US20100326129A1 - Refrigeration apparatus - Google Patents

Refrigeration apparatus Download PDF

Info

Publication number
US20100326129A1
US20100326129A1 US12/866,566 US86656609A US2010326129A1 US 20100326129 A1 US20100326129 A1 US 20100326129A1 US 86656609 A US86656609 A US 86656609A US 2010326129 A1 US2010326129 A1 US 2010326129A1
Authority
US
United States
Prior art keywords
refrigerant
circuit
heat
water
heat exchanger
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/866,566
Other languages
English (en)
Inventor
Michio Moriwaki
Hideki Hara
Syuji Furui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daikin Industries Ltd
Original Assignee
Daikin Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=41015771&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=US20100326129(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Daikin Industries Ltd filed Critical Daikin Industries Ltd
Assigned to DAIKIN INDUSTRIES, LTD. reassignment DAIKIN INDUSTRIES, LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: FURUI, SYUJI, HARA, HIDEKI, MORIWAKI, MICHIO
Publication of US20100326129A1 publication Critical patent/US20100326129A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/02—Materials undergoing a change of physical state when used
    • C09K5/04—Materials undergoing a change of physical state when used the change of state being from liquid to vapour or vice versa
    • C09K5/041—Materials undergoing a change of physical state when used the change of state being from liquid to vapour or vice versa for compression-type refrigeration systems
    • C09K5/044—Materials undergoing a change of physical state when used the change of state being from liquid to vapour or vice versa for compression-type refrigeration systems comprising halogenated compounds
    • C09K5/045—Materials undergoing a change of physical state when used the change of state being from liquid to vapour or vice versa for compression-type refrigeration systems comprising halogenated compounds containing only fluorine as halogen
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B25/00—Machines, plants or systems, using a combination of modes of operation covered by two or more of the groups F25B1/00 - F25B23/00
    • F25B25/005—Machines, plants or systems, using a combination of modes of operation covered by two or more of the groups F25B1/00 - F25B23/00 using primary and secondary systems
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B9/00—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point
    • F25B9/002—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point characterised by the refrigerant
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2205/00—Aspects relating to compounds used in compression type refrigeration systems
    • C09K2205/10—Components
    • C09K2205/12—Hydrocarbons
    • C09K2205/126—Unsaturated fluorinated hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2205/00—Aspects relating to compounds used in compression type refrigeration systems
    • C09K2205/22—All components of a mixture being fluoro compounds

Definitions

  • the present invention relates to a refrigeration apparatus including a refrigerant circuit in which a refrigeration cycle is performed.
  • a refrigeration apparatus including a refrigerant circuit in which a refrigeration cycle is performed has been broadly applied to air conditioners, hot-water supply systems, etc.
  • Patent Document 1 discloses the refrigeration apparatus of this type.
  • the refrigeration apparatus includes a refrigerant circuit which is a closed circuit filled with refrigerant.
  • a compressor, a condenser, an expansion valve, and an evaporator are connected to the refrigerant circuit.
  • refrigerant compressed in the compressor is condensed by releasing heat to air in the condenser.
  • the pressure of the refrigerant condensed in the condenser is reduced by the expansion valve, and then such refrigerant is evaporated in the evaporator.
  • the evaporated refrigerant is sucked into the compressor to be compressed again.
  • the refrigerant has excellent properties as refrigerant of the refrigeration cycle, and a coefficient of performance (COP) of the refrigeration apparatus has been improved.
  • COP coefficient of performance
  • the refrigerant does not contain chlorine atoms, bromine atoms, etc., and does not contribute to destruction of the ozone layer.
  • Patent Document 1 discloses refrigerant mixture (zeotropic refrigerant mixture) of the refrigerant which is represented by the above-described molecular formula, and which has the single double bond in the molecular structure, and other refrigerant (R-22, R-32, etc.).
  • PATENT DOCUMENT 1 Japanese Patent Application No. 04-110388
  • the refrigerant disclosed in Patent Document 1 has properties including the relatively-high theoretical COP and low global warming potential (GWP).
  • the refrigerant is used in the refrigeration cycle, thereby providing an environment-friendly refrigeration apparatus with high operational efficiency.
  • the refrigerant is so-called “low-pressure refrigerant” with a relatively-high boiling point, and has properties which tend to increase an influence of a pressure loss of refrigerant in a refrigerant pipe.
  • input etc. of the compressor increase due to the influence of the pressure loss in the refrigerant pipe, and therefore there is a possibility that an actual operational efficiency is rather degraded.
  • the influence of the pressure loss is markedly increased, thereby further degrading the operational efficiency.
  • the present invention has been made in view of foregoing, and it is an object of the present invention to provide a refrigeration apparatus with high operational efficiency.
  • a first aspect of the invention is intended for a refrigeration apparatus, and the refrigeration apparatus includes a refrigerant circuit ( 11 ) in which a compressor ( 12 ), a heat-source-side heat exchanger ( 13 ), an expansion mechanism ( 15 ), and a utilization-side heat exchanger ( 14 ) are connected together, and a refrigeration cycle is performed by circulating refrigerant; and a casing ( 10 a ) in which the whole of the refrigerant circuit ( 11 ) is accommodated.
  • the refrigeration cycle is performed by circulating the refrigerant.
  • the refrigerant has a relatively-high theoretical COP, and therefore a refrigeration cycle with a high COP can be performed in the refrigerant circuit ( 11 ) of the present invention.
  • the refrigerant has properties including relatively-lower global warming potential (GWP) as compared to that of R410A which is current mainly-used refrigerant, thereby providing an environment-friendly refrigeration apparatus.
  • GWP global warming potential
  • the refrigerant is so-called “low-pressure refrigerant,” and therefore is susceptible to an influence of a pressure loss in a refrigerant pipe of the refrigerant circuit ( 11 ).
  • the whole of the refrigerant circuit ( 11 ) is accommodated in the casing ( 10 a ).
  • a second aspect of the invention is intended for the refrigeration apparatus of the first aspect of the invention, which further includes a heat medium circuit ( 20 , 30 , 51 ) which is connected to the refrigerant circuit ( 11 ) through the utilization-side heat exchanger ( 14 ), and which supplies a heat medium exchanging heat with refrigerant in the utilization-side heat exchanger ( 14 ), to a predetermined heat utilization target ( 3 , 4 , 5 , 6 ).
  • the refrigerant circuit ( 11 ) is connected to the heat medium circuit ( 20 , 30 , 51 ) through the utilization-side heat exchanger ( 14 ).
  • the refrigeration cycle is performed by circulating the refrigerant.
  • the refrigerant releases heat to the heat medium of the heat medium circuit ( 20 , 30 , 51 ), or absorbs heat from the heat medium of the heat medium circuit ( 20 , 30 , 51 ). That is, in the utilization-side heat exchanger ( 14 ), heat is exchanged between the refrigerant of the refrigerant circuit ( 11 ) and the heat medium of the heat medium circuit ( 20 , 30 , 51 ). The heat medium cooled or heated in the utilization-side heat exchanger ( 14 ) is supplied to the predetermined heat utilization target ( 3 , 4 , 5 , 6 ).
  • the refrigerant circuit ( 11 ) is provided separately from the heat medium circuit ( 20 , 30 , 51 ), and the heat medium of the heat medium circuit ( 20 , 30 , 51 ) is sent to the predetermined heat utilization target ( 3 , 4 , 5 , 6 ).
  • the length of the pipe of the refrigerant circuit ( 11 ) can be shortened while controlling the temperature of the predetermined heat utilization target ( 3 , 4 , 5 , 6 ). Consequently, the influence of the pressure loss in the refrigerant circuit ( 11 ) can be minimized, thereby further improving the actual operational efficiency upon the refrigeration cycle.
  • a third aspect of the invention is intended for the refrigeration apparatus of the second aspect of the invention, in which the heat exchanger ( 14 ) serves as a heating heat exchanger ( 14 ) for heating the heat medium of the heat medium circuit ( 20 , 30 , 51 ) by the refrigerant of the refrigerant circuit ( 11 ).
  • the heat medium of the heat medium circuit ( 20 , 30 , 51 ) is heated by the refrigerant of the refrigerant circuit ( 11 ).
  • the heated heat medium is supplied to the predetermined heat utilization target ( 3 , 4 , 5 , 6 ), and then is used for heating the heat utilization target ( 3 , 4 , 5 , 6 ).
  • a fourth aspect of the invention is intended for the refrigeration apparatus of the third aspect of the invention, in which the heat utilization target is a hot-water generator ( 3 , 4 ) for generating hot water.
  • the heat medium heated in the heating heat exchanger ( 14 ) is supplied to the hot-water generator ( 3 , 4 ), and then is used for generating hot water.
  • a fifth aspect of the invention is intended for the refrigeration apparatus of the third aspect of the invention, in which the heat utilization target is a floor heater ( 5 ) for heating a floor surface.
  • the heat medium heated in the heating heat exchanger ( 14 ) is supplied to the floor heater ( 5 ), and then is used for heating the floor surface.
  • a sixth aspect of the invention is intended for the refrigeration apparatus of the second aspect of the invention, in which the utilization-side heat exchanger serves as a cooling heat exchanger ( 14 ) for cooling the heat medium of the heat medium circuit ( 20 , 30 , 51 ) by the refrigerant of the refrigerant circuit ( 11 ).
  • the heat medium of the heat medium circuit ( 20 , 30 , 51 ) is cooled by the refrigerant of the refrigerant circuit ( 11 ).
  • the cooled heat medium is supplied to the predetermined heat utilization target ( 3 , 4 , 5 , 6 ), and then is used for cooling the heat utilization target ( 6 ).
  • a seventh aspect of the invention is intended for the refrigeration apparatus of the sixth aspect of the invention, in which the heat utilization target is a cooler ( 6 ) for generating cold heat.
  • the heat medium cooled in the cooling heat exchanger ( 14 ) is supplied to the cooler ( 6 ), and then is used for, e.g., cooling a room or refrigerating/cooling an inside of a container.
  • An eighth aspect of the invention is intended for the refrigeration apparatus of any one of the second to seventh aspects of the invention, in which the heat medium circuit ( 20 , 30 , 51 ) circulates water which is a heat medium.
  • the water of the heat medium circuit ( 20 , 30 , 51 ) is heated or cooled by the refrigerant of the refrigerant circuit ( 11 ).
  • the water heated or cooled in the heat exchanger ( 14 ) is supplied to the predetermined heat utilization target ( 3 , 4 , 5 , 6 ).
  • the refrigerant (single component refrigerant) containing 2,3,3,3-tetrafluoro-1-propene or the refrigerant mixture containing such refrigerant is used as the refrigerant of the refrigerant circuit ( 11 ).
  • the refrigerant has the relatively-high theoretical COP, thereby improving the theoretical COP in the refrigerant circuit ( 11 ).
  • the refrigerant has the properties including the relatively-lower global warming potential (GWP) as compared to that of R410A which is current mainly-used refrigerant, thereby providing the environment-friendly refrigeration apparatus.
  • GWP global warming potential
  • 2,3,3,3-tetrafluoro-1-propene is low-pressure refrigerant, and is susceptible to the influence of the pressure loss.
  • the whole of the refrigerant circuit ( 11 ) is accommodated in the casing ( 10 a ), thereby shortening the length of the refrigerant pipe. Consequently, as in the first aspect of the invention, the actual operational efficiency upon the refrigeration cycle can be maximized.
  • a tenth aspect of the invention is intended for the refrigeration apparatus of any one of the first to ninth aspects of the invention, in which the refrigerant of the refrigerant circuit ( 11 ) is refrigerant mixture further containing difluoromethane.
  • the refrigerant mixture containing the refrigerant represented by the above-described molecular formula and having the single double bond in the molecular structure, and difluoromethane is used as the refrigerant of the refrigerant circuit ( 11 ).
  • difluoromethane is so-called “high-pressure refrigerant.”
  • difluoromethane is added to the refrigerant represented by the above-described molecular formula, thereby reducing the influence of the pressure loss of the refrigerant on the operational efficiency of the refrigeration apparatus. Consequently, the actual operational efficiency upon the refrigeration cycle can be enhanced.
  • An eleventh aspect of the invention is intended for the refrigeration apparatus of any one of the first to tenth aspects of the invention, in which the refrigerant of the refrigerant circuit ( 11 ) is refrigerant mixture further containing pentafluoroethane.
  • the refrigerant mixture containing the refrigerant represented by the above-described molecular formula and having the single double bond in the molecular structure, and pentafluoroethane is used as the refrigerant of the refrigerant circuit ( 11 ).
  • the refrigerant represented by the above-described molecular formula and having the single double bond in the molecular structure is low flammable refrigerant, but there is no possibility that such refrigerant does not catch fire.
  • pentafluoroethane which is non-flammable refrigerant is added to the refrigerant represented by the above-described molecular formula and having the single double bond in the molecular structure.
  • the refrigerant has the relatively-high theoretical COP, and therefore the theoretical COP of the refrigerant circuit ( 11 ) increases.
  • the refrigerant has the properties including the relatively-lower global warming potential (GWP) as compared to that of R410A which is current mainly-used refrigerant, thereby providing the environment-friendly refrigeration apparatus.
  • GWP global warming potential
  • the whole of the refrigerant circuit ( 11 ) is accommodated in the casing ( 10 a ).
  • the refrigerant circuit ( 11 ) is provided separately from the heat medium circuit ( 20 , 30 , 51 ), thereby further shortening the length of the pipe of the refrigerant circuit ( 11 ). Consequently, the influence of the pressure loss can be further minimized, thereby further enhancing the actual operational efficiency.
  • the length of the pipe of the refrigerant circuit ( 11 ) is shortened, thereby reducing the size of the casing ( 10 a ) in which the refrigerant circuit ( 11 ) is accommodated.
  • the refrigeration apparatus with the high COP can heat the predetermined heat utilization target (the hot-water generators ( 3 , 4 ) or the floor heater ( 5 )).
  • the refrigeration apparatus with the high COP can cool the predetermined heat utilization target (the cooler ( 6 )).
  • the water which is the heat medium circulates in the heat medium circuit ( 20 , 30 , 51 ), thereby providing the heat medium circuit ( 20 , 30 , 51 ) at relatively low cost.
  • the refrigerant containing 2,3,3,3-tetrafluoro-1-propene or the refrigerant mixture containing such refrigerant is used as the refrigerant of the refrigerant circuit ( 11 ), thereby providing the refrigeration apparatus with the high COP.
  • the refrigerant has the properties including the relatively-lower global warming potential (GWP) as compared to that of R410A which is current mainly-used refrigerant, thereby providing the environment-friendly refrigeration apparatus.
  • GWP global warming potential
  • difluoromethane which is the so-called “high-pressure refrigerant” is added to the refrigerant represented by the above-described molecular formula and having the single double bond in the molecular structure. This reduces the influence of the pressure loss of the refrigerant on the operational efficiency of the refrigeration apparatus, thereby improving the actual operational efficiency of the refrigeration apparatus.
  • pentafluoroethane which is the non-flammable refrigerant is added to the refrigerant represented by the above-described molecular formula and having the single double bond in the molecular structure.
  • the refrigerant of the refrigerant circuit ( 11 ) becomes flame-resistant, thereby improving safety of the refrigeration apparatus.
  • FIG. 1 is a schematic configuration diagram of a refrigeration apparatus of a first embodiment.
  • FIG. 2 is a schematic configuration diagram of a refrigeration apparatus of a second embodiment.
  • FIG. 3 is a schematic configuration diagram of a refrigeration apparatus of a third embodiment.
  • a refrigeration apparatus of the present invention serves as a hot-water supply system ( 10 ) in which hot-water generators such as a faucet ( 3 ) and a bathtub ( 4 ) are heat utilization targets.
  • the hot-water supply system ( 10 ) includes a refrigerant circuit ( 11 ); a circulation circuit ( 20 ); and a hot-water utilization circuit ( 30 ).
  • the refrigerant circuit ( 11 ) is connected to the circulation circuit ( 20 ) through a water-heat exchanger ( 14 ).
  • the circulation circuit ( 20 ) is connected to the hot-water utilization circuit ( 30 ) through a hot-water storage tank ( 25 ).
  • the circulation circuit ( 20 ) and the hot-water utilization circuit ( 30 ) serve as a heat medium circuit for supplying hot-water to the heat utilization targets ( 3 , 4 ) as a heat medium.
  • the refrigerant circuit ( 11 ) is a closed circuit in which a refrigeration cycle is performed by circulating refrigerant.
  • the refrigerant circuit ( 11 ) includes a compressor ( 12 ); an air-heat exchanger ( 13 ); the water-heat exchanger ( 14 ); and an expansion valve ( 15 ).
  • the air-heat exchanger ( 13 ) is connected to a suction side of the compressor ( 12 ), and the water-heat exchanger ( 14 ) is connected to a discharge side of the compressor ( 12 ).
  • the expansion valve ( 15 ) is connected between the air-heat exchanger ( 13 ) and the water-heat exchanger ( 14 ).
  • the compressor ( 12 ) is an inverter compressor with variable operational capacity.
  • the air-heat exchanger ( 13 ) is a cross-fin type fin-and-tube heat exchanger, and serves as a heat-source-side heat exchanger.
  • An outdoor fan ( 16 ) is provided near the air-heat exchanger ( 13 ).
  • the expansion valve ( 15 ) is an electric expansion valve with variable opening, and serves as an expansion mechanism.
  • the water-heat exchanger ( 14 ) is a plate-fin type heat exchanger, and serves as a utilization-side heat exchanger.
  • the water-heat exchanger ( 14 ) includes a first flow path ( 14 a ) and a second flow path ( 14 b ).
  • the first flow path ( 14 a ) is connected to the refrigerant circuit ( 11 )
  • the second flow path ( 14 b ) is connected to the circulation circuit ( 20 ). That is, the circulation circuit ( 20 ) is connected to the refrigerant circuit ( 11 ) through the water-heat exchanger ( 14 ).
  • the water-heat exchanger ( 14 ) heat is exchanged between refrigerant flowing in the first flow path ( 14 a ) and water (heat medium) flowing in the second flow path ( 14 b ). That is, the water-heat exchanger ( 14 ) serves as a heating heat exchanger for heating water of the circulation circuit ( 20 ) by refrigerant of the refrigerant circuit ( 11 ).
  • a circulation pump ( 21 ) is provided in the circulation circuit ( 20 ).
  • the circulation pump ( 21 ) serves as a pump mechanism for transferring and circulating water in the circulation circuit ( 20 ).
  • the hot-water storage tank ( 25 ) is connected to the circulation circuit ( 20 ).
  • the hot-water storage tank ( 25 ) is an elongated cylindrical hermetic container.
  • a water supply port ( 26 ), a hot-water outlet port ( 27 ), a water discharge port ( 28 ), and a hot-water inlet port ( 29 ) are formed in the hot-water storage tank ( 25 ).
  • the water supply port ( 26 ) and the water discharge port ( 28 ) are formed in a bottom section of the hot-water storage tank ( 25 ).
  • the hot-water outlet port ( 27 ) is formed in a top section of the hot-water storage tank ( 25 ).
  • the hot-water inlet port ( 29 ) is formed in a section closer to an upper portion of a side wall of the hot-water storage tank ( 25 ).
  • One end of the circulation circuit ( 20 ) is connected to the hot-water inlet port ( 29 ) of the hot-water storage tank ( 25 ), and the other end is connected to the water discharge port ( 28 ) of the hot-water storage tank ( 25 ).
  • a water supply path ( 31 ) and a hot-water supply path ( 32 ) are formed in the hot-water utilization circuit ( 30 ).
  • An upstream side of the water supply path ( 31 ) is connected to supply sources of water such as tap water.
  • An outflow end of the water supply path ( 31 ) is connected to the water supply port ( 26 ) of the hot-water storage tank ( 25 ).
  • An inflow end of the hot-water supply path ( 32 ) is connected to the hot-water outlet port ( 27 ) of the hot-water storage tank ( 25 ).
  • An outflow side of the hot-water supply path ( 32 ) branches into two paths, and such branched paths are connected to a faucet-side flow path ( 33 ) and a bathtub-side flow path ( 34 ).
  • An outflow end of the faucet-side flow path ( 33 ) is connected to the faucet ( 3 ), and an outflow end of the bathtub-side flow path ( 34 ) opens to an inside of the bathtub ( 4 ).
  • a first bypass path ( 35 ) and a second bypass path ( 36 ) are formed in the hot-water utilization circuit ( 30 ). Inflow ends of the first bypass path ( 35 ) and the second bypass path ( 36 ) are connected to the water supply path ( 31 ). An outflow end of the first bypass path ( 35 ) is connected to the faucet-side flow path ( 33 ) through a first mixing valve ( 37 ), and an outflow end of the second bypass path ( 36 ) is connected to the bathtub-side flow path ( 34 ) through a second mixing valve ( 38 ).
  • the whole of the refrigerant circuit ( 11 ) is accommodated in a casing ( 10 a ) of a heat source unit.
  • the whole of the hot-water utilization circuit ( 30 ), the hot-water storage tank ( 25 ), the circulation pump ( 21 ), etc. is accommodated in a casing ( 10 b ) of a hot-water supply unit.
  • the refrigerant circuit ( 11 ) of the present embodiment is filled with single component refrigerant containing HFO-1234yf (2,3,3,3-tetrafluoro-1-propene) as refrigerant.
  • a chemical formula of the HFO-1234yf is represented by an expression CF 3 —CF ⁇ CH 2 .
  • refrigerant compressed in the compressor ( 12 ) flows in the first flow path ( 14 a ) of the water-heat exchanger ( 14 ).
  • the refrigerant is cooled and condensed by water of the circulation circuit ( 20 ).
  • the pressure of the refrigerant condensed in the water-heat exchanger ( 14 ) is reduced by the expansion valve ( 15 ), and then such refrigerant flows into the air-heat exchanger ( 13 ).
  • the refrigerant is evaporated by absorbing heat from outdoor air.
  • the refrigerant evaporated in the air-heat exchanger ( 13 ) is sucked into the compressor ( 12 ) to be compressed again.
  • a refrigeration cycle is performed, in which the water-heat exchanger ( 14 ) serves as a condenser (radiator), and the air-heat exchanger ( 13 ) serves as an evaporator.
  • water transferred by the circulation pump ( 21 ) flows in the second flow path ( 14 b ) of the water-heat exchanger ( 14 ).
  • the water flowing in the second flow path ( 14 b ) is heated by refrigerant flowing in the first flow path ( 14 a ).
  • the hot-water storage tank ( 25 ) is refilled with the water (hot water) heated in the water-heat exchanger ( 14 ). This generates hot water in the hot-water storage tank ( 25 ).
  • the hot water in the hot-water storage tank ( 25 ) is supplied to the faucet ( 3 ) and the bathtub ( 4 ) through the hot-water utilization circuit ( 30 ).
  • the single component refrigerant containing the HFO-1234yf (2,3,3,3-tetrafluoro-1-propene) is used as the refrigerant of the refrigerant circuit ( 11 ).
  • the HFO-1234yf has properties including a relatively-high theoretical COP.
  • such refrigerant is used as the single component refrigerant, thereby performing a refrigeration cycle with excellent operational efficiency. Consequently, an operational efficiency of the hot-water supply system ( 10 ) can be improved.
  • the HFO-1234yf has properties including relatively-lower global warming potential (GWP) as compared to that of R410A which is current mainly-used refrigerant, thereby providing an environment-friendly refrigeration apparatus.
  • GWP global warming potential
  • the HFO-1234yf has a relatively-high boiling point, and serves as so-called “low-pressure refrigerant.”
  • refrigerant is used as the single component refrigerant, resulting in an increase in input etc. of the compressor ( 12 ) due to an influence of a pressure loss of refrigerant. Consequently, there is a possibility that an actual operational efficiency is rather degraded.
  • the whole of the refrigerant circuit ( 11 ) is accommodated in the casing ( 10 a ). This shortens the length of the pipe of the refrigerant circuit ( 11 ).
  • the circulation circuit ( 20 ) and the hot-water utilization circuit ( 30 ) are provided separately from the refrigerant circuit ( 11 ) to supply water heated in the water-heat exchanger ( 14 ) to the heat utilization targets (the faucet ( 3 ) and the bathtub ( 4 )).
  • the length of the refrigerant pipe of the refrigerant circuit ( 11 ) can be requisite minimum. Consequently, in the first embodiment, the influence of the pressure loss of refrigerant in the refrigerant circuit ( 11 ) can be minimized, thereby preventing the degradation of the actual operational efficiency due to the influence of the pressure loss in the refrigerant circuit ( 11 ).
  • the refrigeration apparatus of the present invention serves as a floor heating system ( 40 ) in which a floor heater ( 5 ) is a heat utilization target.
  • the floor heating system ( 40 ) includes a refrigerant circuit ( 11 ) and a circulation circuit ( 20 ) which are similar to those in the first embodiment.
  • the floor heating system ( 40 ) includes a hot-water utilization circuit ( 30 ) which is a closed circuit in which hot-water circulates, and the circulation circuit ( 20 ) and the hot-water utilization circuit ( 30 ) serve as a heat medium circuit.
  • the hot-water utilization circuit ( 30 ) includes the floor heater ( 5 ) and a circulation pump ( 41 ).
  • the circulation pump ( 41 ) is provided on an upstream side of the floor heater ( 5 ).
  • the floor heater ( 5 ) is installed below a floor of a room, and heats the floor by hot water.
  • the whole of the refrigerant circuit ( 11 ) is accommodated in a casing ( 10 a ) of a heat source unit.
  • refrigerant circuit ( 11 ) of the second embodiment single component refrigerant containing HFO-1234yf (2,3,3,3-tetrafluoro-1-propene) is used as in the first embodiment.
  • water is used as a heat medium.
  • a compressor ( 12 ), and two circulation pumps ( 21 , 41 ) are in operation.
  • a refrigeration cycle similar to that of the first embodiment is performed.
  • a hot-water storage tank ( 25 ) is refilled with water heated in a water-heat exchanger ( 14 ) as necessary.
  • the hot water drawn from the hot-water storage tank ( 25 ) into the hot-water utilization circuit ( 30 ) flows in a heat exchange section ( 5 a ) of the floor heater ( 5 ).
  • heat exchange section ( 5 a ) heat of the hot water is released to a floor surface. Consequently, the floor surface is heated to heat the room.
  • the single component refrigerant containing the HFO-1234yf (2,3,3,3-tetrafluoro-1-propene) is also used as the refrigerant of the refrigerant circuit ( 11 ), thereby providing the floor heating system ( 40 ) with a high COP.
  • the whole of the refrigerant circuit ( 11 ) is accommodated in the casing ( 10 a ), and the refrigerant circuit ( 11 ) is separated from the heat medium circuits ( 20 , 30 ), thereby allowing the requisite minimum length of the pipe of the refrigerant circuit ( 11 ).
  • the influence of the pressure loss in the refrigerant pipe can be also minimized, thereby improving an actual operational efficiency of the floor heating system ( 40 ).
  • the refrigeration apparatus of the present invention serves as a so-called “heat-pump/chiller type” air conditioning system ( 50 ) in which a plurality of air conditioning units ( 6 ) are heat utilization targets.
  • a refrigerant circuit ( 11 ) of the third embodiment includes a four-way switching valve ( 17 ).
  • the four-way switching valve ( 17 ) has first to fourth ports.
  • the first port is connected to a discharge side of a compressor ( 12 ); the second port is connected to a suction side of the compressor ( 12 ); the third port is connected to one end of an air-heat exchanger ( 13 ); and the fourth port is connected to one end of a water-heat exchanger ( 14 ).
  • the four-way switching valve ( 17 ) is switchable between a state in which the first port communicates with the fourth port with the second port communicating with the third port (state indicated by a solid line in FIG. 3 ), and a state in which the first port communicates with the third port with the second port communicating with the fourth port (state indicated by a dashed line in FIG. 3 ).
  • the air conditioning system ( 50 ) includes an air-conditioning-side circuit ( 51 ).
  • the air-conditioning-side circuit ( 51 ) is connected to a second flow path ( 14 b ) of the water-heat exchanger ( 14 ), and serves as a heat medium circuit.
  • the plurality of air conditioning units ( 6 ) are connected in parallel.
  • the air conditioning units ( 6 ) are installed in a ceiling etc. of a room of a building etc.
  • the air conditioning unit ( 6 ) serves as a fan coil unit including an indoor heat exchanger and an indoor fan. Further, the whole of the refrigerant circuit ( 11 ) is accommodated in a casing ( 10 a ) of a heat source unit.
  • each of the air conditioning units ( 6 ) switches between a cooling operation and a heating operation.
  • the four-way switching valve ( 17 ) of the refrigerant circuit ( 11 ) is in the state indicated by the dashed line in FIG. 3 . Consequently, in the refrigerant circuit ( 11 ), a refrigeration cycle is performed, in which the air-heat exchanger ( 13 ) serves as a condenser (radiator), and the water-heat exchanger ( 14 ) serves as an evaporator. That is, in the air-conditioning-side circuit ( 51 ), water flowing in the second flow path ( 14 b ) of the water-heat exchanger ( 14 ) is cooled by refrigerant flowing in a first flow path ( 14 a ).
  • the water cooled in the water-heat exchanger ( 14 ) is sent to each of the air conditioning units ( 6 ).
  • room air is cooled by the water.
  • the water-heat exchanger ( 14 ) serves as a cooling heat exchanger for cooling water of the air-conditioning-side circuit ( 51 ).
  • the air conditioning unit ( 6 ) serves as a cooler for cooling room air.
  • the four-way switching valve ( 17 ) of the refrigerant circuit ( 11 ) is in the state indicated by the solid line in FIG. 3 . Consequently, in the refrigerant circuit ( 11 ), a refrigeration cycle is performed, in which the water-heat exchanger ( 14 ) serves as the condenser (radiator), and the air-heat exchanger ( 13 ) serves as the evaporator. That is, in the air-conditioning-side circuit ( 51 ), water flowing in the second flow path ( 14 b ) of the water-heat exchanger ( 14 ) is heated by refrigerant flowing in the first flow path ( 14 a ).
  • the water heated in the air-heat exchanger ( 13 ) is sent to each of the air conditioning units ( 6 ).
  • room air is heated by the water.
  • the water-heat exchanger ( 14 ) serves as a heating heat exchanger for heating water of the air-conditioning-side circuit ( 51 ).
  • the air conditioning unit ( 6 ) serves as a heater for heating room air.
  • the single component refrigerant containing the HFO-1234yf (2,3,3,3-tetrafluoro-1-propene) is also used as the refrigerant of the refrigerant circuit ( 11 ), thereby providing the air conditioning system ( 50 ) with a high COP.
  • the whole of the refrigerant circuit ( 11 ) is accommodated in the casing ( 10 a ), and the refrigerant circuit ( 11 ) is separated from the heat medium circuits ( 20 , 30 , 51 ), thereby minimizing an influence of a pressure loss in the refrigerant circuit ( 11 ). Consequently, an actual operational efficiency of the floor heating system ( 40 ) can be improved.
  • the foregoing embodiments may have the following configurations.
  • single component refrigerant may be used, which is refrigerant represented by the above-described molecular formula and having a single double bond in a molecular structure other than the HFO-1234yf.
  • refrigerant includes, e.g., 1,2,3,3,3-pentafluoro-1-propene (referred to as “HFO-1225ye,” and a chemical formula thereof is represented by an expression CF 3 —CF ⁇ CHF); 1,3,3,3-tetrafluoro-1-propene (referred to as “HFO-1234ze,” and a chemical formula thereof is represented by an expression CF 3 —CH ⁇ CHF); 1,2,3,3-tetrafluoro-1-propene (referred to as “HFO-1234ye,” and a chemical formula thereof is represented by an expression CHF 2 —CF ⁇ CHF); 3,3,3-trifluoro-1-propene (referred to as “HFO-1243zf,” and a chemical formula thereof is represented by an expression CF 3 —CH ⁇ CH 2 ); 1,2,2-trifluoro-1-propene (a chemical formula thereof is represented by an expression CH 3 —CF ⁇ CF 2 ); and 2-fluoro-1-propene (a chemical formula thereof is
  • refrigerants other than HFC-32 may be used as refrigerant to be mixed with the refrigerant represented by the above-described molecular formula and having the single double bond in the molecular structure.
  • the mixed refrigerant is made by using at least one of HFC-32 (difluoromethane); HFC-125 (pentafluoroethane); HFC-134 (1,1,2,2-tetrafluoroethane); HFC-134a (1,1,1,2-tetrafluoroethane); HFC-143a (1,1,1-trifluoroethane); HFC-152a (1,1-difluoroethane); HFC-161 (fluoroethane); HFC-227ea (1,1,1,2,3,3,3-heptafluoropropane); HFC-236ea (1,1,1,2,3,3-hexafluoropropane); HFC-236fa (1,1,1,3,3,3-hexafluoropropane
  • a mixing ratio may be as follows. That is, for the refrigerant mixture of the HFO-1234yf and the HFC-32, the proportion of the HFO-1234yf may be equal to or greater than 70% by mass and equal to or less than 94% by mass, and the proportion of the HFC-32 may be equal to or greater than 6% by mass and equal to or less than 30% by mass.
  • the proportion of the HFO-1234yf may be preferably equal to or greater than 77% by mass and equal to or less than 87% by mass, and the proportion of the HFC-32 may be preferably equal to or greater than 13% by mass and equal to or less than 23% by mass.
  • the proportion of the HFO-1234yf may be equal to or greater than 77% by mass and equal to or less than 79% by mass, and the proportion of the HFC-32 may be equal to or greater than 21% by mass and equal to or less than 23% by mass. More preferably, the proportion of the HFO-1234yf may be 78.2% by mass, and the proportion of the HFC-32 may be 21.8% by mass.
  • Refrigerant mixture of the HFO-1234yf and the HFC-125 may be used.
  • the proportion of the HFC-125 may be equal to or greater than 10% by mass, and more preferably equal to or greater than 10% by mass and equal to or less than 20% by mass.
  • Refrigerant mixture of the HFO-1234yf, the HFC-32, and the HFC-125 may be used.
  • the refrigeration apparatus of the present invention may be applied to other systems other than the hot-water supply system ( 10 ), the floor heating system ( 40 ), and the air conditioning system ( 50 ).
  • the present invention may be applied to, e.g., a window-type air conditioner in which the whole of a refrigerant circuit ( 11 ) is accommodated in a casing; and a roof-trap-type or central air conditioner in which cold/warm air is transferred through a duct.
  • the present invention may be applied to a freezing/refrigeration apparatus (in particular, a refrigeration apparatus for cooling a refrigerator or an inside of a container for marine transportation etc.) in which the whole of a refrigerant circuit ( 11 ) is accommodated in a casing.
  • the present invention may be applied to a snow melting system for melting snow by a heat medium, a chiller unit only for cooling, a turbo refrigerator, etc.
  • Air may be used as a heat medium instead of water.
  • water mixed with brine or antifreeze solution to lower a freezing point may be used as a heat medium.
  • the heat source of the refrigerant circuit is air in the embodiments, but such a heat source may be a water heat source or an underground heat source.
  • the present invention is useful for the refrigeration apparatus which includes the refrigerant circuit in which the refrigeration cycle is performed, and which supplies warm/cold heat to predetermined heat utilization target(s).

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Combustion & Propulsion (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Heat-Pump Type And Storage Water Heaters (AREA)
  • Other Air-Conditioning Systems (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)
US12/866,566 2008-02-29 2009-02-24 Refrigeration apparatus Abandoned US20100326129A1 (en)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2008050855 2008-02-29
JP2008-050855 2008-02-29
JP2008-070240 2008-03-18
JP2008070240 2008-03-18
JP2008-105821 2008-04-15
JP2008105821A JP2009257652A (ja) 2008-02-29 2008-04-15 冷凍装置
PCT/JP2009/000800 WO2009107364A1 (fr) 2008-02-29 2009-02-24 Appareil de réfrigération

Publications (1)

Publication Number Publication Date
US20100326129A1 true US20100326129A1 (en) 2010-12-30

Family

ID=41015771

Family Applications (1)

Application Number Title Priority Date Filing Date
US12/866,566 Abandoned US20100326129A1 (en) 2008-02-29 2009-02-24 Refrigeration apparatus

Country Status (7)

Country Link
US (1) US20100326129A1 (fr)
EP (1) EP2246649B2 (fr)
JP (1) JP2009257652A (fr)
CN (1) CN101946135B (fr)
BR (2) BR122019017243B1 (fr)
ES (1) ES2634625T5 (fr)
WO (1) WO2009107364A1 (fr)

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100319377A1 (en) * 2008-03-04 2010-12-23 Michio Moriwaki Refrigeration apparatus
US20110219794A1 (en) * 2009-10-29 2011-09-15 Mitsubishi Electric Corporation Apparatus using refrigerant, and method for installing apparatus using refrigerant
US20130167572A1 (en) * 2010-10-12 2013-07-04 Mitsubishi Electric Corporation Air-conditioning apparatus
US20130284464A1 (en) * 2011-01-11 2013-10-31 Mary E. Koban Methods of reducing flame propogation in systems with a flammable refrigerant
US20140144066A1 (en) * 2011-01-25 2014-05-29 Technologies Holdings Corp. Portable heating system and method for pest control
US9005468B2 (en) 2010-05-11 2015-04-14 Arkema France Heat-transfer fluids and use thereof in countercurrent heat exchangers
US9039922B2 (en) 2009-09-11 2015-05-26 Arkema France Low-temperature and average-temperature refrigeration
US9133379B2 (en) 2009-09-11 2015-09-15 Arkema France Binary refrigerating fluid
US20150300709A1 (en) * 2012-12-20 2015-10-22 Mitsubishi Electric Corporation Air-conditioning apparatus
US9315706B2 (en) 2010-09-20 2016-04-19 Arkema France 3,3,3-trifluoropropene compositions
CN105589536A (zh) * 2014-11-11 2016-05-18 北京仙络科技发展有限公司 液体传输系统及装置
US20160245558A1 (en) * 2013-10-17 2016-08-25 Carrier Corporation Two-phase refrigeration system
US9574124B2 (en) 2010-03-02 2017-02-21 Arkema France Heat-transfer fluid for a centrifugal compressor
US9599381B2 (en) 2008-10-08 2017-03-21 Arkema France Heat transfer fluid
US9683157B2 (en) 2009-09-11 2017-06-20 Arkema France Heat transfer method
US10035938B2 (en) 2009-09-11 2018-07-31 Arkema France Heat transfer fluid replacing R-134a
US10308854B2 (en) 2010-05-11 2019-06-04 Arkema France Heat-transfer fluids and use thereof in countercurrent heat exchangers

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB201002625D0 (en) 2010-02-16 2010-03-31 Ineos Fluor Holdings Ltd Heat transfer compositions
US8333901B2 (en) 2007-10-12 2012-12-18 Mexichem Amanco Holding S.A. De C.V. Heat transfer compositions
US8512591B2 (en) 2007-10-12 2013-08-20 Mexichem Amanco Holding S.A. De C.V. Heat transfer compositions
US8628681B2 (en) 2007-10-12 2014-01-14 Mexichem Amanco Holding S.A. De C.V. Heat transfer compositions
JP2009257652A (ja) 2008-02-29 2009-11-05 Daikin Ind Ltd 冷凍装置
US11214720B2 (en) 2009-07-29 2022-01-04 Honeywell International Inc. Compositions containing difluoromethane and fluorine substituted olefins
FR2950069B1 (fr) 2009-09-11 2011-11-25 Arkema France Utilisation de compositions ternaires
WO2011099065A1 (fr) * 2010-02-10 2011-08-18 三菱電機株式会社 Climatiseur
GB201002622D0 (en) 2010-02-16 2010-03-31 Ineos Fluor Holdings Ltd Heat transfer compositions
AU2010353438B2 (en) 2010-05-20 2013-08-22 Mexichem Amanco Holding S.A. De C.V. Heat transfer compositions
US8808570B2 (en) 2010-05-20 2014-08-19 Mexichem Amanco Holding S.A. De C.V. Heat transfer compositions
GB2481443B (en) 2010-06-25 2012-10-17 Mexichem Amanco Holding Sa Heat transfer compositions
PT2894209T (pt) * 2012-09-04 2022-01-27 Daikin Ind Ltd Método para encher mistura refrigerante contendo 2,3,3,3-tetrafluoropropeno
US10330364B2 (en) 2014-06-26 2019-06-25 Hudson Technologies, Inc. System and method for retrofitting a refrigeration system from HCFC to HFC refrigerant
FR3064275B1 (fr) * 2017-03-21 2019-06-07 Arkema France Procede de chauffage et/ou climatisation d'un vehicule
CN111998569A (zh) 2020-09-10 2020-11-27 上海海洋大学 可用于箱门防冻的冷藏集装箱制冷系统

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04110388A (ja) * 1990-08-31 1992-04-10 Daikin Ind Ltd 熱伝達用流体
US6895768B2 (en) * 2001-06-11 2005-05-24 Daikin Industries, Ltd. Refrigerant circuit
US20050167516A1 (en) * 2002-03-20 2005-08-04 Kenichi Saitoh Heat pump hot-water supply system
US20060243944A1 (en) * 2005-03-04 2006-11-02 Minor Barbara H Compositions comprising a fluoroolefin
EP1780476A1 (fr) * 2004-07-01 2007-05-02 Daikin Industries, Ltd. Dispositif d"approvisionnement en eau chaude
US20070096053A1 (en) * 2005-11-03 2007-05-03 Honeywell International Inc. Direct conversion of HCFC 225ca/cb mixture to HFC 245cb and HFC 1234yf
US20080157022A1 (en) * 2004-12-21 2008-07-03 Singh Rajiv R Stabilized Iodocarbon Compositions
US7458418B2 (en) * 2003-01-13 2008-12-02 Carrier Corporation Storage tank for hot water systems
US7655610B2 (en) * 2004-04-29 2010-02-02 Honeywell International Inc. Blowing agent compositions comprising fluorinated olefins and carbon dioxide
US20110011123A1 (en) * 2008-03-18 2011-01-20 Hideki Matsuura Refrigeration apparatus
US8308936B2 (en) * 2007-06-27 2012-11-13 Daikin Industries, Ltd. Heat pump-type hot-water supply device
US20120285186A1 (en) * 2009-12-28 2012-11-15 Daikin Europe N.V. Heat pump system
US8385729B2 (en) * 2009-09-08 2013-02-26 Rheem Manufacturing Company Heat pump water heater and associated control system

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0712810Y2 (ja) * 1990-03-28 1995-03-29 三菱重工業株式会社 ゾーン形成空気調和装置
US6327866B1 (en) 1998-12-30 2001-12-11 Praxair Technology, Inc. Food freezing method using a multicomponent refrigerant
JP3159200B2 (ja) 1999-03-02 2001-04-23 ダイキン工業株式会社 空気調和装置
US6986262B2 (en) 2002-11-28 2006-01-17 Sanyo Electric Co., Ltd. Binary refrigeration unit
JP2006105560A (ja) * 2004-10-08 2006-04-20 Matsushita Electric Ind Co Ltd 空気調和装置
JP5011713B2 (ja) * 2005-11-22 2012-08-29 株式会社デンソー ヒートポンプ式給湯装置
GB0614080D0 (en) 2006-07-17 2006-08-23 Ineos Fluor Holdings Ltd Heat transfer compositions
GB2441006A (en) 2006-08-17 2008-02-20 Ineos Fluor Holdings Ltd Fluid Composition
JP2009074018A (ja) 2007-02-27 2009-04-09 Nippon Oil Corp 冷凍機油および冷凍機用作動流体組成物
AR066522A1 (es) 2007-05-11 2009-08-26 Du Pont Metodo para intercambiar calor en un sistema de transferencia de calor por compresion de vapor y un sistema de transferencia de calor por compresion de vapor que comprende un intercambiador de calor intermediario con un evaporador o condensador de doble fila
JP2009257652A (ja) 2008-02-29 2009-11-05 Daikin Ind Ltd 冷凍装置
JP2009257655A (ja) 2008-03-04 2009-11-05 Daikin Ind Ltd 冷凍装置
ES2581933T3 (es) 2008-07-30 2016-09-08 Honeywell International Inc. Composiciones que contienen olefinas sustituidas con difluorometano y flúor

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04110388A (ja) * 1990-08-31 1992-04-10 Daikin Ind Ltd 熱伝達用流体
US6895768B2 (en) * 2001-06-11 2005-05-24 Daikin Industries, Ltd. Refrigerant circuit
US20050167516A1 (en) * 2002-03-20 2005-08-04 Kenichi Saitoh Heat pump hot-water supply system
US7458418B2 (en) * 2003-01-13 2008-12-02 Carrier Corporation Storage tank for hot water systems
US20110289748A1 (en) * 2004-04-29 2011-12-01 Honeywell International Inc. Compositions containing tetrafluoropropene and carbon dioxide
US7655610B2 (en) * 2004-04-29 2010-02-02 Honeywell International Inc. Blowing agent compositions comprising fluorinated olefins and carbon dioxide
US20090211282A1 (en) * 2004-07-01 2009-08-27 Daikin Industries, Ltd. Hot water supply system
EP1780476A1 (fr) * 2004-07-01 2007-05-02 Daikin Industries, Ltd. Dispositif d"approvisionnement en eau chaude
US20080157022A1 (en) * 2004-12-21 2008-07-03 Singh Rajiv R Stabilized Iodocarbon Compositions
US20060243944A1 (en) * 2005-03-04 2006-11-02 Minor Barbara H Compositions comprising a fluoroolefin
US20070096053A1 (en) * 2005-11-03 2007-05-03 Honeywell International Inc. Direct conversion of HCFC 225ca/cb mixture to HFC 245cb and HFC 1234yf
US8308936B2 (en) * 2007-06-27 2012-11-13 Daikin Industries, Ltd. Heat pump-type hot-water supply device
US20110011123A1 (en) * 2008-03-18 2011-01-20 Hideki Matsuura Refrigeration apparatus
US8385729B2 (en) * 2009-09-08 2013-02-26 Rheem Manufacturing Company Heat pump water heater and associated control system
US20120285186A1 (en) * 2009-12-28 2012-11-15 Daikin Europe N.V. Heat pump system

Cited By (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100319377A1 (en) * 2008-03-04 2010-12-23 Michio Moriwaki Refrigeration apparatus
US11130893B2 (en) 2008-10-08 2021-09-28 Arkema France Heat transfer fluid
US9599381B2 (en) 2008-10-08 2017-03-21 Arkema France Heat transfer fluid
US9039922B2 (en) 2009-09-11 2015-05-26 Arkema France Low-temperature and average-temperature refrigeration
US9884984B2 (en) 2009-09-11 2018-02-06 Arkema France Binary refrigerating fluid
US10035938B2 (en) 2009-09-11 2018-07-31 Arkema France Heat transfer fluid replacing R-134a
US9133379B2 (en) 2009-09-11 2015-09-15 Arkema France Binary refrigerating fluid
US10858562B2 (en) 2009-09-11 2020-12-08 Arkema France Binary refrigerating fluid
US9683157B2 (en) 2009-09-11 2017-06-20 Arkema France Heat transfer method
US10125296B2 (en) 2009-09-11 2018-11-13 Arkema France Binary refrigerating fluid
US10316231B2 (en) 2009-09-11 2019-06-11 Arkema France Low-temperature and average-temperature refrigeration
US20110219794A1 (en) * 2009-10-29 2011-09-15 Mitsubishi Electric Corporation Apparatus using refrigerant, and method for installing apparatus using refrigerant
US9574124B2 (en) 2010-03-02 2017-02-21 Arkema France Heat-transfer fluid for a centrifugal compressor
US10450489B2 (en) 2010-03-02 2019-10-22 Arkema France Heat-transfer fluid for a centrifugal compressor
US9005468B2 (en) 2010-05-11 2015-04-14 Arkema France Heat-transfer fluids and use thereof in countercurrent heat exchangers
US10858564B2 (en) 2010-05-11 2020-12-08 Arkema France Heat-transfer fluids and use thereof in countercurrent heat exchangers
US9683154B2 (en) 2010-05-11 2017-06-20 Arkema France Heat-transfer fluids and use thereof in countercurrent heat exchangers
US10308854B2 (en) 2010-05-11 2019-06-04 Arkema France Heat-transfer fluids and use thereof in countercurrent heat exchangers
US9315706B2 (en) 2010-09-20 2016-04-19 Arkema France 3,3,3-trifluoropropene compositions
US9494363B2 (en) * 2010-10-12 2016-11-15 Mitsubishi Elelctric Corporation Air-conditioning apparatus
US20130167572A1 (en) * 2010-10-12 2013-07-04 Mitsubishi Electric Corporation Air-conditioning apparatus
US9295860B2 (en) * 2011-01-11 2016-03-29 The Chemours Company Fc, Llc Methods of reducing flame propogation in systems with a flammable refrigerant
US20130284464A1 (en) * 2011-01-11 2013-10-31 Mary E. Koban Methods of reducing flame propogation in systems with a flammable refrigerant
US9578867B2 (en) 2011-01-25 2017-02-28 Technologies Holding Corp. Portable heating system and method for pest control
US9807994B2 (en) 2011-01-25 2017-11-07 Technologies Holdings Corp. Portable heating system and method for pest control
US9374991B2 (en) * 2011-01-25 2016-06-28 Technologies Holdings Corp. Portable heating system and method for pest control
US20140144066A1 (en) * 2011-01-25 2014-05-29 Technologies Holdings Corp. Portable heating system and method for pest control
US9933192B2 (en) * 2012-12-20 2018-04-03 Mitsubishi Electric Corporation Air-conditioning apparatus
US20150300709A1 (en) * 2012-12-20 2015-10-22 Mitsubishi Electric Corporation Air-conditioning apparatus
US10174975B2 (en) * 2013-10-17 2019-01-08 Carrier Corporation Two-phase refrigeration system
US20160245558A1 (en) * 2013-10-17 2016-08-25 Carrier Corporation Two-phase refrigeration system
CN105589536A (zh) * 2014-11-11 2016-05-18 北京仙络科技发展有限公司 液体传输系统及装置

Also Published As

Publication number Publication date
BR122019017243B1 (pt) 2021-06-15
EP2246649A4 (fr) 2014-07-16
CN101946135B (zh) 2012-10-03
BRPI0906025B1 (pt) 2019-11-26
CN101946135A (zh) 2011-01-12
EP2246649B2 (fr) 2023-10-25
BRPI0906025A2 (pt) 2018-05-29
ES2634625T3 (es) 2017-09-28
ES2634625T5 (es) 2024-04-26
JP2009257652A (ja) 2009-11-05
WO2009107364A1 (fr) 2009-09-03
EP2246649A1 (fr) 2010-11-03
EP2246649B1 (fr) 2017-07-19

Similar Documents

Publication Publication Date Title
US20100326129A1 (en) Refrigeration apparatus
US20100319377A1 (en) Refrigeration apparatus
US10619082B2 (en) Refrigerant composition comprising difluoromethane (HFC32) and 2,3,3,3-tetrafluoropropene (HFO1234yf)
TWI254073B (en) Non-azeotropic refrigerant mixture, refrigerating cycle device and refrigerating device
US20230038644A1 (en) Air conditioning process
JP2009222363A (ja) 空気調和装置の更新方法および空気調和装置
JP2009222356A (ja) 冷凍装置及び冷媒充填方法
JP2009222348A (ja) 冷凍装置
JP2020094698A (ja) 冷凍装置
WO2018139589A1 (fr) Dispositif de réfrigération
JP2009250592A (ja) 冷凍装置
JP5245510B2 (ja) 空調システム及び空調システムの室外ユニット
JP2009062471A (ja) 混合作動流体およびそれを用いた冷凍サイクル装置
WO2017145713A1 (fr) Unité d'échange de chaleur
JP2003064352A (ja) 混合作動流体、および冷凍サイクル装置
CN118633008A (zh) 形成制冷剂系统的方法

Legal Events

Date Code Title Description
AS Assignment

Owner name: DAIKIN INDUSTRIES, LTD., JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:MORIWAKI, MICHIO;HARA, HIDEKI;FURUI, SYUJI;SIGNING DATES FROM 20090326 TO 20090408;REEL/FRAME:024808/0026

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION