US20110005967A1 - Methods and apparatuses for large diameter wafer handling - Google Patents

Methods and apparatuses for large diameter wafer handling Download PDF

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Publication number
US20110005967A1
US20110005967A1 US12/812,729 US81272909A US2011005967A1 US 20110005967 A1 US20110005967 A1 US 20110005967A1 US 81272909 A US81272909 A US 81272909A US 2011005967 A1 US2011005967 A1 US 2011005967A1
Authority
US
United States
Prior art keywords
wafer
door
door frame
container
wafers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/812,729
Other languages
English (en)
Inventor
Barry Gregerson
Michael Shawn Adams
Jason Todd Steffens
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Entegris Inc
Original Assignee
Entegris Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Entegris Inc filed Critical Entegris Inc
Priority to US12/812,729 priority Critical patent/US20110005967A1/en
Assigned to ENTEGRIS, INC. reassignment ENTEGRIS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: GREGERSON, BARRY, ADAMS, MICHAEL SHAWN, STEFFENS, JASON TODD
Publication of US20110005967A1 publication Critical patent/US20110005967A1/en
Abandoned legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D25/00—Details of other kinds or types of rigid or semi-rigid containers
    • B65D25/02—Internal fittings
    • B65D25/10—Devices to locate articles in containers
    • B65D25/103—V-shaped elements, e.g. racks, protuberances projecting from a supporting surface, supporting the articles locally at its sides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D25/00—Details of other kinds or types of rigid or semi-rigid containers
    • B65D25/28—Handles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D43/00—Lids or covers for rigid or semi-rigid containers
    • B65D43/02—Removable lids or covers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • B65D85/38—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for delicate optical, measuring, calculating or control apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/70—Containers, packaging elements or packages, specially adapted for particular articles or materials for materials not otherwise provided for
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67383—Closed carriers characterised by substrate supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67386—Closed carriers characterised by the construction of the closed carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
US12/812,729 2008-01-13 2009-01-13 Methods and apparatuses for large diameter wafer handling Abandoned US20110005967A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/812,729 US20110005967A1 (en) 2008-01-13 2009-01-13 Methods and apparatuses for large diameter wafer handling

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US2073608P 2008-01-13 2008-01-13
US61020736 2008-01-13
US13460408P 2008-07-11 2008-07-11
US61134604 2008-07-11
US12/812,729 US20110005967A1 (en) 2008-01-13 2009-01-13 Methods and apparatuses for large diameter wafer handling
PCT/US2009/030870 WO2009089552A2 (en) 2008-01-13 2009-01-13 Methods and apparatuses for large diameter wafer handling

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2009/030870 A-371-Of-International WO2009089552A2 (en) 2008-01-13 2009-01-13 Methods and apparatuses for large diameter wafer handling

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US13/847,345 Continuation US8919563B2 (en) 2008-01-13 2013-03-19 Methods and apparatus for large diameter wafer handling

Publications (1)

Publication Number Publication Date
US20110005967A1 true US20110005967A1 (en) 2011-01-13

Family

ID=40853795

Family Applications (3)

Application Number Title Priority Date Filing Date
US12/812,729 Abandoned US20110005967A1 (en) 2008-01-13 2009-01-13 Methods and apparatuses for large diameter wafer handling
US13/847,345 Active US8919563B2 (en) 2008-01-13 2013-03-19 Methods and apparatus for large diameter wafer handling
US14/558,445 Active 2029-02-21 US9592930B2 (en) 2008-01-13 2014-12-02 Methods and apparatus for large diameter wafer handling

Family Applications After (2)

Application Number Title Priority Date Filing Date
US13/847,345 Active US8919563B2 (en) 2008-01-13 2013-03-19 Methods and apparatus for large diameter wafer handling
US14/558,445 Active 2029-02-21 US9592930B2 (en) 2008-01-13 2014-12-02 Methods and apparatus for large diameter wafer handling

Country Status (7)

Country Link
US (3) US20110005967A1 (de)
EP (2) EP2243156B1 (de)
JP (2) JP2011510491A (de)
KR (3) KR20150023941A (de)
CN (1) CN101981684B (de)
TW (2) TWI469901B (de)
WO (1) WO2009089552A2 (de)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD668865S1 (en) * 2010-10-19 2012-10-16 Entegris, Inc. Substrate container
WO2013025629A2 (en) 2011-08-12 2013-02-21 Entegris, Inc. Wafer carrier
US20130082015A1 (en) * 2011-09-29 2013-04-04 Semiconductor Manufacturing International Corporation Elastic retention wheels and wafer adapter containing the same wheels
US20130190924A1 (en) * 2012-01-24 2013-07-25 Kabushiki Kaisha Yaskawa Denki Robot system
CN103811392A (zh) * 2014-03-10 2014-05-21 上海华虹宏力半导体制造有限公司 晶圆叉件安装方法
US20140302447A1 (en) * 2013-04-09 2014-10-09 Asm Ip Holding B.V. Wafer boat having dual pitch
US20150129459A1 (en) * 2012-05-04 2015-05-14 Entegris, Inc. Replaceable wafer support backstop
USD740031S1 (en) * 2010-10-19 2015-10-06 Entegris, Inc. Substrate container
US20150294882A1 (en) * 2012-11-20 2015-10-15 Miraial Co., Ltd. Substrate storing container
US20150364346A1 (en) * 2013-01-14 2015-12-17 Pico&Tera Co., Ltd. Exhaust system of wafer treatment device
US20160225647A1 (en) * 2013-09-11 2016-08-04 Miraial Co., Ltd. Substrate storage container
TWI596693B (zh) * 2012-04-09 2017-08-21 恩特葛瑞斯股份有限公司 晶圓載運器
US10339490B1 (en) * 2012-08-22 2019-07-02 Amazon Technologies, Inc. Dynamically generating orientation information for containers
US10358736B2 (en) * 2015-03-10 2019-07-23 Bum Je WOO Purge gas spraying plate for fume removing of a semiconductor manufacturing apparatus

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011108715A (ja) * 2009-11-13 2011-06-02 Shin Etsu Polymer Co Ltd 基板収納容器
WO2011102318A1 (ja) 2010-02-19 2011-08-25 信越ポリマー株式会社 基板収納容器
JP2011253960A (ja) * 2010-06-02 2011-12-15 Shin Etsu Polymer Co Ltd 基板収納容器
US20130270152A1 (en) * 2010-10-19 2013-10-17 Entegris, Inc. Front opening wafer container with robotic flange
JP2014513442A (ja) 2011-05-03 2014-05-29 インテグリス・インコーポレーテッド パーティクルシールドを有するウェハ容器
US9520264B2 (en) * 2012-03-19 2016-12-13 Varian Semiconductor Equipment Associates, Inc. Method and apparatus for clamping and cooling a substrate for ion implantation
JP2014007344A (ja) 2012-06-26 2014-01-16 Disco Abrasive Syst Ltd 収容カセット
US10190235B2 (en) * 2013-05-24 2019-01-29 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer supporting structure and method for forming the same
KR20160021215A (ko) * 2013-06-18 2016-02-24 엔테그리스, 아이엔씨. 중량 밸러스트를 갖는 전방 개방 웨이퍼 컨테이너
TWI549881B (zh) * 2014-11-14 2016-09-21 Chung King Entpr Co Ltd Substrate storage container and its manufacturing method
JP2018526824A (ja) * 2015-08-25 2018-09-13 インテグリス・インコーポレーテッド モジュール式基板支持柱のインターロック
US10124492B2 (en) 2015-10-22 2018-11-13 Lam Research Corporation Automated replacement of consumable parts using end effectors interfacing with plasma processing system
US9881820B2 (en) * 2015-10-22 2018-01-30 Lam Research Corporation Front opening ring pod
US10062599B2 (en) 2015-10-22 2018-08-28 Lam Research Corporation Automated replacement of consumable parts using interfacing chambers
US20170115657A1 (en) 2015-10-22 2017-04-27 Lam Research Corporation Systems for Removing and Replacing Consumable Parts from a Semiconductor Process Module in Situ
US10361108B2 (en) 2015-12-14 2019-07-23 Solarcity Corporation Ambidextrous cassette and methods of using same
DE102016119888B3 (de) * 2016-10-19 2018-03-08 Asys Automatic Systems Gmbh & Co. Kg Arbeitseinheit zur Umsetzung von Substraten
US11121019B2 (en) 2018-06-19 2021-09-14 Kla Corporation Slotted electrostatic chuck
NL2022185B1 (nl) * 2018-12-12 2020-07-02 Suss Microtec Lithography Gmbh Substratkassette
TWI740502B (zh) * 2020-05-15 2021-09-21 強友企業有限公司 晶圓載具與收納晶圓於晶圓載具之方法
US11676838B2 (en) 2021-02-26 2023-06-13 Visera Technologies Company Limiied Wafer cassette
WO2023188147A1 (ja) * 2022-03-30 2023-10-05 アキレス株式会社 半導体ウェーハ搬送容器

Citations (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5988392A (en) * 1997-09-01 1999-11-23 Shin-Etsu Polymer Co., Ltd. Shipping container
US6186331B1 (en) * 1998-04-06 2001-02-13 Dainichi Shoji K.K. Container
US6206196B1 (en) * 1999-01-06 2001-03-27 Fluoroware, Inc. Door guide for a wafer container
US20020005369A1 (en) * 1999-01-06 2002-01-17 Nyseth David L. Door guide for a wafer container
US6446806B1 (en) * 1998-11-24 2002-09-10 Shin-Etsu Polymer Co., Ltd. Transportation container and method for opening and closing lid thereof
US20030106831A1 (en) * 2001-11-14 2003-06-12 Entegris, Inc. Wafer enclosure sealing arrangement for wafer containers
US6581264B2 (en) * 2000-05-02 2003-06-24 Shin-Etsu Polymer Co., Ltd. Transportation container and method for opening and closing lid thereof
US20030141217A1 (en) * 2002-01-28 2003-07-31 Park Dong-Jin Workpiece container assembly and apparatus for opening/closing the same
US6736268B2 (en) * 1997-07-11 2004-05-18 Entegris, Inc. Transport module
US20050115867A1 (en) * 2003-11-07 2005-06-02 John Burns Wafer container and door with vibration dampening latching mechanism
US6902063B2 (en) * 2002-09-04 2005-06-07 Industrial Technology Research Institute Latching mechanism for locking/unlocking the door of a wafer container
US20050173296A1 (en) * 2001-07-23 2005-08-11 Yukihiro Hyobu Lid unit for thin-plate holding container, thin-plate holding container, and simplified attaching/detaching mechanism
US6945405B1 (en) * 1999-07-08 2005-09-20 Entegris, Inc. Transport module with latching door
US20060027477A1 (en) * 2002-12-02 2006-02-09 Miraial Co., Ltd. Thin plate storage container
US7100772B2 (en) * 2003-11-16 2006-09-05 Entegris, Inc. Wafer container with door actuated wafer restraint
US20060283774A1 (en) * 2005-05-17 2006-12-21 Shin-Etsu Polymer Co., Ltd. Substrate storage container and method for manufacturing the same
US20070151897A1 (en) * 2005-12-29 2007-07-05 Shin-Etsu Polymer Co., Ltd. Substrate storage container
US20070187287A1 (en) * 2004-03-12 2007-08-16 Junya Toda Substrate storage container
US20070295638A1 (en) * 2006-06-21 2007-12-27 Vantec Co., Ltd. Wafer transportable container
US20080041761A1 (en) * 2006-06-28 2008-02-21 Takuji Nakatogawa Wafer carrier positioning structure

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4043451A (en) * 1976-03-18 1977-08-23 Fluoroware, Inc. Shipping container for silicone semiconductor wafers
TW296361B (de) * 1995-06-26 1997-01-21 Kakizaki Seisakusho Kk
US6776289B1 (en) * 1996-07-12 2004-08-17 Entegris, Inc. Wafer container with minimal contact
JP3968142B2 (ja) 1997-02-20 2007-08-29 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 包装容器における半導体ウェハの支持溝構造
JPH1116997A (ja) * 1997-06-23 1999-01-22 Komatsu Ltd 合成樹脂製容器の密閉構造と同構造を備えた半導体ウェハ包装容器
US6214127B1 (en) * 1998-02-04 2001-04-10 Micron Technology, Inc. Methods of processing electronic device workpieces and methods of positioning electronic device workpieces within a workpiece carrier
US6267245B1 (en) 1998-07-10 2001-07-31 Fluoroware, Inc. Cushioned wafer container
JP2001301878A (ja) * 2000-04-26 2001-10-31 Vantec Co Ltd 半導体ウェハ包装容器輸送用コンテナ
US6779667B2 (en) * 2001-08-27 2004-08-24 Entegris, Inc. Modular carrier for semiconductor wafer disks and similar inventory
TW511649U (en) * 2001-09-12 2002-11-21 Ind Tech Res Inst Wafer retainer
JP3910397B2 (ja) 2001-10-12 2007-04-25 信越ポリマー株式会社 基板収納容器用ガスケット部材及びこれを用いた基板収納容器
WO2003042071A1 (en) * 2001-11-14 2003-05-22 Entegris, Inc. Wafer carrier with wafer retaining system
JP3924714B2 (ja) * 2001-12-27 2007-06-06 東京エレクトロン株式会社 ウエハカセット
JP2003303879A (ja) * 2002-04-11 2003-10-24 Fujitsu Ltd 半導体基板収納容器
EP1548820B1 (de) * 2002-09-11 2010-12-15 Shin-Etsu Polymer Co., Ltd. Substratlagerungsbehälter
TW553195U (en) 2002-10-09 2003-09-11 Foxsemicon Integrated Tech Inc Substrate supporting slot plate and substrate cassette using the same
KR101029434B1 (ko) * 2003-03-04 2011-04-14 신에츠 폴리머 가부시키가이샤 정밀 기판 수납 용기
US7455181B2 (en) * 2003-05-19 2008-11-25 Miraial Co., Ltd. Lid unit for thin plate supporting container
US7347329B2 (en) * 2003-10-24 2008-03-25 Entegris, Inc. Substrate carrier
US7316325B2 (en) * 2003-11-07 2008-01-08 Entegris, Inc. Substrate container
CN1906098A (zh) * 2003-11-16 2007-01-31 安堤格里斯公司 具有门驱动的晶片限制装置的晶片容器
US7325693B2 (en) 2003-11-16 2008-02-05 Entegris, Inc. Wafer container and door with cam latching mechanism
JP4681221B2 (ja) 2003-12-02 2011-05-11 ミライアル株式会社 薄板支持容器
JP2005294386A (ja) * 2004-03-31 2005-10-20 Miraial Kk 薄板支持容器用蓋体
TWI423451B (zh) * 2004-04-18 2014-01-11 Entegris Inc 具有流體密封流動通道之基板容器
JP4667769B2 (ja) * 2004-06-11 2011-04-13 信越ポリマー株式会社 基板収納容器
JP4338617B2 (ja) * 2004-10-20 2009-10-07 信越ポリマー株式会社 基板収納容器
TW200624353A (en) * 2004-12-20 2006-07-16 Miraial Co Ltd Lid unit for thin-plate supporting container and method for attaching lid unit
JP4587828B2 (ja) 2005-02-03 2010-11-24 信越ポリマー株式会社 精密基板用の固定治具
WO2006087894A1 (ja) 2005-02-03 2006-08-24 Shin-Etsu Polymer Co., Ltd. 固定キャリア、固定キャリアの製造方法、固定キャリアの使用方法、及び基板収納容器
JP4412235B2 (ja) * 2005-05-25 2010-02-10 信越ポリマー株式会社 基板収納容器
JP2007123685A (ja) 2005-10-31 2007-05-17 Miraial Kk 薄板体収納容器
JP2009543374A (ja) * 2006-07-07 2009-12-03 インテグリス・インコーポレーテッド ウエハカセット
EP2207199B1 (de) * 2007-11-09 2016-11-30 Shin-Etsu Polymer Co. Ltd. Haltevorrichtung und behälter für substrataufbewahrung
JP5269077B2 (ja) * 2008-06-23 2013-08-21 信越ポリマー株式会社 支持体及び基板収納容器
CN102844249B (zh) * 2010-04-20 2014-09-10 未来儿株式会社 基板收纳容器
US8910792B2 (en) * 2010-05-24 2014-12-16 Miraial Co., Ltd. Substrate storage container
TWI465375B (zh) * 2010-06-02 2014-12-21 Gudeng Prec Industral Co Ltd 一種配置有彈性件模組之晶圓盒

Patent Citations (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6736268B2 (en) * 1997-07-11 2004-05-18 Entegris, Inc. Transport module
US5988392A (en) * 1997-09-01 1999-11-23 Shin-Etsu Polymer Co., Ltd. Shipping container
US6186331B1 (en) * 1998-04-06 2001-02-13 Dainichi Shoji K.K. Container
US6446806B1 (en) * 1998-11-24 2002-09-10 Shin-Etsu Polymer Co., Ltd. Transportation container and method for opening and closing lid thereof
US6206196B1 (en) * 1999-01-06 2001-03-27 Fluoroware, Inc. Door guide for a wafer container
US20020005369A1 (en) * 1999-01-06 2002-01-17 Nyseth David L. Door guide for a wafer container
US6945405B1 (en) * 1999-07-08 2005-09-20 Entegris, Inc. Transport module with latching door
US6581264B2 (en) * 2000-05-02 2003-06-24 Shin-Etsu Polymer Co., Ltd. Transportation container and method for opening and closing lid thereof
US20050173296A1 (en) * 2001-07-23 2005-08-11 Yukihiro Hyobu Lid unit for thin-plate holding container, thin-plate holding container, and simplified attaching/detaching mechanism
US20030106831A1 (en) * 2001-11-14 2003-06-12 Entegris, Inc. Wafer enclosure sealing arrangement for wafer containers
US7108135B2 (en) * 2002-01-28 2006-09-19 Samsung Electronics Co., Ltd. Workpiece container assembly and apparatus for opening/closing the same
US20030141217A1 (en) * 2002-01-28 2003-07-31 Park Dong-Jin Workpiece container assembly and apparatus for opening/closing the same
US20060283771A1 (en) * 2002-01-28 2006-12-21 Park Dong-Jin Workpiece container assembly and apparatus for opening/closing the same
US6902063B2 (en) * 2002-09-04 2005-06-07 Industrial Technology Research Institute Latching mechanism for locking/unlocking the door of a wafer container
US20060027477A1 (en) * 2002-12-02 2006-02-09 Miraial Co., Ltd. Thin plate storage container
US20050115867A1 (en) * 2003-11-07 2005-06-02 John Burns Wafer container and door with vibration dampening latching mechanism
US7100772B2 (en) * 2003-11-16 2006-09-05 Entegris, Inc. Wafer container with door actuated wafer restraint
US20060289333A1 (en) * 2003-11-16 2006-12-28 Entegris, Inc. Wafer container with door actuated wafer restraint
US20070187287A1 (en) * 2004-03-12 2007-08-16 Junya Toda Substrate storage container
US20060283774A1 (en) * 2005-05-17 2006-12-21 Shin-Etsu Polymer Co., Ltd. Substrate storage container and method for manufacturing the same
US20070151897A1 (en) * 2005-12-29 2007-07-05 Shin-Etsu Polymer Co., Ltd. Substrate storage container
US20070295638A1 (en) * 2006-06-21 2007-12-27 Vantec Co., Ltd. Wafer transportable container
US20080041761A1 (en) * 2006-06-28 2008-02-21 Takuji Nakatogawa Wafer carrier positioning structure

Cited By (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD668865S1 (en) * 2010-10-19 2012-10-16 Entegris, Inc. Substrate container
USD740031S1 (en) * 2010-10-19 2015-10-06 Entegris, Inc. Substrate container
WO2013025629A2 (en) 2011-08-12 2013-02-21 Entegris, Inc. Wafer carrier
WO2013025629A3 (en) * 2011-08-12 2013-04-18 Entegris, Inc. Wafer carrier
TWI587444B (zh) * 2011-08-12 2017-06-11 恩特葛瑞斯股份有限公司 晶圓載具
US9312157B2 (en) 2011-08-12 2016-04-12 Entegris, Inc. Wafer carrier
US10147624B2 (en) 2011-08-12 2018-12-04 Entegris, Inc. Wafer carrier
US9111973B2 (en) * 2011-09-29 2015-08-18 Semiconductor Manufacturing International Corporation (Shanghai) Elastic retention wheels and wafer adapter containing the same wheels
US20130082015A1 (en) * 2011-09-29 2013-04-04 Semiconductor Manufacturing International Corporation Elastic retention wheels and wafer adapter containing the same wheels
US20130190924A1 (en) * 2012-01-24 2013-07-25 Kabushiki Kaisha Yaskawa Denki Robot system
US8983659B2 (en) * 2012-01-24 2015-03-17 Kabushiki Kaisha Yaskawa Denki Robot system
TWI596693B (zh) * 2012-04-09 2017-08-21 恩特葛瑞斯股份有限公司 晶圓載運器
US20150129459A1 (en) * 2012-05-04 2015-05-14 Entegris, Inc. Replaceable wafer support backstop
US9343345B2 (en) * 2012-05-04 2016-05-17 Entegris, Inc. Replaceable wafer support backstop
US10339490B1 (en) * 2012-08-22 2019-07-02 Amazon Technologies, Inc. Dynamically generating orientation information for containers
US20150294882A1 (en) * 2012-11-20 2015-10-15 Miraial Co., Ltd. Substrate storing container
TWI602756B (zh) * 2012-11-20 2017-10-21 Miraial Co Ltd Substrate storage container
US9768045B2 (en) * 2012-11-20 2017-09-19 Miraial Co., Ltd. Substrate storing container
US20150364346A1 (en) * 2013-01-14 2015-12-17 Pico&Tera Co., Ltd. Exhaust system of wafer treatment device
US11342200B2 (en) * 2013-01-14 2022-05-24 Pico & Tera Co., Ltd. Wafer treatment device
US10008401B2 (en) * 2013-04-09 2018-06-26 Asm Ip Holding B.V. Wafer boat having dual pitch
US20140302447A1 (en) * 2013-04-09 2014-10-09 Asm Ip Holding B.V. Wafer boat having dual pitch
US20160225647A1 (en) * 2013-09-11 2016-08-04 Miraial Co., Ltd. Substrate storage container
US9865487B2 (en) * 2013-09-11 2018-01-09 Miraial Co., Ltd. Substrate storage container
CN103811392A (zh) * 2014-03-10 2014-05-21 上海华虹宏力半导体制造有限公司 晶圆叉件安装方法
US10358736B2 (en) * 2015-03-10 2019-07-23 Bum Je WOO Purge gas spraying plate for fume removing of a semiconductor manufacturing apparatus

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EP2243156A2 (de) 2010-10-27
CN101981684B (zh) 2013-01-30
US20150083640A1 (en) 2015-03-26
JP2011510491A (ja) 2011-03-31
US8919563B2 (en) 2014-12-30
JP5624173B2 (ja) 2014-11-12
KR20140107704A (ko) 2014-09-04
TW200948689A (en) 2009-12-01
WO2009089552A2 (en) 2009-07-16
TWI469901B (zh) 2015-01-21
CN101981684A (zh) 2011-02-23
US9592930B2 (en) 2017-03-14
KR20100105875A (ko) 2010-09-30
EP2243156B1 (de) 2017-07-12
JP2013165292A (ja) 2013-08-22
EP3082154A1 (de) 2016-10-19
EP2243156A4 (de) 2013-08-07
US20130287528A1 (en) 2013-10-31
KR101525753B1 (ko) 2015-06-09
TW201514073A (zh) 2015-04-16

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