US20100233638A1 - Substrate treatment apparatus, substrate treatment method, coating and developing apparatus, coating and developing method, and storage medium - Google Patents

Substrate treatment apparatus, substrate treatment method, coating and developing apparatus, coating and developing method, and storage medium Download PDF

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Publication number
US20100233638A1
US20100233638A1 US12/720,072 US72007210A US2010233638A1 US 20100233638 A1 US20100233638 A1 US 20100233638A1 US 72007210 A US72007210 A US 72007210A US 2010233638 A1 US2010233638 A1 US 2010233638A1
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US
United States
Prior art keywords
substrate
developer
resist
cooling
heating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/720,072
Other languages
English (en)
Inventor
Yuichi Yoshida
Hiroshi Arima
Taro Yamamoto
Kousuke Yoshihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Assigned to TOKYO ELECTRON LIMITED reassignment TOKYO ELECTRON LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ARIMA, HIROSHI, YAMAMOTO, TARO, YOSHIDA, YUICHI, YOSHIHARA, KOUSUKE
Publication of US20100233638A1 publication Critical patent/US20100233638A1/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/002—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor using materials containing microcapsules; Preparing or processing such materials, e.g. by pressure; Devices or apparatus specially designed therefor
    • G03F7/0022—Devices or apparatus
    • G03F7/0025—Devices or apparatus characterised by means for coating the developer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • G03F7/405—Treatment with inorganic or organometallic reagents after imagewise removal
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
US12/720,072 2009-03-13 2010-03-09 Substrate treatment apparatus, substrate treatment method, coating and developing apparatus, coating and developing method, and storage medium Abandoned US20100233638A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009062088A JP5099054B2 (ja) 2009-03-13 2009-03-13 基板処理装置、基板処理方法、塗布、現像装置、塗布、現像方法及び記憶媒体
JP2009-062088 2009-03-13

Publications (1)

Publication Number Publication Date
US20100233638A1 true US20100233638A1 (en) 2010-09-16

Family

ID=42731005

Family Applications (1)

Application Number Title Priority Date Filing Date
US12/720,072 Abandoned US20100233638A1 (en) 2009-03-13 2010-03-09 Substrate treatment apparatus, substrate treatment method, coating and developing apparatus, coating and developing method, and storage medium

Country Status (5)

Country Link
US (1) US20100233638A1 (ko)
JP (1) JP5099054B2 (ko)
KR (1) KR101522437B1 (ko)
CN (1) CN101840853B (ko)
TW (1) TWI418955B (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180021806A1 (en) * 2016-07-25 2018-01-25 SCREEN Holdings Co., Ltd. Thermal processing device, substrate processing apparatus and thermal processing method
US20190332013A1 (en) * 2016-09-23 2019-10-31 Tokyo Electron Limited Coating and developing method and coating and developing apparatus

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5566265B2 (ja) * 2010-11-09 2014-08-06 東京エレクトロン株式会社 基板処理装置、プログラム、コンピュータ記憶媒体及び基板の搬送方法
CN102566326A (zh) * 2010-12-08 2012-07-11 无锡华润上华科技有限公司 显影装置
JP6532080B2 (ja) * 2014-05-30 2019-06-19 東京化工機株式会社 基板材の現像装置
JP7009122B2 (ja) * 2017-09-05 2022-01-25 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP7097759B2 (ja) * 2018-06-22 2022-07-08 東京エレクトロン株式会社 基板処理装置および基板処理方法
KR102243063B1 (ko) * 2018-08-08 2021-04-22 세메스 주식회사 액 공급 유닛, 기판 처리 장치, 그리고 기판 처리 방법
KR102288984B1 (ko) * 2018-08-08 2021-08-13 세메스 주식회사 기판 처리 장치 및 방법
JP7232596B2 (ja) * 2018-08-30 2023-03-03 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP7232593B2 (ja) * 2018-08-30 2023-03-03 東京エレクトロン株式会社 基板処理装置および基板処理方法
KR102467529B1 (ko) * 2019-11-07 2022-11-16 세메스 주식회사 반송 유닛, 이를 포함하는 기판 처리 장치 및 기판 처리 방법

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7262829B2 (en) * 2005-02-14 2007-08-28 Tokyo Electron Limited Coating and developing apparatus and coating and developing method
US20080026153A1 (en) * 2006-07-31 2008-01-31 Tokyo Electron Limited Coating and developing system, coating and developing method and storage medium
US7740410B2 (en) * 2004-07-15 2010-06-22 Tokyo Electron Limited Developing apparatus and developing method
US7884622B2 (en) * 2007-08-24 2011-02-08 Tokyo Electron Limited Method of adjusting moving position of transfer arm and position detecting jig

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01302725A (ja) * 1988-05-30 1989-12-06 Nec Corp フォトレジストの現像方法
JP2000286183A (ja) * 1999-03-31 2000-10-13 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
JP2005277268A (ja) * 2004-03-26 2005-10-06 Dainippon Screen Mfg Co Ltd 基板処理装置及び基板処理方法
JP4410119B2 (ja) * 2005-02-03 2010-02-03 東京エレクトロン株式会社 洗浄装置、塗布、現像装置及び洗浄方法
US7503710B2 (en) * 2005-05-30 2009-03-17 Tokyo Electron Limited Substrate processing system
WO2006134902A1 (ja) * 2005-06-13 2006-12-21 Tokuyama Corporation フォトレジスト現像液、および該現像液を用いた基板の製造方法
JP4519036B2 (ja) * 2005-08-30 2010-08-04 東京エレクトロン株式会社 加熱装置、塗布、現像装置及び加熱方法
JP4450784B2 (ja) * 2005-10-19 2010-04-14 東京エレクトロン株式会社 塗布、現像装置及びその方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7740410B2 (en) * 2004-07-15 2010-06-22 Tokyo Electron Limited Developing apparatus and developing method
US20100216077A1 (en) * 2004-07-15 2010-08-26 Tokyo Electron Limited Developing apparatus and developing method
US7262829B2 (en) * 2005-02-14 2007-08-28 Tokyo Electron Limited Coating and developing apparatus and coating and developing method
US20080026153A1 (en) * 2006-07-31 2008-01-31 Tokyo Electron Limited Coating and developing system, coating and developing method and storage medium
US7884622B2 (en) * 2007-08-24 2011-02-08 Tokyo Electron Limited Method of adjusting moving position of transfer arm and position detecting jig

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180021806A1 (en) * 2016-07-25 2018-01-25 SCREEN Holdings Co., Ltd. Thermal processing device, substrate processing apparatus and thermal processing method
US20190332013A1 (en) * 2016-09-23 2019-10-31 Tokyo Electron Limited Coating and developing method and coating and developing apparatus
US10732508B2 (en) * 2016-09-23 2020-08-04 Tokyo Electron Limited Coating and developing method and coating and developing apparatus

Also Published As

Publication number Publication date
JP2010219168A (ja) 2010-09-30
CN101840853A (zh) 2010-09-22
TWI418955B (zh) 2013-12-11
KR20100103413A (ko) 2010-09-27
TW201033758A (en) 2010-09-16
CN101840853B (zh) 2012-05-30
KR101522437B1 (ko) 2015-05-21
JP5099054B2 (ja) 2012-12-12

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AS Assignment

Owner name: TOKYO ELECTRON LIMITED, JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:YOSHIDA, YUICHI;ARIMA, HIROSHI;YAMAMOTO, TARO;AND OTHERS;SIGNING DATES FROM 20100317 TO 20100318;REEL/FRAME:024166/0302

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION