US20120073787A1 - Cooling for superconducting machines - Google Patents

Cooling for superconducting machines Download PDF

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Publication number
US20120073787A1
US20120073787A1 US13/322,856 US201013322856A US2012073787A1 US 20120073787 A1 US20120073787 A1 US 20120073787A1 US 201013322856 A US201013322856 A US 201013322856A US 2012073787 A1 US2012073787 A1 US 2012073787A1
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US
United States
Prior art keywords
evaporator
liquid coolant
cooling
coolant
surface structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/322,856
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English (en)
Inventor
Heinz Schmidt
Peter van Hasselt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Assigned to SIEMENS AKTIENGESELLSCHAFT reassignment SIEMENS AKTIENGESELLSCHAFT ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SCHMIDT, HEINZ, VAN HASSELT, PETER
Publication of US20120073787A1 publication Critical patent/US20120073787A1/en
Abandoned legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K55/00—Dynamo-electric machines having windings operating at cryogenic temperatures
    • H02K55/02—Dynamo-electric machines having windings operating at cryogenic temperatures of the synchronous type
    • H02K55/04—Dynamo-electric machines having windings operating at cryogenic temperatures of the synchronous type with rotating field windings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0208—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes using moving tubes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/14—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally
    • F28F1/16—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally the means being integral with the element, e.g. formed by extrusion
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/40—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only inside the tubular element
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K9/00—Arrangements for cooling or ventilating
    • H02K9/19—Arrangements for cooling or ventilating for machines with closed casing and closed-circuit cooling using a liquid cooling medium, e.g. oil
    • H02K9/20—Arrangements for cooling or ventilating for machines with closed casing and closed-circuit cooling using a liquid cooling medium, e.g. oil wherein the cooling medium vaporises within the machine casing
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K9/00—Arrangements for cooling or ventilating
    • H02K9/22—Arrangements for cooling or ventilating by solid heat conducting material embedded in, or arranged in contact with, the stator or rotor, e.g. heat bridges
    • H02K9/225—Heat pipes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E40/00—Technologies for an efficient electrical power generation, transmission or distribution
    • Y02E40/60—Superconducting electric elements or equipment; Power systems integrating superconducting elements or equipment

Definitions

  • the invention relates to a device for cooling superconducting machines.
  • This device has a closed thermal siphon system which can be filled with a liquid coolant and which has an evaporator for evaporating the liquid coolant.
  • DE 102 44 428 A1 discloses a machine with a rotor and a stator in a machine housing which contains an installation for cooling parts within this housing.
  • This cooling installation has on at least one face of the machine a closed system of piping with a condenser located outside the housing, with an evaporator located inside the housing and with connecting tubes running between the condenser and the evaporator, wherein the circulation of a coolant in this system is effected in accordance with a thermal siphon effect.
  • WO 2006/082194 A1 discloses a machine with a rotor which can rotate about an axis, the superconducting winding of which has a heat-conducting coupling, via a winding carrier and a thermal contact gas to a central cooling agent space of a stationary thermally conductive solid which projects into a hollow space in the rotor.
  • the cooling agent space forms a piping system in which a cooling agent circulates due to a thermal siphon effect.
  • the cooling agent space is provided with a lining of a porous material, preferably a sintered material, with a high thermal conductivity.
  • One possible object is to improve the cooling performance of a device for cooling superconducting machines.
  • the available cooling performance of the device for cooling superconducting machines can be effectively raised by an enlargement of the wettable surface of the evaporator.
  • An evaporator is usually designed as a hollow space, the bounds of which are available as the surface of the evaporator. Depending on the level of filling with the liquid coolant, a larger or smaller surface of the evaporator is then available for evaporating the liquid coolant. In order to enlarge this surface which can be wetted by the liquid coolant, without the need to increase the quantity of the liquid coolant, it is proposed that the devices to enlarge the surface of the evaporator which can be wetted by the liquid coolant have at least one displacer for displacing the liquid coolant. With this, there is a saving on coolant combined with an enlargement of the surface of the evaporator which can be wetted by the liquid coolant.
  • the evaporator is arranged in the interior of a rotor of a superconducting machine.
  • the surplus thermal energy can thereby be dissipated directly from the rotor.
  • the enlargement of the surface of the evaporator which can be wetted by the liquid coolant, is especially advantageous with this embodiment because the volume, and with it also the surface, of an evaporator located in the interior of a rotor is normally limited by the relatively small dimensions of a rotor.
  • the evaporator and the at least one displacer are cylindrical, in particular circularly cylindrical, in shape. Such shaping is simple to manufacture, and nevertheless is efficient in displacing the liquid coolant.
  • the surface of the evaporator which can be wetted by the liquid coolant has a surface structure which is formed in such a way that the surface which can be effectively used for the transfer of heat is enlarged. In this manner, it is possible to achieve a particularly significant enlargement of the surface of the evaporator which can be wetted by the liquid coolant, combined with low construction costs.
  • one surface structure which is particularly simple to realize, in terms of manufacturing technology has elements which are one-dimensional, in particular groove- or fin-like.
  • the surface structure has, in accordance with another advantageous embodiment, elements which are two-dimensional, in particular hole-like or spiky.
  • the liquid coolant is neon. Neon permits a particularly favorable working point, e.g. in the cooling of high temperature super-conductors, but is however relatively expensive so that the reduction in coolant which is achieved by the inventors' proposals is particularly useful.
  • FIG. 1 a schematic diagram of a section through a superconducting machine together with a device for cooling the superconducting machine
  • FIG. 2 a schematic diagram of an evaporator in accordance with the related art
  • FIG. 3 an exemplary embodiment of the proposed device, with a displacer for displacing the liquid coolant
  • FIG. 4 another exemplary embodiment of the proposed device, in which the surface of the evaporator which is effectively usable for the transfer of heat is enlarged, and
  • FIG. 5 an exemplary embodiment of the proposed device, in which use is made of various devices to enlarge the surface which can be wetted by the liquid coolant.
  • FIG. 1 shows a schematic diagram of a superconducting machine 1 together with a device for cooling the superconducting machine 1 .
  • This shows a section along the longitudinal axis of the superconducting machine 1 .
  • the superconducting machine 1 in the case of the exemplary embodiment shown in FIG. 1 is a rotating electrical machine, in particular a synchronous machine, for example a motor or a generator.
  • This has a stator 10 together with a rotor 6 .
  • it has a housing 11 for accommodating the stator 10 and for the bearing mountings of the rotor 6 .
  • the superconducting machine 1 is cooled by a closed thermal siphon system, which has an evaporator 4 , a condenser 9 together with elements which connect the evaporator 4 and the condenser 9 , e.g. connecting pipes.
  • the evaporator 4 , the connecting elements and the condenser 9 form the bounds of an enclosed space, which is provided to accommodate the liquid coolant 3 .
  • the evaporator 4 has a surface 5 , which can be wetted by the liquid coolant 3 , via which the thermal energy arising in the rotor and which is to be dissipated is transferred to the coolant 3 .
  • the coolant 3 is normally converted from the liquid state into the gaseous state by the thermal energy transferred, i.e. the coolant 3 is evaporated or boils. Due to the lower density of the gaseous form of the coolant, it rises through the connecting elements to the condenser 9 , which is at a higher geodetic level, and there it is converted back from the gaseous to the liquid state by extraction of the thermal energy which it had taken up. Due to gravity, the coolant 3 which has in this way been re-liquefied flows back to the evaporator 4 , and in particular to the surface 3 of the evaporator 4 which can be wetted by the coolant 3 .
  • a cooling system of this type utilizes the so-called thermal siphon effect. The cooling circulation is maintained solely by the density differences mentioned, or gravity, as applicable.
  • FIG. 2 shows an axial section through the evaporator 4 of a superconducting machine with the machine stationary. The other parts of the machine are not explicitly illustrated in FIG 2 .
  • the evaporator 4 shown in FIG. 2 has a circularly cylindrical cross-section.
  • the evaporator 4 illustrated is known from the related art.
  • the evaporator 4 is at least partially filled with a liquid coolant 3 .
  • the surface of the evaporator 4 which can be or is wetted by the liquid coolant 3 is identified with the reference mark 5 .
  • FIG. 3 shows an evaporator 4 in an exemplary embodiment of the proposed device.
  • the evaporator 4 is at least partially filled with a liquid coolant 3 .
  • an additional (advantageously cylindrical) displacer 7 By using an additional (advantageously cylindrical) displacer 7 , the quantity of liquid required for wetting the same evaporator surface area can be substantially reduced.
  • the device has, as the structure 7 , 8 to enlarge the surface 5 of the evaporator 4 which can be wetted by the liquid coolant 3 , a displacer 7 for displacing the liquid coolant 3 .
  • the displacer 7 restricts the volume available within the evaporator 4 for the liquid coolant 3 , in such a way as to enlarge the surface 5 of the evaporator 4 which is actually wetted by the coolant 3 .
  • FIG. 4 shows an evaporator 4 in another exemplary embodiment of a device in accordance with the proposals.
  • the functionally effective surface of the evaporator surface can itself also be substantially enlarged by the introduction of an appropriate surface structure 8 .
  • Advantageous embodiments are one-dimensional groove- or fin-like structures, with which the surfaces can in a simple way be substantially enlarged (factor 3-5).
  • the structure 7 , 8 for enlarging the surface 5 of the evaporator 4 which can be wetted by the liquid coolant 3 are in the form of a surface structure 8 on the surface of the evaporator, wherein the surface structure 8 is arranged so as to enlarge the surface 5 which is effectively usable for the transfer of heat.
  • the surface structure 8 in the exemplary embodiment shown has one-dimensional elements, in this case groove- or fin-like elements. Two-dimensional variants, rather more complicated to manufacture, are also advantageous for the purpose of enlarging the surfaces (such as for example the introduction of holes or spiky structures), and permit an even greater enlargement of the effective surface.
  • FIG. 5 shows an evaporator 4 , in a device in accordance with the proposals, which has a combination of the structure 7 , 8 for enlarging the surface 5 of the evaporator 4 which can be wetted by the liquid coolant 3 .
  • the structure shown in FIG. 3 i.e. a displacer 7
  • the structure shown in FIG. 4 i.e. a surface structure 8 for enlarging the surface 5 of the evaporator 4 which can be wetted by the coolant 3 .
  • the embodiments shown enable a reduction in the quantity of fluid required for wetting a particular minimum surface of the evaporator 4 as part of the thermal siphon cooling circuit.
  • the advantages lie in the directly associated reduction in the required buffer volume (typically from several 100 liters to about one tenth of that) and thus from a smaller space requirement and lower costs.
  • the costs of the actual filling of the thermal siphon system are also reduced thereby (less coolant 3 ).
  • the proposals relate to a device for cooling superconducting machines 1 , with a closed thermal siphon system 2 which can be filled with a liquid coolant 3 and which has an evaporator 4 for evaporating the liquid coolant 3 .
  • structure 7 , 8 are provided for enlarging a surface 5 of the evaporator 4 which can be wetted by the coolant 3 .

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Geometry (AREA)
  • Motor Or Generator Cooling System (AREA)
  • Superconductive Dynamoelectric Machines (AREA)
US13/322,856 2009-05-28 2010-05-25 Cooling for superconducting machines Abandoned US20120073787A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102009022960A DE102009022960A1 (de) 2009-05-28 2009-05-28 Kühlung supraleitender Maschinen
DE102009022960.4 2009-05-28
PCT/EP2010/057098 WO2010136419A2 (de) 2009-05-28 2010-05-25 Kühlung supraleitender maschinen

Publications (1)

Publication Number Publication Date
US20120073787A1 true US20120073787A1 (en) 2012-03-29

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US13/322,856 Abandoned US20120073787A1 (en) 2009-05-28 2010-05-25 Cooling for superconducting machines

Country Status (10)

Country Link
US (1) US20120073787A1 (de)
EP (1) EP2436108A2 (de)
JP (1) JP2012528291A (de)
KR (1) KR20120028888A (de)
CN (1) CN102449889A (de)
AU (1) AU2010252079B2 (de)
CA (1) CA2763596A1 (de)
DE (1) DE102009022960A1 (de)
RU (1) RU2550089C2 (de)
WO (1) WO2010136419A2 (de)

Cited By (1)

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CN109120105A (zh) * 2018-09-29 2019-01-01 东方电机控制设备有限公司 一种发电机定子冷却水系统防虹吸装置

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KR101482570B1 (ko) 2011-12-30 2015-01-16 두산중공업 주식회사 윅구조를 포함하는 초전도 회전기기
CN114221491B (zh) * 2021-12-02 2023-07-14 国网江苏省电力有限公司经济技术研究院 一种超导电机转子换热器结构

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US20050088048A1 (en) * 2003-08-07 2005-04-28 Siemens Aktiengesellschaft Machine device having superconducting winding and thermosiphon cooling of winding
US20050155356A1 (en) * 2002-05-15 2005-07-21 Michael Frank Superconductive device comprising a refrigeration unit, equipped with a refrigeration head that is thermally coupled to a rotating superconductive winding
US20090121561A1 (en) * 2005-02-04 2009-05-14 Siemens Aktiengesellschaft Machine System with Thermosyphon Cooled Superconductor Rotor Winding

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US20050155356A1 (en) * 2002-05-15 2005-07-21 Michael Frank Superconductive device comprising a refrigeration unit, equipped with a refrigeration head that is thermally coupled to a rotating superconductive winding
US20050088048A1 (en) * 2003-08-07 2005-04-28 Siemens Aktiengesellschaft Machine device having superconducting winding and thermosiphon cooling of winding
US20090121561A1 (en) * 2005-02-04 2009-05-14 Siemens Aktiengesellschaft Machine System with Thermosyphon Cooled Superconductor Rotor Winding

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109120105A (zh) * 2018-09-29 2019-01-01 东方电机控制设备有限公司 一种发电机定子冷却水系统防虹吸装置

Also Published As

Publication number Publication date
WO2010136419A2 (de) 2010-12-02
WO2010136419A3 (de) 2011-05-12
RU2550089C2 (ru) 2015-05-10
EP2436108A2 (de) 2012-04-04
AU2010252079A1 (en) 2012-01-12
CN102449889A (zh) 2012-05-09
CA2763596A1 (en) 2010-12-02
RU2011153676A (ru) 2013-07-10
KR20120028888A (ko) 2012-03-23
JP2012528291A (ja) 2012-11-12
AU2010252079B2 (en) 2014-08-28
DE102009022960A1 (de) 2010-12-02

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AS Assignment

Owner name: SIEMENS AKTIENGESELLSCHAFT, GERMANY

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:SCHMIDT, HEINZ;VAN HASSELT, PETER;REEL/FRAME:027481/0446

Effective date: 20111114

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION