TWI487470B - Heat dissipation device and electronic device using same and heat dissipation fin thereof - Google Patents

Description

Electronic device and its heat sink and heat sink

The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device and a heat sink for dissipating heat from electronic components of an electronic device.

With the rapid development of the electronic information industry, portable electronic devices such as notebook computers, personal digital assistants, and multimedia mobile phones are rapidly developing in the direction of high performance and multi-function. The electronic components such as the central processing unit in the electronic device are high-speed. High frequency and integration make its heat generation increase sharply. If the heat is not removed in time, it will cause the temperature of the electronic component to rise and the ambient temperature to rise, which will affect the normal operation of the electronic components and even reduce the performance and shorten the life. . Therefore, the industry usually configures a heat sink on an electronic component to dissipate heat. The heat sink used in the industry usually consists of a pedestal and a plurality of flat fins erected on the pedestal. However, today's portable electronic devices usually have the characteristics of small size and convenient carrying, so the internal space is small and the radiator occupies The space is limited. In order to further improve the heat dissipation performance, the heat sink is usually brought into contact with the outer casing of the electronic device, and the heat of the electronic component is further radiated outward through the casing.

However, the bottom plate and the heat sink of the conventional heat sink are rigid structures, and the shape cannot be changed according to the needs of the installation space, and the space adaptability is poor. Moreover, due to the high mobility of the portable electronic device, the outer casing is usually subjected to various external forces, and the external force impact is directly transmitted to the electronic component through the rigid heat sink, which is easy to be Subcomponents cause damage.

In view of the above, it is necessary to provide a heat sink that has better space adaptability and can reduce the impact of external forces on electronic components.

A heat sink disposed between two parallel heat conducting plates, the heat sink being formed by bending a sheet of material, comprising two flat joints and being connected between the two joints The at least one bent portion is respectively fixed to the two heat conducting plates in a surface contact manner, and the bent portion has an elastic stretching capability between the two joint portions, the bending The portion includes two vertical portions and a connecting portion connected between the two vertical portions, the two joint portions respectively extending horizontally from opposite ends of the two vertical portions in opposite directions, The projections of the two joints and the joint on the plane in which any one of the joints are located are sequentially connected but do not overlap each other.

A heat dissipating device comprises two heat conducting plates and a plurality of heat radiating fins disposed between the two heat conducting plates, each fin is formed by bending a sheet of material, and comprises two flat connecting portions and connected thereto At least one bent portion between the two joint portions, the bent portion has elastic stretchability between the two joint portions, and two joint portions of each heat sink are respectively fixed to the two in surface contact manner a heat conducting plate, the bent portion includes two vertical portions and a connecting portion connected between the two vertical portions, the two joint portions are respectively opposite from the two free ends of the two vertical portions Extending horizontally, the projections of the two joints and the joint on the plane in which any one of the joints are located are sequentially connected but do not overlap each other.

An electronic device includes a casing, an electronic component disposed in the casing, and a heat sink formed by bending a sheet of material, including two flat knots a joint portion and at least one bent portion connected between the two joint portions, the bent portion has an elastic expansion and contraction capability between the two joint portions, and the two joint portions of the heat sink are respectively in surface contact manner Fixed to the electronic component and the outer casing, the bent portion includes two vertical portions and a connecting portion connected between the two vertical portions, the two joint portions respectively free from the two vertical portions The ends extend horizontally in opposite directions, and the projections of the two joints and the joint on the plane in which any one of the joints are located are sequentially connected but do not overlap each other.

An electronic device includes an outer casing, an electronic component disposed in the outer casing, and a heat dissipating device. The heat dissipating device includes two heat conducting plates and a plurality of heat radiating fins disposed between the two heat conducting plates, the two heat conducting materials The plates are respectively connected to the electronic component and the outer casing, and each of the heat sinks is formed by bending a piece of material, and includes two flat joints and at least one bent portion connected between the two joints, the bend The folding portion has elastic stretching capability between the two joint portions, and the two joint portions of each heat sink are respectively fixed to the two heat conducting plates in a surface contact manner, and the bending portion includes two vertical portions and Connected to a connecting portion between the two vertical portions, the two joint portions respectively extending horizontally from opposite ends of the two vertical portions, the two joint portions are connected to the connection The projections on the plane in which any one of the joints are located are sequentially connected but do not overlap each other.

Compared with the prior art, the bent portion of the heat sink of the heat dissipating device of the present invention has an elastic expansion and contraction capability between the two joint portions, and can be correspondingly deformed according to the size of the internal space of different electronic devices, thereby causing the heat dissipation. The device has better space adaptability. At the same time, due to the elastic expansion and contraction capability of the heat sink, when the electronic device is subjected to an external force, the heat sink can contract to play a buffering function, thereby preventing the external force from being directly transmitted to the electronic component through the heat sink, thereby causing The electronic components are damaged.

10‧‧‧heating device

11‧‧‧First heat conducting plate

12‧‧‧Second heat conducting plate

13, 13a‧‧ ‧ heat sink

14‧‧‧Air passage

20‧‧‧Electronic devices

21‧‧‧ Shell

22‧‧‧Electronic components

130‧‧‧ first joint

131‧‧‧Second junction

132, 132a‧‧‧ bends

210‧‧‧floor

211‧‧‧ cover

1320, 1320a‧‧‧ Connections

1321‧‧‧ vertical

Fig. 1 is a perspective view of a heat sink according to a first embodiment of the present invention.

2 is a side cross-sectional view showing the heat sink of FIG. 1 disposed in an electronic device.

3 is a perspective view of a heat sink portion of a heat sink according to a second embodiment of the present invention.

4 is a side view of the heat sink of FIG. 3.

Fig. 5 is a perspective view showing a heat sink portion of a heat sink according to a third embodiment of the present invention.

Figure 6 is a side elevational view of the heat sink of Figure 5.

The present invention will be further described below in conjunction with the embodiments with reference to the accompanying drawings.

As shown in Fig. 1, a first embodiment of a heat sink 10 of the present invention is shown. The heat dissipating device 10 is made of a metal having good thermal conductivity, such as copper, aluminum, etc., and includes a first heat conducting plate 11 , a second heat conducting plate 12 , and the first heat conducting plate 11 and the first heat conducting plate 11 . A plurality of heat sinks 13 between the two heat conducting plates 12.

The first heat conducting plate 11 and the second heat conducting plate 12 are respectively substantially rectangular plate-shaped, and the first heat conducting plate 11 and the second heat conducting plate 12 are parallel to each other. The lower surface of the first heat conducting plate 11 is in contact with an electronic component 22 (shown in FIG. 2), and the upper surface thereof is used to support the heat sink 13. The second heat conducting plate 12 has a size larger than that of the first heat conducting plate 11, and a lower surface thereof is opposite to an upper surface of the first heat conducting plate 11.

The plurality of fins 13 are disposed on an upper surface of the first heat conducting plate 11. Each of the fins 13 has a substantially stepped shape, and is formed by integrally stamping and bending a sheet of aluminum or copper sheet having good thermal conductivity. Each of the fins 13 includes a first joint portion 130 fixed to the first heat conducting plate 11 and a first portion fixed to the second heat conducting plate 12 The second joint portion 131 and a bent portion 132 connected between the first joint portion 130 and the second joint portion 131. The first joint portion 130 and the second joint portion 131 are each in a rectangular flat shape, and the first joint portion 130 and the second joint portion 131 are parallel to the first heat conducting plate 11 and the second heat conducting plate 12, respectively. The second bonding portion 131 is located above the first bonding portion 130. The bent portion 132 includes a connecting portion 1320 parallel to the first joint portion 130 and the second joint portion 131, and a connection between the connecting portion 1320 and the first joint portion 130 and a connection with the second joint portion 1320 Two vertical portions 1321 between the portions 131. The shape and size of the connecting portion 1320 are the same as the shape and size of the first joint portion 130 and the second joint portion 131, and are mutually offset in the vertical direction, that is, the first joint portion 130, the joint portion 1320, and the second portion. The projections of the joint portion 131 on the first heat conducting plate 11 are sequentially connected but not overlapped. The bent portion 132 can expand and contract between the first joint portion 130 and the second joint portion 131, so that the heat sink 13 can be stretched, compressed or inclined. In this embodiment, only one bent portion 132 is disposed between the first joint portion 130 and the second joint portion 131. In fact, a plurality of the first joint portion 130 and the second joint portion 131 may be disposed in sequence. The bent portion 132 is connected to expand the space adaptability of the heat sink 13.

The first joint portion 130 of each of the fins 13 is sequentially arranged in a plurality of rows and a plurality of rows in the same direction on the upper surface of the first heat conducting plate 11, and the bent portions 132 are disposed in the same direction, and the heat sinks 13 are disposed in the same direction. The second joint portion 131 is sequentially arranged in a plurality of rows and a plurality of columns corresponding to the lower surface of the second heat conducting plate 12 in the same direction. The heat sink 13 is welded to the first heat conducting plate 11 and the second heat conducting plate 12 through the first joint portion 130 and the second joint portion 131 , respectively. The fins 13 are spaced apart from each other to ensure that the heat dissipating device 10 is compressed, and the bent portions 132 of the adjacent fins 13 are not pressed against each other by deformation or inclination. A stepped air flow passage 14 is formed between each adjacent two fins 13.

FIG. 2 is a schematic diagram of the heat dissipating device 10 shown in FIG. 1 disposed in a portable electronic device 20, such as a notebook computer. The electronic device 20 includes a housing 21 , an electronic component 22 received in the housing 21 , and a heat sink 10 disposed above the electronic component 22 . The outer casing 21 includes a bottom plate 210 and a cover plate 211 which are disposed on the lower and lower sides of the heat sink 10. The electronic component 22 is located on the bottom plate 210. The lower surface of the first heat conducting plate 11 of the heat sink 10 is attached to the electronic component 22, and the upper surface of the second heat conducting plate 12 is attached to the cover plate 211.

Generally, in order to increase the heat dissipation effect of the heat sink 10, the height in the axial direction of each of the heat sinks 13 before being mounted in the natural state is greater than the distance between the bottom plate 210 and the cover plate 211 to maximize the distance. Cooling area. During assembly, due to the limitation of the internal space of the electronic device 20, the heat sink 13 can be appropriately compressed to achieve assembly requirements. At the same time, the heat dissipating device 10 can also be applied to various different applications, such as a larger internal electronic device, and the heat sink 13 can be appropriately stretched to meet assembly requirements. During operation, the heat generated by the electronic component 22 is directly transmitted to the first heat conducting plate 11 and the first joint portion 130 of each of the heat sinks 13 , and is transmitted to the upper second joint portion 131 and the second portion through the bent portions 132 . The heat conducting plate 12 is emitted from the second heat conducting plate 12 through the cover 211 of the electronic device 20 to the external space of the electronic device 20.

Since the heat sink 13 of the heat sink 10 has an elastic expansion capability, the heat sink 10 can be deformed according to the size of the internal space of the different electronic device 20, so that the heat sink 10 has better space adaptability. The heat can be directly transmitted to the cover 211 of the electronic device 20 to be radiated to the surrounding environment. At the same time, since the heat sink 13 has an elastic contraction capability, when the electronic device 20 is subjected to an external force, the heat sink 13 can be deformed to play a buffering function, thereby avoiding the external heat. The force is directly transmitted to the electronic component 22 through the heat sink 13 to damage the electronic component 22.

Please refer to FIG. 3 and FIG. 4, which is a second embodiment of the heat dissipation device 10a of the present invention. The difference between the present embodiment and the first embodiment is that the connecting portion 1320a is disposed obliquely with respect to the first joint portion 130 and the second joint portion 131, and the connecting portion 1320a and the first joint portion 130 and the second joint portion The 131 are staggered in the vertical direction, and a side of the connecting portion 1320a adjacent to the second joint portion 131 forms a certain distance from the first heat conducting plate 11. The connecting portion 1320a and each of the vertical portions 1321 are connected to each other at a circular arc chamfer.

Please refer to FIG. 5 and FIG. 6 , which illustrate a third embodiment of the heat dissipation device of the present invention. The difference between the present embodiment and the first embodiment is that the connecting portion 1320b and the first joint portion 130 and the second joint portion 131 overlap each other in the vertical direction, that is, the first joint portion 130 and the joint portion 1320b. The projections of the second joint portion 131 on the first heat conducting plate 11 coincide with each other, and the connecting portion 1320b is located between the two joint portions 130, 131 and disposed in parallel with the two joint portions 130, 131.

In addition, the second heat conducting plate 12 may not be disposed in the heat dissipating device, so that the second bonding portion 131 of the heat sink 13 is directly connected to the outer casing 21 of the electronic device 20. Similarly, the heat dissipating device may not be provided with the first heat conducting plate. 11. The first bonding portion 130 of the heat sink 13 is directly connected to the electronic component 22 in the electronic device 20.

