US20060238981A1 - Heat-dissipation device with elastic member and heat-dissipation method thereof - Google Patents

Heat-dissipation device with elastic member and heat-dissipation method thereof Download PDF

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Publication number
US20060238981A1
US20060238981A1 US11/189,496 US18949605A US2006238981A1 US 20060238981 A1 US20060238981 A1 US 20060238981A1 US 18949605 A US18949605 A US 18949605A US 2006238981 A1 US2006238981 A1 US 2006238981A1
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United States
Prior art keywords
heat
elastic member
base
dissipation
dissipation device
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Granted
Application number
US11/189,496
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US7312997B2 (en
Inventor
Yu-Nien Huang
Shun-Ta Yu
Cheng-Yu Wang
Jim-Fat Tseng
Tsan-Nan Chien
Yu Liu
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Quanta Computer Inc
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Quanta Computer Inc
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Assigned to QUANTA COMPUTER INC. reassignment QUANTA COMPUTER INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LIU, YU, HUANG, YU-NIEN, TSENG, JIM-FAT, WANG, CHENG-YU, YU, SHUN-TA, CHIEN, TSAN-NAN
Publication of US20060238981A1 publication Critical patent/US20060238981A1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates in general to a heat-dissipation device, and in particular to a heat-dissipation device with an elastic member and a heat-dissipation method thereof applied to an electronic device.
  • FIG. 1 illustrates the relationship between contact force and thermal resistance. When contact force is greater, thermal resistance is lower. For this reason, increasing the contact force can achieve a better heat-dissipation.
  • the invention provides a heat-dissipation device with an elastic member and a heat-dissipation method thereof.
  • the elastic member comprises a base, and a compressible portion disposed on the base.
  • the compressible portion When a shell presses on the compressible portion, the compressible portion generates a compression stroke to make the base forced uniformly.
  • the compressible portions are extended curvedly and upward from two sides of the base.
  • the base comprises two fixing portions disposed on two sides of the base.
  • the base further comprises a convex passage approximately.
  • the heat-dissipation device comprises a heat source, a thermal interface material contacting the heat source, a heat-dissipation module contacting the thermal interface material, and an elastic member supporting the heat-dissipation module toward the heat source.
  • the steps of the heat-dissipation method comprise overlapping a thermal interface material and a heat-dissipation module on the heat source, and exerting a force toward the heat source to the heat-dissipation module.
  • FIG. 1 is the relationship diagram of a contact force and a thermal resistance
  • FIG. 2 shows a schematic diagram of an elastic member
  • FIG. 3 shows a use case diagram of an elastic member
  • FIG. 4 is a use case diagram of an elastic member applied to an electronic device.
  • FIG. 5 is a flowchart of a heat-dissipation method.
  • an elastic member 1 comprises a base 11 and two compressible portions 12 , 13 .
  • the base 11 comprises two fixing portions 111 and a passage 112 .
  • the fixing portions 111 are disposed on two sides of the base 11 .
  • the compressible portions 12 , 13 are convex, alternately arranged, and extended curvedly and upward from two sides 111 of the base 11 to the center portion 112 of the base 11 .
  • the cross section of the passage 112 is substantially ⁇ -shaped, allowing a heat pipe 22 (shown in FIG. 3 ) to pass therethrough.
  • the heat-dissipation device 2 is installed in an electronic device 4 .
  • the heat-dissipation device 2 comprises a heat-dissipation module 20 and the elastic member 1 .
  • the heat-dissipation module 20 comprises a fan 21 , the heat pipe 22 , and a thermal block 23 .
  • the thermal block 23 is installed on/over the heat source 30 (for example a heat-dissipation chip) via a thermal interface material 24 .
  • the elastic member 1 is fixed on the heat pipe 22 of the heat-dissipation module 20 through the fixing portions 111 by welding, riveting, or screws.
  • a distance L shown in FIG.
  • the elastic member 1 exists between the top of the compressible portions 12 , 13 and the bottom of the elastic member 1 .
  • the elastic member 1 is forced by the shell 40 above the elastic member 1 .
  • the compressible portions 12 , 13 generate a compression stroke to absorb the force from the shell 40 .
  • a change to the thickness L of the elastic member 1 can affect the compression stroke to change the contact force between the heat source 30 and the heat-dissipation module 20 .
  • the invention also can be applied to a heat-dissipation fin to promote the heat-dissipation efficiency via the above principle.
  • FIG. 5 illustrates a flow chart of a heat-dissipation method.
  • a thermal interface material 24 and a heat-dissipation module 20 are overlapped on the heat source in order (S 1 step).
  • An elastic member 1 is presses against the heat-dissipation module 20 and the heat source 30 (S 2 step).
  • the S 2 step increases the contact force between the heat source 30 , thermal interface material 24 , and the heat-dissipation module 20 to decrease the thermal resistance promoting heat-dissipation efficiency.

