US20110165847A1 - Millimiter wave transmission device, millimiter wave transmission method, and millimiter wave transmission system - Google Patents

Millimiter wave transmission device, millimiter wave transmission method, and millimiter wave transmission system Download PDF

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Publication number
US20110165847A1
US20110165847A1 US13/062,091 US200913062091A US2011165847A1 US 20110165847 A1 US20110165847 A1 US 20110165847A1 US 200913062091 A US200913062091 A US 200913062091A US 2011165847 A1 US2011165847 A1 US 2011165847A1
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United States
Prior art keywords
signal
millimeter wave
circuit board
generation unit
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/062,091
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English (en)
Inventor
Kenichi Kawasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
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Filing date
Publication date
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Assigned to SONY CORPORATION reassignment SONY CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KAWASAKI, KENICHI
Publication of US20110165847A1 publication Critical patent/US20110165847A1/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/16—Dielectric waveguides, i.e. without a longitudinal conductor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B3/00—Line transmission systems
    • H04B3/52—Systems for transmission between fixed stations via waveguides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/12—Hollow waveguides
    • H01P3/121—Hollow waveguides integrated in a substrate
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B3/00—Line transmission systems
    • H04B3/02—Details
    • H04B3/20—Reducing echo effects or singing; Opening or closing transmitting path; Conditioning for transmission in one direction or the other
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B3/00—Line transmission systems
    • H04B3/02—Details
    • H04B3/46—Monitoring; Testing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item

Definitions

  • An electronic component used for signal processing in baseband region of the input signal and the output signal may be mounted on the circuit board between the first region of the circuit board including the first signal generation unit and the first signal coupling unit and the second region of the circuit board including the second signal generation unit and the second signal coupling unit.
  • FIG. 8C is a waveform diagram illustrating an example of transmission of a high-speed baseband signal.
  • FIG. 10 is a block diagram illustrating an exemplary configuration of a millimeter wave transmission system 200 according to a second embodiment.
  • FIG. 12A is a perspective view illustrating an exemplary implementation of transmission lines 206 , 226 and the electronic components #A, #B, #C, #D in the millimeter wave transmission system 200 .
  • FIG. 22 is a frequency characteristic diagram illustrating an example of reflection characteristic and an example of bandpass characteristic of a high-pass filter device 255 of the millimeter wave transmission device 600 .
  • the simple high-pass filter device 255 can be structured on the circuit board 10 with the coupling circuit 205 including the microstrip line 251 and the waveguide structure 252 at the side of the electronic component #A, the transmission line 206 , and the coupling circuit 207 including the microstrip line 251 and the waveguide structure 252 at the side of the electronic component #B.
  • the high-pass filter device 255 reduces adverse effect of a standing wave caused by the reflected wave.
  • the coupling circuit 205 of the millimeter wave transmission device 800 includes the microstrip line 251 , a waveguide structure 252 ′ and the slot hole 257 .
  • the microstrip line 251 is constituted by a copper foil and the like and is arranged on the circuit board 10 .
  • the microstrip line 251 directly connects the waveguide top panel portion 253 and the amplifier 204 of the electronic component #A shown in FIG. 1 .
  • the microstrip line 251 is configured to transmit an electromagnetic wave S′ based on a millimeter wave signal S to the waveguide structure 252 ′.
  • the output terminal of the amplifier 204 and the microstrip line 251 are bonded with bump electrodes by flip chip method. The method is not limited thereto. Other methods may also be used. For example, they may be bonded with wires.
  • two electronic components #A, #B are arranged on one surface of the circuit board 10
  • two electronic components #C, #D are arranged on the other surface thereof.
  • the four electronic components # 1 to # 4 are connected by the multi-layer coupling circuits 205 , 207 and the transmission line 206 having a large loss.
  • the electromagnetic wave S′ is propagated to the lower dielectric material layer 10 i via the slot hole 257 of the interlayer ground layer at the side of the electronic component #A. Further, the electromagnetic wave S′ is propagated to the original upper dielectric material layer 10 f via the slot hole 257 of the interlayer ground layer at the side of the electronic component #D.
  • the waveguide top panel portion 253 is omitted.
  • the electromagnetic wave S′ based on the signal S is propagated from the waveguide structure 252 ′ to the transmission line 206 constituted by the lower dielectric material layer 10 i via the slot hole 257 at the side of the electronic components #A, #C.
  • the tangible object (tangible object made of the dielectric material) having the predetermined dielectric constant ⁇ has been explained about the circuit board 10 made of glass epoxy resin.
  • the tangible object made of a dielectric material is not limited thereto.
  • the inventors of the present application have confirmed that tangible objects made of dielectric material such as a light-gathering sheet and a conducting/insulating sheet made of acrylic and polyethylene resin, an acrylic stick and an acrylic plate, a ballpoint pen in which an ink containing tube and a ballpoint pen body (tube) is made of polyethylene synthetic resin such as polyethylene and polyethylene terephthalate also function as the transmission line for the millimeter wave.
  • the dielectric loss tangent ⁇ of the acrylic and polyethylene resin is generally close to a dielectric loss tangent ⁇ of glass epoxy resin. Therefore, the circuit board 10 explained in the embodiments is not limited to glass epoxy resin, and may be acrylic and polyethylene resin.

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  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Radar Systems Or Details Thereof (AREA)
  • Transceivers (AREA)
  • Waveguides (AREA)
  • Near-Field Transmission Systems (AREA)
  • Cable Transmission Systems, Equalization Of Radio And Reduction Of Echo (AREA)
US13/062,091 2008-09-25 2009-09-24 Millimiter wave transmission device, millimiter wave transmission method, and millimiter wave transmission system Abandoned US20110165847A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2008246509 2008-09-25
JP2008-246509 2008-09-25
JP2009214046A JP2010103982A (ja) 2008-09-25 2009-09-16 ミリ波伝送装置、ミリ波伝送方法、ミリ波伝送システム
JP2009-214046 2009-09-16
PCT/JP2009/066511 WO2010035740A1 (fr) 2008-09-25 2009-09-24 Dispositif de transmission d'ondes millimétriques, procédé de transmission d'ondes millimétriques, système de transmission d'ondes millimétriques

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2009/066511 A-371-Of-International WO2010035740A1 (fr) 2008-09-25 2009-09-24 Dispositif de transmission d'ondes millimétriques, procédé de transmission d'ondes millimétriques, système de transmission d'ondes millimétriques

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US14/309,336 Continuation US9608683B2 (en) 2008-09-25 2014-06-19 Millimeter wave transmission device, millimeter wave transmission method, and millimeter wave transmission system

Publications (1)

Publication Number Publication Date
US20110165847A1 true US20110165847A1 (en) 2011-07-07

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ID=42059739

Family Applications (3)

Application Number Title Priority Date Filing Date
US13/062,091 Abandoned US20110165847A1 (en) 2008-09-25 2009-09-24 Millimiter wave transmission device, millimiter wave transmission method, and millimiter wave transmission system
US14/309,336 Active 2030-06-18 US9608683B2 (en) 2008-09-25 2014-06-19 Millimeter wave transmission device, millimeter wave transmission method, and millimeter wave transmission system
US15/420,353 Active US9825667B2 (en) 2008-09-25 2017-01-31 Millimeter wave transmission device, millimeter wave transmission method, and millimeter wave transmission system

Family Applications After (2)

Application Number Title Priority Date Filing Date
US14/309,336 Active 2030-06-18 US9608683B2 (en) 2008-09-25 2014-06-19 Millimeter wave transmission device, millimeter wave transmission method, and millimeter wave transmission system
US15/420,353 Active US9825667B2 (en) 2008-09-25 2017-01-31 Millimeter wave transmission device, millimeter wave transmission method, and millimeter wave transmission system

Country Status (8)

Country Link
US (3) US20110165847A1 (fr)
EP (1) EP2328226B1 (fr)
JP (1) JP2010103982A (fr)
KR (1) KR101903787B1 (fr)
CN (1) CN102150323B (fr)
BR (1) BRPI0918440A2 (fr)
RU (1) RU2487446C2 (fr)
WO (1) WO2010035740A1 (fr)

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US9608683B2 (en) 2017-03-28
US20170141814A1 (en) 2017-05-18
CN102150323B (zh) 2016-08-24
JP2010103982A (ja) 2010-05-06
EP2328226A4 (fr) 2012-09-05
RU2011109259A (ru) 2012-09-20
US20160197630A1 (en) 2016-07-07
KR101903787B1 (ko) 2018-10-02
KR20110061567A (ko) 2011-06-09
BRPI0918440A2 (pt) 2015-11-24
EP2328226B1 (fr) 2019-05-29
CN102150323A (zh) 2011-08-10
RU2487446C2 (ru) 2013-07-10
EP2328226A1 (fr) 2011-06-01
WO2010035740A1 (fr) 2010-04-01
US9825667B2 (en) 2017-11-21

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