US20050077616A1 - High power light emitting diode device - Google Patents

High power light emitting diode device Download PDF

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Publication number
US20050077616A1
US20050077616A1 US10/683,489 US68348903A US2005077616A1 US 20050077616 A1 US20050077616 A1 US 20050077616A1 US 68348903 A US68348903 A US 68348903A US 2005077616 A1 US2005077616 A1 US 2005077616A1
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United States
Prior art keywords
heat
circuit element
die
trace
conducting body
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US10/683,489
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English (en)
Inventor
Kee Ng
Cheng Tan
Ji Tham
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Avago Technologies International Sales Pte Ltd
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Agilent Technologies Inc
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Priority to US10/683,489 priority Critical patent/US20050077616A1/en
Assigned to AGILENT TECHNOLOGIES, INC. reassignment AGILENT TECHNOLOGIES, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: TAN, CHENG WHY, NG, KEE YEAN, THAM, JI KIN
Priority to GB0419641A priority patent/GB2406969B/en
Priority to DE102004044149A priority patent/DE102004044149B4/de
Priority to JP2004291171A priority patent/JP2005117041A/ja
Publication of US20050077616A1 publication Critical patent/US20050077616A1/en
Priority to US11/358,477 priority patent/US7612386B2/en
Assigned to AVAGO TECHNOLOGIES GENERAL IP PTE. LTD. reassignment AVAGO TECHNOLOGIES GENERAL IP PTE. LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: AGILENT TECHNOLOGIES, INC.
Assigned to AVAGO TECHNOLOGIES ECBU IP (SINGAPORE) PTE. LTD. reassignment AVAGO TECHNOLOGIES ECBU IP (SINGAPORE) PTE. LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Assigned to AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD. reassignment AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD. CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE NAME PREVIOUSLY RECORDED AT REEL: 017206 FRAME: 0666. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Assignors: AGILENT TECHNOLOGIES, INC.
Abandoned legal-status Critical Current

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    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
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Definitions

