TWI242633B - Method for manufacturing aluminum copper cladding radiator - Google Patents

Method for manufacturing aluminum copper cladding radiator Download PDF

Info

Publication number
TWI242633B
TWI242633B TW93117188A TW93117188A TWI242633B TW I242633 B TWI242633 B TW I242633B TW 93117188 A TW93117188 A TW 93117188A TW 93117188 A TW93117188 A TW 93117188A TW I242633 B TWI242633 B TW I242633B
Authority
TW
Taiwan
Prior art keywords
aluminum
copper
plate
heat sink
manufacturing
Prior art date
Application number
TW93117188A
Other languages
Chinese (zh)
Other versions
TW200540389A (en
Inventor
Chao-Ming Chen
Wen-Kuan Wang
Original Assignee
Ind Tech Res Inst
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ind Tech Res Inst filed Critical Ind Tech Res Inst
Priority to TW93117188A priority Critical patent/TWI242633B/en
Application granted granted Critical
Publication of TWI242633B publication Critical patent/TWI242633B/en
Publication of TW200540389A publication Critical patent/TW200540389A/en

Links

Landscapes

  • Pressure Welding/Diffusion-Bonding (AREA)

Abstract

The present invention is to provide a method for manufacturing aluminum copper cladding radiator using aluminum and copper boards of complementary sizes having a preserved gap. After being rolled and squeezed, the boards are capable of producing a reverse oblique angle so as to form a conjunction tighter than commonly rolling and squeezing. Afterward, a heat treatment operation is conducted for generating an aluminum copper composite board having a strengthened conjunction between the two boards by an alloy layer. After processing, an aluminum copper cladding radiator with high efficiency can be obtained. Furthermore, when the copper board or the aluminum board is formed in a serrated shape, the rolling and squeezing force is decreased and the contact area of the aluminum and copper boards is increased as well so as to increase the heat dissipation efficiency.

Description

1242633 五、發明說明α) 【發明所屬之技術領域】 本發明係關於一種鋁銅複合材料板的製造方法,應 用於散熱器,特別是指一種藉由無介面填料軋延過程所 製作鋁銅複合散熱器之方法。 【先前技術】 隨著電腦功率不斷提升,各類散熱器需求量非常 大,且對價格與性能十分地敏感,價格不夠低,性能再 優異,也很難大量導入市場。隨著散熱性能需求不斷上 昇,價格便宜的鋁製散熱器已難滿足最新的C P U與顯示卡 的需求,而純銅材料的導熱雖高於鋁,但是在價格、重 量、製程與應用上有所限制,因此各類型的取代方式紛 紛出現,互有優劣。 一般散熱器的製程大致上有下列方式:(1 )擠型 (Extrusion ) (2)壓鑄(Die Casting ) (3)鍛造 (Forging ) (4)機械力口 工(Machining ) (5)接合 (Bonding ) (6)折彎(Folding) (7) I 入壓鑄(Insert molding) (8)刨削(Skiving) (9)金屬射出成型 (Metal Injection Molding)。上述許多較具生產性且 較經濟的製程,如擠型、壓·、鍛造等製程,無法應用 兔.料。 如上所述,純鋁散熱_器性能不足,而純銅散熱器價 才各、重量、製程與應用上有許多限制。因此,鋁銅複合 散熱器,滿足現在高散熱需求,是眾多廠商積極開發的 方向。1242633 V. Description of the invention α) [Technical field to which the invention belongs] The present invention relates to a method for manufacturing an aluminum-copper composite material plate, which is applied to a radiator, and particularly refers to an aluminum-copper composite produced by a rolling process without an interface filler. Method of radiator. [Previous technology] With the continuous increase of computer power, the demand for various types of radiators is very large, and it is very sensitive to price and performance. The price is not low enough, and the performance is excellent, and it is difficult to introduce it to the market in large quantities. With the increasing demand for heat dissipation performance, cheap aluminum heat sinks have been unable to meet the requirements of the latest CPUs and graphics cards. Although the thermal conductivity of pure copper materials is higher than aluminum, there are restrictions on price, weight, process and application. Therefore, various types of replacement methods have appeared one after another, and each has advantages and disadvantages. Generally, the manufacturing process of the radiator has the following methods: (1) Extrusion (2) Die Casting (3) Forging (4) Mechanical (Machining) (5) Bonding ) (6) Folding (7) I Insert molding (8) Skiving (9) Metal Injection Molding. Many of the above-mentioned more productive and economical processes, such as extrusion, pressing, and forging, cannot be applied to rabbits. As mentioned above, pure aluminum heat sinks have insufficient performance, while pure copper heat sinks have various limitations, weights, processes and applications. Therefore, aluminum-copper composite radiators meet the current high heat dissipation requirements, and are actively developed by many manufacturers.

