US20080083643A1 - Cushioning for packing cassette cases - Google Patents

Cushioning for packing cassette cases Download PDF

Info

Publication number
US20080083643A1
US20080083643A1 US11/869,873 US86987307A US2008083643A1 US 20080083643 A1 US20080083643 A1 US 20080083643A1 US 86987307 A US86987307 A US 86987307A US 2008083643 A1 US2008083643 A1 US 2008083643A1
Authority
US
United States
Prior art keywords
cassette case
molded member
blocks
box
impact absorbing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/869,873
Other languages
English (en)
Inventor
Tomohiro Horio
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumco Corp
Original Assignee
Sumco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumco Corp filed Critical Sumco Corp
Assigned to SUMCO CORPORATION reassignment SUMCO CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HORIO, TOMOHIRO
Publication of US20080083643A1 publication Critical patent/US20080083643A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D65/00—Wrappers or flexible covers; Packaging materials of special type or form
    • B65D65/38—Packaging materials of special type or form
    • B65D65/44—Applications of resilient shock-absorbing materials, e.g. foamed plastics material, honeycomb material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
    • B65D81/02—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage
    • B65D81/05—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents
    • B65D81/107—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents using blocks of shock-absorbing material
    • B65D81/113—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents using blocks of shock-absorbing material of a shape specially adapted to accommodate contents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • B65D85/38—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for delicate optical, measuring, calculating or control apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere

Definitions

  • the present invention relates to a cushioning body for packing a cassette case, more specifically to a cushioning body for packing a cassette case that is formed of foamed material and is used when the cassette case having a substantially rectangular parallelepiped shape is placed and packed in a rectangular parallelepiped cardboard box.
  • Patent Document 1 is known as a conventional cushioning body for packing a cassette case of such a type. More specifically, the patent document discloses, as a cushioning body for transporting semiconductor wafers, a foamed polyethylene cushioning body, which is provided as a pair on upper and lower sides and is inserted between a container and an external box (rectangular parallelepiped cardboard box). The cushioning body is intended to protect a cassette case and semiconductor wafers from vibrations and shocks during transportation. The cushioning body provides a predetermined space between the external box and cassette case, and absorbs and reduces the above-described impact power by elastically deforming itself and the like.
  • Patent Document 1 Japanese Patent Laid-Open Publication No. 2005-41503
  • the conventional cushioning body is constructed with substantially rectangular frames on the upper and lower sides. On an external surface of the frames, two protrusions are provided on each of four side surfaces, such that the protrusions face an internal wall surface of the external box. Thus, a total of eight protrusions are provided on the upper and lower cushioning bodies, so as to provide a predetermined space with the external box.
  • the protrusions on a side that faces a main surface of a plurality of semiconductor wafers loaded vertically in the cassette case are provided in locations out of the main surface (i.e., not directly facing the main surface).
  • the impact force caused by the drop affects the cassette case and eventually the semiconductor wafers, through the cushioning body. Since the protrusions on the side facing the above-described main surface are provided in the locations out of the main surface, the protrusions cannot support the semiconductor wafers as both-end supporting beams. In addition, since the protrusions are provided substantially away from each other, a deflection and deformation amount in a central portion of the main surface of the semiconductor wafers is large, thus potentially causing cracks, scratches, splits of the semiconductor wafers.
  • the present invention is intended to provide a cushioning body for packing a cassette case that is used when the cassette case is placed and packed in a cardboard box and that protects semiconductor wafers in the cassette case from an external impact.
  • the invention according to claim 1 provides a cushioning body for packing a cassette case provided between the cassette case and a box, when the cassette case having a box shape is placed and packed in the box having a rectangular parallelepiped shape, the cassette case being loaded therein with a plurality of semiconductor wafers having a main surface thereof standing substantially vertically.
  • the cushioning body for packing the cassette case includes a lower molded member and an upper molded member.
  • the lower molded member has a substantially rectangular frame body, fits to a bottom portion of the cassette case, contacts an internal bottom wall of the box, and supports the cassette case while having a space between an external wall of the cassette case and an internal wall of the box.
  • the upper molded member has a substantially rectangular frame body, fits to a lid portion of the cassette case, contacts a ceiling wall of the box, and supports the cassette case while having a space between the external wall of the cassette case and the internal wall of the box.
  • At least the upper molded member or lower molded member is provided with lateral impact absorbing blocks that protrude in an orthogonal direction to the main surface of the semiconductor wafers toward the internal wall of the box that faces the main surface.
  • the lateral impact absorbing blocks provided on the upper molded member and lower molded member are disposed such that when the light is emitted in the orthogonal direction to the main surface of the semiconductor wafers in the cassette case so as to project the lateral impact absorbing blocks, the projected image thereof is positioned within the diameter width of the semiconductor wafers from a front view.
  • the lateral impact absorbing blocks are protruded perpendicular to the front and rear surfaces (main surface) of the semiconductor wafers in the above-described cassette case and toward the internal wall of the packing box.
  • the impact force is absorbed or reduced by the above-described lateral impact absorbing blocks, and thereby the impact force exerted on the semiconductor wafers in the cassette case can be reduced.
  • the lateral impact absorbing blocks which are provided such that the blocks are positioned within the diameter (width of the main surface) of the semiconductor wafers, can reduce the impact force that directly affects the main surface of the semiconductor wafers.
  • the lateral impact absorbing blocks protect all semiconductor wafers loaded in the cassette case. Thus, damage to the semiconductor wafers is reduced, and a split or crack is prevented.
  • the lateral impact absorbing blocks on both external surfaces of the upper molded member and lower molded member do not need to be singularly provided on each surface. However, a plurality of blocks may be provided depending on a size of the cassette case. It is preferable that the lateral impact absorbing blocks be provided on each surface at a position opposed to a surface centering on the main surface of the semiconductor wafers (be provided on the both surfaces corresponding to the front and rear surfaces).
  • the respective lateral impact absorbing blocks be provided on symmetric positions of a vertical line (diameter) that passes the center of the semiconductor wafers in the cassette case from a front view of the main surface of the semiconductor wafers.
