US10488270B2 - Platinum temperature sensor element - Google Patents

Platinum temperature sensor element Download PDF

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Publication number
US10488270B2
US10488270B2 US15/784,695 US201715784695A US10488270B2 US 10488270 B2 US10488270 B2 US 10488270B2 US 201715784695 A US201715784695 A US 201715784695A US 10488270 B2 US10488270 B2 US 10488270B2
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lead wires
sensor element
temperature sensor
electrodes
paste
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US15/784,695
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US20180106687A1 (en
Inventor
Ryusuke SUZUKI
Takumi ASHIKAWA
Katsuya Miura
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Koa Corp
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Koa Corp
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Assigned to KOA CORPORATION reassignment KOA CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ASHIKAWA, TAKUMI, MIURA, KATSUYA, SUZUKI, RYUSUKE
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G01K7/18—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G01K7/18—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer
    • G01K7/183—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer characterised by the use of the resistive element
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P5/00—Measuring speed of fluids, e.g. of air stream; Measuring speed of bodies relative to fluids, e.g. of ship, of aircraft
    • G01P5/10—Measuring speed of fluids, e.g. of air stream; Measuring speed of bodies relative to fluids, e.g. of ship, of aircraft by measuring thermal variables
    • G01P5/12—Measuring speed of fluids, e.g. of air stream; Measuring speed of bodies relative to fluids, e.g. of ship, of aircraft by measuring thermal variables using variation of resistance of a heated conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/1406—Terminals or electrodes formed on resistive elements having positive temperature coefficient
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C3/00—Non-adjustable metal resistors made of wire or ribbon, e.g. coiled, woven or formed as grids
    • H01C3/10—Non-adjustable metal resistors made of wire or ribbon, e.g. coiled, woven or formed as grids the resistive element having zig-zag or sinusoidal configuration
    • H01C3/12—Non-adjustable metal resistors made of wire or ribbon, e.g. coiled, woven or formed as grids the resistive element having zig-zag or sinusoidal configuration lying in one plane
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • H01C7/021—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient formed as one or more layers or coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/06—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material including means to minimise changes in resistance with changes in temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/22—Elongated resistive element being bent or curved, e.g. sinusoidal, helical

Definitions

  • the present invention relates to a platinum temperature sensor element used in an air-flow sensor for measuring air intake passing through an air inlet pipe, for example.
  • air intake in internal combustion engines has been measured by providing an air-flow sensor within an air inlet pipe in order to inject fuel in accordance with the quantity of air intake.
  • air-flow sensors are also used for air-flow control in air conditioning equipment in a building, factory, etc., and control of wind speed and air flow etc. in environmental equipment.
  • a hot type also called a hot wire type
  • platinum hot wire platinum hot wire
  • a cold type that measures air temperature as is. Since either type of sensor needs to be placed within an air flow and to measure the temperature of the air accurately, it is necessary to control fluctuation in element resistance, fluctuation in TCR (temperature coefficient of resistance), fluctuation in how heat dissipates, and fluctuation due to turbulence of air flow around the element, etc.
  • Platinum is used in thin-film temperature sensors that require heat resistance as it has stable properties and excellent resistance-temperature characteristics.
  • Such thin-film temperature sensors have lead wires welded to electrode parts, and an insulating material, such as glass or a conductive material including a precious metal for reinforcing connections applied on the welded parts so as to strengthen the connections.
  • Patent Document 1 discloses a thin-film thermistor having an Au—Pt layer formed on welded parts of an Au—Pt electrode film and lead wires on a substrate, and further covered with a glass layer so as to improve conductivity and heat resistance.
  • Patent Document 2 discloses a technique of providing electrode pads made of an Au—Pt alloy on the substrate of a gas sensor, connecting the lead wires to the pads for the purpose of improving durability of the gas sensor against change in temperature, maintaining connection strength of lead wires to the electrode pads, and further increasing the connection strength of the lead wires, and then covering them with a protective film.
  • Patent Document 1 JP S62-111402A
  • Patent Document 2 JP H9-68512A
  • the above-given conventional thermistor has a problem that if a glass paste material or a paste material including glass is used as a connection reinforcing material between the electrode pads and the lead wires on the substrate, stress is applied on the welded parts through compressive stress and tensile stress due to difference in thermal expansion of the glass, thereby generating cracks. Glass easily cracks, and therefore welded parts lack electrical reliability when reinforced by only glass, wherein such reinforcement can be considered a cause for damage.
  • Patent Document 2 discloses gold (Au), which can be calcined at a low temperature and easily bonded to pads and lead wires, used as a favorable material for a protective film.
  • Au is an expensive material and would increase costs of a sensor etc.
  • the present invention is devised in light of these problems, and aims to secure connection strength between lead wires and internal electrodes of a platinum temperature sensor element.
  • a platinum temperature sensor element is characterized by including: an insulating substrate having a planar rectangular shape made of an insulating material with a predetermined thickness; a pattern made of a platinum resistance film formed on the insulating substrate; a pair of electrodes formed on either end along the length of the insulating substrate; lead wires that are joined to the pair of electrodes and extend to the outside; and a protective film that is formed on a top side of the insulating substrate to cover the pattern, the pair of electrodes, and top surfaces of joined regions of the lead wires to the pair of electrodes.
  • One side surfaces of the lead wires and top surfaces of the pair of electrodes on the one side surfaces are covered with a reinforcement paste on the joined regions.
  • a concave part for housing the lead wires is characterized by being formed on each of the pair of electrodes.
  • multiple regions on the one side surfaces of the lead wires on the joined regions, or multiple regions on the one side surfaces and the other side surfaces of the lead wires on the joined regions are characterized by being covered with the reinforcement paste.
  • the pair of electrodes, a surface protective material for the lead wires, and the reinforcement paste are characterized by being made of a common precious metal material.
  • the precious metal material is characterized by including at least platinum.
  • a platinum temperature sensor element that reduces thermal-stress load on a connecting part of lead wires and internal electrodes, and does not generate cracks may be provided.
  • FIG. 1 is a diagram illustrating an external structure of a temperature sensor element according to an embodiment of the present invention
  • FIG. 2A is a cross-section of the temperature sensor element of FIG. 1 viewed from the horizontal direction;
  • FIG. 2B is a cross-section of the temperature sensor element of FIG. 1 viewed from the vertical direction;
  • FIG. 3A is a perspective view of a portion indicated by a circle A in FIG. 2 ;
  • FIG. 3B is a cross-section of the sensor element illustrated in FIG. 3A cut along a line B-B′ indicated by arrows;
  • FIG. 4 is a diagram illustrating a modification of an area to be covered with a reinforcing paste formed on one side surface of a lead wire;
  • FIG. 5A is a diagram illustrating a modification of reinforcing regions when covering a lead wire and an internal electrode with a reinforcing paste.
  • FIG. 5B is a diagram illustrating another modification of reinforcing regions when covering a lead wire and an internal electrode with a reinforcing paste.
  • FIG. 1 illustrates an external structure of a temperature sensor element according to the embodiment of the present invention.
  • FIG. 2A is a cross-section of a structure of the temperature sensor element of FIG. 1 when viewed from an X direction (horizontal direction)
  • FIG. 2B is a cross-section of a structure of the same when viewed from a Y direction (vertical direction).
  • a temperature sensor element 10 includes an element main body 12 and lead wires 15 a and 15 b , which are led from either end of the element main body 12 along the length thereof.
  • the temperature sensor element 10 has an overall square-columnar shape (prismatic bar) without any irregularities on the outer surface, and the shape of the cross-section (vertical cross-sectional shape or transverse cross-sectional shape) orthogonal to the length of the element is approximately square even at any location along the length of the element.
  • internal electrodes (electrode pads) 25 a and 25 b are formed on either top end of a substrate 21 that has a planar rectangular shape and a predetermined thickness, and a resistance film 23 made in a predetermined pattern is formed between the internal electrodes 25 a and 25 b .
  • ends of the lead wires 15 a and 15 b are connected to the internal electrodes 25 a and 25 b , respectively, by welding or the like.
  • a protective film 27 is formed on the top side of the substrate 21 so as to cover the internal electrodes 25 a and 25 b , the resistance film 23 , and the top surfaces of joined regions of the lead wires 15 a and 15 b connected to the internal electrodes 25 a and 25 b , and a surface layer protective film 29 is formed covering the entire protective film 27 .
  • the temperature sensor element 10 has length L (length along the length of the substrate 21 ) of 2 mm, for example, height H (height at the center along the length) of 0.6 mm, for example, and width W (also width of the substrate 21 ) of 0.4 mm, for example.
  • the substrate 21 is made of an electric insulating ceramic substrate or an alumina substrate (Al 2 O 3 ), etc. having a thickness of approximately 0.3 mm, for example.
  • the resistance film 23 formed on the substrate 21 is a thin resistance film (platinum resistance film pattern) made of platinum (Pt).
  • the lead wires 15 a and 15 b are platinum-covered nickel core wires having a diameter of 0.15 mm, for example.
  • the internal electrodes 25 a and 25 b are printed using an electrode paste containing platinum or the like, for example.
  • the protective film 27 and the surface layer protective film 29 (referred to hereafter as protective films 27 and 29 ) are made of heat-resistant glass, for example, having a small linear expansion coefficient.
  • the longitudinal cross-section of the protective films 27 and 29 has a shape that is thickest at the center along the length of the element and decreases slightly as it approaches either end, as illustrated in FIG. 2A . More specifically, thickness ‘a’ of the protective films 27 and 29 at the center is 0.35 mm, for example, and thicknesses of the top surfaces of joined regions to the lead wires 15 a and 15 b are 130 to 180 ⁇ m, for example.
  • the entire temperature sensor element 10 has a square columnar (prismatic bar) shape formed by the protective films making the top surfaces of joined regions of the lead wires 15 a and 15 b connected to the internal electrodes 25 a and 25 b have a fixed thickness, and the vertical cross sectional shape orthogonal to the length of the element has nearly a square shape even at any portion along the length, as described above.
  • provision of the protective films 27 and 29 on top of the lead wires 15 a and 15 b allows fixation of the lead wires on the substrate.
  • the temperature sensor element 10 is a self-heating element using a platinum hot wire (a platinum heating coil).
  • the center part of the resistance film 23 is a heating part 23 a made of a meander-shaped pattern that self-heats once an electric current is applied.
  • the heating part 23 a is positioned nearly at the center in the longitudinal direction and the width direction of the substrate 21 when viewed from above, and is positioned nearly at the center even along the thickness of the temperature sensor element 10 since it is between the substrate 21 and the protective films 27 and 29 .
  • the heating part 23 a of the temperature sensor element 10 is positioned at nearly the center of the resistance film pattern and at nearly the center of the height and width directions of the sensor element, the vicinity of the center of the temperature sensor element is a heat-generating point. That is, since provision of a heat-generating configuration at the center of the sensor element rids deviation of heat generation and makes heat release to the lead wires 15 a and 15 b constant and stabilized, there is an advantage that adjustment of heat release can be reduced to a minimum (only a small span of adjustable range is necessary.)
  • FIG. 3A is a perspective view of a portion indicated by dotted-line circles A in FIGS. 2A and 2B
  • FIG. 3B is a cross-section of the sensor element illustrated in FIG. 3A cut along a line B-B′ indicated by arrows. Note that the protective films formed on top of the lead wires in FIGS. 3A and 3B are omitted from the drawings.
  • the temperature sensor element according to the embodiment has one side surface (one side) 33 of the lead wire 15 a and a top surface of the internal electrode 25 a on the same side as the one side surface of the lead wire covered with a reinforcement paste 31 a without covering with the reinforcement paste the entire lead wire 15 a that is welded and connected to the internal electrode 25 a , as illustrated in FIG. 2 and FIG. 3 .
  • the reinforcement paste 31 a is made of a platinum paste containing glass, for example.
  • Covering only one side surface 33 of the lead wire 15 a and the top surface of the internal electrode 25 a on the same side in this manner is for obtaining fixing strength of a protective film (glass reinforcing film) formed on top of the lead wire after the covering process, and obtaining overall strength of the protective film and the internal electrode. Therefore, covering a large part of the internal electrode with the reinforcement paste is not desirable from the viewpoint of securing a large area of the internal electrode that is not covered with the reinforcement paste.
  • the reinforcement paste 31 a When covering the one side surface of the lead wire 15 a with a reinforcement paste as described above, the reinforcement paste 31 a is filled in from diagonally above as indicated by an arrow C in FIG. 3B using a dispenser or the like. At this time, the reinforcement paste 31 a is aligned to a welded point where the lead wire 15 a is welded and connected to the internal electrode 25 a so as to be filled in. The filled-in reinforcement paste is then calcined at a temperature of 800° C. to 850° C., for example.
  • a concave groove (depression) 35 is formed in the internal electrode 25 a through an electrode printing process, for example. The same holds true for the internal electrode 25 b . This allows holding of the lead wire 15 a at the center along the width of the substrate 21 , and prevention of shifting when welding together the lead wire 15 a and the internal electrode 25 a . Depth of the concave groove 35 should be thick enough to secure the thickness of the internal electrode 25 a below the welded lead wire 15 a.
  • the temperature sensor element according to the embodiment has such a structure as, when reinforcing the lead wire welded and connected on the internal electrode, one side surface (one side) of each of the lead wires and the top surface of each of the internal electrodes on the same side as the one side surface are covered with a reinforcement paste, and the other side surface of each of the lead wires and the top surface of each of the internal electrodes on the other side are not covered with the reinforcement paste.
  • not covering the entire periphery of the lead wires with a reinforcement paste allows reduction in thermal-stress load (stress) due to heating, cooling etc. of the heating part of the temperature sensor element, and elimination of the cause of cracks generating in welded portions, etc.
  • sufficient joining strength between the internal electrode and the lead wire can be secured, and conductivity between the internal electrode and the lead wire can be reinforced.
  • the region covered with the reinforcement paste 31 a on the one side surface 33 of the lead wire 15 a reaches the vicinity of the top of the lead wire 15 a , as illustrated in FIGS. 2 and 3 , but the region to be covered is not limited thereto.
  • a region to be covered by a reinforcement paste 41 on one side surface of the lead wire 15 a may be reduced so as not to reach the top (indicated by S in the drawing) of the lead wire so that the internal electrode 25 a and the lead wire 15 a are joined together using the reinforcement paste 41 . This allows control of filling amount of the reinforcement paste so as to secure joining strength between the internal electrode and the lead wire using a minimum amount of the reinforcement paste.
  • the number of reinforcing regions on the lead wire using a reinforcement paste is one for each lead wire in the example of FIGS. 2 and 3 but is not limited thereto. As long as such a structure as a reinforcement paste is covering one side surface of a lead wire and the top surface on one side of an internal electrode is adopted, two reinforcing regions may be provided on the one side surface of the lead wire.
  • reinforcement pastes 43 and 45 formed in two places, as illustrated in FIG. 5A may cover one side surface of the lead wire 15 a and the top surface on one side of the internal electrode 25 a.
  • a structure providing a reinforcement at a total of two places is possible by providing one reinforcing region using the reinforcement paste 47 for covering one side surface of the lead wire 15 a and the top surface on one side of the internal electrode 25 a , and providing one reinforcing region using the reinforcement paste 49 for covering the other side surface of the lead wire 15 a and the top surface on the other side of the internal electrode 25 a.
  • a reinforcing region is a position away from the welded point (indicated by P in the drawing) at which the lead wire 15 a is welded and connected to the internal electrode 25 a in which the reinforcement paste is filled.
  • the lead wire 15 a and the internal electrode 25 a are joined and reinforced at multiple regions.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Measuring Volume Flow (AREA)
US15/784,695 2016-10-17 2017-10-16 Platinum temperature sensor element Active US10488270B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016-203846 2016-10-17
JP2016203846 2016-10-17
JP2016203846A JP6821384B2 (ja) 2016-10-17 2016-10-17 白金温度センサ素子

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US10488270B2 true US10488270B2 (en) 2019-11-26

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TW (1) TW201819872A (ja)

Cited By (1)

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US20220044849A1 (en) * 2020-08-05 2022-02-10 Koa Corporation Circuit substrate

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* Cited by examiner, † Cited by third party
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US11226244B2 (en) * 2019-01-30 2022-01-18 Sensata Technologies, Inc. Automotive exhaust gas sensor with two calibration portions
JP2022178388A (ja) * 2021-05-20 2022-12-02 Koa株式会社 センサ素子

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US4213113A (en) * 1978-09-08 1980-07-15 Allen-Bradley Company Electrical resistor element and method of manufacturing the same
JPS62111402A (ja) 1985-11-08 1987-05-22 松下電器産業株式会社 薄膜サ−ミスタ
US5735606A (en) * 1995-02-15 1998-04-07 Murata Manufacturing Co., Ltd. Platinum temperature sensor
JPH0968512A (ja) 1995-06-19 1997-03-11 Figaro Eng Inc ガスセンサ
US6543102B1 (en) * 1998-03-26 2003-04-08 Sensotherm Temperatursensorik Gmbh Sensor component
US6437681B1 (en) * 1999-10-27 2002-08-20 Cyntec Company Structure and fabrication process for an improved high temperature sensor
US7339455B2 (en) * 2004-03-08 2008-03-04 Ngk Spark Plug Co., Ltd. Platinum resistor temperature sensor
US7746212B2 (en) * 2004-07-15 2010-06-29 Heinrich Zitzmann Temperature sensor and method for its production
US8138881B2 (en) * 2007-09-28 2012-03-20 Heraeus Sensor Technology Gmbh Coated wire and film resistor
US8183974B2 (en) * 2007-09-28 2012-05-22 Heracus Sensor Technology GmbH 1200° C. film resistor
US8730002B2 (en) * 2009-02-06 2014-05-20 Heraeus Sensor Technology Gmbh Non-conducting zirconium dioxide

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Publication number Priority date Publication date Assignee Title
US20220044849A1 (en) * 2020-08-05 2022-02-10 Koa Corporation Circuit substrate
US11562837B2 (en) * 2020-08-05 2023-01-24 Koa Corporation Circuit substrate

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US20180106687A1 (en) 2018-04-19
CN107957300A (zh) 2018-04-24
JP2018066591A (ja) 2018-04-26
JP6821384B2 (ja) 2021-01-27
TW201819872A (zh) 2018-06-01

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