US20140097913A1 - Multi-mode filter - Google Patents
Multi-mode filter Download PDFInfo
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- US20140097913A1 US20140097913A1 US13/647,936 US201213647936A US2014097913A1 US 20140097913 A1 US20140097913 A1 US 20140097913A1 US 201213647936 A US201213647936 A US 201213647936A US 2014097913 A1 US2014097913 A1 US 2014097913A1
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- filter
- dielectric resonator
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/207—Hollow waveguide filters
- H01P1/208—Cascaded cavities; Cascaded resonators inside a hollow waveguide structure
- H01P1/2084—Cascaded cavities; Cascaded resonators inside a hollow waveguide structure with dielectric resonators
- H01P1/2086—Cascaded cavities; Cascaded resonators inside a hollow waveguide structure with dielectric resonators multimode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/2002—Dielectric waveguide filters
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/213—Frequency-selective devices, e.g. filters combining or separating two or more different frequencies
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P7/00—Resonators of the waveguide type
- H01P7/10—Dielectric resonators
- H01P7/105—Multimode resonators
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0231—Capacitors or dielectric substances
Definitions
- the present invention relates to a multi-mode filter.
- Single mode dielectric filters are in widespread use in many communications systems, and are used in both in low power and high power applications within the cellular communications industry.
- duplex filters which are used in many cellular telephone handsets, typically employ single mode dielectric filter technology.
- Single mode dielectric filters typically include a resonator made of a dielectric material such as a ceramic. In many filtering applications a steep roll-off and a wide pass-band bandwidth are desired filter characteristics. In order to achieve these characteristics in a single mode dielectric filter, it is typically necessary to cascade a number of resonators in series. Cascading resonators in this way typically results in a significant increase in the loss in the (wanted) pass-band, due to both the insertion loss of the dielectric material itself (i.e. the dielectric losses within that material) and the coupling losses in transferring energy into and out of the dielectric.
- a multi-mode dielectric filter typically has a steeper roll-off and a wider pass-band bandwidth than an equivalent single-mode dielectric filter could achieve.
- Use of a multi-mode dielectric filter in place of cascaded single mode resonators will typically also result in lower losses, due to the reduction in the number of times the signal needs to be coupled into and out of the dielectric material.
- the invention provides a multi-mode filter comprising: a carrier on which is mounted a dielectric resonator, the dielectric resonator having a covering of an electrically conductive material in which there is provided an aperture; and a coupling structure for coupling input signals to the dielectric resonator or for extracting filtered output signals from the dielectric resonator, wherein the carrier is provided with an enclosing formation of a grounded electrically conductive material, which enclosing formation is electrically coupled to the electrically conductive covering of the dielectric resonator, such that the covering and the enclosing formation together form an electrically conductive enclosure for the dielectric resonator.
- the enclosure formed by the combination of the enclosing formation and the covering of the dielectric resonator has the effect of substantially reducing leakage from the resonator, thereby permitting an improvement in filter characteristics of the filter. Moreover, this improved leakage performance permits the filter to be used in a cascaded filter arrangement without compromising characteristics such as stop band isolation of the cascaded filter arrangement.
- the enclosing formation is preferably electrically grounded.
- the enclosing formation may comprise a continuous or almost continuous formation of electrically conducting material.
- the carrier may be provided with a trench of electrically conductive material which surrounds the resonator in a plane of the carrier, the trench being electrically grounded.
- the trench may comprise a side wall and a base portion, such that the enclosing formation comprises a side wall and a base portion of the trench.
- the carrier may be provided with a conductive layer on which the dielectric resonator is mounted, the conductive layer being electrically coupled to the trench such that the enclosing formation comprises a portion of the conductive layer and the side wall and base portion of the trench.
- the carrier on which the dielectric resonator is mounted may be a first carrier, in which case the filter may comprise a second carrier on which the first carrier is mounted, the second carrier having a groundplane layer to which the enclosing formation is electrically coupled to electrically ground the enclosing formation.
- the enclosing formation may have an aperture generally corresponding to the aperture of the covering of the dielectric resonator, the enclosing formation being electrically coupled to the covering of the dielectric resonator such that the aperture of the covering is aligned with the aperture of the enclosing formation.
- the coupling structure may be electrically coupled to a corresponding contact track provided within the aperture of the enclosing formation.
- the carrier may be of a printed circuit board material.
- a further embodiment of the invention provides a cascaded resonator filter arrangement comprising: a first filter of the type described above and a second filter of the type described above, wherein an output of the first filter is electrically coupled to an input of the second filter.
- the carrier of the first filter and the carrier of the second filter may comprise a single carrier that is common to the first and second filters.
- a further embodiment of the invention provides a duplex or diplex filter comprising a transmit filter according of the type described above and a receive filter of the type described above.
- the carrier of the first filter and the carrier of the second filter may comprise a single carrier that is common to the transmit and receive filters.
- FIG. 1 is a schematic cross-sectional representation of a multi-mode dielectric filter
- FIG. 2 is a schematic cross-sectional representation of a filter arrangement using cascaded resonators
- FIG. 3 is a schematic cross-sectional representation of a filter arrangement using cascaded resonators according to an embodiment of the present invention
- FIG. 4 is a schematic view from below of the arrangement illustrated in FIG. 3 ;
- FIG. 5 is a schematic cross-sectional representation of a filter arrangement using cascaded resonators according to an alternative embodiment of the present invention
- FIG. 6 is a schematic view from below of the arrangement of FIG. 5 ;
- FIG. 7 is a schematic cross-sectional representation of a filter according to an alternative embodiment of the present invention.
- FIG. 8 is a schematic representation of a cascaded filter arrangement using the filter illustrated in FIG. 7 .
- FIG. 1 is a schematic cross-sectional representation of a multi-mode dielectric filter.
- the multi-mode filter (shown generally at 10 ) comprises a dielectric resonator 12 , which in the example is in the form of a generally cuboidal “puck” of dielectric material such as a ceramic material having a high dielectric constant.
- the cuboidal puck of dielectric material 12 is provided on five of its six faces with a coating or covering 14 of an electrically conductive material such as silver or another electrically conductive metal.
- the coating 14 extends also partially over a sixth face 16 of the dielectric material 12 , thereby defining an aperture 18 in the coating 14 on the sixth face 16 .
- One or more coupling structures 20 are provided on the sixth face 16 of the dielectric material to permit a signal to be filtered to be input to the dielectric material 12 and/or to permit filtered output signals to be extracted from the dielectric material 12 .
- the dielectric resonator 12 is mounted on a carrier 22 , which in the example illustrated in FIG. 1 is a printed circuit board (PCB), but which may alternatively be of another dielectric material such as ceramic or glass.
- the PCB has lower and upper groundplane layers 24 , 26 and a central connection layer 28 .
- Lower and upper layers 30 , 32 of PCB dielectric material having a low dielectric constant are disposed between the lower groundplane layer 24 and the central connection layer 28 and between the central connection layer 28 and the upper groundplane layer 26 respectively.
- the upper groundplane layer 26 includes an aperture generally corresponding in shape and size to the aperture 18 in the coating 14 of the dielectric resonator 12 .
- the central connection layer 28 includes an input or output connection track 34 which is electrically connected by means of a via 38 to a PCB connection track 36 disposed within the aperture of the upper groundplane layer 26 , the PCB connection track 26 being electrically isolated from the upper groundplane layer 26 . Further vias 40 electrically connect the upper and lower groundplane layers 24 , 26 .
- the coating 14 of the dielectric resonator 12 is electrically coupled to the upper groundplane 26 of the carrier, and the coupling structure 20 of the dielectric material 12 is electrically coupled to the PCB connection track 36 , which is in turn electrically coupled to the input or output connection track 34 .
- a signal to be filtered can be input to the dielectric resonator 12 or a filtered output signal can be extracted from the dielectric resonator 12 as appropriate by means of the input or output connection track 24 .
- Multi-mode filters such as the one illustrated in FIG. 1 typically have a low cost structure, a low loss and a small size. This is essential in active antenna applications where many filters are required in each active antenna product. For example, a 900 MHz active antenna product typically requires 16 filters. Unless small, low-cost, low-loss filters are used, the product becomes either too heavy or too expensive to be deployed on a large scale.
- Some applications require a sharp roll-off between the pass-band and the stop band(s) of a filter, which may not be realisable using a single filter, even where a multi-mode filter such as that illustrated in FIG. 1 is used. In such applications it is typical to cascade multiple resonators 12 .
- FIG. 2 is a schematic cross-sectional view of a filter arrangement which uses two cascaded resonators.
- first and second dielectric resonators 62 a , 62 b are mounted on a common carrier 64 , in a manner similar to that described above with reference to FIG. 1 .
- each of the dielectric resonators 62 a , 62 b has an apertured coating or covering 66 of an electrically conductive material such as silver or another electrically conductive metal.
- the first and second dielectric resonators 62 a , 62 b are mounted on the carrier such that their coatings electrically couple to an upper groundplane 68 of the carrier 64 .
- the first dielectric resonator 62 a is provided with a coupling structure 70 which is electrically coupled to a PCB connection track 72 of the carrier 64 to permit a filtered output signal to be extracted from the first dielectric resonator 62 a .
- the second dielectric resonator 62 b is provided with a coupling structure 74 which is electrically coupled to a PCB connection track 76 of the carrier 64 to permit a signal to be filtered to be input to the second dielectric resonator 62 b .
- the PCB connection tracks 72 and 76 are each connected to a common connector track 78 by vias 80 , such that a signal extracted from the first dielectric resonator 62 a is input to the second dielectric resonator 62 b for further filtering.
- the required filter characteristics can be realised using the cascaded dielectric resonators 62 a , 62 b.
- One disadvantage of the cascaded dielectric resonator arrangement illustrated in FIG. 2 is that the overall filter losses due to the insertion loss within the dielectric resonators 62 a , 62 b and the coupling losses in transferring energy into and out of the dielectric resonators 62 a , 62 b is too high for some applications, such as diplexers for use in transceivers. It can also be difficult to achieve sufficient isolation between the individual dielectric resonators 62 a , 62 b in a cascaded arrangement of the type illustrated in FIG.
- leakage may also occur between the transmit and receive portions of the filter.
- the filter 100 is made up of two generally similar dielectric resonators 102 a , 102 b , each being formed as a generally cuboidal puck of a dielectric material such as a ceramic having a high dielectric constant.
- Each of the dielectric resonators 102 a , 102 b has a coating or covering of an electrically conductive material such as silver or another electrically conductive metal.
- the coating 104 extends over all six faces of the dielectric resonators 102 a , 102 b , although apertures 106 a , 106 b are provided in the coating 104 in one face (shown as the lower face in FIG. 3 ) of each of the dielectric resonators 102 a , 102 b , to permit connections to be made to the dielectric material of the dielectric resonators 102 a , 102 b.
- the first and second dielectric resonators 102 a , 102 b are mounted on a common carrier 108 , which may be, for example, a printed circuit board (PCB), but which may alternatively be of another dielectric material such as ceramic or glass.
- the carrier 108 has an upper conductive layer 110 of a conductive material such as copper, lower and upper groundplane layers 112 , 114 and a central connection layer 116 .
- Lower and upper layers 118 , 120 of PCB dielectric material having a low dielectric constant are disposed between the lower groundplane layer 112 and the central connection layer 116 and between the central connection layer 116 and the upper groundplane layer 114 respectively.
- a further layer 122 of dielectric material such as PCB material, ceramic or glass is disposed between the upper groundplane layer 114 and the upper conductive layer 110 .
- the upper conductive layer 110 is provided with apertures 111 a , 111 b which correspond generally in shape and size to the apertures 106 a , 106 b of the dielectric resonators 102 a , 102 b . It will be appreciated that the apertures 111 a , 111 b in the upper conductive layer 110 need not correspond exactly to the apertures 106 a , 106 b of the dielectric resonators 102 a , 102 b . For example, the apertures 106 a , 106 b of the dielectric resonators 102 a , 102 b may be slightly larger than the apertures 111 a , 111 b in the upper conductive layer 326 .
- the lower faces of the first and second dielectric resonators 102 a , 102 b are mounted on the upper conductive layer 110 , with the apertures 106 a , 106 b in the coatings 104 of the dielectric resonators 102 a , 102 b aligned with the apertures 111 a , 111 b in the upper conductive layer 110 , such that that portion of the electrically conductive coatings 104 which surrounds each of the apertures 106 a , 106 b electrically couples the coatings 104 of the dielectric resonators 102 a , 102 b to the upper conductive layer 110 of the carrier 108 .
- the first dielectric resonator 102 a is provided with one or more coupling structures 124 which are electrically coupled to one or more corresponding PCB connection tracks 126 provided within the aperture 111 a of the upper conductive layer 110 of the carrier 108 , to permit a signal to be filtered to be input to the first dielectric resonator 102 a , and/or to permit a filtered output signal to be extracted from the first dielectric resonator 102 a .
- the second dielectric resonator 102 b is provided with one or more coupling structures 128 which are electrically coupled to PCB connection tracks 130 provided within the aperture 111 b of the upper conductive layer 110 of the carrier 108 , to permit a signal to be filtered to be input to the second dielectric resonator 102 b , and/or to permit a filtered output signal to be extracted from the second dielectric resonator 102 b .
- the PCB connection tracks 126 and 130 are each connected to a common connector track 132 by vias 134 , such that a signal extracted from the first dielectric resonator 102 a is input to the second dielectric resonator 102 b for further filtering.
- the upper conductive layer 110 of the carrier 108 is formed with first and second trenches 136 a , 136 b of an electrically conductive material such as copper which presents a low impedance to radio frequency currents.
- the trenches 136 a , 136 b surround the lower faces of the first and second dielectric resonators 102 a , 102 b in the plane of the upper conductive layer 110 , as can be seen more clearly from FIG. 4 , and extending from an upper surface of the upper conductive layer 110 into the carrier 108 .
- Each of the first and second trenches 136 a , 136 b has a base portion 138 which is positioned adjacent the upper groundplane 114 , and is electrically coupled to the upper groundplane 114 by means of vias 140 or by directly bonding the base portion 138 of the trench 136 a , 136 b to the upper groundplane 114 , for example using a conductive bond such as solder, or plating using an electroplating process.
- a conductive bond such as solder, or plating using an electroplating process.
- the combination of the upper conductive layer 110 , side walls 142 and base portions 138 of the trenches 136 a , 136 b and the upper groundplane 114 forms respective first and second continuous electrically conductive enclosing formations, as shown in dashed outline at 144 a and 144 b .
- These electrically conductive enclosing formations 144 a , 144 b are electrically grounded by virtue of the upper groundplane 114 , and are electrically coupled to the electrically conductive coatings 104 of the first and second dielectric resonators 102 a , 102 b , and thus the first and second dielectric resonators 102 a , 102 b are substantially enclosed in respective first and second grounded electrically conductive enclosures made up of the coatings 104 and the respective first and second enclosing formations 144 a , 144 b .
- the trenches 136 a , 136 b take the form of open-topped channels with a generally rectangular cross-section, but it will be appreciated that the same effect can be achieved using trenches of any cross-sectional shape, for example a trench with a generally U-shaped cross-section, such that the base portion is curved, a trench having a generally V-shaped cross-section, or a trench with substantially parallel sides and a base portion having a generally V-shaped cross-section.
- FIG. 5 is a schematic cross-sectional view of an alternative arrangement of cascaded dielectric resonators forming a filter 200 .
- the filter 200 is made up of two generally similar dielectric resonators 202 a , 202 b , each being formed as a generally cuboidal puck of a dielectric material such as a ceramic having a high dielectric constant.
- Each of the dielectric resonators 202 a , 202 b has a coating or covering of an electrically conductive material such as silver or another electrically conductive metal.
- the coating 204 extends over all six faces of the dielectric resonators 202 a , 202 b , although apertures 206 a , 206 b are provided in the coating 204 in one face (shown as the lower face in FIG. 5 ) of each of the dielectric resonators 202 a , 202 b , to permit connections to be made to the dielectric material of the dielectric resonators 202 a , 202 b.
- the first and second dielectric resonators 202 a , 202 b are mounted on a common carrier 208 , which may be, for example, a printed circuit board (PCB), but which may alternatively be of another dielectric material such as ceramic or glass.
- the carrier has an upper conductive layer 210 of a conductive material such as copper, a lower groundplane layer 212 and a central connection layer 214 .
- Lower and upper layers 216 , 218 of dielectric material such as PCB material, ceramic or glass are disposed between the lower groundplane layer 212 and the central connection layer 214 and between the central connection layer 214 and the upper conductive layer 210 respectively.
- the upper groundplane layer 210 is provided with apertures 211 a , 211 b which generally correspond in shape and size to the apertures 206 a , 206 b of the dielectric resonators 202 a , 202 b . It will be appreciated that the apertures 211 a , 211 b in the upper groundplane layer 210 need not correspond exactly to the apertures 206 a , 206 b of the dielectric resonators 202 a , 202 b . For example, the apertures 206 a , 206 b of the dielectric resonators 202 a , 202 b may be slightly larger than the apertures 211 a , 211 b in the upper groundplane layer 210 .
- the lower faces of the first and second dielectric resonators 202 a , 202 b are mounted on the upper conductive layer 210 , with the apertures 206 a , 206 b of the first and second dielectric resonators 202 a , 202 b aligned with the apertures 211 a , 211 b of the upper groundplane 210 of the carrier 208 , such that that portion of the electrically conductive coatings 204 which surrounds each of the apertures 206 a , 206 b electrically couples the coating 204 of the dielectric resonators 202 a , 202 b to the upper conductive layer 210 of the carrier 208 .
- the first dielectric resonator 202 a is provided with one or more coupling structures 220 which are electrically coupled to one or more corresponding PCB connection tracks 222 disposed within the aperture 211 a of the upper groundplane layer 210 of the carrier 208 to permit a signal to be filtered to be input to the first dielectric resonator 202 a , and/or to permit a filtered output signal to be extracted from the first dielectric resonator 202 a .
- the second dielectric resonator 202 b is provided with one or more coupling structures 224 which are electrically coupled to a PCB connection track 226 disposed within the aperture 211 b of the upper groundplane 210 of the carrier 208 to permit a signal to be filtered to be input to the second dielectric resonator 202 b and/or to permit a filtered output signal to be extracted from the second dielectric resonator 202 b .
- the PCB connection tracks 222 and 226 are each connected to a common connector track 228 by vias 230 , such that a signal extracted from the first dielectric resonator 202 a is input to the second dielectric resonator 202 b for further filtering.
- the carrier 208 is formed with first and second trenches 230 a , 230 b of an electrically conductive material such as copper which presents a low impedance to radio frequency currents.
- the trenches 230 a , 230 b surround the lower faces of the first and second dielectric resonators 202 a , 202 b in the plane of the upper groundplane layer 210 , as can be seen more clearly from FIG. 6 .
- the trenches 230 a , 230 b extend from an upper surface of the upper conductive layer 210 into the carrier 208 through the upper and lower PCB dielectric layers 218 , 216 and the central connection layer 214 , such that a base portion 232 of each trench 230 a , 230 b is positioned adjacent the lower groundplane 212 .
- the base portion 232 of each trench 230 a , 230 b is electrically coupled to the lower groundplane 212 by means of a via 234 or by directly bonding the base portion 232 of the trench 230 a , 230 b to the lower groundplane 212 , for example using a conductive bond such as solder, or plating using an electroplating process.
- the combination of the upper conductive layer 210 , side walls 236 and base portions 232 of the trenches 230 a , 230 b and the lower groundplane 212 forms respective first and second electrically conductive enclosing formations, as indicated in dashed outline at 238 a and 238 b in FIG. 5 .
- These electrically conductive enclosing formations 238 a , 238 b are electrically grounded by virtue of the lower groundplane 212 , and are electrically coupled to the electrically conductive coatings 204 of the first and second dielectric resonators 202 a , 202 b , and thus the first and second dielectric resonators 202 a , 202 b are substantially enclosed in respective first and second grounded electrically conductive enclosures made up of the coatings 204 and the respective first and second enclosing formations 238 a , 238 b .
- the combination of the enclosing formations 238 a , 238 b and the coverings 204 to form the enclosures enclosing the dielectric resonators 202 a , 202 b provides improved performance compared to the filter arrangement of FIG. 2 .
- the example illustrated in FIG. 2 In the example illustrated in FIG.
- the trenches 230 a , 230 b take the form of open-topped channels with a generally rectangular cross-section, but it will be appreciated that the same effect can be achieved using trenches of any cross-sectional shape, for example a trench with a generally U-shaped cross-section, such that the base portion is curved, a trench having a generally V-shaped cross-section, or a trench with substantially parallel sides and a base portion having a generally V-shaped cross-section.
- FIG. 7 is a schematic cross-sectional representation of an alternative dielectric resonator filter 300 .
- the filter 300 uses a single dielectric resonator 302 formed as a generally cuboidal puck of a dielectric material such as a ceramic having a high dielectric constant.
- the dielectric resonator 302 has a coating or covering 304 of an electrically conductive material such as silver or another electrically conductive metal.
- the coating 304 extends over all six faces of the dielectric resonator 302 , although an aperture 306 is provided in the coating 304 in one face (shown as the lower face in FIG. 7 ) of the dielectric resonator 302 , to permit connections to be made to the dielectric material of the dielectric resonator 302 .
- the dielectric resonator 302 is mounted on a first carrier 308 , which in turn is mounted on a second carrier 310 , such that the second carrier 310 may be regarded as a “mother” carrier and the first carrier 308 may be regarded as a “daughter” carrier.
- the second carrier 310 is of a dielectric material such as, for example PCB material, ceramic or glass, having lower and upper groundplane layers 312 , 314 , which are electrically connected by vias 316 , and a central connection layer 318 .
- Lower and upper layers 320 , 322 of dielectric material such as PCB material, ceramic or glass are disposed between the lower groundplane layer 312 and the central connection layer 318 and between the central connection layer 318 and the upper groundplane layer 314 respectively.
- the first carrier 308 comprises a central layer 324 of a dielectric material such as PCB substrate material, ceramic or glass. Disposed on upper and lower faces of the central layer 324 are upper and lower conductive layers 326 , 328 of an electrically conductive material such as copper or another metal which presents a low impedance to radio frequency currents.
- the lower conductive layer 328 is disposed on and electrically coupled to the upper groundplane layer 314 of the second carrier 310 .
- the central layer 324 of the first carrier 310 also has walls 330 of an electrically conductive material such as copper or another metal, which are electrically coupled to the upper and lower conductive layers 326 , 328 .
- the upper conductive layer 326 is provided with an aperture 332 of a shape and size generally corresponding to the aperture 306 in the coating 304 of the dielectric resonator 302 . It will be appreciated that the aperture 332 in the upper conductive layer 326 need not correspond exactly to the aperture 306 in the coating 304 of the dielectric resonator 302 . For example, the aperture 306 in the coating 304 may be slightly larger than the aperture 332 in the upper conductive layer 326 .
- the lower face of the dielectric resonator 302 is mounted on the upper conductive layer 326 , with the aperture 306 of the dielectric resonator 302 aligned with the aperture 332 of the upper conductive layer 326 of the first carrier 308 , such that that portion of the electrically conductive coating 304 which surrounds the aperture 306 electrically couples the coating 304 of the dielectric resonator 302 to the upper conductive layer 326 of the first carrier 308 .
- the dielectric resonator 302 is provided with one or more coupling structures 334 which are electrically coupled to one or more corresponding PCB connection tracks 336 disposed within the aperture 332 of the upper conductive layer 326 of the first carrier 308 to permit a signal to be filtered to be input to the dielectric resonator 302 , and/or to permit a filtered output signal to be extracted from the dielectric resonator 302 .
- the PCB connection track 336 is electrically connected to a further PCB connection track 338 provided on the lower conductive layer 328 of the first carrier 308 by a via 340 .
- This further PCB connection track 338 is electrically coupled to a PCB connection pad 342 provided in the upper groundplane layer 314 of the second carrier 310 , which PCB connection pad 342 is electrically coupled to the central connection layer 318 by means of a via 344 , to permit input and output signals to be input to and extracted from the dielectric resonator 302 through the central connection layer 318 .
- the upper conductive layer 326 , the lower conductive layer 328 and the walls 330 of the first carrier 308 together constitute a continuous electrically conductive enclosing formation, as indicated in dashed outline at 346 .
- This electrically conductive enclosing formation 346 is electrically grounded, by virtue of the electrical connection between the lower conductive layer 328 and the upper groundplane layer 314 of the second carrier 310 , and is electrically coupled to the electrically conductive coating 304 of the dielectric resonators 302 , and thus the dielectric resonator 302 is substantially enclosed in a grounded electrically conductive enclosure made up of the coating 304 and the enclosing formation 346 .
- This grounded electrically conductive enclosure has the effect of enclosing fields (electric or magnetic) present in the dielectric resonator 302 , thus improving isolation of, and reducing leakage from, the dielectric resonator 302 , and thus leads to improved characteristics of the filter 300 in comparison to filters such as that illustrated in FIG. 1 .
- FIG. 8 is a schematic cross-sectional representation of a filter arrangement 400 made up of two cascaded filters of the type described above with reference to FIG. 7 .
- the filter arrangement illustrated in FIG. 8 uses first and second dielectric resonators 402 a , 402 b of the type described above, and so like reference numerals have been used in FIG. 8 to refer to like elements.
- the first and second dielectric resonators 402 a , 402 b are mounted on respective first (“daughter”) carriers 408 a , 408 b , which are in turn mounted on a second carrier 410 .
- the dielectric resonators 402 a , 402 b and the first carriers 408 a , 408 b are of the type described above, and so will not be described again in detail here.
- the second carrier 410 is similar in structure and construction to the second carrier 310 described above, and so will not be described again in detail here. However, the second carrier 410 differs from the second carrier 310 described above in that that the central connection layer 418 is used to connect an output of the first dielectric resonator 402 a to an input of the second dielectric resonator by means of vias 440 a , 444 a and 440 b , 440 b which connect PCB connection tracks 436 a , 436 b to each other, thereby permitting transfer of signals between the first and second dielectric resonators 402 a , 402 b.
- the upper conductive layer 326 , the lower conductive layer 328 and the walls 330 of the first carrier 308 together constitute a continuous electrically conductive enclosing formation, as indicated in dashed outline at 346 .
- This electrically conductive enclosing formation 346 is electrically coupled to the electrically conductive coating 304 of the dielectric resonators 302 , and thus the dielectric resonator 302 is substantially enclosed in a conductive enclosure made up of the coating 304 and the enclosing formation 346 .
- This electrically conductive enclosure has the effect of enclosing fields (electric or magnetic) present in the dielectric resonator 302 , thus improving isolation of, and reducing leakage from, the dielectric resonator 302 , and thus leads to improved characteristics of the filter 300 in comparison to filters such as that illustrated in FIG. 1 .
- this improved isolation and reduced leakage results in improved filter characteristics over known cascaded dielectric resonator arrangements.
- the filter arrangement of the present invention provide improved isolation and reduced leakage, which gives rise to improved filter characteristics and performance, particularly in the cascaded resonator filter arrangements discussed above by reference to FIGS. 3 , 5 and 8 .
- the filter arrangement of the present invention may be employed in a duplex or diplex filter arrangement in which a transmit filter and a receive filter are mounted on a common carrier, by electrically isolating the connecting structures of the transmit and receive structures from each other.
- the improved isolation and reduced leakage of the filter of the present invention gives rise to improved filter characteristics and performance of both the transmit filter and the receive filter.
Abstract
The present invention relates to a multi-mode filter comprising a carrier on which is mounted a dielectric resonator having a covering of an electrically conductive material in which there is provided an aperture and a coupling structure for coupling input signals to the dielectric resonator or for extracting filtered output signals from the dielectric resonator. The carrier is provided with an enclosing formation of electrically conductive material, which enclosing formation is electrically coupled to the electrically conductive covering of the dielectric resonator, such that the covering and the enclosing formation together form an electrically conductive enclosure for the dielectric resonator. The enclosure formed from the covering of the dielectric resonator and the enclosing formation increases the isolation of the filter and reduces leakage. The filter of the present invention is particularly suitable for use in cascaded resonator filter arrangements, and in duplex/diplex filters.
Description
- The present invention relates to a multi-mode filter.
- The reference in this specification to any prior publication (or information derived from it), or to any matter which is known, is not, and should not be taken as an acknowledgment or admission or any form of suggestion that the prior publication (or information derived from it) or known matter forms part of the common general knowledge in the field of endeavour to which this specification relates.
- Single mode dielectric filters are in widespread use in many communications systems, and are used in both in low power and high power applications within the cellular communications industry. In particular, duplex filters, which are used in many cellular telephone handsets, typically employ single mode dielectric filter technology.
- Single mode dielectric filters typically include a resonator made of a dielectric material such as a ceramic. In many filtering applications a steep roll-off and a wide pass-band bandwidth are desired filter characteristics. In order to achieve these characteristics in a single mode dielectric filter, it is typically necessary to cascade a number of resonators in series. Cascading resonators in this way typically results in a significant increase in the loss in the (wanted) pass-band, due to both the insertion loss of the dielectric material itself (i.e. the dielectric losses within that material) and the coupling losses in transferring energy into and out of the dielectric.
- Interest in the use of multi-mode dielectric filters is growing, since these filters allow the same piece of dielectric material (or “puck”) to be effectively re-used multiple times, to form a more complex filter characteristic. A multi-mode dielectric filter typically has a steeper roll-off and a wider pass-band bandwidth than an equivalent single-mode dielectric filter could achieve. Use of a multi-mode dielectric filter in place of cascaded single mode resonators will typically also result in lower losses, due to the reduction in the number of times the signal needs to be coupled into and out of the dielectric material.
- According to some embodiments, the invention provides a multi-mode filter comprising: a carrier on which is mounted a dielectric resonator, the dielectric resonator having a covering of an electrically conductive material in which there is provided an aperture; and a coupling structure for coupling input signals to the dielectric resonator or for extracting filtered output signals from the dielectric resonator, wherein the carrier is provided with an enclosing formation of a grounded electrically conductive material, which enclosing formation is electrically coupled to the electrically conductive covering of the dielectric resonator, such that the covering and the enclosing formation together form an electrically conductive enclosure for the dielectric resonator.
- The enclosure formed by the combination of the enclosing formation and the covering of the dielectric resonator has the effect of substantially reducing leakage from the resonator, thereby permitting an improvement in filter characteristics of the filter. Moreover, this improved leakage performance permits the filter to be used in a cascaded filter arrangement without compromising characteristics such as stop band isolation of the cascaded filter arrangement.
- The enclosing formation is preferably electrically grounded.
- In some embodiments, the enclosing formation may comprise a continuous or almost continuous formation of electrically conducting material.
- The carrier may be provided with a trench of electrically conductive material which surrounds the resonator in a plane of the carrier, the trench being electrically grounded.
- The trench may comprise a side wall and a base portion, such that the enclosing formation comprises a side wall and a base portion of the trench.
- The carrier may be provided with a conductive layer on which the dielectric resonator is mounted, the conductive layer being electrically coupled to the trench such that the enclosing formation comprises a portion of the conductive layer and the side wall and base portion of the trench.
- The carrier on which the dielectric resonator is mounted may be a first carrier, in which case the filter may comprise a second carrier on which the first carrier is mounted, the second carrier having a groundplane layer to which the enclosing formation is electrically coupled to electrically ground the enclosing formation.
- The enclosing formation may have an aperture generally corresponding to the aperture of the covering of the dielectric resonator, the enclosing formation being electrically coupled to the covering of the dielectric resonator such that the aperture of the covering is aligned with the aperture of the enclosing formation.
- The coupling structure may be electrically coupled to a corresponding contact track provided within the aperture of the enclosing formation.
- The carrier may be of a printed circuit board material.
- A further embodiment of the invention provides a cascaded resonator filter arrangement comprising: a first filter of the type described above and a second filter of the type described above, wherein an output of the first filter is electrically coupled to an input of the second filter.
- In this case, the carrier of the first filter and the carrier of the second filter may comprise a single carrier that is common to the first and second filters.
- A further embodiment of the invention provides a duplex or diplex filter comprising a transmit filter according of the type described above and a receive filter of the type described above.
- In this case, the carrier of the first filter and the carrier of the second filter may comprise a single carrier that is common to the transmit and receive filters.
- An example of the present invention will now be described, strictly by way of example, with reference to the accompanying drawings, in which:
-
FIG. 1 is a schematic cross-sectional representation of a multi-mode dielectric filter; -
FIG. 2 is a schematic cross-sectional representation of a filter arrangement using cascaded resonators; -
FIG. 3 is a schematic cross-sectional representation of a filter arrangement using cascaded resonators according to an embodiment of the present invention; -
FIG. 4 is a schematic view from below of the arrangement illustrated inFIG. 3 ; -
FIG. 5 is a schematic cross-sectional representation of a filter arrangement using cascaded resonators according to an alternative embodiment of the present invention; -
FIG. 6 is a schematic view from below of the arrangement ofFIG. 5 ; -
FIG. 7 is a schematic cross-sectional representation of a filter according to an alternative embodiment of the present invention; and -
FIG. 8 is a schematic representation of a cascaded filter arrangement using the filter illustrated inFIG. 7 . -
FIG. 1 is a schematic cross-sectional representation of a multi-mode dielectric filter. In the example illustrated inFIG. 1 , the multi-mode filter (shown generally at 10) comprises adielectric resonator 12, which in the example is in the form of a generally cuboidal “puck” of dielectric material such as a ceramic material having a high dielectric constant. The cuboidal puck ofdielectric material 12 is provided on five of its six faces with a coating or covering 14 of an electrically conductive material such as silver or another electrically conductive metal. Thecoating 14 extends also partially over asixth face 16 of thedielectric material 12, thereby defining anaperture 18 in thecoating 14 on thesixth face 16. One ormore coupling structures 20 are provided on thesixth face 16 of the dielectric material to permit a signal to be filtered to be input to thedielectric material 12 and/or to permit filtered output signals to be extracted from thedielectric material 12. - The
dielectric resonator 12 is mounted on acarrier 22, which in the example illustrated inFIG. 1 is a printed circuit board (PCB), but which may alternatively be of another dielectric material such as ceramic or glass. The PCB has lower andupper groundplane layers central connection layer 28. Lower andupper layers lower groundplane layer 24 and thecentral connection layer 28 and between thecentral connection layer 28 and theupper groundplane layer 26 respectively. Theupper groundplane layer 26 includes an aperture generally corresponding in shape and size to theaperture 18 in thecoating 14 of thedielectric resonator 12. Thecentral connection layer 28 includes an input oroutput connection track 34 which is electrically connected by means of avia 38 to aPCB connection track 36 disposed within the aperture of theupper groundplane layer 26, thePCB connection track 26 being electrically isolated from theupper groundplane layer 26.Further vias 40 electrically connect the upper andlower groundplane layers - With the
dielectric resonator 12 positioned on thecarrier 22 as illustrated inFIG. 1 , thecoating 14 of thedielectric resonator 12 is electrically coupled to theupper groundplane 26 of the carrier, and thecoupling structure 20 of thedielectric material 12 is electrically coupled to thePCB connection track 36, which is in turn electrically coupled to the input oroutput connection track 34. Thus, a signal to be filtered can be input to thedielectric resonator 12 or a filtered output signal can be extracted from thedielectric resonator 12 as appropriate by means of the input oroutput connection track 24. - Multi-mode filters such as the one illustrated in
FIG. 1 typically have a low cost structure, a low loss and a small size. This is essential in active antenna applications where many filters are required in each active antenna product. For example, a 900 MHz active antenna product typically requires 16 filters. Unless small, low-cost, low-loss filters are used, the product becomes either too heavy or too expensive to be deployed on a large scale. - Some applications require a sharp roll-off between the pass-band and the stop band(s) of a filter, which may not be realisable using a single filter, even where a multi-mode filter such as that illustrated in
FIG. 1 is used. In such applications it is typical to cascademultiple resonators 12. - Such an arrangement of cascaded resonators is shown generally at 60 in
FIG. 2 , which is a schematic cross-sectional view of a filter arrangement which uses two cascaded resonators. In the arrangement illustrated inFIG. 2 , first and seconddielectric resonators common carrier 64, in a manner similar to that described above with reference toFIG. 1 . Thus, each of thedielectric resonators dielectric resonators upper groundplane 68 of thecarrier 64. - The first
dielectric resonator 62 a is provided with acoupling structure 70 which is electrically coupled to aPCB connection track 72 of thecarrier 64 to permit a filtered output signal to be extracted from the firstdielectric resonator 62 a. The seconddielectric resonator 62 b is provided with acoupling structure 74 which is electrically coupled to aPCB connection track 76 of thecarrier 64 to permit a signal to be filtered to be input to the seconddielectric resonator 62 b. The PCB connection tracks 72 and 76 are each connected to acommon connector track 78 byvias 80, such that a signal extracted from the firstdielectric resonator 62 a is input to the seconddielectric resonator 62 b for further filtering. In this way, the required filter characteristics can be realised using the cascadeddielectric resonators - One disadvantage of the cascaded dielectric resonator arrangement illustrated in
FIG. 2 is that the overall filter losses due to the insertion loss within thedielectric resonators dielectric resonators dielectric resonators FIG. 2 for the overall filter to achieve its theoretical capabilities, particularly with regard to stop band isolation, as leakage occurs through thecarrier 64 on which the cascadeddielectric resonators - Referring now to
FIG. 3 , an arrangement of cascaded dielectric resonators forming a filter is shown generally at 100. Thefilter 100 is made up of two generally similardielectric resonators dielectric resonators coating 104 extends over all six faces of thedielectric resonators apertures coating 104 in one face (shown as the lower face inFIG. 3 ) of each of thedielectric resonators dielectric resonators - The first and second
dielectric resonators common carrier 108, which may be, for example, a printed circuit board (PCB), but which may alternatively be of another dielectric material such as ceramic or glass. Thecarrier 108 has an upperconductive layer 110 of a conductive material such as copper, lower and upper groundplane layers 112, 114 and acentral connection layer 116. Lower andupper layers lower groundplane layer 112 and thecentral connection layer 116 and between thecentral connection layer 116 and theupper groundplane layer 114 respectively. Afurther layer 122 of dielectric material such as PCB material, ceramic or glass is disposed between theupper groundplane layer 114 and the upperconductive layer 110. - The upper
conductive layer 110 is provided withapertures apertures dielectric resonators apertures conductive layer 110 need not correspond exactly to theapertures dielectric resonators apertures dielectric resonators apertures conductive layer 326. The lower faces of the first and seconddielectric resonators conductive layer 110, with theapertures coatings 104 of thedielectric resonators apertures conductive layer 110, such that that portion of the electricallyconductive coatings 104 which surrounds each of theapertures coatings 104 of thedielectric resonators conductive layer 110 of thecarrier 108. - The first
dielectric resonator 102 a is provided with one ormore coupling structures 124 which are electrically coupled to one or more corresponding PCB connection tracks 126 provided within theaperture 111 a of the upperconductive layer 110 of thecarrier 108, to permit a signal to be filtered to be input to the firstdielectric resonator 102 a, and/or to permit a filtered output signal to be extracted from the firstdielectric resonator 102 a. Similarly, the seconddielectric resonator 102 b is provided with one ormore coupling structures 128 which are electrically coupled to PCB connection tracks 130 provided within theaperture 111 b of the upperconductive layer 110 of thecarrier 108, to permit a signal to be filtered to be input to the seconddielectric resonator 102 b, and/or to permit a filtered output signal to be extracted from the seconddielectric resonator 102 b. The PCB connection tracks 126 and 130 are each connected to acommon connector track 132 byvias 134, such that a signal extracted from the firstdielectric resonator 102 a is input to the seconddielectric resonator 102 b for further filtering. - The upper
