US20060288664A1 - Purge system for a product container and table for use in the purge system - Google Patents

Purge system for a product container and table for use in the purge system Download PDF

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Publication number
US20060288664A1
US20060288664A1 US11/424,752 US42475206A US2006288664A1 US 20060288664 A1 US20060288664 A1 US 20060288664A1 US 42475206 A US42475206 A US 42475206A US 2006288664 A1 US2006288664 A1 US 2006288664A1
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Prior art keywords
gas
container
interior
gas outlet
port
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Abandoned
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US11/424,752
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English (en)
Inventor
Tsutomu Okabe
Hitoshi Suzuki
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TDK Corp
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TDK Corp
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Assigned to TDK CORPORATION reassignment TDK CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: OKABE, TSUTOMU, SUZUKI, HITOSHI
Publication of US20060288664A1 publication Critical patent/US20060288664A1/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements

Definitions

  • the present invention relates to a product container employed for containing a product such as a semiconductor, a panel for a flat panel display, or an optical disk in a product manufacturing process conducted under a high clean envelopment, and a so-called load port for conducting an open/close operation of the container.
  • the present invention relates to a purge system for replacing a gas sealed in a so-called front-opening unified pod (FOUP) where the product is used as an object to be contained in processing of wafer of the above product, mainly, a semiconductor wafer that is 300 mm in diameter, and a table used in structuring the purge system.
  • FOUP front-opening unified pod
  • the cleaning degree of the entire factory is not enhanced, but only interiors within the respective processing devices in a manufacturing process and an interior within a storage container (hereinafter referred to as “pod”) during travel between the respective processing devices are kept to the high cleaning degree.
  • the pod is generically named “FOUP” as described above.
  • FIG. 5 shows the entirety of a semiconductor wafer processing device 50 .
  • the semiconductor wafer processing device 50 is mainly made up of a load port portion 51 , a transport chamber 52 , and a processing chamber 59 .
  • the respective joint portions are zoned by a partition 55 a and a cover 58 a at the load port side, and a partition 55 b and a cover 58 b at the processing chamber side.
  • a pod 2 that is a storage vessel of a product to be contained such as a silicon wafer (hereinafter referred to simply as “wafer”) is installed on the load port portion 51 .
  • the interior of the transport chamber 52 is kept to the high cleaning degree in order to process a wafer 1
  • a robot arm 54 is also disposed in the interior of the transport chamber 52 .
  • the wafer is transported between the interior of the pod 2 and the interior of the processing chamber 59 by the robot arm 54 .
  • Various mechanisms for subjecting a wafer surface to processing such as thin film formation or thin film processing are normally included in the processing chamber 59 . Those structures are directly irrelevant to the present invention, and therefore their description will be omitted.
  • the pod 2 includes a box type main body portion 2 a having a space for receiving the wafer 1 which is an object to be processed therein, and having an opening portion on any one side, and a cover 4 for tightly closing the opening portion.
  • a rack having a plurality of steps for stacking the wafers 1 in one direction is arranged in the interior of the main body portion 2 a.
  • the respective wafers 1 that are mounted on the steps are contained in the interior of the pod 2 at constant intervals. In this example, the direction along which the wafers 1 are stacked is vertical.
  • An opening portion 10 is defined at the load port portion 51 side of the transport chamber 52 .
  • the opening portion 10 is disposed at a position that faces the opening portion of the pod 2 when the pod 2 is disposed on the load port portion 51 so as to come close to the opening portion 10 . Further, an opener (not shown) is disposed in the vicinity of the opening portion 10 within the transport chamber 52 . After the opener removes the cover 4 from the pod 2 , the operation of carrying in and out the wafer 1 is conducted by the robot arm 54 .
  • FIG. 6 schematically shows the structure of the table 53 shown in FIG. 5 and the pod 2 that is mounted on the table 53 , which are observed along a longitudinal section thereof.
  • a lower portion of the pod 2 has recesses 5 , an inlet port 7 , and an outlet port 9 .
  • a surface of the table 53 is equipped with positioning pins 12 that are fitted into the recesses 5 to regulate the replacement position of the pod 2 , a table inlet port 14 at the table 53 side which is abutted against the inlet port 7 at the pod 2 side, and a table output port 16 at the table 53 side which is abutted against the outlet port 9 at the pod 2 side.
  • the opening portions of the inlet and outlet ports 14 and 16 at the table 53 side are equipped with sealing members 18 for enhancing the air-tightness of portions where the table inlet and outlet ports 14 and 16 are abutted against the ports at the pod 2 side.
  • Filter members 11 are disposed in the vicinity of the opening portions of the inlet and outlet ports 7 and 9 at the pod side so as to prevent dusts from entering the interior of the pod 2 through the ports 7 and 9 .
  • the inlet port 14 and the outlet port 16 at the table 53 side are connected to substitution air discharge sources (not shown) which are external devices through a check valve (not shown) and a flow meter (not shown)
  • substitution air discharge sources not shown
  • the FOUP as the pod 2 is normally made up of a resin mold product. Therefore, even in the case where a pressure within the pod is slightly different from an external pressure, the FOUP is deformed. For that reason, the above inlet and outlet ports are normally in open states, and those ports are used as breathing ports, and a difference between the internal pressure of the FOUP and the external pressure thereof is eliminated to prevent the deformation of the FOUP.
  • the above structure is schematically disclosed in, for example, Japanese Patent Application Laid-Open No. 2002-510150 and U.S. Pat. No. 6,164,664.
  • the wafer 1 that suppresses the adhesion of dusts is taken in the above pod 2 for containing the product therein, and an internal atmosphere is replaced with an inactive gas such as clean nitrogen, to thereby suppress a chemical change such as native oxidation or the occurrence of organic contamination with respect to the wafer surface that is in a contained state.
  • the above replacement operation of the internal atmosphere is conducted through a gas flow path that is formed of the inlet and outlet ports which are disposed in the pod 2 and the table 53 , respectively, in a state where the pod 2 is placed on the table 53 .
  • the gas flow path ensure a magnitude for allowing a sufficient amount of replacement gas or internal atmosphere to flow, and a sufficient air-tightness for preventing the displacement gat or the internal atmosphere from being contaminated.
  • the sealing members 18 are demanded to ensure the sufficient sealing characteristic that satisfies those requirements.
  • the inlet port 7 and the outlet port 9 form a completely closed loop as a gas circulating path through the interior of the pod by the sealing members 18 .
  • the formation of the closed loop prevents a leakage of gas from the interior of the pod to the exterior thereof, or an entrance of gas into the interior of the pod from the exterior thereof.
  • a pressure balance between the gas inlet side and the gas outlet side is not kept in the above structure, a pressure difference between the interior of the pod 2 and the exterior thereof occurs, thereby leads a fear that the pod 2 is deformed.
  • U.S. Pat. No. 6,164,664 discloses a method of controlling a gas flow rate in the gas outlet path so as to introduce a supply of the gas into the interior of the pod by discharging the gas that exists within the pod. According to the above method, it is possible to suppress a gas outlet rate to some degree or less, and prevent a rapid pressure difference from occurring between the interior and the exterior of the pod. However, according to the method, a time required for purging becomes long all anyhow, and an improvement is further required in the productivity. Further, as the volume of the pod 2 becomes larger, a conductance difference between the inlet and outlet ports and the interior of the pod is larger.
  • the present invention has been made in view of the above circumstances, and therefore an object of the present invention is to provide a purge system that is capable of preventing a pressure difference from occurring between an interior and an exterior of a pod in the purge operation of the interior of the pod 2 , and a table in a load port which is used in structuring the purge system.
  • a purge system in which a container that receives a product therein is placed on a table, and the interior of the container is purged by a predetermined gas, the purge system including:
  • a gas inlet port that is disposed on a facing surface of the container with respect to the table and used when supplying the predetermined gas to the interior of the container;
  • a gas outlet port that is disposed on the facing surface of the container with respect to the table and used when discharging the gas within the container to the exterior of the container;
  • a table side gas supply port that is disposed on a facing surface of the table with respect to the container and has a gas inlet system that supplies the predetermined gas to the interior of the container in association with the gas inlet port;
  • a table side gas outlet port that is disposed on the facing surface of the table with respect to the container, and has a gas outlet system that discharges the gas within the container to the exterior of the container from the interior of the container in association with the gas outlet port, and in which:
  • the interior of the gas inlet system is closed from the exterior of the gas inlet system
  • the interior of the gas outlet system communicates with the exterior of the gas outlet system through a communication path.
  • the gas inlet system form a closed state with respect to the exterior by provision of a member having a sealing action between the gas inlet port and the table side gas inlet port;
  • the gas outlet system form the communication path between the gas outlet port and the table side gas outlet port by provision of no member having the sealing action between the gas outlet port and the table side gas outlet port.
  • the purge system further include a valve shaped member that introduces the gas into the interior of the gas outlet system from the exterior of the container through the communication path when a given pressure difference occurs between an internal pressure of the gas outlet system and an external pressure of the gas outlet system.
  • a purge operation table faces a container that receives a product therein and includes one surface having a gas inlet port which is used when a predetermined gas is supplied to the interior of the container, and a gas outlet port which is used when a gas which exists in the interior of the container is discharged to the exterior, in which the one surface of the container is placed on the table to purge the interior of the container by the predetermined gas, the purge table including:
  • a table side gas supply port that is disposed on a facing surface of the table with respect to the container and has a gas inlet system that supplies the predetermined gas to the interior of the container in association with the gas inlet port;
  • a table side gas outlet port that is disposed on the facing surface of the table with respect to the container, and has a gas outlet system that discharges the gas within the container to the exterior of the container from the interior of the container in association with the gas outlet port, in which:
  • the interior of the gas inlet system is closed with respect to the exterior of the gas inlet system when the container is placed on the table to form the gas inlet system;
  • the content of the gas outlet system which is formed at the same time communicates with the exterior of the gas outlet system through a communication path.
  • the gas inlet system form a closed state with respect to the exterior by provision of a member having a sealing action between the gas inlet port and the table side gas inlet port;
  • the gas outlet system form the communication path between the gas outlet port and the table side gas outlet port by provision of no member having the sealing action between the gas outlet port and the table side gas outlet port.
  • the purge operation table further include a valve shaped member that introduces the gas into the interior of the gas outlet system from the exterior of the container through the communication path when a given pressure difference occurs between an internal pressure of the gas outlet system and an external pressure of the gas outlet system.
  • a gas within the pod which is discharged from the outlet port in the pod and the atmosphere that exists around the outlet port are sucked and discharged at the same time by the outlet port in the purge system.
  • the outlet port in the purge system it is possible to suppress a pressure difference from occurring between a inlet side pressure and an outlet side pressure of the gas, and it is possible to suppress a pressure difference between the interior and the exterior of the pod to prevent the pod from being deformed.
  • the atmosphere around the outlet port is supplied to the outlet port as a buffer.
  • a large fluctuation within the pod due to the gas discharge is suppressed.
  • valve shaped member having a so-called check operation that enables atmosphere introduction only when a given pressure difference occurs in a communication path that is a supply path in the case of supplying the atmosphere around the outlet port.
  • the arrangement of the valve shaped member reduces the possibility that the atmosphere under which the moisture content is not managed in a normal state enters the interior of the pod, thereby making it possible to preferably maintain the environment of the interior of the pod.
  • FIG. 1 is a diagram schematically showing a structure of a main portion of an FOUP and a load port in a purge system according to an embodiment of the present invention
  • FIG. 2 is a diagram showing a modified example of the embodiment shown in FIG. 1 ;
  • FIG. 3 is a diagram showing another modified example of the embodiment shown in FIG. 1 ;
  • FIG. 4 is a diagram showing the structure of a main portion of an FOUP and a load port in a purge system according to an embodiment of the present invention
  • FIG. 5 is a side view entirely showing the schematic structure of a normal semiconductor wafer processing device to which the present invention and the conventional art are applied.
  • FIG. 6 is a diagram schematically showing the main portion of a purge system that is made up of an FOUP and a load port in the conventional art.
  • FIG. 1 is a diagram schematically showing a purge system according to an embodiment of the present invention.
  • FIG. 1 schematically shows a structure of a pod 2 , and a table side inlet port 14 and a table side outlet port 16 which are disposed on a table 53 of FIG. 6 , taken along a vertical section thereof.
  • the same structures as those of the respective structures shown in FIG. 5 as the conventional art are denoted by identical references for description.
  • a sealing member 18 that is fixed to the table 53 side is interposed between an inlet port 7 of the pod 2 and a table side inlet port 14 that is connected to the inlet port 7 . Therefore, a gas inlet system is completely sealed from an external space of the pod 2 . On the contrary, no sealing member 18 is interposed between a outlet port 9 and a table side outlet port 16 , thereby making it possible that a gas outlet system communicates with an external space of the pod 2 .
  • the purge operation of the gas within the pod 2 is conducted by a low voltage source (not shown) which is disposed downstream of the table side outlet port and generates a negative pressure.
  • a low voltage source (not shown) which is disposed downstream of the table side outlet port and generates a negative pressure.
  • the conductance of the inlet system is made substantially identical with the conductance of the outlet system in the case where the sealing member 18 is interposed therebetween.
  • a high pressure source that generates a positive pressure is disposed upstream of the table side inlet port, and the gas in the interior of the pod 2 is extruded by the gas that is supplied from the high voltage source to conduct the purge operation.
  • the conductance of the outlet system be set to be larger than the conductance of the inlet system (more specifically, there is proposed a modification such that the inner diameter of the outlet port is made larger), and the outlet resistance at the time of extruding the gas within the pod be reduced.
  • the high voltage source and the low voltage source it is preferable to use both of the high voltage source and the low voltage source.
  • the sealing member 18 is interposed between the outlet port 9 and the table side outlet port 16 .
  • a communication path 23 that communicates with the external space is formed in the table side outlet port 16 .
  • the atmosphere around the outlet port is sucked or discharged by the outlet system through the communication path 23 .
  • the present invention can also be implemented by provision of the communication path that is capable of supplying the external atmosphere to the outlet system in the convention structure.
  • the atmosphere that exists around the outlet port is different from an inactive gas that is positively supplied to the interior of the pod 2 , for example, dry nitrogen, and is not controlled in the moisture content, and is not also controlled in the contamination material of the organic system. Therefore, it is preferable to prevent the above atmosphere from entering the interior of the pod 2 . Therefore, for example, as shown in FIG. 3 , it is possible that a valve shaped member 25 having a so-called check preventing function with respect to the gas flow is disposed in a communication space 21 that is disposed between the outlet port 9 and the table side outlet port 16 and communicates with the exterior of the exhaust system.
  • the valve shaped member 25 is deformed and makes the external space communicate with the interior of the outlet system in the case where the interior of the outlet system generates a pressure difference by a given pressure with respect to the external space. Because the valve shaped member 25 is disposed in the communication space 21 or the communication path 23 , it is possible to reduce the risk that the atmosphere enters the interior of the pod 2 from the external space, and to obtain the effects of the present invention.
  • a film member that is bent by application of a pressure of some degree is disposed around the table side discharge port on the table 53 so as to be used as the valve shaped member 25 .
  • the configuration of the member is not limited to the above configuration.
  • the communication path 23 is not limited to the communication space 21 shown in FIG. 1 or the path shown in FIG. 2 , but may be structured by a configuration that is capable of introducing the external atmosphere with respect to the outlet path that extends from the table side discharge port. To be more specific, any configuration can be applied if the outlet path communicates with the external space.
  • FIG. 4 shows a purge system according to an embodiment of the present invention in the same manner as that of FIG. 6 .
  • the same structures as those shown in FIGS. 6 and 1 and the like are denoted by identical reference symbols for description.
  • a pod 2 includes recesses 5 , an inlet port 7 , and an outlet port 9 at a bottom surface thereof. Further, the surface of a table 53 on which the pod 2 is placed is equipped with positioning pins 12 that are fitted into the recesses 5 to regulate the placement position of the pod 2 , a table side inlet port 14 that constitutes the inlet system in association with the inlet port 7 at the pod 2 side, and a table side outlet port 16 that constitutes the outlet system in association with the outlet port 9 at the pod 2 side. Further, a toric sealing member 18 is disposed between the inlet port 7 and the table side inlet port 14 facing each other to enhance the air-tightness with respect to the exterior of the pod 2 of the inlet system.
  • No sealing member 18 is disposed between the outlet port 9 and the table side outlet port 16 , and a communication space 21 having an interval that substantially corresponds to the sealing member 18 is formed between those ports when the positional relationship between the pod 2 and the table 53 is determined according to the recesses 5 , the positioning pins 12 , the inlet system, and the like.
  • Filter members 11 are disposed in the vicinity of the opening portions of the inlet and outlet ports 7 and 9 at the pod side so as to prevent dusts and the like from entering the interior of the pod 2 through the ports. Further, an upstream side of the table side inlet port 14 and a downstream side of the table side outlet port 16 in the gas flow are connected to a replacement gas inlet source and a replacement gas outlet source (not shown) which are external devices through a check valve and a flow meter (not shown), respectively. Further, in this embodiment, a flow controller 27 is disposed upstream of the table side inlet port 14 so as to control the flow rate of gas that is supplied to the interior of the pod 2 .
  • the semiconductor wafer 1 is contained in the interior of the pod 2 , and the pod 2 having the interior tightly closed by a cover 4 is transported above the table 53 .
  • the pod 2 is mounted on the table 53 in a state where the positioning pins 12 that project from the table 53 are substantially fitted into the recesses 5 that are disposed on the lower portion of the pod 2 .
  • the inlet port 7 at the pod side is abutted against the table side inlet port 14 that is disposed on the table 53 through the sealing member 18 .
  • the outlet port 9 and the table side outlet port 16 face each other to form the communication space 21 therebetween.
  • the inlet system and the outlet system are connected to the replacement gas supply source and the replacement gas discharge source, respectively.
  • the flow rate of gas inlet for purging is set by the flow controller 27 in advance.
  • the gas for purging is sucked to the interior of the pod 2 , and the gas within the pod 2 is discharged.
  • the magnitude of the replacement gas discharge source is set to be large, the sufficiently large gas discharge is conducted as compared with the gas suction, to thereby suppress the step-up of the internal pressure within the pod 2 due to the gas suction.
  • the atmosphere is replenished through the communication space 21 to prevent the internal pressure of the interior of the pod 2 from being reduced.
  • the purge operation within the pod 2 is conducted.
  • the replacement gas is circulated in the stated order of the table side inlet port 14 , the sealing member 20 , the inlet port 7 at the pod 2 side, the filter 11 , the interior of the pod 2 , the filter 11 , the outlet port 9 at the pod 2 side, and the table side outlet port 16 , to thereby replace the atmosphere within the pod 2 .
  • the table 53 in which the inlet port and the outlet port are formed by one system, respectively, and the pod 2 corresponding to the table 53 .
  • the configuration to which the present invention is applicable is not limited to the above structure, but it is preferable that the numbers of inlet ports and outlet ports be appropriately increased or decreased taking into consideration the demanded gas replacement speed, the capacity of the pod 2 , and the like.
  • the present system is applied to the FOUP, but the embodiment of the present invention is not limited to the above system.
  • the system according to the present invention can be applied to a system having a container that receives a plurality of objects to be held (products) therein, and a transport chamber that transports the object to be held from the container to a device that processes the object to be held, in which the atmosphere within the container is purged.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Warehouses Or Storage Devices (AREA)
US11/424,752 2005-06-24 2006-06-16 Purge system for a product container and table for use in the purge system Abandoned US20060288664A1 (en)

Applications Claiming Priority (2)

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JP2005-184788 2005-06-24
JP2005184788A JP3983254B2 (ja) 2005-06-24 2005-06-24 製品収容容器用パージシステム及び該パージシステムに供せられる台

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US (1) US20060288664A1 (zh)
EP (1) EP1737030B1 (zh)
JP (1) JP3983254B2 (zh)
KR (1) KR100799415B1 (zh)
DE (1) DE602006019798D1 (zh)
TW (1) TWI297925B (zh)

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US20110214778A1 (en) * 2010-03-05 2011-09-08 Sinfonia Technology Co., Ltd. Gas charging apparatus, gas discharging apparatus, gas charging method, and gas discharging method
US20130004268A1 (en) * 2011-06-28 2013-01-03 Dynamic Micro Systems, Semiconductor Equipment Gmbh Semiconductor Stocker Systems And Methods
US20140017040A1 (en) * 2012-01-04 2014-01-16 Daifuku Co., Ltd. Article Storage Facility and Article Storage Method
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US20150000785A1 (en) * 2013-06-26 2015-01-01 Daifuku Co., Ltd. Inactive Gas Supply Facility and Inactive Gas Supply Method
US20150101703A1 (en) * 2013-10-11 2015-04-16 Taiwan Semiconductor Manufacturing Company Limited Ultra-low oxygen and humility loadport and stocker system
US20150117986A1 (en) * 2013-10-30 2015-04-30 Taiwan Semiconductor Manufacturing Co., Ltd Mechanisms for chraging gas into cassette pod
US20150203225A1 (en) * 2012-08-27 2015-07-23 Mitsubishi Gas Chemical Company, Inc. Method of packaging particle-like material, and packaging machine for a particle-like material
US20160358799A1 (en) * 2014-04-28 2016-12-08 Murata Machinery, Ltd. Purge device and purge method
US20170025296A1 (en) * 2015-03-31 2017-01-26 Tdk Corporation Gas purge apparatus, load port apparatus, installation stand for purging container, and gas purge method
US20170025298A1 (en) * 2015-03-31 2017-01-26 Tdk Corporation Gas purge apparatus, load port apparatus, installation stand for purging container, and gas purge method
US20170069516A1 (en) * 2015-09-08 2017-03-09 Chen-Wei KU Purge load port
US20170170044A1 (en) * 2015-12-11 2017-06-15 Tdk Corporation Controling method for a wafer transportation part and a load port part on an efem
US20180315632A1 (en) * 2017-04-28 2018-11-01 Sinfonia Technology Co., Ltd. Gas supply device, method for controlling gas supply device, load port, and semiconductor manufacturing apparatus
US20190131155A1 (en) * 2016-04-05 2019-05-02 Fabmatics Gmbh FOUP Measurement Chamber
US11426773B2 (en) * 2020-03-23 2022-08-30 Hirata Corporation Load port and control method

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JP5155848B2 (ja) * 2008-12-18 2013-03-06 日本ケンブリッジフィルター株式会社 Ｆｏｕｐ用ｎ２パージ装置
JP5410794B2 (ja) * 2009-03-17 2014-02-05 東京エレクトロン株式会社 基板処理装置
JP5887719B2 (ja) * 2011-05-31 2016-03-16 シンフォニアテクノロジー株式会社 パージ装置、ロードポート、ボトムパージノズル本体、ボトムパージユニット
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KR100799415B1 (ko) 2008-01-30
TW200709329A (en) 2007-03-01
KR20060135536A (ko) 2006-12-29
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EP1737030A1 (en) 2006-12-27
JP2007005604A (ja) 2007-01-11

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