  • the present invention relates to packaged integrated circuits, and more particularly, to high-power LEDs.
  • LEDs Light emitting diodes
  • LEDs are fabricated from compound semiconductor materials, which have the characteristic of emitting light when biased with a forward current. LEDs are widely used as indicators or displays in various types of appliances. Historically, LEDs emitted a relatively low level of light compared to other light sources and were suitable for indoor applications only.
  • LEDs which emit very high levels of light.
  • these new LED materials are Aluminum Indium Gallium Phosphide (AlInGaP) and Indium Gallium Nitride (InGaN). These high brightness LEDs have given rise to new LED devices suitable for applications in areas such as outdoor video displays, automotive signals, traffic signals and illumination.
  • the high output achieved with these devices is the result of efficient semiconductor materials and of driving the LEDs at very high forward currents.
  • Drive currents in the hundreds or thousands of milliamperes (mA) are often utilized.
  • mA milliamperes
  • Unfortunately, such high drive currents produce excessive heat.
  • the packaging of the devices starts to break down due to prolonged exposure to the elevated temperatures. Such packaging failures limit useful life of the device.
  • a number of device packages have been proposed; however, none of these provide sufficient heat dissipation for the current generation of high-power LEDs.
  • the present invention includes a circuit element having a heat-conducting body having top and bottom surfaces, and a die having an electronic circuit thereon.
  • the die includes first and second contact points for powering the electronic circuit.
  • the die is in thermal contact with the heat-conducting body, the die having a bottom surface that is smaller than the top surface of the heat-conducting body.
  • a first trace constructed from an electrically conducting material bonded to the top surface of the heat-conducting body and electrically insulated therefrom is connected to the first contact point by an electrically conducting path that is preferably a wire bond.
  • An encapsulating cap covers the die and the first electrically conducting path.
  • the first trace has a first portion that extends outside of the encapsulating cap and a second portion that is covered by the encapsulating cap.
  • the heat-conducting body is preferably constructed from copper or aluminum and includes a cavity having an opening on the first surface in which the die is mounted.
  • the die preferably includes a light-emitting device that emits light in a direction pointing away from the top surface, the encapsulating cap being optically transparent to the emitted light.
  • the encapsulating cap can include a dam surrounding the die, the dam is filled with a clear encapsulating material.
  • the first trace preferably includes a solder ball on the first portion thereof.
  • the circuit element may include a second trace for making the connection to the second contact point on the die. Alternatively, the second connection can be made through the heat-conducting die itself.
  • a second solder ball is preferably placed on the second trace or the heat-conducting body to provide an electrical connection to the second contact point of the die.
  • a third solder ball is preferably provided on the top surface of the heat conducting body at a location that is non-colinear with the first and second solder balls.
  • the solder balls provide a mechanism for coupling the circuit element to a printed circuit board as well as providing power to the die.
  • the bottom surface of the heat conducting body may include fins or other features for increasing the surface area of the bottom surface relative to the top surface of the heat conducting body.
  • FIG. 1 is a cross-sectional view of a packaged LED according to one prior art design.
  • FIG. 2 is a cross-sectional view of the packed LED shown in FIG. 1 attached to a typical printed circuit board (PCB).
  • PCB printed circuit board
  • FIG. 3A is a top view of LED device.
  • FIG. 3B is a cross-sectional view through line 341 - 342 of LED device shown in FIG. 3A .
  • FIG. 3C is a top view of substrate 361 that illustrates the manner in which an LED device is mounted on a substrate such as a PCB.
  • FIG. 3D is a cross-sectional view through line 351 - 352 of the LED device shown in FIG. 3C .
  • FIG. 4 is a cross-sectional view of an LED device with a greater surface area according to another embodiment of the present invention.
  • FIG. 5 is a cross-sectional view of an LED device that provides a reflector according to another embodiment of the present invention.
  • FIG. 6A is a top view of an LED device.
  • FIG. 6B is a cross-sectional view of the LED device shown in FIG. 6A through line 751 - 752 .
  • FIG. 7 is a cross-sectional view of an array of LED devices that share a single heat sink according to another embodiment of the present invention.
  • FIG. 1 is cross-sectional view of a packaged LED according to one prior art design.
  • An LED 100 is mounted in a cavity of a substrate 102 using a conductive medium 104 .
  • a first bond wire 106 electrically connects one terminal of the LED 100 to one electrical contact 110 while a second bond wire 108 electrically connects a second terminal of LED 100 to another electrical contact 112 .
  • An encapsulating body 114 substantially encases the LED, the bond wires, the substrate and the contacts to provide protection for the LED.
  • FIG. 2 is a cross-sectional view of the packed LED shown in FIG. 1 attached to a typical printed circuit board (PCB) 116 .
  • the base of substrate 102 is mounted on a PCB 116 so that it is in direct contact with PCB 116 .
  • One electrical contact 110 is electrically connected to the trace 118 of the PCB via an electrically conductive medium 120 while the other electrical contact 112 is electrically connected to trace 122 of the PCB via an electrically conductive medium 124 .
  • solder is used for these connections.
  • the heat generated in LED 100 is conducted to the PCB through substrate 102 .
  • the LED device in FIG. 1 has many disadvantages.
  • the ability of substrate 102 to act as a heat sink and heat transfer conduit depends on the size of the substrate. Since the electrical contacts at the sides of the substrate increase the footprint of the device without providing additional surface area for heat conduction, these devices cannot incorporate heat sinks as large as the footprint of the device. That is, the lateral size of the heat sink will always be smaller than the overall footprint of the device.
  • Prior art devices attempt to overcome the limitations of the substrate size by relying on a secondary heat sink in the form of the PCB 116 to help conduct the heat away from the LED, and hence, limit the temperature rise to which the LED is subjected.
  • This solution moves the heat dissipation problem to the PCB.
  • a metal core PCB with some provision for transferring the heat to the surrounding air is often needed. Since the cost of such metal core PCBs is significantly greater than the cost of the more common glass epoxy PCBs, this solution significantly increases the cost of the final circuit utilizing the LED.
  • this solution increases the design complexity of the final PCB since the PCB must be arranged to dissipate the heat without subjecting other components on the PCB to excessive temperatures.
  • FIGS. 3 A-D illustrate an LED device 300 according to one embodiment of the present invention.
  • FIG. 3A is a top view of LED device 300
  • FIG. 3B is a cross-sectional view through line 341 - 342 shown in FIG. 3A .
  • LED device 300 has a body 301 with a first surface 302 and a second surface 304 on the opposite side.
  • a circuit trace having electrical contacts 306 and 308 on a thin film layer 310 is attached to surface 302 .
  • the circuit layer has an opening 312 in the center that provides access to surface 302 .
  • An LED 314 is attached to surface 302 using an adhesive 316 .
  • Electrical connections by way of bond wires 318 and 320 connect the LED to the electrical contacts 306 and 308 .
  • Solder bumps 322 and 324 are then deposited on one portion of the electrical contacts 306 and 308 .
  • the LED and bond wires and a portion of the electrical contacts are encapsulated in an optically clear material 326 .
  • traces 306 and 308 preferably include a T-shaped region as shown at 331 in FIG. 3A . This enlarged area reduces the precision required in the wire bonding process.
  • FIGS. 3C and 3D illustrate the manner in which LED device 300 is mounted on a substrate 361 such as a PCB.
  • FIG. 3C is a top view of substrate 361
  • FIG. 3D is a cross-sectional view through line 351 - 352 .
  • Substrate 361 includes an opening 370 through which LED 314 is viewed.
  • Substrate 361 also includes two traces shown at 371 and 372 , which are positioned to connect to solder bumps 322 and 324 .
  • LED device 300 is connected to substrate 361 via traces 371 and 372 by any of a number of methods.
  • heat can be applied to substrate 361 sufficient to cause the solder to reflow and make the connections between LED device 300 and substrate 361 .
  • the solder can be deposited on the PCB before the placement of device 300 , and the assembly subsequently reflowed.
  • an electrically conductive adhesive such as epoxy, silicone or suitable plastic can be used to make the attachment.
  • adhesive can be either cured by heat or other means, such as exposure to ultraviolet (UV) light.
  • Body 301 provides two functions. First, body 301 acts as a heat sink that buffers thermal fluctuations. Surface 304 dissipates heat to the surrounding air. Body 301 is preferably made of a metal such as copper or aluminum to provide a high thermal conductivity. Since surface 304 is as large as the footprint of the device, this embodiment of the present invention provides substantially more heat transfer area than the prior art devices discussed above.
  • FIG. 4 is a cross-sectional view of an LED device 400 according to another embodiment of the present invention.
  • LED device 400 is similar to LED device 300 discussed above except for the second surface of the device body.
  • LED device 400 has a body 401 with a first surface 402 and a second surface 404 on the opposite side.
  • a circuit trace consisting of electrical contacts 406 and 408 on a thin film layer 410 is attached to the said first surface of the body.
  • the circuit layer has an opening in the center to provide access to surface 402 .
  • An LED 414 is attached to surface 402 using an adhesive layer.
  • the surface 404 has a fin-like, rib-like or stub-like shape to enhance heat dissipation.
  • body 401 is a heat sink.
  • the fin can be advantageously designed into any shape such as taper, rectangular, stubs etc.
  • the fins can be molded as part of a single body as shown in the drawing or attached to surface 404 discussed above by any mechanism that provides good heat conduction.
  • LED device 600 that provides such a reflector.
  • LED device 600 is similar to LED device 300 discussed above except that a recess cavity is provided in the first surface 602 .
  • LED device 600 includes a body 601 having a first surface 602 and a second surface 604 on the opposite side.
  • a circuit trace consisting of electrical contacts 606 and 608 on a thin film layer 610 is attached to surface 602 .
  • the circuit layer has an opening in the center to provide access to surface 602 .
  • An LED 614 is attached to the first surface 602 inside a cavity 603 using an adhesive 616 .
  • Electrical connections by way of bond wires 618 and 620 connect the LED to the electrical contacts 606 and 608 .
  • Solder bumps 622 and 624 are then deposited on one portion of the electrical contacts 606 and 608 .
  • the LED and bond wires and a portion of the electrical contacts are encapsulated in an optically clear material 626 .
  • FIGS. 6A and 6B illustrate an LED device 700 according to another embodiment of the present invention.
  • FIG. 6A is a top view of LED device 700
  • FIG. 6B is a cross-sectional view of LED device 700 through line 751 - 752 .
  • LED device 700 is similar to LED device 300 discussed above except that an annular ring 764 is provided on the first surface 702 .
  • LED device 700 has a body 701 having a first surface 702 and a second surface 704 on the opposite side.
  • An annular shaped ring 764 is attached on the first surface 702 by any known method such as using a thermally conductive adhesive, solder or just mechanically attached with fasteners.
  • a circuit trace consisting of electrical contacts 706 and 708 on a thin film layer 710 is attached to surface 702 .
  • the circuit layer has an opening 712 in the center thereof to provide access to surface 702 .
  • An LED 714 is attached to surface 702 using an adhesive 716 . Electrical connections by way of bond wires 718 and 720 connect the LED to the electrical contacts 706 and 708 .
  • Solder bumps 722 and 724 are then deposited on one portion of the electrical contacts 706 and 708 .
  • the LED and bond wires, and a portion of the electrical contacts, are encapsulated with optically clear material 726 by filling the cavity created by annular ring 764 .
  • the annular-shaped ring 764 can be of any shape such as circular or polygonal. It acts as a reservoir to contain the optically clear encapsulant 726 . Additionally, an optically clear lens 765 made of plastic, polymer or glass can be incorporated on top of the annular-shaped body so as to direct the light in a desired direction. The lens can be glued to the surface of the encapsulant or formed in the encapsulant by a molding operation.
  • surface 702 may include additional solder bumps to provide additional adhesion points for connecting the LED device to a PCB or the like. Such solder bumps are shown at 771 and 772 in FIG. 6A . These solder bumps may be formed on a conducting trace that is attached to surface 702 by an appropriate adhesive or directly on surface 702 if the metal chosen for body 701 is wet by solder. In this regard, copper is the preferred material for body 701 .
  • the above-described embodiments utilize bond wires to make all of the connections between the LED and the solder bumps that connect to the PCB.
  • the body may be used for one of these connections. If the chip is conductive or the bottom of the chip having the LED has a contact thereon, and the chip is mounted to the body by an electrically conducting adhesive, then the body can be used to connect to that contact. In this case, an appropriately placed solder bump is formed directly on surface 702 .
  • inventions utilize passive convection/conduction to move the heat from the bottom surface of the body, e.g., surface 704 or surface 404 , to the surrounding air.
  • a fan is utilized to enhance the airflow can also be constructed.
  • the fan can be attached to the bottom surface of the body or provided in the enclosure in which the LED device is located.
  • an LED device has the body, which spans the device footprint. Therefore the LED device has a heat sink that utilizes the full footprint of the device. Additionally, the body is not encased in any kind of thermally insulative encapsulant, and therefore, is able to dissipate heat more efficiently. Further, the problems related to the coplanarity of the leads and the heat sink in prior art devices have been overcome.
  • the bottom surface of the body is exposed to the ambient, and hence, efficient heat dissipation can be obtained. Additionally, since the bottom surface does not come in contact with any other surface, the body can be fabricated such that this surface extends as long or deep as possible. Hence, it is now possible to fabricate devices with long or deep heat sinks without having to increase the lateral dimensions of the devices.
  • the mounting substrate can be constructed from common materials such as those used in inexpensive PCBs.
  • the end-user does not need to provide an additional heat sink, thus simplifying the design of products that use the LED device.
  • FIG. 7 is a cross-sectional view of an array 800 of LED devices that share a single heat sink according to another embodiment of the present invention.
  • Array 800 is constructed on a PCB 810 .
  • a plurality of LED devices according to the present invention is mounted on PCB 810 in a manner analogous to that described above.
  • Exemplary LED devices are shown at 801 - 803 .
  • the body of each of the LED devices is in thermal contact with a common heat sink 821 .
  • the individual LED devices can be connected to heat sink 821 by a layer of heat conducting adhesive.
  • Heat sink 821 may also include structures, such as the fins shown at 822 to facilitate the transfer of heat to the surrounding air.
  • Heat sink 821 can also include a fan 823 to further enhance the transfer of heat from heat sink 821 to the surrounding air.
  • the die is mounted on a heat-conducting body that is preferably made from Aluminum or Copper.
  • a heat-conducting body that is preferably made from Aluminum or Copper.
  • other materials such as ceramics and composites may be utilized for the heat-conducting body.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Led Device Packages (AREA)
US10/683,489 2003-10-09 2003-10-09 High power light emitting diode device Abandoned US20050077616A1 (en)

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US10/683,489 US20050077616A1 (en) 2003-10-09 2003-10-09 High power light emitting diode device
GB0419641A GB2406969B (en) 2003-10-09 2004-09-03 Circuit element
DE102004044149A DE102004044149B4 (de) 2003-10-09 2004-09-13 Hochleistungs-Leuchtdiodenvorrichtung
JP2004291171A JP2005117041A (ja) 2003-10-09 2004-10-04 高出力発光ダイオードデバイス
US11/358,477 US7612386B2 (en) 2003-10-09 2006-02-20 High power light emitting diode device

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JP (1) JP2005117041A (enrdf_load_stackoverflow)
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Also Published As

Publication number Publication date
GB2406969A (en) 2005-04-13
US7612386B2 (en) 2009-11-03
GB2406969B (en) 2008-04-23
US20060138645A1 (en) 2006-06-29
JP2005117041A (ja) 2005-04-28
DE102004044149B4 (de) 2011-02-17
DE102004044149A1 (de) 2005-06-02
GB0419641D0 (en) 2004-10-06

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