JP3148003U - Heat sink module bottom plate - Google Patents

Abstract

A heat dissipation module bottom plate having improved heat dissipation efficiency is provided by adopting a structure that is inclined and thinned from a contact surface toward an outer peripheral edge of a substrate. A contact surface protrudes mainly at a central portion of a bottom surface of a substrate, and an inclined surface which is inclined and thinned toward an outer peripheral edge of the substrate is provided on the side of the contact surface. The substrate 1 comes into contact with the chip 31 at the contact surface 11, and one or more sheet-like heat radiation members 2 are welded to the opposite side of the contact surface of the substrate, so that heat generated in the chip travels through the substrate and one or more sheet-like heat radiations. Dissipate heat with the member. The thickness of the substrate away from the chip has a small effect on the performance, and the thickness of the substrate near the chip has a large effect on the performance. By increasing the thickness of the substrate, the heat conduction resistance of the substrate is lowered. [Selection] Figure 4

Description

  The present invention relates to the structure of the bottom plate of the heat dissipation module, and in particular, the contact surface protrudes from the central portion of the bottom surface of the substrate, and the contact surface side is provided with an inclined surface that is inclined and thinned toward the outer peripheral edge of the substrate. Heat dissipation by using the contact surface and slope to reliably conduct heat to one or more sheet-shaped heat dissipation members on the other side surface, reduce the volume, and improve the heat dissipation effect It relates to the structure of the module bottom plate.

  Today, computer and electronic technologies are progressing steadily, and the development trend of personal computers and electronic products is progressing in the direction of precise calculation functions and high speed. The CPU of a computer generates heat during work, and the higher the speed, the higher the heat. If the heat is not released immediately, the CPU will burn or freeze. In general, in order to reduce or dissipate the heat generated during the operation of the CPU, a sheet-like heat radiating member is provided on the surface of the CPU, the heat generated by the CPU is conducted to each sheet-like heat radiating member, and cold air is used using a fan. Is sent to a gap between adjacent sheet-like heat radiating members to radiate heat. However, the main cause affecting the heat radiation efficiency is the heat radiation area. The size of the heat radiation area formed by the sheet-like heat radiating member varies depending on the distance between the sheet-like heat radiating members.

  FIG. 10 shows a three-dimensional exploded view of the prior art. There is a manufacturer that researches and develops using a high-density sheet-shaped heat radiation member, welds a high-density sheet-shaped heat radiation member A to the surface of the storage tank B1 in the fixing base B, and moves toward the both sides from the top surface of the fixing base B. The extending part B2 is extended in a letter shape, and a plurality of fixing holes B21 are provided on the surface of the extending part B2. The fan C passes through the fixing part D through the hole C1 and the fixing hole B21 and is screwed together to constitute a heat dissipation device. However, the heat conduction effect is enhanced by making the fixing base B with a steel material to further improve the heat dissipation efficiency.

  The fixing base B is directly molded with almost one steel material. In order to save the processing cost, the cross-sectional area of the steel material is almost rectangular. Therefore, when the shape is changed, the processing is performed again, and the processing cost is significantly increased. However, as the price of copper increases, the weight of the fixed base B becomes the main factor affecting the product cost. Since the cross-sectional area thickness of the fixing base B and the entire area are large, the manufacturing cost of the product is significantly increased. In addition, since the fixing base B is installed above the CPU, if the weight of the fixing base B is heavy, the CPU is likely to be damaged due to an impact test, a vibration test, or a shake when transporting the computer.

Furthermore, as manufacturers continue to improve CPU research and development, the area of CPUs has gradually decreased. Thermal resistance occurs when conducting heat, and the temperature continues to decrease as the conduction distance increases. When the cross-sectional area of the fixing table B is relatively thick and the entire area is relatively large, the route through which heat is conducted through the fixing table B to the sheet-like heat radiating member A becomes long. The fixed base B conducts heat mainly at the central portion and the connection point of the CPU. The thickness of the central portion of the fixing base B is thin, and when the heat is conducted toward the outer edge from the central portion, a large resistance is generated, so that the sheet shape connected to the outside of the CPU position of the fixing base B and the other side surface The temperature difference between the temperature of the heat dissipating member A and the room temperature is reduced. However, the smaller the temperature difference between the object surface and the outside, the smaller the heat radiation speed, so that only part of the sheet-shaped heat radiating member A radiates heat, and the heat radiation effect is reduced. It was necessary to further improve how to manufacture a heatsink with low cost and simple technology, and how to reduce the material cost and simplify the manufacturing process according to the high heat generated from the CPU.
Utility Model Registration No. 3145194

In order to solve the drawbacks of the prior art, the first object of the present invention is to provide a contact surface projecting from the central portion of the bottom surface of the substrate, and a slant surface that is inclined and thinned toward the outer peripheral edge of the substrate on the contact surface side. An object of the present invention is to provide a bottom plate of a heat dissipation module.
A second object of the present invention is to provide a heat radiating module bottom plate that forms a contact surface in the central portion of the bottom surface of the substrate by extruding a metal material, casting, and forging the substrate.

