US10385237B2 - Organic electronic device - Google Patents

Organic electronic device Download PDF

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US10385237B2
US10385237B2 US15/735,018 US201615735018A US10385237B2 US 10385237 B2 US10385237 B2 US 10385237B2 US 201615735018 A US201615735018 A US 201615735018A US 10385237 B2 US10385237 B2 US 10385237B2
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organic electronic
electronic device
weight
butylene
monomer
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US20180171179A1 (en
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Kyung Yul BAE
Hyun Jee Yoo
Se Woo YANG
Yoon Gyung Cho
Sang Min Park
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LG Chem Ltd
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LG Chem Ltd
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    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F210/00—Copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond
    • C08F210/04—Monomers containing three or four carbon atoms
    • C08F210/08—Butenes
    • C08F210/10—Isobutene
    • C—CHEMISTRY; METALLURGY
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    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F255/00—Macromolecular compounds obtained by polymerising monomers on to polymers of hydrocarbons as defined in group C08F10/00
    • C08F255/08—Macromolecular compounds obtained by polymerising monomers on to polymers of hydrocarbons as defined in group C08F10/00 on to polymers of olefins having four or more carbon atoms
    • C08F255/10—Macromolecular compounds obtained by polymerising monomers on to polymers of hydrocarbons as defined in group C08F10/00 on to polymers of olefins having four or more carbon atoms on to butene polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
    • C08L23/20—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
    • C08L23/22—Copolymers of isobutene; Butyl rubber ; Homo- or copolymers of other iso-olefins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
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    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
    • C09D4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09D159/00 - C09D187/00
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    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
    • C09J123/20—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
    • C09J123/22—Copolymers of isobutene; Butyl rubber ; Homo- or copolymers of other iso-olefines
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    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
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    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
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    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • H01L51/00—
    • H01L51/0001—
    • H01L51/0097—
    • H01L51/52—
    • H01L51/5237—
    • H01L51/5246—
    • H01L51/56—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/124—Insulating layers formed between TFT elements and OLED elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K99/00—Subject matter not provided for in other groups of this subclass
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    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C09J2205/114—
    • C—CHEMISTRY; METALLURGY
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    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/414—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of a copolymer
    • C—CHEMISTRY; METALLURGY
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    • C09J2463/00—Presence of epoxy resin
    • H01L2251/5338—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to an organic electronic device, a method for manufacturing the same, and a lighting apparatus and a display device comprising the same.
  • An organic electronic device means a device comprising an organic material layer that generates alternate current of charges using holes and electrons.
  • An example of the organic electronic device may include a photovoltaic device, a rectifier, a transmitter, and an organic light emitting diode (OLED), and the like.
  • the organic light emitting diode has a lower power consumption and a faster response speed than an existing light source, and is advantageous for thinning display devices or illuminations.
  • the OLEDs are also expected to be applied in various fields covering various portable devices, monitors, notebooks, and televisions because of their excellent space utilization.
  • the present application provides a flexible organic electronic device that does not only realize excellent moisture barrier characteristics, but also has excellent endurance reliability under high temperature and high humidity conditions while having flexible characteristics.
  • the present application relates to an organic electronic device.
  • the organic electronic device may have flexible characteristics.
  • the organic electronic device may comprise, as shown in FIG. 1 or 2 , a substrate (1) in which an organic electronic element (2) is formed on one surface and an adhesive layer (3) formed on the other surface of the substrate (1) and comprising a polymer derived from butylene and a curable oligomer.
  • the adhesive layer according to the present invention is applied to a flexible organic electronic device, physical properties, in which the flexible organic electronic device can effectively suppress cracks capable of occurring in the organic electronic device despite several folding processes and can maintain excellent luminance even after folding, while relaxing stress caused by folding, are required for the adhesive constituting the adhesive layer.
  • the substrate on which the element is formed may be a flexible polymer base material. Accordingly, in order to block moisture or oxygen penetrating through the substrate, the adhesive layer may be positioned on the opposite surface of one surface of the substrate on which the element is formed.
  • the organic electronic device according to the present application can achieve endurance reliability at high temperature and high humidity, prevention of cracks in flexible organic electronic devices, and luminance maintaining together with excellent moisture barrier characteristics by forming the aforementioned adhesive layer on the other surface of the substrate.
  • organic electronic device means an article or device having an element comprising an organic material layer that generates alternate current of charges using holes and electrons between a pair of electrodes opposing to each other, and the example thereof may include, but is not limited to, a photovoltaic device, a rectifier, a transmitter and an organic light emitting diode (OLED), and the like.
  • the organic electronic device may be an OLED.
  • adhesive herein is a term encompassing not only a material commonly referred to as an adhesive but also a layer formed by using a material referred to as a so-called pressure-sensitive adhesive or a material referred to as a so-called adhesive and pressure-sensitive adhesive, and the like.
  • adhesive layer herein may be in a film or sheet shape, whereby the adhesive layer may be used interchangeably with an adhesive film or an adhesive.
  • the term “polymer derived from butylene” may mean that at least one of the polymerized units of the polymer is composed of butylene. Since the polymer derived from butylene has a very low polarity, is transparent, and has almost no influence of corrosion, excellent moisture barrier characteristics and endurance reliability can be realized when used as an encapsulant or a sealing material.
  • the polymer derived from butylene may be also a homopolymer of a butylene monomer; a copolymer obtained by copolymerizing another monomer polymerizable with a butylene monomer; a reactive oligomer using a butylene monomer; or a mixture thereof.
  • the derived polymer may mean that the monomer forms a polymer in polymerized units.
  • the butylene monomer may include, for example, 1-butene, 2-butene or isobutylene.
  • Another monomer polymerizable with the butylene monomer or a derivative thereof may include, for example, an olefin-based compound such as isoprene, styrene or butadiene.
  • an olefin-based compound such as isoprene, styrene or butadiene.
  • the reactive oligomer using the butylene monomer may include a butylene polymer having a reactive functional group.
  • the butylene polymer may be associated with another polymer having a reactive functional group.
  • the other polymer may be, but is not limited to, alkyl (meth)acrylate.
  • the reactive functional group may be a hydroxy group, a carboxyl group, an isocyanate group or a nitrogen-containing group.
  • the reactive oligomer and the other polymer may be cross-linked by a multifunctional cross-linking agent, and the multifunctional cross-linking agent may be at least one selected from the group consisting of an isocyanate cross-linking agent, an epoxy cross-linking agent, an aziridine cross-linking agent and a metal chelate cross-linking agent.
  • polystyrene polyisobutylene, a copolymer of isobutylene and isoprene, a copolymer of isoprene and styrene, a copolymer of isobutylene and styrene, a copolymer of butadiene and styrene, a copolymer of isoprene, butadiene and styrene, polyisoprene, polybutadiene or a copolymer of isoprene and styrene, a copolymer of butadiene and styrene, or a copolymer of isoprene, butadiene and styrene can be exemplified.