conductive layer 110 of thecarrier 108 is formed with first andsecond trenches trenches dielectric resonators conductive layer 110, as can be seen more clearly fromFIG. 4 , and extending from an upper surface of the upperconductive layer 110 into thecarrier 108. Each of the first andsecond trenches base portion 138 which is positioned adjacent theupper groundplane 114, and is electrically coupled to theupper groundplane 114 by means ofvias 140 or by directly bonding thebase portion 138 of thetrench upper groundplane 114, for example using a conductive bond such as solder, or plating using an electroplating process. Thus, as can be seen most clearly inFIG. 3 , the combination of the upperconductive layer 110,side walls 142 andbase portions 138 of thetrenches upper groundplane 114, forms respective first and second continuous electrically conductive enclosing formations, as shown in dashed outline at 144 a and 144 b. These electrically conductive enclosingformations upper groundplane 114, and are electrically coupled to the electricallyconductive coatings 104 of the first and seconddielectric resonators dielectric resonators coatings 104 and the respective first andsecond enclosing formations dielectric resonators dielectric resonators filter 100 in comparison to filters such as that illustrated inFIG. 2 . In the example illustrated inFIG. 3 thetrenches -
FIG. 5 is a schematic cross-sectional view of an alternative arrangement of cascaded dielectric resonators forming afilter 200. As in the embodiment illustrated inFIG. 3 , thefilter 200 is made up of two generally similardielectric resonators dielectric resonators coating 204 extends over all six faces of thedielectric resonators apertures coating 204 in one face (shown as the lower face inFIG. 5 ) of each of thedielectric resonators dielectric resonators - The first and second
dielectric resonators common carrier 208, which may be, for example, a printed circuit board (PCB), but which may alternatively be of another dielectric material such as ceramic or glass. The carrier has an upperconductive layer 210 of a conductive material such as copper, alower groundplane layer 212 and acentral connection layer 214. Lower andupper layers lower groundplane layer 212 and thecentral connection layer 214 and between thecentral connection layer 214 and the upperconductive layer 210 respectively. - The
upper groundplane layer 210 is provided withapertures apertures dielectric resonators apertures upper groundplane layer 210 need not correspond exactly to theapertures dielectric resonators apertures dielectric resonators apertures upper groundplane layer 210. The lower faces of the first and seconddielectric resonators conductive layer 210, with theapertures dielectric resonators apertures upper groundplane 210 of thecarrier 208, such that that portion of the electricallyconductive coatings 204 which surrounds each of theapertures coating 204 of thedielectric resonators conductive layer 210 of thecarrier 208. - The first
dielectric resonator 202 a is provided with one ormore coupling structures 220 which are electrically coupled to one or more corresponding PCB connection tracks 222 disposed within theaperture 211 a of theupper groundplane layer 210 of thecarrier 208 to permit a signal to be filtered to be input to the firstdielectric resonator 202 a, and/or to permit a filtered output signal to be extracted from the firstdielectric resonator 202 a. Similarly, the seconddielectric resonator 202 b is provided with one ormore coupling structures 224 which are electrically coupled to aPCB connection track 226 disposed within theaperture 211 b of theupper groundplane 210 of thecarrier 208 to permit a signal to be filtered to be input to the seconddielectric resonator 202 b and/or to permit a filtered output signal to be extracted from the seconddielectric resonator 202 b. The PCB connection tracks 222 and 226 are each connected to acommon connector track 228 byvias 230, such that a signal extracted from the firstdielectric resonator 202 a is input to the seconddielectric resonator 202 b for further filtering. - The
carrier 208 is formed with first andsecond trenches trenches dielectric resonators upper groundplane layer 210, as can be seen more clearly fromFIG. 6 . Thetrenches conductive layer 210 into thecarrier 208 through the upper and lower PCB dielectric layers 218, 216 and thecentral connection layer 214, such that abase portion 232 of eachtrench lower groundplane 212. Thebase portion 232 of eachtrench lower groundplane 212 by means of a via 234 or by directly bonding thebase portion 232 of thetrench lower groundplane 212, for example using a conductive bond such as solder, or plating using an electroplating process. Thus, the combination of the upperconductive layer 210,side walls 236 andbase portions 232 of thetrenches lower groundplane 212, forms respective first and second electrically conductive enclosing formations, as indicated in dashed outline at 238 a and 238 b inFIG. 5 . These electrically conductive enclosingformations lower groundplane 212, and are electrically coupled to the electricallyconductive coatings 204 of the first and seconddielectric resonators dielectric resonators coatings 204 and the respective first andsecond enclosing formations dielectric resonators dielectric resonators filter 200 in comparison to filters such as that illustrated inFIG. 2 . It will be noted that, in the embodiment illustrated inFIGS. 5 and 6 , thecommon connector track 228 extends through theside walls 236 of thetrenches dielectric resonators formations coverings 204 to form the enclosures enclosing thedielectric resonators FIG. 2 . In the example illustrated inFIG. 5 thetrenches -
FIG. 7 is a schematic cross-sectional representation of an alternativedielectric resonator filter 300. In the arrangement illustrated inFIG. 7 , thefilter 300 uses a singledielectric resonator 302 formed as a generally cuboidal puck of a dielectric material such as a ceramic having a high dielectric constant. Thedielectric resonator 302 has a coating or covering 304 of an electrically conductive material such as silver or another electrically conductive metal. Thecoating 304 extends over all six faces of thedielectric resonator 302, although anaperture 306 is provided in thecoating 304 in one face (shown as the lower face inFIG. 7 ) of thedielectric resonator 302, to permit connections to be made to the dielectric material of thedielectric resonator 302. - The
dielectric resonator 302 is mounted on afirst carrier 308, which in turn is mounted on asecond carrier 310, such that thesecond carrier 310 may be regarded as a “mother” carrier and thefirst carrier 308 may be regarded as a “daughter” carrier. - The
second carrier 310 is of a dielectric material such as, for example PCB material, ceramic or glass, having lower and upper groundplane layers 312, 314, which are electrically connected byvias 316, and acentral connection layer 318. Lower andupper layers lower groundplane layer 312 and thecentral connection layer 318 and between thecentral connection layer 318 and theupper groundplane layer 314 respectively. - The
first carrier 308 comprises acentral layer 324 of a dielectric material such as PCB substrate material, ceramic or glass. Disposed on upper and lower faces of thecentral layer 324 are upper and lowerconductive layers conductive layer 328 is disposed on and electrically coupled to theupper groundplane layer 314 of thesecond carrier 310. Thecentral layer 324 of thefirst carrier 310 also haswalls 330 of an electrically conductive material such as copper or another metal, which are electrically coupled to the upper and lowerconductive layers - The upper
conductive layer 326 is provided with anaperture 332 of a shape and size generally corresponding to theaperture 306 in thecoating 304 of thedielectric resonator 302. It will be appreciated that theaperture 332 in the upperconductive layer 326 need not correspond exactly to theaperture 306 in thecoating 304 of thedielectric resonator 302. For example, theaperture 306 in thecoating 304 may be slightly larger than theaperture 332 in the upperconductive layer 326. The lower face of thedielectric resonator 302 is mounted on the upperconductive layer 326, with theaperture 306 of thedielectric resonator 302 aligned with theaperture 332 of the upperconductive layer 326 of thefirst carrier 308, such that that portion of the electricallyconductive coating 304 which surrounds theaperture 306 electrically couples thecoating 304 of thedielectric resonator 302 to the upperconductive layer 326 of thefirst carrier 308. - The
dielectric resonator 302 is provided with one ormore coupling structures 334 which are electrically coupled to one or more corresponding PCB connection tracks 336 disposed within theaperture 332 of the upperconductive layer 326 of thefirst carrier 308 to permit a signal to be filtered to be input to thedielectric resonator 302, and/or to permit a filtered output signal to be extracted from thedielectric resonator 302. ThePCB connection track 336 is electrically connected to a furtherPCB connection track 338 provided on the lowerconductive layer 328 of thefirst carrier 308 by a via 340. This furtherPCB connection track 338 is electrically coupled to aPCB connection pad 342 provided in theupper groundplane layer 314 of thesecond carrier 310, whichPCB connection pad 342 is electrically coupled to thecentral connection layer 318 by means of a via 344, to permit input and output signals to be input to and extracted from thedielectric resonator 302 through thecentral connection layer 318. - It will be appreciated that the upper
conductive layer 326, the lowerconductive layer 328 and thewalls 330 of thefirst carrier 308 together constitute a continuous electrically conductive enclosing formation, as indicated in dashed outline at 346. This electricallyconductive enclosing formation 346 is electrically grounded, by virtue of the electrical connection between the lowerconductive layer 328 and theupper groundplane layer 314 of thesecond carrier 310, and is electrically coupled to the electricallyconductive coating 304 of thedielectric resonators 302, and thus thedielectric resonator 302 is substantially enclosed in a grounded electrically conductive enclosure made up of thecoating 304 and the enclosingformation 346. This grounded electrically conductive enclosure has the effect of enclosing fields (electric or magnetic) present in thedielectric resonator 302, thus improving isolation of, and reducing leakage from, thedielectric resonator 302, and thus leads to improved characteristics of thefilter 300 in comparison to filters such as that illustrated inFIG. 1 . -
FIG. 8 is a schematic cross-sectional representation of afilter arrangement 400 made up of two cascaded filters of the type described above with reference toFIG. 7 . - The filter arrangement illustrated in
FIG. 8 uses first and seconddielectric resonators FIG. 8 to refer to like elements. The first and seconddielectric resonators carriers second carrier 410. Thedielectric resonators first carriers - The
second carrier 410 is similar in structure and construction to thesecond carrier 310 described above, and so will not be described again in detail here. However, thesecond carrier 410 differs from thesecond carrier 310 described above in that that thecentral connection layer 418 is used to connect an output of the firstdielectric resonator 402 a to an input of the second dielectric resonator by means ofvias dielectric resonators - As in the
single resonator filter 300 illustrated inFIG. 7 , the upperconductive layer 326, the lowerconductive layer 328 and thewalls 330 of thefirst carrier 308 together constitute a continuous electrically conductive enclosing formation, as indicated in dashed outline at 346. This electricallyconductive enclosing formation 346 is electrically coupled to the electricallyconductive coating 304 of thedielectric resonators 302, and thus thedielectric resonator 302 is substantially enclosed in a conductive enclosure made up of thecoating 304 and the enclosingformation 346. This electrically conductive enclosure has the effect of enclosing fields (electric or magnetic) present in thedielectric resonator 302, thus improving isolation of, and reducing leakage from, thedielectric resonator 302, and thus leads to improved characteristics of thefilter 300 in comparison to filters such as that illustrated inFIG. 1 . In thefilter 400 illustrated inFIG. 8 , which uses two cascadeddielectric resonators - It will be appreciated that the filter arrangement of the present invention provide improved isolation and reduced leakage, which gives rise to improved filter characteristics and performance, particularly in the cascaded resonator filter arrangements discussed above by reference to
FIGS. 3 , 5 and 8. Additionally, the filter arrangement of the present invention may be employed in a duplex or diplex filter arrangement in which a transmit filter and a receive filter are mounted on a common carrier, by electrically isolating the connecting structures of the transmit and receive structures from each other. In such an arrangement the improved isolation and reduced leakage of the filter of the present invention gives rise to improved filter characteristics and performance of both the transmit filter and the receive filter.
Claims (14)
1. A multi-mode filter comprising;
a carrier on which is mounted a dielectric resonator, the dielectric resonator having a covering of an electrically conductive material in which there is provided an aperture; and
at least one coupling structure for coupling input signals to the dielectric resonator or for extracting filtered output signals from the dielectric resonator,
wherein the carrier is provided with an enclosing formation of electrically conductive material, which enclosing formation is electrically coupled to the electrically conductive covering of the dielectric resonator, such that the covering and the enclosing formation together form an electrically conductive enclosure for the dielectric resonator.
2. A multi-mode filter according to claim 1 wherein the enclosing formation is electrically grounded.
3. A multi-mode filter according to claim 1 wherein the enclosing formation comprises a continuous or almost continuous formation of grounded electrically conducting material.
4. A multi-mode filter according to claim 3 wherein the carrier is provided with a trench of electrically conductive material which surrounds the resonator in a plane of the carrier, the trench being electrically grounded.
5. A multi-mode filter according to claim 4 wherein the trench comprises a side wall and a base portion, such that the enclosing formation comprises the side wall and the base portion of the trench.
6. A multi-mode filter according to claim 5 wherein the carrier is provided with conductive layer on which the dielectric resonator is mounted, the conductive layer being electrically coupled to the trench such that the enclosing formation comprises a portion of the conductive layer and the side wall and base portion of the trench.
7. A multi-mode filter according to claim 1 wherein carrier on which the dielectric resonator is mounted is a first carrier, the filter comprising a second carrier on which the first carrier is mounted, the second carrier having a groundplane layer to which the enclosing formation is electrically coupled to electrically ground the enclosing formation.
8. A multi-mode filter according to claim 1 wherein the enclosing formation has an aperture generally corresponding to the aperture of the covering of the dielectric resonator, the enclosing formation being electrically coupled to the covering of the dielectric resonator such that the aperture of the covering is aligned with the aperture of the enclosing formation.
9. A multi-mode filter according to claim 8 wherein the coupling structure is electrically coupled to a corresponding contact track provided within the aperture of the enclosing formation.
10. A multi-mode cavity filter according to claim 1 wherein the carrier is of a printed circuit board material, or a ceramic material, or glass.
11. A cascaded resonator filter arrangement comprising:
a first filter according to claim 1 ; and
a second filter according to claim 1 , wherein an output of the first filter is electrically coupled to an input of the second filter.
12. A cascaded resonator filter arrangement according to claim 11 , wherein the carrier of the first filter and the carrier of the second filter comprise a single carrier that is common to the first and second filters.
13. A duplex or diplex filter comprising a transmit filter according to claim 1 and a receive filter according to claim 1 .
14. A duplex or diplex filter according to claim 13 wherein the carrier of the first filter and the carrier of the second filter comprise a single carrier that is common to the transmit and receive filters.
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US13/647,936 US20140097913A1 (en) | 2012-10-09 | 2012-10-09 | Multi-mode filter |
US15/019,178 US9843083B2 (en) | 2012-10-09 | 2016-02-09 | Multi-mode filter having a dielectric resonator mounted on a carrier and surrounded by a trench |
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US13/647,936 US20140097913A1 (en) | 2012-10-09 | 2012-10-09 | Multi-mode filter |
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US15/019,178 Active 2032-12-15 US9843083B2 (en) | 2012-10-09 | 2016-02-09 | Multi-mode filter having a dielectric resonator mounted on a carrier and surrounded by a trench |
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US10847855B2 (en) | 2015-11-28 | 2020-11-24 | Huawei Technologies Co., Ltd. | Dielectric resonator and filter comprising a body with a resonant hole surrounded by an encirclement wall having a ring shaped exposed dielectric area |
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US11431067B2 (en) | 2019-06-19 | 2022-08-30 | Knowles Cazenovia, Inc. | Dielectric cavity notch filter |
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