US20080309402A1 - Extinction of plasma arcs - Google Patents

Extinction of plasma arcs Download PDF

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Publication number
US20080309402A1
US20080309402A1 US12/118,897 US11889708A US2008309402A1 US 20080309402 A1 US20080309402 A1 US 20080309402A1 US 11889708 A US11889708 A US 11889708A US 2008309402 A1 US2008309402 A1 US 2008309402A1
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United States
Prior art keywords
power supply
switching device
circuit configuration
energy storing
energy
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US12/118,897
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English (en)
Inventor
Pawel Ozimek
Rafal Bugyi
Robert Dziuba
Andrzej Klimczak
Marcin Zelechowski
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Trumpf Huettinger Sp zoo
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Huettinger Electronic Sp zoo
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Assigned to HUETTINGER ELECTRONIC SP. Z O. O. reassignment HUETTINGER ELECTRONIC SP. Z O. O. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: BUGYI, RAFAL, DZIUBA, ROBERT, KLIMCZAK, ANDRZEJ, OZIMEK, PAWEL, ZELECHOWSKI, MARCIN
Publication of US20080309402A1 publication Critical patent/US20080309402A1/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32055—Arc discharge
    • H01J37/32064—Circuits specially adapted for controlling the arc discharge
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M3/00—Conversion of dc power input into dc power output
    • H02M3/02—Conversion of dc power input into dc power output without intermediate conversion into ac
    • H02M3/04—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters
    • H02M3/06—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using resistors or capacitors, e.g. potential divider
    • H02M3/07—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using resistors or capacitors, e.g. potential divider using capacitors charged and discharged alternately by semiconductor devices with control electrode, e.g. charge pumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32091—Radio frequency generated discharge the radio frequency energy being capacitively coupled to the plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32174—Circuits specially adapted for controlling the RF discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
    • H01M10/425—Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
    • H01M10/425—Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing
    • H01M10/4264—Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing with capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
    • H01M10/44—Methods for charging or discharging
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M3/00—Conversion of dc power input into dc power output
    • H02M3/02—Conversion of dc power input into dc power output without intermediate conversion into ac
    • H02M3/04—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters
    • H02M3/10—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H02M3/145—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
    • H02M3/155—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/26—Plasma torches
    • H05H1/32—Plasma torches using an arc
    • H05H1/34—Details, e.g. electrodes, nozzles
    • H05H1/36—Circuit arrangements
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Definitions

  • the present description relates to a circuit for reducing electrical energy stored in a lead inductance of leads that connect a power supply unit with a load, for example, a plasma application.
  • a lead is any electrical connection, such as a wire or the like, that can be associated with a non-negligible inductance value.
  • a circuit configuration includes a first electrical nonlinear device arranged in parallel with a switching device; and an energy storing device arranged in parallel with the switching device and in series with the first electrical nonlinear device.
  • the nonlinear device is a device in which the current is not proportional to the voltage.
  • a typical nonlinear device is an electrical valve device such as a diode.
  • An electrical switch such as a transistor, a thyristor, or a triac, as well as a varistor or an electromechanical or magnetic device with nonlinear behavior can also be considered as an electrical valve device and therefore as a nonlinear device.
  • the energy storing device can be any device that is able to store energy.
  • Typical energy storing devices are capacitances, inductances, or arrangements containing both, at least one capacitance and at least one inductance.
  • a power supply apparatus can be designed with this circuit configuration.
  • a method of reducing electrical energy stored in a lead inductance includes the steps of: prior to interrupting the power supply, pre-charging the energy storing device arranged in parallel with the switching device to a pre-determined energy level; interrupting the power supply; and discharging electrical energy stored in the energy storing device prior to re-enabling the power supply.
  • a method for arc extinction in plasma applications includes performing the method described above in connection with interrupting power supply to the plasma application.
  • a circuit configuration reduces electrical energy stored in a lead inductance that is formed by a plurality of leads for connecting a power supply unit with a load.
  • the circuit configuration includes a switching device in operative connection with at least one of the leads and configured to enable power to be supplied to the load, a first electrical nonlinear device in parallel with the switching device, an energy storing device in parallel with the switching device and in series with the first electrical nonlinear device, and a pre-charging circuit in operative connection with the energy storing device and being configured to store energy in the energy storing device to a pre-determined energy level while power supply to the load is enabled by the switching device.
  • the first electrical nonlinear device can include a valve device.
  • the valve device can be a diode.
  • the energy storing device can be a capacitive device.
  • the first electrical nonlinear device can be configured to block a pre-charging current from the pre-charging circuit for storing energy in the energy storing device.
  • the pre-charging circuit can be a voltage-controlled externally powered unit.
  • the pre-charging circuit can include a second electrical nonlinear device connected between one of the leads and a node located between the energy storing device and the first electrical nonlinear device.
  • One or more of the first electrical nonlinear device and the second electrical nonlinear device can be a diode or a controlled MOSFET.
  • the first and second electrical nonlinear devices can be arranged with opposite blocking directions.
  • the circuit configuration can include a discharging circuit in operative connection with the energy storing device to discharge electrical energy stored within the energy storing device.
  • the discharging circuit can be integrated with the pre-charging circuit.
  • the discharging circuit can include a resistive element connected in parallel with the second electrical nonlinear device, and a discharge switching device connected to the energy storing device for discharging the energy storing device through the resistive element.
  • the plurality of leads can connect the power supply unit with a plasma application.
  • the circuit configuration can include a power supply unit that supplies power to the load.
  • a power supply apparatus for plasma applications includes a power supply unit; and outputs for supplying power from the power supply unit to a plasma application through a plurality of leads.
  • the power supply apparatus includes a first circuit configuration for reducing electrical energy stored in a lead inductance that is formed by the plurality of leads.
  • the circuit configuration includes a switching device in operative connection with at least one of the leads and configured to enabling power to be supplied to the load; a first electrical nonlinear device in parallel with the switching device; an energy storing device in parallel with the switching device and in series with the first electrical nonlinear device; and a pre-charging circuit in operative connection with the energy storing device and configured to store energy in the energy storing device to a pre-determined energy level while power supply to the load is enabled by the switching device.
  • the power supply apparatus can include a control unit that monitors an operational state of the plasma application, and controls at least the switching device in response to a result of the monitoring.
  • the power supply unit can be a direct current power supply unit.
  • the power supply unit can be an alternating current power supply unit.
  • a method can be performed to reduce electrical energy stored in a lead inductance formed by a plurality of leads that connect a power supply unit with a load.
  • the method includes interrupting power to the load with a switching device that is in operative connection with at least one of the leads; prior to interrupting the power, pre-charging an energy storing device arranged in parallel with the switching device to a pre-determined energy level while the switching device is closed; opening the switching device; and discharging electrical energy stored in the energy storing device prior to closing the switching device.
  • a method can be performed for arc extinction in plasma applications supplied by a direct-current power supply unit.
  • the method includes monitoring an operational state of the plasma application with respect to an occurrence of plasma arcs; interrupting power supply to the plasma application in response to a result of the monitoring by interrupting power to the plasma application by opening a switching device that, when closed, connects the direct-current power supply unit with the plasma application; pre-charging an energy storing device arranged in parallel with the switching device to a pre-determined energy level while the switching device is closed; and discharging electrical energy stored in the energy storing device prior to closing the switching device after power to the load has been interrupted by opening the switching device.
  • Implementations can include one or more of the following features.
  • the method can include applying an adjustable blocking time after interrupting power to the plasma application, during which a further interruption of power supply to the plasma application is inhibited.
  • a method for reducing electrical energy stored in a lead inductance formed by a plurality of leads that connect a power supply unit with a plasma application.
  • the method includes pre-charging an energy storing device arranged in parallel with a switching device that is connected to at least one of the leads to a pre-determined energy level while the switching device is closed; interrupting power to the load by opening the switching device; and discharging electrical energy stored in the energy storing device prior to closing the switching device after power to the load has been interrupted by opening the switching device.
  • circuit configuration, power supply apparatus, and methods described in this description ensure a significant reduction of the energy transferred from the lead inductance to the arc discharge without relying on any shortening of leads or cables. In this way, improved arc extinction and plasma application is enabled without placing constraints on the relative location of power supply unit and the load.
  • a switching device is located between the power supply unit and the load, for example, a plasma application.
  • the switching device is closed during normal operating conditions, and an energy storing device connected in parallel with the switching device is pre-charged to a required energy (voltage) level by means of a pre-charging circuit.
  • the latter can be devised as a voltage-controlled externally powered unit.
  • the switching device is opened so that an output current from the lead inductances flows along a bypass path.
  • the bypass path includes the energy storing device connected in series with an electrical nonlinear device, for example, a diode. This particular arrangement enables transferring a large amount of the residual energy stored in the lead inductance into the energy storing device instead of delivering it to the load, for example, to an arc discharge.
  • Excessive energy stored in the energy storing device can be eliminated by means of a discharging circuit prior to re-enabling power supply to the load.
  • the circuit configuration can be arranged so that the switching device is either arranged on a positive side of the power supply unit or on a negative side of the power supply unit.
  • the pre-charging circuit and the discharging circuit can be integrated in a common circuit entity.
  • the pre-charging circuit and the discharging circuit can be separate circuits.
  • the discharging circuit can include an electrical nonlinear device (for example, a diode) and a resistive element (for example, a discharge resistor) connected in parallel.
  • any one of the elements can be equipped with a heat sink structure in order to efficiently dissipate excess heat.
  • the diodes that are used in the circuit configuration can alternatively be devised as controlled metal oxide semiconductor field effect transistors (MOSFETs).
  • MOSFETs controlled metal oxide semiconductor field effect transistors
  • an adjustable blocking time can be applied after interrupting power supply to the plasma application. During the blocking time, any further interruption of power supply to the plasma application is inhibited. In other words, a subsequent plasma arc extinction is only enabled after the blocking time has ended. Additionally, this feature also enables “swapping” of charges in the pre-charging/discharging circuits.
  • the power supply apparatus can also include a second circuit configuration of the type described above and being connected antiparallel with the circuit configuration.
  • the power supply unit can either be a direct current power supply or an alternating current power supply.
  • FIG. 1 is a circuit diagram of a first implementation of a power supply apparatus including a first implementation of a circuit configuration
  • FIG. 2 is a circuit diagram of a second implementation of a power supply apparatus including a second implementation of a circuit configuration
  • FIG. 3 is a circuit diagram of a third implementation of a power supply apparatus including a third implementation of a circuit configuration
  • FIG. 4 is a circuit diagram of a fourth implementation of a power supply apparatus including a forth implementation of a circuit configuration
  • FIG. 5 is a flow chart of a procedure for arc extinction in plasma applications a procedure for reducing electrical energy.
  • FIG. 1 shows a circuit diagram of a power supply apparatus 1 that is connected with a plasma application 2 , for example, in the form of a plasma device or a plasma chamber, through leads 3 . 1 , 3 . 2 , which are connected to respective outputs 4 . 1 , 4 . 2 of the power supply apparatus 1 .
  • the total lead inductance L can store electrical energy during operation of the power supply apparatus 1 , that is, during operation of plasma application 2 .
  • the output 4 . 1 of the power supply apparatus 1 is connected with a positive pole (+) of a direct current (DC) power supply unit (or generator) 5 in the power supply apparatus 1 .
  • the output 4 . 2 of the power supply apparatus 1 is connected with a negative pole ( ⁇ ) of the DC power supply unit 5 .
  • An electrical nonlinear device in form of a freewheeling diode D 1 is coupled in reverse bias across the positive and negative poles of the power supply unit 5 .
  • a switching device SS in the form of a serial switch.
  • the serial switch SS could be devised in the form of an insulated-gate bipolar transistor (IGBT) or a MOSFET.
  • the serial switch SS is a switch that can be switched on and off at a given time.
  • IGBT insulated-gate bipolar transistor
  • the serial switch SS is another electrical nonlinear device in the form of a diode D 2 .
  • the diode D 2 is connected in series with a capacitor C, so that both the diode D 2 and the capacitor C are arranged in parallel with the serial switch SS, where the cathode of the diode D 2 faces the capacitor C. In this way, the diode D 2 and the capacitor C effectively form a bypass for the serial switch SS.
  • the anode-side connecting node 6 of the diode D 1 is located between the bypass and the negative pole ( ⁇ ) of the power supply unit 5 .
  • the power supply apparatus 1 also includes a pre-charging/discharging circuit 7 that is coupled across terminals of the capacitor C.
  • the pre-charging/discharging circuit 7 can be made as a voltage-controlled, externally powered unit.
  • the pre-charging/discharging circuit 7 includes a voltage source (not shown) for charging the capacitor C to a pre-determined and adjustable voltage level.
  • the pre-charging/discharging circuit 7 presents positive and negative poles (+/ ⁇ ), where the positive pole (+) of pre-charging/discharging circuit 7 is connected between the capacitor C and the cathode of the diode D 2 , and the negative pole ( ⁇ ) of the pre-charging/discharging circuit 7 is connected between the capacitor C and the serial switch SS, that is, between the capacitor C and the anode-side connecting node 6 of the diode D 1 .
  • the diode D 2 is arranged in reverse bias with respect to the pre-charging potential of the pre-charging/discharging circuit 7 and is adapted to block a pre-charging current from the pre-charging circuit/discharging circuit 7 for the charging capacitor C.
  • the capacitor C could be replaced with any sort of energy storing device.
  • the capacitor C could be replaced with an inductor that acts as an energy storing device and the pre-charging/discharging circuit 7 is preferably devised as a current-controlled, externally powered unit.
  • Such an energy storing device can be useful if energy stored in the load is in the form of a capacitance, for example, a capacitance of the plasma.
  • the power supply apparatus 1 further includes a control unit 8 that can perform one or more of control and monitoring functions, as explained in detail below.
  • the control unit 8 could be external to the power supply apparatus 1 .
  • the Control unit 8 is operatively connected with the serial switch SS, the pre-charging/discharging circuit 7 , the power supply unit 5 , and the plasma application 2 .
  • the control unit 8 is a plasma arc detection/extinction unit, and is adapted for monitoring an operational state of the plasma application 2 for detecting occurrences of plasma arcs in order to control operation of the serial switch SS, the pre-charging/discharging circuit 7 , or both in response to the monitoring of the plasma application 2 .
  • the control unit 8 can be adapted to detect plasma arcs directly by monitoring the plasma application 2 , that is, from plasma parameters. Alternatively or additionally, the control unit 8 can be adapted to do so indirectly by monitoring operational parameters of the power supply unit 5 , for example, the output voltage, the output current, or both of the power supply unit 5 .
  • Extinction of detected plasma arcs is generally accomplished by interrupting power supplies to the plasma application 2 by opening the serial switch SS under control of the control unit 8 . Further to this, the design of FIG. 1 ensures a reduction in lead inductance energy to enable faster arc extinction in plasma applications.
  • the serial switch SS Under normal operating conditions, that is, with no arcs detected in plasma application 2 , the serial switch SS is closed, and the pre-charging/discharging circuit 7 pre-charges capacitor C to the pre-determined voltage level.
  • the serial switch SS When a plasma arc is detected by the control unit 8 , the serial switch SS is opened under control of the control unit 8 , thus forcing an output current in the lead inductances L 1 , L 2 , which will generally be increased due to the occurrence of a plasma arc, to flow through the diode D 2 against the initial pre-charged voltage of the capacitor C and then further through the freewheeling diode D 1 via the connecting node 6 .
  • the diode D 2 effectively functions as a bypass diode for the opened serial switch SS.
  • a considerable amount of residual electrical energy which is mainly stored in the lead inductances L 1 , L 2 , is transferred into the capacitor C and stored therein instead of being delivered to the plasma arc or plasma arc discharge. This contributes to an accelerated extinction of plasma arcs. In other words, the total energy transferred to the arc discharge is significantly reduced.
  • the excess electrical energy stored in the capacitor C is eliminated by means of the discharging function of the pre-charging/discharging circuit 7 . Then, the serial switch SS can be safely closed under control of the control unit 8 .
  • control unit 8 includes an additional function 8 a , which provides an adjustable blocking time, that is, a corresponding control signal (not shown) for controlling the serial switch SS, during which a further interruption of power supplied to the plasma application 2 is inhibited.
  • an adjustable blocking time that is, a corresponding control signal (not shown) for controlling the serial switch SS, during which a further interruption of power supplied to the plasma application 2 is inhibited.
  • the blocking time function 8 a ensures that the serial switch SS cannot be opened again during the blocking time—if the serial switch SS has been closed in the meantime in order to re-establish power supplied to the plasma application 2 .
  • the adjustable blocking time enables an adjustable setting of a low arc detection rate, which can be important in order to allow the pre-charging/discharging circuit 7 to swap charges and to avoid excessive heating of the serial switch SS.
  • the serial switch SS can advantageously be equipped with a heat sink structure for dissipating excess heat, which is not shown in FIG. 1 .
  • the serial switch SS, the bypass diode D 2 , the capacitor C, and the pre-charging/discharging circuit 7 together with the freewheeling diode D 1 effectively constitute a circuit configuration 9 for reducing the electrical energy stored in the total lead inductance L formed by the leads L 1 , L 2 .
  • the circuit configuration 9 has been highlighted with a dashed box in FIG. 1 .
  • Both diodes D 1 and D 2 could be replaced by switches, which can be controlled by the control unit 8 .
  • the circuit arrangement consisting of at least two antiparallel circuit configurations 9 is also applicable to a system with a power supply unit 5 that feeds AC energy into the plasma application 2 .
  • FIG. 2 shows a circuit diagram of another implementation of a power supply apparatus 1 ′ including another implementation of the circuit configuration.
  • the power supply apparatus 1 ′ of FIG. 2 is generally similar to that of FIG. 1 , which has been described in detail above, so that the following description focuses on differences between the designs of FIG. 1 and FIG. 2 only.
  • the control unit 8 has been omitted for mere reason of clarity, but the control unit 8 can connect to the switch SS, the power supply unit 5 , the switch DS, and the plasma application 2 .
  • the power supply apparatus 1 ′ of FIG. 2 includes discrete pre-charging and discharging circuits 7 . 1 , 7 . 2 , respectively.
  • the pre-charging circuit 7 . 1 is formed by an electrical nonlinear device in the form of a diode D 3 connected between the positive pole (+) of the power supply unit 5 and a node 10 , which is located between the capacitor C, the cathode of the diode D 3 , and the cathode of the bypass diode D 2 .
  • the discharging circuit 7 . 2 is formed by a resistive element in the form of discharge resistor R connected between the output 4 .
  • the discharging circuit 7 . 2 includes a discharge switching device DS coupled across the positive and negative poles (+/ ⁇ ) of the power supply unit 5 in parallel with the freewheeling diode D 1 .
  • the diodes D 2 and D 3 are arranged with opposite blocking directions, that is, they are connected in a cathode-to-cathode type fashion.
  • Operation of power supply apparatus 1 ′ of FIG. 2 is as follows. Under normal operating conditions, the serial switch SS is closed. The capacitor C is charged through the diode D 3 (charging diode) to an output voltage level of the power supply unit 5 . Upon detection of an arc discharge in the plasma application 2 , as previously described with reference to FIG. 1 , the control unit 8 opens the serial switch SS, thus forcing an output current in the lead inductances L 1 , L 2 to flow through the bypass diode D 2 against the initial voltage of the capacitor C and then further through the freewheeling diode D 1 . Again, owing to this arrangement, a large amount of the residual energy stored in the total lead inductance L is transferred into the capacitor C instead of being delivered to the arc discharge.
  • any one of electrical nonlinear devices D 1 -D 3 could alternatively be a suitably controlled MOSFET, controlling of which could also be provided by the control unit 8 (shown in FIG. 1 ).
  • FIG. 3 shows a circuit diagram of another power supply apparatus 1 ′′ that includes a third implementation of the circuit configuration.
  • the power supply apparatus 1 ′′ of FIG. 3 generally corresponds to that of FIG. 1 so that only differences between these two is explained here in detail.
  • the control unit 8 has been omitted for reason of clarity only; the control unit 8 is connected to the switch SS, the plasma application 2 , the circuit 7 , and the power supply unit 5 .
  • the serial switch SS is arranged on the positive side of the power supply unit 5 , that is, is directly connected with the positive pole (+) of the power supply unit 5 . Consequently, the configuration of the bypass path including the bypass diode D 2 , the capacitor C, and the integrated pre-charging/discharging circuit 7 has been modified accordingly.
  • the bypass diode D 2 is in this apparatus 1 ′′ connected with the capacitor 10 by means of its anode instead of being connected to the capacitor C via its cathode, as it is in FIG. 1 .
  • Operation of the power supply apparatus 1 ′′ of FIG. 3 is similar to that of the power supply apparatus 1 of FIG. 1 so that a detailed description of its operation can be omitted.
  • FIG. 4 shows a circuit diagram of a power supply apparatus 1 ′′′ including a forth implementation of the circuit configuration.
  • the power supply apparatus 1 ′′′ of FIG. 4 is a variation of the power supply apparatus 1 ′ of FIG. 2 .
  • the serial switch SS is located on the positive side (+) of the power supply unit 5 in the power supply apparatus 1 ′′′ of FIG. 4 .
  • the capacitor C and the bypass diode D 2 are re-arranged in the power supply apparatus 1 ′′′ relative to the embodiment of FIG. 2 , as previously described with reference to FIG. 3 .
  • the charging diode D 3 is connected between the negative pole ( ⁇ ) of the power supply unit 5 and the node 10 ′, which is located between the anode of the charging diode D 3 and the capacitor C.
  • the discharge resistor R is connected in parallel with the charging diode D 3 , so that one terminal of the discharge resistor R is connected with the negative pole ( ⁇ ) of the power supply unit 5 while the other terminal of the discharge resistor R is connected with the node 11 ′ located between the node 10 ′ and the anode of the bypass diode D 2 .
  • the diodes D 2 , D 3 are connected in anode-to-anode type fashion, that is, with opposite blocking directions. While the charging diode D 3 of FIG. 4 effectively forms a pre-charging circuit 7 . 1 ′, the switching device DS and the resistor R effectively form a discharging circuit 7 . 2 ′.
  • Operation of the power supply apparatus 1 ′′′ of FIG. 4 corresponds to the operation of the power supply apparatus 1 ′ previously described with reference to FIG. 2 . Therefore, a detailed description thereof can be omitted.
  • the discharge resistors R of FIG. 2 and FIG. 4 can dissipate a considerable amount of heat during operation of the power supply apparatus 1 ′ or 1 ′′′. Therefore, the discharge resistors R, too, can be equipped with heat sink structures (not shown) in order to efficiently dissipate excess heat.
  • FIG. 5 is a flow chart of a procedure for arc extinction in plasma applications that reduces electrical energy supplied to a load.
  • the method starts with step S 100 and can be performed, for example, at least in part by software within the control unit 8 . Initially, assuming normal operation of the power supply apparatus 1 , 1 ′, 1 ′′, 1 ′′′, that is, no arc discharges are detected in the plasma application 2 , temporal blocking of power supply interruption is deactivated.
  • step S 102 the energy storing device (capacitor C) is (pre-)charged, as previously described.
  • step S 104 an operating state of the plasma application 2 is monitored, for example, by the control unit 8 (shown in FIG. 1 ), as previously described. Steps S 102 and S 104 can be performed simultaneously or nearly simultaneously.
  • step S 106 it is decided whether an arc discharge has been detected. If the question in step S 106 (“arc detected?”) is answered in the affirmative (y), in subsequent step S 108 , it is checked whether temporal blocking of power supply interruption has been deactivated. Assuming a deactivated state of temporal blocking, the question in step S 108 (“temporal blocking of power supply interruption deactivated?”) is answered in the affirmative (y) so that in subsequent step S 110 the serial switch SS is opened, thus interrupting the power supplied to the plasma application 2 for arc extinction. Furthermore, residual electrical energy stored in the lead inductances L 1 , L 2 is transferred to the energy storing device (capacitor C), as previously described.
  • step S 112 After a pre-determined (adjustable) amount of time, the energy storing device C is discharged in step S 112 . Then, in step S 114 , temporal blocking of power supply interruption to plasma application 2 is activated. In subsequent step S 116 the serial switch SS is closed, thus re-establishing power supplied to the plasma application 2 . In some implementations, step S 114 could alternatively be performed before step S 112 or after step S 116 . If the question in step S 106 (“arc detected?”) is answered in the negative (n), then the method returns to step S 104 , that is, an operational state of the plasma application 2 is repeatedly monitored, for example, by the control unit 8 .
  • step S 116 the method terminates with step S 118 .
  • the method returns to step S 102 . It may now be assumed that the question in step S 108 (“temporal blocking of power supply interruption deactivated?”) is answered in the negative (n), owing to performing step S 114 . In this case, from step S 108 the method returns to step S 104 .
  • the power supply apparatus of FIGS. 1-4 includes an alternating current (AC) power supply unit.
  • the power supply apparatus or the circuit configuration can be designed to account for the AC power signal and therefore it can include additional components such as an additional capacitor.

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
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  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Power Engineering (AREA)
  • Plasma Technology (AREA)
  • Charge And Discharge Circuits For Batteries Or The Like (AREA)
  • Generation Of Surge Voltage And Current (AREA)
  • Discharge Heating (AREA)
  • Dc-Dc Converters (AREA)
  • Keying Circuit Devices (AREA)
US12/118,897 2007-05-12 2008-05-12 Extinction of plasma arcs Abandoned US20080309402A1 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080203070A1 (en) * 2007-02-22 2008-08-28 Milan Ilic Arc recovery without over-voltage for plasma chamber power supplies using a shunt switch
US20100211230A1 (en) * 2009-02-17 2010-08-19 Albert Bulliard power supply device for plasma processing
US8395078B2 (en) 2008-12-05 2013-03-12 Advanced Energy Industries, Inc Arc recovery with over-voltage protection for plasma-chamber power supplies
US8552665B2 (en) 2010-08-20 2013-10-08 Advanced Energy Industries, Inc. Proactive arc management of a plasma load
US20170287684A1 (en) * 2014-12-19 2017-10-05 Trumpf Huettinger Sp. Z O. O. Detecting an arc occuring during supplying power to a plasma process
US20220052543A1 (en) * 2018-09-26 2022-02-17 Fdk Corporation Battery unit, power storage system, and method for charging/discharging battery unit
US11322926B2 (en) * 2016-06-22 2022-05-03 Eaton Intelligent Power Limited Hybrid DC circuit breaker

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1995818A1 (en) * 2007-05-12 2008-11-26 Huettinger Electronic Sp. z o. o Circuit and method for reducing electrical energy stored in a lead inductance for fast extinction of plasma arcs
DE102010031568B4 (de) * 2010-07-20 2014-12-11 TRUMPF Hüttinger GmbH + Co. KG Arclöschanordnung und Verfahren zum Löschen von Arcs
CN104362593A (zh) * 2014-10-10 2015-02-18 湖南红太阳光电科技有限公司 一种直流磁控溅射镀膜电源快速灭弧电路
EP3054472A1 (en) * 2015-02-03 2016-08-10 TRUMPF Huettinger Sp. Z o. o. Arc treatment device and method therefor
US10300791B2 (en) * 2015-12-18 2019-05-28 Ge Global Sourcing Llc Trolley interfacing device having a pre-charging unit
EP3379672A1 (de) * 2017-03-23 2018-09-26 Siemens Aktiengesellschaft Effiziente vorladung von abschnitten eines gleichspannungsnetzes
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US11183844B2 (en) * 2018-06-14 2021-11-23 Arm Limited Supplying energy to an apparatus
WO2024015158A1 (en) * 2022-07-14 2024-01-18 Lam Research Corporation Metal-oxide varistor (mov) based surge protection circuit for plasma processing chamber

Citations (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3867669A (en) * 1974-01-11 1975-02-18 Yakov Lvovich Krasik Power source with a sparkproof output
US4428023A (en) * 1980-02-25 1984-01-24 Bbc Brown, Boveri & Company Limited Electronic protective circuit
US4459629A (en) * 1981-11-23 1984-07-10 General Electric Company Electric circuit breaker utilizing semiconductor diodes for facilitating interruption
US5192894A (en) * 1991-08-20 1993-03-09 Leybold Aktiengesellschaft Device for the suppression of arcs
US5241152A (en) * 1990-03-23 1993-08-31 Anderson Glen L Circuit for detecting and diverting an electrical arc in a glow discharge apparatus
US5303139A (en) * 1991-07-31 1994-04-12 Magtron Magneto Elektronische Gerate Gmbh Low frequency, pulsed, bipolar power supply for a plasma chamber
US5427669A (en) * 1992-12-30 1995-06-27 Advanced Energy Industries, Inc. Thin film DC plasma processing system
US5535906A (en) * 1995-01-30 1996-07-16 Advanced Energy Industries, Inc. Multi-phase DC plasma processing system
US5584974A (en) * 1995-10-20 1996-12-17 Eni Arc control and switching element protection for pulsed dc cathode sputtering power supply
US5645698A (en) * 1992-09-30 1997-07-08 Advanced Energy Industries, Inc. Topographically precise thin film coating system
US5651865A (en) * 1994-06-17 1997-07-29 Eni Preferential sputtering of insulators from conductive targets
US5682067A (en) * 1996-06-21 1997-10-28 Sierra Applied Sciences, Inc. Circuit for reversing polarity on electrodes
US5718813A (en) * 1992-12-30 1998-02-17 Advanced Energy Industries, Inc. Enhanced reactive DC sputtering system
US5889391A (en) * 1997-11-07 1999-03-30 Sierra Applied Sciences, Inc. Power supply having combined regulator and pulsing circuits
US6522076B2 (en) * 2000-03-28 2003-02-18 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Process and switching arrangement for pulsing energy introduction into magnetron discharges
US6621674B1 (en) * 1999-08-13 2003-09-16 Hüttinger Elektronik GmbH & Co. KG Electric supply unit for plasma installations
US20040055881A1 (en) * 2002-09-25 2004-03-25 Christie David J. High peak power plasma pulsed supply with arc handling
US6876205B2 (en) * 2003-06-06 2005-04-05 Advanced Energy Industries, Inc. Stored energy arc detection and arc reduction circuit
US6943317B1 (en) * 2004-07-02 2005-09-13 Advanced Energy Industries, Inc. Apparatus and method for fast arc extinction with early shunting of arc current in plasma
US20080061794A1 (en) * 2006-09-13 2008-03-13 Joshua Brian Pankratz System and Method for Managing Power Supplied to a Plasma Chamber

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3514690A1 (de) 1985-04-24 1986-10-30 Aeg-Elotherm Gmbh, 5630 Remscheid Gleichspannungsquelle fuer anlagen zur oberflaechenbearbeitung von werkstuecken, insbesondere fuer eine ionitrierhaertanlage
DE3538494A1 (de) 1985-10-30 1987-05-07 Boehringer Andreas Aus einer gleichspannungsquelle gespeiste elektrische schaltungsanordnung zur versorgung eines verbraucherzweipols mit eingepraegtem, jedoch unterbrechbarem gleichstrom oder eingepraegtem, jedoch unterbrechbarem, blockfoermigem wechselstrom mit einstellbarer begrenzung der spannungen am verbraucherzweipol und an den verwendeten elektronischen einwegschaltern
DE3706153A1 (de) * 1987-02-26 1988-09-08 Roewac Elektrotechnische Fabri Elektrische sicherheitsschaltung fuer plasma-schneidanlagen
CH689767A5 (de) 1992-03-24 1999-10-15 Balzers Hochvakuum Verfahren zur Werkstueckbehandlung in einer Vakuumatmosphaere und Vakuumbehandlungsanlage.
DE4239218C2 (de) 1992-11-21 2000-08-10 Leybold Ag Anordnung zum Verhindern von Überschlägen in einem Plasma-Prozeßraum
FR2728408B1 (fr) * 1994-12-20 1997-01-31 Alsthom Cge Alcatel Dispositif d'alimentation electrique notamment pour appareils portatifs
JP2733454B2 (ja) 1995-02-16 1998-03-30 株式会社京三製作所 成膜装置用異常放電抑制装置
US5882492A (en) 1996-06-21 1999-03-16 Sierra Applied Sciences, Inc. A.C. plasma processing system
US6416638B1 (en) * 1997-02-20 2002-07-09 Shibaura Mechatronics Corporation Power supply unit for sputtering device
US6104967A (en) 1997-07-25 2000-08-15 3M Innovative Properties Company Fault-tolerant battery system employing intra-battery network architecture
US6043636A (en) * 1997-10-20 2000-03-28 Diversified Technologies, Inc. Voltage transient suppression
JPH11178333A (ja) * 1997-12-15 1999-07-02 Sansha Electric Mfg Co Ltd 直流電源装置
KR100571116B1 (ko) * 2001-09-28 2006-04-13 시바우라 메카트로닉스 가부시키가이샤 스퍼터링용 전원 장치
AUPR967301A0 (en) * 2001-12-21 2002-01-24 Energy Storage Systems Pty Ltd A control circuit
JP4100938B2 (ja) 2002-03-14 2008-06-11 芝浦メカトロニクス株式会社 アーク遮断回路、スパッタ用電源及びスパッタ装置
AU2002951291A0 (en) * 2002-09-09 2002-09-19 Energy Storage Systems Pty Ltd A power supply
JP2005537776A (ja) * 2002-08-29 2005-12-08 エナジィ・ストーリッジ・システムズ・プロプライエタリー・リミテッド 予め定められた期間中に高電力を必要とする通信モジュールのための電源
JP2004194420A (ja) 2002-12-11 2004-07-08 Shibaura Mechatronics Corp 電源、電源システム、スパッタリング用電源及びスパッタリング装置
US6967305B2 (en) * 2003-08-18 2005-11-22 Mks Instruments, Inc. Control of plasma transitions in sputter processing systems
JP4597886B2 (ja) 2005-02-24 2010-12-15 イーエヌ テクノロジー インコーポレイテッド プラズマ電源装置用アークエネルギー制御回路
JP5057731B2 (ja) * 2005-09-16 2012-10-24 株式会社半導体エネルギー研究所 表示装置、モジュール、及び電子機器
TWI332742B (en) * 2006-04-21 2010-11-01 Delta Electronics Inc Uninterruptible power supply capable of providing sinusoidal-wave ouput ac voltage and method thereof
TWI309498B (en) * 2006-06-09 2009-05-01 Delta Electronics Inc Resonant converter and voltage stabilizing method thereof
EP1995818A1 (en) * 2007-05-12 2008-11-26 Huettinger Electronic Sp. z o. o Circuit and method for reducing electrical energy stored in a lead inductance for fast extinction of plasma arcs

Patent Citations (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3867669A (en) * 1974-01-11 1975-02-18 Yakov Lvovich Krasik Power source with a sparkproof output
US4428023A (en) * 1980-02-25 1984-01-24 Bbc Brown, Boveri & Company Limited Electronic protective circuit
US4459629A (en) * 1981-11-23 1984-07-10 General Electric Company Electric circuit breaker utilizing semiconductor diodes for facilitating interruption
US5241152A (en) * 1990-03-23 1993-08-31 Anderson Glen L Circuit for detecting and diverting an electrical arc in a glow discharge apparatus
US5303139A (en) * 1991-07-31 1994-04-12 Magtron Magneto Elektronische Gerate Gmbh Low frequency, pulsed, bipolar power supply for a plasma chamber
US5192894A (en) * 1991-08-20 1993-03-09 Leybold Aktiengesellschaft Device for the suppression of arcs
US5645698A (en) * 1992-09-30 1997-07-08 Advanced Energy Industries, Inc. Topographically precise thin film coating system
US6024844A (en) * 1992-12-30 2000-02-15 Advanced Energy Industries, Inc. Enhanced reactive DC sputtering system
US5718813A (en) * 1992-12-30 1998-02-17 Advanced Energy Industries, Inc. Enhanced reactive DC sputtering system
US5427669A (en) * 1992-12-30 1995-06-27 Advanced Energy Industries, Inc. Thin film DC plasma processing system
US6001224A (en) * 1993-04-02 1999-12-14 Advanced Energy Industries, Inc. Enhanced reactive DC sputtering system
US5651865A (en) * 1994-06-17 1997-07-29 Eni Preferential sputtering of insulators from conductive targets
US5535906A (en) * 1995-01-30 1996-07-16 Advanced Energy Industries, Inc. Multi-phase DC plasma processing system
US5584974A (en) * 1995-10-20 1996-12-17 Eni Arc control and switching element protection for pulsed dc cathode sputtering power supply
US5682067A (en) * 1996-06-21 1997-10-28 Sierra Applied Sciences, Inc. Circuit for reversing polarity on electrodes
US5889391A (en) * 1997-11-07 1999-03-30 Sierra Applied Sciences, Inc. Power supply having combined regulator and pulsing circuits
US6621674B1 (en) * 1999-08-13 2003-09-16 Hüttinger Elektronik GmbH & Co. KG Electric supply unit for plasma installations
US6522076B2 (en) * 2000-03-28 2003-02-18 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Process and switching arrangement for pulsing energy introduction into magnetron discharges
US20040055881A1 (en) * 2002-09-25 2004-03-25 Christie David J. High peak power plasma pulsed supply with arc handling
US6876205B2 (en) * 2003-06-06 2005-04-05 Advanced Energy Industries, Inc. Stored energy arc detection and arc reduction circuit
US6943317B1 (en) * 2004-07-02 2005-09-13 Advanced Energy Industries, Inc. Apparatus and method for fast arc extinction with early shunting of arc current in plasma
US20080061794A1 (en) * 2006-09-13 2008-03-13 Joshua Brian Pankratz System and Method for Managing Power Supplied to a Plasma Chamber

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080203070A1 (en) * 2007-02-22 2008-08-28 Milan Ilic Arc recovery without over-voltage for plasma chamber power supplies using a shunt switch
US8217299B2 (en) 2007-02-22 2012-07-10 Advanced Energy Industries, Inc. Arc recovery without over-voltage for plasma chamber power supplies using a shunt switch
US8884180B2 (en) 2008-12-05 2014-11-11 Advanced Energy Industries, Inc. Over-voltage protection during arc recovery for plasma-chamber power supplies
US8395078B2 (en) 2008-12-05 2013-03-12 Advanced Energy Industries, Inc Arc recovery with over-voltage protection for plasma-chamber power supplies
US8542471B2 (en) 2009-02-17 2013-09-24 Solvix Gmbh Power supply device for plasma processing
US8837100B2 (en) 2009-02-17 2014-09-16 Solvix Gmbh Power supply device for plasma processing
US8854781B2 (en) 2009-02-17 2014-10-07 Solvix Gmbh Power supply device for plasma processing
US20100211230A1 (en) * 2009-02-17 2010-08-19 Albert Bulliard power supply device for plasma processing
US9214801B2 (en) 2009-02-17 2015-12-15 Solvix Gmbh Power supply device for plasma processing
US9997903B2 (en) 2009-02-17 2018-06-12 Solvix Gmbh Power supply device for plasma processing
US8552665B2 (en) 2010-08-20 2013-10-08 Advanced Energy Industries, Inc. Proactive arc management of a plasma load
US20170287684A1 (en) * 2014-12-19 2017-10-05 Trumpf Huettinger Sp. Z O. O. Detecting an arc occuring during supplying power to a plasma process
US10431437B2 (en) * 2014-12-19 2019-10-01 Trumpf Huettinger Sp. Z O. O. Detecting an arc occuring during supplying power to a plasma process
US11322926B2 (en) * 2016-06-22 2022-05-03 Eaton Intelligent Power Limited Hybrid DC circuit breaker
US20220052543A1 (en) * 2018-09-26 2022-02-17 Fdk Corporation Battery unit, power storage system, and method for charging/discharging battery unit
US11777333B2 (en) * 2018-09-26 2023-10-03 Fdk Corporation Backup power storage system with removable secondary battery, and method of operating same

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US20140320015A1 (en) 2014-10-30
JP2010528405A (ja) 2010-08-19
KR101412736B1 (ko) 2014-07-01
EP2156505A1 (en) 2010-02-24
CN101682090B (zh) 2012-10-24
CN101682090A (zh) 2010-03-24
EP2156505B1 (en) 2011-04-06
KR20080100300A (ko) 2008-11-17
US8786263B2 (en) 2014-07-22
WO2008138573A1 (en) 2008-11-20
US9818579B2 (en) 2017-11-14
ATE504956T1 (de) 2011-04-15
JP5096564B2 (ja) 2012-12-12
US20100213903A1 (en) 2010-08-26
JP2008283855A (ja) 2008-11-20
DE602008006070D1 (de) 2011-05-19
EP1995818A1 (en) 2008-11-26

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