6 , the opening of the lower frame portion 3 (dimension in plan view) is larger than the opening of the upper frame portion 2 . In other words, with respect to the rectangular parallelepiped base portion, the opening dimension of the lower concave portion is larger than that of the upper concave portion in plan view. Also in this example, the possibility of electromagnetic interaction between the microphone element 4 and the semiconductor element 5 can be effectively reduced. Moreover, in this case, the microphone element 4 and the semiconductor element 5 can be further separated in the horizontal direction, so that the effect of reducing the electromagnetic interaction can be enhanced.

In this case, the volume of the space existing on the side of the lower frame portion 3, that is, on the side of the diaphragm of the microphone element 4 can be made relatively large. Therefore, it is easy to vibrate the diaphragm and improve the detection sensitivity of the sound wave. For example, when the microphone device 20 is installed in a mobile phone, the microphone device 20 can be advantageous in terms of improving the accuracy of calling or voice recognition.

FIG. 7 schematically shows an example of the effect of reducing the electromagnetic influence between the microphone element 4 and the semiconductor element 5 in the microphone device 20 including the microphone package 10 of each of the above embodiments. FIG. 7 is a schematic diagram illustrating the effect of the microphone device 20 of the embodiment of the invention. The microphone device 20 shown in FIG. 7 is the same as the microphone device 20 shown in FIG. 1, but the reference numerals other than the microphone element 4 and the semiconductor element 5 are omitted for clarity. Also, the electromagnetic field EM generated from the integrated circuit, which is the functional portion of the semiconductor element 4, is indicated by a virtual line (chain double-dashed line).

As shown in FIG. 7, the electromagnetic field EM generated by the semiconductor element 5 spreads in the direction opposite to the microphone element 4 . The distance between the functional surface of the semiconductor element 5 and the functional surface of the microphone element 4 is approximately 0.2 mm in the horizontal direction (eg L in FIG. 7), but
H) in the figure is about 1.5 mm or more, which is relatively large. Therefore, the distance between the functional surface of the semiconductor element 5 and the functional surface of the microphone element 4 should be increased about seven times or more compared to the case where the microphone element 4 and the semiconductor element 5 are mounted on the same plane, for example. can be done.

It can be seen that the electromagnetic influence between the semiconductor element 5 and the microphone element 4 can be effectively reduced in the microphone package 10 of the embodiment and the microphone device 20 including the same. Therefore, for example, it is possible to provide the microphone package 10 and the microphone device 20 that facilitate the production of a mobile phone with improved sound wave (voice) recognition accuracy.

Reference Signs List 1 Base portion 1a First mounting portion 1b Second mounting portion 1c Through hole 1ca First through portion 1cb Second through portion 2 Upper frame portion 3 Lower frame 4 Microphone element 5 Semiconductor element 6 Lid 6a Opening 7 Sealing body 8 Ground conductor layer 9 Wiring conductor
10 Package for microphone
20 Microphone device EM Electromagnetic field

Claims (3)

It has a through hole penetrating from the top surface to the bottom surface, has a first mounting portion in a region including the through hole on the top surface, and has a second mounting portion in a region adjacent to the through hole on the bottom surface. a base having
an upper frame portion positioned on the upper surface of the base portion so as to surround the first mounting portion in plan view;
a lower frame portion positioned to surround the second mounting portion in a plan view on the lower surface of the base portion;
The through-hole is located on the upper surface side of the base, and is located on the lower surface side of the base. and a stepped portion provided on the inner surface of the through hole on the side of the second mounting portion ,
The second through portion is arranged to sandwich the stepped portion with the second mounting portion in a plan view, and the microphone is positioned farther from the second mounting portion in the first through portion. package for. 2. The microphone package of claim 1, further comprising a ground conductor layer positioned within said base along said top and bottom surfaces. a microphone package according to claim 1 or claim 2;
a microphone element mounted on the first mounting portion so as to overlap with the through hole in plan view;
a semiconductor element mounted away from the through hole on the second mounting portion;
a lid that closes the opening of the upper frame and has an opening above the microphone element;
and a sealing body closing the opening of the lower frame.

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