第5頁 1242633 五、發明說明(2) 而構成鋁銅複合散熱器之鋁銅複合板有下列接合方 式: 軟焊接合:鋁板先鍍鎳或銅,再填料焊接,介面有 填料層及助焊劑,熱傳導不佳。 爆炸接合:成本高、爆炸噪音環保問題、良率低。 壓鑄接合:有介面間隙及氧化物生成問題,熱阻抗 高。 機械接合:純粹以機械力量(加重壓或利用熱漲冷縮 方式)將銅置入鋁中的緊密接合方式,熱傳導不佳。 擠型接合:更換模具及更換鑄錠材料之操作不易。 熱壓接合:無需介面填料,但須在控制氣候爐體 中,藉由高真空、高熱、高壓下,迫使鋁板銅板產生冶 金接合,成本高。 軋延接合:產能大,成本低,但僅能生產簡易造型 的平板,須再施以刨削(s k i v i n g )或切削(m a c h i n i n g )加 工,才能成為散熱器成品。 由於市場需求量大,許多非量產性製程與價格過高 者,難以被廠商採用。目前以軟焊接合與機械接合製程 所做之鋁銅複合散熱器較常見。軟焊接合有著鉛錫等介 面填料,此類介面填料熱傳導值相對偏低,又經常有空 焊(Void welding)現象導致熱傳導效能不佳,且不良率 極難控制。機械接合製程則僅是鋁與銅相互貼合,無接 合強度,其間存有許多間隙,熱傳導值也相對偏低。 而傳統面與面堆疊的軋延製程,在將銘銅兩板軋延Page 5 1242633 V. Description of the invention (2) The aluminum-copper composite plate constituting the aluminum-copper composite heat sink has the following joining methods: Soft soldering: The aluminum plate is first plated with nickel or copper, and then filled with solder. The interface has a filler layer and a flux. , Poor heat conduction. Explosion bonding: high cost, environmental noise explosion problem, low yield. Die-cast bonding: interface gap and oxide generation problems, high thermal resistance. Mechanical bonding: A tight bonding method in which copper is placed in aluminum purely by mechanical force (weighting or using thermal expansion and contraction), and the heat conduction is poor. Extrusion jointing: The operation of changing molds and ingot materials is not easy. Thermocompression bonding: No interface filler is required, but in a climate-controlled furnace body, high-vacuum, high-heat, and high-pressure are required to force the aluminum plate and copper plate to produce metallurgical bonding, which is costly. Rolling and bonding: Large production capacity and low cost, but can only produce flat plates with simple shapes, and must be subjected to planing (ski v i n g) or cutting (m a c h i n i n g) processing in order to become a finished radiator. Due to the large market demand, many non-mass production processes and prices are too high for manufacturers to adopt. At present, aluminum-copper composite heat sinks made by soldering and mechanical bonding processes are more common. Soft solder joints have interface fillers such as lead and tin. The thermal conductivity of such interface fillers is relatively low. Void welding often results in poor thermal conduction performance, and the defect rate is extremely difficult to control. In the mechanical bonding process, only aluminum and copper are bonded to each other, there is no bonding strength, there are many gaps between them, and the heat conduction value is relatively low. The traditional rolling process of surface-to-surface stacking is rolling the two copper plates.

1242633 五、發明說明(3) 後,往往會因接合強度不足,無法承受熱處理的熱膨脹 應力與加工產生的機械應力,而發生銅板與鋁板分離脫 落的問題,因此也發展出一些改良的軋延製程。 例如,在美國專利6 2 6 7 8 3 0揭示了一種五層鍋的製 程’五層為不錄鋼板-薄铭板-銅板-薄銘板-不錄鋼板。 其做法疋先做薄銘板_銅板札延接合並熱處理,再將不錄 鋼板與鋁銅板再軋延接合並熱處理,最後再引伸成形為 鍋子。其重點是應用0 . 0 0 9 i η薄鋁板做為銅與不銹鋼板 、的中間層,藉由熱處理使鋁的兩面分別產鋁-銅與鋁-不 銹鋼合金層,克服銅-不銹鋼合金層極難由熱處理產生的 問題。由於其作法是以超薄鋁板當接合介面與並引伸成 形為鍋子形狀克服機械應力,而有關鋁平板如何不藉引 伸成形克服熱膨脹與機械應力的部份的問題並未解決。 另如,在美國專利6 4 2 7 9 0 4揭示一種以Ρ V D方式作為 氧化保護再施行異種金屬間的高溫熱壓接合與軋延接合 的製程。此法採4 0 0 °C高溫作業,以PVD作為高溫氧化保 護方式,藉以省去高溫熱壓接合中所需的真空條件;此 法仍須熱處理作業以產生鋁銅合金層,無法省掉。其高 溫作業壞境的防氧化保護製程5與一般室溫的礼延接合 方式相比,製程成本相對提高。 【發明内容】 本發明主要是為了克服傳統的軋延製程中,在將鋁 銅板軋延後,會因接合強度不足,無法承受熱處理的熱 膨脹應力與加工產生的機械應力,發生銅板與鋁板分離1242633 V. Description of the invention After (3), due to insufficient joint strength, the thermal expansion stress of heat treatment and mechanical stress caused by processing will not be able to bear, and the problem of separation and fall-off of copper and aluminum plates will occur. Therefore, some improved rolling processes have also been developed. . For example, in U.S. Patent No. 6,266,830, a process of a five-layer cooker is disclosed. The five layers are non-recorded steel plates-thin nameplates-copper plates-thin nameplates-non-recorded steel plates. The method is as follows: first make a thin nameplate_copper plate, and join and heat-treat, and then non-recorded steel plate and aluminum-copper plate, and then roll-join and heat-treat, and then extend to form a pot. The main point is to use 0.09 i η thin aluminum plate as the middle layer of copper and stainless steel plates. Through heat treatment, the two sides of aluminum can produce aluminum-copper and aluminum-stainless steel alloy layers respectively to overcome the copper-stainless steel alloy layer electrode. Problems that are difficult to be caused by heat treatment. Because its method is to use an ultra-thin aluminum plate as the joint interface and extend it into a pot shape to overcome mechanical stress, and the problem of how to avoid the thermal expansion and mechanical stress of the aluminum flat plate by extension forming is not solved. In another example, U.S. Patent No. 6 427 9 0 4 discloses a process in which the PVD method is used as oxidation protection and then high-temperature hot-press bonding and rolling bonding between dissimilar metals are performed. This method uses high-temperature operation at 400 ° C, and uses PVD as a high-temperature oxidation protection method to eliminate the vacuum conditions required for high-temperature hot-press bonding. This method still requires heat treatment to generate an aluminum-copper alloy layer, which cannot be omitted. Compared with the ordinary room-temperature ritual joining method, the process 5 for oxidation protection of high-temperature operating environments is relatively expensive. [Summary of the invention] The present invention is mainly to overcome the traditional rolling process, after rolling aluminum-copper sheet, due to insufficient joint strength, it cannot withstand the thermal expansion stress of heat treatment and mechanical stress generated during processing, and the copper sheet is separated from the aluminum sheet.