  In order to solve the above-mentioned problems, the present invention provides a structure of a heat dissipation module bottom plate. Even if the thickness of the contact surface of the substrate increases, the contact surface protrudes from the central portion of the bottom surface of the substrate, and the contact surface side is inclined and thinned toward the outer peripheral edge of the substrate. The total volume and weight of the substrate can be reduced. The farther the substrate is from the center, the smaller the effect of thickness on performance, and the closer to the center, the greater the effect of thickness on performance. In addition, by increasing the contact area and increasing the heat conduction effect, there is no large temperature difference even at a position far from the chip of the substrate, and the substrate 1 maintains a uniform temperature. On the other hand, since one or more sheet-like heat radiation members on the other side surface of the substrate cause a relatively large temperature difference from the external space, the effect of one or more sheet-like heat radiation members radiating heat to the external space is improved, and the substrate is also Has the characteristics of reducing the volume and improving the heat dissipation effect.

  Further, the substrate is made by extruding a metal material by a casting and forging method, thereby forming a contact surface at the central portion of the bottom surface of the substrate. In addition, by providing a sloping surface that is slanted and thinned toward the outer peripheral edge of the substrate on the contact surface side, it is possible to save the cost of cutting part of the general rectangular metal material and the loss part of the remaining cutting material. This also saves material costs. In addition to reliably reducing the manufacturing cost of the product, the weight of the substrate is reduced to avoid damage to the chip due to shock testing, vibration testing or shaking during computer transport.

  According to the structure of the heat radiating module bottom plate of the present invention, a thick contact surface protrudes from the central portion of the bottom surface of the metal substrate to increase the heat conduction effect. By providing an inclined surface that is inclined and thinned toward the outer peripheral edge of the substrate on the side of the contact surface, the total volume and weight of the substrate are reduced, and at the same time, not only the manufacturing cost of the product is surely lowered but also the substrate is reduced. By reducing the weight of the chip, it is possible to avoid damage to the chip due to shock test, vibration test, or shaking during transportation of the computer.

  In order to clearly show the structure of the heat dissipation module bottom plate according to the present invention, a detailed description will be given with reference to the drawings. As shown in FIG. 1 and FIG. 2, a three-dimensional external view and a side sectional view of the substrate of the present invention. The bottom plate of the heat dissipating module has a contact surface 11 projecting from a central portion of the bottom surface of the substrate 1, and an inclined surface that is inclined and thinned toward the outer peripheral edge of the substrate on the contact surface 11 side. A plurality of holes 13 are provided at each corner of the substrate 1. A convex portion 14 having a relatively small thickness is extended from one side of the substrate 1, and a plurality of stationary portions 15 having stationary holes 151 are provided at the opposite corner portion of the convex portion 14 of the substrate 1. An inclination angle 16 opposite to the stationary part 15 is provided on the substrate 1 and the protruding convex part 14 side.

  The substrate 1 is made by a method of extruding, casting and forging a metal material, and the metal material can be made of copper, aluminum, other metals, or alloys, saving the cutting cost required for general rectangular metal materials. can do. Further, since the substrate 1 is reduced in volume by the inclined surface 12, not only the manufacturing material cost can be saved, but also the weight of the substrate 1 can be reduced. Normally, when heat is transferred to the side, the conduction resistance decreases as the thickness (width) in the direction perpendicular to the direction of heat transfer increases. When the substrate 1 is inclined and thinned from the center to the outside, the thickness at the center is increased, so that the speed of conduction to the outside is increased. Further, the thinned substrate 1 is thinner from the center toward the outside, so that the weight is lighter than the rectangular base. Since the price of materials has increased significantly, reducing the weight reaches the goal of reducing the manufacturing cost and improving the heat dissipation effect.

  The inclined surface 12 is inclined linearly or curvedly outward from each side of the contact surface 11, and the inclined surface 12 is connected to a plurality of surfaces to form a plurality of corners or a single plane. The point is that it becomes thinner toward the outside. However, it does not limit the scope of the present invention, and if the same effect is produced, such as various changes and modifications based on the concept of the present invention, application, and change of shape, naturally, within the scope of rights of the present invention. is there.

  1, 3, and 4 are a three-dimensional external view of the substrate of the present invention, a three-dimensional external view of the best embodiment, and a cross-sectional view of the second embodiment. When the substrate 1 is used, one or more sheet-like heat radiating members (heat radiating sheets) 2 are fixed by welding to the surface opposite to the contact surface 11 of the substrate 1, and the contact surface 11 of the substrate 1 is connected to the chip 31 of the circuit board 3. Match. By passing a plurality of fixing components 4 through a plurality of holes in the substrate 1, the substrate 1 is placed on the circuit board 3. Since the contact surface 11 of the substrate 1 conflicts with the chip 31 and the substrate 1 moves away from the surface of the circuit board 3, when the chip 31 is operated, the heat generated by the chip passes through the substrate 1 and is on one or more other surfaces. Conducted to the sheet-like heat radiating member 2.

  Furthermore, one or more sheet-like heat radiating members 2 are provided with one or more fans 5 on the top or on the wind inlet side, and by using the fans 5 to put outside cold air into the sheet-like heat radiating member 2, sheet-like heat radiating members 2 Since the convective heat transfer coefficient between the member 2 and the outside air increases, the heat dissipation speed increases. Further, by extracting hot air around one or more sheet-like heat radiating members 2 using the fan 5, external cold air flows around the sheet-like heat radiating member 2, so that the heat radiation speed can be increased.

  The substrate 1 is first coated with heat transfer cream (heat transfer grease) on the contact surface 11, and then the contact surface 11 is pasted on the chip 31. With the heat transfer cream, there is no gap between the chip 31 and the contact surface 11, and heat is reliably transferred to the substrate 1, and a situation where heat is accumulated is prevented. In addition, an outer cover on which one or more sheet-like heat radiating members 2 or fans 5 are fixed can be installed. The above-described outer cover, heat transfer cream, and other heat-dissipating and stationary parts are conventional techniques, and the detailed configuration thereof is not a point of the present invention, and thus will not be described here.

  FIG. 1 and FIG. 5 are a three-dimensional external view of the substrate of the present invention and a three-dimensional external view of the substrate of the second embodiment. The substrate 1 and the contact surface can be rectangular, circular, diamond-shaped or other shapes, and the contact surface 11 has a function of conducting heat on an average by completely contacting the chip 31. Therefore, the scope of the present invention is not limited, and the same scope of the present invention shall be applied to all cases where the same effects are produced, such as various changes, modifications, applications and shapes based on the concept of the present invention.

  6, 7, 8, and 9 show the temperature distribution of the substrate of the present invention, the temperature and distance comparison diagram of the present invention and the prior art, the performance test comparison diagram, and the performance test and weight comparison. FIG. As a result of repeated research and development, the function of the chip 31 has been improved. However, since the volume of the chip 31 has decreased, the thermal density of the chip 31 has increased. Since the contact area between the substrate 1 and the chip 31 is reduced, heat is concentrated on the substrate 1, and a large conduction resistance is generated when heat is transferred from the center to the outside. The temperature at each position on the substrate 1 also decreases as the distance of the chip 31 increases, and the change in temperature represents a curve. Substrate 1 has a thin tip 12 that is inclined toward the outer periphery of the contact surface 11 at the center of the bottom surface of the substrate 1. 31 The conduction resistance of the surrounding substrate 1 can be lowered, and the substrate 1 has a better temperature uniformity and reaches the purpose of increasing the heat transfer effect.

  Further, the thin substrate 1 can reduce the number of sheet-like heat radiating members 2 connected to the top. As shown in FIG. 8, the heat radiation effect of installing 35 sheet-like heat radiating members 2 on the thin substrate 1 is the same as the rectangular pedestal of the 48 sheet-like heat radiating members 2. Therefore, the production cost can be reduced by reducing the number and weight of the sheet-like heat radiating members 2 installed.

  When the center thickness of the 2.5 mm thin substrate 1 is increased to 3.5 mm and the outer peripheral edge of the thin substrate 1 is decreased to 1 mm, the rate of decrease of the temperature effect curve becomes lower than that of the 2.5 mm rectangular pedestal. As shown in FIG. 7, the dark color curve of the rhombus block indicates the number of the rectangular pedestal, and the light curve of the block type indicates the number of the thin substrate 1. The performance of the thin substrate 1 with a thick central portion is superior to the rectangular base of the prior art, and the weight can be reduced by 17%.

  Further, when one or more sheet-like heat dissipating members 2 are installed on a plurality of prior art rectangular pedestals and a plurality of substrates 1 of the present invention, the substrate 1 and the chip 31 on the circuit board 3 are in contact with each other, and an experiment is performed. After reducing the volume by thinning 1 from the center toward the outer periphery by the slope 12, the weight of the bottom plate usually accounted for 30% to 50% of the total weight, the target to save 15% of the material weight You can see that

