Classifications

• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
  • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
  • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
  • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
  • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
  • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
  • H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
  • H01B3/306—Polyimides or polyesterimides
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
  • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/01—Dielectrics
  • H05K2201/0137—Materials
  • H05K2201/0154—Polyimide
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
  • H05K2201/0203—Fillers and particles
  • H05K2201/0206—Materials
  • H05K2201/0209—Inorganic, non-metallic particles
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/09—Shape and layout
  • H05K2201/09209—Shape and layout details of conductors
  • H05K2201/0929—Conductive planes
  • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes

Definitions

• the present invention relates generally to polyimide based compositions useful in electronic type applications, particularly high frequency electronic circuitry applications, such as, planar capacitor substrates, capacitor pastes, and the like. More specifically, the invention is directed to polyimide based materials containing inorganic additives having properties useful in electronic type applications and at least one non-ionic halogenated dispersing agent.
• U.S. Pat. No. 5,078,936 to Parish et al. discloses electrically conductive polyimide articles.
• the articles are prepared by blending carbon based particles in a polar solvent to form a slurry, then mixing the slurry with a polyamic acid to form a polyimide precursor material.
• the precursor material is then shaped into a structure and converted into a polyimide based article.
• U.S. Pat. No. 6,721,164 to Albertsen et al. discloses dielectric inorganic material incorporated into an organic polymer in combination with a dispersing agent.
• the present invention is directed to polyimide based materials having improved electrical and mechanical performance, and also to a process of making such materials.
• the compositions of the present invention comprise: i. a polyimide base polymer in an amount of at least 60, 70, 80, 85, 90 or 95 weight percent; ii. a discontinuous phase of inorganic material among the base polymer, the inorganic material having a capacitive, resistive, conductive or other electronic type property, the inorganic material being present in an amount of at least 4, 5, 10, 15, 20, 25, 30, 35, or 40 weight percent; iii.
• compositions of the present invention generally have excellent high frequency performance and also excellent mechanical performance.
• the compositions of the present invention can be manufactured by incorporating the dispersing agent and inorganic material into a polyamic acid solution and then converting the polyamic acid solution into a polyimide by conventional or non-conventional means.
• Barium titanate is a useful inorganic material for capacitor type applications.
• Other ceramics can also be useful, such as titanium dioxide, silica, and alumina.
• the inorganic material is used in the smallest commercially practical particle size achievable. The technical art of dispersing small particles in aqueous and non-aqueous systems is legion and need not be reiterated here.
• the average particle size (of the inorganic material) is less than 500, 250, 100, or 50 nanometers.
• dispersed particle As the size of a dispersed particle becomes ever smaller, a transition is possible where the material might no longer be considered a particle, but instead, a ‘dissolved solid.’
• the inorganic material within the compositions of the present invention will sometimes be referred to as “discontinuous domains” or “discontinuous phase” (rather than as “particles”) as a way to include not only particles, but also, dissolved solids within (or among) the base polymer.
• the ceramic is dispersed (as a discontinuous phase) into a polyamic acid, together with a non-ionic dispersing agent.
• Polyamic acid is intended to mean a polyimide precursor solution that is ultimately converted into a polyimide by an imidization process. The conversion of polyamic acids into polyimides is well known in the technical art of polyimide chemistry and need not be reiterated here.
• the non-ionic, halogenated dispersing agent is used to assist in dispersing the inorganic material into the polyamic acid, and optionally, to assist in breaking down unwanted particle agglomerates. Additionally, mechanical energy (i.e,. mechanical grinding or shearing) or precipitation type processing can also be used to diminish the average domain size of the inorganic material.
• non-ionic used herein to describe the dispersing agent is intended to mean any dispersing agent substantially free of ionic moieties, i.e., less than 1.0, 0.5, 0.2, 0.1, 0.05 or 0.01 moles of moieties have an electric charge, per mole of dispersing agent.
• the non-ionic halogenated dispersing agents When used in accordance with the present invention, the non-ionic halogenated dispersing agents have been found to provide improved electrical properties in high frequency applications, relative to ionic dispersing agents. While ionic dispersing agents tend to provide excellent dispersing properties when dispersing particulate filler into polyamic acids, it has been discovered that the ionic nature of these dispersing agents can harm or inhibit electrical performance, particularly capacitor performance and most particularly in applications where high frequencies are employed, such as frequencies above one megahertz.
• the dispersion process comprises at least two steps.
• the dispersing agent is fully mixed into a solvent to create a dispersing solution, and thereafter, inorganic filler particles are added.
• the particles are then dispersed and ideally reduced to their non-agglomerated particle size using mechanical energy, such as, high shear mixing.
• a useful dispersing agent is a fluorine-containing surfactant dispersing agent.
• the liquid slurry formed therefrom can then be mixed with a polyimide precursor material (e.g., a polyamic acid) to form a polyamic acid casting solution.
• a polyimide precursor material e.g., a polyamic acid
• the casting solution can then be cast alone to form a film cast directly onto a metal foil to form a polyimide composite metal laminate or otherwise formed into any possible shape.
• Conventional imidization processing such as the use of thermal energy, can be used to cure the acid into an imide to form a polyimide composite material.
• Useful organic solvents for the synthesis of the polyimide composites of the present invention are preferably solvents, or solvent mixtures, capable of dissolving polyimide precursor materials (e.g., varying polyamic acids).
• Such solvents typically have a relatively low boiling point (e.g., below 225° C.) so that the polyimide can be dried at moderate (more convenient and less costly) temperatures.
• solvents having a boiling point of less than 210° C., 205° C., 200° C., 195° C., 190° C., or 180° C. can be useful.
• Solvents of the present invention may be used alone or in combination with other solvents (i.e., cosolvents).
• Useful organic solvents include: N-methylpyrrolidone (NMP), dimethyl-pyrrolidin-3-one, dimethylacetamide (DMAc), N,N′-dimethyl-formamide (DMF), dimethyl sulfoxide (DMSO), tetramethyl urea (TMU), hexamethylphosphoramide, dimethylsulfone, tetramethylene sulfone, gamma-butyrolactone, and pyridine.
• preferred solvents include N-methylpyrrolidone (NMP) and dimethylacetamide (DMAc).
• Co-solvents can also be used generally at about five to 50 weight-percent of the total solvent.
• Useful co-solvents include xylene, toluene, benzene, diethyleneglycol diethyl ether, 1,2-dimethoxyethane (monoglyme), diethylene glycol dimethyl ether (diglyme), 1,2-bis-(2-methoxyethoxy) ethane (triglyme), bis [2-(2-methoxyethoxy) ethyl)]ether (tetraglyme), bis-(2-methoxyethyl) ether, tetrahydrofuran, propylene glycol methyl ether, propylene glycol methyl ether acetate, “CELLOSOLVETM” (ethylene glycol ethyl ether), butyl “CELLOSOLVETM” (ethylene glycol butyl ether), “CELLOSOLVETM acetate” (ethylene glycol ethyl ether acetate
• a non-ionic fluorine-containing dispersing agent can be added to the organic solvent, or co-solvent mixture (or solvent system) and dissolved to form a dispersing solution.
• the dispersion solution typically comprises a concentration of non-ionic fluorine-containing dispersing agent between any two of the following numbers, 0.1, 0.5, 1.0, 2.0, 4.0, 5.0, 10.0, 15.0 and 20.0 percent.
• the dispersing solution is then used to disperse (along with shearing force if necessary) an inorganic filler component, typically inorganic filler particles.
• the inorganic filler component can be added directly to the dispersing solution, it is possible to add the inorganic filler component to the organic solvent (co-solvent or solvent system) prior to adding the low-ionic (or non-ionic) fluorine-containing dispersing agent. Generally speaking, the order of addition of these components is not critical to the practice of this invention. Useful non-ionic fluorine-containing dispersing agents employed in the practice of the present invention are described more fully below.
• Useful non-ionic (or low ionic) perfluorinated polymers used in the practice of the present invention include, but are not limited to, non-ionic ZONYL® products made by E. I. duPont and Nemours and Co.
• non-ionic fluoro-surfactants include a large number of ethoxylated materials, some of which are commercially sold under the trade names ZONYL® FSN-100, ZONYL® FSO, ZONYL® FSO-100, ZONYL® FSH, ZONYL® FS-300 and ZONYL® FS-610.
• fluoro-surfactants can be grouped into four major categories including (I) non-ionic, (ii) anionic, (iii) ionic, and (iv) amphoteric.
• the non-ionic fluoro-surfactants of the present invention can have a pendant hydrogen group at the end of the polymer chain.
• Anionic fluoro-surfactants generally have moieties having a negative charge while ionic fluoro-surfactants generally have moieties (at the end of the polymer chain) having a positive charge.
• Amphoteric fluoro-surfactants can have mixture of positive and negative charge carrying functional groups.
• the dispersing agent is a perfluorinated polymer that contains small portions of carboxylate (—COOH) and/or methyl ester (—COOCH 3 ) functional groups at one end or both ends of the polymer.
• These polymers can be formed from the polymerization product of the following monomer: where X can equal a carboxylate (—COOH) group or a methyl ester (—COOCH 3 ) group.
• These perfluorinated polymers can be found as solutions sold by E. I. duPont de Nemours and Co. under the trade name NAFION®.
• NAFION® solutions do contain sulfonate groups (—SOOOH3), and are considered to be “ionic”, the present inventor has found that certain NAFION® solutions, classified as non-ionic or low-ionic, can work well in the present invention.
• compositions comprising ionic dispersing agents tend to exhibit unwanted energy loss (measured in terms of a having a high “dissipation factor”) at operating frequencies of greater than 1 megahertz.
• the dissipation factor for compositions of the present invention are less than 0.08, 0.06, 0.05, 0.04, 0.03, 0.02, 0.01, 0.008, 0.005, or 0.001.
• non-ionic halogen-containing surfactants of the present invention have been found to both (I) disperse inorganic fillers well in solvents common to polyimide processing, and (ii) have little (if any) adverse effect on the polymer composite's electrical performance in high frequency applications.
• planar capacitors of the present invention tend to provide a dissipation factor of less than 0.08, 0.075, 0.07, 0.06, 0.05, 0.04, 0.03, 0.02, 0.01 or less than 0.001.
• the non-ionic dispersing agent of the present invention can be added either as a solid or as a liquid to an organic solvent (or solvent system, co-solvent, or co-solvent system) to form a dispersing solution.
• the dispersing agent is allowed to fully dissolve using any known means of dissolving polymers (and/or chemicals) in an organic solvent. Examples of useful dispersing methods include, but are not limited to, mechanical agitation, heat, and the like.
• an organic solvent is heated to about 100 to 120 degrees C. and then put under agitation or shear mixing for about 1 to 4 hours.
• a non-ionic fluorine containing dispersing agent is added to an organic solvent within a range between any two of the following numbers, 0.01, 0.5, 1.0, 2.0, 3.0, 4.0, 5.0, 10.0 and 20.0 weight percent.
• the dispersing polymer can be added to the organic solvent prior to or after the inorganic filler is added.
• the dispersing polymer is added to the solvent prior to the addition of inorganic filler particles to ensure that the particles are being added to a mixture that can readily disperse the particles without forming unwanted agglomerates.
• the amount of inorganic filler particles added to the solvent mixture typically containing the dispersing polymer already dissolved
• inorganic filler particles can be added to 100 weight parts solvent to create the slurry.
• the slurry of the organic solvent, the non-ionic dispersing agent, and the inorganic filler can be referred to more generally as an inorganic filler component.
• the inorganic filler component can have particles dispersed to the level of having an average particle size in a range between (and including) any two of the following sizes: 50, 55, 60, 65, 70, 75, 80, 85, 90, 95, 100, 125, 150, 175, 200, 250, 300, 350, 400, 450, 500 and 5,000 nanometers, where at least 80, 85, 90, 92, 94, 95, 96, 98, 99 or 100 percent of the dispersed filler is within the above size range(s).
• ‘filler size’ can be determined by a laser particle analyzer (e.g., HORIBA® laser particle analyzer).
• the practice of the present invention allows manufacturers to both extend the limits of how much inorganic filler component can be dispersed into a polymer binder (e.g., a polyimide binder matrix) while maintaining good electrical performance such as ‘low dissipation loss.’
• a polyimide composite material formed can have greater performance characteristics as a capacitor (i.e., become a capacitor having a higher D k ).
• the polyimide film composite comprises a barium titanate filler for use as a composite film (typically used as a buried capacitor in a flexible or rigid circuit board)
• the maximum allowable amount of barium titanate can often be raised from about 60 weight percent to about 80 weight percent, while maintaining the dissipation factor at substantially a constant level.
• a polyimide film composite is formed having a thickness ranging from about 2, 5, 10, 15, 20, 25, 30, 35, 40, 50, 60, 70, 80, 90, 100, 150, 200, 250 and 300 microns, or when cast onto a metal foil can have a thickness ranging from about 1, 2, 3, 4, 5, 10, 15, 20, 25, 30, 35, 40, 50, 60, 70, 80, 90, 100, 150, 200, 250 and 300 microns.
• Filler components of the present invention are selected to provide a polyimide film composite with certain desired physical properties. The properties include electrical conductivity, capacitance, thermal conductivity, color, and the like.
• some useful fillers include (but are not limited to) silica, boron nitride, boron nitride coated aluminum oxide, granular alumina, granular silica, fumed silica, silicon carbide, aluminum nitride, aluminum oxide coated aluminum nitride, titanium dioxide, barium titanate, silicon carbide, diamond, dicalcium phosphate, carbon black, graphite, electrically conductive polymers, silver, palladium, gold, platinum, nickel, copper or mixtures or alloys of these materials, paraelectric filler powders like Ta 2 O 5 , HfO 2 , Nb 2 O 5 , Al 2 O 3 , steatite and mixtures these, perovskites of the general formula ABO 3 , crystalline barium titanate (BT), barium strontium titanate (BST), lead zirconate titanate (PZT), lead lanthanum titan
• Useful high dielectric strength polyimide binders of the present invention are derived from a dianhydride component (or the corresponding diacid-diester, diacid halide ester, or tetra-carboxylic acid derivative of the dianhydride) and a diamine component.
• the dianhydride component is typically any aromatic, aliphatic, or cycloaliphatic dianhydride.
• the diamine component is typically any aromatic diamine, aliphatic diamine, or cycloaliphatic diamine.
• Useful dianhydrides of the present invention include aromatic dianhydrides. These aromatic dianhydrides include, (but are not limited to),
• Useful aromatic diamines of the present invention include, but are not limited to,
• Useful aliphatic diamines of the present invention, used alone or in conjunction with either an aromatic diamine, include but are not limited to, 1,6-hexamethylene diamine, 1,7-heptamethylene diamine, 1,8-octamethylenediamine, 1,9-nonamethylenediamine, 1,10-decamethylenediamine (DMD), 1,11-undecamethylenediamine, 1,12-dodecamethylenediamine (DDD), 1,16-hexadecamethylenediamine, 1,3-bis(3-aminopropyl)-tetramethyldisiloxane, isophoronediamine, and combinations thereof.
• DMD decamethylenediamine
• DDD 1,11-undecamethylenediamine
• DDD 1,12-dodecamethylenediamine
• DDD 1,16-hexadecamethylenediamine
• 1,3-bis(3-aminopropyl)-tetramethyldisiloxane isophoronediamine,
• the dianhydride and diamine components of the present invention are particularly selected to provide the polyimide binder with certain desirable properties.
• One such property is for the polyimide binder to have a certain glass transition temperature (Tg).
• Tg range can be between and including any two of the following numbers, 250° C., 240° C., 230° C., 220° C., 210° C., 200° C., 190° C., 180° C., 170° C., 160° C., 150° C., 140° C., 130° C., 120° C., 110° C. and 100° C. if for example good adhesivity of the binder is required.
• Another useful range, if self-adherability is less important than other properties, is from 550° C., 530° C., 51 0° C., 490° C., 470° C., 450° C., 430° C., 410° C., 390° C., 370° C., 350° C., 330° C., 310° C., 290° C., 270° C., and 250° C.
• Not all of the dianhydrides and diamines listed above will form either a low-Tg polyimide binder or a high-Tg binder. As such, the selection of which dianhydride, and which diamine components, is needed is an important issue for customizing the final properties of the polymer binder.
• p-phenylene diamine is used in combination with 4,4′-ODA as a second diamine.
• a combination of BPDA and PMDA is used as the dianhydride component to form the polyimide binder.
• PMDA is used with 4,4-ODA to form the polyimide.
• a precursor to the polyimide binder component i.e., a polyamic acid
• the resulting mixed polymer was thermally converted to a 1-mil thick, filled-polyimide film composite.
• the film composite had a thermal conductivity of about 0.7 watts/(meter*K), and a Tg of greater than 350° C.
• useful dianhydrides include BPADA, DSDA, ODPA, BPDA, BTDA, 6FDA, and PMDA or mixtures thereof. These dianhydrides are readily commercially available and generally provide acceptable performance.
• One noteworthy dianhydride is BPADA because it can produce a polyimide having excellent adhesivity and good flex life while also having a relatively low, moisture absorption coefficient.
• a polyimide is synthesized by first forming a polyimide precursor (typically a polyamic acid solution).
• the polyamic acid is created by reacting (in a solvent system) one or more dianhydride monomers with one or more diamine monomers.
• a polyamic acid can be added to the inorganic filler component. More commonly, the inorganic filler component is added to a polyamic acid. This is generally true at least until imidization of the polymer (i.e., solvent removal and curing) increases the viscosity of the polymer beyond the point where the inorganic filler component can be adequately dispersed in the binder.
• Weight loading of inorganic filler in the polyimide binders of the present invention can generally range between and including any two of the following numbers 40, 45, 50, 55, 60, 65, 70, 75, 80, 85, 90, 95, 100, 105, 110, 120, 130, 140 and 150 weight parts per 100 weight parts polyimide binder.
• the inorganic filler component can require extensive milling and filtration to breakup unwanted particle agglomeration.
• barium titanate is suspendable at 120 weight-parts per 100 weight parts polyimide.
• inorganic filler component is mixed with a polyamic acid to form a mixed polymer blend.
• the mixed polymer blend is cast onto a flat sheet to form a wet film.
• the polyimide precursor i.e., the polyamic acid
• the viscosity of the binder is increased beyond the point where the filler material can be blended with polyimide precursor.
• the viscosity of the binder can possibly be lowered again by solvating the material, perhaps sufficiently enough to allow dispersion of more filler material into the binder.
• the mixed polymer blend is cast onto a metal foil.
• the cast on metal laminate is heated so that the polyamic acid is converted to a polyimide.
• the polyimide composite is on one side of a metal foil and a polyimide composite metal laminate is formed.
• these one sided laminates can be bonded together so that the polymer composite is between two metal foils. This type of lamination can occur without using an adhesive, wherein the polyimide binder has enough bonding strength to bond to itself (or where higher Tg polyimides are used) an adhesive layer can be used.
• a single polyimide metal-clad of the present invention comprises a flexible polyimide composite layer which can adhere to a metal foil such as copper, aluminum, nickel, steel or an alloy containing one or more of these metals.
• the polyimide composite layer can adhere firmly to the metal, having a peel strength of greater than 2 pounds per linear inch and higher, without using an additional adhesive.
• the metal may be adhered to one or both sides of the polyimide layer.
• an adhesive can be used to laminate the polyimide film composite to a metal layer.
• Common adhesives are polyimide adhesive, acrylic-based adhesives, and epoxies.
• metal foils do not have to be used as elements in pure form; they may also be used as metal foil alloys, such as copper alloys containing nickel, chromium, iron, and other metals.
• metal foil alloys such as copper alloys containing nickel, chromium, iron, and other metals.
• Other useful metals include, but are not limited to, copper, steel, aluminum, brass, a copper molybdenum alloy, KOVAR®, INVAR®, a bimetal, a trimetal, a tri-metal derived from two-layers of copper and one layer of INVAR®, and a trimetal derived from two layers of copper and one layer of molybdenum.
• Polyamic acid solutions can be converted to high temperature polyimides using processes and techniques commonly known in the art such as heat or conventional polyimide conversion chemistry. Such polyimide manufacturing processes have been practiced for decades. The amount of public literature on polyimide manufacture is legion and hence further discussion herein is unnecessary. Any conventional or non-conventional polyimide manufacturing process can be appropriate for use in accordance with the present invention provided that a precursor material is available having a sufficiently low viscosity to allow filler material to be mixed. Likewise, if the polyimide is soluble in its fully imidized state, filler can be dispersed at this stage prior to forming into the final composite.
• a heating system having a plurality of heating sections or zones is used.
• the maximum heating temperature can be controlled to give a maximum air (or nitrogen) temperature of the ovens from about 200 to 600° C., more preferably from 350 to 500° C.
• a maximum air (or nitrogen) temperature of the ovens from about 200 to 600° C., more preferably from 350 to 500° C.
• heating temperatures can be set to 200-600° C. while varying the heating time.
• the polyimide film composites (or metal foil laminates) of the present invention be exposed to the maximum heating temperature for about 1, 2, 3, 5, 10, 15, 20, 25, 30, 35, 40, 45 or 50 seconds to about 60, 70, 80, 90, 100, 200, 400, 500, 700, 800, 900, 1000, 1100 or 1200 seconds (the length of time depending on heating temperature).
• the heating temperature may be changed stepwise so as not to wrinkle the film by drying to quickly.
• the thickness of a polyimide composite may be adjusted depending on the intended purpose of the film or laminate. Depending upon the design criteria of any particular embodiment chosen, the polyimide composite thickness can range between (and including) any two of the following film thicknesses: 5, 8, 10, 15, 20, 25, 30, 35, 40, 45, 50, 60, 80, 100, 125, 150, 175, 200, 300, 400 and 500 microns. In one embodiment, the thickness is from about 12 to about 125 microns and is preferably from 15 to 25 microns.
• the polyimide film composites can be a discrete layer in a multi-polyimide layer film construction.
• the polyimide film composite layer can be co-extruded as one layer in a two-layer polyimide, or as the inner (or outer) layers in a three-layer polyimide (see also U.S. Pat. No. 5,298,331, herein incorporated by reference).
• the polyimides of the present invention can be used as a material used to construct a planar transformer component. These planar transformer components are commonly used in power supply devices.
• the polyimide adhesives of the present invention may be used with thick metal foils (like Inconel) to form flexible heaters. These heaters are typically used in automotive and aerospace applications.
• the polyimide film composites of the present invention are useful as a single-layer base substrate (a dielectric) in an electronic device requiring good dielectric strength.
• electronic devices include (but are not limited) planar capacitors, thermoelectric modules, thermoelectric coolers, DC/AC and AC/DC inverters, DC/DC and AC/AC converters, power amplifiers, voltage regulators, igniters, light emitting diodes, IC packages, and the like.
• Barium titanate inorganic filler i.e., known commercially as TICON® CN
• ZONYL® FSO-100 dispersing agent and DMAc solvent were added to a 500ml ceramic jar containing 250g ceramic balls (0.65 mm YTZ media, i.e., ZrO 2 based ceramic ball).
• the ceramic jar was placed onto a roll mill for over night at a rotation speed of about 20 rpm.
• 19 weight percent PMDA//4,4-ODA polyamic acid was added to the jar and kept stirring for 10 minutes.
• a 25-micron thick film (having 80 weight percent barium titanate filler and 2.0 weight percent dispersing agent on a polymer weight basis) was cast on a glass plate and heated to a temperature of about 80 to 100 degree C. The film was then peeled from the plate and thermally ‘imidized’ at 150° C. for 10 minutes and 350° C. for another 10 minutes.
• the cured polyimide composite was evaluated as having: Dielectric Constant (Dk) 31 @ 1 KHz 30 @ 1 MHz Dissipation Factor (D f ), 0.014 @1 KHz 0.072 @ 1 MHz Capacitance 4200 pf @ 1 KHz 4018 pf @ 1 MHz
• Example 2 The following comparative example was prepared in accordance with Example 1. In contrast (an in place of using ZONYL® FSO-100® as the dispersing agent) NAFION® sulfonate was used as the dispersing agent, i.e., an ionic dispersing agent. While most of the electrical properties above remained the same, the dissipation factor (D f ) was measured at 0.1097.

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