  • the polymer may have a weight average molecular weight (MW) such an extent that the adhesive composition can be formed into a film shape.
  • MW weight average molecular weight
  • the polymer may have a weight average molecular weight of about 10,000 to 2,000,000, 50,000 to 1,000,000, 80,000 to 500,000, or 100,000 to 300,000 or so.
  • the term weight average molecular weight means a value converted to standard polystyrene as measured by GPC (Gel Permeation Chromatograph).
  • GPC Gel Permeation Chromatograph
  • the polymer does not necessarily have the above-mentioned weight average molecular weight, and for example, even when the molecular weight of the polymer is not in such level to form a film, a separate binder resin may be formulated into the adhesive composition.
  • the adhesive layer of the present application may comprise a curable oligomer.
  • the adhesive composition according to the present application may optionally use the above-mentioned curable oligomer instead of a tackifier to be described below. That is, the adhesive layer according to the present application may comprise no tackifier.
  • the curable oligomer may comprise at least one or more curable functional groups.
  • the curable functional group may be one or more selected from, for example, a glycidyl group, an isocyanate group, a hydroxy group, a carboxyl group, an amide group, an epoxide group, a cyclic ether group, a sulfide group, an acetal group and a lactone group.
  • the curable oligomer may have a weight average molecular weight in a range of 400 to 10,000, 500 to 10,000, 800 to 10,000, 1,000 to 10,000, 2,000 to 9,000, or 3,000 to 8,000.
  • the adhesive layer of the present application may be cured to have excellent moisture barrier characteristics and may be applied to flexible organic electronic devices to realize excellent heat resistance and adhesion. Flexible organic electronic devices can cause stress during the folding process, whereby some portions can be peeled off, and be vulnerable to high temperatures. However, the organic electronic device in which the adhesive layer according to the present application is formed can alleviate the stress, maintain excellent adhesive force even under severe conditions, and achieve heat resistant durability at high temperature and high humidity.
  • the curable oligomer may be a hydrogenated compound.
  • the term hydrogenated compound herein may mean a compound obtained by adding hydrogen to unsaturated bonds in an organic compound, for example, a carbon-carbon double bond or triple bond or a multiple bond such as a carbonyl group.
  • the hydrogenated compound may inhibit yellowing of the adhesive at high temperatures.
  • the curable oligomer contains two or more functional groups and may be an epoxy oligomer having an epoxy equivalent of 100 g/eq to 1,500 g/eq, 150 g/eq to 1,400 g/eq, 200 g/eq to 1,200 g/eq, or 300 g/eq to 1,000 g/eq.
  • the present application can effectively maintain properties such as adhesion performance and glass transition temperature of a cured product by using an epoxy oligomer having an epoxy equivalent in the above range.
  • the curable oligomer may have a cyclic structure within the molecular structure.
  • the cyclic structure may comprise, for example, an aromatic group (e.g., a phenyl group).
  • the curable oligomer of the present application may be a hydrogenated aromatic epoxy compound.
  • a specific example of the aromatic group-containing curable oligomer that can be used in the present application may be an oligomer type such as a biphenyl type epoxy resin, a dicyclopentadiene type epoxy resin, a naphthalene type epoxy resin, a dicyclopentadiene modified phenol type epoxy resin, a cresol-based epoxy resin, a bisphenol-based epoxy resin, a xylol-based epoxy resin, a multifunctional epoxy resin, a phenol novolak epoxy resin, a triphenol methane type epoxy resin, and an alkyl-modified triphenol methane epoxy resin, but is not limited thereto.
  • an oligomer type such as a biphenyl type epoxy resin, a dicyclopentadiene type epoxy resin, a naphthalene type epoxy resin, a dicyclopentadiene modified phenol type epoxy resin, a cresol-based epoxy resin, a bisphenol-based epoxy resin, a xylol-
  • the curable oligomer may be an oligomer shape such as 3,4-epoxycyclohexylmethyl 3′,4′-epoxycyclohexanecarboxylate (EEC) and derivatives, dicyclopentadiene dioxide and derivatives, 3-ethyl-3-oxetane methanol and derivatives, diglycidyl tetrahydrophthalate and derivatives, diglycidyl hexahydrophthalate and derivatives, 1,2-ethanediglycidyl ether and derivatives, 1,3-propanediglycidyl ether and derivatives, 1,4-butanediol diglycidyl ether and derivatives, higher 1,n-alkane diglycidyl ether and derivatives, bis[(3,4-epoxycyclohexyl)methyl]adipate and derivatives, vinylcyclohexyldioxide and derivatives, 1,4-cyclohexanedimethanol bis(3,4-ep
  • the curable oligomer may be included in an amount of 15 to 100 parts by weight, 20 to 80 parts by weight, or 20 to 70 parts by weight relative to 100 parts by weight of the polymer derived from butylene.
  • the present application can achieve endurance reliability at high temperature and high humidity, prevention of cracks in flexible organic electronic devices, and luminance maintaining together with excellent moisture barrier characteristics by applying the adhesive layer to the organic electronic element.
  • the adhesive layer may further comprise a curable monomer.
  • the curable monomer can be distinguished from the curable oligomer in that it is not in the oligomeric form.
  • the curable monomer may be a cationic initiating monomer.
  • An exemplary curable monomer may have a weight average molecular weight in a range of less than 400, 50 to 390, or 100 to 350.
  • the curable monomer may comprise at least one or more curable functional groups.
  • the curable functional group may be one or more selected from, for example, a glycidyl group, an isocyanate group, a hydroxy group, a carboxyl group, an amide group, an epoxide group, a cyclic ether group, a sulfide group, an acetal group and a lactone group.
  • an epoxy compound having an epoxy equivalent of 10 g/eq to 200 g/eq, 50 g/eq to 180 g/eq, or 100 g/eq to 150 g/eq may be used as the curable monomer containing two or more functional groups.
  • an epoxy compound having an epoxy equivalent in the above range properties such as adhesion performance and glass transition temperature of the cured product can be effectively maintained.
  • the curable monomer a compound having a cyclic structure in which the ring constituent atoms in the molecular structure are in the range of 3 to 10, 4 to 9, or 5 to 8 may be used, but is not limited thereto.
  • the curable monomer may be an alicyclic epoxy compound having the cyclic structure.
  • curable monomer is 3,4-epoxycyclohexylmethyl 3′,4′-epoxycyclohexanecarboxylate (EEC) and derivatives, dicyclopentadiene dioxide and derivatives, 3-ethyl-3-oxetane methanol and derivatives, diglycidyl tetrahydrophthalate and derivatives, diglycidyl hexahydrophthalate and derivatives, 1,2-ethanediglycidyl ether and derivatives, 1,3-propanediglycidyl ether and derivatives, 1,4-butanediol diglycidyl ether and derivatives, higher 1,n-alkane diglycidyl ether and derivatives, bis[(3,4-epoxycyclohexyl)methyl]adipate and derivatives, vinylcyclohexyldioxide and derivatives, 1,4-cyclohexanedimethanol bis(3,4-epoxycyclohexanecarboxylate (
  • the curable monomer may be included in an amount of 20 to 80 parts by weight, 30 to 70 parts by weight, or 35 to 60 parts by weight relative to 100 parts by weight of the polymer derived from butylene. Within the above weight range, excellent moisture barrier characteristics and adhesiveness can be realized.
  • the curable monomer and the curable oligomer may be included in the aforementioned adhesive layer in ratios of 10 to 50 parts by weight and 20 to 70 parts by weight, or 20 to 45 parts by weight and 25 to 60 parts by weight, respectively.
  • the adhesive layer may comprise the polymer derived from butylene, the curable monomer and the curable oligomer in ratios of 40 to 100 parts by weight, 10 to 50 parts by weight and 20 to 70 parts by weight, respectively.
  • the present application can achieve endurance reliability at high temperature and high humidity, together with excellent moisture barrier characteristics by applying the adhesive layer to the organic electronic device, and excellent heat resistance holding ability, adhesion and prevention of cracks and luminance maintaining by applying the adhesive layer to the flexible organic electronic device.
  • the adhesive layer may further comprise a tackifier, which may be a hydrogenated cyclic olefin-based polymer.
  • a tackifier for example, a hydrogenated petroleum resin obtained by hydrogenating a petroleum resin can be used.
  • the hydrogenated petroleum resin may be partially or fully hydrogenated and may be a mixture of such resins.
  • a specific example of the hydrogenated petroleum resin may include a hydrogenated terpene resin, a hydrogenated ester resin or a hydrogenated dicyclopentadiene resin, and the like.
  • the tackifier may have a weight average molecular weight of about 200 to 5,000.
  • the content of the tackifier can be appropriately adjusted as necessary.
  • the content of the tackifier may be included in a weight ratio of 5 parts by weight to 100 parts by weight or 20 to 40 parts by weight, relative to 100 parts by weight of the solid content of the adhesive composition.
  • the adhesive layer may further comprise a curing agent or an initiator depending on the kind of the polymer, the curable oligomer or the curable monomer.
  • a curing agent capable of reacting with the polymer, the curable oligomer or the curable monomer, as described above, to form a cross-linked structure or the like, or a cationic initiator or a radical initiator, capable of initiating the curing reaction may be further included.
  • a cationic initiator a cationic photopolymerization initiator or a cationic thermal initiator may be used.
  • an exemplary curing agent which is an epoxy curing agent known in the art, for example, one or two or more of an amine curing agent, an imidazole curing agent, a phenol curing agent, a phosphorus curing agent, an acid anhydride curing agent, and the like can be used, without being limited thereto.
  • an imidazole compound which is solid at room temperature and has a melting point or a decomposition temperature of 80° C. or higher can be used.
  • a compound can be exemplified by, for example, 2-methylimidazole, 2-heptadecylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole or 1-cyanoethyl-2-phenylimidazole, and the like, but is not limited thereto.
  • the content of the curing agent may be selected depending on composition of the composition, for example, the type and ratio of the polymer, the curable oligomer or the curable monomer.
  • the curing agent may be included in an amount of 0.01 to 20 parts by weight, 0.1 to 10 parts by weight or 1 to 5 parts by weight, relative to 100 parts by weight of the solid content of the adhesive composition.
  • the weight ratio may be changed depending on the type and ratio of the functional group of the curable oligomer or the curable monomer or the compound, the cross-linking density to be achieved, and the like.
  • an ionized cationic initiator of onium salt or organometallic salt series or a non-ionized cationic photopolymerization initiator of organic silane or latent sulfonic acid series may be used.
  • diaryliodonium salt, triarylsulfonium salt or aryldiazonium salt, and the like can be exemplified
  • the initiator of organometallic salt series iron arene and the like
  • the initiator of organosilane series o-nitrobenzyl triaryl silyl ether, triaryl silyl peroxide or acyl silane, and the like
  • the initiator of latent sulfuric acid series ⁇ -sulfonyloxy ketone or ⁇ -hydroxymethylbenzoin sulfonate, and the like can be exemplified, without being limited thereto.
  • the initiator may be included in an amount of 0.01 parts by weight to 20 parts by weight, 0.1 parts by weight to 10 parts by weight or 1 part by weight to 5 parts by weight, relative to 100 parts by weight of the solid content of the adhesive composition.
  • the adhesive layer of the present application may further comprise a high molecular weight resin.
  • the high molecular weight resin can play a role of improving moldability, when the adhesive layer of the present application is molded into a film or sheet shape. In addition, it can serve as a high-temperature viscosity controlling agent for controlling flowability.
  • the type of the high molecular weight resin that can be used in the present application is not particularly limited as long as it is compatible with other components such as the polymer.
  • a specific example of the high molecular weight resin that can be used may include, as a resin having a weight average molecular weight of 20,000 or more, one or a mixture of two or more of a phenoxy resin, an acrylate resin, a high molecular weight epoxy resin, a ultrahigh molecular weight epoxy resin, a high polar functional group-containing rubber and a high polar functional group-containing reactive rubber, and the like, but is not limited thereto.
  • the content thereof is not particularly limited as it is controlled depending on the intended physical properties.
  • the high molecular weight resin may be included in an amount of up to about 200 parts by weight, preferably up to 150 parts by weight, more preferably up to about 100 parts by weight, relative to 100 parts by weight of the polymer derived from butylene, and the lower limit is not particularly limited, but may be 30 parts by weight or more, or 50 parts by weight or more.
  • the content of the high molecular weight resin by controlling the content of the high molecular weight resin to 200 parts by weight or less, compatibility with each component of the resin composition can be effectively maintained.
  • the adhesive layer of the present application may comprise a moisture adsorbent, if necessary.
  • moisture adsorbent can be used generically to refer to components capable of adsorbing or removing moisture or humidity introduced from the outside through physical or chemical reactions or the like. That is, it means a moisture-reactive adsorbent or a physical adsorbent, and a mixture thereof can be also used.
  • the moisture-reactive adsorbent chemically reacts with humidity, moisture or oxygen, and the like introduced into the adhesive to adsorb moisture or humidity.
  • the physical adsorbent can lengthen a moving route of moisture or humidity penetrating into the encapsulation structure to suppress the permeation, and can maximize the barrier characteristics against moisture and humidity through interaction with the matrix structure of the adhesive resin and the moisture-reactive adsorbent.
  • the moisture-reactive adsorbent may include one or a mixture of two or more of a metal powder such as alumina, a metal oxide, a metal salt or phosphorus pentoxide (P 2 O 5 ), and the like, and the physical adsorbent may include silica, zeolite, titania, zirconia or montmorillonite, and the like.
  • the metal oxide may include alumina, lithium oxide (Li 2 O), sodium oxide (Na 2 O), barium oxide (BaO), calcium oxide (CaO) or magnesium oxide (MgO), and the like
  • an example of the metal salt may include a sulfate salt such as lithium sulfate (Li 2 SO 4 ), sodium sulfate (Na 2 SO 4 ), calcium sulfate (CaSO 4 ), magnesium sulfate (MgSO 4 ), cobalt sulfate (CoSO 4 ), gallium sulfate (Ga 2 (SO 4 ) 3 ), titanium sulfate (Ti(SO 4 ) 2 ) or nickel sulfate (NiSO 4 ), a metal halide such as calcium chloride (CaCl 2 ), magnesium chloride (MgCl 2 ), strontium chloride (SrCl 2 ), yttrium chloride (YCl 3 ), copper chloride (CaCl
  • the moisture adsorbent such as the metal oxide can be formulated into the composition in a properly processed state.
  • an adhesive made of the above-mentioned adhesive composition in the form of a film can be formed into a thin film having a thickness of 30 ⁇ m or less depending on the kind of the organic electronic device to be applied, where a process of pulverizing the moisture adsorbent may be required.
  • a process such as three roll mill, bead mill or ball mill may be used.
  • the adhesive layer of the present application may comprise the moisture adsorbent in an amount of 0 parts by weight to 100 parts by weight, 1 to 90 parts by weight, 5 parts by weight to 80 parts by weight, or 10 to 60 parts by weight, relative to 100 parts by weight of the polymer derived from butylene.
  • the moisture adsorbent may not be included as an optional component, but preferably by controlling the content of the moisture adsorbent to 5 parts by weight or more, the cured product may exhibit excellent moisture and humidity barrier characteristics. In addition, by controlling the content of the moisture adsorbent to 100 parts by weight or less, it may exhibit excellent moisture barrier characteristics, while forming a thin film encapsulation structure.
  • the unit “part by weight” means a weight ratio between the respective components.
  • the adhesive layer of the present application may optionally comprise a filler, preferably an inorganic filler.
  • the filler can lengthen the moving route of moisture or humidity penetrating into the encapsulation structure to suppress the penetration, and can maximize the barrier characteristics against moisture and humidity through the interaction with the matrix structure of the resin component and the moisture adsorbent.
  • the specific kind of the filler that can be used in the present application is not particularly limited, and for example, one or a mixture of two or more of clay, or talc, and the like may be used.
  • a product surface-treated with an organic material may be used as the filler, or an additional coupling agent may be added thereto and used.
  • the adhesive layer of the present application may comprise 0 to 50 parts by weight, 1 to 40 parts by weight, or 1 to 20 parts by weight of the filler, relative to 100 parts by weight of the polymer derived from butylene.
  • the filler may not be included in the adhesive as an optional component, but preferably by controlling it to 1 part by weight or more, an encapsulation structure having excellent moisture or humidity barrier characteristics and mechanical properties may be provided.
  • the filler content to 50 parts by weight or less in the present application, it is possible to provide a cured product which can be produced in the form of a film and exhibits excellent moisture barrier characteristics even when formed into a thin film.
  • the adhesive layer may further comprise a dispersing agent so that a moisture adsorbent or the like can be uniformly dispersed.
  • a dispersing agent that can be used here, for example, a nonionic surfactant having affinity with the surface of the moisture adsorbent and good compatibility with the adhesive resin, and the like can be used.
  • the adhesive layer according to the present application may comprise, in addition to the above-described configurations, various additives in accordance with applications, the type of the resin component and the manufacturing process of the adhesive layer described below, within the range that the above-described effect of invention is not affected.
  • the adhesive layer may comprise a coupling agent, a cross-linking agent, a curable material, an ultraviolet stabilizer or an antioxidant, and the like in an appropriate range of content depending on the desired physical properties.
  • the adhesive layer may have, in a graph (X-axis: temperature, Y-axis: storage elastic modulus) of storage elastic moduli depending on temperatures, where the X-axis is a temperature and the Y-axis is a storage elastic modulus, an absolute value of the slope of the storage elastic modulus with respect to the temperature before curing, greater than an absolute value of the slope of the storage elastic modulus with respect to the temperature after curing.
  • the storage elastic modulus may be measured at a temperature range of 25° C. to 65° C. under conditions of a strain of 5% and a frequency of 1 Hz.
  • a ratio (A/B) of the absolute value (A) of the slope of the storage elastic modulus with respect to the temperature after curing to the absolute value (B) of the storage elastic modulus with respect to the temperature before curing may be in a range of 0.001 to 0.9 or 0.001 to 0.8.
  • the adhesive layer of the present application can realize excellent step filling property in a vacuum heat cohesion condition applied to a substrate by maintaining the large absolute value of the slope before curing to have a low storage elastic modulus at a high temperature.
  • the present application also maintains a high storage elastic modulus at a high temperature by keeping the slope small after curing, and thus can realize heat resistant durability at high temperature and high humidity by being applied to a flexible organic electronic device.
  • the adhesive layer may have a viscosity measured depending on shear stress in conditions of a temperature at any one point of 50° C. to 70° C., a strain of 5% and a frequency of 1 Hz before curing in a range of 100 Pa ⁇ s to 10 4 Pa ⁇ s, or 500 Pa ⁇ s to 8,000 Pa ⁇ s.
  • the adhesive satisfying the above viscosity range can realize excellent step filling property in the vacuum heat cohesion condition.
  • the adhesive layer may be a multi-layer structure.
  • the adhesive layer may have a structure of two or more layers, and the composition of the two adhesive layers may be the same or different.
  • the adhesive layer may have a storage elastic modulus, as measured in conditions of a temperature of 25° C., a strain of 5% and a frequency of 1 Hz after curing, in a range of 10 5 to 10 9 Pa, 0.5 MPa to 800 MPa or 0.8 MPa to 500 MPa.
  • a storage elastic modulus as measured in conditions of a temperature of 25° C., a strain of 5% and a frequency of 1 Hz after curing, in a range of 10 5 to 10 9 Pa, 0.5 MPa to 800 MPa or 0.8 MPa to 500 MPa.
  • the organic electronic device of the present application may further comprise an encapsulating layer (4) covering the entire surface of the organic electronic element (2), as shown in FIG. 1 or 2 .
  • the encapsulation layer may be an adhesive, a pressure-sensitive adhesive, or an adhesive and pressure-sensitive adhesive, and the composition may be the same as or different from the above-mentioned adhesive layer.
  • the encapsulating layer may comprise one or more of the polymer derived from butylene, the curable oligomer and the curable monomer, as described above.
  • the organic electronic device may further comprise a cover substrate (5) formed on the encapsulation layer (4).
  • the surface of the substrate, where the organic electronic element is present, and the cover substrate may be adhered by the encapsulation layer.
  • the specific kind of the substrate or the cover substrate is not particularly limited.
  • a general polymer film in this field can be used.
  • a polyethylene terephthalate film, a polytetrafluoroethylene film, a polyethylene film, a polypropylene film, a polybutene film, a polybutadiene film, a vinyl chloride copolymer film, a polyurethane film, an ethylene-vinyl acetate film, an ethylene-propylene copolymer film, an ethylene-ethyl acrylate copolymer film, an ethylene-methyl acrylate copolymer film or a polyimide film, and the like can be used.
  • the thickness of the substrate or the cover substrate as above is not particularly limited and can be appropriately selected depending on the applied applications.
  • the substrate or the cover substrate may have a thickness of 10 ⁇ m to 500 ⁇ m, preferably 20 ⁇ m to 200 ⁇ m or so. If the thickness is less than 10 ⁇ m, the substrate may be easily deformed during the manufacturing process, whereas if the thickness exceeds 500 ⁇ m, the economical efficiency is lowered.
  • the thickness of the adhesive layer of the present application is not particularly limited and can be appropriately selected in accordance with the following conditions in consideration of the application to which the adhesive layer is applied.
  • the adhesive layer included in the adhesive film of the present application may have 5 ⁇ m to 200 ⁇ m, preferably 10 ⁇ m to 150 ⁇ m or so.
  • the organic electronic device may comprise one or more folding portions.
  • FIG. 2 illustrates the organic electronic device having one folding portion, in which the folding portion is folded with a curvature radius of 1 R.
  • the folding portion may satisfy Equation 1 below. X ⁇ 10% [Equation 1]
  • X is a luminance change rate before and after a folding test in which a process of folding the folding portion of the organic electronic device to a curvature radius of 1 R (1 mm) at a temperature at any one point of 15° C. to 35° C., for example, a temperature of 25° C. and the humidity at any one point of 30% to 80%, for example, a relative humidity of 50%, is repeated 100,000 times.
  • the folding test is not limited to the above, and can be carried out by folding it 10,000 to 200,000 times with any one radius of 0.1 R to 3 R.
  • the change rate of luminance can be measured by measuring luminance A of the folding portion before the folding test and luminance B after the folding test, using the DISPLAY COLOR ANALYZER (CA-210, KONICA MINOLTA) equipment as a luminance meter, and calculating the change rate
  • X may be 8% or less or 5% or less, and the lower limit is not particularly limited, but may be 0%.
  • the organic electronic device according to the present application has flexible characteristics and can effectively suppress cracks that may occur in the organic electronic device, despite the folding process of 100,000 times or more as described above, and can maintain excellent luminance.
  • folding portion herein may mean any one portion of an organic electronic device that can be folded such that the organic electronic device has a curvature radius of 0.1 R to 3 R.
  • the folding portion can be seen as a straight line when the organic electronic device is viewed in a plan view, but is not limited thereto.
  • the unit R can be used in the same manner as mm, which is a length unit, and 1 R can mean that the curvature radius is 1 mm, when the folding portion has been folded.
  • the folding process may mean a process of folding the folding portion.
  • the organic electronic device of the present application may have one folding portion, but is not limited thereto, and for example, two or more folding portions.
  • the flexible organic electronic device of the present application can be folded without limitation to any region, by having folding portions on all the entire surface of the device.
  • the physical properties of the adhesive film measured herein are physical properties varying by the temperature, they may be physical properties measured at room temperature, unless otherwise specified.
  • the room temperature herein may mean a natural temperature that the temperature is not increased nor reduced, and for example, the temperature at any one point of about 15° C. to 35° C., the temperature at any one point of 20° C. to 25° C. or about 25° C.
  • the adhesive layer of the present application may have a peel force (peeling speed: 0.3 m/min, peeling angle: 180°) to the substrate of 1000 gf/in or more. Since the organic electronic device of the present application has folding portions, interface peeling may occur between the respective layers constituting the organic electronic device due to several folding, but by controlling the peeling force of the adhesive layer as above, defects due to the interface peeling can be suppressed.
  • the adhesive layer may have a coefficient of thermal expansion of less than 80 ⁇ m/m° C.
  • the coefficient of thermal expansion can be measured in conditions of a temperature at any one point of 30° C. to 100° C., 0.1 N and 10° C./min.
  • the adhesive may have a moisture permeability of 50 g/m 2 ⁇ day or less, 30 g/m 2 ⁇ day or less, 20 g/m 2 ⁇ day or less, or less than 15 g/m 2 ⁇ day.
  • the moisture permeability is a moisture permeability measured in the thickness direction of a cross-linked product or a cured product under 100° F. and a relative humidity of 100%, where the cross-linked product or the cured product is obtained after cross-linking or curing an adhesive described below and making the cross-linked product or cured product into a film shape having a thickness of 100 ⁇ m.
  • the moisture permeability is measured according to ASTM F1249.
  • the encapsulation structure exhibit more excellent performance, where the lower limit is not particularly limited, and for example may be 0 g/m 2 ⁇ day, 1 g/m 2 ⁇ day or 3 g/m 2 ⁇ day.
  • the adhesive may have a moisture content of 0.05% or less, relative to the adhesive mass, as measured according to Kal-Fischer titration.
  • the moisture content may be a moisture content (the measurement conditions are a nitrogen gas temperature of 240° C.
  • the measurement time is measured until the moisture measurement amount reaches 0.17 ⁇ g/s) for about 1 g of the adhesive sample by using VA-236S equipment from Mitsubishi after performing nitrogen purging for about 1 hour in the equipment and the container storage chamber, but is not limited thereto.
  • the adhesive may have a dielectric constant of 4 F/m or less, or 3 F/m or less.
  • the dielectric constant can be measured by a method known in the art, and for example, can be measured at 1 MHz by preparing an adhesive sample in a thickness of 100 ⁇ m, laminating the sample with a size of 2 cm ⁇ 2 cm between copper foils, and then using an Agilent 4294A Precision Impedance Analyzer, but is not limited thereto. It is preferred that the dielectric constant does not exceed 4 F/m with respect to the response speed of the touch sensor, considering that the organic electronic device described above is applied to a display device or the like.
  • the adhesive layer may have excellent light transmittance with respect to the visible light region.
  • the light transmittance may be measured at 550 nm using a UV-Vis spectrometer.
  • the adhesive layer of the present application may exhibit a light transmittance of 90% or more with respect to the visible light region.
  • the adhesive layer of the present application can exhibit low haze with excellent light transmittance.
  • the adhesive layer may exhibit a haze of 3% or less, 2% or less, 1% or less, 0.8% or less, 0.5% or less, or 0.3% or less.
  • the adhesive layer of the present application can realize excellent optical characteristics by being applied to an organic electronic device.
  • the light transmittance or haze in the present application may be measured in accordance with JIS K7105 standard test method.
  • the organic electronic device of the present application can satisfy Equation 2 below. Y ⁇ 10% [Equation 2]
  • Y is a light transmittance change rate before and after a folding test in which a process of folding the folding portion of the organic electronic device to a curvature radius of 1 R (1 mm) at a temperature at any one point of 15° C. to 35° C., for example, a temperature of 25° C. and the humidity at any one point of 30% to 80%, for example, a relative humidity of 50%, is repeated 100,000 times.
  • the folding test is not limited to the above, and can be carried out by folding it 10,000 to 200,000 times with any one radius of 0.1 R to 3 R.
  • the light transmittance can be measured at a wavelength of 550 nm using a UV-Vis spectrometer.
  • the organic electronic device of the present application can satisfy Equation 3 below. Z ⁇ 10% [Equation 3]
  • Z is a haze change rate before and after a folding test in which a process of folding the folding portion of the organic electronic device to a curvature radius of 1 R (1 mm) at a temperature at any one point of 15° C. to 35° C., for example, a temperature of 25° C. and the humidity at any one point of 30% to 80%, for example, a relative humidity of 50%, is repeated 100,000 times.
  • the folding test is not limited to the above, and can be carried out by folding it 10,000 to 200,000 times with any one radius of 0.1 R to 3 R.
  • the haze can be measured according to the JIS K7105 standard test method. In Equation 3 above, Z may be 8% or less or 5% or less.
  • the adhesive composition when the adhesive composition is cured to form an adhesive layer and the adhesive layer is applied to the flexible organic electronic device, the components constituting the adhesive composition and the contents of the respective components can be controlled in order to realize the above-described physical properties.
  • the organic electronic device according to the present application may comprise an organic electronic element, as described above.
  • the organic electronic element present on the top of the substrate region may comprise a first electrode layer and a second electrode layer, and may also comprise an organic layer present between the first and second electrode layers.
  • the first and second electrode layers may be a hole-injection or electron-injection electrode layer commonly used in organic electronic devices. Any one of the first and second electrode layers may be formed of a hole-injection electrode layer and the other may be formed of an electron-injection electrode layer. Any one of the first and second electrode layers may be formed of a transparent electrode layer and the other may be formed of a reflective electrode layer.
  • the hole-injection electrode layer may be formed using, for example, a material having a relatively high work function, and if necessary, may be formed using a transparent or reflective material.
  • the hole-injection electrode layer may comprise a metal, an alloy, an electrically conductive compound or a mixture of two or more thereof, having a work function of about 4.0 eV or more.
  • a metal such as gold, CuI, an oxide material such as ITO (indium tin oxide), IZO (indium zinc oxide), ZTO (zinc tin oxide), zinc oxide doped with aluminum or indium, magnesium indium oxide, nickel tungsten oxide, ZnO, SnO 2 or In 2 O 3
  • a metal nitride such as gallium nitride, a metal selenide such as zinc selenide or a metal sulfide such as zinc sulfide, and the like can be exemplified.
  • the transparent hole-injection electrode layer can also be formed by using a laminate of a metal thin film such as Au, Ag or Cu and a high refractive index transparent material such as ZnS, TiO 2 or ITO.
  • the hole-injection electrode layer may be formed by any means such as vapor deposition, sputtering, chemical vapor deposition or electrochemical means.
  • the formed electrode layer may be patterned through a process using known photolithography, shadow mask, or the like.
  • the electron-injection electrode layer can be formed using, for example, a material having a relatively low work function, and for example, can be formed using a suitable transparent or reflective material of materials used for forming the hole-injection electrode layer, without being limited thereto.
  • the electron-injection electrode layer can also be formed using, for example, a vapor deposition method or a sputtering method, and the like, and if necessary, can be suitably patterned.
  • the electrode layer may be formed to have a thickness of, for example, about 90 nm to 200 nm, 90 nm to 180 nm, or about 90 nm to 150 nm or so.
  • the organic layer exists between the first and second electrode layers.
  • the organic layer may comprise at least two light emitting units. In such a structure, light emitted from the light emitting unit can be emitted toward the transparent electrode layer through a process of being reflected by the reflective electrode layer.
  • the material constituting the light emitting unit is not particularly limited. Fluorescent or phosphorescent organic materials having various luminescent center wavelengths are known in the art, and the light emitting unit can be formed by selecting a suitable type of such known materials.
  • a material of the light emitting unit a material of Alq series such as tris(4-methyl-8-quinolinolate)aluminum (III) (Alg3), 4-MAlq3 or Gaq3, a cyclopentadiene derivative such as C-545T (C 26 H 26 N 2 O 2 S), DSA-amine, TBSA, BTP, PAP-NPA, Spiro-FPA, Ph 3 Si (PhTDAOXD) or PPCP (1,2,3,4,5-pentaphenyl-1,3-cyclopentadiene), DPVBi (4,4′-bis(2,2′-diphenylyinyl)-1,1′-biphenyl), distyrylbenzene or a derivative thereof, or DCJ
  • the light emitting unit may also have a host-dopant system which includes the above material as a host and also includes perylene, distyrylbiphenyl, DPT, quinacridone, rubrene, BTX, ABTX or DCJTB and the like as a dopant.
  • a host-dopant system which includes the above material as a host and also includes perylene, distyrylbiphenyl, DPT, quinacridone, rubrene, BTX, ABTX or DCJTB and the like as a dopant.
  • the light emitting unit may also be formed by appropriately employing a kind that exhibits light emission characteristics among the electron-accepting organic compounds or electron-donating organic compounds as described below.
  • the organic layer comprises the light emitting unit, it may be formed with various structures further comprising a variety of other functional layers known in the art.
  • an electron injecting layer As the layer that can be included in the organic layer, an electron injecting layer, a hole blocking layer, an electron transporting layer, a hole transporting layer and a hole injecting layer, and the like can be exemplified.
  • the electron injecting layer or the electron transporting layer can be formed using, for example, an electron accepting organic compound.
  • an electron accepting organic compound any known compound can be used without any particular limitation.
  • an organic compound a polycyclic compound or a derivative thereof such as p-terphenyl or quaterphenyl, a polycyclic hydrocarbon compound or a derivative thereof such as naphthalene, tetracene, pyrene, coronene, chrysene, anthracene, diphenylanthracene, naphthacene or phenanthrene, a heterocyclic compound or a derivative thereof such as phenanthroline, bathophenanthroline, phenanthridine, acridine, quinoline, quinoxaline or phenazine, and the like can be exemplified.
  • metal complexes having at least one 8-quinolinolato or derivative thereof as a ligand such as tris(8-quinolinolato)aluminum, bis(8-quinolinolato)aluminum, bis[benzo(f)-8-quinolinolato]zinc, bis(2-methyl-8-quinolinolato)aluminum, tris(8-quinolinolato)indium, tris (5-methyl-8-quinolinolato)aluminum, 8-quinolinolatolithium, tris(5-chloro-8-quinolinolato)gallium or bis(5-chloro-8-quinolinolato)calcium, which is a metal chelated oxanoid compound, oxadiazole compounds disclosed in Japanese Laid-Open Patent Publication No.
  • fluorescent brightening agents such as benzooxazole compounds, benzothiazole compounds or benzoimidazole compounds
  • distyrylbenzene compounds such as 1,4-bis(2-methylstyryl)benzene, 1,4-bis(3-methylstyryl)benzene, 1,4-bis(4-methylstyryl)benzene, distyrylbenzene, 1,4-bis(2-ethylstyryl)benzene, 1,4-bis(3-ethylstyryl)benzene, 1,4-bis(2-methylstyryl)-2-methylbenzene or 1,4-bis(2-methylstyryl)-2-ethylbenzene
  • distyrylpyrazine compounds such as 2,5-bis(4-methylstyryl)pyrazine, 2,5-bis(4-ethylstyryl)pyrazine, 2,5-bis(4-ethylstyryl)pyrazine, 2,5
  • the electron injecting layer can be also formed using a material such as LiF or CsF.
  • the hole blocking layer is a layer capable of improving the lifetime and efficiency of the element by preventing the injected holes from entering into the electron-injection electrode layer via the light emitting unit, and if necessary, can be formed in an appropriate portion between the light emitting unit and the electron-injection electrode layer by using a known material.
  • the hole injecting layer or the hole transporting layer may comprise, for example, an electron donating organic compound.
  • an electron donating organic compound arylamine compounds such as N,N′,N′-tetraphenyl-4,4′-diaminophenyl, N,N′-diphenyl-N,N′-di(3-methylphenyl)-4,4′-diaminobiphenyl, 2,2-bis(4-di-p-tolylaminophenyl)propane, N,N,N′,N′-tetra-p-tolyl-4,4′-diaminobiphenyl, bis(4-di-p-tolylaminophenyl)phenylmethane, N,N′-diphenyl-N,N′-di(4-methoxyphenyl)-4,4′-diaminobiphenyl, N,N,N′,N′-tetraphenyl-4,4′-diamin
  • the hole injecting layer or the hole transporting layer may be formed by dispersing an organic compound in a polymer, or by using a polymer derived from the organic compound. Furthermore, so-called ⁇ -conjugated polymers such as polyparaphenylenevinylene and derivatives thereof, hole-transporting non-conjugated polymers such as poly(N-vinylcarbazole) or ⁇ -conjugated polymers such as polysilanes, and the like may also be used.
  • the hole injecting layer may be formed by using metal phthalocyanine such as copper phthalocyanine or nonmetal phthalocyanine, or electrically conductive polymers such as a carbon film and polyaniline, or by reacting the arylamine compound as an oxidizing agent with a Lewis acid.
  • metal phthalocyanine such as copper phthalocyanine or nonmetal phthalocyanine
  • electrically conductive polymers such as a carbon film and polyaniline
  • the specific structure of the organic layer is not particularly limited.
  • various materials for forming a hole or electron injecting electrode layer and an organic layer for example, a light emitting unit, an electron injecting or transporting layer, a hole injecting or transporting layer, and forming methods thereof are known, and all the above methods may be applied to manufacture the organic electronic device.
  • the organic electronic element of the present application may comprise a protective layer.
  • the protective layer can prevent damage to the electrode, be composed of typical materials in this technical field, and for example, comprise SiNx or Al 2 O 3 , and the like as an inorganic material.
  • the present application also relates to a method for manufacturing the organic electronic device.
  • the manufacturing method may comprise steps of forming an adhesive layer comprising a polymer derived from butylene and a curable oligomer on the other surface of a substrate, one surface of which an organic electronic element is present on, and curing the adhesive layer.
  • curing herein may mean that the adhesive composition of the present invention forms a cross-linked structure through heating or UV irradiation processes to be produced in the form of an adhesive.
  • an organic electronic element may be formed by forming an electrode on a polymer film used as a substrate with a method such as vacuum deposition or sputtering, forming a luminescent organic material layer composed of, for example, a hole transporting layer, a light emitting layer and an electron transporting layer, and the like on the electrode and then further forming an electrode layer on the top.
  • the above-described adhesive layer is placed on the opposite side of the surface on which the element is formed.
  • the adhesive layer may be formed by heating the adhesive layer and pressing it in a state where fluidity is imparted thereto, with a laminator or the like, and cross-linking the resin in the adhesive layer.
  • the method for manufacturing the organic electronic device according to the present application may also comprise positioning an encapsulation layer to cover the entire surface of the organic electronic element. Subsequently, the encapsulation layer may be formed by heating the encapsulation layer and pressing it in a state where fluidity is imparted thereto, with a laminator or the like, and cross-linking the resin in the encapsulation layer.
  • the encapsulation layer positioned to cover the entire surface of the organic electronic element may be previously transferred to the cover substrate.
  • the transfer of the encapsulation layer to the cover substrate can be also carried out, for example, by peeling the encapsulation layer and then heating the encapsulation layer in contact with the cover substrate using a vacuum press or a vacuum laminator and the like.
  • the adhesive contains a thermosetting curable polymer, there is a concern that the curing reaction is excessively performed in the above process and sticking force or adhesiveness of the encapsulation layer is reduced, and thus it is possible to control the process temperature to about 100° C. or less and the process time within 5 minutes.
  • the encapsulation layer may be formed by positioning the cover substrate onto which the encapsulation layer is transferred on the organic electronic element, and performing the hot pressing process.
  • the organic electronic device may be manufactured in other ways as well.
  • the device is manufactured in the same manner as described above, but the order or conditions of the process may be changed.
  • the present application also relates to a use of the organic electronic device, for example, an organic light emitting device.
  • the organic light emitting device may be effectively applied to a backlight of a liquid crystal display (LCD), an illumination, a light source of various sensors, a printer, a copy machine, a vehicle instrument light source, a signal lamp, an indicating lamp, a display device, a light source of a planar light emitter, a display, a decoration, or various lights, and the like.
  • the present application relates to a lighting apparatus comprising the flexible organic electronic device.
  • the present application relates to a display device comprising the flexible organic electronic device as a light source.
  • the present application provides a flexible organic electronic device that does not only realize excellent moisture barrier characteristics, but also has excellent endurance reliability under high temperature and high humidity conditions while having flexible characteristics.
  • FIGS. 1 and 2 are cross-sectional views illustrating exemplary organic electronic devices.
  • a styrene-isobutylene copolymer (SIBS 102T, Mw: 100,000, Kaneka) as a polymer derived from butylene, a hydrogenated bisphenol A epoxy resin (YX8000, epoxy equivalent: 201 g/eq, Mitsubishi Chemical) as a curable oligomer, and a silane-modified epoxy resin (KSR-177, Kukdo Chemical) as a curable monomer were introduced into a reaction vessel at a weight ratio of 60:15:25 (SIBS 102T: YX8000: KSR-177), respectively, and Irgacure290 (Ciba) as a cationic photoinitiator was added thereto in an amount of 0.1 parts by weight, relative to 100 parts by weight of the polymer, and then diluted with toluene to a solid content of about 15% by weight to prepare an adhesive composition coating solution.
  • SIBS 102T Mw: 100,000, Kaneka
  • An adhesive film was produced by coating the prepared solution on the releasing surface of the releasing PET and drying it in an oven at 100° C. for 15 minutes to form an adhesive layer having a thickness of 50 ⁇ m.
  • An adhesive composition and an adhesive film were produced in the same manner as in Example 1, except that a styrene-isobutylene copolymer (SIBS 102T, Mw: 100,000, Kaneka) as a polymer derived from butylene, a hydrogenated bisphenol A epoxy resin (YX8000, epoxy equivalent: 201 g/eq, Mitsubishi Chemical) as a curable oligomer, and an alicyclic epoxy compound (Celloxide 2021P, Mw: 250, Daicel corporation) as a curable monomer were introduced into a reaction vessel at a weight ratio of 60:15:25 (SIBS 102T: YX8000: Celloxide 2021P), respectively.
  • SIBS 102T styrene-isobutylene copolymer
  • Polyisobutylene (B50, BASF) as a polymer derived from butylene, a hydrogenated petroleum resin (SU90, Kolon), and 1,6-hexandediol diacrylate (M200, Miwon Commercial Co., Ltd.) were introduced into a reaction vessel at a weight ratio of 60:30:10 (B50: SU90: M200), respectively, and Irgacure651 (Ciba) as a radical initiator was added thereto in an amount of 0.1 parts by weight, relative to 100 parts by weight of the polymer, and then diluted with toluene to a solid content of about 15% by weight to prepare an adhesive composition coating solution.
  • An adhesive film was produced by coating the prepared solution on the releasing surface of the releasing PET and drying it in an oven at 100° C. for 15 minutes to form an adhesive layer having a thickness of 50 ⁇ m.
  • An adhesive composition and an adhesive film were produced in the same manner as in Comparative Example 1, except that polyisobutylene (B50, BASF) as a polymer derived from butylene, a hydrogenated petroleum resin (SU90, Kolon), and 1,6-hexandediol diacrylate (M200, Miwon Commercial Co., Ltd.) were introduced into a reaction vessel at a weight ratio of 50:40:10 (B50: SU90: M200), respectively.
  • B50 polyisobutylene
  • SU90 hydrogenated petroleum resin
  • M200 1,6-hexandediol diacrylate
  • An adhesive composition and an adhesive film were produced in the same manner as in Example 1, except that a styrene-isobutylene copolymer (SIBS 062M, Kaneka) as a polymer derived from butylene, a hydrogenated petroleum resin (SU90, Kolon), and an alicyclic epoxy compound (Celloxide 2021P, Mw: 250, Daicel corporation) were introduced into a reaction vessel at a weight ratio of 50:30:20 (SIBS 062M: SU90: Celloxide 2021P), respectively.
  • SIBS 062M styrene-isobutylene copolymer
  • SU90 hydrogenated petroleum resin
  • Celloxide 2021P Mw: 250, Daicel corporation
  • the storage elastic modulus was measured in conditions of a temperature of 25° C., a strain of 5% and a frequency of 1 Hz.
  • the film was laminated to a thickness of 600 ⁇ m, and physical properties were measured using ARES equipment as follows. The viscosity was measured depending on shear stress in conditions of a temperature of 65° C., a strain of 5% and a frequency of 1 Hz.
  • the adhesive film prepared in Examples and Comparative Examples was adhered to the center portion by using a roll laminator.
  • a glass having the same size as the prepared specimen is pressed in the vertical direction and bonded together by applying a vacuum of 100 pa and a pressure of 0.5 MPa under a temperature condition of 65° C. with a vacuum bonding machine.
  • the cohesiveness was determined depending on looseness of the step forming region in the front side of the adhesive and classified as 0 when the loosed portion of the step formation region is 10% or less of the total area, A when it is 30% or less and X when it is 50% or more.

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  • Chemical & Material Sciences (AREA)
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  • Polymers & Plastics (AREA)
  • Optics & Photonics (AREA)
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  • Engineering & Computer Science (AREA)
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  • Manufacturing & Machinery (AREA)
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  • Adhesive Tapes (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
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CN107849414B (zh) * 2015-06-09 2020-06-05 株式会社Lg化学 粘合剂组合物、包含其的粘合膜和包含其的有机电子器件
KR102001613B1 (ko) * 2017-05-24 2019-07-18 주식회사 엘지화학 유기전자장치
KR102316015B1 (ko) * 2017-11-10 2021-10-22 주식회사 엘지화학 적층체의 제조 방법
KR102102971B1 (ko) * 2018-07-12 2020-04-21 주식회사 오플렉스 터치패널용 저유전 점착필름
KR102698627B1 (ko) * 2020-05-29 2024-08-27 (주)이녹스첨단소재 롤러블 유기전자장치용 봉지재 및 이를 포함하는 롤러블 유기전자장치
KR102698628B1 (ko) * 2020-05-29 2024-08-27 (주)이녹스첨단소재 롤러블 유기전자장치용 봉지재 및 이를 포함하는 롤러블 유기전자장치
KR102505829B1 (ko) * 2020-12-11 2023-03-06 한국과학기술연구원 신축성 표시 장치 및 신축성 표시 장치 제조 방법
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KR102308951B1 (ko) 2021-10-06
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KR20160144934A (ko) 2016-12-19
US20180171179A1 (en) 2018-06-21
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JP2018525773A (ja) 2018-09-06
CN107851731A (zh) 2018-03-27

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