US20020182764A1 - System and method for moving substrates in and out of a manufacturing process - Google Patents

System and method for moving substrates in and out of a manufacturing process Download PDF

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Publication number
US20020182764A1
US20020182764A1 US09/480,689 US48068900A US2002182764A1 US 20020182764 A1 US20020182764 A1 US 20020182764A1 US 48068900 A US48068900 A US 48068900A US 2002182764 A1 US2002182764 A1 US 2002182764A1
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US
United States
Prior art keywords
cassette
transfer device
process apparatus
port
automatic transfer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US09/480,689
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English (en)
Inventor
Min-Young Heo
Sung-Joon Byun
Jung-Teak Lim
Byung-Kwen Park
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Assigned to SAMSUNG ELECTRONICS CO., LTD. reassignment SAMSUNG ELECTRONICS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: BYUN, SUNG-JOON, HEO, MIN-YOUNG, LIM, JUNG-TEAK, PARK, BYUNG-KWEN
Publication of US20020182764A1 publication Critical patent/US20020182764A1/en
Priority to US10/871,007 priority Critical patent/US7409257B2/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting

Definitions

  • the present invention relates to a system and a method for moving workpieces in and out of a manufacturing process. More specifically, the present invention relates to a system and a method for moving workpieces in and out of a manufacturing process for a semiconductor or a thin film transistor liquid crystal display (TFT-LCD).
  • TFT-LCD thin film transistor liquid crystal display
  • the above processes are automated, when a problem occurs in the process apparatus, an operator must be able to check the status of the process apparatus.
  • the substrates are transferred to the process apparatus in a cassette by a manually guided vehicle (MGV) that the operator manually operates.
  • MMV manually guided vehicle
  • cassettes can be moved in and out of the process apparatus using only a transfer device that corresponds to the transfer mode set in the manufacturing process apparatus. Using a transfer device that does not correspond to the set transfer mode causes an error.
  • the present invention provides a system for moving substrates in and out of a manufacturing process that has an automatic transfer device for automatically transferring a cassette that stores substrates, a manual transfer device for transferring the cassette according to instructions of an operator, and a process apparatus for performing predetermined jobs on the substrate stored in the cassette.
  • the process apparatus has a port on which the cassette is temporarily placed by the automatic transfer device or the manual transfer device, a loader having a sensor that can receive a communication start signal from the automatic transfer device when the cassette is transferred by the automatic transfer device, and a job table on which actual jobs are performed on the substrates.
  • the system checks if it is transferred by the AGV or by the MGV. If transferred by the AGV, the process apparatus automatically gets the cassette and processes the substrate. If transferred by the MGV, the system waits for the operator's instructions and processes the substrates according to the operator's instructions.
  • FIG. 1 is a block diagram of a transfer system according to a preferred embodiment of the present invention.
  • FIG. 2 is a detailed diagram of a process apparatus in FIG. 1;
  • FIGS. 3 ( a ) and ( b ) are flow charts of a transfer method according to a preferred embodiment of the present invention.
  • FIG. 1 is a diagram of a transfer system according to an embodiment of the present invention.
  • the transfer system comprises a host 100 ; an apparatus server 200 ; a process apparatus 300 ; an automated guided vehicle (AGV) 400 ; an AGV controller 500 ; and a manually guided vehicle (MGV) 600 .
  • AGV automated guided vehicle
  • MGV manually guided vehicle
  • the host 100 coupled to the apparatus server 200 and the AGV controller 500 through a network using the transmission control protocol/Internet protocol (TCP/IP), transmits and receives predetermined messages so as to exchange information or to issue control commands.
  • the AGV controller 500 receives commands from the host 100 and transmits specific commands to the AGV 400 .
  • the apparatus server 200 is coupled to the process apparatus 300 using the semiconductor equipment communications standard (SECS), and interfaces the process apparatus 300 and the host 100 .
  • SECS semiconductor equipment communications standard
  • the AGV 400 moves to the process apparatus 300 with a loaded cassette according to the commands of the AGV controller 500 .
  • the AGV 400 transmits a completion message to the AGV controller 500 .
  • the AGV controller 500 transmits a corresponding message to the host 100 through the network so that the host 100 is able to manage the status of the AGV 400 and the entire transfer system.
  • the MGV 600 is used when the operator manually transfers cassettes. In the preferred embodiment of the present invention, it is possible to transfer cassettes to the appropriate process apparatus using either AGV 400 or MGV 600 as needed.
  • FIG. 2 is a detailed diagram of the process apparatus 300 in FIG. 1.
  • the process apparatus 300 comprises a loader 350 on which the cassette transferred by the AGV 400 or MGV 600 is temporarily loaded; a job table 380 on which various processes are performed on the glass substrates in the cassette; and a transfer robot 340 that transfers the glass substrates to the job table 380 from the cassette in the loader 350 .
  • the loader 350 comprises ports 310 a and 310 b ; sensors 320 a and 320 b used to perform wireless communications with the AGV 400 ; and bar code card readers (BCR) 330 a and 330 b which read IDs of the cassettes when the cassettes are loaded on the port 310 a and the port 310 b .
  • a glass location detecting sensor (not shown), located on the port 310 a and the port 310 b , detects the position and the number of the glass substrates stored in the cassettes when the cassettes are on the port 310 a and the port 310 b .
  • a verification code reader (VCR) 370 installed on the job table 380 , reads IDs of the glass substrates.
  • the loader 350 determines whether or not the ports 310 a and 310 b can be used (S 10 ). If available, a cassette holding substrates is transferred to the process apparatus 300 through the AGV 400 or MGV 600 (S 20 ).
  • the process apparatus 300 transmits to the apparatus server 200 a load request message to load the cassette, after checking the availability of a port.
  • the apparatus server 200 then transmits this message to the host 100 .
  • the host 100 searches its own database to find the cassette holding the glass substrate to be processed in the process apparatus 300 .
  • the host 100 then calls the AGV controller 500 to issue a transfer command directing the controller 500 to move the cassette to the process apparatus 300 .
  • the AGV controller 500 then controls the AGV 400 to load the corresponding cassette to a tester in a stocker or other process apparatus.
  • the AGV transmits to the process apparatus 300 a communication start signal (hereinafter referred to as a ‘valid on signal’) that prompts a loading process, and if the cassette is transferred to the process apparatus 300 by the MGV 600 , the cassette is transferred to the process apparatus 300 by the operator's command (S 30 ).
  • a communication start signal hereinafter referred to as a ‘valid on signal’
  • the process apparatus 300 determines whether it has received a valid on signal (S 40 ). If received, the process apparatus 300 checks whether a cassette is on the ports 310 a and 310 b , and requests to load the cassette (S 50 ). The AGV 400 then loads the cassette on the process apparatus 300 (S 60 ), and the process apparatus 300 checks whether there is a cassette on the ports (S 70 ).
  • step S 40 if the process apparatus 300 determines that it has not received the valid on signal, the process is skipped to the step S 70 because the cassette may be on the ports of the process apparatus, when the cassette is transferred by the MGV, although the valid on signal is not received.
  • the process apparatus sets the transfer mode to the AGV mode (i.e., sets an AGV flag) (S 90 ).
  • the process apparatus 300 sets the transfer mode to the MGV mode (i.e., sets an MGV flag) (S 100 ).
  • the process apparatus 300 automatically chucks the cassette (S 110 ), and then reads the cassette ID with the BCR on the loader 350 (S 120 ). After checking whether there are glass substrates in the cassette and checking the position of the glass substrates via a sensor (not shown) on the ports 310 a and 310 b (S 130 ), the process apparatus 300 reports information on the cassette to the host 100 (S 140 ).
  • the cassette is chucked by the instructions of an operator (S 150 ).
  • the reason for manually chucking the cassette is that the cassette is transferred by the MGV 600 only when problems occur in the process apparatus 300 and an operator's attention is necessary.
  • the cassette IDs are read by the BCR on the loader (S 160 ). This step is the same as the AGV mode. Next, it is determined whether glass substrates are in the cassette and the position of the glass substrates is checked (S 170 ). Then, the information on the cassette is reported to the host 100 in step (S 180 ).
  • the host 100 searches its own database referring to the cassette ID, and then transfers information on the glass substrates in the cassette, information on job contents and job processes, and job recipes to the process apparatus 300 .
  • the cassette regardless of whether the cassette is transferred through the AGV mode or through the MGV mode, the cassette is placed on the ports of the process apparatus.
  • the process apparatus determines whether this cassette was transferred through the MGV mode or the AGV mode by detecting the valid on signal. Therefore, subsequent jobs are performed according to the corresponding transfer mode. This enhances productivity and efficiency.
US09/480,689 1999-02-12 2000-01-11 System and method for moving substrates in and out of a manufacturing process Abandoned US20020182764A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US10/871,007 US7409257B2 (en) 1999-02-12 2004-06-21 System and method for moving substrates in and out of a manufacturing process

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1019990004979A KR100280644B1 (ko) 1999-02-12 1999-02-12 기판의 반출입 시스템 및 반출입 방법
KR99-4979 1999-02-12

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US10/871,007 Continuation US7409257B2 (en) 1999-02-12 2004-06-21 System and method for moving substrates in and out of a manufacturing process

Publications (1)

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US20020182764A1 true US20020182764A1 (en) 2002-12-05

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US09/480,689 Abandoned US20020182764A1 (en) 1999-02-12 2000-01-11 System and method for moving substrates in and out of a manufacturing process
US10/871,007 Expired - Fee Related US7409257B2 (en) 1999-02-12 2004-06-21 System and method for moving substrates in and out of a manufacturing process

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US10/871,007 Expired - Fee Related US7409257B2 (en) 1999-02-12 2004-06-21 System and method for moving substrates in and out of a manufacturing process

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US (2) US20020182764A1 (ko)
JP (1) JP4518608B2 (ko)
KR (1) KR100280644B1 (ko)
CN (1) CN1139527C (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070097409A1 (en) * 2005-10-31 2007-05-03 International Business Machines Corporation Downstream error handling in manufacturing systems
CN107634025A (zh) * 2017-11-02 2018-01-26 湖南艾博特机器人系统有限公司 一种光伏硅晶电池片花篮输送机构

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100470363B1 (ko) * 2002-03-15 2005-02-05 (주)솔트론 엘시디 패널 점등 테스트 시스템
KR20090041883A (ko) * 2007-10-25 2009-04-29 삼성전자주식회사 웨이퍼 슬롯 가변지정에 의한 웨이퍼 로딩 및 언로딩하기위한 반도체 제조설비 및 그 방법
TWI582889B (zh) * 2009-11-19 2017-05-11 尼康股份有限公司 A substrate processing apparatus, a substrate cassette, a circuit manufacturing method, and a substrate processing method
KR101579505B1 (ko) * 2014-06-17 2015-12-23 피에스케이 주식회사 기판 처리 장치 및 기판 이송 방법
KR102319050B1 (ko) * 2017-10-27 2021-10-28 세메스 주식회사 포토 마스크 처리 장치

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6398476B1 (en) * 1997-01-24 2002-06-04 Nec Corporation Automatic storage unit and automatic storing method

Family Cites Families (4)

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Publication number Priority date Publication date Assignee Title
JPH07105430B2 (ja) * 1989-10-25 1995-11-13 三菱電機株式会社 搬送設備
US5570990A (en) * 1993-11-05 1996-11-05 Asyst Technologies, Inc. Human guided mobile loader stocker
JPH08203975A (ja) * 1995-01-23 1996-08-09 Sony Corp キャリア搬送システム
US6238160B1 (en) * 1998-12-02 2001-05-29 Taiwan Semiconductor Manufacturing Company, Ltd' Method for transporting and electrostatically chucking a semiconductor wafer or the like

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6398476B1 (en) * 1997-01-24 2002-06-04 Nec Corporation Automatic storage unit and automatic storing method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070097409A1 (en) * 2005-10-31 2007-05-03 International Business Machines Corporation Downstream error handling in manufacturing systems
US7689312B2 (en) * 2005-10-31 2010-03-30 Infoprint Solutions Company, Llc Downstream error handling in manufacturing systems
CN107634025A (zh) * 2017-11-02 2018-01-26 湖南艾博特机器人系统有限公司 一种光伏硅晶电池片花篮输送机构

Also Published As

Publication number Publication date
KR100280644B1 (ko) 2001-01-15
CN1139527C (zh) 2004-02-25
CN1263040A (zh) 2000-08-16
US7409257B2 (en) 2008-08-05
JP4518608B2 (ja) 2010-08-04
JP2000236011A (ja) 2000-08-29
US20040228707A1 (en) 2004-11-18
KR20000055998A (ko) 2000-09-15

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AS Assignment

Owner name: SAMSUNG ELECTRONICS CO., LTD., KOREA, REPUBLIC OF

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:HEO, MIN-YOUNG;BYUN, SUNG-JOON;LIM, JUNG-TEAK;AND OTHERS;REEL/FRAME:010515/0301

Effective date: 20000103

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION