US20110088262A1 - Method for manufacturing inkjet head - Google Patents

Method for manufacturing inkjet head Download PDF

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Publication number
US20110088262A1
US20110088262A1 US12/651,003 US65100309A US2011088262A1 US 20110088262 A1 US20110088262 A1 US 20110088262A1 US 65100309 A US65100309 A US 65100309A US 2011088262 A1 US2011088262 A1 US 2011088262A1
Authority
US
United States
Prior art keywords
resist
piezoelectric material
vibrating membrane
over
photo
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/651,003
Other languages
English (en)
Inventor
Chung-Mo YANG
Jae-Woo Joung
Won-Chul Sim
Seuck-Young Yoo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electro Mechanics Co Ltd
Original Assignee
Samsung Electro Mechanics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020090100364A external-priority patent/KR20110043306A/ko
Priority claimed from KR1020090107085A external-priority patent/KR20110050205A/ko
Application filed by Samsung Electro Mechanics Co Ltd filed Critical Samsung Electro Mechanics Co Ltd
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD. reassignment SAMSUNG ELECTRO-MECHANICS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: Joung, Jae-woo, SIM, WON-CHUL, YANG, CHUNG-MO, YOO, YOUNG-SEUCK
Publication of US20110088262A1 publication Critical patent/US20110088262A1/en
Abandoned legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14201—Structure of print heads with piezoelectric elements
    • B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1607—Production of print heads with piezoelectric elements
    • B41J2/161—Production of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1628—Manufacturing processes etching dry etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1631—Manufacturing processes photolithography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1642—Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49401—Fluid pattern dispersing device making, e.g., ink jet

Definitions

  • the present invention relates to a method for manufacturing an inkjet head.
  • An inkjet head can be manufactured by processing various parts, such as the chamber, restrictor, nozzle, etc., in a number of layers and then attaching the layers together.
  • a piezoelectric device (PZT) is utilized to drive a vibrating membrane.
  • PZT piezoelectric device
  • an inner crystal structure of the piezoelectric device is changed and a displacement can be generated in the piezoelectric device.
  • the operation of the vibrating membrane utilizes the displacement.
  • the distance between unit cells for discharging ink droplets needs to be narrower, and the vibrating membrane and the piezoelectric device need to be thinner.
  • a lower electrode is deposited on a head body and a piezoelectric material is coated on the lower electrode with epoxy resin. Then the deposited piezoelectric material is separated in accordance with each cell by means of, for example, a blade. At this time, the vibrating membrane may be cracked when the lower electrode is contacted by the blade since the lower electrode is thin. Therefore, to prevent this, the piezoelectric material is separated into several piezoelectric devices such that a residue layer remains in the piezoelectric material.
  • the residue layer causes a cross talk that delivers the operating power of a piezoelectric device of one cell to another cell. This causes a defective discharging of ink.
  • An aspect of the invention provides a method for manufacturing an inkjet head.
  • the method in accordance with an embodiment of the present invention can include: preparing a head body including a vibrating membrane, which is located in an upper portion of the head body; coating a lower electrode over the vibrating membrane; patterning a resist such that an open area is formed over the vibrating membrane; filling a piezoelectric material in the open area; selectively coating an upper electrode over the piezoelectric material; and removing the resist.
  • the resist can be made of a material including polysilicon, and the resist can be removed by an etching process using XeF2 gas.
  • the method for manufacturing an inkjet head according to an embodiment of the invention can further include forming an inlet port in the head body, after the resist is removed.
  • the piezoelectric material can be filled by: depositing the piezoelectric material in the open area and over the resist; and removing a portion of the deposited piezoelectric material such that an upper surface of the resist is exposed.
  • the resist can be a photo-resist
  • the upper electrode can be selectively coated by: coating a conductive layer over the piezoelectric material and over the photo-resist; and patterning the upper electrode over the piezoelectric material by removing a portion of the conductive layer coated over the photo-resist by etching the photo-resist.
  • FIG. 1 is a flowchart illustrating a method for manufacturing an inkjet head according to an embodiment of the invention
  • FIGS. 2 to 11 illustrate a respective process of a method for manufacturing an inkjet head according to an embodiment of the invention.
  • FIGS. 12 and 13 illustrate a process for coating an upper electrode selectively according to another embodiment of the invention.
  • FIG. 1 is a flowchart illustrating a method for manufacturing an inkjet head according to an embodiment of the invention
  • FIGS. 2 to 10 illustrate a respective process of a method for manufacturing an inkjet head according to an embodiment of the invention.
  • a head body 10 including a vibrating membrane 16 , is prepared, and a lower electrode 20 is coated over the vibrating membrane 16 (S 110 ).
  • the vibrating membrane 16 is located in an upper portion of the head body 10 .
  • gold can be deposited on an upper surface of the vibrating membrane 16 , but the present invention is not limited to depositing gold.
  • the head body 10 In the head body 10 , some elements such as a chamber 13 , a reservoir 11 , a restrictor 13 , a damper 14 , and a nozzle 15 are formed. Described below are the functions of the elements constituting the head body 10 .
  • the chamber 13 accommodates ink.
  • a piezoelectric material (refer to reference numeral 42 in FIG. 11 ), which is formed on an upper surface of the vibrating membrane, applies pressure to the chamber 13 , the chamber 13 transfers the accommodated ink in the direction of the nozzle 15 and causes the ink to be discharged.
  • the reservoir 11 is supplied with the ink from the outside through an inlet port 12 and stores the ink, and then provides the ink to the chamber 13 described above.
  • the restrictor 13 links the reservoir 11 and the chamber 13 and controls the ink flow generated between the reservoir 11 and the chamber 13 .
  • the restrictor 13 is formed to have a smaller cross sectional area than those of the reservoir 11 and the chamber 13 .
  • the restrictor 13 can control the amount of ink provided by the reservoir 11 to the chamber 13 when the vibrating membrane 16 is vibrated by a vibration generator.
  • the nozzle 15 is linked to the chamber 13 and is supplied with the ink from the chamber 13 . Then, the ink is ejected through the nozzle. If the vibration generated by the vibration generator is delivered to the chamber 13 through the vibrating membrane 16 , pressure is applied to the chamber 13 , causing the ink to be ejected through the nozzle 15 .
  • the damper 14 is formed between the chamber 13 and the nozzle 15 .
  • the damper 14 can carry out a function of converging the energy generated by the chamber 13 to the nozzle 15 and dampening a sudden change of pressure.
  • the head body 10 including the elements described above can be formed by stacking one or several substrates made of silicon or ceramic material.
  • a resist 30 is patterned such that an open area 32 is formed over the lower electrode 20 (S 120 ).
  • the open area 32 is an area in which a piezoelectric material (refer to reference numeral 42 in FIG. 11 ) is to be filled.
  • the piezoelectric material 42 can later serve as a vibration generator.
  • the resist 30 is patterned by depositing polysilicon by using PECVD or LPCVD.
  • PECVD PECVD
  • LPCVD LPCVD
  • the present invention is not limited to patterning the resist by depositing polysilicon, and it shall be evident that other materials than polysilicon can be used.
  • the piezoelectric material 42 is filled in the open area 32 (S 130 ).
  • processes shown in FIGS. 4 and 5 can be used. That is, as shown in FIG. 4 , a piezoelectric material 40 can be deposited in the open area 32 and over the resist 30 by using a sputtering process or E-beam process, and then a portion of the deposited piezoelectric material 40 can be removed such that an upper surface of the resist 30 is exposed, as shown in FIG. 5 .
  • a CMP process can be used for removing a portion of the deposited piezoelectric material 40 .
  • an upper electrode 50 is selectively coated over the piezoelectric material 42 (S 140 ).
  • a resist 52 can be formed such that a portion of the upper surface of the piezoelectric material 42 is opened—the opened area is an area where the upper electrode 50 is to be formed—and the upper electrode 50 can be deposited in the opened area by using, for example, a sputtering process, as shown in FIG. 6 .
  • the upper electrode 50 can be patterned by removing the resist 52 , as shown in FIG. 7 .
  • the resist 30 is removed, as shown in FIG. 8 (S 150 ). That is, the resist 30 utilized for selectively depositing the piezoelectric material is removed.
  • the resist 30 can be removed by an etching process using XeF 2 gas. In that case, the resist 30 can be selectively removed without damaging the head body 10 or the piezoelectric material 42 . If any material other than polysilicon is used for the resist 30 , an etching process using a material that can selectively remove the resist 30 without damaging the head body 10 or the piezoelectric material 42 can be used.
  • an inlet port 17 is formed in the head body 10 (S 160 ).
  • a process shown in FIGS. 9 to 11 can be used. That is, a resist 60 may be formed such that a portion of the head body 10 where the inlet port 17 is to be formed is opened, as shown in FIG. 9 . And the opened portion of the head body 10 can be etched, as shown in FIG. 10 . Then, the resist 60 may be removed, as shown in FIG. 11 .
  • a conductive layer 54 can be coated over the piezoelectric material 42 and the resist 30 .
  • the resist 30 is a photo-resist. Then, a portion of the conductive layer 54 formed on the photo-resist 30 can be removed by etching the photo-resist 30 .
  • the conductive layer 54 is coated over the upper surface of the piezoelectric material 42 and the photo-resist 30 , and when the photo-resist 30 is etched selectively, a portion of the conductive layer 54 coated over the photo-resist 30 can be separated and removed. That is, the upper electrode 50 is patterned by a lift-off process.
  • the photo-resist 30 can be etched selectively without damaging the piezoelectric material 42 , the lower electrode 20 or the conductive layer 54 .
  • the photo-resist 30 can be etched selectively without damaging the piezoelectric material 42 , the lower electrode 20 or the conductive layer 54 .
  • only a portion of the conductive layer 54 coated over the piezoelectric material 42 can remain, and the remaining portion 50 of the conductive layer 54 can be patterned to serve as an upper electrode.
  • the inlet port 17 can be formed in the head body 10 .
US12/651,003 2009-10-21 2009-12-31 Method for manufacturing inkjet head Abandoned US20110088262A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR1020090100364A KR20110043306A (ko) 2009-10-21 2009-10-21 잉크젯 헤드 제조방법
KR10-2009-0100364 2009-10-21
KR1020090107085A KR20110050205A (ko) 2009-11-06 2009-11-06 잉크젯 헤드 제조방법
KR10-2009-0107085 2009-11-06

Publications (1)

Publication Number Publication Date
US20110088262A1 true US20110088262A1 (en) 2011-04-21

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Family Applications (1)

Application Number Title Priority Date Filing Date
US12/651,003 Abandoned US20110088262A1 (en) 2009-10-21 2009-12-31 Method for manufacturing inkjet head

Country Status (2)

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US (1) US20110088262A1 (ja)
JP (1) JP2011088422A (ja)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0781071A (ja) * 1993-09-10 1995-03-28 Fujitsu Ltd インクジェットヘッドの製造方法
US6265139B1 (en) * 1998-12-30 2001-07-24 Samsung Electro-Mechanics Co., Ltd. Method for fabricating piezoelectric/electrostrictive ceramic micro actuator using photolithography
JP2001210888A (ja) * 1999-11-18 2001-08-03 Kansai Research Institute 圧電体素子およびその製造方法ならびにそれを用いたインクジェット式プリンタヘッド
JP3956277B2 (ja) * 2001-11-15 2007-08-08 ソニー株式会社 プリンタヘッド及びプリンタ
JP3783781B2 (ja) * 2002-07-04 2006-06-07 セイコーエプソン株式会社 液体噴射ヘッドの製造方法
JP4977946B2 (ja) * 2004-06-29 2012-07-18 富士ゼロックス株式会社 インクジェット記録ヘッドの製造方法
KR100682964B1 (ko) * 2006-02-09 2007-02-15 삼성전자주식회사 잉크젯 헤드의 압전 액츄에이터 형성 방법

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Publication number Publication date
JP2011088422A (ja) 2011-05-06

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Legal Events

Date Code Title Description
AS Assignment

Owner name: SAMSUNG ELECTRO-MECHANICS CO., LTD., KOREA, REPUBL

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:YANG, CHUNG-MO;JOUNG, JAE-WOO;YOO, YOUNG-SEUCK;AND OTHERS;REEL/FRAME:023723/0958

Effective date: 20091117

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION