US20020030480A1 - Apparatus for the automated testing, calibration and characterization of test adapters - Google Patents

Apparatus for the automated testing, calibration and characterization of test adapters Download PDF

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Publication number
US20020030480A1
US20020030480A1 US09/931,686 US93168601A US2002030480A1 US 20020030480 A1 US20020030480 A1 US 20020030480A1 US 93168601 A US93168601 A US 93168601A US 2002030480 A1 US2002030480 A1 US 2002030480A1
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US
United States
Prior art keywords
test
contact
holder
probe head
contact pins
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Abandoned
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US09/931,686
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English (en)
Inventor
Stephan Appen
Michael Hubner
Michael Kund
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Individual
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Individual
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Application filed by Individual filed Critical Individual
Publication of US20020030480A1 publication Critical patent/US20020030480A1/en
Priority to US10/965,513 priority Critical patent/US6970006B2/en
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
    • G01R31/2834—Automated test systems [ATE]; using microprocessors or computers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations

Definitions

  • the present invention relates to an apparatus for automatically testing, calibrating and characterizing test adapters for semiconductor devices.
  • the semiconductor devices are preferably integrated semiconductor circuits.
  • a test adapter may be, for example, what is referred to as a test card, by means of which semiconductor chips are tested at wafer level.
  • a test adapter is a socket board, into which individual modules are introduced for testing.
  • test cards are used, as is known, as test adapters. These test cards produce the electrical connection between contact points on the semiconductor chips in a wafer to be tested and at least one test channel in the test system.
  • FIG. 9 shows a plan view of one possible exemplary arrangement of contact surfaces 2 in an edge area 3 of a motherboard of a test card 1 . It should be understood, however, that other configurations of a test card are also feasible as an example of a test adapter.
  • the contact surfaces 2 produce a contact with the test channels in the test system, and are preferably located on a number of circles with different radii in the edge region 3 .
  • a large number of contact needles are provided on the lower face of the test card 1 , and are to fit such that they reliably make contact with the contact points on the chip at wafer level to be tested. These contact needles are preferably located in the inner area of the test card. In this case, each contact surface 2 has at least one associated contact needle. This means that the contact needles are electrically related with the associated contact surfaces 2 in a precisely defined manner.
  • the contact surfaces 2 are arranged in the form of a square, rather than in the circular configuration above.
  • test adapters such as test cards are matched to different semiconductor devices to be tested, that is, to their contact points.
  • the appropriate different test adapters are therefore required for different types of semiconductor devices.
  • the test adapters therefore make it possible to use the same test system even for different types of semiconductor devices.
  • test adapters used for testing semiconductor devices have a considerable influence on the test results, and hence also on the test yield.
  • electrical calibration and/or characterization of test adapters is an important element, which should not be underestimated, in the analysis of an overall test system.
  • test adapters In the past, scarcely any investigations have been carried out into the influence of test adapters on various electrical parameters, such as line impedance, signal delay times, signal rise times or crosstalk between their various channels in different test systems, due to the large number of channels, which is currently around 1600 for test cards and will amount to 3200 in the near future. In other words, the influence of test adapters on signal performance and signal integrity in test systems has scarcely been considered so far.
  • an apparatus for automated testing, calibration and characterization of test adapters for semiconductor devices comprises:
  • At least one probe head adjustably disposed relative to the holder, the probe head having two or more contact pins whose with an adjustable spacing distance therebetween;
  • an adjustment device configured to adjust the probe head relative to the holder.
  • the objects of the invention are achieved in the context of an apparatus of the type mentioned initially, by a holder for the test adapter and at least one probe head, which can be adjusted with respect to the holder and has at least two contact pins (whose spacing is adjustable).
  • the distance between the at least two contact pins on a probe head can be matched to the distance, which differs with different test adapters to be calibrated or wherein, between the contact surfaces for signals and the associated shields.
  • the holder can in this case hold test adapters with different diameters.
  • the apparatus according to the invention thus has, in particular, the holder which can rotate to hold test adapters with different diameters.
  • This holders allows the test adapter to be rotated in a defined manner in the apparatus.
  • a stepping motor or the like may be used as the drive for this rotation of the holder.
  • the apparatus according to the invention has one or more robot arms, which can be moved in a horizontal direction, running parallel to the plane of the test adapter, and also in a direction at right angles to this.
  • a probe head is fit on each robot arm.
  • the apparatus can be matched directly to widely differing test adapters by appropriately controlling the position of the robot arms.
  • the apparatus according to the invention can thus be matched directly to different test adapters and measurement tasks. Since, furthermore, it operates in a fully automated manner, it can carry out any desired electrical calibration and characterization of test adapters of widely differing types.
  • FIG. 1 is a plan view of a first exemplary embodiment of the apparatus according to the invention, having a robot arm with at least one probe head;
  • FIG. 2 is a schematic side view of the apparatus of FIG. 1;
  • FIG. 3 is a plan view of a second exemplary embodiment of the apparatus according to the invention, having two robot arms, each having at least one probe head;
  • FIG. 4 is a schematic side view of the apparatus in FIG. 3;
  • FIG. 5 is a schematic illustration to explain the configuration of contact pins for making contact with contact surfaces
  • FIG. 6 is a schematic illustration to explain the configuration of contact pins for making contact with contact needles
  • FIG. 7 is a plan view of a third exemplary embodiment of the apparatus according to the invention.
  • FIG. 8 is a schematic side view of the apparatus in FIG. 7;
  • FIG. 9 is a plan view of contact surfaces in the edge area of a conventional test card.
  • a test card 1 as an example of a test adapter with contact surfaces 2 on its upper face and contact needles 5 on its lower face.
  • the test card 1 is placed on a holder 4 of the apparatus, which can rotate as shown by a double arrow 6 .
  • the apparatus also has a robot arm 7 , which can be moved as shown by a double arrow 8 in elevation and in its distance from the test card 1 .
  • a probe head 9 on this robot arm 7 can be moved in two directions, as shown by the double arrow 10 .
  • This probe head 9 has two contact pins 11 , which can make contact with the contact surfaces 2 on the test card 1 . The distance between these contact pins 11 can be adjusted, so that the apparatus can be matched to different types of test cards with different distances between the contact surfaces 2 . If required, another probe head can also be provided on the robot arm 7 .
  • the probe head 9 may also have more than two contact pins 10 , if required. For example, it can thus be provided with four contact pins 11 . It is even possible to equip the contact head 11 with enough contact pins 11 for it to be able to simultaneously touch all the contact surfaces 2 which are located one behind the other in the radial direction. In the example in FIG. 1, this would be six contact pins 11 .
  • the holder 4 can be driven via a stepping motor 12 .
  • the stepping motor 12 is controlled by a central control unit 13 , which also makes it possible to control and adjust the movement of the robot arm 7 and the position of the probe head 9 , as well as the distance between the contact pins 11 .
  • the holder 4 has an edge 14 which can be moved in the lateral direction, so that it is suitable for holding test cards with different diameters or else different test adapters.
  • the apparatus shown in FIGS. 1 and 2 is particularly suitable for measuring signal delay times and line impedances: this is because only the one robot arm 7 is required in this case.
  • the probe head 9 together with the two contact pins 11 which is fit on the robot arm 7 allows automatic measurement of all the channels on the test card 1 by moving the one contact pin 11 for a test signal into contact with a contact surface 2 , while the other contact pin 11 , which is used for grounding, is in contact, for example, with an adjacent contact surface 11 .
  • the desired electrical parameters such as electrical losses, can be deduced from the delay time of the test signal reflected at the channel end, and from the magnitude of the reflected signal.
  • FIGS. 3 and 4 show a further exemplary embodiment of the present invention, wherein a second robot arm 7 ′ is provided with a second probe head 9 ′ and with two further contact pins 11 ′.
  • This second robot arm 7 ′ can be adjusted in elevation (see the double arrow 8 ′) in the same way as the robot arm 7 , and can likewise be driven from the central control unit 13 .
  • the position of the second robot arm 7 ′ can be rotated with respect to the holder 4 , as is indicated by a double arrow 6 ′.
  • the control device 13 thus controls the stepping motor 12 , the upward and downward movement of the robot arms 7 and 7 ′ (see the double arrows 8 and 8 ′), the rotational movement of the robot arm 7 ′ (see the double arrow 6 ′ in FIG. 3) and the radial movement of the probe heads 9 and 9 ′ (see the double arrows 10 and 10 ′).
  • the exemplary embodiment in FIGS. 3 and 4 is particularly suitable for measuring crosstalk effects between different channels on the test card 1 . This is because the aim of this measurement is to investigate the influence of the signals in two different channels on one another, wherein case each channel is intended to be considered together with every other channel, which leads to well over a million measurements when there are a large number of channels.
  • the robot arm 7 which cannot rotate, with the probe head 9 is connected in a case such as this via the contact pins 11 to at least one channel to be investigated.
  • the robot arm 7 ′, which can rotate, with the probe head 9 ′ is then connected via the contact pins 11 ′ to all the other channels, so that the influence of all the channels on the channels mentioned above of the robot arm 7 can be investigated in one run.
  • the probe head 9 is then connected via its contact pins 11 to the next channels, and the contact pins 10 ′, on the probe head 9 ′ are moved into contact with all the other channels. In this way, it is possible to measure successive crosstalk effects between each individual channel and all the other channels.
  • test card 1 can be rotated independently of the rotational movement of the robot arm 7 ′. If required, it is also possible to couple the rotary movement of the probe head 7 ′ to the rotary movement of the holder 4 .
  • the holder 4 is preferably designed such that it is suitable for holding different test adapters and test cards.
  • the holder 4 may, for example, have adjustable outer edges 14 so that test adapters and test cards of different diameters can be inserted into the holder 4 .
  • FIGS. 5 and 6 show examples of possible configurations of the contact pins 11 : as shown in FIG. 5, these may have pointed ends and may be sprung, so that these ends rest on the contact surfaces 2 .
  • contact pins 11 a, 11 b with flat ends (see FIG. 6), so that these flat ends can be moved into contact with the contact needles 5 of the test card 1 which is then inserted “reversed” into the holder 4 .
  • the contact pins 11 a, 11 b may have a curved profile (see reference symbols 11 and 11 a in FIGS. 5 and 6), or may be provided with a separate spring (see reference symbol 11 b in FIG. 6).
  • FIGS. 7 and 8 show an exemplary embodiment wherein signals are supplied from a test system with an interface board 17 via contact pins 16 to the contact surfaces 2 of the test card 1 , which has now been inserted “reversed”, and are passed to the contact needles 5 .
  • the signals which are otherwise present on the chip are tapped off for analysis on these contact needles 5 by means of the springs illustrated in FIG. 6.
  • the radial polar-coordinate robot arms 7 are replaced by a Cartesian (xyz) robot system which can be adjusted as shown by the arrows 10 , 15 and 18 .
  • Such a configuration provides a square arrangement for the contact needles 5 . This intrinsically allows the entire system to be analyzed.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
US09/931,686 2000-08-16 2001-08-16 Apparatus for the automated testing, calibration and characterization of test adapters Abandoned US20020030480A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US10/965,513 US6970006B2 (en) 2000-08-16 2004-10-14 Apparatus for the automated testing, calibration and characterization of test adapters

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10039928A DE10039928B4 (de) 2000-08-16 2000-08-16 Vorrichtung zum automatisierten Testen, Kalibrieren und Charakterisieren von Testadaptern
DE10039928.2 2000-08-16

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US10/965,513 Continuation US6970006B2 (en) 2000-08-16 2004-10-14 Apparatus for the automated testing, calibration and characterization of test adapters
US10/965,513 Division US6970006B2 (en) 2000-08-16 2004-10-14 Apparatus for the automated testing, calibration and characterization of test adapters

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US10/965,513 Expired - Fee Related US6970006B2 (en) 2000-08-16 2004-10-14 Apparatus for the automated testing, calibration and characterization of test adapters

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Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1498942A1 (de) * 2002-04-17 2005-01-19 Tokyo Electron Limited Signaldetektionskontaktor und signalkorrektursystem
US20080012591A1 (en) * 2006-06-09 2008-01-17 Richard Campbell Differential signal probe with integral balun
US20080045028A1 (en) * 2000-12-04 2008-02-21 Cascade Microtech, Inc. Wafer probe
US20080246498A1 (en) * 2006-06-12 2008-10-09 Cascade Microtech, Inc. Test structure and probe for differential signals
US7723999B2 (en) 2006-06-12 2010-05-25 Cascade Microtech, Inc. Calibration structures for differential signal probing
US7759953B2 (en) 2003-12-24 2010-07-20 Cascade Microtech, Inc. Active wafer probe
US7764072B2 (en) 2006-06-12 2010-07-27 Cascade Microtech, Inc. Differential signal probing system
US20100295552A1 (en) * 2009-05-25 2010-11-25 Hon Hai Precision Industry Co., Ltd. Signal testing system and method of a printed circuit board
US7898273B2 (en) 2003-05-23 2011-03-01 Cascade Microtech, Inc. Probe for testing a device under test
US8013623B2 (en) * 2004-09-13 2011-09-06 Cascade Microtech, Inc. Double sided probing structures
CN109444478A (zh) * 2018-10-29 2019-03-08 河南平高电气股份有限公司 一种三相高压电器试验用电连接装置

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Publication number Priority date Publication date Assignee Title
US7323897B2 (en) * 2004-12-16 2008-01-29 Verigy (Singapore) Pte. Ltd. Mock wafer, system calibrated using mock wafer, and method for calibrating automated test equipment
KR102038102B1 (ko) * 2013-03-07 2019-10-30 삼성디스플레이 주식회사 압착 품질 검사용 저항 측정 장치 및 이를 이용한 측정 방법
US10545173B2 (en) 2013-11-26 2020-01-28 Commscope Connectivity Uk Limited Balunless test fixture
US20220349937A1 (en) * 2021-04-30 2022-11-03 Xcerra Corporation Calibration System
US11668745B1 (en) * 2022-03-09 2023-06-06 Nanya Technology Corporation Probe apparatus having a track and wafer inspection method using the same
US11747394B1 (en) * 2022-03-09 2023-09-05 Nanya Technology Corporation Probe apparatus with a track

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US4677474A (en) * 1984-07-02 1987-06-30 Canon Kabushiki Kaisha Wafer prober
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JPH06334004A (ja) * 1993-05-25 1994-12-02 Mitsubishi Electric Corp マイクロ波帯用プロービング装置
DE4441347C2 (de) * 1994-11-21 1998-10-29 Peter Fritzsche Verfahren zum Prüfen von elektronischen Schaltungen auf Leiterplatten und Vorrichtung zum Durchführen des Verfahrens
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US4471298A (en) * 1981-12-11 1984-09-11 Cirdyne, Inc. Apparatus for automatically electrically testing printed circuit boards
US4677474A (en) * 1984-07-02 1987-06-30 Canon Kabushiki Kaisha Wafer prober
US4904934A (en) * 1987-10-21 1990-02-27 Mitsubishi Denki Kabushiki Kaisha Testing apparatus for semiconductor devices
US4985676A (en) * 1989-02-17 1991-01-15 Tokyo Electron Limited Method and apparatus of performing probing test for electrically and sequentially testing semiconductor device patterns
US4923407A (en) * 1989-10-02 1990-05-08 Tektronix, Inc. Adjustable low inductance probe
US6462556B2 (en) * 1997-10-30 2002-10-08 Nidec-Read Corporation Circuit board testing apparatus and method
US5952843A (en) * 1998-03-24 1999-09-14 Vinh; Nguyen T. Variable contact pressure probe
US6356093B2 (en) * 1998-06-02 2002-03-12 Nidec-Read Corporation Printed circuit board testing apparatus
US6137303A (en) * 1998-12-14 2000-10-24 Sony Corporation Integrated testing method and apparatus for semiconductor test operations processing
US6276956B1 (en) * 1999-04-12 2001-08-21 Sencore, Inc. Dual point test probe for surface mount type circuit board connections

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7761983B2 (en) 2000-12-04 2010-07-27 Cascade Microtech, Inc. Method of assembling a wafer probe
US20080045028A1 (en) * 2000-12-04 2008-02-21 Cascade Microtech, Inc. Wafer probe
US7688097B2 (en) 2000-12-04 2010-03-30 Cascade Microtech, Inc. Wafer probe
US20060006859A1 (en) * 2002-04-17 2006-01-12 Tokyo Electron Limited Signal detection contactor and signal calibration system
EP1498942A4 (de) * 2002-04-17 2006-05-17 Tokyo Electron Ltd Signaldetektionskontaktor und signalkorrektursystem
US7414390B2 (en) 2002-04-17 2008-08-19 Tokyo Electron Limited Signal detection contactor and signal calibration system
EP1498942A1 (de) * 2002-04-17 2005-01-19 Tokyo Electron Limited Signaldetektionskontaktor und signalkorrektursystem
US7898273B2 (en) 2003-05-23 2011-03-01 Cascade Microtech, Inc. Probe for testing a device under test
US7759953B2 (en) 2003-12-24 2010-07-20 Cascade Microtech, Inc. Active wafer probe
US8013623B2 (en) * 2004-09-13 2011-09-06 Cascade Microtech, Inc. Double sided probing structures
US20080012591A1 (en) * 2006-06-09 2008-01-17 Richard Campbell Differential signal probe with integral balun
US7723999B2 (en) 2006-06-12 2010-05-25 Cascade Microtech, Inc. Calibration structures for differential signal probing
US7764072B2 (en) 2006-06-12 2010-07-27 Cascade Microtech, Inc. Differential signal probing system
US7750652B2 (en) 2006-06-12 2010-07-06 Cascade Microtech, Inc. Test structure and probe for differential signals
US20080246498A1 (en) * 2006-06-12 2008-10-09 Cascade Microtech, Inc. Test structure and probe for differential signals
US20100295552A1 (en) * 2009-05-25 2010-11-25 Hon Hai Precision Industry Co., Ltd. Signal testing system and method of a printed circuit board
US8242798B2 (en) * 2009-05-25 2012-08-14 Hon Hai Precision Industry Co., Ltd. Signal testing system and method of a printed circuit board
CN109444478A (zh) * 2018-10-29 2019-03-08 河南平高电气股份有限公司 一种三相高压电器试验用电连接装置

Also Published As

Publication number Publication date
DE10039928B4 (de) 2004-07-15
US6970006B2 (en) 2005-11-29
DE10039928A1 (de) 2002-03-21
US20050046412A1 (en) 2005-03-03

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