CN2453614Y - Solid relay - Google Patents
Solid relay Download PDFInfo
- Publication number
- CN2453614Y CN2453614Y CN 00247771 CN00247771U CN2453614Y CN 2453614 Y CN2453614 Y CN 2453614Y CN 00247771 CN00247771 CN 00247771 CN 00247771 U CN00247771 U CN 00247771U CN 2453614 Y CN2453614 Y CN 2453614Y
- Authority
- CN
- China
- Prior art keywords
- power
- printed board
- solid state
- state relay
- pcc
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
The utility model discloses a solid relay, and a printed board assembly and a power assembly are embedded to form the solid relay. Radiating fins of the power assembly are arranged inside and positioned between a printed circuit board and an outer shell. A power element is embedded at a notch of a printed board. The utility model uses the simple structure to obtain performance characteristics which are expected, the cost is low, and the volume is small. A printed board assembly and the power assembly are embedded. The radiating fins of the power assembly are arranged inside and positioned between the printed circuit board and the outer shell, which leads the input of the relay and the surface of the outer shell to be positioned in a regular insulation state.
Description
The utility model relates to a kind of solid state relay, be particularly related to the solid state relay of a kind of printed board assembly and the chimeric configuration structure of (PCC) power, the fin of (PCC) power is built-in, and between printed circuit board and shell, power component is entrenched in the indentation, there of printed board.
The solid state relay that has now, the metal conduction band is all adopted in be electrically connected and the heat radiation of power component of electronic component, and the assembly after the welding is packed in the shell, is cured with epoxide resin encapsulation material.The solid state relay of this structure can be done to such an extent that volume is little, but the processing technology more complicated, production equipments such as welding equipment, moulding pressing equipment, transfer equipment, spot gluing equipment is required than higher, thereby cause the raising of product cost.
The solid state relay that has, ceramic substrate is adopted in be electrically connected and the heat radiation of power component of electronic component, and the assembly after the welding carries out epoxy resin wraps up in sealingization.The resistant to elevated temperatures ability of the solid state relay of this structure is strong, and still, manufacturing needs a whole set of thick film firing equipment, and simultaneously cost of parts is higher, thus the time cause the cost of entire product to improve.
So the purpose of this utility model is to provide a kind of solid state relay, can obtain desired operating characteristic with simple structure, and cheap, volume is little.
For achieving the above object, according to solid state relay of the present utility model, by the chimeric configuration of (PCC) power and printing assembly, the fin of (PCC) power is between printed board and shell, and power component is welded in the indentation, there of printed board.
At this moment, described (PCC) power comprises power component and fin, and power component carries out radiating treatment by being welded on the fin.Assembly is printed in being electrically connected by being welded to constitute on the single face epoxy glass fiber plate of electronic component.
Fig. 1 is the circuit diagram of the solid state relay that relates to of the utility model embodiment; Fig. 2 is the stereogram of the solid state relay that relates to of the utility model embodiment; Fig. 3 is the plane graph of expression printed board assembly; Fig. 4 is the plane graph of expression (PCC) power.
Preferred embodiment of the present utility model is described with reference to the accompanying drawings.
As shown in Figure 1, the solid state relay that relates to of an embodiment of the present utility model comprises electric coupling A1, controllable silicon A2, Chip-R R1, R2, R3, capacitor C 1.Terminal 11 and 12 is the inputs that are connected input control signal, and terminal 18 and 19 is the outputs that are connected solid state relay.Input control signal is applied on the LED 13 by resistance R 1, so LED13 sends Infrared, make photosensitive controllable silicon 14 conductings, it is photoelectrical coupler that LED13 and photosensitive controllable silicon 14 are integrated in one, isolation between the input and output is provided, the photosensitive silicon controlled t2 utmost point is connected to the t2 utmost point of controllable silicon A2 and the output 18 of solid state relay by lead 15, and the t1 utmost point of photosensitive controllable silicon 14 is connected to the grid g1 of controllable silicon A2 by lead 16.
The t1 utmost point and the t2 utmost point of controllable silicon A2 are connected to output 18 and 19 by lead 15 and 17 respectively, and the t1 utmost point of A2 is connected by resistance R 2 with the g1 utmost point.Photosensitive controllable silicon 14 makes controllable silicon A2 enter conducting state by the g1 utmost point of control A2, thereby output loading is connected by output 18 and 19, resistance R 3 and capacitor C 1 are serially connected, and also receive on lead 15 and 17 at the two ends after the serial connection, plays the effect of transient suppression interference voltage.
As shown in Figure 2, the solid state relay that relates to of the utility model embodiment comprise shell 21 (as Fig. 2 a), print assembly 22 (as Fig. 2 b), (PCC) power 23 (as Fig. 2 c) and potting compound 24 (as Fig. 2 d).
Printed board assembly 22 and (PCC) power 23 chimeric configurations, (PCC) power 23 power components are navigated to the indentation, there of printed board, fin is close to the back side of printed board, and three leading foots of power component are welded on the printed circuit board, makes (PCC) power 23 and printed board assembly 22 temporarily fixing.Fin is close to the inwall of shell 21 then, and they are packed in the shell 21, is cured with epoxide resin encapsulation material again.
As shown in Figure 3, printed board assembly 22 comprises single-clad board 31, electronic component: photoelectrical coupler 32, lead terminal 33, Chip-R 34a, 34b, 34c and electric capacity 35.Printed circuit board is roughly rectangle, in its upper left corner rectangular indentation is arranged, and is used for the embedding of power component; The material of printed board is the single face epoxy glass fiber plate that the class of insulation reaches the UL94V-0 level.Electronic component is welded in by surface mount and realizes in the printed board being electrically connected.
As shown in Figure 4, (PCC) power 23 comprises fin 41 and controllable silicon 42.Fin 41 is roughly rectangle, has a circular arc chamfering in the lower right corner, increases the creepage distance between input and the output, strengthens the isolating power between input and the output.Controllable silicon 42 is welded to the upper left corner of fin, solves silicon controlled heat dissipation problem effectively.
By such configuration, make product internal structure compactness, dwindled the volume of product; By the insulating effect of printed board, solved input dexterously simultaneously with the isolating problem between the output.Fin is by the thin-walled of shell, and the heat of power component is lost effectively.The cost of parts of entire product is lower, the processing technology maturation, and required conventional production device is so the cost of entire product is lower.
By above explanation as can be known,, can solve the heat radiation and the safety Insulation Problems of power component, realize desired operating characteristic with simple structure according to solid state relay of the present utility model, and cheap.
Claims (3)
1, a kind of solid state relay, the chimeric configuration of printed board assembly and (PCC) power, insert after described assembly combines and use the epoxy resin embedding in the shell, the fin that it is characterized in that its (PCC) power is built-in, between printed circuit board and shell, power component is entrenched in the indentation, there of printed board.
2, solid state relay as claimed in claim 1 is characterized in that printed board is a single face epoxy glass fiber plate, and the fin of (PCC) power is close at its back side.
3, solid state relay as claimed in claim 1 is characterized in that fin is close to the inwall of electric appliance casing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 00247771 CN2453614Y (en) | 2000-08-28 | 2000-08-28 | Solid relay |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 00247771 CN2453614Y (en) | 2000-08-28 | 2000-08-28 | Solid relay |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2453614Y true CN2453614Y (en) | 2001-10-10 |
Family
ID=33606625
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 00247771 Expired - Lifetime CN2453614Y (en) | 2000-08-28 | 2000-08-28 | Solid relay |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2453614Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101867359A (en) * | 2010-06-12 | 2010-10-20 | 陕西群力电工有限责任公司 | Small-sized high-power sealed direct-current solid-state relay |
-
2000
- 2000-08-28 CN CN 00247771 patent/CN2453614Y/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101867359A (en) * | 2010-06-12 | 2010-10-20 | 陕西群力电工有限责任公司 | Small-sized high-power sealed direct-current solid-state relay |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CX01 | Expiry of patent term |
Expiration termination date: 20100828 Granted publication date: 20011010 |