US20110179806A1 - Cooling apparatus - Google Patents

Cooling apparatus Download PDF

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Publication number
US20110179806A1
US20110179806A1 US12/910,107 US91010710A US2011179806A1 US 20110179806 A1 US20110179806 A1 US 20110179806A1 US 91010710 A US91010710 A US 91010710A US 2011179806 A1 US2011179806 A1 US 2011179806A1
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US
United States
Prior art keywords
heat
heat pipe
thermal transport
cooling apparatus
peltier devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/910,107
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English (en)
Inventor
Shigetoshi Ipposhi
Tatsuro Hirose
Kazuo Kadowaki
Takumi Kijima
Takayuki Nakao
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Publication date
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Assigned to MITSUBISHI ELECTRIC CORPORATION reassignment MITSUBISHI ELECTRIC CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: NAKAO, TAKAYUKI, KADOWAKI, KAZUO, KIJIMA, TAKUMI, HIROSE, TATSURO, IPPOSHI, SHIGETOSHI
Publication of US20110179806A1 publication Critical patent/US20110179806A1/en
Abandoned legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B25/00—Machines, plants or systems, using a combination of modes of operation covered by two or more of the groups F25B1/00 - F25B23/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/38—Cooling arrangements using the Peltier effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B23/00—Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect
    • F25B23/006—Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect boiling cooling systems
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/021—Control thereof
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2700/00—Sensing or detecting of parameters; Sensors therefor
    • F25B2700/21—Temperatures
    • F25B2700/2107—Temperatures of a Peltier element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
    • H01S5/02415—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling by using a thermo-electric cooler [TEC], e.g. Peltier element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H01S5/4087—Array arrangements, e.g. constituted by discrete laser diodes or laser bar emitting more than one wavelength
    • H01S5/4093—Red, green and blue [RGB] generated directly by laser action or by a combination of laser action with nonlinear frequency conversion

Definitions

  • the present invention relates to a cooling apparatus for cooling heating elements.
  • Patent Document 1 proposes a semiconductor laser apparatus which is provided with a cooling mechanism by combining a Peltier device with a heat pipe.
  • An object of the present invention is to provide a cooling apparatus capable of, when using a plurality of Peltier devices, reducing power consumption thereof by equalizing each operation of the respective Peltier devices.
  • the cooling apparatus includes:
  • thermoelectric device being provided on an exothermic side of the Peltier devices
  • the plurality of heating elements are arranged along a longitudinal direction of the thermal transport heat pipe, and
  • the plurality of Peltier devices are arranged along the longitudinal direction of the thermal transport heat pipe.
  • the heat dissipating device includes: a second heat receiving plate in contact with the exothermic sides of the Peltier devices; a radiating heat pipe coupled to the second heat receiving plate; and a radiating fin coupled to the radiating heat pipe.
  • a plurality of radiating heat pipes are arranged at the same interval along a direction perpendicular to the longitudinal direction of the thermal transport heat pipe.
  • the cooling apparatus further comprising: a temperature sensor located near a coupling portion between the heat dissipating device and the thermal transport heat pipe; a plurality of drive circuits for individually driving the respective Peltier devices; and a control circuit for individually controlling the respective drive circuit based on an output from the temperature sensor.
  • a tip end of the thermal transport heat pipe is protruded from the end face of the heat dissipating device.
  • the heat receiving plate and the radiator plate are coupled by a plurality of thermal transport heat pipes, and a smaller amount of liquid is sealed in the heat pipe which is located at a larger distance from the heating element attachment portion.
  • a wick that generates a capillary force is fixed to an inner surface of the thermal transport heat pipe.
  • thermal transport heat pipe is bent in a U-shape, and both ends of the thermal transport heat pipe are thermally coupled by another heat pipe.
  • the thermal transport heat pipe is bent in a U-shape, and the heat receiving plate and the radiator plate are integrated into a single piece and disposed perpendicularly to each other.
  • the heating element which is located at a portion closer to the end of the thermal transport heat pipe generates a smaller amount of heat.
  • an electronic or optical device is located at a position other than under a endothermic surface of the Peltier device in a vertical direction.
  • the heat receiving plate is provided with a heater.
  • heat generated by the plurality of heating elements is dissipated through the heat receiving plate and the thermal transport heat pipes by the plurality of Peltier devices. Therefore, operations of the Peltier devices can be equalized to collectively control the temperature. Further, a difference in temperature between an endothermic side and an exothermic side of each Peltier device can be decreased, thereby reducing power consumption of the Peltier devices.
  • FIGS. 1A and 1B are a plan view and a front view, showing a cooling apparatus according to Embodiment 1 of the present invention
  • FIGS. 2A and 2B are a front view and a side view, showing a cooling apparatus according to Embodiment 2 of the present invention
  • FIGS. 3A and 3B are a plan view and a front view, showing a cooling apparatus according to Embodiment 3 of the present invention.
  • FIGS. 4A , 4 B and 4 C are a left side view, a front view and a right side view, showing a cooling apparatus according to Embodiment 4 of the present invention
  • FIGS. 5A and 5B are a plan view and a front view, showing a cooling apparatus according to Embodiment 5 of the present invention.
  • FIG. 6 is a plan view showing a cooling apparatus according to Embodiment 6 of the present invention.
  • FIGS. 1A and 1B are a plan view and a front view, showing a cooling apparatus according to Embodiment 1 of the present invention.
  • This cooling apparatus includes a heat receiving plate 2 , a radiator plate 4 , thermal transport heat pipes 5 , a plurality of Peltier devices 3 and a heat sink 6 .
  • the heat receiving plate 2 is made of a material having favorable thermal conductivity, like a metallic material such as copper or aluminum.
  • An upper surface of the heat receiving plate 2 has a flat shape, on which a plurality of heating elements 1 such as semiconductor lasers are mounted.
  • FIG. 1 shows one example in which three heating elements 1 are mounted, but the number of the heating elements 1 may be two or four or more.
  • a lower surface of the heat receiving plate 2 has a shape substantially conforming to a shape of each of the thermal transport heat pipes 5 , thereby ensuring favorable thermal coupling.
  • the thermal transport heat pipes 5 are constituted such that working fluid is sealed within a metallic pipe, and provide a function of effectively transporting heat by means of evaporation of the working fluid, traveling of vapor, condensation of the vapor, and reflux of liquid due to a capillary force within the heat pipe.
  • One end of each of the thermal transport heat pipes 5 is joined with the heat receiving plate 2 , and the other end is coupled with the radiator plate 4 , thus the heat receiving plate 2 is thermally coupled with the radiator plate 4 , thereby efficiently transporting heat from the heat receiving plate 2 to the radiator plate 4 .
  • FIG. 1 shows one example in which two thermal transport heat pipes 5 are provided, but the number of the thermal transport heat pipes 5 may be one or three or more.
  • the radiator plate 4 is made of a material having favorable thermal conductivity, like a metallic material such as copper or aluminum.
  • a lower surface of the radiator plate 4 has a shape substantially conforming to a shape of each of the thermal transport heat pipes 5 , thereby ensuring favorable thermal coupling.
  • An upper surface of the radiator plate 4 has a flat shape, on which a plurality of Peltier devices 3 are mounted.
  • FIG. 1 shows one example in which three Peltier devices are mounted, but the number of the Peltier devices 3 may be two or four or more.
  • the Peltier devices 3 utilize the Peltier effect in which an endothermic or exothermic phenomenon can occur at a junction between a p-type and an n-type semiconductors according to the direction of a current flowing through the junction.
  • the endothermic surfaces of the Peltier devices 3 are in contact with the upper surface of the radiator plate 4 .
  • the exothermic surface of the Peltier devices 3 are attached with the heat sink 6 .
  • the heat sink 6 is made of a material having favorable thermal conductivity, like a metallic material such as copper or aluminum, and has such a configuration that a number of radiating fins are provided upright on a base plate.
  • the cooling apparatus further includes a temperature sensor 7 , a plurality of drive circuits 52 for individually driving the respective Peltier devices 3 , and a control circuit 51 for individually controlling the respective drive circuits 52 based on an output from the temperature sensor 7 .
  • the three heating elements 1 including an R element, a G element and a B element generate heat during emission of desired light as each element is energized.
  • the heat generated by each of the heating elements 1 is transferred to the heat receiving plate 2 , and then transferred to one end of the thermal transport heat pipes 5 .
  • the thermal transport heat pipes 5 can efficiently transport heat by circulation of working fluid sealed therein.
  • each of attachment surfaces of the R element, the G element and the B element has a substantially even temperature.
  • each of the Peltier devices 3 since at a portion where each of the Peltier devices 3 is attached the vapor is uniformly dispersed and condensed such that each of inner wall surfaces within the heat pipes has the same temperature through the intermediary of the radiator plate 4 , each of the endothermic surfaces of the plurality of Peltier devices 3 can receive a uniform amount of heat at an even temperature through the intermediary of the radiator plate 4 . In this manner, each of the Peltier devices 3 can receive an averaged heat quantity, and can transfer the thermal energy received from the endothermic surface to the heat sink 6 using the Peltier effect. At this time, the Peltier device 3 has a lower temperature on the side of the radiator plate and a higher temperature on the side of heat sink.
  • the heat sink 6 has a temperature higher than that of the thermal transport heat pipes 5 , resulting in more efficient heat dissipation due to larger difference of temperature with respect to the ambient temperature. Further, the temperature of each of the thermal transport heat pipes, thus the temperature at the portion where the heating element is attached can be controlled by varying power supply to the Peltier devices 3 .
  • the Peltier device 3 may have a higher temperature on the side of the radiator plate and a lower temperature on the side of heat sink by inverting the flowing direction of a current supplied to the Peltier devices 3 .
  • the heat is transferred through the radiator plate 4 and the thermal transport heat pipes 5 to the attachment surfaces, temperature of each is thus increased.
  • each of the attachment surfaces of the R/G/B elements can be maintained at any constant temperature regardless of the ambient temperature. For example, even when the ambient temperature rises from ⁇ 5° C. up to 45° C., each of the endothermic surfaces of the Peltier devices 3 can be maintained at a constant temperature of 30° C.
  • the temperature at each of the endothermic surfaces of the Peltier devices 3 in a range of 20 to 35° C., more preferably in a range of 25° C. to 30° C.
  • the heating elements 1 can be cooled by temperature regulation, and it is possible to obtain desired properties (e.g., optical output) of the heating elements 1 by controlling the heating elements 1 at a desired temperature.
  • the temperature used for temperature regulation can be measured using the temperature sensor 7 such as thermocouple, thermistor, or diode.
  • a measuring position of the temperature sensor 7 may be at any point from the heat receiving plate 2 to the heat sink 6 , but preferably at the radiator plate 4 , in particular, as shown in FIG. 1 , more preferably near a coupling portion between the radiator plate 4 and the thermal transport heat pipe 5 .
  • the thermal transport heat pipes 5 are used for heat uniformizing elements, and the plurality of heating elements 1 are arranged linearly along the longitudinal direction of the thermal transport heat pipes 5 , and the plurality of Peltier devices 3 are arranged linearly along the longitudinal direction of the thermal transport heat pipes 5 . Accordingly, the heat transferred from the plurality of heating elements 1 is transported in a collective manner, and uniformly exhausted to the plurality of Peltier devices 3 . As a result, the heat receiving plate 2 and the radiator plate 4 can be maintained at a uniform temperature within the respective planes.
  • the heat generated by each of the heating elements 1 is not uniform, the heat can be uniformly transferred to each of the Peltier devices 3 . Accordingly, the thermal transport efficiency of each of the Peltier devices 3 can be maintained at a maximal state, in other words, the difference in temperature between the endothermic surface and the exothermic surface of each Peltier device 3 can be maintained at a uniform condition. As a result, it is possible to reduce the power consumption of the Peltier devices 3 . Moreover, since the heat is uniformly transferred to each of the Peltier devices 3 , local supercooling can be prevented, thereby improving dew condensation resistance.
  • each of the plurality of heating elements 1 generates heat in a different mode (for example, one condition in which R element: large, G element: small, B element: medium changes rapidly to another condition in which R element: medium, G element: medium, B element: small), compared to the case in which the Peltier device 3 is provided for every heating element 1 , each Peltier device can receive heat of an average heat quantity out of the plurality of heating elements 1 . Accordingly, the variation of the generated heat quantity becomes moderate, thereby facilitating the control of the temperature.
  • the R/G/B elements are provided for the same heat pipe, thereby preventing abnormally low temperature (0° C. when the ambient temperature is 0° C.).
  • a particular heating element generates a larger mount of heat among the plurality of heating elements 1 , as long as the other heating elements generate a smaller mount of heat, a total amount of heat exhausted is kept relatively small, thereby maintaining the particular heating element 1 at a lower temperature.
  • Each of the R/G/B elements may change its coloring (wavelength) and light intensity depending on the temperature of a luminescent body (LD) inside the element, and therefore it is preferable that the temperature of the LD does not change too much in order to obtain desired light.
  • each of the R/G/B elements has its unique thermal resistance, and the temperature of the LD element (junction temperature) may change by the temperature difference obtained by integration of the generated heat quantity that corresponds to the ever-changing light output for forming various video images (motion pictures).
  • the temperature of each of the LD elements can be more easily predicted and/or controlled only based on each thermal resistance value that is a fixed value and generated heat quantity (supplied power) that represents transient change, without being affected by environment changes such as ambient temperature and surrounding wind speed, which means high robustness. Further, abnormally lower temperature can be avoided even when any of the elements is under no load, and the temperature of the LD element varies only in a smaller range, which defines a minimum temperature. Therefore it is possible to resume the temperature with favorable light emitting efficiency in the next light output.
  • the Peltier devices are required in order to cool the R element with the adequately efficient number of the Peltier devices.
  • the number of the Peltier devices required for the R element is 1.5
  • the number of the Peltier devices required for the G element is 2.3
  • the number of the Peltier devices required for the B element is 1.2. Consequently, the total number of the required Peltier devices is seven, which is a physically possible total number of 2, 3, and 2.
  • FIGS. 2A and 2B are a front view and a side view, showing a cooling apparatus according to Embodiment 2 of the present invention.
  • This cooling apparatus has a configuration similar to that shown in FIG. 1 , but is different in that each thermal transport heat pipe 5 is bent in a U-shape, and a heat receiving and radiating plate 8 is used in which the heat receiving plate 2 and the radiator plate 4 shown in FIG. 1 are integrated into a single piece and disposed perpendicularly to each other. With such a configuration, it is possible to realize downsizing of the entire apparatus.
  • the temperature control circuit of the cooling apparatus has the same configuration as that shown in FIG. 1 , and therefore not shown in the drawing.
  • the thermal transport heat pipe 5 can be a common heat pipe including a circular pipe, a grooved pipe, a wire-lined pipe, or a particle sintered pipe.
  • a wick such as thin wire or particle
  • an inner capillary force is peeled off from an inner surface of the pipe.
  • a maximum amount of heat transport is reduced as viscosity coefficient of liquid increases.
  • a heat pipe manufactured by lining a number of thin wires along an inner wall of a grooved pipe, followed by providing a ribbon for holding the thin wires from the inner side thereof, and then sintering it to fix the thin wires.
  • a problem may occur that a difference in temperature between a wall of the heat pipe and a liquid becomes smaller as a distance between a heat pipe and the heating element attachment portion increases, resulting in an operational failure (for example, vapor does not easily travel) and deterioration in the thermal transport property.
  • thickness of a liquid film formed on the inner wall of the heat pipe can be made smaller, and evaporation phenomenon can easily occur even with a smaller difference in temperature.
  • it is possible to ensure thermal transport under normal vapor, thereby improving the maximum amount of heat transport and realizing thermal transport even with a smaller difference in temperature.
  • a portion closer to the end of the thermal transport heat pipe 5 that is in contact with the heat receiving plate 2 has a longer liquid reflux distance, with reflux properties of the liquid being lowered. Therefore, providing the heating element 1 that generates a larger amount of heat at the end of the heat pipe may cause occurrence of “dryout”, that is, no liquid is resupplied and the temperature at the attachment portion may rise up.
  • a heating element that generates a smaller amount of heat is preferably located at a portion closer to the end of the thermal transport heat pipe. Consequently, an allowable limit value of a total amount of exhaust heat quantity to be dissipated from the plurality of heating elements 1 , that is, the maximum amount of heat transport of the heat pipe is further increased.
  • the G element is likely to generate the largest amount of heat, therefore, the G element is preferably located at a position closest to the heat sink along the heat pipe.
  • FIGS. 3A and 3B are a plan view and a front view, showing a cooling apparatus according to Embodiment 3 of the present invention.
  • This cooling apparatus includes the heat receiving plate 2 , the radiator plate 4 , the thermal transport heat pipes 5 , the plurality of Peltier devices 3 , and a heat dissipating unit 20 .
  • the cooling apparatus has a configuration similar to that shown in FIG. 1 , but is different in that the heat dissipating unit 20 including radiating heat pipes 10 is used in place of the heat sink 6 shown in FIG. 1 .
  • the temperature control circuit of the cooling apparatus has the same configuration as that shown in FIG. 1 , and therefore not shown in the drawing.
  • the heat dissipating unit 20 includes a second heat receiving plate 9 in contact with the exothermic side of each Peltier device 3 , the plurality of radiating heat pipes 10 coupled to the second heat receiving plate 9 , and radiating fins 11 coupled to the respective radiating heat pipes 10 .
  • the second heat receiving plate 9 is made of a material having favorable thermal conductivity, like a metallic material such as copper or aluminum.
  • a lower surface of the second heat receiving plate 9 has a flat shape which is in contact with the exothermic side of the plurality of Peltier devices 3 .
  • An upper surface of the second heat receiving plate 9 has a shape substantially conforming to a shape of each of the radiating heat pipes 10 , thereby ensuring favorable thermal coupling.
  • the radiating heat pipe 10 is constituted similarly to the thermal transport heat pipe 5 , such that working fluid is sealed within a metallic pipe, and provides a function of effectively transporting heat by means of evaporation of the working fluid, traveling of vapor, condensation of the vapor, and reflux of liquid due to a capillary force within the heat pipe.
  • One end of each radiating heat pipe 10 is joined with the second heat receiving plate 9 , and the other end is joined with the radiating fins 11 , thereby efficiently transporting heat from the second heat receiving plate 9 to the radiating fins 11 .
  • FIG. 3 shows one example in which six radiating heat pipes 10 are provided, but the number of the radiating heat pipes 10 may be one to five or seven or more.
  • the radiating fin 11 is configured of a plurality of plates made of a material having favorable thermal conductivity, like a metallic material such as copper or aluminum.
  • the plates are arranged at substantially the same interval along the longitudinal direction of the radiating heat pipe 10 .
  • a heat dissipating capability is dramatically improved by using the heat dissipating unit 20 as described above.
  • the plurality of radiating heat pipes 10 are arranged at the same interval along a direction perpendicular to the longitudinal direction of the thermal transport heat pipe 5 .
  • a larger number of heat dissipating heat pipes 5 can be located as compared to the case where the thermal transport heat pipes 5 and the radiating heat pipes 10 are parallelly located, thereby further improving heat dissipating properties.
  • the entire apparatus can be downsized by providing the heat dissipating unit including the perpendicular heat pipes.
  • the heat dissipating 20 is required to exhaust the total amount of heat including the heat quantity generated from the heating elements 1 and the driving power of the Peltier devices 3 , thus desired to exhaust a greater amount of heat and to have a larger value of maximum heat transport capability. Moreover, the further the heat dissipating properties of the heat dissipating unit 20 improves, the lower the temperature of the exothermic surface of the Peltier device 3 becomes, and the smaller the difference in temperature between the endothermic surface and the exothermic surface of the Peltier device 3 becomes. Accordingly, the power consumption of the Peltier devices 3 can be reduced to save energy.
  • FIGS. 4A , 4 B and 4 C are a left side view, a front view and a right side view, showing a cooling apparatus according to Embodiment 4 of the present invention.
  • This cooling apparatus has a configuration similar to that shown in FIG. 2 , but is different in that each thermal transport heat pipe 5 is bent in a U-shape, and the heat receiving and radiating plate 8 is used in which the heat receiving plate 2 and the radiator plate 4 shown in FIG. 1 are integrated into a single piece and disposed perpendicularly to each other. With such a configuration, it is possible to realize downsizing of the entire apparatus.
  • the temperature control circuit of the cooling apparatus has the same configuration as that shown in FIG. 1 , and therefore not shown in the drawing.
  • a tip end 12 of the thermal transport heat pipes 5 is protruded from the end face of the radiator plate 4 . If there is an initial residual non-condensable gas (e.g., nitrogen) or a non-condensable gas generated from residual metals (e.g., hydrogen) present within the heat pipe, the gas can be moved to remain at a condensation side end portion of the heat pipe during operation. Further, an excess of the liquid sealed within the heat pipe can be also moved to remain at the condensation side end portion. Accordingly, the vapor cannot enter the condensation side end portion of the heat pipe, at which the heat cannot be exchanged.
  • an initial residual non-condensable gas e.g., nitrogen
  • a non-condensable gas generated from residual metals e.g., hydrogen
  • this condensation side end portion may have an abnormally lower temperature with respect to other condensation portions. Once dew condensation occurs at the abnormally lower temperature portion, the condensed water droplets are possibly attached to electronic and optical components.
  • a bypass heat pipe 13 is provided in addition to the thermal transport heat pipes 5 .
  • One end of the heat pipe 13 is coupled to the vicinity of a coupling portion between the heat receiving plate 2 and one end of the thermal transport heat pipe 5 .
  • the other end of the heat pipe 13 is coupled to the vicinity of another coupling portion between the radiator plate 4 and the other end of the thermal transport heat pipe 5 .
  • the condensation side end portion of the thermal transport heat pipe 5 is likely to be supercooled by the Peltier devices 3 , causing dew condensation.
  • providing the additional heat pipe 13 can make direct supply of heat to a portion to which heat is not easily transferred through vapor movement in the thermal transport heat pipe 5 .
  • dew condensation caused by supercooling can be prevented.
  • an end portion on the heat receiving side of the thermal transport heat pipe 5 has the longest distance for reflux of the condensation liquid, and thus lower reflux capability of the liquid. If too large a mount of heat is supplied to this end portion, the liquid inside the pipe is dried, thus causing “dryout”. Also in this case, providing the additional heat pipe 13 allows a part of the heat quantity supplied from the heating elements 1 to be transferred in a bypass manner via the heat pipe 13 to the radiator plate 4 , thereby preventing the dryout.
  • the control board 14 is not positioned under the Peltier devices 3 . Further, it is more preferable that the control board 14 is positioned above the Peltier devices 3 . In this arrangement, even if any one of the Peltier devices 3 is supercooled to a lowest temperature, causing dew condensation and fallen water droplets, then the water droplets can be prevented from attaching to the control board 14 , thereby surely preventing electrical and optical problems, such as short circuit, contamination, etc.
  • FIGS. 5A and 5B are a plan view and a front view, showing a cooling apparatus according to Embodiment 5 of the present invention.
  • This cooling apparatus has a configuration similar to that shown in FIG. 3 , but is different in that the heat receiving plate 2 is provided with a heater 30 .
  • the temperature of the attachment surface can be raised up by inverting the direction of a current flowing through the Peltier devices 3 to raise up the temperature of the radiator plate 4 , but inverting the direction of a current flowing through the Peltier devices 3 shifts the lower temperature surface into the higher temperature surface, and vice versa, thereby causing large variation in temperature. Consequently, the material constituting the Peltier device 3 is likely to thermally expand and contract at a higher degree, resulting in fatigue breakdown. Therefore, providing such a heater as described above can achieve longer duration of life. In addition, directly heating the heat receiving plate 2 can rapidly increase the temperature of the attachment surface of the R/G/B elements, thereby improving response of the temperature regulation.
  • the R/G/B elements cannot generate adequate optical outputs due to their properties, but the R/G/B elements can generate adequate optical outputs according to this embodiment.
  • the R/G/B elements having a lower temperature cannot generate optical outputs, thereby extending a latency time to wait for image formation.
  • energizing the heater 30 can keep the R/G/B elements at a desired temperature, thereby reducing the latency time.
  • a power source for the Peltier devices 3 or a power source for the heater 30 can alternately operate, hence, the power source can be shared to downsize the apparatus.
  • FIG. 6 is a plan view showing a cooling apparatus according to Embodiment 6 of the present invention.
  • This embodiment has a configuration similar to that shown in FIG. 3 , but is different in that the plurality of heating elements 1 are arranged non-linearly along the longitudinal direction of the thermal transport heat pipes 5 , and the plurality of Peltier devices 3 are arranged non-linearly along the longitudinal direction of the thermal transport heat pipes 5 . Also with such a configuration, the heat transferred from the plurality of heating elements 1 is transported in a collective manner, and uniformly exhausted to the plurality of Peltier devices 3 . As a result, the heat receiving plate 2 and the radiator plate 4 can be maintained at a uniform temperature within the respective planes.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
US12/910,107 2010-01-28 2010-10-22 Cooling apparatus Abandoned US20110179806A1 (en)

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US20150330717A1 (en) * 2013-01-25 2015-11-19 Furukawa Electric Co., Ltd. Heat pipe
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US9515246B2 (en) 2012-08-17 2016-12-06 Silicium Energy, Inc. Systems and methods for forming thermoelectric devices
US20170302055A1 (en) * 2014-10-13 2017-10-19 Bae Systems Plc Peltier effect heat transfer system
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USD819627S1 (en) 2016-11-11 2018-06-05 Matrix Industries, Inc. Thermoelectric smartwatch
US10003004B2 (en) 2012-10-31 2018-06-19 Matrix Industries, Inc. Methods for forming thermoelectric elements
US10118717B2 (en) * 2015-06-02 2018-11-06 Airbus Defence And Space Sas Artificial Satellite
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US10290796B2 (en) 2016-05-03 2019-05-14 Matrix Industries, Inc. Thermoelectric devices and systems
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US10749094B2 (en) 2011-07-18 2020-08-18 The Regents Of The University Of Michigan Thermoelectric devices, systems and methods
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US11313625B2 (en) * 2019-12-16 2022-04-26 Yuan-Hsin Sun Intensified cassette-type heat dissipation module
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US11496828B2 (en) 2019-09-12 2022-11-08 Apple Inc. Sensor drying pathway via capillary-induced pressure gradient
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US10205080B2 (en) 2012-01-17 2019-02-12 Matrix Industries, Inc. Systems and methods for forming thermoelectric devices
US9515246B2 (en) 2012-08-17 2016-12-06 Silicium Energy, Inc. Systems and methods for forming thermoelectric devices
US10003004B2 (en) 2012-10-31 2018-06-19 Matrix Industries, Inc. Methods for forming thermoelectric elements
US9995537B2 (en) * 2013-01-25 2018-06-12 Furukawa Electric Co., Ltd. Heat pipe
US20150330717A1 (en) * 2013-01-25 2015-11-19 Furukawa Electric Co., Ltd. Heat pipe
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US10644216B2 (en) 2014-03-25 2020-05-05 Matrix Industries, Inc. Methods and devices for forming thermoelectric elements
US20160197259A1 (en) * 2014-03-25 2016-07-07 Silicium Energy, Inc. Thermoelectric devices and systems
US20170302055A1 (en) * 2014-10-13 2017-10-19 Bae Systems Plc Peltier effect heat transfer system
US9902507B2 (en) * 2015-01-27 2018-02-27 Airbus Defence And Space Sas Artificial satellite and method for filling a tank of propellent gas of said artificial satellite
US10118717B2 (en) * 2015-06-02 2018-11-06 Airbus Defence And Space Sas Artificial Satellite
US10290796B2 (en) 2016-05-03 2019-05-14 Matrix Industries, Inc. Thermoelectric devices and systems
US10580955B2 (en) 2016-05-03 2020-03-03 Matrix Industries, Inc. Thermoelectric devices and systems
US11249522B2 (en) * 2016-06-30 2022-02-15 Intel Corporation Heat transfer apparatus for a computer environment
USD819627S1 (en) 2016-11-11 2018-06-05 Matrix Industries, Inc. Thermoelectric smartwatch
US10845685B2 (en) * 2018-01-25 2020-11-24 Seiko Epson Corporation Light source device and projector
US20190227415A1 (en) * 2018-01-25 2019-07-25 Seiko Epson Corporation Light source device and projector
US20200227880A1 (en) * 2019-01-10 2020-07-16 Hisense Laser Display Co., Ltd. Laser light source and laser projection device
US11592145B2 (en) 2019-01-10 2023-02-28 Hisense Laser Display Co., Ltd. Laser light source and laser projection device
US11570411B2 (en) * 2019-01-10 2023-01-31 Hisense Laser Display Co., Ltd. Laser light source and laser projection device
US11191187B2 (en) * 2019-04-30 2021-11-30 Deere & Company Electronic assembly with phase-change material for thermal performance
US20200352054A1 (en) * 2019-04-30 2020-11-05 Deere & Company Electronic assembly with phase-change material for thermal performance
US11496828B2 (en) 2019-09-12 2022-11-08 Apple Inc. Sensor drying pathway via capillary-induced pressure gradient
US11313625B2 (en) * 2019-12-16 2022-04-26 Yuan-Hsin Sun Intensified cassette-type heat dissipation module
CN112466981A (zh) * 2020-10-30 2021-03-09 武汉大学 一种用于高功率脉冲激光能量衰减的制冷陷阱衰减器
WO2022141654A1 (zh) * 2020-12-31 2022-07-07 北京市鑫全盛科技有限公司 具备半导体辅助热泵的电子设备散热装置
CN112968228A (zh) * 2021-02-01 2021-06-15 徐州储盈电子科技有限公司 一种电动车锂电池散热装置
US20240074028A1 (en) * 2022-08-29 2024-02-29 Samsung Electronics Co., Ltd. Electronic device including heat pipe surrounding multiple integrated circuits
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