US20070031684A1 - Thermally conductive grease - Google Patents

Thermally conductive grease Download PDF

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Publication number
US20070031684A1
US20070031684A1 US11/195,953 US19595305A US2007031684A1 US 20070031684 A1 US20070031684 A1 US 20070031684A1 US 19595305 A US19595305 A US 19595305A US 2007031684 A1 US2007031684 A1 US 2007031684A1
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US
United States
Prior art keywords
thermally conductive
conductive particles
dispersant
distributions
grease
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/195,953
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English (en)
Inventor
Jeffrey Anderson
Philip Kendall
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to US11/195,953 priority Critical patent/US20070031684A1/en
Assigned to 3M INNOVATIVE PROPERTIES COMPANY reassignment 3M INNOVATIVE PROPERTIES COMPANY ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KENDALL, PHILIP E., ANDERSON, JEFFREY T.
Priority to US11/459,163 priority patent/US7404853B2/en
Priority to PCT/US2006/029840 priority patent/WO2007019125A1/en
Priority to KR1020087002726A priority patent/KR101336517B1/ko
Priority to JP2008525099A priority patent/JP5368090B2/ja
Priority to EP20060789054 priority patent/EP1920034A1/en
Priority to MX2008001423A priority patent/MX2008001423A/es
Priority to CNA2006800286873A priority patent/CN101238202A/zh
Priority to MYPI20063742A priority patent/MY140818A/en
Priority to TW095128306A priority patent/TWI480371B/zh
Priority to MYPI20090614A priority patent/MY145358A/en
Publication of US20070031684A1 publication Critical patent/US20070031684A1/en
Priority to US12/164,498 priority patent/US7643298B2/en
Abandoned legal-status Critical Current

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    • C10M125/00Lubricating compositions characterised by the additive being an inorganic material
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    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08Materials not undergoing a change of physical state when used
    • C09K5/14Solid materials, e.g. powdery or granular
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    • H01L23/00Details of semiconductor or other solid state devices
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    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
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    • C10M2207/30Complex esters, i.e. compounds containing at leasst three esterified carboxyl groups and derived from the combination of at least three different types of the following five types of compounds: monohydroxyl compounds, polyhydroxy xompounds, monocarboxylic acids, polycarboxylic acids or hydroxy carboxylic acids
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    • C10M2209/02Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C10M2209/08Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds containing monomers having an unsaturated radical bound to a carboxyl radical, e.g. acrylate type
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    • C10M2215/02Amines, e.g. polyalkylene polyamines; Quaternary amines
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    • C10N2020/00Specified physical or chemical properties or characteristics, i.e. function, of component of lubricating compositions
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    • C10N2050/10Form in which the lubricant is applied to the material being lubricated semi-solid; greasy
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    • H01L2924/30Technical effects
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    • H01L2924/3011Impedance
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/26Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/263Coating layer not in excess of 5 mils thick or equivalent
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T428/26Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
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    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31652Of asbestos
    • Y10T428/31663As siloxane, silicone or silane

Definitions

  • the invention relates to thermal interface materials and their use.
  • thermal management is known in the industry as a “thermal interface material” or “TIM” whereby such a material is placed between a heat source, such as a microprocessor, and a heat dissipation device to facilitate the heat transfer.
  • a heat source such as a microprocessor
  • TIMs may be in the form of a grease or a sheet-like material.
  • thermal interface materials also are used to eliminate any insulating air between the microprocessor and heat dissipation device.
  • TIMs typically are used to thermally connect a heat source to a heat spreader, that is, a thermally conductive plate larger than the heat source, in which case they are referred to as TIM Is. TIMs may also be employed between a heat spreader and a thermal dissipation device such as a cooling device or a finned heat sink in which case such TIMs are referred to as TIM IIs. TIMs may be present in one or both locations in a particular installation.
  • the invention provides a thermally conductive grease that comprises 0 to about 49.5 weight percent of carrier oil, about 0.5 to about 25 weight percent of at least one dispersant, and at least about 50 weight percent of thermally conductive particles.
  • the thermally conductive particles comprise a mixture of at least three distributions of thermally conductive particles, each of the at least three distributions of thermally conductive particles having an average (D 50 ) particle size which differs from the other distributions by at least a factor of 5.
  • the invention provides a method of making a thermally conductive grease of the invention that comprises the steps of providing carrier oil, dispersant, and thermally conductive particles, and then mixing the carrier oil (if present), dispersant, and thermally conductive particles together.
  • the carrier oil (if present) and dispersant are mixed together, and the thermally conductive particles are mixed sequentially, finest to largest average particle size into the carrier oil and dispersant mixture.
  • the thermally conductive particles are mixed together, and then mixed into the carrier oil (if present) and dispersant mixture.
  • a portion or all of the thermally conductive particles are pre-dispersed with a dispersant prior to mixing the thermally conductive particles into the carrier oil (if present) and dispersant mixture.
  • the invention provides a microelectronic package comprising a substrate, at least one microelectronic heat source attached to the substrate, and a thermally conductive grease disclosed in this application on the at least one microelectronic heat source.
  • the invention provides the above microelectronic package further comprising a heat spreader and thermally conductive grease disclosed in this application between the microelectronic heat source and the heat spreader.
  • the invention provides a microelectronic package comprising a substrate, at least one microelectronic heat source attached to the substrate, a heat spreader, and a heat dissipation device attached to the heat spreader wherein a thermally conductive grease disclosed in this application is between the heat spreader and the heat dissipation device.
  • the invention provides a microelectronic package comprising a substrate, at least one microelectronic heat source attached to the substrate, a heat spreader, a thermally conductive grease disclosed in this application between the microelectronic heat source and the heat spreader and a heat dissipation device wherein thermally conductive grease is between the heat spreader and the heat dissipation device.
  • Gel means a material having a viscosity of greater than 1 ⁇ 10 4 cps (10 Pa.s) at 1/s shear rate and 20° C. and a viscosity of less than 108 cps at 1/sec shear rate and 125° C.
  • Thermally conductive grease means grease having a bulk conductivity of greater than 0.05 W/m-K as measured by the test method Bulk Thermal Conductivity described below.
  • Thermally conductive greases (TCGs) of the invention may contain one or more carrier oils.
  • Carrier oil provides the base or matrix for the TCGs of the invention.
  • Useful carrier oils may comprise synthetic oils or mineral oils, or a combination thereof and are typically flowable at ambient temperature. Specific examples of useful carrier oils include polyol esters, epoxides, silicone oils, and polyolefins or a combination thereof.
  • carrier oils include HATCOL 1106, a polyol ester of dipentaerythritol and short chain fatty acids, and HATCOL 3371, a complexed polyol ester of trimethylol propane, adipic acid, caprylic acid, and capric acid (both available form Hatco Corporation, Fords, N.J.); and HELOXY 71 an aliphatic epoxy ester resin, available from Hexion Specialty Chemicals, Inc., Houston Tex.
  • Carrier oil may be present in the TCGs of the invention in an amount of from 0 to about 49.5 weight percent, and in other embodiments, from 0 to not more than about 20 or about 12 weight percent of the total composition. In other embodiments, carrier oil may be present in an amount of at least 2, 1, or 0.5 weight percent of the composition. Carrier oil may also be present in the TCGs of the invention in ranges including from about 0.5, 1, or 2 to about 12, 15, or 20 weight percent.
  • TCGs of the invention contain one or more dispersants.
  • the dispersant(s) may be present in combination with carrier oil, or may be present in the absence of carrier oil.
  • the dispersants improve the dispersion of the thermally conductive particles (described below) in the carrier oil if present.
  • Useful dispersants may be characterized as polymeric or ionic in nature. Ionic dispersants may be anionic or cationic. In some embodiments, the dispersant may be nonionic. Combinations of dispersants may be used, such as, the combination of an ionic and a polymeric dispersant.
  • useful dispersants include, but not limited to, polyamines, sulfonates, modified polycaprolactones, organic phosphate esters, fatty acids, salts of fatty acids, polyethers, polyesters, and polyols, and inorganic dispersants such as surface-modified inorganic nanoparticles, or any combination thereof.
  • dispersants include those having the tradenames SOLSPERSE 24000 and SOLSPERSE 39000 hyperdispersants, available from Noveon, Inc., a subsidiary of Lubrizol Corporation, Cleveland, Ohio; EFKA 4046, a modified polyurethane dispersant, available from Efka Additives BV, Heerenveen, The Netherlands; and RHODAFAC RE-610, an organic phosphate ester, available from Rhone-Poulenc, Plains Road, Granbury, N.J.
  • Dispersant is present in the TCGs of the invention in an amount of at least 0.5 and not more than 50 weight percent, and in other embodiments, not more than 25, 10, or 5 weight percent of the total composition. In another embodiment, dispersant may be present in an amount of at least 1 weight percent. Dispersant may also be present in the TCGs of the invention in ranges including from about 1 to about 5 weight percent.
  • TCGs of the invention contain thermally conductive particles.
  • Useful thermally conductive particles include, but are not limited to, those made from or that comprise diamond, polycrystalline diamond, silicon carbide, alumina, boron nitride (hexagonal or cubic), boron carbide, silica, graphite, amorphous carbon, aluminum nitride, aluminum, silver, and combinations of any of them. Each of these particles are of a different type.
  • the thermally conductive particles used in the TCGs of the invention are a mixture of at least three distributions of thermally conductive particles.
  • Each of the at least three distributions of thermally conductive particles have an average particle size which differs from the average particle size of the distribution above and/or below it by at least a factor of 5, and in other embodiments, at least a factor of 7.5, or at least a factor of 10, or greater than 10.
  • a mixture of thermally conductive particles may consist of: a smallest particle distribution having an average particle diameter (D 50 ) of 0.3 micrometers; a middle distribution having an average particle diameter (D 50 ) of 3.0 micrometers; and a largest distribution having an average particle diameter (D 50 ) of 30 micrometers.
  • Another example may have average diameter particle distributions having average particle diameter (D 50 ) values of 0.03 micrometers, 0.3 micrometers, and 3 micrometers.
  • the thermally conductive particles used in the TCGs of the invention are a mixture of at least three distributions of thermally conductive particles resulting in at least a trimodal distribution.
  • the minima between the peaks may be no more than 75, 50, 20, 10 or 5 percent of the interpolated value (height) between adjacent peaks.
  • the three size distributions are essentially non-overlapping “essentially non-overlapping” means that the lowest point of the valley is no more than 5% of the interpolated value between adjacent peaks.
  • the three distributions have only a minimal overlap. “Minimal overlap” means that the lowest point of the valley is no more than 20% of the interpolated value between adjacent peaks.
  • the average particle size for the smallest average diameter may range from about 0.02 to about 5.0 micrometers.
  • the average particle size for the middle average diameter may range from about 0.10 to about 50.0 micrometers.
  • the average particle size for the middle average diameter may range from about 0.5 to about 500 micrometers.
  • the conductive particle distributions may be selected in accordance with the following general principles.
  • the distribution of smallest diameter particles should have diameters that are smaller than, or nearly bridge, the expected gap between the two substrates to be thermally connected. Indeed, the largest particles may bridge the smallest gap between substrates. When the particles of the largest diameter distribution are in contact with each other, a gap or void volume between the particles will remain.
  • the mean diameter of the middle diameter distribution may be advantageously selected to just fit within the gap or void between the larger particles. The insertion of the middle diameter distribution will create a population of smaller gaps or voids between the particles of the largest diameter distribution and the particles of the middle diameter distribution the dimensions of which may be used to select the mean diameter of the smallest distribution. In a similar fashion, desirable mean particle dimensions may be selected for fourth, fifth, or higher order populations of particles if desired.
  • Each distribution of thermally conductive particles may comprise the same or different thermally conductive particles in each or any of the at least three distributions. Additionally, each distribution of thermally conductive particles may contain a mixture of different types of thermally conductive particles
  • the remaining voids may be thought of as being filled with carrier, dispersant(s) and other components with a slight excess to provide flowability. Further guidance in the selection of suitable particle distributions may be found in “Recursive Packing of Dense Particle Mixtures”, Journal of Materials Science Letters, 21, (2002), pages 1249-1251. From the foregoing discussion, it will be seen that the mean diameters of the successive particle size distributions will preferably be quite distinct and well separated to ensure that they will fit within the interstices left by the previously packed particles without significantly disturbing the packing of the previously packed particles.
  • thermally conductive particles may be present in the TCGs of the invention in an amount of at least 50 percent by weight. In other embodiments, thermally conductive particles may be present in amounts of at least 70, 75, 80, 85, 86, 87, 88, 89, 90, 91, 92, 93, 94, 95, 96, 97, or 98 weight percent. In other embodiments, thermally conductive particles may be present in the TCGs of the invention in an amount of not more than 99, 98, 97, 96, 95, 94, 93, 92, 91, 90, 89, 88, 87, 86, or 85 weight percent.
  • the TCGs and TCG compositions of the invention may also optionally include additives such as antiloading agents, leveling agents and solvents (to reduce application viscosity), for example, methylethyl ketone (MEK), methylisobutyl ketone, and esters such as butyl acetate.
  • additives such as antiloading agents, leveling agents and solvents (to reduce application viscosity), for example, methylethyl ketone (MEK), methylisobutyl ketone, and esters such as butyl acetate.
  • the TCGs of the invention are generally made by blending dispersant and carrier oil together, and then blending the thermally conductive particles sequentially, finest to largest average particle size into the dispersant/carrier oil mixture.
  • the thermally conductive particles may also be premixed with one another, and then added to the liquid components. Heat may be added to the mixture in order to reduce the overall viscosity and aid in reaching a uniformly dispersed mixture.
  • the TCGs of the invention may be used in microelectronic packages and may be used to assist in the dissipation of heat from a heat source, for example, a microelectronic die or chip to a thermal dissipation device.
  • Microelectronic packages may comprise at least one heat source, for example, a die mounted on a substrate or stacked die on a substrate, a thermally conductive grease of the invention on the heat source, and may include an additional thermal dissipation device in thermal and physical contact with the die, such as, for example, a thermal spreader.
  • a thermal spreader may also be a heat source for any subsequent thermal dissipation device.
  • the thermally conductive greases of the invention are useful to provide thermal contact between said die and thermal dissipation device. Additionally, TCGs of the invention may also be used in thermal and physical contact between a thermal dissipation device and a cooling device. In another embodiment, the TCGs of the invention may be used between a heat generating device and a cooling device, that is, without using a heat or thermal spreader in between. TCGs of the invention are useful in TIM I and TIM II applications.
  • a Thermal conductivity was measured generally in accord with ASTM D-5470-01 on the TCG samples using a Heat Transfer Tester, available from Custom Automation, Inc., Blaine, Minn.
  • the Heat Transfer Tester was built according to Proposal Number 3M-102204-01 and included such features as: a vision system capable of measuring parallelism and gap between copper meter bars for up to 0.010 inch (0.254 mm) gaps, copper meter bars with 5 resistance temperature detector (RTD) sensors on each meter bar, a cooler to cool the cooled clamping block (to hold the cooled meter bar) having an operating range of from ⁇ 20 to 100° C.
  • RTD resistance temperature detector
  • the vision system used to measure meter bar gap was calibrated as outlined in the operating procedures provided.
  • the cooler was charged with a 50/50 blend of water and ethylene glycol.
  • the gap between the copper meter bars was set at about 550 micrometers at room temperature.
  • the heater set point was put at 120° C. and the cooler set point at ⁇ 5° C., and the unit was allowed to equilibrate.
  • the meter bar gap after equilibration was about 400 micrometers.
  • the surfaces of the hot and cold meter bars were planarized using the individual meter bar tumbuckles until the gap between the meter bars read by each of the three individual cameras fell within a ⁇ 3 ⁇ m range.
  • the data were recorded every 7-8 seconds by the instrument and contained a time/date stamp, the sample name, the force exerted on the TCG in the meter bar gap, each of the individual meter bar gap readings, and each of the 10 RTD sensor temperature readings.
  • the file was downloaded into a spreadsheet for analysis. In the analysis, the last 10 data points recorded at the given gap were averaged, and these averages were used for the calculations.
  • the power flowing through the TCG sample was calculated using the known bulk conductivity of copper, the dimensions of the copper bars, and the locations of the RTD temperature sensors. Typically, the calculations indicated slightly different wattage flowing down the hot meter bar than down the cold meter bar; these two values were averaged for calculations extending to the TCG sample.
  • the temperature at the surface of each of the meter bars was also extrapolated from a plot of the temperatures and the RTD sensor locations.
  • the power, the average of the three individual meter bar gaps, the temperature drop across the meter bar gap, and the cross sectional area of the hot/cold meter bars were then used to calculate the temperature gradient, the power flux, and then the thermal impedance for the TCG sample under those conditions.
  • the viscosity data on selected samples was generated on a Rheometrics RDA3 viscometer (TA Instruments, Newcastle, Del.). The viscometer was run with disposable 1 inch (25.4 mm) diameter parallel plates in the log sweep mode starting at 0.5/sec initial shear rate, taking 5 points/decade up to 1000/sec shear rate. The gap was set at 0.5 mm for a run, and then lowered to 0.25 mm for a second run on some samples; on other samples the gap was set and run only at 0.25 mm. Temperatures of the runs were controlled to either 125° C. or 25° C. as indicated in the table below. Viscosities were recorded in mPa.s at a 1.25/sec shear rate.
  • TONE 305 A polyol resulting from The Dow Chemical the addition reaction of Company, Midland, caprolactone with MI trimethylol propane (carrier oil) WA 30000 Aluminum oxide particles Fujimi Corporation having a D 50 of 0.25 ⁇ m WA 4000 Aluminum oxide particles Fujimi Corporation having a D 50 of 3.0 ⁇ m WA 500 Aluminum oxide particles Fujimi Corporation having a D 50 of 30 ⁇ m
  • iC8 Modified silica nanoparticles a nonionic, inorganic dispersant, was prepared as follows: 61.42 grams BS1316 isooctyltrimethoxysilane (Wacker Silicones Corp., Adrian, Mich.), 1940 grams 1-methoxy-2-propanol and 1000 grams NALCO 2326 colloidal silica were combined in a 1 gallon glass jar. The mixture was shaken to ensure mixing and then placed in an oven at 80° C. overnight. The mixture was then dried in a flow through oven at 150° C. to produce a white particulate solid.
  • HIMOD a sulfonated polyol ionic dispersant
  • a reactor equipped with a mechanical stirrer, nitrogen purge, and distillation apparatus was charged with dimethyl-5-sodiosulfoisophthalate (42.6 grams, 0.144 moles, available from DuPont Chemicals, Wilmington, Del.), polyethylene glycol having a molecular weight of 400 (115.1 grams, 0.288 moles, available from Union Carbide Chemical and Plastics Co., Inc. (now The Dow Chemical Company, Midland, Mich.)), and polypropylene glycol having a molecular weight of 425 (122.3 grams, 0.288 moles, available from Aldrich Chemical Co., Milwaukee, Wis.), and xylene (75 grams).
  • the reactor was slowly heated to 220° C. for about 1 hour to remove the xylene.
  • Zinc acetate (0.2 gram) was then added to the reactor and the temperature was held at 220° C. for 4 hours with concomitant distillation of methanol from the reaction.
  • the temperature was reduced to about 160° C. and 0.2 Torr (SI) vacuum was applied to the resulting mixture for 30 minutes.
  • the contents were cooled to 120° C. under nitrogen to yield a clear, colorless polyol.
  • the OH equivalent was determined to be 310 g/mole OH and the theoretical sulfonated equivalent weight was found to be 1882 grams polymer/mole sulfonated.
  • TCPA HATCOL 3371 an ionic dispersant was prepared as follows: To a reactor equipped with a mechanical stirrer, and nitrogen purge was added 45 grams (0.0241 equivalents) HATCOL 3371 and 3.4 grams (0.0121 equivalents) tetrachlorophthalic anhydride. The reactor contents were stirred and heated to 150° C. with a constant nitrogen purge. The reaction was complete after 4 hours and a sample was analyzed by infrared spectroscopy. The final product was a brown, low viscosity liquid with a theoretical acid equivalent weight of 18,127.
  • TONE 305 TCPA an ionic dispersant
  • Tone 305 from Dow Chemical Company
  • 1.0 grams (0.00355 equivalents) tetrachlorophthalic anhydride from Aldrich Chemical was stirred and heated to 105° C. with a constant nitrogen purge.
  • the reaction was complete after 4 hours and a sample was analyzed by infrared spectroscopy.
  • the final product was a clear, low viscosity liquid with a theoretical acid equivalent weight of 3,100.
  • dispersant or mixture of dispersants was weighed into a watch glass. Any other surface active ingredients, if present, were also weighed onto the watch glass.
  • Thermally conductive particles were added to the dispersant(s)/carrier oil mixture sequentially, starting with the smallest particle size distribution. Each of the thermally conductive particle distributions was dispersed into the dispersant(s)/carrier oil mixture with a metal spatula before adding the next distribution of thermally conductive particles.
  • the thermally conductive grease composition was heated in an oven (110° C.) to reduce the viscosity of the composition to facilitate mixing of the thermally conductive particles and/or subsequent additions of thermally conductive particles.
  • the resultant thermally conductive greases were transferred into and stored in capped glass vials.
  • the amount of dispersant to be carried on the fine thermally conductive particle distribution was calculated.
  • the amount of remaining dispersant necessary for the formulation was then determined and was weighed on to a watch glass. The remaining steps are identical to those described above.
  • Example 1 HATCOL SOLSPERSE — GC GC GC 1106 39000 (0.36) 20000 4000 400 (0.32); (2.12) (2.97) (3.92) HATCOL 3371(0.32)
  • Example 2 HATCOL SOLSPERSE — GC GC GC 1106 39000 (0.36) 20000 4000 400 (0.37); (2.08) (2.97) (3.88) HATCOL 3371 (0.37)
  • Example 3 HATCOL SOLSPERSE — GC GC GC 1106 39000 20000 4000 400 (0.42); (0.35) (2.07) (2.91) (3.84)

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US11/195,953 US20070031684A1 (en) 2005-08-03 2005-08-03 Thermally conductive grease
US11/459,163 US7404853B2 (en) 2005-08-03 2006-07-21 Thermally conductive grease
CNA2006800286873A CN101238202A (zh) 2005-08-03 2006-07-28 导热油脂
MX2008001423A MX2008001423A (es) 2005-08-03 2006-07-28 Grasa termicamente conductora.
KR1020087002726A KR101336517B1 (ko) 2005-08-03 2006-07-28 열전도성 그리스
JP2008525099A JP5368090B2 (ja) 2005-08-03 2006-07-28 熱伝導性グリース
EP20060789054 EP1920034A1 (en) 2005-08-03 2006-07-28 Thermally conductive grease
PCT/US2006/029840 WO2007019125A1 (en) 2005-08-03 2006-07-28 Thermally conductive grease
MYPI20063742A MY140818A (en) 2005-08-03 2006-08-02 Thermally conductive grease
TW095128306A TWI480371B (zh) 2005-08-03 2006-08-02 熱傳導潤滑脂
MYPI20090614A MY145358A (en) 2005-08-03 2006-08-02 Thermally conductive grease
US12/164,498 US7643298B2 (en) 2005-08-03 2008-06-30 Thermally conductive grease

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US7643298B2 (en) 2010-01-05
CN101238202A (zh) 2008-08-06

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