In summary, the present invention conforms to the requirements of the invention patent, and proposes a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.

10‧‧‧heating device

11‧‧‧First heat conducting plate

12‧‧‧Second heat conducting plate

13, 13a‧‧ ‧ heat sink

14‧‧‧Air passage

130‧‧‧ first joint

131‧‧‧Second junction

132‧‧‧Bend

1320‧‧‧Connecting Department

1321‧‧‧ vertical

Claims (14)

A heat sink is disposed between two parallel heat conducting plates, wherein the heat sink is formed by bending a sheet of material, comprising two flat joints and connecting the two joints At least one bent portion between the portions, the two flat-shaped joint portions are respectively fixed to the two heat-conducting plates in a surface contact manner, and the bent portion has an elastic expansion and contraction capability between the two joint portions. The bent portion includes two vertical portions and a connecting portion connected between the two vertical portions, the two joint portions respectively extending horizontally from opposite ends of the two vertical portions The projections of the two joints and the joint on the plane in which any one of the joints are located are sequentially connected but do not overlap each other. The heat sink of claim 1, wherein the connecting portion is disposed in parallel or obliquely with respect to the two joint portions. The heat sink of claim 1, wherein the connecting portion is located between the two joint portions and disposed in parallel with the two joint portions. A heat dissipating device comprising two heat conducting plates and a plurality of heat dissipating fins disposed between the two heat conducting plates, wherein the heat dissipating fins are formed by bending a piece of material, comprising two flat joints and Attached to the at least one bent portion between the two joint portions, the bent portion has an elastic expansion and contraction capability between the two joint portions, and the two joint portions of each heat sink are respectively fixed to the surface contact manner to The two heat conducting plates, the bent portion includes two vertical portions and a connecting portion connected between the two vertical portions, the two joint portions respectively from the two free ends of the two vertical portions Extending horizontally in opposite directions, the projections of the two joints and the joint on the plane in which any one of the joints are located are sequentially connected but do not overlap each other. The heat dissipating device of claim 4, wherein the connecting portion is disposed in parallel or obliquely with respect to the two joint portions. The heat dissipating device of claim 4, wherein the connecting portion is located between the two joint portions and disposed in parallel with the two joint portions. The heat dissipating device of claim 4, wherein the plurality of fins are arranged in a plurality of rows and a plurality of columns. An electronic device includes an outer casing, an electronic component disposed in the outer casing, and a heat sink, wherein the heat sink is formed by bending a sheet of material, including two flat joints and connected thereto. At least one bent portion between the two joint portions, the bent portion has an elastic expansion and contraction capability between the two joint portions, and the two joint portions of the heat sink are respectively fixed to the electronic component and the outer shell in a surface contact manner The bent portion includes two vertical portions and a connecting portion connected between the two vertical portions, the two joint portions respectively extending horizontally from opposite ends of the two vertical portions And, the projections of the two joint portions and the connecting portion on the plane in which any one of the joint portions are located are sequentially connected but do not overlap each other. The electronic device of claim 8, wherein the connecting portion is disposed in parallel or obliquely with respect to the two joint portions. The electronic device of claim 8, wherein the connecting portion is located between the two joint portions and disposed in parallel with the two joint portions. An electronic device includes an outer casing, an electronic component disposed in the outer casing, and a heat dissipating device, wherein the heat dissipating device comprises two heat conducting plates and a plurality of heat dissipating fins disposed between the two heat conducting plates, The two heat conducting plates are respectively connected to the electronic component and the outer casing, and each of the heat radiating fins is formed by bending a piece of material, and includes two flat connecting portions and at least one bent portion connected between the two joint portions. The bending portion has an elastic stretching capability between the two joint portions, and the two joint portions of each heat sink are respectively fixed to the two heat conducting plates in a surface contact manner, and the bending portion includes two vertical portions. And a connecting portion connected between the two vertical portions, the two joint portions respectively extending horizontally from opposite ends of the two vertical portions, the two joint portions and the joint portion a projection of the connecting portion on a plane in which any one of the joints is located Connect in order but not overlap each other. The electronic device of claim 11, wherein the connecting portion is disposed in parallel or obliquely with respect to the two joint portions. The electronic device of claim 11, wherein the connecting portion is located between the two joint portions and disposed in parallel with the two joint portions. The electronic device of claim 11, wherein the plurality of heat sinks are arranged in a plurality of rows and a plurality of columns.