  • the lateral impact absorbing blocks may be integrally molded with the above-described upper molded member and lower molded member.
  • the lateral impact absorbing blocks may also be formed as separate bodies from the above-described lower molded member, by using a different material (material having a high impact absorbing capability, such as, for example, foamed plastics or rubber having a high elastic coefficient).
  • the invention according to claim 2 provides the cushioning body for packing the cassette case according to claim 1 , wherein the substantially rectangular upper molded member is provided with four upper impact absorbing blocks on an upper surface thereof, the blocks protruding upward from apex positions of a square; and the substantially rectangular lower molded member is provided with four lower impact absorbing blocks on a lower surface thereof, the blocks protruding downward from apex positions of a square.
  • the vertical protrusions are provided on the upper molded member and lower molded member, thereby effectively protecting the cassette case against a vertical impact force.
  • the invention according to claim 3 provides the cushioning body for packing the cassette case according to claim 1 or 2 , wherein two lateral impact absorbing blocks are provided on each of the upper molded member and lower molded member.
  • the four lateral impact absorbing blocks are provided, such that the blocks form a square within a square having a side of the diameter of the main surface of the semiconductor wafers in the cassette case from a front view.
  • the lateral impact absorbing blocks thus can effectively reduce and absorb the impact force perpendicular to the main surface, thereby minimizing damage to the main surface.
  • the structure supports the main surface at four positions.
  • the impact force is absorbed by the above-described lateral impact absorbing blocks, thereby not directly affecting the semiconductor wafers in the cassette case.
  • the lateral impact absorbing blocks are provided so as to be positioned within the main surface width of the semiconductor wafers. Compared to a case where the blocks are provided outside the diameter width of the semiconductor wafers, the blocks work more effectively to reduce the impact force to the semiconductors. Thereby, the lateral impact absorbing blocks protect all semiconductor wafers loaded in the cassette case.
  • the protrusions provided on the upper molded member and lower molded member can reduce and absorb the vertical impact force to the cassette case when the box is dropped.
  • the blocks disposed at the apex positions of the square can evenly receive the vertical impact force at the respective protrusions, and thereby effectively reduce and absorb the impact force.
  • the semiconductor wafers in the cassette case can be effectively protected from the external force even in the most vulnerable direction.
  • FIGS. 1 to 10 illustrate the cushioning body for packaging the cassette case according to one embodiment of the present invention.
  • a box-shaped cassette case 10 is placed in a rectangular parallelepiped cardboard box 11 while being provided with a cushioning body in between, the cardboard box 11 being an external box.
  • the cushioning body includes a lower molded member 12 , which is fitted to a bottom portion of the cassette case 10 , and an upper molded member 13 , which is fitted to a lid portion of the cassette case 10 .
  • the cardboard box 11 has a rectangular parallelepiped shape having predetermined dimensions, in which one cassette case 10 compliant with the SEMI standard is placed and packed.
  • the cassette case 10 is a plastic box having a predetermined substantially rectangular parallelepiped shape, which includes a main body portion having a predetermine depth and a lid portion covering an upper opening thereof. Inside the main body portion, a plurality of silicon wafers W are loaded while being aligned in parallel. For example, 25 silicon wafers W having a diameter of 300 mm are placed into grooves in a vertical (perpendicular to the bottom surface of the cassette case) and parallel position in the cassette case 10 . A direction in which the silicon wafers W are aligned is a long side direction of the cardboard box 11 .
  • the lower molded member 12 is formed by molding foamed material, such as foamed polyethylene, foamed polypropylene, and the like.
  • the lower molded member 12 has a frame body 21 having a rectangular shape provided with an opening at a central portion.
  • the lower molded member 12 fits to the bottom portion of the above-described cassette case 10 while contacting the bottom surface thereof, and supports the cassette case 10 while having a predetermined space with an internal wall of the above-described box 11 . More specifically, four corner portions of the rectangular (substantially # shaped) frame body 21 are provided with long-side direction blocks 23 and short-side direction blocks 24 , which protrude externally within the plain surface.
  • the long-side direction blocks 23 and the short-side direction blocks 24 contact the internal surface (vertical surface) of the box 11 , thereby providing the predetermined space with the internal wall surface (vertical surface) in upper, lower, right, and left directions.
  • the lateral impact absorbing blocks 23 and 24 have a square shape cross-sectionally, protrude from a predetermined position for a predetermined length, and have a flat vertical surface on an end portion of the protruding surface.
  • the respective blocks 23 have a same shape and a same protruding length. As shown in FIG.
  • the blocks 23 protrude having a predetermined distance in between, such that the blocks are positioned within a width of a main surface, or a diameter width, of the semiconductor wafers W placed in the cassette case.
  • two protrusions (blocks) 23 are provided on a front side of the cassette case 10 and two on a rear side. All the protrusions 23 are positioned within the width of the wafer diameter.
  • FIGS. 1 and 2 indicate the positions of the blocks 23 . All the respective short-side direction blocks 24 have a same shape and same dimensions.
  • the lower molded member 12 is further provided with four lower impact absorbing blocks 25 that are disposed at apexes of the square and protrude toward a lower side, so as to provide a predetermined space with an internal bottom surface of the cardboard box 11 .
  • Four lower impact absorbing blocks 25 are provided at the apexes of the square of the rectangular frame body 21 (corresponding to the bottom portion of the cassette case 10 ).
  • the lower impact absorbing blocks 25 have a protruding height of 4.5 cm.
  • the upper molded member 13 which constitutes the upper portion of the cushioning body, fits to the lid portion of the above-described cassette case 10 while contacting the upper surface thereof, similar to the lower molded member 12 .
  • the upper molded member 13 supports the cassette case 10 while having a predetermined space with the internal wall of the above-described box 11 .
  • the upper molded member 13 has a frame body 31 having a rectangular shape (substantially # shape) provided with an opening at a central portion. The rectangular opening is provided on an internal side of the frame body 31 .
  • the bottom surface of the cassette case 10 contacts the rectangular opening portion (a portion of the frame body) so as to be placed.
  • the short-side direction blocks 34 contact the internal surface (vertical surface) of the box, thereby providing the predetermined space with the internal wall surface (vertical surface) of the box in upper, lower, right, and left directions.
  • the blocks have a square shape cross-sectionally, protrude for a predetermined length, and have a flat vertical surface on an end portion of the protruding surface.
  • the frame body 31 is further provided with a total of four long-side direction blocks 33 , similar to the short-side direction blocks 34 .
  • the long-side direction blocks 33 have a square shape cross-sectionally and protrude for a same length perpendicular to the internal surface of the cardboard box 11 , so as to provide a predetermined space between the internal surface and an external surface of the cassette case 10 .
  • the frame body 31 With the long-side direction blocks 33 and the short-side direction blocks 34 , the frame body 31 have a # shape from a plain view.
  • four protrusions 35 are further provided at apexes of the square of the frame body 31 (corresponding to the lid portion of the cassette case 10 ), as shown in FIG. 8 .
  • the protrusions 35 have a same square shape cross-sectionally and a same protruding height, which is set to 1.2 to 2.0 cm.
  • the two long sides of the frame body 21 of the lower molded member 12 are provided with the two protruding blocks 23 on each side having a predetermined distance in between as shown in FIG. 1 .
  • the blocks 23 are provided protruding such that when a light is emitted perpendicular to the main surface of the semiconductor wafers W, a projected location of a projected image of the blocks is positioned within the diameter width of the semiconductor wafers W in the above-described cassette case 10 when the main surface is viewed from a front surface.
  • the four blocks 23 are provided in an orthogonal direction to the main surface (front and rear surfaces) of the above-described silicon wafers W from the lower molded member 12 , and thereby constitute the lateral impact absorbing blocks protruding toward the internal wall surface of the cardboard box 11 .
  • the lateral impact absorbing blocks 23 contact the internal surface (vertical surface) of the cardboard box 11 , thereby providing the predetermined space with the internal surface (vertical surface) of the cardboard box 11 in upper, lower, right, and left directions.
  • the lateral impact absorbing blocks 23 have a flat vertical surface on an end portion of the protruding surface.
  • the plurality of lower impact absorbing blocks 25 protruding toward the lower side of the lower molded member 12 provide the predetermined space with the bottom surface of the box 11 .
  • the lower impact absorbing blocks 25 are provided evenly at the four corner portions of the frame body 21 and have the same height. A protruding surface thereof is flat.
  • the upper molded member 13 and the lower molded member 12 are formed as an integrally molded plastics part using a mold and the like.
  • the cushioning body structured as above is placed in the cardboard box 11 as described below as shown in FIG. 10 .
  • the lower molded member 12 is first set. More specifically, the lower molded member 12 is inserted such that the lower impact absorbing blocks 25 contact the box bottom surface, and then the blocks 23 and 24 contact the box internal surface. Thereafter, the cassette case 10 that contains the semiconductor wafers is inserted from above to the lower molded member 12 and is placed such that the bottom surface of the cassette case fits into the recess space of the lower molded member.
  • a plurality of (25) 300-mm silicon wafers W are placed in the cassette case 10 while being aligned in parallel and in the vertical direction so as to be perpendicular to the bottom surface of the cassette case.
  • the above-described upper molded member 13 is fitted to the upper lid surface of the cassette case 10 .
  • the upper molded member 13 holds the upper end portion of the cassette case 10 in an internal square space of the frame body 31 .
  • the lower molded member 12 holds the lower end portion of the cassette case 10 in an internal square space of the frame body 21 from a plain view.
  • the blocks 23 and 24 that protrude from the frame body 21 in the horizontal direction (lateral direction) provide a predetermined space with the internal wall surface (vertical surface) of the cardboard box 11 .
  • the lower impact absorbing blocks 25 provide a predetermined space with the bottom surface of the cardboard box 11 .
  • the long-side direction blocks 23 of the above-described lower molded member 12 are disposed so as to be perpendicular to the flat surface that includes the front and rear surfaces of the silicon wafers W in the above-described cassette case 10 . Further, the long-side direction blocks 23 are provided protruding from the lower molded member 12 toward the box internal wall surface, such that when a perpendicular light is emitted to project the silicon wafer main surface, a projected image thereof is positioned within the main surface of the silicon wafers W from a front view.
  • the upper molded member 13 and the lower molded member 12 may be fitted to and combined with the cassette case 10 , which may then be placed in the cardboard box 11 .
  • the cushioning body particularly the long-side direction blocks 23 of the lower molded member 12 , can firmly support the cassette case 10 at the internal wall surface of the cardboard box 11 , even though the cardboard box 11 is substantially bent and deformed, and can reduce and absorb the impact force.
  • the respective blocks and the like absorb and reduce the impact simultaneously.
  • four long-side direction blocks (lateral impact absorbing blocks) 23 are provided on each of both the front and rear surface sides within the diameter width of the main surface of the silicon wafers W.
  • the blocks 23 can reduce and absorb the impact force that exerts on the silicon wafers W, and thereby reduce the external force perpendicular to the main surface of the silicon wafers W.
  • the damage to the silicon wafers W in the cassette case 10 is reduced, and a split or crack of the silicon wafers W is prevented.
  • the cushioning body which includes the lower molded member 12 and the upper molded member 13 , is provided in the space with the internal wall of the cardboard box 11 , so that the cassette case 10 does not directly contact the internal wall of the cardboard box 11 .
  • the silicon wafers W can be effectively protected from the external impact.
  • the cassette case 10 is sandwiched from above and under by the upper molded member 13 and the lower molded member 12 , which are the cushioning body formed of foamed material, so as to be held while being suspended.
  • the upper molded member 13 and the lower molded member 12 have the rectangular frame bodies 21 and 31 that surround and fix the bottom portion and lid portion of the cassette case 10 respectively. Then, all the blocks (protrusions) provided on the lower molded member 12 and the upper molded member 13 prevent and protect the cardboard box 11 from being substantially deformed.
  • a plurality of upper molded members 13 and a plurality of lower molded members 12 were prepared.
  • the plurality of upper molded members 13 had the upper impact absorbing blocks 35 having different protruding lengths (leg lengths), and the lower molded members 12 had the lower impact absorbing blocks 25 having different protruding lengths (leg lengths).
  • the cassette case 10 in which 25 silicon wafers W were placed, was fitted into the upper and lower molded members above and under respectively, and then was packed in the cardboard box 11 .
  • the cardboard box 11 in which the cassette case 10 was packed was dropped from a predetermined height to a floor surface. It is then checked whether or not a crack occurred in the silicon wafers 25 in the cassette case 10 .
  • the drop test was performed in a case where the cardboard box 11 was dropped while the lid surface (top) of the cassette case 10 faced downward, and in a case where the cardboard box 11 was dropped while the bottom surface (bottom) of the cassette case 10 faced downward. Drop acceleration was also measured simultaneously. Table 1 below shows the results.
  • the leg length in the table indicates the protrusion length of the lower impact absorbing blocks 25 when the box was dropped with the bottom side down and the protrusion length of the upper impact absorbing blocks 35 when the box was dropped with the top side down.
  • the lateral impact absorbing blocks were provided on the lower molded member.
  • the lateral impact absorbing blocks may also be provided on the upper molded member simultaneously.
  • two blocks are provided on each side (four on the both side surfaces) simultaneously, such that two lateral impact absorbing blocks on the upper molded member and two on the lower molded member form a square within the diameter width of the wafer main surface (four blocks on each side of the front and rear surfaces protect the semiconductor wafers), the semiconductor wafers are further effectively prevented from the impact force.
  • FIG. 1 is a plain view illustrating a state where a cassette case is mounted according to a first embodiment of the present invention
  • FIG. 2 is a plain view illustrating a lower molded member of a cushioning body according to the first embodiment of the present invention
  • FIG. 3 is a front view of the lower molded member according to the first embodiment of the present invention.
  • FIG. 4 is a cross-sectional view along line D 1 -D 2 -D 3 -D 4 in FIG. 2 of the lower molded member according to the first embodiment of the present invention
  • FIG. 5 is a side surface view illustrating the lower molded member according to the first embodiment of the present invention.
  • FIG. 6 is a cross-sectional view along line C-C in FIG. 2 of the lower molded member according to the first embodiment of the present invention
  • FIG. 7 is a plain view illustrating an upper molded member of the cushioning material according to the first embodiment of the present invention.
  • FIG. 8 is a cross-sectional view along line A-A in FIG. 7 of the upper molded member according to the first embodiment of the present invention and a side surface view illustrating the upper molded member;
  • FIG. 9 is a cross-sectional view along line B-B in FIG. 7 of the upper molded member according to the first embodiment of the present invention and a side surface view illustrating the upper molded member;
  • FIG. 10 is an exploded view illustrating a layout of a cardboard box, the lower molded member, the cassette case, and the upper molded member according to the first embodiment of the present invention.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Buffer Packaging (AREA)
US11/869,873 2006-10-10 2007-10-10 Cushioning for packing cassette cases Abandoned US20080083643A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006-276982 2006-10-10
JP2006276982A JP4947410B2 (ja) 2006-10-10 2006-10-10 カセットケース梱包用緩衝体

Publications (1)

Publication Number Publication Date
US20080083643A1 true US20080083643A1 (en) 2008-04-10

Family

ID=39274195

Family Applications (1)

Application Number Title Priority Date Filing Date
US11/869,873 Abandoned US20080083643A1 (en) 2006-10-10 2007-10-10 Cushioning for packing cassette cases

Country Status (3)

Country Link
US (1) US20080083643A1 (ko)
JP (1) JP4947410B2 (ko)
KR (1) KR100835320B1 (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140227469A1 (en) * 2013-02-14 2014-08-14 Sumco Corporation Buffer material for packing wafer carrier
CN112397454A (zh) * 2019-08-16 2021-02-23 爱思开海力士有限公司 用于封装半导体封装件的载带

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015097489A1 (ja) * 2013-12-26 2015-07-02 積水化成品工業株式会社 緩衝包装材
JP6525306B2 (ja) * 2014-02-19 2019-06-05 信越ポリマー株式会社 梱包体
CN109119369B (zh) * 2017-06-23 2020-07-14 上海微电子装备（集团）股份有限公司 晶圆传送盒和晶圆自动传送系统

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3938661A (en) * 1974-10-17 1976-02-17 Republic Packaging Corporation Packing brace
US5366080A (en) * 1993-10-21 1994-11-22 Seagate Technology, Inc. Molded ridge tolerance compensator
US5628402A (en) * 1990-11-05 1997-05-13 Intepac Technologies Inc. Gas-containing product supporting structure
US5755331A (en) * 1994-07-26 1998-05-26 A. & W. Fullarton Limited Packaging device, particularly for fragile goods
US5875896A (en) * 1996-11-05 1999-03-02 Taiwan Semiconductor Manufacturing Company, Ltd. Unified semiconductor wafer packaging system to unify irregular shape buffer materials
US6131739A (en) * 1997-09-26 2000-10-17 Wacker Siltronic Ag Fracture-proof container for wafer discs
US6817161B1 (en) * 2002-05-17 2004-11-16 Taiwan Semiconductor Manufacturing Company Support for protecting containers holding breakable substrates
US20050016896A1 (en) * 2003-07-24 2005-01-27 Sumitomo Mitsubishi Silicon Corporation Damper system for transportation

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2779143B2 (ja) * 1995-03-17 1998-07-23 信越ポリマー株式会社 半導体ウェーハ収納容器
JPH1126566A (ja) 1997-06-30 1999-01-29 Komatsu Ltd 半導体ウェハ包装容器
JP3506208B2 (ja) 1998-02-20 2004-03-15 三菱住友シリコン株式会社 ウェーハケース
JP4326115B2 (ja) 2000-04-26 2009-09-02 信越ポリマー株式会社 バックグラインドウェーハの輸送容器及びバックグラインドウェーハの収納方法
JP2003026232A (ja) * 2001-07-18 2003-01-29 Seiko Epson Corp 梱包方法及び緩衝材
JP4193472B2 (ja) * 2002-11-15 2008-12-10 株式会社カネカ ウェーハ容器緩衝体

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3938661A (en) * 1974-10-17 1976-02-17 Republic Packaging Corporation Packing brace
US5628402A (en) * 1990-11-05 1997-05-13 Intepac Technologies Inc. Gas-containing product supporting structure
US5366080A (en) * 1993-10-21 1994-11-22 Seagate Technology, Inc. Molded ridge tolerance compensator
US5755331A (en) * 1994-07-26 1998-05-26 A. & W. Fullarton Limited Packaging device, particularly for fragile goods
US5875896A (en) * 1996-11-05 1999-03-02 Taiwan Semiconductor Manufacturing Company, Ltd. Unified semiconductor wafer packaging system to unify irregular shape buffer materials
US6131739A (en) * 1997-09-26 2000-10-17 Wacker Siltronic Ag Fracture-proof container for wafer discs
US6817161B1 (en) * 2002-05-17 2004-11-16 Taiwan Semiconductor Manufacturing Company Support for protecting containers holding breakable substrates
US20050016896A1 (en) * 2003-07-24 2005-01-27 Sumitomo Mitsubishi Silicon Corporation Damper system for transportation

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140227469A1 (en) * 2013-02-14 2014-08-14 Sumco Corporation Buffer material for packing wafer carrier
US9455168B2 (en) * 2013-02-14 2016-09-27 Sumco Corporation Buffer material for packing wafer carrier
CN112397454A (zh) * 2019-08-16 2021-02-23 爱思开海力士有限公司 用于封装半导体封装件的载带

Also Published As

Publication number Publication date
JP4947410B2 (ja) 2012-06-06
KR100835320B1 (ko) 2008-06-04
JP2008094417A (ja) 2008-04-24
KR20080032620A (ko) 2008-04-15

Similar Documents

Publication Publication Date Title
US11279544B2 (en) Container
JP3149446U (ja) 脆性プレートの保護包装装置の改良構造
US20080083643A1 (en) Cushioning for packing cassette cases
CN102883973B (zh) 薄晶片运载器
KR101419566B1 (ko) 곤포용 완충체 및 포장체
JP2009269610A (ja) 板状体の搬送用容器
JP2012166850A (ja) 矩形薄板パネルの搬送ユニット
US8439197B2 (en) Damping body for packaging and package body
KR101462975B1 (ko) 유리 기판 곤포 상자
JP3755580B2 (ja) 容器の梱包体及び容器の緩衝体
CN115636160A (zh) 托盘
KR101941124B1 (ko) 디스플레이장치용 포장박스
KR20160039576A (ko) 기판수납용기를 포장하기 위한 포장구조
JP2007505798A (ja) 低コストウェファボックスの改良
WO2009131014A1 (ja) トレイ
JP5155419B2 (ja) 薄型テレビジョンの梱包構造
US20080296200A1 (en) Damper system for transportation
CN210467865U (zh) 托盘及具有其的载具
KR20010028962A (ko) 칩 스케일 패키지용 트레이
KR20080044998A (ko) 디스플레이 패널의 포장 조립체
US20070151896A1 (en) Packing member for packing wafer container
JP2014088194A (ja) 基板収納容器の梱包体
JPH09290862A (ja) 集合梱包体
EP4106506A1 (en) Substrate tray
CN219361780U (zh) 包装垫

Legal Events

Date Code Title Description
AS Assignment

Owner name: SUMCO CORPORATION, JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:HORIO, TOMOHIRO;REEL/FRAME:020410/0780

Effective date: 20071206

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION