US20100107411A1 - Inkjet head manufacturing method - Google Patents
Inkjet head manufacturing method Download PDFInfo
- Publication number
- US20100107411A1 US20100107411A1 US12/469,278 US46927809A US2010107411A1 US 20100107411 A1 US20100107411 A1 US 20100107411A1 US 46927809 A US46927809 A US 46927809A US 2010107411 A1 US2010107411 A1 US 2010107411A1
- Authority
- US
- United States
- Prior art keywords
- inkjet head
- piezoelectric element
- chamber
- actuator
- actuators
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 238000005530 etching Methods 0.000 claims abstract description 10
- 238000000034 method Methods 0.000 claims description 19
- 239000010409 thin film Substances 0.000 abstract description 2
- 239000011324 bead Substances 0.000 abstract 1
- 230000008569 process Effects 0.000 description 16
- 239000012528 membrane Substances 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000007792 addition Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1607—Production of print heads with piezoelectric elements
- B41J2/161—Production of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1623—Manufacturing processes bonding and adhesion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1629—Manufacturing processes etching wet etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1632—Manufacturing processes machining
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49401—Fluid pattern dispersing device making, e.g., ink jet
Abstract
An inkjet head manufacturing method is disclosed. The method of manufacturing an inkjet bead including a plurality of chambers, configured to contain ink; and an actuator, configured to provide pressure to the chamber, which includes forming a piezoelectric element on one side of the inkjet head that is adjacent to the chambers; forming the actuator(s) by dicing the piezoelectric element such that the piezoelectric element is divided and placed corresponding to a position of the chamber(s); and etching one side of the inkjet head such that a part of the piezoelectric element remaining between the adjacent actuators, can manufacture an inkjet head having a thin-film actuator reducing the cross talk by removing a part of the piezoelectric element remaining between the actuators of the inkjet head.
Description
- This application claims the benefit of Korean Patent Application No. 10-2008-0106925, filed with the Korean Intellectual Property Office on Oct. 30, 2008, the disclosure of which is incorporated herein by reference in its entirety.
- 1. Technical Field
- The present invention relates to a method of manufacturing an inkjet head.
- 2. Description of the Related Art
- The inkjet printer can convert an electric signal to a physical force and discharge an in ink droplet through a nozzle in order to perform the printing. An inkjet head can be manufactured by processing various elements such as a chamber, a restrictor, a nozzle, and a piezoelectric element on each layer and coupling the layers to one another.
- The inkjet head has been expansively applied to the manufacture of electronic parts, such as printed boards and LCD panels, as well as the conventional graphic inkjet industries that perform the printing on the paper or fiber.
- Accordingly, the inkjet printing technology for electronic parts, which is required to discharge functional ink more precisely than the conventional graphic printing, requires functions that the conventional inkjet has not required. It is necessary to control the size and the speed deviation of an ink droplet. Moreover, high density nozzles and high frequency properties are required to increase the production. An actuator of the thin-film inkjet head has been developed to meet such demands.
-
FIG. 1 is a front cross-sectional view showing aconventional inkjet head 12. In accordance with the conventional art as shown inFIG. 1 , a piezoelectric element is adhered to one surface of theinkjet head 12, and then dicing is performed to allow the piezoelectric element to function as anindependent actuator 2 on eachchamber 6. - At this time, if each of the
actuators 2 is completely severed, there may be serious stress on a silicon board of theinkjet head 12. If the piezoelectric element is not completely severed, however, theadjacent actuators 2 are connected to each other, thereby causing the crosstalk. - If the dicing is performed twice by using a saw blade for fear of the stress of the silicon board of the
inkjet head 12, there remains a wall-shaped part 8 of the piezoelectric element between the adjacent actuators, thereby causing the crosstalk. - The present invention provides a method of manufacturing an inkjet head having a thin actuator and reducing the crosstalk.
- An aspect of present invention features a method of manufacturing an inkjet head, the inkjet head having a plurality of chambers containing ink and an actuator providing pressure to the chambers, including forming a piezoelectric element on one side of the inkjet head that is adjacent to the chambers; forming the actuator(s) by dicing the piezoelectric element such that the piezoelectric element is divided and placed corresponding to a position of the chamber(s); and etching one side of the inkjet head such that a part of the piezoelectric element remaining between the adjacent actuators is removed.
- Here, the forming of the piezoelectric element can be performed by adhering the sintered piezoelectric element to one side of the inkjet head.
-
FIG. 1 is a front cross-sectional view showing the conventional inkjet head; -
FIG. 2 is a lateral cross-sectional view showing an inkjet head in accordance with an embodiment of the present invention; -
FIG. 3 is a flowchart showing an inkjet head manufacturing method in accordance with an embodiment of the present invention; -
FIG. 4 andFIG. 5 are plan views showing an inkjet head in accordance with an embodiment of the present invention; -
FIG. 6 is a front cross-sectional view showing an inkjet head in accordance with an embodiment of the present invention; and -
FIG. 7 andFIG. 8 are front cross-sectional views showing part of an inkjet head in accordance with an embodiment of the present invention. - The features and benefits of an embodiment of the present invention will become more apparent through the below description with reference to the accompanying drawings.
- An inkjet head manufacturing method according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. Identical or corresponding elements will be given the same reference numerals, regardless of the figure number, and any redundant description of the identical or corresponding elements will not be repeated.
-
FIG. 2 is a lateral cross-sectional view showing an inkjet head in accordance with an embodiment of the present invention. As shown inFIG. 2 , aninkjet head 100 can include areservoir 111, arestrictor 113, achamber 114, amembrane 115, anactuator 190, and anozzle 116. - The
reservoir 111 can contain ink and supply the ink to thechamber 114 through therestrictor 113, which will be described below. Thereservoir 111 can receive ink from the outside of theinkjet head 100 through aninlet 112. Theinlet 112 and thechamber 114 can be formed on athird plate 30, and thereservoir 111 can be formed or, asecond plate 20. - The
restrictor 113 can connect thereservoir 111 and thechamber 114, which will be described below, and function as a channel supplying the ink from thereservoir 111 to thechamber 114. Therestrictor 113 and thereservoir 111 can be formed on thesecond plate 20. - The
restrictor 113 can have a cross-section that is smaller than that of thereservoir 111. When pressure is provided to thechamber 114 by theactuator 190, therestrictor 113 can adjust the amount of the ink supplied from thereservoir 111 to thechamber 114. - One side of the
chamber 114 can be connected to therestrictor 113, and the other side can be connected to thenozzle 116. Thechamber 114 can be formed inside theinkjet head 100 to receive ink, and themembrane 115 can cover the one side of themembrane 115. - A plurality of inkjet heads can be formed in the widthwise direction inside the
inkjet head 100. Accordingly, a plurality ofreservoirs 111 can be formed by being expanded in the widthwise direction, and each of therestrictors 113 can be formed between eachchamber 114 and thereservoir 111. - The
nozzles 116 can be connected to the other side of eachchamber 114 and provide a path through which ink is discharged to the outside of theinkjet head 100. Thenozzle 116 can be formed on afirst plate 10. - The
actuator 190 can be coupled to one side of theinkjet head 100, corresponding to a position of thechamber 114, which is an upper side of themembrane 115. Theactuator 190 can provide pressure to thechamber 114 by generating vibration and transferring the vibration to thechamber 114 through themembrane 115. Themembrane 115 can be formed on afourth plate 40. - An upper electrode (not shown) and a lower electrode (not shown) can be coupled to one side of the
inkjet head 100 in order to supply voltage to theactuator 190. - The above-described
inkjet head 100, including thenozzle 116, thechamber 114, therestrictor 113, and thereservoir 111, can be formed by stacking thefirst plate 10, thesecond plate 20, thethird plate 30, and thefourth plate 40, on which each of the corresponding elements are formed. Thefirst plate 10, thesecond plate 20, thethird plate 30, and thefourth plate 40 can be made of a silicon board. The method of manufacturing theinkjet head 100 in accordance with an embodiment of the present invention will be described below. -
FIG. 3 is a flowchart showing an inkjet head manufacturing method in accordance with an embodiment of the present invention. As shown inFIG. 3 , the method of manufacturing theinkjet head 100 in accordance with an embodiment of the present invention can include a process represented by S100, in which a sinteredpiezoelectric element 400 is adhered to one side of theinkjet head 100 that is adjacent to thechamber 114; a process represented by S200, in which theactuator 190 is formed by dicing the piezoelectric element, to correspond to a position of thechamber 114; and a process represented by S300, in which one side of theinkjet head 100 is etched such that a part of thepiezoelectric element 400 remaining between theadjacent actuators 190 is removed. Accordingly, by removing a part of thepiezoelectric element 400 that remains between theactuators 190 of theinkjet head 100, it is possible to manufacture theinkjet head 100 having thethin actuator 190 that reduces the crosstalk. -
FIG. 4 andFIG. 5 are plan views showing an inkjet head in accordance with an embodiment of the present invention. As shown inFIG. 4 , in the process represented by S100, the sinteredpiezoelectric element 400 can be adhered to one side of theinkjet head 100 adjacent to thechamber 114. - The
chamber 114 can be formed inside theinkjet head 100. The sinteredpiezoelectric element 400 can be adhered to one side, which is an upper side, of theinkjet head 100 adjacent to thechamber 114. - The sintered
piezoelectric element 400 can have a bulk shape. The bulk-shapedpiezoelectric element 400 can be adhered to the upper side of theinkjet head 100, corresponding to the position of thechamber 114. Thepiezoelectric element 400 can be adhered to the upper side of theinkjet head 100 by using, for example, an adhesive. - Next, in the process represented by S200, the
actuators 190 can be formed by dicing thepiezoelectric element 400 such that thepiezoelectric element 190 remains between theactuators 190, which are to be adjacently formed corresponding to the position of each of thechambers 114, as shown inFIG. 5 . As described above, thechambers 114 can be arranged side by side in the widthwise direction of theinkjet head 100, and the dicing process can sever and divide thepiezoelectric element 400 such that theactuator 190 is formed on eachchamber 114. -
FIG. 6 is a front cross-sectional view showing an inkjet head in accordance with an embodiment of the present invention. As shown inFIG. 6 , the dicing process can be performed one time to divide thepiezoelectric element 400, to thereby form theadjacent actuators 190. This can prevent a wall-shaped part of thepiezoelectric element 400 from remaining between theadjacent actuators 190. - The dicing process can be also performed to be shallow enough not to server the
piezoelectric element 400 completely. Accordingly, it is possible to minimize the stress on thefourth plate 40 in the process of completely severing thepiezoelectric element 400. -
FIG. 7 andFIG. 8 are front cross-sectional views showing part of an inkjet head in accordance with an embodiment of the present invention. Through the dicing process, the thickness of thepiezoelectric element 400 remaining between theadjacent actuators 190 may be identical to that of theactuator 190, which is to be removed through the etching as described below, as shown inFIG. 7 . Accordingly, it is possible to remove a part of thepiezoelectric element 400 remaining between theadjacent actuators 190 and simultaneously form the actuators having desired thicknesses. - Next, in the process represented by S300, one side of the
inkjet head 100 can be etched such that a part of thepiezoelectric element 400 remaining between theadjacent actuators 190 is removed. The etching process can be preformed by, for example, wet etching. The etching conditions can be adjusted such that theactuators 190 can be physically separated from one another by removing a part of thepiezoelectric element 400 remaining between theadjacent actuators 190. Various solutions capable of etching thepiezoelectric element 400 can be used as the etchant. For example, it is possible to use a solution having the composition of 1BHF:2HCl:4NH4Cl:4H2O. - Accordingly, the method of manufacturing the
inkjet head 100 in accordance with an embodiment of the present invention can separate theadjacent actuators 190 by complementing the limitations of the dicing process, which is a mechanical method, with the etching process, which is a chemical method. This can give no stress to thefourth plate 40 but can prevent the crosstalk from being generated, thereby improving the discharging property of theinkjet head 100. - On the other hand, the etching process can be performed over the overall part of one side of the
inkjet head 100. The process of forming an additional etching resist on one side of theinkjet head 100 can be omitted. Accordingly, it is possible to remove a part of thepiezoelectric element 400 remaining between theadjacent actuators 190 and simultaneously reduce the thickness of theactuator 190. - As a result, it is possible to decrease the actuating voltage of the
inkjet head 100 and improve the frequency property of theinkjet head 100 because thethin actuator 190 can be formed even though the sintered bulk-shaped piezoelectric element is used. - Hitherto, although some embodiments of the present invention have been shown and described for the above-described objects, it will be appreciated by any person of ordinary skill in the art that a large number of modifications, permutations and additions are possible within the principles and spirit of the invention, the scope of which shall be defined by the appended claims and their equivalents.
Claims (2)
1. A method of manufacturing an inkjet head, the inkjet head including a plurality of chambers containing ink and an actuator providing pressure to the chambers, the method comprising:
forming a piezoelectric element on one side of the inkjet head that is adjacent to the chambers;
forming the actuator(s) by dicing the piezoelectric element such that the piezoelectric element is divided and placed corresponding to a position of the chamber(s); and
etching one side of the inkjet head such that a part of the piezoelectric element remaining between the adjacent actuators is removed.
2. The method of claim 1 , wherein the forming of the piezoelectric element is performed by adhering the sintered piezoelectric element to one side of the inkjet head.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2008-0106925 | 2008-10-30 | ||
KR1020080106925A KR20100047973A (en) | 2008-10-30 | 2008-10-30 | Method for manufacturing ink-jet head |
Publications (1)
Publication Number | Publication Date |
---|---|
US20100107411A1 true US20100107411A1 (en) | 2010-05-06 |
Family
ID=42129694
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/469,278 Abandoned US20100107411A1 (en) | 2008-10-30 | 2009-05-20 | Inkjet head manufacturing method |
Country Status (3)
Country | Link |
---|---|
US (1) | US20100107411A1 (en) |
JP (1) | JP2010105383A (en) |
KR (1) | KR20100047973A (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9139004B2 (en) * | 2012-03-05 | 2015-09-22 | Xerox Corporation | Print head transducer dicing directly on diaphragm |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4751774A (en) * | 1986-08-29 | 1988-06-21 | Dataproducts Corporation | Method of fabricating an ink jet apparatus |
US6076244A (en) * | 1997-11-17 | 2000-06-20 | Seiko Epson Corporation | Heat treatment method of actuators for an ink jet printer head and method for manufacturing an ink jet printer head |
US6223405B1 (en) * | 1996-12-17 | 2001-05-01 | Fujitsu Limited | Method of manufacturing ink jet head |
US6457222B1 (en) * | 1999-05-28 | 2002-10-01 | Hitachi Koki Co., Ltd. | Method of manufacturing ink jet print head |
US6732414B2 (en) * | 1999-12-27 | 2004-05-11 | Seiko Epson Corporation | Method of manufacturing a liquid ink jet head |
US6862783B2 (en) * | 1997-09-30 | 2005-03-08 | Seiko Epson Corporation | Manufacturing method for an ink jet recording head |
US6931702B2 (en) * | 2001-05-28 | 2005-08-23 | Fuji Xerox Co., Ltd. | Inkjet recording head and method for manufacturing the same |
US7225540B2 (en) * | 2002-01-23 | 2007-06-05 | Sharp Kabushiki Kaisha | Method for manufacturing an ink jet head |
US20080295333A1 (en) * | 2007-05-30 | 2008-12-04 | Oce-Technologies B.V. | Method of manufacturing a piezoelectric ink jet device |
US7789491B2 (en) * | 2005-08-02 | 2010-09-07 | Konica Minolta Holdings, Inc. | Inkjet head and method of manufacturing inkjet head |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3575120B2 (en) * | 1995-07-26 | 2004-10-13 | ソニー株式会社 | Printer device and method of manufacturing the same |
JPH09267489A (en) * | 1996-03-31 | 1997-10-14 | Sony Corp | Printer |
JPH11245406A (en) * | 1998-03-03 | 1999-09-14 | Ricoh Co Ltd | Ink-jet head |
JPH11334088A (en) * | 1998-05-27 | 1999-12-07 | Fuji Electric Co Ltd | Manufacture of ink jet recording head |
-
2008
- 2008-10-30 KR KR1020080106925A patent/KR20100047973A/en not_active Application Discontinuation
-
2009
- 2009-05-20 US US12/469,278 patent/US20100107411A1/en not_active Abandoned
- 2009-06-09 JP JP2009138612A patent/JP2010105383A/en active Pending
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4751774A (en) * | 1986-08-29 | 1988-06-21 | Dataproducts Corporation | Method of fabricating an ink jet apparatus |
US6223405B1 (en) * | 1996-12-17 | 2001-05-01 | Fujitsu Limited | Method of manufacturing ink jet head |
US6862783B2 (en) * | 1997-09-30 | 2005-03-08 | Seiko Epson Corporation | Manufacturing method for an ink jet recording head |
US6076244A (en) * | 1997-11-17 | 2000-06-20 | Seiko Epson Corporation | Heat treatment method of actuators for an ink jet printer head and method for manufacturing an ink jet printer head |
US6457222B1 (en) * | 1999-05-28 | 2002-10-01 | Hitachi Koki Co., Ltd. | Method of manufacturing ink jet print head |
US6732414B2 (en) * | 1999-12-27 | 2004-05-11 | Seiko Epson Corporation | Method of manufacturing a liquid ink jet head |
US6931702B2 (en) * | 2001-05-28 | 2005-08-23 | Fuji Xerox Co., Ltd. | Inkjet recording head and method for manufacturing the same |
US7225540B2 (en) * | 2002-01-23 | 2007-06-05 | Sharp Kabushiki Kaisha | Method for manufacturing an ink jet head |
US7789491B2 (en) * | 2005-08-02 | 2010-09-07 | Konica Minolta Holdings, Inc. | Inkjet head and method of manufacturing inkjet head |
US20080295333A1 (en) * | 2007-05-30 | 2008-12-04 | Oce-Technologies B.V. | Method of manufacturing a piezoelectric ink jet device |
Also Published As
Publication number | Publication date |
---|---|
KR20100047973A (en) | 2010-05-11 |
JP2010105383A (en) | 2010-05-13 |
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Legal Events
Date | Code | Title | Description |
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AS | Assignment |
Owner name: SAMSUNG ELECTRO-MECHANICS CO., LTD.,KOREA, REPUBLI Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:KIM, BOUM-SEOCK;JOUNG, JAE-WOO;YANG, JU-HWAN;AND OTHERS;REEL/FRAME:022712/0354 Effective date: 20090311 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |