CN203691210U - Integrated packaging power supply - Google Patents
Integrated packaging power supply Download PDFInfo
- Publication number
- CN203691210U CN203691210U CN201320861171.4U CN201320861171U CN203691210U CN 203691210 U CN203691210 U CN 203691210U CN 201320861171 U CN201320861171 U CN 201320861171U CN 203691210 U CN203691210 U CN 203691210U
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- Prior art keywords
- power supply
- winding
- magnetic device
- integration packaging
- control section
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- Expired - Lifetime
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 54
- 238000004804 winding Methods 0.000 claims abstract description 52
- 230000003321 amplification Effects 0.000 claims abstract description 5
- 238000003199 nucleic acid amplification method Methods 0.000 claims abstract description 5
- 230000002093 peripheral effect Effects 0.000 claims abstract description 5
- 230000010354 integration Effects 0.000 claims description 44
- 239000000463 material Substances 0.000 claims description 29
- 238000000465 moulding Methods 0.000 claims description 29
- 230000008878 coupling Effects 0.000 claims description 21
- 238000010168 coupling process Methods 0.000 claims description 21
- 238000005859 coupling reaction Methods 0.000 claims description 21
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 7
- 230000004888 barrier function Effects 0.000 claims description 6
- 229910000859 α-Fe Inorganic materials 0.000 claims description 4
- 239000000696 magnetic material Substances 0.000 claims description 3
- 230000008901 benefit Effects 0.000 abstract description 3
- 239000005022 packaging material Substances 0.000 abstract 3
- 238000000034 method Methods 0.000 description 8
- 238000010276 construction Methods 0.000 description 7
- 238000005538 encapsulation Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/645—Inductive arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
- H01F2017/048—Fixed inductances of the signal type with magnetic core with encapsulating core, e.g. made of resin and magnetic powder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19042—Component type being an inductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19102—Disposition of discrete passive components in a stacked assembly with the semiconductor or solid state device
- H01L2924/19104—Disposition of discrete passive components in a stacked assembly with the semiconductor or solid state device on the semiconductor or solid-state device, i.e. passive-on-chip
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
The utility model discloses an integrated packaging power supply, comprising a control portion, a magnetic device and a connecting portion; wherein the control portion comprises a control chip, a power tube and a peripheral circuit, the control chip generates a high-frequency signal, the power tube performs power amplification to the high-frequency signal; the magnetic device comprises windings and a packaging material, the windings and the packaging material have combined action to form the magnetic device; the connecting portion is used for providing support, and realizing electrical connection between the control portion and the magnetic device. The integrated packaging power supply of the utility model takes full advantage of the whole space structure of an integrated packaging area, and forms the magnetic device through combined action of the windings and the packaging material, thereby increasing inductance of the magnetic device within a finite volume, increasing an overcurrent capability of the winding, reducing a PCB footprint of the power magnetic device, reducing the volume of the integrated packaging power supply, reducing the thickness of a power supply, raising power density, and raising competitiveness of products.
Description
Technical field
The utility model relates to power technique fields, particularly relates to a kind of integration packaging power supply.
Background technology
Along with industry-by-industry development such as communication, broadband networks, require electric supply system volume more and more less, power density is more and more higher.Given this, the numerous and confused release of each power supply producer will be controlled the Discrete device packaging such as IC, power MOSFET, capacitance-resistance, magnetic device together, can be used as the integration packaging power module that an entirety is called.
Taking non-insulating power supply module as example, the structure of the integration packaging power supply of prior art as depicted in figs. 1 and 2, comprises three major parts: a) the integrated control section 2 of control chip, power MOSFET and capacitance resistance ware; B) ferrite or the ferrocart core power inductor 3 of moulding of tradition; C) lead frame or other product structures 1 control section 2 and power inductance 3 being realized to electrical connection and provided support for it.
Integration packaging power supply shown in Fig. 1, is done the as a whole user of confession and is called fixed- type 1,2,3 combinations by encapsulating material.For the control section 2 that improves power MOSFET integrated dispels the heat, as shown in Figure 3, integration packaging power supply maximum height is determined by the maximum height of power inductor in Fig. 13 structure after conventionally having encapsulated.
12 representatives of Fig. 2 dashed middle line left side comprise power inductor, input, the contour device portions of output filter capacitor, and dotted line right side 11 represents the low device portions such as control device, power MOSFET, little capacitor-resistor unit.
But the magnetic device that the integration packaging power supply of prior art uses has the shortcoming that volume is large, sensibility reciprocal is little, the general through-current capability of winding is little.
Utility model content
The technical problems to be solved in the utility model is to provide a kind of integration packaging power supply, the problem that magnetic device volume is large, sensibility reciprocal is little, the general through-current capability of winding is little using in order to solve the integration packaging power supply of prior art.
For solving the problems of the technologies described above, on the one hand, the utility model provides a kind of integration packaging power supply, comprises control section, magnetic device and coupling part;
Described control section comprises control chip, power tube and peripheral circuit, and described control chip produces high-frequency signal, and described power tube carries out power amplification to described high-frequency signal;
Described magnetic device comprises winding and encapsulating material, forms magnetic device by winding and encapsulating material acting in conjunction;
Described coupling part is used for providing support, and realizes the electrical connection of described control section and magnetic device.
Further, a part for described winding be positioned at described control section directly over space.
Further, the winding of described magnetic device is one or is made up of multiple windings that intercouple together.
Further, the winding of described magnetic device forms by multiple simplex winding are parallel, has two terminals that connect for user that expose after each simplex winding has encapsulated.
Further, on the splicing ear of the device of described control section and the electrical lead wire of described coupling part, contain insulating barrier, for increasing the resistance coefficient between described splicing ear and electrical lead wire and described encapsulating material.
Further, described power tube is power MOSFET or pliotron.
Further, described coupling part is printed circuit board (PCB) or lead frame.
Further, also comprise moulding magnetic elements, described moulding magnetic elements is connected with described control section by described coupling part, and is packaged in described encapsulating material.
Further, described moulding magnetic elements is made up of ferrite or ferrocart core magnetic material.
Further, described moulding magnetic elements is single or multiple power inductances, single or multiple transformer, single or multiple inductance and transformer coupled magnetic elements.
Further, on described moulding magnetic elements surface and pin electrical terminal, contain insulating barrier, for the resistance coefficient between moulding magnetic elements surface and pin electrical terminal and described encapsulating material described in increasing.
The utility model beneficial effect is as follows:
The utility model takes full advantage of the whole space structure in integration packaging region, form magnetic device by winding and encapsulating material acting in conjunction, in limited bulk, increase magnetic device sensibility reciprocal, strengthen winding overcurrent capability, what reduced power magnetic device accounts for plate area, has reduced the volume of integration packaging power supply, has reduced power supply thickness, improve power density, promoted product competitiveness.
Brief description of the drawings
Fig. 1 is the structure chart of the integration packaging power supply of prior art;
Fig. 2 is the front view of Fig. 1;
Fig. 3 is the perspective view after the integration packaging power package of Fig. 1 completes;
Fig. 4 is the structure chart of a kind of integration packaging power supply of the utility model embodiment;
Fig. 5 is the perspective view after the integration packaging power package of Fig. 4 completes;
Fig. 6 is a kind of structure chart of the integration packaging power supply of moulding magnetic elements that comprises of the utility model embodiment;
Fig. 7 is that the utility model embodiment winding construction does not close envelope, reserve expose pin terminals by user select as required connect winding construction schematic diagram;
Fig. 8 increases the structural representation of moulding magnetic elements on Fig. 7 basis.
Embodiment
The problem that magnetic device volume is large, sensibility reciprocal is little, the general through-current capability of winding is little using in order to solve the integration packaging power supply of prior art, the utility model provides a kind of integration packaging power supply, below in conjunction with accompanying drawing and six embodiment, the utility model is further elaborated.Should be appreciated that specific embodiment described herein, only in order to explain the utility model, does not limit the utility model.
Taking non-isolated product as example, as shown in Figure 4, the perspective view after its encapsulation as shown in Figure 5 for the structure of a kind of integration packaging power supply of the utility model embodiment.With reference to Fig. 4 and Fig. 5, the integration packaging power supply of the present embodiment comprises control section 2, magnetic device and coupling part 1.
Described control section comprises control chip, power tube and peripheral circuit, and described control chip produces high-frequency signal, and described power tube carries out power amplification to described high-frequency signal; Described power tube can power MOSFET, also can adopt pliotron.
Described magnetic device comprises winding 5 and encapsulating material 6, forms magnetic device by winding 5 and encapsulating material 6 actings in conjunction.A part for winding 5 described in the present embodiment be positioned at described control section 2 directly over space.On the electrical lead wire of the splicing ear of the device of described control section 2 and described coupling part 1, also can adopt insulating barrier, for increasing the resistance coefficient between described splicing ear and electrical lead wire and described encapsulating material 6.
Described coupling part 1 is for providing support, and realizes the electrical connection of described control section 2 and magnetic device, and in the present embodiment, described coupling part adopts printed circuit board (PCB).
Magnetic elements in existing packaging power product is i.e. moulding completely before encapsulation, and the magnetic elements in packaging power product does not have moulding or there is no complete moulding before encapsulation described in the present embodiment, after encapsulation, winding and encapsulating material acting in conjunction form power magnetic device.
In the present embodiment, winding 5 is half turn inductor winding structure, what provide is a kind of preferred embodiment, when concrete application, can change arbitrarily as required winding construction or be formed by several winding constructions that intercouple together, better utilize low device in space on the plate of whole integration packaging power supply product and system directly over space segment, increase inductance sensibility reciprocal, strengthen winding wire diameter to increase winding through-current capability, to reduce inductance volume, further reduce the integrated packaging power small product size of non-isolation, the market competitiveness of improving product.
The structure of the another kind of integration packaging power supply of the utility model embodiment as shown in Figure 6, compared with embodiment 1, the present embodiment also comprises moulding magnetic elements 7, described moulding magnetic elements 7 is connected with described control section 2 by described coupling part 1, and is packaged in described encapsulating material.
In the present embodiment, described moulding magnetic elements is made up of the magnetic material such as ferrite or ferrocart core, represents magnetic elements monomer, many bodies or assembly that the various those skilled in the art such as single or multiple power inductances, single or multiple transformer, single or multiple inductance and transformer coupled magnetic elements understand.
In the present embodiment, on moulding magnetic elements 7 surfaces and pin electrical terminal, can adopt insulating barrier, for the resistance coefficient between moulding magnetic unit 7 surfaces of device and pin electrical terminal and described encapsulating material described in increasing.
The structure of the another kind of integration packaging power supply of the utility model embodiment as shown in Figure 7, wherein the winding of magnetic device forms by two simplex winding 8,9 are parallel, after having encapsulated, each simplex winding has two terminals that connect for user that expose, user can be connected in parallel or serially these terminals as required, to reach needed sensibility reciprocal or through-current capability.
The integration packaging power supply of the present embodiment, specific implementation process can also pass through to control the formula of local encapsulating material, after encapsulation completes, the object that magnetic elements sensibility reciprocal is high or anti-saturation ability is strong being combined to form to reach part winding and encapsulating material.
The structure of a kind of integration packaging power supply of the utility model embodiment as shown in Figure 8, compared with embodiment 3, the present embodiment is on the basis of Fig. 7, increase moulding magnetic elements 7, described moulding magnetic elements 7 is connected with described control section 2 by described coupling part 1, and is packaged in described encapsulating material.Can according to actual needs, determine whether on moulding magnetic elements 7, applying insulating material.
Taking the integration packaging power supply shown in Fig. 4 and Fig. 5 as example, the manufacture method of a kind of integration packaging power supply of the utility model embodiment comprises the following steps:
(1) control section 2 and coupling part 1 are electrically connected, described control section 2 comprises control chip, power tube and peripheral circuit, and described control chip produces high-frequency signal, and described power tube carries out power amplification to described high-frequency signal.While needs, can first be processed this part of devices and electrical lead wire, to increase the resistance coefficient between electrical terminal and the encapsulating material of this part of devices, be carried out the interference effect of shielding magnetic device magnetic flux change to this partial circuit by this processing.
(2) winding 5 and coupling part 1 are electrically connected.A part for described winding 5 be positioned at described control section 2 directly over space.
(3) control section 2, winding 5 and coupling part 1 use encapsulating material 6 are encapsulated.After encapsulation, winding 5 is combined to form power inductor with encapsulating material 6.
The positive overhead part that the method for the present embodiment makes full use of the low device of whole power supply architecture forms inductor, compared with the first moulding of traditional power inductance, reach same inductance value, on the plate that the method power source integral inductance needs, space is less, through-current capability is stronger, thereby reach the object that reduces the integrated packaging power volume of whole non-isolation, increased power density.Described winding and encapsulating material acting in conjunction form magnetic device.
Embodiment 6
For the integration packaging power supply shown in Fig. 6, the manufacture method of the integration packaging power supply of the utility model embodiment, compared with embodiment 5, before encapsulating, has increased moulding magnetic elements and coupling part are electrically connected.While needs, first suitable processing is done in the surface of magnetic element 7 shown in Fig. 6 and pin electrical terminal, to increase this part-structure and encapsulating material resistance coefficient before, this processing is the interference effect to other electronic devices and components in order to shielding magnetic components and parts flux change.When encapsulation by encapsulating material by coupling part in Fig. 61, control section 2, winding 5(5 representative can according to use need the winding construction that changes arbitrarily or by several winding constructions that intercouple together), the magnetic elements 7 of moulding and other need be encapsulated in intrasystem components and parts and combine, form an overall power-supply system, for user.It should be noted that, when magnetic elements 7 does not apply insulating material, after having encapsulated, there is magnetic-coupled relation with the magnetic elements and 7 that encapsulating material acting in conjunction forms in winding construction 5, can determine according to actual needs whether on magnetic elements 7, apply insulating material.
For the integration packaging power supply shown in Fig. 7, Fig. 8, the manufacture method of its manufacture method and above-described embodiment is similar.
The utility model takes full advantage of the whole space structure in integration packaging region, form magnetic device by winding and encapsulating material acting in conjunction, in limited bulk, increase magnetic device sensibility reciprocal, strengthen winding overcurrent capability, what reduced power magnetic device accounts for plate area, has reduced the volume of integration packaging power supply, has reduced power supply thickness, improve power density, promoted product competitiveness.
Although be example object, preferred embodiment of the present utility model is disclosed, it is also possible those skilled in the art will recognize various improvement, increase and replacement, therefore, scope of the present utility model should be not limited to above-described embodiment.
Claims (11)
1. an integration packaging power supply, is characterized in that, comprises control section, magnetic device and coupling part;
Described control section comprises control chip, power tube and peripheral circuit, and described control chip produces high-frequency signal, and described power tube carries out power amplification to described high-frequency signal;
Described magnetic device comprises winding and encapsulating material, forms magnetic device by winding and encapsulating material acting in conjunction;
Described coupling part is used for providing support, and realizes the electrical connection of described control section and magnetic device.
2. integration packaging power supply as claimed in claim 1, is characterized in that, a part for described winding be positioned at described control section directly over space.
3. integration packaging power supply as claimed in claim 2, is characterized in that, the winding of described magnetic device is one or is made up of multiple windings that intercouple together.
4. integration packaging power supply as claimed in claim 2, is characterized in that, the winding of described magnetic device forms by multiple simplex winding are parallel, has two terminals that connect for user that expose after each simplex winding has encapsulated.
5. integration packaging power supply as claimed in claim 1, it is characterized in that, on the splicing ear of the device of described control section and the electrical lead wire of described coupling part, contain insulating barrier, for increasing the resistance coefficient between described splicing ear and electrical lead wire and described encapsulating material.
6. integration packaging power supply as claimed in claim 1, is characterized in that, described power tube is power MOSFET or pliotron.
7. integration packaging power supply as claimed in claim 1, is characterized in that, described coupling part is printed circuit board (PCB) or lead frame.
8. the integration packaging power supply as described in claim 1 to 7 any one, is characterized in that, also comprises moulding magnetic elements, and described moulding magnetic elements is connected with described control section by described coupling part, and is packaged in described encapsulating material.
9. integration packaging power supply as claimed in claim 8, is characterized in that, described moulding magnetic elements is made up of ferrite or ferrocart core magnetic material.
10. integration packaging power supply as claimed in claim 8, is characterized in that, described moulding magnetic elements is single or multiple power inductances, single or multiple transformer, single or multiple inductance and transformer coupled magnetic elements.
11. integration packaging power supplys as claimed in claim 8, it is characterized in that, on described moulding magnetic elements surface and pin electrical terminal, contain insulating barrier, for the resistance coefficient between moulding magnetic elements surface and pin electrical terminal and described encapsulating material described in increasing.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320861171.4U CN203691210U (en) | 2013-12-25 | 2013-12-25 | Integrated packaging power supply |
| PCT/CN2014/077612 WO2014187267A1 (en) | 2013-12-25 | 2014-05-15 | Integrated packaging power source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320861171.4U CN203691210U (en) | 2013-12-25 | 2013-12-25 | Integrated packaging power supply |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203691210U true CN203691210U (en) | 2014-07-02 |
Family
ID=51013068
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320861171.4U Expired - Lifetime CN203691210U (en) | 2013-12-25 | 2013-12-25 | Integrated packaging power supply |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN203691210U (en) |
| WO (1) | WO2014187267A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108417570A (en) * | 2018-05-15 | 2018-08-17 | 深圳市国微电子有限公司 | A kind of power supply module |
| WO2019057182A1 (en) * | 2017-09-21 | 2019-03-28 | Bitmain Technologies Inc. | Calculation board power stage circuit, power supply package unit, and calculation board |
| CN112086442A (en) * | 2019-06-14 | 2020-12-15 | 华为技术有限公司 | Packaging module and metal plate |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008301594A (en) * | 2007-05-30 | 2008-12-11 | Panasonic Corp | Power supply unit |
| US20090057822A1 (en) * | 2007-09-05 | 2009-03-05 | Yenting Wen | Semiconductor component and method of manufacture |
| US7969002B2 (en) * | 2008-10-29 | 2011-06-28 | Maxim Integrated Products, Inc. | Integrated circuit packages incorporating an inductor and methods |
| CN102171825B (en) * | 2011-04-29 | 2013-02-27 | 华为技术有限公司 | Power module and encapsulation and integration method thereof |
| US9070642B2 (en) * | 2011-09-14 | 2015-06-30 | Infineon Technologies Ag | Electronic module |
| CN102790513B (en) * | 2012-07-30 | 2014-12-10 | 华为技术有限公司 | Power supply module and packaging method thereof |
| CN103298258B (en) * | 2013-05-21 | 2016-09-21 | 华为技术有限公司 | Circuit board and there is the power supply change-over device of this circuit board |
-
2013
- 2013-12-25 CN CN201320861171.4U patent/CN203691210U/en not_active Expired - Lifetime
-
2014
- 2014-05-15 WO PCT/CN2014/077612 patent/WO2014187267A1/en active Application Filing
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019057182A1 (en) * | 2017-09-21 | 2019-03-28 | Bitmain Technologies Inc. | Calculation board power stage circuit, power supply package unit, and calculation board |
| RU2729605C1 (en) * | 2017-09-21 | 2020-08-11 | Битмейн Текнолоджиз Инк. | Compute board power stage circuit and compute board |
| US11188131B2 (en) | 2017-09-21 | 2021-11-30 | Bitmain Technologies Inc. | Calculation board power stage circuit, and calculation board |
| CN108417570A (en) * | 2018-05-15 | 2018-08-17 | 深圳市国微电子有限公司 | A kind of power supply module |
| CN112086442A (en) * | 2019-06-14 | 2020-12-15 | 华为技术有限公司 | Packaging module and metal plate |
| US11955891B2 (en) | 2019-06-14 | 2024-04-09 | Huawei Digital Power Technologies Co., Ltd. | Packaged module and metal plate |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2014187267A1 (en) | 2014-11-27 |
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| C14 | Grant of patent or utility model | ||
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Granted publication date: 20140702 |