TWI487470B - Heat dissipation device and electronic device using same and heat dissipation fin thereof - Google Patents
Heat dissipation device and electronic device using same and heat dissipation fin thereof Download PDFInfo
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Description
本發明涉及一種散熱裝置,尤其涉及一種對電子裝置的電子元件散熱用的散熱裝置與散熱片。 The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device and a heat sink for dissipating heat from electronic components of an electronic device.
隨著電子資訊產業的快速發展,可攜式電子裝置如筆記型電腦、個人數位助理、多媒體手機等亦在快速向高性能、多功能方向發展,該電子裝置內的中央處理器等電子元件高速、高頻及集成化使其發熱量劇增,如不及時排除該等熱量,將引起電子元件自身溫度和環境溫度的升高,進而影響電子元件的正常工作甚至帶來性能的降低以及壽命縮短。因此,業界通常在電子元件上配置散熱器對其進行散熱。業界採用的散熱器通常由一基座和基座上豎立的複數平板狀散熱片組成,然而如今可攜式電子裝置通常具有體積小、方便攜帶的特點,因此其內部空間狹小,散熱器所佔用的空間有限,為了進一步提高散熱性能通常使散熱器與電子裝置的外殼相接觸,通過機殼進一步將電子元件的熱量向外散發。 With the rapid development of the electronic information industry, portable electronic devices such as notebook computers, personal digital assistants, and multimedia mobile phones are rapidly developing in the direction of high performance and multi-function. The electronic components such as the central processing unit in the electronic device are high-speed. High frequency and integration make its heat generation increase sharply. If the heat is not removed in time, it will cause the temperature of the electronic component to rise and the ambient temperature to rise, which will affect the normal operation of the electronic components and even reduce the performance and shorten the life. . Therefore, the industry usually configures a heat sink on an electronic component to dissipate heat. The heat sink used in the industry usually consists of a pedestal and a plurality of flat fins erected on the pedestal. However, today's portable electronic devices usually have the characteristics of small size and convenient carrying, so the internal space is small and the radiator occupies The space is limited. In order to further improve the heat dissipation performance, the heat sink is usually brought into contact with the outer casing of the electronic device, and the heat of the electronic component is further radiated outward through the casing.
然而,習知的散熱器的底板及散熱片均為剛性結構,不能根據安裝空間的需要而改變其形狀,空間適應性較差。且由於可攜式電子裝置的高移動性,其外殼通常會受到各種外力的衝擊,所述外力衝擊通過該剛性的散熱器直接傳遞至該電子元件,容易對該電 子元件造成損傷。 However, the bottom plate and the heat sink of the conventional heat sink are rigid structures, and the shape cannot be changed according to the needs of the installation space, and the space adaptability is poor. Moreover, due to the high mobility of the portable electronic device, the outer casing is usually subjected to various external forces, and the external force impact is directly transmitted to the electronic component through the rigid heat sink, which is easy to be Subcomponents cause damage.
有鑒於此,有必要提供一種空間適應性較好、且能減小外力對電子元件衝擊的散熱裝置。 In view of the above, it is necessary to provide a heat sink that has better space adaptability and can reduce the impact of external forces on electronic components.
一種散熱片,所述散熱片設置於兩個平行的導熱板之間,該散熱片由一片狀材料折彎形成,包括兩個平板狀的結合部及連接於該兩個結合部之間的至少一彎折部,所述兩個平板狀的結合部以面接觸的方式分別固定至兩個導熱板上,該彎折部於該兩個結合部之間具有彈性伸縮能力,所述彎折部包括兩個豎直部及連接於該兩個豎直部之間的一連接部,該兩個結合部分別自該兩個豎直部的兩自由端向相反方向水平延伸而出,所述兩個結合部與所述連接部在其中任一個結合部所在的平面上的投影依次連接但相互不重疊。 A heat sink disposed between two parallel heat conducting plates, the heat sink being formed by bending a sheet of material, comprising two flat joints and being connected between the two joints The at least one bent portion is respectively fixed to the two heat conducting plates in a surface contact manner, and the bent portion has an elastic stretching capability between the two joint portions, the bending The portion includes two vertical portions and a connecting portion connected between the two vertical portions, the two joint portions respectively extending horizontally from opposite ends of the two vertical portions in opposite directions, The projections of the two joints and the joint on the plane in which any one of the joints are located are sequentially connected but do not overlap each other.
一種散熱裝置,包括兩個導熱板及設於該兩個導熱板之間的複數散熱片,每一散熱片由一片狀材料折彎形成,其包括兩個平板狀的結合部及連接於該兩個結合部之間的至少一彎折部,該彎折部於該兩個結合部之間具有彈性伸縮能力,每一散熱片的兩個結合部以面接觸的方式分別固定至該兩個導熱板,所述彎折部包括兩個豎直部及連接於該兩個豎直部之間的一連接部,該兩個結合部分別自該兩個豎直部的兩自由端向相反方向水平延伸而出,所述兩個結合部與所述連接部在其中任一個結合部所在的平面上的投影依次連接但相互不重疊。 A heat dissipating device comprises two heat conducting plates and a plurality of heat radiating fins disposed between the two heat conducting plates, each fin is formed by bending a sheet of material, and comprises two flat connecting portions and connected thereto At least one bent portion between the two joint portions, the bent portion has elastic stretchability between the two joint portions, and two joint portions of each heat sink are respectively fixed to the two in surface contact manner a heat conducting plate, the bent portion includes two vertical portions and a connecting portion connected between the two vertical portions, the two joint portions are respectively opposite from the two free ends of the two vertical portions Extending horizontally, the projections of the two joints and the joint on the plane in which any one of the joints are located are sequentially connected but do not overlap each other.
一種電子裝置,包括一外殼、設於該外殼內的一電子元件及一散熱片,該散熱片由一片狀材料折彎形成,其包括兩個平板狀的結 合部及連接於該兩個結合部之間的至少一彎折部,該彎折部於該兩個結合部之間具有彈性伸縮能力,該散熱片的兩個結合部以面接觸的方式分別固定至電子元件及外殼,所述彎折部包括兩個豎直部及連接於該兩個豎直部之間的一連接部,該兩個結合部分別自該兩個豎直部的兩自由端向相反方向水平延伸而出,所述兩個結合部與所述連接部在其中任一個結合部所在的平面上的投影依次連接但相互不重疊。 An electronic device includes a casing, an electronic component disposed in the casing, and a heat sink formed by bending a sheet of material, including two flat knots a joint portion and at least one bent portion connected between the two joint portions, the bent portion has an elastic expansion and contraction capability between the two joint portions, and the two joint portions of the heat sink are respectively in surface contact manner Fixed to the electronic component and the outer casing, the bent portion includes two vertical portions and a connecting portion connected between the two vertical portions, the two joint portions respectively free from the two vertical portions The ends extend horizontally in opposite directions, and the projections of the two joints and the joint on the plane in which any one of the joints are located are sequentially connected but do not overlap each other.
一種電子裝置,包括一外殼、設於該外殼內的一電子元件及一散熱裝置,該散熱裝置包括兩個導熱板及設於該兩個導熱板之間的複數散熱片,所述兩個導熱板分別與電子元件及外殼連接,每一散熱片由一片狀材料折彎形成,其包括兩個平板狀的結合部及連接於該兩個結合部之間的至少一彎折部,該彎折部於該兩個結合部之間具有彈性伸縮能力,每一散熱片的兩個結合部以面接觸的方式分別固定至該兩個導熱板,所述彎折部包括兩個豎直部及連接於該兩個豎直部之間的一連接部,該兩個結合部分別自該兩個豎直部的兩自由端向相反方向水平延伸而出,所述兩個結合部與所述連接部在其中任一個結合部所在的平面上的投影依次連接但相互不重疊。 An electronic device includes an outer casing, an electronic component disposed in the outer casing, and a heat dissipating device. The heat dissipating device includes two heat conducting plates and a plurality of heat radiating fins disposed between the two heat conducting plates, the two heat conducting materials The plates are respectively connected to the electronic component and the outer casing, and each of the heat sinks is formed by bending a piece of material, and includes two flat joints and at least one bent portion connected between the two joints, the bend The folding portion has elastic stretching capability between the two joint portions, and the two joint portions of each heat sink are respectively fixed to the two heat conducting plates in a surface contact manner, and the bending portion includes two vertical portions and Connected to a connecting portion between the two vertical portions, the two joint portions respectively extending horizontally from opposite ends of the two vertical portions, the two joint portions are connected to the connection The projections on the plane in which any one of the joints are located are sequentially connected but do not overlap each other.
與習知技術相比,本發明中的散熱裝置的散熱片的彎折部於二結合部之間具有彈性伸縮能力,可根據不同電子裝置的內部空間的大小產生相應的形變,從而使該散熱裝置有更好的空間適應性。同時,由於該散熱片的彈性伸縮能力,當該電子裝置受到外力衝擊時,所述散熱片可以收縮而起到一緩衝的作用,從而避免該外力通過散熱片直接傳遞至該電子元件,而造成電子元件受損傷。 Compared with the prior art, the bent portion of the heat sink of the heat dissipating device of the present invention has an elastic expansion and contraction capability between the two joint portions, and can be correspondingly deformed according to the size of the internal space of different electronic devices, thereby causing the heat dissipation. The device has better space adaptability. At the same time, due to the elastic expansion and contraction capability of the heat sink, when the electronic device is subjected to an external force, the heat sink can contract to play a buffering function, thereby preventing the external force from being directly transmitted to the electronic component through the heat sink, thereby causing The electronic components are damaged.
10‧‧‧散熱裝置 10‧‧‧heating device
11‧‧‧第一導熱板 11‧‧‧First heat conducting plate
12‧‧‧第二導熱板 12‧‧‧Second heat conducting plate
13、13a‧‧‧散熱片 13, 13a‧‧ ‧ heat sink
14‧‧‧氣流通道 14‧‧‧Air passage
20‧‧‧電子裝置 20‧‧‧Electronic devices
21‧‧‧外殼 21‧‧‧ Shell
22‧‧‧電子元件 22‧‧‧Electronic components
130‧‧‧第一結合部 130‧‧‧ first joint
131‧‧‧第二結合部 131‧‧‧Second junction
132、132a‧‧‧彎折部 132, 132a‧‧‧ bends
210‧‧‧底板 210‧‧‧floor
211‧‧‧蓋板 211‧‧‧ cover
1320、1320a‧‧‧連接部 1320, 1320a‧‧‧ Connections
1321‧‧‧豎直部 1321‧‧‧ vertical
圖1為本發明第一實施例的散熱裝置的立體圖。 Fig. 1 is a perspective view of a heat sink according to a first embodiment of the present invention.
圖2為圖1所示散熱裝置設於一電子裝置內的側面剖視圖。 2 is a side cross-sectional view showing the heat sink of FIG. 1 disposed in an electronic device.
圖3為本發明第二實施例的散熱裝置的散熱片部分的立體圖。 3 is a perspective view of a heat sink portion of a heat sink according to a second embodiment of the present invention.
圖4為圖3的散熱裝置的側視圖。 4 is a side view of the heat sink of FIG. 3.
圖5為本發明第三實施例的散熱裝置的散熱片部分的立體圖。 Fig. 5 is a perspective view showing a heat sink portion of a heat sink according to a third embodiment of the present invention.
圖6為圖5的散熱裝置的側視圖。 Figure 6 is a side elevational view of the heat sink of Figure 5.
下面參照附圖結合實施例對本發明作進一步說明。 The present invention will be further described below in conjunction with the embodiments with reference to the accompanying drawings.
如圖1所示,為本發明的散熱裝置10的第一實施例。該散熱裝置10由導熱性良好的金屬,如銅、鋁等製成,其包括相對平行間隔設置的一第一導熱板11、一第二導熱板12及設於該第一導熱板11與第二導熱板12之間的複數散熱片13。 As shown in Fig. 1, a first embodiment of a heat sink 10 of the present invention is shown. The heat dissipating device 10 is made of a metal having good thermal conductivity, such as copper, aluminum, etc., and includes a first heat conducting plate 11 , a second heat conducting plate 12 , and the first heat conducting plate 11 and the first heat conducting plate 11 . A plurality of heat sinks 13 between the two heat conducting plates 12.
所述第一導熱板11及第二導熱板12分別大致呈矩形板狀,且第一導熱板11與第二導熱板12相互平行。其中,該第一導熱板11的下表面與一電子元件22(如圖2所示)相互接觸,其上表面用於支撐所述散熱片13。該第二導熱板12的尺寸大於該第一導熱板11的尺寸,其下表面與該第一導熱板11的上表面相對。 The first heat conducting plate 11 and the second heat conducting plate 12 are respectively substantially rectangular plate-shaped, and the first heat conducting plate 11 and the second heat conducting plate 12 are parallel to each other. The lower surface of the first heat conducting plate 11 is in contact with an electronic component 22 (shown in FIG. 2), and the upper surface thereof is used to support the heat sink 13. The second heat conducting plate 12 has a size larger than that of the first heat conducting plate 11, and a lower surface thereof is opposite to an upper surface of the first heat conducting plate 11.
