US20050252951A1 - Method for assembling and brazing CPU heat sink modules - Google Patents
Method for assembling and brazing CPU heat sink modules Download PDFInfo
- Publication number
- US20050252951A1 US20050252951A1 US11/103,700 US10370005A US2005252951A1 US 20050252951 A1 US20050252951 A1 US 20050252951A1 US 10370005 A US10370005 A US 10370005A US 2005252951 A1 US2005252951 A1 US 2005252951A1
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- Prior art keywords
- components
- filler
- heat sink
- copper
- junctions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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- 238000000034 method Methods 0.000 title claims abstract description 61
- 238000005219 brazing Methods 0.000 title claims abstract description 31
- 239000000945 filler Substances 0.000 claims abstract description 71
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 25
- 239000001301 oxygen Substances 0.000 claims abstract description 25
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 25
- 229910001316 Ag alloy Inorganic materials 0.000 claims abstract description 20
- YCKOAAUKSGOOJH-UHFFFAOYSA-N copper silver Chemical compound [Cu].[Ag].[Ag] YCKOAAUKSGOOJH-UHFFFAOYSA-N 0.000 claims abstract description 20
- 239000011261 inert gas Substances 0.000 claims abstract description 20
- 230000003647 oxidation Effects 0.000 claims abstract description 17
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 17
- 238000002844 melting Methods 0.000 claims abstract description 15
- 230000008018 melting Effects 0.000 claims abstract description 15
- 239000007788 liquid Substances 0.000 claims abstract description 10
- 238000010438 heat treatment Methods 0.000 claims description 33
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 26
- 239000010949 copper Substances 0.000 claims description 26
- 239000000463 material Substances 0.000 claims description 26
- 229910052802 copper Inorganic materials 0.000 claims description 25
- 238000001816 cooling Methods 0.000 claims description 14
- 238000012545 processing Methods 0.000 claims description 5
- 239000003344 environmental pollutant Substances 0.000 claims description 2
- 231100000719 pollutant Toxicity 0.000 claims description 2
- 238000002161 passivation Methods 0.000 claims 1
- 238000003466 welding Methods 0.000 description 46
- 230000008569 process Effects 0.000 description 20
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 14
- 229910052782 aluminium Inorganic materials 0.000 description 13
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 13
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 230000007797 corrosion Effects 0.000 description 7
- 238000005260 corrosion Methods 0.000 description 7
- 238000001125 extrusion Methods 0.000 description 7
- 150000002739 metals Chemical class 0.000 description 7
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000007789 sealing Methods 0.000 description 6
- 238000005476 soldering Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 229910052786 argon Inorganic materials 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 230000004927 fusion Effects 0.000 description 3
- 238000005304 joining Methods 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229910000978 Pb alloy Inorganic materials 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000003466 anti-cipated effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 231100000925 very toxic Toxicity 0.000 description 1
- 238000005493 welding type Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
Definitions
- the present invention relates to methods of assembling heat sinks and attaching them to semiconductor devices. Specifically, the invention relates to methods of brazing (e.g., copper welding) heat sink modules and attaching them to a computer CPU (Central Processing Unit).
- brazing e.g., copper welding
- CPU Central Processing Unit
- Welding is a common process that saves labor, time and materials and is widely used in industrial production processes. Whether used with or without a filler, welding heats and/or pressurizes the molecules in a metal and makes use of cohesion to bond two metals as one.
- Welding techniques include fusion welding and pressure welding.
- Fusion welding is a type of welding process where the parts to be joined are heated without pressurization until melted to form a welded joint.
- Examples of fusion welding include hand arc welding and argon arc welding.
- pressure welding When pressurization is used during welding to form a welded joint, the welding process is called pressure welding, and examples include contact resistance spot welding and friction welding.
- Tin having a relatively low melting point
- Tin is often used as a filler to weld the heat pipes, fins and base at a low melting point to form a heat sink.
- the heat sink When the heat sink is combined with fans, it becomes a heat sink module.
- the heat sink module In the past, when CPUs operated at lower powers, the heat sink module was able to dissipate the heat generated by the CPU at a satisfactory rate.
- the electronic industry has rapidly made improvements and developed many precision electronic components. These components operate at a higher speeds and powers, generating more heat. For example, when the CPU is operating at a full load, the surface temperature of the chip can reach 100° C. or more.