1242633 五、發明說明(4) 脫落的問題,因此提供了一種鋁銅複合散熱器的製造方 法,將經過間隙搭配設計後的銅板置入U型鋁板的開口 中,然後藉由軋延製程的局部巨大壓力,讓鋁銅兩板擠 壓後產生倒包斜角,而使銘板與銅板產生緊密地接合, 如此,再將其經熱處理後,以產生穩定及全面之冶金接 合的鋁銅複合板,最後則對此鋁銅複合板進行加工處 理,藉此獲得散熱性能優良的鋁銅複合散熱器。 因此,鑑於習知技術的問題,本發明提供一種I呂銅 複合散熱器之製造方法,其步驟包含:首先,提供銅板 與具有一開口之鋁板,且開口略寬於銅板;再將銅板置 於開口中,使銅板兩側與鋁板間各形成一間隙;然後, 軋延銅板與鋁板,使銅板兩侧與鋁板間各形成一倒包斜 角;繼而,進行熱處理作業,使銅板與鋁板間產生合金 層,製得铭銅複合板;最後,對此紹銅複合板進行加 工,以完成铭銅複合散熱器。 有關本發明之詳細内容及技術,茲就配合圖式說明 如下: 【實施方式】 請參照第1圖,本發明所提供之鋁銅複合散熱器之製 造方法,其主要流程包括:首先,提供銅板與具有開口 之鋁板(步驟1 0 0 ):然後,將銅板置入開口中(步驟 1 1 0 ),並使銅板兩侧與鋁板間形成一定間隙;接著,軋 延銅板與鋁板(步驟1 2 0 ),則銅板兩侧與鋁板間會各形成 具有一倒包斜角;再進行熱處理作業(步驟1 3 0 ),於銅板1242633 V. Description of the invention (4) The problem of falling off, so a manufacturing method of aluminum-copper composite heat sink is provided. The copper plate after the gap matching design is placed in the opening of the U-shaped aluminum plate, and then a part of the rolling process is rolled. The huge pressure causes the aluminum and copper two plates to produce an overwrapped bevel after extrusion, so that the nameplate and the copper plate are tightly joined. In this way, after heat treatment, it produces a stable and comprehensive metallurgical bonded aluminum-copper composite plate. Finally, the aluminum-copper composite plate is processed to obtain an aluminum-copper composite heat sink with excellent heat dissipation performance. Therefore, in view of the problems of the conventional technology, the present invention provides a method for manufacturing a copper composite heat sink. The steps include: first, providing a copper plate and an aluminum plate with an opening, and the opening is slightly wider than the copper plate; In the opening, a gap is formed between the two sides of the copper plate and the aluminum plate; then, the rolled copper plate and the aluminum plate are formed so that each of the two sides of the copper plate and the aluminum plate forms an oblique angle; and then, a heat treatment operation is performed to generate a gap between the copper plate and the aluminum plate. The alloy layer is used to produce Ming copper composite plate. Finally, this Shao copper composite plate is processed to complete the Ming copper composite heat sink. The detailed content and technology of the present invention are described below with reference to the drawings: [Embodiment] Please refer to FIG. 1. The manufacturing method of the aluminum-copper composite heat sink provided by the present invention includes the following steps: First, provide a copper plate And an aluminum plate with an opening (step 1 0 0): then, place the copper plate into the opening (step 1 1 0) and form a certain gap between the two sides of the copper plate and the aluminum plate; then, roll the copper plate and the aluminum plate (step 1 2) 0), the two sides of the copper plate and the aluminum plate will be formed with an overturned bevel angle; and then a heat treatment operation (step 130) is performed on the copper plate

1242633 五、發明說明(5) 與鋁板間產生一合金層,即製得一鋁銅複合板;最後, 將此銘銅複合板加工,即完成一銘銅複合散熱器(步驟 140 ) ° 以下將針對本發明之鋁銅複合散熱器之製造方法作 詳細說明。 請參照第2圖,我們首先將尺寸經過搭配設計後的銅 板1 0,置放於U型鋁板2 0的開口 3 0中(步驟1 0 0、步驟 110),此開口可經由擠型或加工產生,而且在銅板1 0與 鋁板2 0間並不需置入任何的介面填料或助焊劑。U型鋁 板2 0的開口 3 0大小與置入的銅板1 0大小,兩者間間隙B經 試驗後,建議數值如表1所示。 表1 銅板厚A (mm) 間隙B (mm) 1~5 0.080〜0.125 〜7 0_080〜0.135 〜9 0.080〜0.150 >9 0.100-0.200 此夕卜,如第3 A圖與第3 B圖所示,銅板1 0或鋁板2 0也 可設計成具有鋸齒狀的表面,除了能降低軋延所須馬 力,也能增加銘板2 0與銅板1 0的接觸面積,增加散熱效 能。 接著,將兩板一併送入軋延機,經縮減率約3 5〜8 0 %1242633 V. Description of the invention (5) An alloy layer is produced between the aluminum plate and the aluminum-copper composite plate; finally, the copper-copper composite plate is processed to complete a copper-copper composite radiator (step 140). The manufacturing method of the aluminum-copper composite heat sink of the present invention is described in detail. Please refer to the second figure. We first place the copper plate 10 with the matched design in the opening 30 of the U-shaped aluminum plate 20 (step 100, step 110). This opening can be extruded or processed. Generated, and there is no need to put any interface filler or flux between the copper plate 10 and the aluminum plate 20. The size of the opening 30 of the U-shaped aluminum plate 20 and the size of the inserted copper plate 10 are shown in Table 1 after the gap B between the two is tested. Table 1 Copper plate thickness A (mm) Clearance B (mm) 1 ~ 5 0.080 ~ 0.125 ~ 7 0_080 ~ 0.135 ~ 9 0.080 ~ 0.150 > 9 0.100-0.200 As shown in Figure 3A and Figure 3B As shown, the copper plate 10 or aluminum plate 20 can also be designed to have a jagged surface. In addition to reducing the horsepower required for rolling, it can also increase the contact area between the nameplate 20 and the copper plate 10 and increase heat dissipation efficiency. Next, the two plates are sent to the rolling mill together, and the reduction rate is about 35 to 80%.

第9頁 1242633 五、發明說明(6) 的軋延後(步驟1 2 0 隙,加上板的外側 生倒包斜角,使其 然後,我們進 退火處理(步驟1 3 0 料或助焊劑,為增 高熱傳導值,所以 生鋁銅合金層。參 散退火溫度不能超 5 4 0 °C之間。 由於銘的熱膨 K_1,由於差異極大 之間產生倒包斜角 僅單靠軋延的結合 力,而使鋁板與銅 金層。 最後,此is銅 散熱器或其他產品 在此,對於前 們藉由一不預留間 明。 此例中,是先 m m ),置放於銘板( 開口中,兩者間不 ),由鋁板和銅板之間事先預留的間 較早受力變形,軋延使兩板擠壓而產 接合更緊密。 而對軋延過後的銘板和銅板施行擴散 )。由於兩板中間不置入任何的介面填 加其接合強度、防止鋁銅板分離與提 必須施行適當擴散退火處理,使其產 照鋁-銅相圖,其共晶溫度5 4 8 °C ,擴 過此溫度,建議所採用的溫度在4 6 0〜 脹係數為2 1.8*1 0_6 K-1,銅為16. 6*10-6 ,若無於先前軋延製程中,已使兩板 ,當板厚度大於0 . 5 m m左右時,即無法 強度,克服熱處理作業中的熱膨脹應 板於熱處理中分離,無法產生鋁銅合 複合板可用刨削或機械加工方式製成 (步驟1 4 0 )。 述為何於鋁板和銅板間預留間隙,我 隙的鋁銅複合板之失敗例子來協助說 將表面經過清洗銅板(3 0 0 * 5 9 . 8 * 5 3 0 0 *100*1 6mm,開 口300*59. 8*5mm)的 預留間隙,將兩板一併送入軋延機,Page 9 1242633 Fifth, rolling description of the invention (6) (step 1 2 0 gap, plus the outside of the board to produce an overwrapped bevel angle, so that we then annealing (step 1 3 0 material or flux) In order to increase the heat conduction value, the aluminum-copper alloy layer is produced. The parasitic annealing temperature cannot exceed 5 4 0 ° C. Due to the thermal expansion of K_1, the overturning bevel angle is only caused by the difference. Combine the force to make the aluminum plate and copper-gold layer. Finally, this is a copper heat sink or other products. For the former, there is no need to reserve the time. In this example, it is first mm), placed on the nameplate ( In the opening, there is no space between them), the space reserved in advance between the aluminum plate and the copper plate is deformed earlier, and the rolling makes the two plates squeezed to produce a tighter joint. The diffused nameplate and copper plate are diffused. ). Since no interface is placed in the middle of the two plates to add their joint strength to prevent the separation and lifting of the aluminum-copper plate, proper diffusion annealing must be performed to produce an aluminum-copper phase diagram. Its eutectic temperature is 5 4 8 ° C. After this temperature, it is recommended to use a temperature of 4 6 0 ~ expansion coefficient of 2 1.8 * 1 0_6 K-1, copper is 16. 6 * 10-6, if not in the previous rolling process, two plates have been used, When the thickness of the plate is greater than about 0.5 mm, the strength cannot be achieved. The thermal expansion of the heat treatment operation should be used to separate the plate from the heat treatment. The aluminum-copper composite plate cannot be produced by planing or machining (step 1 40). . The reason why a gap is reserved between the aluminum plate and the copper plate, and the example of the failure of the aluminum-copper composite plate of the gap to assist in cleaning the surface of the copper plate (30 0 * 5 9. 8 * 5 3 0 0 * 100 * 1 6mm, opening 300 * 59. 8 * 5mm), send the two plates into the rolling mill together,

第10頁 1242633 五、發明說明(7) 設定縮減率約5 0 %的乳延’即成品為8 in πι。再將此板置入 加熱爐,以510°G,10分鐘施e擴散退火處理。由於兩板 之間沒有產生倒包斜角,兩板於熱處理中分離,如第4圖 所示。這案例表示,鋁銅複合板軋延不預留間隙與傳統 面對面銘銅複合板的軋延一樣,都會因接合強度不足, 而無法進行擴散退火處理生成合金層的問題。 以下則根據本發明之鋁銅複合散熱器之製造方法, 提供數個具體實施例並加以詳細說明: 第一實施例 先,將表面經 鋁板(3 0 0 * 1 0 0 兩板一併送入 口厚度為8 mm 剛軋延後之板 後’再將此板 火處理,即可 顯示其擴散退 其接合狀況, 接製程的超音 陷少了許多。 以刨肖d ( s k i v 我們將其與刨 器,做散熱性 銘銅散熱器比 首 置放於 中,將 即設出 施例之 40。然 擴散退 所示, 波檢驗 一般焊 接合缺 複合板 這裡, 銅散熱 果得知 過清洗的銅板(3 0 0 * 5 9 . 8 0 * 5 m m ), *16mm ,開口 300*60· 05*5mm)的開口 軋延機,設定縮減率約5 0 %的軋延, ,如第5A圖與第5B圖所示,即為本實 ,軋延使兩板擠壓而產生倒包斜角 置入加熱爐,以5 1 0 °C、1 0分鐘施行 產生1 5 // m的鋁銅合金層,如第6圖 火後鋁銅合金金相。我們再以超音 如第7圖所示,比照如第8圖所示之 波檢驗之接合狀況,證明本發明的 最後,如第9圖所示,即再將此銘銅 i n g )加工成铭銅複合散熱器成品。 削加工成同尺寸的純銘、铭銅、純 能測試比較,如表2所示。由比較結 純鋁散熱器效能提升7 %。Page 10 1242633 V. Description of the invention (7) Milk extension with a reduction rate of about 50%, that is, the finished product is 8 in πm. This plate was placed in a heating furnace and subjected to e-diffusion annealing at 510 ° G for 10 minutes. Since there is no inclination between the two plates, the two plates are separated during heat treatment, as shown in Figure 4. This case shows that the rolling of aluminum-copper clad plates without leaving gaps is the same as the rolling of traditional face-to-face copper clad plates, because of the insufficient joint strength, the problem of the alloy layer cannot be formed by diffusion annealing. In the following, according to the manufacturing method of the aluminum-copper composite heat sink of the present invention, several specific embodiments are provided and described in detail. In the first embodiment, the surface is firstly sent to the inlet through an aluminum plate (3 0 0 * 1 0 0). The thickness is 8 mm. After the rolled sheet has been rolled, the sheet can be fired to show its spreading and joining status, and there is much less ultrasonic trapping in the bonding process. With skid d (skiv we will compare it with planing The copper radiator is placed in the middle of the heat sink than the first one, and the 40th example will be set. However, the diffusion test shows that the general inspection of the welded composite board is here. The copper heat sink has learned that the cleaned copper board (3 0 0 * 5 9. 8 0 * 5 mm), * 16mm, 300 * 60 · 05 * 5mm opening rolling mill, set the rolling reduction of about 50%, as shown in Figure 5A and As shown in Figure 5B, this is the actual situation. Rolling causes the two plates to be squeezed to produce an overturned bevel. The bevel is placed in a heating furnace, and it is executed at 5 1 0 ° C for 10 minutes to produce a 15 // m aluminum-copper alloy. Layer, as shown in Fig. 6 after the fire Aluminium-copper alloy metallurgy. We then use supersonic as shown in Fig. 7, and compare it with the wave shown in Fig. 8 The joining status proves that the present invention is finally, as shown in FIG. 9, that is, this Ming copper i n g) is processed into a Ming copper composite radiator. Cut and compare the pure size, bronze size and pure energy test of the same size, as shown in Table 2. By comparison, the performance of pure aluminum radiator is increased by 7%.

第11頁 1242633 五、發明說明(8) 表2 材料尺寸 (mm3) ,風扇 ί Χ:) 接點溫 (t) ΔΤ Power R〇C/W 純鋁 89^89^21 3600 36.9 64.77 27.87 69.15 0.403 鋁鋼 89'S9 '-21 3600 36.9 62.S2 25.92 69.03 0.375 純鋼 89*89*21 3600 36.9 61.03 24.13 69.67 0.346 第二實施例: 首先,將銅板加工成錯齒狀,表面經過清洗(3 0 0 * 59.80*8 mm),置放於鋁板(300*100*23mm,開口300* 6 0 . 1 * 8 m m )的開口中,將兩板一併送入軋延機,設定出口 厚度為1 1 . 5 mm。再將此板置入加熱爐,以5 2 0 °C,2 0分鐘 施行擴散退火處理。再將此鋁銅複合板以刨削 (s k i v i n g )加工成銘銅複合散熱器。 如第1 0圖所示,顯示本實施例之合金金相,說明軋 延結合不因鋸齒而無法接合。而第11圖為其橫截面,顯 示鋸齒尖端會因軋延的壓力而變形鈍化,對接合沒有不 良影響。請參考表3,由散熱性能測試比較,有齒形銘銅 散熱器比無齒形鋁銅散熱器效能提升了 4 %。 表3Page 11 1242633 V. Description of the invention (8) Table 2 Material size (mm3), fan ί Χ :) Contact temperature (t) ΔΤ Power R〇C / W pure aluminum 89 ^ 89 ^ 21 3600 36.9 64.77 27.87 69.15 0.403 Aluminum steel 89'S9 '-21 3600 36.9 62.S2 25.92 69.03 0.375 Pure steel 89 * 89 * 21 3600 36.9 61.03 24.13 69.67 0.346 Second embodiment: First, the copper plate is processed into the wrong tooth shape, and the surface is cleaned (3 0 0 * 59.80 * 8 mm), placed in an aluminum plate (300 * 100 * 23mm, opening 300 * 6 0. 1 * 8 mm), send the two plates together into the rolling mill, set the outlet thickness to 1 1.5 mm. This plate was placed in a heating furnace and subjected to diffusion annealing at 50 ° C for 20 minutes. This aluminum-copper composite plate is processed into a copper-copper composite radiator by planing (ski v in n g). As shown in Fig. 10, the metallographic phase of the alloy of this example is shown, which indicates that the rolling bond cannot be joined due to sawtooth. Figure 11 shows its cross section, which shows that the sawtooth tip will be deformed and passivated due to rolling pressure, which will not adversely affect the joint. Please refer to Table 3. According to the comparison of the heat dissipation performance test, the toothed copper heat sink has 4% higher efficiency than the toothless aluminum copper heat sink. table 3

第12頁 1242633 五、發明說明(9) 材料尺寸 (nun3) 風扇 環溫 (t) 接點溫 Ct) ΔΤ Power R°CAV 鋁銅#無齒 3600 36.3 63.84 27.5 85.7 0.343 形 89*89φ26 紹銅#齒形 89+89^26 3(500 35.4 64.79 29.4 85.3 0.329 鋁鋼#齒形 89*89^30 3600 36.1 63.99 27.9 84.7 0.321 此實施例可說明鋸齒狀表面會使散熱效能提升。 綜合上述,本發明所提供之鋁銅複合散熱器之製造方 法,乃藉由尺寸經過搭配設計後的U型鋁板與銅板,由 事先預留的間隙,經軋延擠壓後而產生倒包斜角,使其 接合更緊密,克服一般軋延接合後因熱膨脹應力與機械 應力而鋁銅板分離脫落的問題。由於軋延製程相較於焊 接製程,不僅可靠性高且成本低廉,非常適合大量製 造,能應用於3 C市場。 其次,本發明所提供之製造方法中,軋延的鋁板與 銅板中並未置入任何的介面填料或助焊劑,因為一般鉛 錫介面填料熱傳導值相對偏低,遂改以對此鋁銅複合板 施行擴散退火處理,使其產生鋁銅合金層,以替代焊接 製程的介面填料層,不但能強化板間接合強度,更能降 低介面熱傳阻抗。Page 121242633 V. Description of the invention (9) Material size (nun3) Fan ring temperature (t) Contact temperature Ct) ΔΤ Power R ° CAV Aluminum copper #No tooth 3600 36.3 63.84 27.5 85.7 0.343 Shape 89 * 89φ26 绍 铜 # Tooth shape 89 + 89 ^ 26 3 (500 35.4 64.79 29.4 85.3 0.329 Aluminum steel #tooth shape 89 * 89 ^ 30 3600 36.1 63.99 27.9 84.7 0.321 This embodiment can show that the jagged surface will improve the heat dissipation efficiency. In summary, the present invention The manufacturing method of the provided aluminum-copper composite heat sink is to use a U-shaped aluminum plate and a copper plate that have been designed to match the size, and then roll out and extrude from the gap that is reserved in advance to produce an overwrapped bevel to make them join Tighter, to overcome the problem of separation and fall-off of aluminum-copper plates due to thermal expansion stress and mechanical stress after general rolling joint. Because the rolling process is more reliable and low cost than the welding process, it is very suitable for mass production and can be applied to 3 Market C. Second, in the manufacturing method provided by the present invention, no interface filler or flux is placed in the rolled aluminum plate and copper plate, because the general thermal conductivity of the lead-tin interface filler is relatively low. In this modified aluminum copper clad sheet underwent diffusion annealing, to produce an aluminum-copper alloy layer to replace soldering process interface filler layer, not only the bonding strength reinforcing plate indirectly, to better reduce the impedance of heat transfer interface.

第13頁 1242633Page 13 1242633

第14頁 1242633 圖式簡單說明 第1圖為本發明之鋁銅複合散熱器之製造方法之流程圖; 第2圖為本發明之尺寸經過搭配設計之鋁板與銅板之示意 圖; 第3A圖與第3B圖分別為本發明之具有鋸齒狀表面的銅板 與鋁板之示意圖; 第4圖為未採用預留間隙而失敗的鋁銅複合板; 第5 A圖與第5 B圖分別為本發明之第一實施例之軋延後之 銘銅複合板及其橫截面; 第6圖為本發明之第一實施例之鋁銅複合板之金相照片; 第7圖為本發明之第一實施例之鋁銅複合板經超音波檢驗 之接合情形; 第8圖為一般焊接製程的銘銅複合板之超音波檢驗之接合 狀況; 第9圖為本發明之第一實施例之鋁銅複合散熱器; 第1 0圖為本發明之第二實施例之鋁銅複合板之金相照 片:及 第1 1圖為本發明之第二實施例之鋁銅複合板之橫截面。1214633 on page 14 Brief description of the diagram. Figure 1 is a flow chart of the manufacturing method of the aluminum-copper composite heat sink of the present invention. Figure 2 is a schematic diagram of the aluminum plate and copper plate of the present invention that have been designed with matching dimensions. Figure 3A and the Figure 3B is a schematic diagram of a copper plate and an aluminum plate with a jagged surface according to the present invention; Figure 4 is an aluminum-copper composite board that fails without the use of a reserved gap; Figures 5 A and 5 B are respectively the first of the present invention The rolled copper composite plate and its cross section according to an embodiment; FIG. 6 is a metallographic photograph of the aluminum-copper composite plate of the first embodiment of the present invention; and FIG. 7 is a view of the first embodiment of the present invention. Ultrasonic inspection of the aluminum-copper composite board; Figure 8 shows the ultrasonic inspection of the copper-clad composite board in the general welding process; Figure 9 shows the aluminum-copper composite heat sink of the first embodiment of the present invention; FIG. 10 is a metallographic photograph of an aluminum-copper composite plate according to the second embodiment of the present invention: and FIG. 11 is a cross-section of the aluminum-copper composite plate according to the second embodiment of the present invention.

【圖 式符 號說 明】 10 銅 板 20 鋁 板 30 開 口 40 倒 包斜 角 A 銅板厚 第15頁 1242633[Illustration of Symbols] 10 Copper plate 20 Aluminum plate 30 Opening 40 Inverted package bevel A Copper plate thickness Page 15 1242633

第16頁Page 16

Claims (1)

1242633 六、申請專利範圍 1 . 一種鋁銅複合散熱器之製造方法,其包含下列步驟: 提供一銅板與一鋁板,且該鋁板具有一開口 ,該 開口略寬於該銅板; 將該銅板置於該開口中,使該銅板兩侧與該鋁板 間各形成一間隙; 軋延該銅板與該鋁板,使該銅板兩側與該鋁板間 各形成一倒包斜角; 進行熱處理作業,使該銅板與該鋁板間產生一合 金層,以製得一鋁銅複合板;及 對該鋁銅複合板進行加工,以完成一鋁銅複合散 熱器。 2 .如申請專利範圍第1項所述之鋁銅複合散熱器之製造方 法,其中該開口係呈U型。 3 .如申請專利範圍第1項所述之鋁銅複合散熱器之製造方 法,其中該開口係經由擠型或加工產生。 4 .如申請專利範圍第1項所述之鋁銅複合散熱器之製造方 法,其中該銅板具有一鋸齒狀表面。 5 .如申請專利範圍第4項所述之鋁銅複合散熱器之製造方 法,其中該鋸齒狀表面係面向該鋁板。 6 ·如申請專利範圍第1項所述之鋁銅複合散熱器之製造方 法,其中該|呂板具有一鋸齒狀表面。 7 .如申請專利範圍第6項所述之鋁銅複合散熱器之製造方 法,其中該鋸齒狀表面係面向該銅板。 8 .如申請專利範圍第1項所述之鋁銅複合散熱器之製造方1242633 6. Scope of patent application 1. A method for manufacturing an aluminum-copper composite heat sink, comprising the following steps: providing a copper plate and an aluminum plate, and the aluminum plate having an opening slightly wider than the copper plate; placing the copper plate in In the opening, a gap is formed between each side of the copper plate and the aluminum plate; the copper plate and the aluminum plate are rolled, and an overclad bevel is formed between each side of the copper plate and the aluminum plate; heat treatment is performed to make the copper plate An alloy layer is generated with the aluminum plate to produce an aluminum-copper composite plate; and the aluminum-copper composite plate is processed to complete an aluminum-copper composite heat sink. 2. The method of manufacturing an aluminum-copper composite heat sink as described in item 1 of the scope of patent application, wherein the opening is U-shaped. 3. The method for manufacturing an aluminum-copper composite heat sink as described in item 1 of the scope of patent application, wherein the opening is produced through extrusion or processing. 4. The method of manufacturing an aluminum-copper composite heat sink as described in item 1 of the scope of the patent application, wherein the copper plate has a jagged surface. 5. The method for manufacturing an aluminum-copper composite heat sink as described in item 4 of the scope of patent application, wherein the jagged surface faces the aluminum plate. 6 · The method for manufacturing an aluminum-copper composite heat sink as described in item 1 of the scope of patent application, wherein the plate has a sawtooth-like surface. 7. The method for manufacturing an aluminum-copper composite heat sink as described in item 6 of the scope of patent application, wherein the jagged surface faces the copper plate. 8. The manufacturer of the aluminum-copper composite heat sink as described in item 1 of the scope of patent application 第17頁 1242633 六、申請專利範圍 法,其中該銅板厚度為1〜5 m ηι時,該間隙為0 . 0 8 0〜 0. 12 5mm 〇 9.如申請專利範圍第1項所述之鋁銅複合散熱器之製造方 法’其中該銅板厚度為5〜7 πι η時’該間隙為0 . 0 8 0〜 0· 1 3 5 m m 〇 1 0 .如申請專利範圍第1項所述之鋁銅複合散熱器之製造 方法’其中該銅板厚度為7〜9 m m時’該間隙為0 . 0 8 0〜 0. 15 0mm 〇 1 1 .如申請專利範圍第1項所述之鋁銅複合散熱器之製造 方法,其中該銅板厚度為9 m m以上時,該間隙為0 . 1 0 0〜 0. 200mm 〇 1 2 .如申請專利範圍第1項所述之鋁銅複合散熱器之製造 方法,其中該軋延該銅板與該鋁板之步驟中,該鋁板 與該銅板係經過縮減率3 5〜8 0 %的軋延。 1 3 .如申請專利範圍第1項所述之鋁銅複合散熱器之製造 方法,其中該熱處理作業係為擴散退火處理。 1 4.如申請專利範圍第1項所述之鋁銅複合散熱器之製造 方法,其中該熱處理作業中,其操作溫度在4 6 0〜5 4 0 °C 之間。 1 5 .如申請專利範圍第1項所述之鋁銅複合散熱器之製造 方法,其中該加工步驟係為包彳削加工。 1 6 .如申請專利範圍第1項所述之鋁銅複合散熱器之製造 方法,其中該加工步驟係為機械加工。Page 17 1242633 VI. Method of applying for a patent, wherein when the thickness of the copper plate is 1 to 5 m η, the gap is 0. 0 0 0 to 0. 12 5mm 〇9. Aluminum as described in item 1 of the scope of patent application Method for manufacturing a copper composite heat sink 'where the thickness of the copper plate is 5 to 7 π η' and the gap is 0. 0 8 0 to 0 · 1 3 5 mm 〇 1 0. The aluminum as described in item 1 of the scope of patent application Method for manufacturing a copper composite heat sink 'where the thickness of the copper plate is 7 to 9 mm' and the gap is 0. 0 8 0 to 0. 15 0 mm 〇1 1. The aluminum-copper composite heat sink as described in item 1 of the scope of patent application The manufacturing method of the device, wherein when the thickness of the copper plate is 9 mm or more, the gap is 0.10 to 0.200mm 〇1 2. The manufacturing method of the aluminum-copper composite heat sink described in item 1 of the scope of patent application, In the step of rolling the copper plate and the aluminum plate, the aluminum plate and the copper plate are rolled by a reduction rate of 35 to 80%. 1 3. The method for manufacturing an aluminum-copper composite heat sink as described in item 1 of the scope of patent application, wherein the heat treatment operation is a diffusion annealing process. 1 4. The manufacturing method of the aluminum-copper composite heat sink as described in item 1 of the scope of the patent application, wherein in the heat treatment operation, the operating temperature is between 460 to 540 ° C. 15. The method for manufacturing an aluminum-copper composite heat sink as described in item 1 of the scope of patent application, wherein the processing step is a baling process. 16. The method for manufacturing an aluminum-copper composite heat sink as described in item 1 of the scope of patent application, wherein the processing step is mechanical processing. 第18頁Page 18
TW93117188A 2004-06-15 2004-06-15 Method for manufacturing aluminum copper cladding radiator TWI242633B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW93117188A TWI242633B (en) 2004-06-15 2004-06-15 Method for manufacturing aluminum copper cladding radiator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW93117188A TWI242633B (en) 2004-06-15 2004-06-15 Method for manufacturing aluminum copper cladding radiator

Publications (2)

Publication Number Publication Date
TWI242633B true TWI242633B (en) 2005-11-01
TW200540389A TW200540389A (en) 2005-12-16

Family

ID=37022549

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93117188A TWI242633B (en) 2004-06-15 2004-06-15 Method for manufacturing aluminum copper cladding radiator

Country Status (1)

Country Link
TW (1) TWI242633B (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105563034A (en) * 2015-03-26 2016-05-11 中国科学院金属研究所 Packaging method for metal construction forming process
TWI615560B (en) * 2016-04-21 2018-02-21 Order structure
CN113385902A (en) * 2021-07-16 2021-09-14 湖南方恒新材料技术股份有限公司 Heat dissipation plate and preparation method thereof
CN115515403A (en) * 2022-11-08 2022-12-23 哈尔滨工业大学 Integrated forming device and method for aluminum-copper composite liquid cooling channel structure

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI551383B (en) * 2014-07-25 2016-10-01 泓萾科技有限公司 A metal composite plate and a method for manufacturing the same
TWI604173B (en) * 2016-11-09 2017-11-01 財團法人金屬工業研究發展中心 Heat sink device applied to loop heat pipe and manufacturing method of its shell

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105563034A (en) * 2015-03-26 2016-05-11 中国科学院金属研究所 Packaging method for metal construction forming process
TWI615560B (en) * 2016-04-21 2018-02-21 Order structure
CN113385902A (en) * 2021-07-16 2021-09-14 湖南方恒新材料技术股份有限公司 Heat dissipation plate and preparation method thereof
CN115515403A (en) * 2022-11-08 2022-12-23 哈尔滨工业大学 Integrated forming device and method for aluminum-copper composite liquid cooling channel structure
CN115515403B (en) * 2022-11-08 2024-01-12 哈尔滨工业大学 Integrated forming method for aluminum-copper composite liquid cooling channel structure

Also Published As

Publication number Publication date
TW200540389A (en) 2005-12-16

Similar Documents

Publication Publication Date Title
JP5918008B2 (en) Manufacturing method of cooler
JP6003108B2 (en) Joining method and joining part manufacturing method
JP5527635B2 (en) Aluminum metal joining method
WO2013129281A1 (en) Method for joining metal materials
JPH0249267B2 (en)
JP3850787B2 (en) Electronic component package, its lid, lid for the lid, and method for manufacturing the lid
JP2003170280A (en) Method for connecting different kinds of metallic materials
JP4350753B2 (en) Heat sink member and manufacturing method thereof
KR100899919B1 (en) Package for Electronic Parts, Lid Thereof, Material for the Lid and Method for Producing the Lid Material
JP5989465B2 (en) Insulating substrate manufacturing method
JP6016095B2 (en) Joining method and joining parts
TWI242633B (en) Method for manufacturing aluminum copper cladding radiator
US20050252951A1 (en) Method for assembling and brazing CPU heat sink modules
JP6819299B2 (en) Joined body, substrate for power module, manufacturing method of joined body and manufacturing method of substrate for power module
TWI341759B (en) Cladding material and method for producing the same
JP4986843B2 (en) Electronic component package, its lid, lid for the lid, and method for manufacturing the lid
JP2016041434A (en) Method for manufacturing joined body, method for manufacturing substrate for power modules, and method for manufacturing substrate for power module with heat sink
CN108581253A (en) A kind of packaging method of the graphene-based heat sink of sandwich type
JP2004066324A (en) Brazing method between aluminum-based metal and different metal
JP5733466B2 (en) Manufacturing method of semiconductor device
JP2002248597A (en) High thermal conductive composite material and metallic mold
JP2001050682A (en) Panel-type heat exchanger, and manufacture thereof
JP2004188482A (en) Brazing method for composite brazing material having a plurality of kinds of metallic layers and brazed product
JP2013038188A (en) Lid for package sealing
JP6682403B2 (en) Insulating substrate manufacturing method and insulating substrate

Legal Events

Date Code Title Description
MK4A Expiration of patent term of an invention patent