所述複數散熱片13設於該第一導熱板11的上表面上。每一散熱片13大致呈長條形的階梯狀,其可由導熱性能良好的一片狀鋁板或銅板一體衝壓折彎而成。每一散熱片13包括一固定於該第一導熱板11上的第一結合部130、一用於固定至該第二導熱板12上的第 二結合部131、及一連接於該第一結合部130與該第二結合部131之間的彎折部132。該第一結合部130與該第二結合部131均呈矩形的平板狀,所述第一結合部130及第二結合部131分別與該第一導熱板11及第二導熱板12相互平行,且該第二結合部131位於該第一結合部130的上方。該彎折部132包括一與所述第一結合部130及第二結合部131平行的連接部1320、及分別連接該連接部1320與第一結合部130及連接該連接部1320與第二結合部131之間的兩個豎直部1321。該連接部1320的形狀、大小與所述第一結合部130及第二結合部131的形狀、大小相同,且沿豎直方向相互錯開,即該第一結合部130、連接部1320及第二結合部131在該第一導熱板11上的投影依次連接但不重疊。該彎折部132在該第一結合部130與第二結合部131之間可以伸縮,使該散熱片13可以被拉伸、壓縮或傾斜。在本實施例中,該第一結合部130與第二結合部131之間僅設置一個彎折部132,事實上,該第一結合部130與第二結合部131之間可以設置多個依次連接的彎折部132,來擴充散熱片13的空間適應能力。 The plurality of fins 13 are disposed on an upper surface of the first heat conducting plate 11. Each of the fins 13 has a substantially stepped shape, and is formed by integrally stamping and bending a sheet of aluminum or copper sheet having good thermal conductivity. Each of the fins 13 includes a first joint portion 130 fixed to the first heat conducting plate 11 and a first portion fixed to the second heat conducting plate 12 The second joint portion 131 and a bent portion 132 connected between the first joint portion 130 and the second joint portion 131. The first joint portion 130 and the second joint portion 131 are each in a rectangular flat shape, and the first joint portion 130 and the second joint portion 131 are parallel to the first heat conducting plate 11 and the second heat conducting plate 12, respectively. The second bonding portion 131 is located above the first bonding portion 130. The bent portion 132 includes a connecting portion 1320 parallel to the first joint portion 130 and the second joint portion 131, and a connection between the connecting portion 1320 and the first joint portion 130 and a connection with the second joint portion 1320 Two vertical portions 1321 between the portions 131. The shape and size of the connecting portion 1320 are the same as the shape and size of the first joint portion 130 and the second joint portion 131, and are mutually offset in the vertical direction, that is, the first joint portion 130, the joint portion 1320, and the second portion. The projections of the joint portion 131 on the first heat conducting plate 11 are sequentially connected but not overlapped. The bent portion 132 can expand and contract between the first joint portion 130 and the second joint portion 131, so that the heat sink 13 can be stretched, compressed or inclined. In this embodiment, only one bent portion 132 is disposed between the first joint portion 130 and the second joint portion 131. In fact, a plurality of the first joint portion 130 and the second joint portion 131 may be disposed in sequence. The bent portion 132 is connected to expand the space adaptability of the heat sink 13.
所述各散熱片13的第一結合部130於該第一導熱板11的上表面同向順次排佈成複數行與複數列,而彎折部132朝同一方向設置,各散熱片13的第二結合部131對應於該第二導熱板12的下表面同向順次排佈成複數行與複數列。所述散熱片13分別通過第一結合部130及第二結合部131與第一導熱板11及第二導熱板12相互焊接連接。各散熱片13之間相互間隔,以保證該散熱裝置10被壓縮時,相鄰兩散熱片13的彎折部132之間不會因為變形或者傾斜而相互擠壓。每相鄰的兩個散熱片13之間形成一階梯形的氣流通道14。 The first joint portion 130 of each of the fins 13 is sequentially arranged in a plurality of rows and a plurality of rows in the same direction on the upper surface of the first heat conducting plate 11, and the bent portions 132 are disposed in the same direction, and the heat sinks 13 are disposed in the same direction. The second joint portion 131 is sequentially arranged in a plurality of rows and a plurality of columns corresponding to the lower surface of the second heat conducting plate 12 in the same direction. The heat sink 13 is welded to the first heat conducting plate 11 and the second heat conducting plate 12 through the first joint portion 130 and the second joint portion 131 , respectively. The fins 13 are spaced apart from each other to ensure that the heat dissipating device 10 is compressed, and the bent portions 132 of the adjacent fins 13 are not pressed against each other by deformation or inclination. A stepped air flow passage 14 is formed between each adjacent two fins 13.
圖2為圖1所示的散熱裝置10設於一可攜式電子裝置20,如筆記型電腦內的示意圖。該電子裝置20包括一外殼21、一收容於該外殼21內的電子元件22及位於該電子元件22上方的散熱裝置10。該外殼21包括分設於該散熱裝置10上、下兩側的底板210和蓋板211。該電子元件22位於該底板210上。該散熱裝置10的第一導熱板11的下表面與該電子元件22貼合,該第二導熱板12的上表面與該蓋板211貼合。 FIG. 2 is a schematic diagram of the heat dissipating device 10 shown in FIG. 1 disposed in a portable electronic device 20, such as a notebook computer. The electronic device 20 includes a housing 21 , an electronic component 22 received in the housing 21 , and a heat sink 10 disposed above the electronic component 22 . The outer casing 21 includes a bottom plate 210 and a cover plate 211 which are disposed on the lower and lower sides of the heat sink 10. The electronic component 22 is located on the bottom plate 210. The lower surface of the first heat conducting plate 11 of the heat sink 10 is attached to the electronic component 22, and the upper surface of the second heat conducting plate 12 is attached to the cover plate 211.
通常,為了增加該散熱裝置10的散熱效果,各散熱片13安裝於該電子裝置20之前處於自然狀態時沿軸向的高度大於該底板210與蓋板211之間的距離,以最大限度地增加散熱面積。而組裝時,由於該電子裝置20內部空間的限制,可對該散熱片13進行適當的壓縮以達成組裝要求。同時,該散熱裝置10亦可適用於各種不同的應用場合,如一內部空間較大電子裝置,可以對所述散熱片13進行適當的拉伸達成組裝要求。工作時,電子元件22產生的熱量直接傳遞至該第一導熱板11及各散熱片13的第一結合部130上,並通過各彎折部132傳遞至上方的第二結合部131及第二導熱板12,由該第二導熱板12通過該電子裝置20的蓋板211散發至該電子裝置20的外部空間。 Generally, in order to increase the heat dissipation effect of the heat sink 10, the height in the axial direction of each of the heat sinks 13 before being mounted in the natural state is greater than the distance between the bottom plate 210 and the cover plate 211 to maximize the distance. Cooling area. During assembly, due to the limitation of the internal space of the electronic device 20, the heat sink 13 can be appropriately compressed to achieve assembly requirements. At the same time, the heat dissipating device 10 can also be applied to various different applications, such as a larger internal electronic device, and the heat sink 13 can be appropriately stretched to meet assembly requirements. During operation, the heat generated by the electronic component 22 is directly transmitted to the first heat conducting plate 11 and the first joint portion 130 of each of the heat sinks 13 , and is transmitted to the upper second joint portion 131 and the second portion through the bent portions 132 . The heat conducting plate 12 is emitted from the second heat conducting plate 12 through the cover 211 of the electronic device 20 to the external space of the electronic device 20.
由於該散熱裝置10的散熱片13具有彈性伸縮能力,因此,該散熱裝置10可以根據不同電子裝置20的內部空間的大小產生相應的形變,從而使該散熱裝置10有更好的空間適應性,並可將熱量直接傳遞至電子裝置20的蓋板211散發至周圍環境中。同時,由於該散熱片13具有彈性收縮能力,當該電子裝置20受到外力衝擊時,所述散熱片13可以產生形變而起到一緩衝的作用,從而避免該外 力通過散熱片13直接傳遞至該電子元件22,而損傷該電子元件22。 Since the heat sink 13 of the heat sink 10 has an elastic expansion capability, the heat sink 10 can be deformed according to the size of the internal space of the different electronic device 20, so that the heat sink 10 has better space adaptability. The heat can be directly transmitted to the cover 211 of the electronic device 20 to be radiated to the surrounding environment. At the same time, since the heat sink 13 has an elastic contraction capability, when the electronic device 20 is subjected to an external force, the heat sink 13 can be deformed to play a buffering function, thereby avoiding the external heat. The force is directly transmitted to the electronic component 22 through the heat sink 13 to damage the electronic component 22.
請參照圖3及圖4,為本發明散熱裝置10a的第二實施例。本實施例與第一實施例的區別在於:該連接部1320a相對於該第一結合部130及第二結合部131傾斜設置,該連接部1320a與所述第一結合部130與第二結合部131沿豎直方向相互錯開,且連接部1320a靠近第二結合部131的一側與第一導熱板11之間形成一定間距。所述連接部1320a與每一豎直部1321相互連接處為一圓弧形倒角。 Please refer to FIG. 3 and FIG. 4, which is a second embodiment of the heat dissipation device 10a of the present invention. The difference between the present embodiment and the first embodiment is that the connecting portion 1320a is disposed obliquely with respect to the first joint portion 130 and the second joint portion 131, and the connecting portion 1320a and the first joint portion 130 and the second joint portion The 131 are staggered in the vertical direction, and a side of the connecting portion 1320a adjacent to the second joint portion 131 forms a certain distance from the first heat conducting plate 11. The connecting portion 1320a and each of the vertical portions 1321 are connected to each other at a circular arc chamfer.
請參照圖5及圖6,為本發明散熱裝置的第三實施例。本實施例與第一實施例的區別在於:該連接部1320b與所述第一結合部130與第二結合部131沿豎直方向相互重合,即所述第一結合部130、連接部1320b及第二結合部131在該第一導熱板11上的投影相互重合,所述連接部1320b位於該兩個結合部130、131之間且與該兩個結合部130、131平行設置。 Please refer to FIG. 5 and FIG. 6 , which illustrate a third embodiment of the heat dissipation device of the present invention. The difference between the present embodiment and the first embodiment is that the connecting portion 1320b and the first joint portion 130 and the second joint portion 131 overlap each other in the vertical direction, that is, the first joint portion 130 and the joint portion 1320b. The projections of the second joint portion 131 on the first heat conducting plate 11 coincide with each other, and the connecting portion 1320b is located between the two joint portions 130, 131 and disposed in parallel with the two joint portions 130, 131.
此外,所述散熱裝置中可以不設置第二導熱板12,使散熱片13的第二結合部131直接與電子裝置20的外殼21連接,同理,所述散熱裝置亦可不設置第一導熱板11,使散熱片13的第一結合部130直接與電子裝置20內的電子元件22連接。 In addition, the second heat conducting plate 12 may not be disposed in the heat dissipating device, so that the second bonding portion 131 of the heat sink 13 is directly connected to the outer casing 21 of the electronic device 20. Similarly, the heat dissipating device may not be provided with the first heat conducting plate. 11. The first bonding portion 130 of the heat sink 13 is directly connected to the electronic component 22 in the electronic device 20.
綜上所述,本發明符合發明專利之要件,爰依法提出專利申請。惟以上所述者僅為本發明之較佳實施例,舉凡熟悉本案技藝之人士,在爰依本發明精神所作之等效修飾或變化,皆應涵蓋於以下之申請專利範圍內。 In summary, the present invention conforms to the requirements of the invention patent, and proposes a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.
10‧‧‧散熱裝置 10‧‧‧heating device
11‧‧‧第一導熱板 11‧‧‧First heat conducting plate
12‧‧‧第二導熱板 12‧‧‧Second heat conducting plate
13、13a‧‧‧散熱片 13, 13a‧‧ ‧ heat sink
14‧‧‧氣流通道 14‧‧‧Air passage
130‧‧‧第一結合部 130‧‧‧ first joint
131‧‧‧第二結合部 131‧‧‧Second junction
132‧‧‧彎折部 132‧‧‧Bend
1320‧‧‧連接部 1320‧‧‧Connecting Department
1321‧‧‧豎直部 1321‧‧‧ vertical
Claims (14)
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Citations (2)
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US6411513B1 (en) * | 1999-12-10 | 2002-06-25 | Jacques Normand Bedard | Compliant thermal interface devices and method of making the devices |
TWI282724B (en) * | 2005-04-22 | 2007-06-11 | Quanta Comp Inc | Heat-dissipating device with elastic piece and heat-dissipating method thereof |
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Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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US6411513B1 (en) * | 1999-12-10 | 2002-06-25 | Jacques Normand Bedard | Compliant thermal interface devices and method of making the devices |
TWI282724B (en) * | 2005-04-22 | 2007-06-11 | Quanta Comp Inc | Heat-dissipating device with elastic piece and heat-dissipating method thereof |
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