- CPU heat sink modules made with traditional soldered heat pipes, fins, and base cannot conduct the heat away from the CPU at a satisfactory rate.
- Embodiments of the invention include methods of brazing components of heat sink modules.
- the methods may include the steps of assembling the components to be brazed, and placing a copper-silver alloy filler at junctions between the components.
- the assembled components may be pre-heated in an air-tight environment to burn up most of the oxygen present, and then heated to the melting point of the copper-silver alloy filler in an air-tight environment having an amount of inert gas sufficient to displace oxygen so as to avoid oxidation of the components, making the filler melt and evenly spread over the gaps at the junctions of the components.
- the assembled components may then be cooled to solidify the liquid filler at the junctions, to form a finished product.
- Embodiments of the invention also include assembly line systems for brazing the components of heat sink modules.
- the systems may include material input means for introducing assembled components to be brazed, and means for placing copper-silver alloy filler at the junctions of the components to join them and to seal them.
- the systems may also include a heating unit having an air-tight internal heating chamber for pre-heating the assembled components to burn up most of the oxygen present, and a brazing unit having an air-tight inert gas chamber containing an amount of inert gas sufficient to displace oxygen so as to avoid oxidation of the components.
- the system may further include a means for heating the assembled components to a melting point of the filler so as to make the filler melt and evenly spread over the gaps at the junctions of the components, and a cooling unit having a cooling chamber for rapidly chilling the assembled components to solidify the liquid filler at the junctions, thereby forming a finished product.
- the system may also include a material output means for removing finished products, and a continuous annular conveying device encompassing and connecting the above units to form a automatic and sequential structure.
- Embodiments of the invention also include methods of brazing components of a heat sink module, where the methods may include the steps of providing components of the heat sink module to be brazed, and placing a copper filler on joints of the components and assembling the components.
- the methods may also include pre-heating the assembled components in an air-tight heating unit to burn up most of the oxygen and pollutants on surfaces of the components, and then heating the assembled components to the melting point of the copper filler in an air-tight brazing unit that has an amount of inert gas sufficient to displace oxygen so as to avoid oxidation of the components, thereby making the filler melt and evenly spread over the gaps at the junctions of the components.
- the components may then be cooled to solidify the liquid copper filler at the joints and form the heat sink module.
- FIG. 1 is a flowchart of the steps of the invention.
- FIG. 2 is a schematic diagram of the assembly line of the invention.
- FIG. 3 is perspective view of one embodiment of the invention wherein the components of a heat pipe are assembled and sealed.
- FIG. 4 is a side view of one embodiment of the invention wherein a heat pipe and flat heat sink are brazed together.
- FIG. 5 is a perspective view of an interlocked heat sink module wherein no welding is used to form the module.
- FIG. 6 is a perspective view of one embodiment of the invention illustrating the assembly of a heat sink plate (vapor chamber) used in notebook computers.
- the present invention relates to methods of assembling and brazing (herein sometimes referred to as “copper welding”) the components of heat sink modules for integrated circuit chips, such as computer CPUs (Central Processing Units).
- the methods employ a filler (e.g., copper, copper-silver alloy, etc.) that is used to braze the components of heat sink modules together securely and durably.
- the filler is generally easier to melt and harder than the materials from which the components are made.
- the components of the heat sink modules may be made from a single material, or a plurality of different materials. These materials may include metals and alloys, such as copper, aluminum, and/or combinations of metals.
- the method of the invention may include assembling the components to be brazed, and placing filler at the junctions of these components to join them and to seal them (this may be done at a filling unit).
- the assembled components may be pre-heated to burn up most of the oxygen present (this may be done at a heating unit), and then heated to the melting point of the filler in the presence of an amount of inert gas sufficient to isolate any remaining oxygen so as to avoid oxidation of the components, thereby making the filler melt and evenly spread over the gaps at the junctions of the components (this may be done at a brazing unit).
- the fused components may then be rapidly chilled to solidify the liquid filler at the junctions, thereby forming a finished product (this may be done at a cooling unit).
- the heat sink modules produced are highly durable, airtight and corrosion-resistant. Cold welding and oxidation will not happen and the speed of heat conductivity and efficiency of the heat sink module will be enhanced.
- the present invention also relates to assembly line systems used to braze the components of heat sink modules into finished products.
- These systems may include a heating unit, a brazing unit, and a cooling unit.
- the units may be joined by a continuous annular conveying device, and a material input and material output, to form an automatic and sequential structure.
- the heating unit may be an airtight heating chamber that provides pre-heating of the assembled components to burn up most of the oxygen present in the heating chamber.
- the brazing unit (also referred to as the welding unit) may be an airtight, inert-gas chamber that provides a sufficient amount of inert gas to displace most of the residual oxygen to avoid oxidizing the components, as they are heated at high temperature to melt the filler material and spread it evenly over the gaps to be brazed.
- the cooling unit may be an airtight cooling chamber that chills the filler rapidly at the welded joint and solidifies it, thereby joining the components together to form a finished product. As mentioned, all three units may be connected by an annul
- the assembly line systems may be automated for mass production of the heat sink modules in a neutral environment, that gives the modules the characteristic of non-attenuation.
- the methods and systems can produce light mass finished products, avoid heavy metal pollution and reduce other pollution during the production process. Because the electronic industry is rapidly upgrading and developing components which are more precise, efficient and have more thermal energy, large amounts of heat sink modules are needed more than ever in combination with components of high thermal energy. Hence, it is anticipated that the methods and systems described here will be widely applied.
- the methods and assembly line systems of the present invention produce heat sink modules having increased speed and efficiency for conducting heat away from the integrated circuit.
- the methods and systems avoid cold welding in air, which reduces oxidation of the welded components of the modules.
- the modules produced are highly durable, airtight, and corrosion-resistant.
- the methods and systems permit components to be made from materials with high heat-transfer coefficients, and also allow welding together components made from different materials, such as metals having different physical properties and special structure requirements.
- the present invention further provides production processes that produce heat sink modules having all the parts tightly joined, and are tightly sealed, corrosion-resistant and durable.
- the heat sink modules produced by the methods and assembly line systems of the invention may include heat pipes, fins and a base. Modules with multiple fins having non-conventional shapes may be produced to expand the surface area of heat dissipation from the integrated circuit chip.
- the fins may be made of copper alloy and copper-silver alloy, which have higher and better heat-transfer coefficient than more conventional materials like aluminum.
- the methods and systems of the invention allow two different metals to be welded together, like aluminum and copper, without using hand arc welding or argon arc welding, which are difficult to use due to differences in metallic properties.
- the methods and systems also permit the components to be joined without having to rely on conventional soldering to join different metallic materials together.
- FIG. 1 is a flowchart showing the steps comprising the process of the invention (the unit of the assembly line used to perform the step is in parentheses).
- the steps of the process may include providing the components of the assembly 10 to be brazed; providing a filler 11 (e.g., copper-silver alloy filler) at the junctions of the components; and joining and/or sealing the components into the assembly 12 . This may be done at the filler unit.
- a filler 11 e.g., copper-silver alloy filler
- the steps of the process may further include preheating the assembled components 13 to burn up most of the oxygen present (this may be done at the heating unit); and heating the assembled components 14 to the melting point of the copper-silver alloy filler in the presence of an amount of inert gas sufficient to isolate any remaining oxygen so as to avoid oxidation of the components, thereby making filler melt and evenly spread over the gaps at the junctions of the components.
- the heating step may be performed at the brazing (copper welding) unit.
- the process may still further include the steps of rapidly chilling the assembly 15 at a cooling unit to solidify the liquid filler at the junctions, thereby forming a finished product 16 .
- FIG. 2 is a schematic diagram of the assembly line of the present invention.
- Heating chamber 23 is an airtight chamber which can burn up most of the oxygen with preheating.
- Inert gas chamber 24 is an airtight chamber that contains an amount of inert gas sufficient to isolate any remaining oxygen to avoid oxidation and that uses high temperature heating to reach the melting point of the copper-silver alloy filler so as to melt it and spread it over the gaps of the welded joints.
- Cooling unit 25 is also an airtight chamber that is used to rapidly chill and solidify the liquid filler at the welded joints of the assembled components 20 , thereby turning the assembled components 20 into a finished product 26 .
- An annular conveying device 27 is used to join the aforementioned units into a continuous assembly line that has a material input for introducing components 20 and a material output for exiting finished products 26 , thereby making it an automatic and sequential structure.
- a filling unit 22 can be installed at the material input of the annular conveying device 27 to simplify the above-described step (b), and annular conveying device 27 may convey assembled components 20 to the heating chamber 23 for the above-described step (c), wherein the assembled components 20 are preheated to burn up most of the oxygen.
- the annular conveying device 27 may then convey assembled components 20 to the inert gas chamber 24 , wherein an appropriate amount of inert gas is present to isolate the remaining oxygen to avoid oxidation of the components and high temperature heating is used to reach the melting point of copper-silver alloy filler 21 so as to melt the filler 21 and spread it over the gaps of the welded joints of the assembled unit 20 . Finally the assembled components. 20 is then conveyed to cooling chamber 25 from the inert gas chamber 24 to rapidly chill and solidify the filler 21 at the welded joints of the assembled unit 20 thereby forming a finished product 26 . The finished product 26 is then sent to the material output by the annular conveying device 27 . The whole procedure is automatic and sequential.
- the aforementioned automatic production process of the present invention is an easy and convenient procedure. It breaks the bottlenecks of the traditional soldering technology and makes airtight, durable, corrosion-resistant finished products which will greatly improve the speed and efficiency of heat conductivity.
- the products of the process are not subject to cold welding and oxidation. Ever-improving, highly efficient electronic components will no longer have problems with heat dissipation when the process of the invention is used, possess high economic benefits and can be used in a wider scope of applications.
- FIG. 3 illustrates the above-described steps (a) assembling the components to be brazed, and (b) placing copper-silver alloy 30 at the junctions of these components to join, seal and assemble them.
- FIG. 3 mainly shows the sealing and assembling of a heat pipe 31 .
- the structural design and shape of heat pipe 31 will change according to different applications, but basically filler 30 is used to seal and assemble the components into an airtight heat pipe 31 .
- the internal structure design of the heat pipe 31 is used to increase its heat conductivity and heat dissipation. Filler is then used to weld heat pipe 31 to the base 32 .
- heat pipe 31 and base 32 Known technology mainly uses tin filler to seal and assemble heat pipe 31 , but when soldering is heated to around 180° C., it is easy for the welded components of different metals (heat pipe 31 and base 32 ) to come apart, to crack or to leak air. These are commonly known as shortcomings of cold welding; hence, up to now the joining of heat pipe 31 and base 32 has been a problem for manufacturers.
- copper-silver alloy filler may be placed at the welded joints of the heat pipe 31 and base 32 to seal and assemble them (the above-described step (b) of this invention).
- the process of this invention is then used to braze the heat sink module, and after brazing (copper welding), both the seal at the heat pipe 31 opening and the seal at the bottom of heat pipe 31 and base 32 are durable, airtight and corrosion-resistant. Cold welding and oxidation will not occur, and the speed and efficiency of heat conductivity of the heat sink module can be highly improved.
- FIG. 4 illustrates brazing between the heat pipe 41 and the flat heat sink 42 .
- copper-silver alloy filler 40 is placed at the welded joints of the components (heat pipe 41 and flat heat sink 42 ) to proceed with the sealing and assembling of the unit (step (b) of the present invention).
- bold lines and dots are used in the figure.
- FIG. 5 illustrates an interlocked heat sink module wherein no welding is used to form the unit.
- a hole 54 having the same diameter as heat pipe 51 is made in the middle of aluminum extrusion heat sink 53 .
- the aluminum extrusion heat sink 53 interlocks with the heat pipe 51 and then sets on base 52 .
- the diameter of hole 54 of the aluminum extrusion heat sink 53 is made slightly smaller than the heat pipe 51 .
- the aluminum extrusion heat sink 53 and the heat pipe 51 will expand, interlock with each other and avoid coming apart.
- the above-mentioned methods will lose not only the heat dissipating efficiency of the heat sink module but also its beneficial results.
- copper-silver alloy filler 50 is used to weld and seal the opening of the heat pipe 51 , and the heat pipe is then welded onto the base 52 .
- the heat pipe 51 is inserted into the hole 54 of the aluminum extrusion heat sink 53 , an appropriate amount of filler 50 is placed around the hole 54 of the aluminum extrusion heat sink 53 .
- tin filler or copper-silver filler is used.
- the sealing and assembling process are performed next in accordance with step (b) of the present invention. Proceeding with the process of this invention, brazing (copper welding) is the next step.
- the assembled heat sink module after brazing (copper welding) is durable, airtight and corrosion-resistant, whether it involves the sealing of the opening of the heat pipe 41 ( FIG. 4 ), the brazing (copper welding) at the welded joints of the heat pipe 41 and the flat heat sink 42 , the brazing (copper welding) of heat pipe 51 and the base 52 (of different materials) or the brazing (copper welding) of the heat pipe 51 and the aluminum extrusion heat sink 53 . Cold welding and oxidation will not happen to the module. In addition, the speed and efficiency of the heat conductivity of the heat sink module will improve enormously.
- FIG. 6 illustrates the butt-welding and assembling of a heat sink plate (vapor chamber) used in notebook computers.
- Skived fins 63 on the bottom cover 62 of the heat sink plate expand and accelerate the speed of heat conductivity of the bottom cover 62 .
- Known technology uses pure tin (unleaded tin) as filler and flux to butt-weld during the sealing and assembling process of the top cover 61 and the bottom cover 62 .
- the assembled unit becomes an airtight heat sink plate (vapor chamber), but filler of pure tin (unleaded tin) and flux oxidizes easily and leaks air.
- the heat sink plate (vapor chamber) after brazing (copper welding) is more durable, airtight and corrosion-resistant, and cold welding and oxidation will not happen.
- the excess pressure resistance will be upgraded to be more than 5 kilograms (5 kg/cm 2 ), greatly improving the speed and efficiency of the heat conductivity of the heat sink plate (vapor chamber).
- this invention provides an assembly line and brazing (copper welding) process to be applied to the manufacture of heat sink modules.
- the design is simple and the structure is innovative and unique, offering practical and improved effectiveness. Because the electronic industry is upgrading rapidly, many components of higher precision and efficacy have been developed, and heat sink modules are widely used with the industry's high thermal energy components.
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Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/396,863 US20090159648A1 (en) | 2004-04-13 | 2009-03-03 | Device and method for brazing a heat pipe |
US12/560,829 US7703663B2 (en) | 2004-04-13 | 2009-09-16 | Device and method for brazing a heat pipe |
US12/705,309 US20100140331A1 (en) | 2004-04-13 | 2010-02-12 | Device and method for brazing a heat pipe |
US13/400,487 US8496161B2 (en) | 2005-04-11 | 2012-02-20 | Device and method for brazing a heat pipe |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW093110301 | 2004-04-13 | ||
TW093110301A TW200533455A (en) | 2004-04-13 | 2004-04-13 | Method and device for brazing CPU heat sink modules |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/396,863 Continuation-In-Part US20090159648A1 (en) | 2004-04-13 | 2009-03-03 | Device and method for brazing a heat pipe |
Related Child Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/396,863 Continuation US20090159648A1 (en) | 2004-04-13 | 2009-03-03 | Device and method for brazing a heat pipe |
US12/396,863 Continuation-In-Part US20090159648A1 (en) | 2004-04-13 | 2009-03-03 | Device and method for brazing a heat pipe |
US12/705,309 Continuation US20100140331A1 (en) | 2004-04-13 | 2010-02-12 | Device and method for brazing a heat pipe |
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US20050252951A1 true US20050252951A1 (en) | 2005-11-17 |
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Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
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US11/103,700 Abandoned US20050252951A1 (en) | 2004-04-13 | 2005-04-11 | Method for assembling and brazing CPU heat sink modules |
US12/396,863 Abandoned US20090159648A1 (en) | 2004-04-13 | 2009-03-03 | Device and method for brazing a heat pipe |
US12/560,829 Expired - Fee Related US7703663B2 (en) | 2004-04-13 | 2009-09-16 | Device and method for brazing a heat pipe |
US12/705,309 Abandoned US20100140331A1 (en) | 2004-04-13 | 2010-02-12 | Device and method for brazing a heat pipe |
Family Applications After (3)
Application Number | Title | Priority Date | Filing Date |
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US12/396,863 Abandoned US20090159648A1 (en) | 2004-04-13 | 2009-03-03 | Device and method for brazing a heat pipe |
US12/560,829 Expired - Fee Related US7703663B2 (en) | 2004-04-13 | 2009-09-16 | Device and method for brazing a heat pipe |
US12/705,309 Abandoned US20100140331A1 (en) | 2004-04-13 | 2010-02-12 | Device and method for brazing a heat pipe |
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US (4) | US20050252951A1 (zh) |
TW (1) | TW200533455A (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
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US20090071637A1 (en) * | 2007-09-14 | 2009-03-19 | Wen-Chih Liao | Heat sink assembly |
US20190225054A1 (en) * | 2018-01-23 | 2019-07-25 | Borgwarner Ludwigsburg Gmbh | Heating device and method for producing a heating rod |
US20190259632A1 (en) * | 2018-02-20 | 2019-08-22 | International Business Machines Corporation | Fixture facilitating heat sink fabrication |
US11278978B2 (en) * | 2019-06-21 | 2022-03-22 | International Business Machines Corporation | Pattern bonded finned cold plate |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200533455A (en) * | 2004-04-13 | 2005-10-16 | Wen-Chi Liao | Method and device for brazing CPU heat sink modules |
CN105171176B (zh) * | 2015-09-09 | 2017-07-21 | 奥英万科技有限公司 | 一种焊接电子钥匙插头装置的专用焊接机 |
CN111761156A (zh) * | 2020-07-22 | 2020-10-13 | 厦门福鑫特工贸有限公司 | 大型计算机散热器的钎焊方法 |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4400870A (en) * | 1980-10-06 | 1983-08-30 | Texas Instruments Incorporated | Method of hermetically encapsulating a semiconductor device by laser irradiation |
US4860938A (en) * | 1988-07-06 | 1989-08-29 | General Electric Company | Automated method of brazing |
US4954202A (en) * | 1987-11-12 | 1990-09-04 | Industrial Insulations Of Texas, Inc. | Apparatus for making V-groove insulation |
US5328084A (en) * | 1992-05-04 | 1994-07-12 | General Motors Corporation | Aluminum heat exchanger braze furnace |
US6115252A (en) * | 1998-07-01 | 2000-09-05 | Showa Aluminum Corporation | Heat sink device for electronic devices |
US6257320B1 (en) * | 2000-03-28 | 2001-07-10 | Alec Wargo | Heat sink device for power semiconductors |
US6302192B1 (en) * | 1999-05-12 | 2001-10-16 | Thermal Corp. | Integrated circuit heat pipe heat spreader with through mounting holes |
US6336497B1 (en) * | 2000-11-24 | 2002-01-08 | Ching-Bin Lin | Self-recirculated heat dissipating means for cooling central processing unit |
US6359267B1 (en) * | 2000-05-31 | 2002-03-19 | Ameritherm, Inc. | Induction heating system |
US6466442B2 (en) * | 2001-01-29 | 2002-10-15 | Ching-Bin Lin | Guidably-recirculated heat dissipating means for cooling central processing unit |
US6745524B1 (en) * | 2001-11-19 | 2004-06-08 | Ch2M Hill Industrial Design & Construction, Inc. | Method and apparatus for supporting a raised floor and a tool |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2123384A (en) * | 1936-04-07 | 1938-07-12 | American Brass Co | Copper base alloy article for brazing and method of preparing it |
US2217398A (en) * | 1936-08-17 | 1940-10-08 | Lorenz C Ag | Electric discharge tube |
US2650683A (en) * | 1949-11-03 | 1953-09-01 | Collins Radio Co | Metal-to-ceramic seal |
US2874949A (en) * | 1953-11-20 | 1959-02-24 | Clyde W Morrison | Brazing furnace construction |
US2800711A (en) * | 1954-08-18 | 1957-07-30 | Wall Colmonoy Corp | Brazing method |
US3551997A (en) * | 1967-10-06 | 1971-01-05 | Rca Corp | Methods for electroless plating and for brazing |
NL7213941A (zh) * | 1972-10-14 | 1974-04-16 | ||
DE2254769C3 (de) * | 1972-11-09 | 1985-06-05 | Vereinigte Aluminium-Werke AG, 1000 Berlin und 5300 Bonn | Durchlaufofen zum flußmittellosen Löten von Aluminiumwerkstoffen unter Schutzgas |
US4045882A (en) * | 1976-06-30 | 1977-09-06 | Buffington James F | Grain drying apparatus and process |
US4294395A (en) * | 1979-03-23 | 1981-10-13 | Airco, Inc. | Brazing process |
US4303122A (en) * | 1979-08-16 | 1981-12-01 | Entec Products Corporation | Flue heat recovery device |
JPH084105B2 (ja) * | 1987-06-19 | 1996-01-17 | 株式会社エンヤシステム | ウェハ接着方法 |
US5502742A (en) * | 1993-02-26 | 1996-03-26 | Abar Ipsen Industries, Inc. | Heat treating furnace with removable floor, adjustable heating element support, and threaded ceramic gas injection nozzle |
US6435866B1 (en) * | 2001-02-16 | 2002-08-20 | Delphi Technologies, Inc. | Radiation furnace with independently controlled heating elements |
US6986383B2 (en) * | 2004-03-30 | 2006-01-17 | Hul-Chun Hsu | End surface structure of a heat pipe for contact with a heat source |
TW200533455A (en) * | 2004-04-13 | 2005-10-16 | Wen-Chi Liao | Method and device for brazing CPU heat sink modules |
-
2004
- 2004-04-13 TW TW093110301A patent/TW200533455A/zh unknown
-
2005
- 2005-04-11 US US11/103,700 patent/US20050252951A1/en not_active Abandoned
-
2009
- 2009-03-03 US US12/396,863 patent/US20090159648A1/en not_active Abandoned
- 2009-09-16 US US12/560,829 patent/US7703663B2/en not_active Expired - Fee Related
-
2010
- 2010-02-12 US US12/705,309 patent/US20100140331A1/en not_active Abandoned
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4400870A (en) * | 1980-10-06 | 1983-08-30 | Texas Instruments Incorporated | Method of hermetically encapsulating a semiconductor device by laser irradiation |
US4954202A (en) * | 1987-11-12 | 1990-09-04 | Industrial Insulations Of Texas, Inc. | Apparatus for making V-groove insulation |
US4860938A (en) * | 1988-07-06 | 1989-08-29 | General Electric Company | Automated method of brazing |
US5328084A (en) * | 1992-05-04 | 1994-07-12 | General Motors Corporation | Aluminum heat exchanger braze furnace |
US6115252A (en) * | 1998-07-01 | 2000-09-05 | Showa Aluminum Corporation | Heat sink device for electronic devices |
US6302192B1 (en) * | 1999-05-12 | 2001-10-16 | Thermal Corp. | Integrated circuit heat pipe heat spreader with through mounting holes |
US6257320B1 (en) * | 2000-03-28 | 2001-07-10 | Alec Wargo | Heat sink device for power semiconductors |
US6359267B1 (en) * | 2000-05-31 | 2002-03-19 | Ameritherm, Inc. | Induction heating system |
US6336497B1 (en) * | 2000-11-24 | 2002-01-08 | Ching-Bin Lin | Self-recirculated heat dissipating means for cooling central processing unit |
US6466442B2 (en) * | 2001-01-29 | 2002-10-15 | Ching-Bin Lin | Guidably-recirculated heat dissipating means for cooling central processing unit |
US6745524B1 (en) * | 2001-11-19 | 2004-06-08 | Ch2M Hill Industrial Design & Construction, Inc. | Method and apparatus for supporting a raised floor and a tool |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090071637A1 (en) * | 2007-09-14 | 2009-03-19 | Wen-Chih Liao | Heat sink assembly |
US8176973B2 (en) | 2007-09-14 | 2012-05-15 | Wen-Chih Liao | Finned heat pipe comprising concentric pipes of different length |
US20190225054A1 (en) * | 2018-01-23 | 2019-07-25 | Borgwarner Ludwigsburg Gmbh | Heating device and method for producing a heating rod |
US20190259632A1 (en) * | 2018-02-20 | 2019-08-22 | International Business Machines Corporation | Fixture facilitating heat sink fabrication |
US10978313B2 (en) * | 2018-02-20 | 2021-04-13 | International Business Machines Corporation | Fixture facilitating heat sink fabrication |
US11404287B2 (en) * | 2018-02-20 | 2022-08-02 | International Business Machines Corporation | Fixture facilitating heat sink fabrication |
US11278978B2 (en) * | 2019-06-21 | 2022-03-22 | International Business Machines Corporation | Pattern bonded finned cold plate |
Also Published As
Publication number | Publication date |
---|---|
US7703663B2 (en) | 2010-04-27 |
US20100001040A1 (en) | 2010-01-07 |
US20090159648A1 (en) | 2009-06-25 |
US20100140331A1 (en) | 2010-06-10 |
TW200533455A (en) | 2005-10-16 |
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