US20040081565A1 - Vacuum pump - Google Patents

Vacuum pump Download PDF

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Publication number
US20040081565A1
US20040081565A1 US10/660,313 US66031303A US2004081565A1 US 20040081565 A1 US20040081565 A1 US 20040081565A1 US 66031303 A US66031303 A US 66031303A US 2004081565 A1 US2004081565 A1 US 2004081565A1
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US
United States
Prior art keywords
pump
housing
coupling member
booster
booster pump
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10/660,313
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English (en)
Inventor
Satoru Kuramoto
Masahiro Kawaguchi
Shinya Yamamoto
Nobuaki Hoshino
Masahiro Ida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyota Industries Corp
Original Assignee
Toyota Industries Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyota Industries Corp filed Critical Toyota Industries Corp
Assigned to KABUSHIKI KAISHA TOYOTA JIDOSHOKKI reassignment KABUSHIKI KAISHA TOYOTA JIDOSHOKKI ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HOSHINO, NOBUAKI, IDA, MASAHIRO, KAWAGUCHI, MASAHIRO, KURAMOTO, SATORU, YAMAMOTO, SHINYA
Publication of US20040081565A1 publication Critical patent/US20040081565A1/en
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
    • F01C—ROTARY-PISTON OR OSCILLATING-PISTON MACHINES OR ENGINES
    • F01C21/00—Component parts, details or accessories not provided for in groups F01C1/00 - F01C20/00
    • F01C21/007—General arrangements of parts; Frames and supporting elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B37/00—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00
    • F04B37/10—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00 for special use
    • F04B37/14—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00 for special use to obtain high vacuum
    • F04B37/16—Means for nullifying unswept space
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
    • F04C18/00—Rotary-piston pumps specially adapted for elastic fluids
    • F04C18/08—Rotary-piston pumps specially adapted for elastic fluids of intermeshing-engagement type, i.e. with engagement of co-operating members similar to that of toothed gearing
    • F04C18/12—Rotary-piston pumps specially adapted for elastic fluids of intermeshing-engagement type, i.e. with engagement of co-operating members similar to that of toothed gearing of other than internal-axis type
    • F04C18/126—Rotary-piston pumps specially adapted for elastic fluids of intermeshing-engagement type, i.e. with engagement of co-operating members similar to that of toothed gearing of other than internal-axis type with radially from the rotor body extending elements, not necessarily co-operating with corresponding recesses in the other rotor, e.g. lobes, Roots type
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
    • F04C23/00—Combinations of two or more pumps, each being of rotary-piston or oscillating-piston type, specially adapted for elastic fluids; Pumping installations specially adapted for elastic fluids; Multi-stage pumps specially adapted for elastic fluids
    • F04C23/001—Combinations of two or more pumps, each being of rotary-piston or oscillating-piston type, specially adapted for elastic fluids; Pumping installations specially adapted for elastic fluids; Multi-stage pumps specially adapted for elastic fluids of similar working principle
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
    • F04C23/00—Combinations of two or more pumps, each being of rotary-piston or oscillating-piston type, specially adapted for elastic fluids; Pumping installations specially adapted for elastic fluids; Multi-stage pumps specially adapted for elastic fluids
    • F04C23/005—Combinations of two or more pumps, each being of rotary-piston or oscillating-piston type, specially adapted for elastic fluids; Pumping installations specially adapted for elastic fluids; Multi-stage pumps specially adapted for elastic fluids of dissimilar working principle
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
    • F04C2220/00—Application
    • F04C2220/10—Vacuum

Definitions

  • the present invention relates to a vacuum pump equipped with a main pump and a booster pump.
  • a vacuum pump is used in a semiconductor fabrication process and discharges a reaction product from a semiconductor process system.
  • a reaction product is solidified and deposited in the booster pump. Deposition of a reaction product in a gas passage leads to a reduction in the performance of the vacuum pump.
  • Japanese Laid-Open Patent Publication No. 5-113180 discloses a technique that permits heat in the housing of a main pump to be transmitted to the housing of a booster pump via a supporting member. This increases the temperature in the booster pump.
  • Japanese Laid-Open Patent Publication No. 8-296557 discloses a vacuum pump equipped with a multi-stage pump mechanism, which performs gas discharging in multiple stages. The temperature of that portion of the housing of the vacuum pump which surrounds the last stage of the pump mechanism or the portion that becomes the hottest becomes higher than the temperatures of the other portions.
  • the invention disclosed in Japanese Laid-Open Patent Publication No. 5-113180 employs the aforementioned structure for the purpose of making the entire vacuum pump compact, the structure that is suitable for effectively raising the temperature in the main pump equipped with a multi-stage pump mechanism.
  • the present invention provides a vacuum pump.
  • the vacuum pump has a main pump, a booster pump and a coupling member.
  • the main pump has a first housing and a first pump mechanism accommodated in the first housing.
  • the first pump mechanism is a multi-stage type.
  • the booster pump has a second housing and a second pump mechanism accommodated in the second housing.
  • the booster pump and the main pump are coupled in series such that gas is sent from the booster pump to the main pump.
  • the coupling member couples the first housing and the second housing to each other.
  • the coupling member is directly coupled to a portion of the first housing that surrounds a last stage of the first pump mechanism such that transmission of heat to the portion is permitted.
  • FIG. 1 is a cross-sectional view of a vacuum pump according to one embodiment of the present invention.
  • FIG. 2 is a cross-sectional view along the line 2 - 2 in FIG. 1;
  • FIG. 3 is a partly cross-sectional view of a vacuum pump according to another embodiment of the embodiment.
  • FIG. 4 is a partly cross-sectional view of a vacuum pump according to a further embodiment of the embodiment.
  • a vacuum pump includes a main pump 11 , which can be activated from the atmospheric pressure, and a booster pump 61 .
  • the vacuum pump is used in a semiconductor fabrication process and discharges a gaseous reaction product (e.g., ammonium chloride) from an unillustrated semiconductor process system.
  • the booster pump 61 is located upstream (on the semiconductor process system side) of the position where the main pump 11 is located in the gas passage.
  • the main pump 11 and the booster pump 61 are coupled in series. It is to be noted that the right-hand side in FIG. 1 is the front end of the vacuum pump and the left-hand side is the rear end of the vacuum pump.
  • the main pump 11 has a rotor housing member 12 , a front housing member 13 , and a rear housing member 14 , which constitute a first housing H 1 .
  • the front housing member 13 is connected to the front end of the rotor housing member 12 , and the rear housing member 14 to the rear end of the rotor housing member 12 .
  • the first housing H 1 accommodates a multi-stage root type first pump mechanism P 1 to be discussed later.
  • the rotor housing member 12 , the front housing member 13 , and the rear housing member 14 are each made of an iron-based metal.
  • Iron-based metals have smaller thermal expansion coefficient than, for example, aluminum-based metals. The iron-based metals can therefore reduce heat-oriented variation in the clearance of the individual sections to thereby ensure effective prevention of gas leakage or the like.
  • the first pump mechanism P 1 will be elaborated below.
  • the rotor housing member 12 includes a cylinder block 15 and a plurality of first to fourth partition walls 16 a, 16 b, 16 c, and 16 d.
  • the space between the front housing member 13 and the first partition wall 16 a, the space between the first and second partition walls 16 a and 16 b, the space between the second and third partition walls 16 b and 16 c, the space between the third and fourth partition walls 16 c and 16 d, and the space between the fourth partition wall 16 d and the rear housing member 14 are respectively equivalent to first to fifth pump chambers 51 , 52 , 53 , 54 , and 55 .
  • Formed in the four partition walls 16 a, 16 b, 16 c, and 16 d is a common passage 17 , which connects the adjoining pump chambers 51 , 52 , 53 , 54 , and 55 .
  • a first rotary shaft 19 and a second rotary shaft 20 are rotatably supported on the front housing member 13 and the rear housing member 14 , respectively. Both rotary shafts 19 and 20 are laid out in parallel to each other. The rotary shafts 19 and 20 are inserted into the first to fourth partition walls 16 a to 16 d.
  • a plurality of (five in the embodiment) first rotors 23 are formed integrally on the first rotary shaft 19 . Each first rotor 23 has the shape of a honewort leaf.
  • Plural second rotors 28 (only one shown in FIG. 2) equal in quantity to the first rotors 23 are formed integrally on the second rotary shaft 20 . Each second rotor 28 likewise has the shape of a honewort leaf.
  • the thicknesses of the first and second rotors 23 and 28 in the axial directions of the first and second rotary shafts 19 and 20 become gradually smaller in order from the front housing member 13 toward the rear housing member 14 .
  • the first and second rotors 23 and 28 are retained in engagement with each other in the first to fifth pump chambers 51 to 55 with slight clearances maintained.
  • the volumes of the first to fifth pump chambers 51 to 55 become gradually smaller in order from the first pump chamber 51 toward the fifth pump chamber 55 .
  • a gear housing 38 which accommodates a gear unit 39 and a shaft coupling 40 is connected to the rear housing member 14 .
  • An electric motor M is mounted on the gear housing 38 .
  • the driving force of the electric motor M is transmitted to the first rotary shaft 19 via the shaft coupling 40 and is transmitted from the shaft coupling 40 to the second rotary shaft 20 (see FIG. 2) via the gear unit 39 .
  • the second rotary shaft 20 (second rotors 28 ) is turned in a direction different from the turning direction of the first rotary shaft 19 (first rotors 23 ).
  • a gas suction port 21 is formed in the cylinder block 15 at the upper part of a portion (peripheral wall) 45 of the foremost stage of the first pump mechanism P 1 (the portion that is constituted by the first pump chamber 51 and the first and second rotors 23 and 28 to be retained in the first pump chamber 51 ).
  • the portion 45 surrounds the first pump chamber 51 in such a way that the suction port 21 communicates with the first pump chamber 51 .
  • the suction port 21 is connected with the exhaust side of the booster pump 61 .
  • a gas exhaust port 22 is formed in the cylinder block 15 at the lower part of a portion (peripheral wall) 46 of the last stage of the first pump mechanism P 1 (the portion that is constituted by the fifth pump chamber 55 and the first and second rotors 23 and 28 to be retained in the fifth pump chamber 55 ).
  • the portion 46 surrounds the fifth pump chamber 55 in such a way that the exhaust port 22 communicates with the fifth pump chamber 55 .
  • the gas from the booster pump 61 that is led into the first pump chamber 51 through the suction port 21 is transferred to the adjoining second pump chamber 52 via the passage 17 in the first partition wall 16 a as the first and second rotors 23 and 28 in the first pump chamber 51 rotate.
  • the gas is transferred in a similar manner in the order from a larger-volume pump chamber to a smaller-volume pump chamber, i.e., in the order from the first pump chamber 51 toward the fifth pump chamber 55 through the second, third and fourth pump chambers 52 , 53 , and 54 .
  • the gas that has been transferred to the fifth pump chamber 55 is discharged toward an unillustrated exhaust-gas process system from the exhaust port 22 .
  • the main pump 11 is a multi-stage (five stages in the embodiment) root pump, which performs gas discharging in multiple stages
  • the booster pump 61 is a single-stage root pump, which performs gas discharging in a single stage.
  • the booster pump 61 therefore, only what differs from the main pump 11 will be described, and the description of those components of the booster pump 61 that are identical or correspond to the components of the main pump 11 will be omitted with the same reference symbols given to the corresponding components.
  • the booster pump 61 also has a rotor housing member 12 , a front housing member 13 , and a rear housing member 14 .
  • the rotor housing member 12 , the front housing member 13 , and the rear housing member 14 constitute a second housing H 2 , which accommodates a single-stage root type second pump mechanism P 2 .
  • the rotor housing member 12 of the booster pump 61 does not have the first to fourth partition walls 16 a to 16 d of the main pump 11 .
  • the space in the rotor housing member 12 that is defined between the front housing member 13 and the rear housing member 14 is a sixth pump chamber 62 , which is larger in volume than the first pump chamber 51 of the main pump 11 .
  • a first rotary shaft 119 and a second rotary shaft 120 of the booster pump 61 are respectively provided with a first rotor 63 and a second rotor 64 both having the shape of a cotyledon.
  • the first and second rotors 63 and 64 are retained in engagement with each other in the sixth pump chamber 62 with a slight clearance kept therebetween.
  • a suction port 65 is formed in the upper portion of the cylinder block 15 of the booster pump 61 in such a way as to communicate with the sixth pump chamber 62 .
  • the suction port 65 is connected with an exhaust-side pipe of the semiconductor process system.
  • An exhaust port 66 is formed in the lower portion of the cylinder block 15 in such a way as to communicate with the sixth pump chamber 62 . Therefore, the gas from the semiconductor process system, which is led into the sixth pump chamber 62 through the suction port 65 , is discharged toward the main pump 11 from the exhaust port 66 as the first and second rotors 63 and 64 rotate.
  • a support portion 67 as a support member is formed integrally with, and protrudes on, the lower portion of the cylinder block 15 of the booster pump 61 .
  • a support and protrusion portion 68 is formed integrally on the lower portion of the rear housing member 14 of the booster pump 61 .
  • a rubber bush 47 is attached to the upper portion of the rear housing member 14 of the main pump 11 .
  • the booster pump 61 is fixed to the top surface (flat surface) 15 a of the cylinder block 15 of the main pump 11 by the support portion 67 , and is securely mounted on the main pump 11 by the support and protrusion portion 68 placed on the rubber bush 47 . That is, the support portion 67 of the booster pump 61 serves as a support stand for supporting the booster pump 61 on the main pump 11 .
  • a communication passage 69 which connects the exhaust side (exhaust port 66 ) of the booster pump 61 to the suction side (suction port 21 ) of the main pump 11 , is formed inside the support portion 67 .
  • an exhaust flange 70 that is connected to the exhaust port 66 of the booster pump 61 , a suction flange 71 that is connected to the suction port 21 of the main pump 11 and a communication portion 72 that connects both flanges 70 and 71 together are integrated with one another.
  • the suction flange 71 is connected to the top surface, 45 a, of the portion 45 of the cylinder block 15 that surrounds the first pump chamber 51 of the first pump mechanism P 1 .
  • the shape of the communication portion 72 becomes narrower toward the suction flange 71 along the shape of the communication passage 69 .
  • the booster pump 61 As the booster pump 61 is securely mounted on the main pump 11 via the support portion 67 in this way, the cylinder blocks 15 of the main pump 11 and the booster pump 61 are directly connected to each other by the support portion 67 such that transmission of heat to the cylinder block 15 of the booster pump 61 is permitted. Therefore, the heat in the main pump 11 is transmitted to the cylinder block 15 of the booster pump 61 from the cylinder block 15 of the main pump 11 via the support portion 67 of the booster pump 61 , thereby raising the temperature inside the booster pump 61 (including the inside of the communication passage 69 ). Raising the temperature in the booster pump 61 prevents the solidification of a reaction product in the booster pump 61 .
  • the embodiment uses a multi-stage root pump as the main pump 11 . Therefore, the temperature of the portion 46 of the cylinder block 15 of the main pump 11 that surrounds the last stage of the first pump mechanism P 1 or the portion that becomes the hottest becomes higher than the temperatures of the other portions (for example, the portion 45 that surrounds the foremost stage).
  • the temperature in the booster pump 61 by using the heat generated in the main pump 11 , therefore, it is necessary to transmit the heat at the high-temperature portion of the cylinder block 15 of the main pump 11 to the cylinder block 15 of the booster pump 61 .
  • the support portion 67 of the booster pump 61 is directly coupled to the (high-temperature) portion 46 of the cylinder block 15 of the main pump 11 such that transmission of heat to the cylinder block 15 of the booster pump 61 is permitted.
  • a flat heat-extracting portion 73 is formed on the suction flange 71 of the support portion 67 in such a way as to extend toward the rear housing member 14 .
  • the heat-extracting portion 73 is directly mounted on the top surface 15 a of the cylinder block 15 of the main pump 11 in an area between the top surface 46 a of the (high-temperature) portion 46 and the top surface 45 a of the portion 45 to include the top surface 46 a.
  • the heat generated by the last stage of the first pump mechanism P 1 is taken directly to the support portion 67 via the heat-extracting portion 73 from the high-temperature portion 46 of the cylinder block 15 .
  • This can effectively raise the temperature in the booster pump 61 , thus reliably ensuring the prevention of the solidification of a reaction product in the booster pump 61 .
  • the embodiment has the following advantages.
  • the heat generated by the last stage of the first pump mechanism P 1 can efficiently be transmitted to the booster pump 61 , thereby effectively raising the temperature in the booster pump 61 . This makes it possible to more reliably prevent the solidification of a reaction product in the booster pump 61 , thereby surely inhibiting a reduction in the performance of the vacuum pump that would otherwise be originated from the deposition of a reaction product in the gas passage.
  • the support portion 67 is formed integrally on the cylinder block 15 of the booster pump 61 . This ensures efficient thermal conduction between the support portion 67 and the cylinder block 15 of the booster pump 61 , thus making it possible to raise the temperature in the booster pump 61 more effectively. Further, it is unnecessary to separately provide the support portion 67 for both pumps 11 and 61 , thereby contributing to reducing the number of components of the vacuum pump.
  • the support portion 67 also serves as the support stand that supports the booster pump 61 on the main pump 11 . This makes it unnecessary to provide an exclusive support stand for supporting the booster pump 61 , thereby also contributing to reducing the number of components of the vacuum pump.
  • the communication passage 69 which connects the exhaust port 66 of the booster pump 61 to the suction port 21 of the main pump 11 , is formed inside the support portion 67 . This eliminates the need for an exclusive pipe for forming the communication passage 69 , so that the number of required components of the vacuum pump can be reduced.
  • the support portion 67 abuts on the top surface 15 a of the cylinder block 15 of the main pump 11 in a wider area stretching from the top surface 45 a of the portion 45 corresponding to the foremost stage of the first pump mechanism P 1 to the top surface 46 a of the portion 46 corresponding to the last stage of that. Accordingly, the booster pump 61 is stably supported on the main pump 11 by the support portion 67 .
  • the support portion 67 may be formed integrally on the cylinder block 15 of the main pump 11 .
  • the support portions 67 may be formed separately on the cylinder block 15 of the main pump 11 and the cylinder block 15 of the booster pump 61 as shown in FIG. 4.
  • the support portion 67 may be formed integrally on both the cylinder block 15 of the main pump 11 and the cylinder block 15 of the booster pump 61 , though not illustrated.
  • a thermal conductive grease as a thermal-conductance improver may be intervened in the portion where the support portion 67 is connected to the cylinder block 15 of the main pump 11 . This improves the adhesion of the support portion 67 to the cylinder block 15 of the main pump 11 , thus improving the thermal conductance between those cylinder block 15 and support portion 67 . As a result, the temperature in the booster pump 61 can be raised more effectively.
  • a substitute thermal conductive material for the thermal conductive grease may be a copper paste, a resin sheet, or a rubber sheet.
  • the heat-extracting portion 73 may be separated from the support portion 67 , and the separated heat-extracting portion 73 may be provided on the cylinder block 15 of the booster pump 61 separately from the support portion 67 .
  • the heat-extracting portion 73 only serves as a coupling member. This structure can allow the heat from the heat-extracting portion 73 to be transmitted directly to the cylinder block 15 of the booster pump 61 , so that the temperature in the booster pump 61 can be raised more efficiently.
  • the support portion 67 , the support protrusion portion 68 and the bush 47 may be eliminated, and the booster pump 61 may be mounted directly on the main pump 11 .
  • the cylinder block 15 of the booster pump 61 that is connected directly to the cylinder block 15 of the main pump 11 serves as a coupling member.
  • This structure causes the (high-temperature) portion 46 of the cylinder block 15 of the main pump 11 to directly abut on the cylinder block 15 of the booster pump 61 , so that the heat generated by the last stage of the first pump mechanism P 1 of the main pump 11 can be transmitted to the booster pump 61 more efficiently.
  • This mode is advantageous in making the vacuum pump compact.
  • At least the cylinder block 15 (inclusive of the support portion 67 integral with the cylinder block 15 ) in the second housing H 2 of the booster pump 61 may be formed of an aluminum-based metal, which has an excellent thermal conductance. This structure can allow the heat from the heat-extracting portion 73 to be efficiently transmitted to the cylinder block 15 of the booster pump 61 , thus making it possible to raise the temperature in the booster pump 61 more efficiently.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Applications Or Details Of Rotary Compressors (AREA)
  • Compressors, Vaccum Pumps And Other Relevant Systems (AREA)
US10/660,313 2002-09-10 2003-09-10 Vacuum pump Abandoned US20040081565A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002-264327 2002-09-10
JP2002264327A JP2004100594A (ja) 2002-09-10 2002-09-10 真空ポンプ装置

Publications (1)

Publication Number Publication Date
US20040081565A1 true US20040081565A1 (en) 2004-04-29

Family

ID=31884757

Family Applications (1)

Application Number Title Priority Date Filing Date
US10/660,313 Abandoned US20040081565A1 (en) 2002-09-10 2003-09-10 Vacuum pump

Country Status (6)

Country Link
US (1) US20040081565A1 (fr)
EP (1) EP1398509A3 (fr)
JP (1) JP2004100594A (fr)
KR (1) KR20040023490A (fr)
CN (1) CN1495363A (fr)
TW (1) TW200404125A (fr)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070104587A1 (en) * 2003-10-17 2007-05-10 Takeshi Kawamura Evacuation apparatus
CN103228921A (zh) * 2010-11-17 2013-07-31 株式会社爱发科 真空排气装置的联接结构和真空排气系统
US20130336828A1 (en) * 2012-06-18 2013-12-19 Kabushiki Kaisha Toshiba Roots pump and exhaust method
US20150260174A1 (en) * 2014-03-17 2015-09-17 Ebara Corporation Vacuum pump with abatement function
US20180149156A1 (en) * 2015-08-27 2018-05-31 Elivac Company, Ltd. (Shanghai) Modularized Integrated Non-Coaxial Multiple Chamber Dry Vacuum Pump
US10641272B2 (en) * 2014-03-17 2020-05-05 Ebara Corporation Vacuum pump with abatement function
US11248607B2 (en) 2017-01-20 2022-02-15 Edwards Limited Multi-stage vacuum booster pump rotor
US11313368B2 (en) * 2020-03-05 2022-04-26 Elivac Company, Ltd. Multistage pump assembly with at least one co-used shaft

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KR100809852B1 (ko) * 2007-05-17 2008-03-04 (주)엘오티베큠 일체형 진공발생장치
DE102009037010A1 (de) * 2009-08-11 2011-02-17 Oerlikon Leybold Vacuum Gmbh Vakuumpumpensystem
TWI518245B (zh) * 2010-04-19 2016-01-21 荏原製作所股份有限公司 乾真空泵裝置、排氣單元，以及消音器
JP2014029114A (ja) * 2010-11-17 2014-02-13 Ulvac Japan Ltd 真空排気装置の連結構造及び真空排気装置
GB2499217A (en) * 2012-02-08 2013-08-14 Edwards Ltd Vacuum pump with recirculation valve
GB2500603A (en) * 2012-03-26 2013-10-02 Edwards Ltd Vacuum pump stators and vacuum pumps
JP6009193B2 (ja) * 2012-03-30 2016-10-19 株式会社荏原製作所 真空排気装置
DE202013003819U1 (de) * 2013-04-24 2014-07-25 Oerlikon Leybold Vacuum Gmbh Vakuumpumpen-System
GB2564381B (en) 2017-06-12 2020-07-01 Edwards Ltd Twin shaft pumps and a method of pumping
CN107084135A (zh) * 2017-06-29 2017-08-22 德耐尔节能科技（上海）股份有限公司 一种干式螺旋真空泵
WO2021240620A1 (fr) * 2020-05-25 2021-12-02 樫山工業株式会社 Dispositif d'échappement sous vide pourvu d'un silencieux
CN112879290B (zh) * 2021-01-25 2022-06-14 马鞍山赛力文机械有限公司 一种前后端齿轮驱动的双螺杆主机结构

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US4934908A (en) * 1988-04-12 1990-06-19 The Boc Group, Plc Vacuum pump systems

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JPH05231369A (ja) * 1991-07-09 1993-09-07 Ebara Corp 多段スクリュー真空ポンプ
JPH05231366A (ja) * 1991-07-09 1993-09-07 Ebara Corp 多段式真空ポンプ装置
JPH05113180A (ja) * 1991-09-05 1993-05-07 Ebara Corp 真空ポンプの連結装置
JP3563152B2 (ja) * 1995-04-21 2004-09-08 株式会社アルバック 真空ポンプ

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US2721694A (en) * 1954-01-29 1955-10-25 New York Air Brake Co First stage mechanical pump for use in a two stage vacuum pumping system
US4934908A (en) * 1988-04-12 1990-06-19 The Boc Group, Plc Vacuum pump systems

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100209259A1 (en) * 2003-10-17 2010-08-19 Ebara Corporation Evacuation apparatus
US20070104587A1 (en) * 2003-10-17 2007-05-10 Takeshi Kawamura Evacuation apparatus
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KR20040023490A (ko) 2004-03-18
EP1398509A2 (fr) 2004-03-17
CN1495363A (zh) 2004-05-12
JP2004100594A (ja) 2004-04-02
EP1398509A3 (fr) 2005-06-15
TW200404125A (en) 2004-03-16

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