US10542622B2 - Printed wiring board - Google Patents

Printed wiring board Download PDF

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Publication number
US10542622B2
US10542622B2 US16/320,399 US201716320399A US10542622B2 US 10542622 B2 US10542622 B2 US 10542622B2 US 201716320399 A US201716320399 A US 201716320399A US 10542622 B2 US10542622 B2 US 10542622B2
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Prior art keywords
power supply
supply layer
branch
printed wiring
wiring board
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US16/320,399
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US20190274214A1 (en
Inventor
Yoshitaka TOYOTA
Kengo IOKIBE
Xingxiaoyu LIN
Toshiyuki Kaneko
Masanori Naito
Toshihisa UEHARA
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Kyocera Corp
Okayama University NUC
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Kyocera Corp
Okayama University NUC
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Assigned to KYOCERA CORPORATION, NATIONAL UNIVERSITY CORPORATION OKAYAMA UNIVERSITY reassignment KYOCERA CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LIN, Xingxiaoyu, IOKIBE, KENGO, TOYOTA, YOSHITAKA, KANEKO, TOSHIYUKI, UEHARA, TOSHIHISA, NAITO, MASANORI
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/26—Power supply means, e.g. regulation thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0236—Electromagnetic band-gap structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections

Definitions

  • the present disclosure relates to a printed wiring board having an electromagnetic band gap structure.
  • a multilayer printed wiring board having a noise suppression part or noise propagation suppression is considered to be used for suppressing parallel plate resonance or high-frequency noise propagation generated between a power supply layer and a ground layer in the multilayer printed wiring board.
  • a capacitor is used for reducing noises in a power supply system in the multilayer printed wiring board.
  • an electromagnetic band gap (EBG) structure is used between the power supply layer and the ground layer in order to suppress noise propagation.
  • EBG electromagnetic band gap
  • a printed wiring board of the present disclosure includes a power supply layer and a ground layer.
  • a power supply layer pattern to be formed in the power supply layer includes a branch that is a direct-current power feeding path connecting adjacent EBG unit cells, and a power supply layer electrode that is connected through a slit disposed along the branch.
  • a capacitive coupling element that is disposed to oppose the power supply layer electrode with an interlayer being provided between the capacitive coupling element and the power supply layer electrode has a structure in which EBG unit cells to be connected to the branch of the power supply layer pattern through a via are disposed at regular intervals.
  • FIG. 1 is an explanatory diagram illustrating a printed wiring board according to one embodiment of the present disclosure.
  • FIG. 2( a ) is an explanatory diagram illustrating an EBG structure provided in the printed wiring board illustrated in FIG. 1 according to one embodiment
  • FIG. 2( b ) is an explanatory diagram illustrating a power supply layer pattern included in the EBG structure
  • FIG. 2( c ) is an explanatory diagram illustrating a capacitive coupling element included in the EBG structure.
  • FIG. 3 is an equivalent circuit diagram of a parallel resonance circuit included in an EBG unit cell for describing a principle of downsizing achieved by providing a two-layer structure to a power supply electrode of the present disclosure.
  • FIG. 4 is a graph illustrating an electromagnetic field simulation result indicating that a resonance frequency of the parallel resonance circuit depends on a distance between the power supply layer electrode and the capacitive coupling element.
  • FIG. 5 is an explanatory diagram illustrating the printed wiring board for the electromagnetic field simulation for transmission characteristic according to one embodiment.
  • FIG. 6 is a graph illustrating the electromagnetic field simulation result using the printed wiring board of FIG. 5 .
  • FIG. 7( a ) is an explanatory diagram illustrating the EBG structure according to another embodiment
  • FIG. 7( b ) is an explanatory diagram illustrating the power supply layer pattern included in the EBG structure
  • FIG. 7( c ) is an explanatory diagram illustrating the capacitive coupling element included in the EBG structure.
  • FIG. 8 illustrates an equivalent circuit of a resonance circuit portion included in EBG unit cells configuring the EBG structure illustrated in FIG. 7( a ) .
  • FIG. 9 is a graph illustrating an electromagnetic field simulation result for obtaining a resonance frequency of the resonance circuit in the EBG unit cells illustrated in FIG. 7( a ) .
  • FIG. 10( a ) is an explanatory diagram illustrating the EBG structure according to still another embodiment
  • FIG. 10( b ) is an explanatory diagram illustrating the power supply layer pattern included in the EBG structure
  • FIG. 10( c ) is an explanatory diagram illustrating the capacitive coupling element included in the EBG structure.
  • an EBG structure In a capacitor used generally, a noise suppression effect cannot be expected at a few hundred or more MHz due to an influence of an equivalent series inductance (an ESL). Provision of an electromagnetic band gap (EBG) structure on a substrate is effective for the noise propagation suppression at a frequency equal to or more than 1 GHz.
  • EBG electromagnetic band gap
  • downsizing of the EBG structure is essential for practical use, and an EBG structure that uses an open stab that is easily downsized is reported.
  • a via has to be formed in an interlayer between a power supply layer and a ground layer, and thus this structure is disadvantageous from a viewpoint of a cost.
  • an EBG structure where a via is not formed in the interlayer between the power supply layer and the ground layer is hardly downsized.
  • the EBG structure provided to a printed wiring board of the present disclosure can be further downsized by forming a two-layer structure of a power supply electrode in which a capacitive coupling element is added to a power supply layer even if a via is not formed in the interlayer between the power supply layer and the ground layer.
  • the printed wiring board of the present disclosure will be described in detail below.
  • a printed wiring board 1 includes, as illustrated in FIG. 1 , a power supply layer 2 and a ground layer 3 .
  • the power supply layer 2 partially has an EBG structure 4 .
  • An insulating layer 9 is disposed between the power supply layer 2 and the ground layer 3 .
  • the power supply layer 2 and the ground layer 3 are formed by a solid pattern including an electrically conductive material such as copper.
  • a thickness of the power supply layer 2 is not particularly limited, and for example, about 18 to 70 ⁇ m.
  • a thickness of the ground layer 3 is also not particularly limited, and for example, about 18 to 70 ⁇ m.
  • the insulating layer 9 is formed on an upper surface of the power supply layer 2 and on a lower surface of the ground layer 3 , namely, between the power supply layer 2 and the ground layer 3 .
  • the insulating layer 9 is not particularly limited as long as it is formed by an insulating material.
  • the insulating material are organic resins such as an epoxy resin, a bismaleimide-triazine resin, a polyimide resin, and a polyphenylene ether resin. Two or more kinds of these organic resins may be mixed.
  • a reinforcement material may be blended to the organic resin.
  • the reinforcement material are insulating fabric materials such as a glass fiber, a glass nonwoven fabric, an aramid nonwoven fabric, an aramid fiber, and a polyester fiber. Two or more kinds of the reinforcement materials may be used. Further, the insulating material may include an inorganic filler such as silica, barium sulfate, talc, clay, glass, calcium carbonate, or titanium oxide.
  • the EBG structure 4 is configured by one-dimensionally disposing a plurality of EBG unit cells 41 in a direction along the branch at regular intervals or two-dimensionally disposing the plurality of EBG unit cells 41 also in a direction orthogonal to the direction along the branch at regular intervals.
  • the EBG structure 4 will be described with reference to FIGS. 2( a ) to 2( c ) .
  • the three EBG unit cells 41 are disposed in the direction along the branch, but a disposing form can be changed appropriately according to a usage pattern.
  • EBG unit cells 41 In the EBG unit cells 41 , as illustrated in FIG. 2( a ) , capacitive coupling elements 43 are disposed above a power supply layer pattern 42 with an interlayer being provided therebetween. Since the EBG unit cells 41 are disposed in the printed wiring board 1 at a design stage, a mounting cost after manufacturing the printed wiring board is not necessary differently from a noise suppression part.
  • a shape of the EBG unit cells 41 is not particularly limited, but an approximately rectangular shape that achieves a less disposing space is preferable.
  • the power supply layer pattern 42 is structured, as illustrated in FIG. 2( b ) , by connecting the adjacent EBG unit cells 41 through a branch 45 that is as thin as a direct current necessary for feeding power can be caused to flow.
  • Power supply layer electrodes 47 are disposed to be connected at ends to the branch 45 across the slits 46 .
  • the power supply layer pattern 42 has at least one via 44 a that is connected to vias 44 b of the capacitive coupling elements 43 .
  • the “ends” mean ends of sides of the power supply layer electrodes 47 opposing the branch 45 across the slits 46 in the EBG unit cells 41 , specifically positions between ends (corners) opposite to the vias 44 a and about one-eighths length of the sides.
  • the capacitive coupling elements 43 have, as illustrated in FIG. 2( c ) , at least one via 44 b to be connected to the via 44 a of the power supply layer pattern 42 .
  • the capacitive coupling elements 43 are disposed to be superimposed on the power supply layer electrodes 47 .
  • the capacitive coupling elements 43 are formed by an electrically conductive material such as copper.
  • the capacitive coupling elements 43 may be formed by an electrically conductive material identical to the material of the power supply layer pattern 42 .
  • the power supply layer electrodes 47 and the capacitive coupling elements 43 form parallel plate capacitors, and realize capacitive coupling (coupling capacitances Cs).
  • a parallel resonance circuit illustrated in FIG. 3 is formed in the EBG unit cells 41 by a series circuit configured by an inductance Lb of the branch 45 and an inductance Lv of the coupling capacitance Cs and the via 44 .
  • a prevention area where an electromagnetic wave does not propagate in a band around 2.4 GHz can be set by designing the inductance Lb and the coupling capacitance Cs so that a resonance frequency becomes 2.4 GHz.
  • shapes and gaps of the power supply layer electrodes 47 and the capacitive coupling elements 43 are designed so that the coupling capacitance Cs increases, the resonance frequency can be reduced, and the EBG structure 4 can be downsized.
  • the branch 45 is for causing the direct current necessary for feeding power to flow, and is disposed in the EBG unit cells 41 .
  • the power supply layer electrodes 47 for forming the parallel plate capacitors are disposed through the slits 46 .
  • the capacitive coupling elements 43 to be counter electrodes are disposed on the power supply layer electrodes 47 , respectively, so that an interlayer is provided therebetween.
  • a thickness of the interlayer between the power supply layer electrodes 47 and the capacitive coupling elements 43 may be equal to or less than 25 ⁇ m, or may be 5 ⁇ m to 20 ⁇ m in order to sufficiently provide the coupling capacitance Cs.
  • the branch 45 may be disposed in any positions of the EBG unit cells 41 .
  • a width of the branch 45 and sizes of the EBG unit cells 41 are 0.25 mm square and 2.0 mm square, respectively.
  • the parallel plate capacitors are formed by disposing the capacitive coupling elements 43 above the power supply layer electrodes 47 in such a manner, and thus the capacitive coupling is realized.
  • the coupling capacitances Cs are provided in the interlayer between the power supply layer electrodes 47 and the capacitive coupling elements 43 . Ends of the branch 45 and the power supply layer electrodes 47 are electrically connected and the branch 45 and the capacitive coupling elements 43 are electrically connected at the vias 44 provided to the other ends of the branch 45 .
  • the parallel resonance circuits are formed between the coupling capacitances Cs and the inductances Lb generated in the branch 45 in the EBG unit cells 41 .
  • FIG. 3 illustrates an equivalent circuit of a parallel resonance circuit portion included in the EBG unit cells 41 illustrated in FIG. 2( a ) .
  • symbol Lb represents an inductance component of the branch 45 .
  • symbol Cs represents coupling capacitances of the power supply layer electrodes 47 and the capacitive coupling elements 43 obtained by dividing the power supply layer pattern 42 by the slits 46 .
  • Symbol Lv represents inductance components of paths for connecting between the power supply layer pattern 42 and the capacitive coupling elements 43 through the vias 44 ( 44 a , 44 b ).
  • the inductance components Lv depends on a thickness of the interlayer between the power supply layer electrodes 47 and the capacitive coupling elements 43 , but the thickness may be ignored as a design as long as the thickness is sufficiently thin. In a case where accuracy is achieved, the equivalent circuit can be designed by taking sizes of the inductance component Lv into consideration.
  • FIG. 4 illustrates a graph obtained by checking the resonance frequencies of the parallel resonance circuits included in three EBG structures (25 ⁇ m thickness, 12 ⁇ m thickness, and 8 ⁇ m thickness) that are identical to the EBG structure illustrated in FIG. 2 but have different thicknesses of the interlayer between the power supply layer electrodes and the capacitive coupling elements, respectively, through the electromagnetic field simulation.
  • the resonance frequency was 3.45 GHz.
  • the resonance frequency becomes 2.4 GHz and 1.9 GHz in 12 ⁇ m thickness and 8 ⁇ m thickness respectively, and as the thickness is thinner, the resonance frequency shifts to a lower frequency side. This means that as the thickness of the interlayer between the power supply layer electrodes and the capacitive coupling elements is made to be thinner, the EBG structure can be smaller.
  • FIG. 5 is an explanatory diagram illustrating a printed wiring board 10 for a transmission characteristic simulation of according to one embodiment.
  • a port 51 is separated from ports 52 , 53 by an EBG structure 40 .
  • the EBG structure 40 is configured by disposing three EBG unit cells 41 in a longitudinal direction of the printed wiring board 10 and 24 EBG unit cells 41 in a cross-sectional direction.
  • the longitudinal direction of the printed wiring board 10 is equal to the direction along the branch where the EBG unit cells 41 are disposed.
  • the EBG unit cells 41 have the shape equal to the shape illustrated in FIG.
  • a thickness of the interlayer between the power supply layer electrodes and the capacitive coupling elements is 12 ⁇ m, and the EBG unit cells 41 are 2.0 mm square.
  • a width of the EBG structure 40 is 6.0 mm in the longitudinal direction and 48.0 mm in the cross-sectional direction.
  • the ground layer and the insulating layer in a thickness direction of the printed wiring board 10 are omitted.
  • FIG. 6 illustrates a result of evaluating the transmission characteristic between the port 51 and the port 52 and between the port 51 and the port 53 through the electromagnetic field simulation using the printed wiring board 10 .
  • a thick line indicates permeability characteristic in a case where the EBG structure 40 is provided, and a thin line indicates transmission characteristic in a case (Reference) where the EBG structure 40 is not provided (a solid structure).
  • S 21 in the drawing indicates between the port 51 and the port 52
  • S 31 indicates between the port 51 and the port 53 .
  • the transmission amount decreases by 20 dB or more at about 2.4 GHz, and a prevention area where a high-frequency electromagnetic wave noise does not propagate is formed.
  • EBG structure 4 ′ An EBG structure 4 ′ according to another embodiment will be described below with reference to FIGS. 7( a ) to 7( c ) .
  • Members in the EBG structure 4 ′ identical to members in the EBG structure 4 according to one embodiment are denoted by identical symbols, and detailed description thereof is omitted.
  • a power supply layer pattern 42 ′ is configured by, as illustrated in FIGS. 7( a ) and 7( b ) , connecting the adjacent EBG unit cells 41 through the branch 45 , and disposing the power supply layer electrodes 47 connected to the branch 45 at portions other than ends across the slits 46 .
  • the portions other than the ends mean portions other than the above-described “ends”, namely, portions between positions of about 1 ⁇ 8 length of sides from ends (corners) opposite to the vias 44 a and ends (corners) on the via 44 a side.
  • a thickness of the interlayer between the power supply layer electrodes 47 and the capacitive coupling elements 43 is 12 ⁇ m.
  • FIG. 8 illustrates an equivalent circuit of a parallel resonance circuit portion included in EBG unit cells 41 illustrated in FIG. 7( a ) .
  • symbol L b /2 represents an inductance component of the branch 45 .
  • symbol Cs represents coupling capacitances of the power supply layer electrodes 47 and the capacitive coupling elements 43 obtained by dividing the power supply layer pattern 42 ′ by the slits 46 .
  • the inductance component is L b /2.
  • Denominator takes various values depending on connecting positions.
  • FIG. 9 is a graph illustrating an electromagnetic field simulation result for obtaining a resonance frequency of the parallel resonance circuit in the EBG structure 4 ′ illustrated in FIG. 7( a ) .
  • a prevention area where electromagnetic noise propagation is suppressed at a band of 3.3 GHz can be set in the EBG structure 4 ′.
  • the “end” in the graph indicates a result of the above-described EBG unit cells 41 (12 ⁇ m thickness).
  • the EBG structure does not have the via of the power supply layer and the ground
  • the EBG structure (the EBG unit cell) can be downsized. Further, since the EBG structure is disposed in the printed wiring board at a design stage, a mounting cost after manufacturing the printed wiring board is not necessary.
  • a frequency to be applied can be changed by comparatively easy design change such that a connecting position is changed.
  • the branch may be disposed in any position in the EBG unit cell.
  • a branch 45 ′ is disposed in an approximately center portion of the EBG unit cell 41 .
  • Members in the EBG structure 4 ′ identical to members in the EBG structure 4 according to one embodiment are denoted by identical symbols, and detailed description thereof is omitted.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
US16/320,399 2016-07-27 2017-07-20 Printed wiring board Active US10542622B2 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2016-147671 2016-07-27
JP2016147671 2016-07-27
JP2017013647 2017-01-27
JP2017-013647 2017-01-27
PCT/JP2017/026331 WO2018021150A1 (ja) 2016-07-27 2017-07-20 印刷配線板

Publications (2)

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US20190274214A1 US20190274214A1 (en) 2019-09-05
US10542622B2 true US10542622B2 (en) 2020-01-21

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US (1) US10542622B2 (ko)
JP (1) JP6611066B2 (ko)
KR (1) KR102188294B1 (ko)
CN (1) CN109496460B (ko)
TW (1) TWI658768B (ko)
WO (1) WO2018021150A1 (ko)

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JP6804261B2 (ja) * 2016-10-27 2020-12-23 京セラ株式会社 中継用印刷配線板
JP6884616B2 (ja) * 2017-02-24 2021-06-09 京セラ株式会社 印刷配線板
KR102273378B1 (ko) * 2019-12-17 2021-07-06 국방기술품질원 전자기 밴드갭 구조물

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CN109496460B (zh) 2021-09-21
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KR20190021401A (ko) 2019-03-05
JP6611066B2 (ja) 2019-11-27
US20190274214A1 (en) 2019-09-05
CN109496460A (zh) 2019-03-19
TW201811141A (zh) 2018-03-16
TWI658768B (zh) 2019-05-01

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