When actually using the bottom plate of the heat dissipation module of the present invention, it has the following advantages:
(1) Even if the thickness of the contact surface 11 of the substrate 1 is increased, the total volume of the substrate can be reduced because the volume of the substrate 1 is reduced by the inclined surface 12. When the thickness of the contact surface 11 is increased, the heat conduction effect is improved, so that a large temperature difference does not occur even at the position of the chip 31 away from the substrate 1, and the substrate 1 has good temperature uniformity. By providing one or more sheet-like heat dissipating members 2 on the surface of the other side of the substrate 1, the temperature of the air greatly differs. The greater the temperature difference between the one or more sheet-like heat radiation members 2 and the external space, the better the heat radiation effect. At the same time, the purpose is to reduce the volume and increase the heat dissipation effect.
(2) The contact surface 11 protrudes from the central portion of the bottom surface of the substrate 1 and the inclined surface 12 is formed on the contact surface side so as to be inclined and thin toward the outer peripheral edge of the substrate. The substrate 1 is made by a method of extruding a metal material, casting, and forging, so that it is possible to save a loss part cost of cutting processing and cutting residual material with a general rectangular metal material. Further, by providing the inclined surface 12 on the substrate 1, manufacturing material costs can be saved, and the manufacturing cost of the product is surely reduced.
(3) Volume and weight of the substrate 1 could be reduced by the slope 12. The smaller the chip, the less weight it can withstand. The chip is easily damaged when subjected to pressure, movement, or impact. If the substrate 1 is lightened, even if an impact, vibration, or shaking during transportation occurs on the substrate 1, it can be prevented from being damaged by being applied to the chip.

  The heat sink module bottom plate of the present invention has a contact surface 11 protruding from the center of the bottom surface of the substrate 1, and a contact surface 11 that contacts the substrate 1 by providing a slant surface 12 that inclines toward the outer periphery of the substrate and becomes thinner. Even if the thickness of the surface 11 is increased, the total volume of the substrate 1 can be reduced by the inclined surface 12, and the main purpose is to reduce the cost of manufacturing the product. By conducting heat conduction using only the contact surface 11 with the increased thickness of the substrate 1 and the inclined surface 12 that becomes thinner toward the outer peripheral edge, the substrate 1 maintains good temperature uniformity and improves the heat dissipation effect.

  The detailed description of the present invention according to the above embodiments does not limit the scope of the present invention. Even if a person familiar with the present technology makes changes or adjustments within the scope of the present invention, the important significance of the present invention is not lost and is included in the scope of the present invention.

It is a three-dimensional external view of the board | substrate of this invention. It is side sectional drawing of the board | substrate of this invention. It is a three-dimensional external view of the best embodiment of the present invention. It is side sectional drawing of the Example of this invention. It is a three-dimensional external view of the board | substrate of the 3rd Example of this invention. It is a temperature distribution figure of the board of this invention. It is a comparison figure of temperature and distance of the present invention and the prior art. It is a comparison figure of the performance test of this invention. It is a comparison figure of the performance test and weight of the present invention. It is a three-dimensional exploded view of the prior art.

Explanation of symbols

1. Board
11 Contact surface
12 slope
13 holes
14 Convex
15 Stationary part
151 Mounting hole
16 Inclination angle
2 Sheet heat dissipation member
3 Circuit board
31 chips
4 Fixed parts
5 fans
A Sheet-shaped heat dissipation member
B Fixed base
B1 storage tank
B2 Stretched part
B21 fixing hole
C fan
C1 hole
D Fixed parts

Claims (8)

It has a substrate, a sheet-like heat dissipation member,
Protruding a contact surface that conflicts with the chip at the center of the bottom surface of the substrate, and providing a slope on the side of the contact surface that is inclined and thinned toward the outer periphery of the substrate,
A structure of a bottom plate of a heat radiating module, in which one or more sheet-like heat radiating members are fixedly installed on the top surface of a substrate, and a chip on a circuit board in contact with the bottom surface of the substrate conducts heat conduction and heat radiation.   The structure of the bottom plate of a heat radiation module according to claim 1, wherein the substrate is provided with a fixing component at each corner and fixed to a plurality of holes of the circuit board.   The heat radiation module bottom plate according to claim 1, wherein a plurality of stationary portions having stationary holes are provided at both ends of the substrate, and inclined angles opposite to the stationary portions are provided on both sides of the substrate and the extended convex portion. Construction.   The structure of the heat sink module bottom plate according to claim 1, wherein the contact surface of the substrate has a rectangular shape, a circular shape, a diamond shape, or other shapes.   2. The structure of the bottom plate of a heat radiation module according to claim 1, wherein the substrate is made by a method of extruding a metal material, casting and forging.   6. The structure of the heat sink module bottom plate according to claim 5, wherein the metal material is copper, aluminum, or another kind of metal or alloy.   2. The structure of a heat radiating module bottom plate according to claim 1, wherein a fan is installed on top of the one or more sheet-like heat radiating members.   2. The structure of a heat radiating module bottom plate according to claim 1, wherein the one or more sheet-like heat radiating members are provided with a fan on a wind inlet side.

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