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention provides a heat-dissipation device and a heat-dissipation method thereof. The electronic device includes a heat source, a thermal interface material (TIM) in contact with the heat source, a heat-dissipation module in contact with the thermal interface material, and an elastic member pushing the heat-dissipation module toward the heat source. The elastic member includes a base and a compressible portion extending from the base, whereby a force, applied to the compressible portion, is transmitted to and uniformly distributed on the base. The heat-dissipation method includes the steps of overlapping a thermal interface material and a heat-dissipation module on the heat source, and exerting a force toward the heat source to the heat-dissipation module.

Description

    BACKGROUND
  • The present invention relates in general to a heat-dissipation device, and in particular to a heat-dissipation device with an elastic member and a heat-dissipation method thereof applied to an electronic device.
  • With the progress of computer technology, a bus and a chip speed have increased greatly, thus, computer efficiency has improved. With computer efficiency improving, heat-dissipation problem becomes important to be solved. Chips other than the central processing unit (CPU), such as north bridge and a display chip require enhanced heat-dissipation efficiency. A conventional heat-dissipation module typically emphasizes heat convection, while ignoring heat conduction ability. FIG. 1 illustrates the relationship between contact force and thermal resistance. When contact force is greater, thermal resistance is lower. For this reason, increasing the contact force can achieve a better heat-dissipation.
    • SUMMARY
  • Accordingly, the invention provides a heat-dissipation device with an elastic member and a heat-dissipation method thereof.
  • The elastic member comprises a base, and a compressible portion disposed on the base. When a shell presses on the compressible portion, the compressible portion generates a compression stroke to make the base forced uniformly.
  • The compressible portions are extended curvedly and upward from two sides of the base. The base comprises two fixing portions disposed on two sides of the base. The base further comprises a convex passage approximately.
  • The heat-dissipation device comprises a heat source, a thermal interface material contacting the heat source, a heat-dissipation module contacting the thermal interface material, and an elastic member supporting the heat-dissipation module toward the heat source.
  • The steps of the heat-dissipation method comprise overlapping a thermal interface material and a heat-dissipation module on the heat source, and exerting a force toward the heat source to the heat-dissipation module.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • The present invention can be more fully understood by reading the subsequent detailed description and examples with references made to the accompanying drawings, wherein:
  • FIG. 1 is the relationship diagram of a contact force and a thermal resistance;
  • FIG. 2 shows a schematic diagram of an elastic member;
  • FIG. 3 shows a use case diagram of an elastic member;
  • FIG. 4 is a use case diagram of an elastic member applied to an electronic device; and
  • FIG. 5 is a flowchart of a heat-dissipation method.
    • DETAILED DESCRIPTION
  • Referring to FIG. 2, an elastic member 1 comprises a base 11 and two compressible portions 12, 13. The base 11 comprises two fixing portions 111 and a passage 112. The fixing portions 111 are disposed on two sides of the base 11. In this embodiment, the compressible portions 12, 13 are convex, alternately arranged, and extended curvedly and upward from two sides 111 of the base 11 to the center portion 112 of the base 11. The cross section of the passage 112 is substantially π-shaped, allowing a heat pipe 22 (shown in FIG. 3) to pass therethrough.
  • Referring to FIGS. 3 and 4, the heat-dissipation device 2 is installed in an electronic device 4. The heat-dissipation device 2 comprises a heat-dissipation module 20 and the elastic member 1. The heat-dissipation module 20 comprises a fan 21, the heat pipe 22, and a thermal block 23. The thermal block 23 is installed on/over the heat source 30 (for example a heat-dissipation chip) via a thermal interface material 24. The elastic member 1 is fixed on the heat pipe 22 of the heat-dissipation module 20 through the fixing portions 111 by welding, riveting, or screws. A distance L (shown in FIG. 4) exists between the top of the compressible portions 12, 13 and the bottom of the elastic member 1. The elastic member 1 is forced by the shell 40 above the elastic member 1. When the elastic member 1 is pressed, the compressible portions 12, 13 generate a compression stroke to absorb the force from the shell 40. Moreover, a change to the thickness L of the elastic member 1 can affect the compression stroke to change the contact force between the heat source 30 and the heat-dissipation module 20. Furthermore, the invention also can be applied to a heat-dissipation fin to promote the heat-dissipation efficiency via the above principle.
  • FIG. 5 illustrates a flow chart of a heat-dissipation method. A thermal interface material 24 and a heat-dissipation module 20 are overlapped on the heat source in order (S1 step). An elastic member 1 is presses against the heat-dissipation module 20 and the heat source 30 (S2 step). The S2 step increases the contact force between the heat source 30, thermal interface material 24, and the heat-dissipation module 20 to decrease the thermal resistance promoting heat-dissipation efficiency.
  • While the invention has been described by way of example and in terms of the preferred embodiments, it is to be understood that the invention is not limited to the disclosed embodiments. To the contrary, it is intended to cover various modifications and similar arrangements (as would be apparent to those skilled in the art). Therefore, the scope of the appended claims should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements.

Claims (13)

1. An elastic member applied to a heat-dissipation module, comprising:
a base;
at least a compressible portion disposed on the base;
wherein when a force is applied to the elastic member, the compressible portion absorbs the force to make the base force uniform, thereby decreasing the thermal resistance of the heat-dissipation module.
2. The elastic member as claimed in claim 1, further comprises two compressible portions extended curvedly and upward from two sides of the base.
3. The elastic member as claimed in claim 1, wherein the base comprises two fixing portions disposed on two sides of the base.
4. The elastic member as claimed in claim 1, wherein the base further comprises an approximate π shape.
5. The elastic member as claimed in claim 1, wherein the compressible portion is convex.
6. A heat-dissipation device applied to an electronic device, comprising:
a heat source;
a thermal interface material contacting the heat source;
a heat-dissipation module contacting the thermal interface material; and
an elastic member supporting the heat-dissipation module toward the heat source.
7. The heat-dissipation device as claimed in claim 6, further comprising a shell containing the heat source, the thermal interface material, the heat-dissipation module, and the elastic member.
8. The heat-dissipation device as claimed in claim 7, wherein the elastic member suports the shell and the heat-dissipation module.
9. The heat-dissipation device as claimed in claim 6, wherein the elastic member comprises a base and at least a compressible portion disposed on the base; wherein when a force is exerted on the elastic member, the compressible portion absorbs the force to make the base forced uniform.
10. The heat-dissipation device as claimed in claim 9, wherein the elastic member further comprises two compressible portions extended curvedly and upward from two sides of the base.
11. The heat-dissipation device as claimed in claim 9, wherein the base comprises two fixing portions disposed on two sides of the base.
12. The heat-dissipation device as claimed in claim 9, wherein the base further comprises an approximate n shape.
13. The heat-dissipation device as claimed in claim 9, wherein the compressible portion is convex.
US11/189,496 2005-04-22 2005-07-26 Heat-dissipation device with elastic member and heat-dissipation method thereof Active 2025-09-19 US7312997B2 (en)

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TW094112886A TWI282724B (en) 2005-04-22 2005-04-22 Heat-dissipating device with elastic piece and heat-dissipating method thereof

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090038782A1 (en) * 2007-08-10 2009-02-12 Kuo-Hsin Chen Heat-conducting module

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101106888B (en) * 2006-07-14 2012-06-13 富准精密工业(深圳)有限公司 Heat radiation module
JP2009043097A (en) * 2007-08-09 2009-02-26 Fujitsu Ltd Electronic equipment and heat radiation unit
CN101636067B (en) * 2008-07-25 2012-08-22 富准精密工业(深圳)有限公司 Heat sink
CN101674717B (en) * 2008-09-11 2012-05-16 富准精密工业(深圳)有限公司 Radiation device
TWI487470B (en) * 2009-01-16 2015-06-01 鴻準精密工業股份有限公司 Heat dissipation device and electronic device using same and heat dissipation fin thereof
CN101861078A (en) * 2009-04-10 2010-10-13 富准精密工业(深圳)有限公司 Heat sink and manufacturing method thereof
JP2011081437A (en) * 2009-10-02 2011-04-21 Toshiba Corp Electronic equipment
JP4908610B2 (en) * 2010-04-09 2012-04-04 株式会社東芝 Electronics

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4235285A (en) * 1979-10-29 1980-11-25 Aavid Engineering, Inc. Self-fastened heat sinks
US4246597A (en) * 1979-06-29 1981-01-20 International Business Machines Corporation Air cooled multi-chip module having a heat conductive piston spring loaded against the chips
US6301107B1 (en) * 1998-07-27 2001-10-09 Compaq Computer Corporation Heat dissipation structure for electronic apparatus component
US6328097B1 (en) * 2000-06-30 2001-12-11 Intel Corporation Integrated heat dissipation apparatus
US6347036B1 (en) * 2000-03-29 2002-02-12 Dell Products L.P. Apparatus and method for mounting a heat generating component in a computer system
US6345664B1 (en) * 1997-02-24 2002-02-12 Fujitsu Limited Heat sink and information processor using heat sink
US6366460B1 (en) * 1998-07-27 2002-04-02 Compaq Computer Corporation Heat dissipation structure for electronic apparatus component
US6400565B1 (en) * 2000-04-21 2002-06-04 Dell Products L.P. Thermally conductive interface member
US6442025B2 (en) * 2000-01-07 2002-08-27 Kabushiki Kaisha Toshiba Cooling unit for cooling heat generating component and electronic apparatus having the cooling unit
US6504720B2 (en) * 2000-09-25 2003-01-07 Kabushiki Kaisha Toshiba Cooling unit for cooling heat generating component, circuit module including the cooling unit, and electronic apparatus mounted with the circuit module
US6708754B2 (en) * 2001-07-25 2004-03-23 Wen-Chen Wei Flexible heat pipe
US6883594B2 (en) * 2001-11-30 2005-04-26 Thermal Corp. Cooling system for electronics with improved thermal interface

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI234257B (en) 2003-06-30 2005-06-11 Advanced Semiconductor Eng Heat sink structure and chip package structure thereof

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4246597A (en) * 1979-06-29 1981-01-20 International Business Machines Corporation Air cooled multi-chip module having a heat conductive piston spring loaded against the chips
US4235285A (en) * 1979-10-29 1980-11-25 Aavid Engineering, Inc. Self-fastened heat sinks
US6345664B1 (en) * 1997-02-24 2002-02-12 Fujitsu Limited Heat sink and information processor using heat sink
US6570761B2 (en) * 1998-07-27 2003-05-27 Hewlett Packard Development Company, L.P. Heat dissipation structure for electronic apparatus component
US6301107B1 (en) * 1998-07-27 2001-10-09 Compaq Computer Corporation Heat dissipation structure for electronic apparatus component
US6366460B1 (en) * 1998-07-27 2002-04-02 Compaq Computer Corporation Heat dissipation structure for electronic apparatus component
US6442025B2 (en) * 2000-01-07 2002-08-27 Kabushiki Kaisha Toshiba Cooling unit for cooling heat generating component and electronic apparatus having the cooling unit
US6347036B1 (en) * 2000-03-29 2002-02-12 Dell Products L.P. Apparatus and method for mounting a heat generating component in a computer system
US6400565B1 (en) * 2000-04-21 2002-06-04 Dell Products L.P. Thermally conductive interface member
US6328097B1 (en) * 2000-06-30 2001-12-11 Intel Corporation Integrated heat dissipation apparatus
US6504720B2 (en) * 2000-09-25 2003-01-07 Kabushiki Kaisha Toshiba Cooling unit for cooling heat generating component, circuit module including the cooling unit, and electronic apparatus mounted with the circuit module
US6708754B2 (en) * 2001-07-25 2004-03-23 Wen-Chen Wei Flexible heat pipe
US6883594B2 (en) * 2001-11-30 2005-04-26 Thermal Corp. Cooling system for electronics with improved thermal interface

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090038782A1 (en) * 2007-08-10 2009-02-12 Kuo-Hsin Chen Heat-conducting module

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US7312997B2 (en) 2007-12-25
TWI282724B (en) 2007-06-11
TW200638850A (en) 2006-11-01

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