CN1838348A - Passive element packaging structure and making method thereof - Google Patents
Passive element packaging structure and making method thereof Download PDFInfo
- Publication number
- CN1838348A CN1838348A CN 200510056960 CN200510056960A CN1838348A CN 1838348 A CN1838348 A CN 1838348A CN 200510056960 CN200510056960 CN 200510056960 CN 200510056960 A CN200510056960 A CN 200510056960A CN 1838348 A CN1838348 A CN 1838348A
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- China
- Prior art keywords
- substrate
- passive device
- passive
- device module
- housing
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Links
- 238000004806 packaging method and process Methods 0.000 title claims description 16
- 238000005538 encapsulation Methods 0.000 claims abstract description 19
- 229910052718 tin Inorganic materials 0.000 claims abstract description 15
- ATJFFYVFTNAWJD-UHFFFAOYSA-N tin hydride Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 15
- 239000000758 substrate Substances 0.000 claims description 31
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000011265 semifinished product Substances 0.000 claims description 10
- 230000000875 corresponding Effects 0.000 claims description 7
- 239000003990 capacitor Substances 0.000 claims description 4
- 235000015110 jellies Nutrition 0.000 claims description 2
- 239000008274 jelly Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims 1
- 239000007769 metal material Substances 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 7
- 210000000056 organs Anatomy 0.000 abstract 3
- 238000005516 engineering process Methods 0.000 description 14
- 238000010586 diagram Methods 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000009413 insulation Methods 0.000 description 4
- 240000001439 Opuntia Species 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 239000006071 cream Substances 0.000 description 3
- 239000012467 final product Substances 0.000 description 3
- 230000001186 cumulative Effects 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005755 formation reaction Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006011 modification reaction Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Abstract
This invention relates to a passive organ encapsulation structure and its making method, which includes a base board, multiple passive organs, a ball grid array and a casing, wherein the passive organs is arranged on the first surface of the base board, multiple tin balls is welded on the second surface of the base board by the ball grid array technique, the casing has a opening which covers and seals the base board to make the second surface of the base board expose at the opening of the casing.
Description
Technical field
The present invention system is about a kind of passive element packaging structure and its related production thereof, especially about a kind of ball grid array (Ball Grid Array, BGA) formed passive element packaging structure of encapsulation technology and its related production thereof of utilizing.
Background technology
The result of modern science and technology advanced IT application exploitation, people to the demand of information processing also with increase, in order to handle and transmit huge data rapidly, usually need be with the electronic equipment of various precisions.Yet along with the demand of the change of lifestyle and society, electronic equipment and electronic component are all towards the trend development of compact, multi-functional, high-performance and high speed.
In the various elements that many electronic products comprised, mainly can divide into two classes: active member and passive device.So-called active member meaning promptly can be carried out the element of data computing, processing, comprising integrated circuit (IC) chip miscellaneous; And some electronic component can't be carried out any computing to the current signal that passes through, just its signal strength is amplified, or merely allow current signal pass through, this class component is so-called passive device, passive device is the essential characteristic that can not influence signal, the circuit element that only makes signal pass through and do not changed, the most common be exactly resistance, electric capacity, inductance, and rheostat etc.Metal wire resistor, fixed carbon resister are for example arranged, reach chip-resistance etc. about active component; Transformer, coil are for example arranged, reach multilayer ceramic inductance etc. about inductive part; Mica capacitor, ceramic condenser, electrochemical capacitor are for example arranged, reach laminated ceramic electric capacity etc. about capacitive part.
Recently along with the fast development of semiconductor technology, passive device is for the miniaturization of adapting device, laborsavingization, and multifunction, and therefore, each element manufacturer does one's utmost especially for the applicating and exploitation of the encapsulating structure of passive device.
With the encapsulating structure of transformer module, please refer to Figure 1A and Figure 1B.Figure 1A shows the preceding schematic diagram of known transformer module encapsulation.Figure 1B is for showing the end view after known transformer module encapsulates.Shown in Figure 1A and Figure 1B, known transformer module 10 comprises a transformer 12 and a printed circuit board (PCB) 20.The internal structure of transformer 12 is wound with the coil (not shown) of multilayer, and after 14 encapsulation of insulation housing, only exposed many electrical pin (pin) 16 are in the outside.Have on the printed circuit board (PCB) 20 and the electrical identical and corresponding through hole (throughhole) 22 of pin 16 numbers, behind pairing through hole 22 on the electrical pin 16 insertion printed circuit board (PCB)s 20 of transformer 12, scolding tin is promptly finished the making flow process of transformer module 10 on solder joint 18.Yet, in the manufacture process of reality, the through hole 22 of printed circuit board (PCB) 20 is with the formation of holing of machining mode, because through hole 22 formed position on printed circuit board (PCB) 20 needs critically and pairing electrical pin 16 contrapositions, as easy as rolling off a log generation bit errors when a large amount of production and produce the defective products of transformer module 10 is not inconsistent production cost requirement really.
In order to solve the above problems, technique known is utilized surface mount technology, and (SurfaceMounting Technology SMT) makes transformer module, please refer to Fig. 2 A and Fig. 2 B.Fig. 2 A system shows the schematic diagram before another known transformer module encapsulation.Fig. 2 B is the end view after the transformer module of displayed map 2A encapsulates.Shown in 2A and Fig. 2 B, transformer module 30 comprises a transformer 32 and a printed circuit board (PCB) 40.The internal structure of transformer 32 also is wound with the coil (not shown) of multilayer, after 34 encapsulation of insulation housing, only extends many electrical pins 36 of Z font by two sides of insulation shell 34.Utilize surface mount technology on printed circuit board (PCB) 40, to be coated with last layer tin cream 38, again transformer 32 is positioned over and scribbles tin cream 38 places on the printed circuit board (PCB) 40, then, send the transformer 32 and the assembly of printed circuit board (PCB) 40 in the high temperature brazier tin cream 38 on the heating fusion printed circuit board (PCB) 40, make that the electrical pin 36 of transformer 32 closely is attached on the printed circuit board (PCB) 40, so promptly finish the making flow process of transformer module 30.
Though the encapsulation procedure of transformer module 30 solved transformer module 10 need extra on printed circuit board (PCB) boring and with electrically at the problem of position, yet, because of electrical pin is to be configured on the printed circuit board (PCB) by transformer two side direction with expanding outward, so, its shared space is bigger, do not met the requirement of small-sized component now, and when the required electrical increase in demand of user, the electrical pin 36 of transformer module 30 also needs to increase thereupon, also can't be issued to preferable structural design in the confined space.
Summary of the invention
Therefore, for addressing the above problem, the present invention proposes a kind of BGA Package technology of utilizing makes the encapsulating structure of passive device obtain minimum cumulative volume under identical semi-finished product situation.
For this reason, the invention provides a kind of passive element packaging structure, it comprises a substrate, a plurality of passive device, a ball grid array and a housing, these a plurality of passive devices are to be disposed on the first surface of this substrate, many tin balls then are welded on the second surface of this substrate with the ball grid array technology, this housing has opening covering and encapsulates this substrate, makes this second surface of this substrate be exposed to outside this opening of this housing.
A kind of passive device module of another purpose system's proposition of the present invention, it is to utilize the BGA Package technology so that the electric connection of passive device module to be provided, when the user has bigger electrical demand, only need increase passive device and tin nodule number order gets final product, it not only keeps the cumulative volume of original module, and structural design is also greatly simplified, and reduces production costs.
For this reason, the invention provides a kind of passive device module, it comprises a substrate, a plurality of passive device, a ball grid array and a housing, these a plurality of passive devices are to be disposed on the first surface of this substrate, many tin balls then are welded on the second surface of this substrate with the ball grid array technology, this housing has opening covering and encapsulates this substrate, makes this second surface of this substrate be exposed to outside this opening of this housing.
A further object of the present invention system proposes a kind of method for packing of passive device, makes to have under the semi-finished product of identical passive element packaging structure, has minimum mounting structure.
For this reason, the invention provides a kind of method for packing of passive device, comprise the following steps: at first, a substrate is provided, this substrate has a corresponding first surface and a second surface; Then, a plurality of passive devices of configuration on this first surface, and with the ball grid array technology, many tin ball bondings are connected to this second surface, and form semi-finished product; At last, utilize a housing with an opening that these semi-finished product are covered and encapsulation, make this second surface of this substrate be exposed to outside this opening of this housing, and then finish the encapsulation of this passive device.
For above and other objects of the present invention, feature and advantage can be become apparent, a preferred embodiment cited below particularly, and conjunction with figs. are described in detail below:
Description of drawings
Figure 1A shows the preceding schematic diagram of known transformer module encapsulation.
Figure 1B is the end view that shows after known transformer module encapsulates.
Fig. 2 A system shows the schematic diagram before another known transformer module encapsulation.
Fig. 2 B is the end view after the transformer module of displayed map 2A encapsulates.
Fig. 3 A and Fig. 3 B system show the schematic diagram of transformer module of the present invention.
Fig. 4 A system shows the schematic diagram before transformer packaging structure of the present invention carries out encapsulation step.
Fig. 4 B system demonstration transformer packaging structure of the present invention is finished the schematic diagram of encapsulation step.
Embodiment
For the structure that makes passive element packaging structure of the present invention and preparation method thereof and principle obtain describing in detail, following passive device will be with transformer as embodiment to set forth spirit of the present invention.
Please refer to Fig. 3 A and Fig. 3 B.Fig. 3 A and Fig. 3 B system show the schematic diagram of transformer module of the present invention.Shown in Fig. 3 A and Fig. 3 B, transformer module of the present invention comprises a substrate 50 and a plurality of ring-type iron core 60,66,70 and 76.
Be wound with the above coil windings 62 of two circles on the iron core 60,66,70 and 76 with primary side and second siding ring as transformer.Substrate 50 is a printed circuit board (PCB) (Printed CircuitBoard; PCB) it has a corresponding first surface 52 and a second surface 82, at first, the sheet metal 54 that disposes plurality of copper or copper alloy material on first surface 52 is with the weld tabs as welding coil windings 62, then, the primary side and the secondary side leading-out terminal of coil windings 62 on iron core 60,66,70 and 76 are welded in different sheet metal 54, at last, on second surface 82, be configured to ball grid array (Ball Grid Array again; BGA) a plurality of tin balls 80 of being welded of technology, each tin ball 80 can correspond to a sheet metal 54, and the number of sheet metal 54 is more than or equal to the number of tin ball 80 on the second surface 82 on the first surface 52.
Since the ball grid array technology can be on second surface 82 spot welding form the tin nodule number group of very high density, so, when the electrical increase in demand of transformer, the number that only need increase iron core gets final product, again the leading-out terminal of coil windings 62 on iron core 60,66,70 and 76 is welded on the different sheet metal 54 and gets final product, again by tin ball 80 and its electric connection to meet the electrical demand of transformer module.
Please refer to Fig. 4 A and Fig. 4 B.Fig. 4 A system shows the schematic diagram before transformer packaging structure of the present invention carries out encapsulation step.Fig. 4 B system demonstration transformer packaging structure of the present invention is finished the schematic diagram of encapsulation step.Shown in Fig. 4 A and 4B, after making, promptly finishes aforesaid transformer module the semi-finished product of transformer packaging structure of the present invention, then, utilize a housing 90 with an opening 92 to cover and encapsulate aforesaid transformer module, make the second surface 82 of this half-finished substrate 50 be exposed to outside the opening 92, housing 90 can be metal shell or plastic casing, so, promptly finishes the making flow process of transformer packaging structure 100 of the present invention.In addition, transformer packaging structure of the present invention also can be filled a jelly between housing 90 and this semi-finished product before these semi-finished product of encapsulation, made passive device generation insulation effect on the first surface 52 of substrate 50.
What specify is that the coil windings of twining on the ring-type iron core of the present invention can be general wire coil, also can be the enamelled wire that is coated with insulating varnish.In addition, passive device of the present invention also is not limited in the transformer of the iron core that twines two groups of above coil windings, and it also can be and twines one group of coil windings on the iron core, or is other passive devices such as resistor, capacitor.
Though the present invention discloses as above with a preferred embodiment; right its is not in order to limit the present invention; the technical staff in described field; without departing from the spirit and scope of the present invention; should be used for a variety of modifications and variations, so protection scope of the present invention is as the criterion when looking to define in the appending claims.
Claims (16)
1. passive device module comprises:
One substrate has a corresponding first surface and a second surface;
A plurality of passive devices are disposed on this first surface of this substrate; And
A plurality of contacts are distributed in this second surface of this substrate.
2. passive device module as claimed in claim 1, wherein this substrate is a printed circuit board (PCB).
3. passive device module as claimed in claim 1, wherein this passive device comprises iron core, resistor or capacitor.
4. passive device module as claimed in claim 3, wherein this iron core structure in the form of a ring.
5. passive device module as claimed in claim 3, wherein this iron core twines at least one circle coil windings, so that the electrical of this passive device module to be provided.
6. as 5 described passive device modules of claim the, wherein this coil windings is enamelled wire or wire coil.
7. passive device module as claimed in claim 5, wherein this substrate includes the multi-disc sheet metal in addition, is formed on this first surface with the weld tabs as this substrate.
8. passive device module as claimed in claim 7, wherein this at least one circle coil windings has at least two leading-out terminals, is welded on the different sheet metal.
9. passive device module as claimed in claim 7, wherein each contact can a corresponding sheet metal.
10. passive device module as claimed in claim 7, wherein the number of this multi-disc sheet metal is more than or equal to the number of this contact.
11. passive device module as claimed in claim 1, wherein these a plurality of contacts are the tin ball, are welded in this second surface in the ball grid array mode.
12. a passive element packaging structure comprises:
One substrate has a corresponding first surface and a second surface;
A plurality of passive devices are disposed on this first surface of this substrate;
A plurality of contacts are distributed in this second surface of this substrate; And
One housing in order to cover and to encapsulate this substrate, makes this second surface of this substrate be exposed to outside this housing.
13. passive element packaging structure as claimed in claim 12, wherein this housing system makes with metal material or plastic material.
14. the method for packing of a passive device comprises the following steps:
One substrate is provided, and this substrate has a corresponding first surface and a second surface;
The a plurality of passive devices of configuration on this first surface;
Dispose a plurality of contacts in this second surface, to form semi-finished product; And
Utilize a housing that these semi-finished product are covered and encapsulation, make this second surface of this substrate be exposed to outside this housing, and then finish the encapsulation of this passive device.
15. method for packing as claimed in claim 14, other comprises:
Before this half-finished step of encapsulation, fill a jelly between this housing and this semi-finished product.
16. method for packing as claimed in claim 14, wherein these a plurality of contacts are to be welded in this second surface in the ball grid array mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510056960 CN1838348A (en) | 2005-03-24 | 2005-03-24 | Passive element packaging structure and making method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510056960 CN1838348A (en) | 2005-03-24 | 2005-03-24 | Passive element packaging structure and making method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1838348A true CN1838348A (en) | 2006-09-27 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200510056960 Pending CN1838348A (en) | 2005-03-24 | 2005-03-24 | Passive element packaging structure and making method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1838348A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104135139A (en) * | 2013-05-03 | 2014-11-05 | 胜美达电机（香港）有限公司 | Power supply module |
-
2005
- 2005-03-24 CN CN 200510056960 patent/CN1838348A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104135139A (en) * | 2013-05-03 | 2014-11-05 | 胜美达电机（香港）有限公司 | Power supply module |
| US10080297B2 (en) | 2013-05-03 | 2018-09-18 | Sumida Electric (H.K.) Company Limited | Power supply module |
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |