US20010022395A1 - Cooling structure for multichip module - Google Patents
Cooling structure for multichip module Download PDFInfo
- Publication number
- US20010022395A1 US20010022395A1 US09/747,517 US74751700A US2001022395A1 US 20010022395 A1 US20010022395 A1 US 20010022395A1 US 74751700 A US74751700 A US 74751700A US 2001022395 A1 US2001022395 A1 US 2001022395A1
- Authority
- US
- United States
- Prior art keywords
- cooling structure
- electronic devices
- structure according
- heat
- multichip module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 39
- 239000000758 substrate Substances 0.000 claims abstract description 12
- 239000002826 coolant Substances 0.000 claims description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- 230000005855 radiation Effects 0.000 abstract description 26
- 239000004020 conductor Substances 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000005549 size reduction Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
- H01L2224/331—Disposition
- H01L2224/3318—Disposition being disposed on at least two different sides of the body, e.g. dual array
- H01L2224/33181—On opposite sides of the body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
- Y10S257/93—Thermoelectric, e.g. peltier effect cooling
Definitions
- the invention relates to a cooling structure for a multichip module and, more particularly, to a cooling structure for a multichip module having a plurality of electronic devices that generate different amounts of heat relative to each other.
- a structure for cooling a multichip module by radiating heat from one face thereof (e.g. Japanese Patent Application Laid-Open No. HEI 11-121666).
- a heat radiation body for covering a plurality of electronic devices is attached to a substrate to which the electronic devices that are different in height are mounted, with a silicon seat of high thermal conductivity being interposed among the electronic devices. Heat generated from the respective electronic devices is radiated through the heat radiation body.
- the electronic devices which are used to control electric power or the like, need to be kept below a permissible operating temperature and therefore heat generated in connection with switching operation or the like needs to be removed. Thus, it is considered important to achieve improvement of performance and size reduction in the cooling structure.
- a cooling structure for a multichip module having a plurality of electronic devices in which the devices generate different amount of heat relative to each other, comprising a first member which is provided on a first face of the multichip module and which transmits heat generated by the electronic devices to the outside of the module and a second member which is provided on a second face that is different from the first face, which is in contact with the electronic devices, and which has thermal conductivity.
- electric power may be supplied to the electronic devices through the second member. This makes it possible to economize space for the member for supplying electric power and thus to achieve further size reduction.
- FIG. 1 is a front view of the construction of a multichip module having a cooling structure according to one embodiment of the invention
- FIG. 2 is a plan view of the multichip module shown in FIG. 1 as viewed in a direction indicated by an arrow A;
- FIG. 3 is a plan view of the multichip module 20 shown in FIG. 1 as viewed in a direction indicated by an arrow B.
- FIG. 1 is a front view of the overall construction of a multichip module 20 having a cooling structure of the invention.
- FIG. 2 is a plan view of the multichip module 20 shown in FIG. 1 as viewed in a direction indicated by an arrow A.
- FIG. 3 is a plan view of the multichip module 20 shown in FIG. 1 as viewed in a direction indicated by an arrow B.
- the multichip module 20 has electronic devices 24 , 26 .
- the electronic devices 24 , 26 generate different amounts of heat.
- the electronic devices 24 , 26 are mounted to an insulated substrate 22 by means of solder. It is assumed herein that the generation of heat by the electronic device 24 is greater than that by the electronic device 26 .
- the module 20 has an electrode 32 for supplying electric power to the electronic devices 24 , 26 , a heat leveling plate 30 that makes the electronic devices 24 , 26 substantially uniform in temperature, and a heat radiation plate 40 disposed below the insulated substrate 22 . Also, an insulator 34 with high thermal conductivity is provided between the electrode 32 and the heat radiation plate 40 .
- heat generated by electronic devices is varied depending on drive conditions. While the electronic device 24 includes an IGBT, a power MOS and a power transistor, the electronic device 26 includes a diode, for example.
- the heat leveling plate 30 makes the temperatures of electronic devices 24 , 26 substantially uniform and also supplies them with electric power from the electrode 32 .
- an electrically conductive material of high thermal conductivity is used as a base material of the heat leveling plate 30 .
- the heat radiation plate 40 radiates heat to a cooling medium such as air and water and is thus made from a material of high thermal conductivity (e.g. a metal such as aluminum and stainless steel).
- a material of high thermal conductivity e.g. a metal such as aluminum and stainless steel.
- the heat radiation plate 40 may include a flow passage for the cooling medium or form a flow passage for the cooling medium in combination with another member. Fins may be provided in a portion facing the flow passage for the cooling medium to enhance cooling effect.
- the heat radiation paths of the multichip module 20 of the embodiment include a first path wherein heat generated from the electronic devices 24 , 26 flows from the heat radiation plate 40 to the cooling medium through the insulated substrate 22 , a second path wherein heat generated from the electronic device 24 flows to the cooling medium through the heat leveling plate 30 , the electronic device 26 , the insulated substrate 22 and the heat radiation plate 40 , and a third path wherein heat generated from the electronic device 24 flows to the cooling medium through the heat leveling plate 30 , the electrode 32 , the insulator 34 and the heat radiation plate 40 .
- the second and third paths both include the heat leveling plate 30 .
- the heat leveling plate 30 distributes heat generated from the electronic device 24 to the electronic device 26 and the electrode 32 . Accordingly, the electronic devices 24 , 26 and the electrode 32 become substantially uniform in temperature. As a result, in comparison with a cooling structure provided only with the first path wherein heat generated from the electronic device 24 flows from the heat radiation plate 40 to the cooling medium through the insulated substrate 22 , cooling effect of the electronic device 24 can be enhanced.
- the electronic device 26 which generates less heat than the electronic device 24 is supplied with heat from the electronic device 24 by the heat leveling plate 30 .
- the temperature of electronic device 26 becomes higher than a temperature attained by heat generation of the electronic device 26 itself.
- the permissible operating temperature of a general semiconductor device is substantially constant (e.g. approximately 150° C.) regardless of its generation of heat.
- the temperature of the electronic device 26 does not exceed the permissible operating temperature even if it has received heat generated by the electronic device 24 through the heat leveling plate 30 .
- the heat leveling plate 30 is used to make the electronic devices 24 , 26 and the electrode 32 substantially uniform in temperature. Thereby it becomes possible to enhance cooling effect of the electronic device 24 in comparison with a cooling structure which does not have the heat leveling plate 30 , and to reduce the size of the entire module.
- the heat leveling plate 30 also serves as a member for supplying electric power to the electronic devices 24 , 26 from the electrode 32 , additional wire bonding does not need for supplying electric power to the electronic devices 24 , 26 from the electrode. Consequently, the multichip module 20 can also be applied to small-size electronic devices which do not permit wire bonding. Also, it is possible to prevent complication of the multichip module.
- heat generated by the electronic devices 24 , 26 passes through the mutichip module 20 along respective paths as indicated by arrows, and the heat is radiated from the heat radiation plate 40 to the outside. Accordingly, it may be difficult to level the temperature of the heat leveling plate 30 and the temperature of the heat radiation plate 40 to be substantially equal to each other.
- the heat radiation plate 40 having substantially the same coefficient of thermal expansion as that of the heat leveling plate 30 can prevent warp of the mutichip module 20 , even if there is a temperature gap between the heat leveling plate 30 and the heat radiation plate 40 .
- the insulated substrate 22 instead of the heat radiation plate 40 , of a material having substantially the same coefficient of thermal expansion as that of the heat leveling plate 30 . It is also possible to add another member to the structure, which has the substantially the same thermal expansion as the heat leveling plate 30 .
- a body of the heat leveling plate 30 may be formed of a material which has thermal conductivity but which does not have electrical conductivity, for example, a ceramic material such as aluminum nitride and alumina.
- a wiring pattern capable of supplying electric power from the electrode 32 may be formed of a material which has electrical conductivity.
- a member for supplying electric power to the electronic devices 24 , 26 may be provided separately from the heat leveling plate 30 .
- the electronic devices 24 , 26 are sandwiched between the heat leveling plate 30 and the heat radiation plate 40 .
- the heat leveling plate 30 is provided so as to advance uniformity of temperature among the electronic devices 24 , 26 and the electrode 32 . Therefore, the electronic devices 24 , 26 may be mounted to a face of the heat leveling plate 30 which does not face the heat radiation plate 40 , for example, to a lateral face or a front face of the heat leveling plate 30 .
- the invention may be applied to a multichip module having three or more electronic devices.
- heat generated in a multichip module 20 b having four electronic devices 24 , 24 b , 26 , 26 b , as shown in FIGS. 5 and 6, can be released in the same manner as described above.
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/262,865 US6969907B2 (en) | 1999-12-21 | 2002-10-03 | Cooling structure for multichip module |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP36205899 | 1999-12-21 | ||
JP11-362058 | 1999-12-21 | ||
JP2000343677A JP2001244391A (ja) | 1999-12-21 | 2000-11-10 | マルチチップモジュールの冷却構造 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/262,865 Continuation US6969907B2 (en) | 1999-12-21 | 2002-10-03 | Cooling structure for multichip module |
Publications (1)
Publication Number | Publication Date |
---|---|
US20010022395A1 true US20010022395A1 (en) | 2001-09-20 |
Family
ID=26581343
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/747,517 Abandoned US20010022395A1 (en) | 1999-12-21 | 2000-12-21 | Cooling structure for multichip module |
US10/262,865 Expired - Lifetime US6969907B2 (en) | 1999-12-21 | 2002-10-03 | Cooling structure for multichip module |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/262,865 Expired - Lifetime US6969907B2 (en) | 1999-12-21 | 2002-10-03 | Cooling structure for multichip module |
Country Status (4)
Country | Link |
---|---|
US (2) | US20010022395A1 (ja) |
EP (1) | EP1111677B1 (ja) |
JP (1) | JP2001244391A (ja) |
DE (1) | DE60043767D1 (ja) |
Cited By (1)
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DE10260663B4 (de) * | 2001-12-27 | 2011-02-10 | DENSO CORPORATION, Kariya-shi | Kühleinheit und Halbleitervorrichtung |
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JP3673776B2 (ja) | 2002-07-03 | 2005-07-20 | 株式会社日立製作所 | 半導体モジュール及び電力変換装置 |
US7612443B1 (en) | 2003-09-04 | 2009-11-03 | University Of Notre Dame Du Lac | Inter-chip communication |
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DE102004018477B4 (de) * | 2004-04-16 | 2008-08-21 | Infineon Technologies Ag | Halbleitermodul |
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US6943293B1 (en) * | 2004-09-01 | 2005-09-13 | Delphi Technologies, Inc. | High power electronic package with enhanced cooling characteristics |
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WO2018164160A1 (ja) * | 2017-03-10 | 2018-09-13 | 株式会社村田製作所 | モジュール |
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JPH11121666A (ja) * | 1997-10-20 | 1999-04-30 | Fujitsu Ltd | マルチチップモジュールの冷却装置 |
US6393169B1 (en) * | 1997-12-19 | 2002-05-21 | Intel Corporation | Method and apparatus for providing optical interconnection |
US5930135A (en) * | 1998-01-20 | 1999-07-27 | Reliance Electric Industrial Company | Heat sink apparatus and method for making the same |
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US6144013A (en) * | 1999-07-01 | 2000-11-07 | International Business Machines Corporation | Local humidity control system for low temperature electronic module |
US20020000239A1 (en) * | 1999-09-27 | 2002-01-03 | Krishna G. Sachdev | Removal of cured silicone adhesive for reworking electronic components |
US6366461B1 (en) * | 1999-09-29 | 2002-04-02 | Silicon Graphics, Inc. | System and method for cooling electronic components |
-
2000
- 2000-11-10 JP JP2000343677A patent/JP2001244391A/ja active Pending
- 2000-12-20 DE DE60043767T patent/DE60043767D1/de not_active Expired - Lifetime
- 2000-12-20 EP EP00127971A patent/EP1111677B1/en not_active Expired - Lifetime
- 2000-12-21 US US09/747,517 patent/US20010022395A1/en not_active Abandoned
-
2002
- 2002-10-03 US US10/262,865 patent/US6969907B2/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10260663B4 (de) * | 2001-12-27 | 2011-02-10 | DENSO CORPORATION, Kariya-shi | Kühleinheit und Halbleitervorrichtung |
Also Published As
Publication number | Publication date |
---|---|
EP1111677A3 (en) | 2003-10-15 |
US20030025197A1 (en) | 2003-02-06 |
US6969907B2 (en) | 2005-11-29 |
DE60043767D1 (de) | 2010-03-18 |
EP1111677A2 (en) | 2001-06-27 |
EP1111677B1 (en) | 2010-01-27 |
JP2001244391A (ja) | 2001-09-07 |
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