TWM621021U - Transfer apparatus - Google Patents

Transfer apparatus Download PDF

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Publication number
TWM621021U
TWM621021U TW110208593U TW110208593U TWM621021U TW M621021 U TWM621021 U TW M621021U TW 110208593 U TW110208593 U TW 110208593U TW 110208593 U TW110208593 U TW 110208593U TW M621021 U TWM621021 U TW M621021U
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Taiwan
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pushing
target
sheet
pressing member
supporting
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TW110208593U
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Chinese (zh)
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賴燦雄
陳光誠
陳揚傑
周維亮
汪秉龍
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久元電子股份有限公司
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Priority to TW110208593U priority Critical patent/TWM621021U/en
Publication of TWM621021U publication Critical patent/TWM621021U/en

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Abstract

The present disclosure provides a transfer apparatus including: a movable placement device configured to place a first carrying sheet in a first carrying area and place a second carrying sheet in a second carrying area; a pressing member movably arranged on one side of the first carrying area away from the second carrying area and configured to press the first carrying sheet in a predetermined moving direction from the first carrying area towards the second carrying area; and a pushing device movably arranged on the side of the first carrying area away from the second carrying area. The pushing device includes a pushing member configured to pass through the pressing member in the predetermined moving direction to push a target object. The pressing member includes a sidewall of which one side away from the first carrying area having a first opening which allows the pushing device to pass through.

Description

轉移設備Transfer equipment

本揭露涉及半導體製造技術領域,特別地,涉及一種轉移設備。The present disclosure relates to the field of semiconductor manufacturing technology, in particular, to a transfer device.

在半導體的製程中,會通過晶粒轉移機構對切割完成的多個晶粒依其外觀、品質或特性進行挑撿分類。目前,大多數的晶粒轉移機構多採用通過一頂推裝置中的頂推針將晶粒從一薄膜轉移至印刷電路板(PCB:Printed Circuit Board)上。但是,在轉移過程中,由於用於承載晶粒的薄膜的面積較大且具有彈性,如果頂推裝置直接頂推到薄膜進而來頂推晶粒的話,無法實現精準對位,容易出現翻晶或置下歪斜等情況,從而導致良率較低。In the semiconductor manufacturing process, multiple diced dies are sorted and sorted according to their appearance, quality, or characteristics through a die transfer mechanism. At present, most of the die transfer mechanisms mostly transfer the die from a thin film to a printed circuit board (PCB: Printed Circuit Board) through an ejector pin in an ejector device. However, during the transfer process, due to the large area and elasticity of the film used to carry the crystal grains, if the pushing device directly pushes onto the film to push the crystal grains, precise alignment cannot be achieved, and crystal flipping is likely to occur. Or set aside skew, etc., resulting in a lower yield.

本揭露是鑒於上述問題而完成的,提供一種能夠實現精準對位,避免出現翻晶或置下歪斜等情況,且良率高的轉移設備。The present disclosure is completed in view of the above-mentioned problems, and provides a transfer device that can achieve precise alignment, avoid flipping or placing skew, and so on, and has a high yield.

為解決上述問題,本揭露提供一種轉移設備,其用於將第一承載片上的至少一個目標物轉移至第二承載片,所述轉移設備包括:移動放置裝置,其用於將所述第一承載片放置於第一承載區域和將所述第二承載片放置於第二承載區域,使得所述第一承載片和所述第二承載片相向間隔且可相對平移;按壓件,其可移動地設置於所述第一承載區域的背離所述第二承載區域的一側,所述按壓件用於沿預設移動方向按壓所述第一承載片,使得所述第一承載片的待頂推的所述目標物的設置區域靠近所述第二承載片,所述預設移動方向為所述第一承載區域朝向所述第二承載區域的方向;以及頂推裝置,其可移動地設置於所述第一承載區域的背離所述第二承載區域的一側,所述頂推裝置包括頂推件,所述頂推件的前端用於沿所述預設移動方向穿過所述按壓件以頂推所述目標物,其中,所述按壓件包括側壁,所述側壁遠離所述第一承載區域的一側開設有第一缺口,所述第一缺口用於供所述頂推裝置穿過。In order to solve the above problems, the present disclosure provides a transfer device, which is used to transfer at least one target on a first carrier sheet to a second carrier sheet. The transfer device includes: a mobile placement device for transferring the first The load-bearing sheet is placed in the first load-bearing area and the second load-bearing sheet is placed in the second load-bearing area, so that the first load-bearing sheet and the second load-bearing sheet are spaced apart from each other and can be relatively translated; the pressing member is movable Is arranged on the side of the first bearing area away from the second bearing area, and the pressing member is used to press the first bearing sheet along a preset moving direction, so that the to-be-topped first bearing sheet The setting area of the object to be pushed is close to the second supporting sheet, and the preset moving direction is the direction of the first supporting area toward the second supporting area; and the pushing device is movably arranged On a side of the first bearing area away from the second bearing area, the pushing device includes a pushing piece, and the front end of the pushing piece is used to pass through the pressing along the preset moving direction. The pushing member is used to push the target, wherein the pressing member includes a side wall, a side of the side wall away from the first bearing area is provided with a first notch, and the first notch is used for the pushing device Through.

在一實施方式中,所述按壓件形成一第二缺口,所述第二缺口設置於所述按壓件靠近所述第一承載區域的一側。In one embodiment, the pressing member forms a second notch, and the second notch is disposed on a side of the pressing member close to the first bearing area.

在一實施方式中,所述按壓件進一步包括按壓環和安裝部,所述按壓環限定了所述第二缺口,所述安裝部且與所述按壓環相對設置,所述安裝部和所述按壓環分別設置於所述側壁的兩側。In one embodiment, the pressing member further includes a pressing ring and a mounting portion, the pressing ring defines the second notch, the mounting portion is disposed opposite to the pressing ring, and the mounting portion and the mounting portion The pressing rings are respectively arranged on both sides of the side wall.

在一實施方式中,所述按壓環的底表面與側表面的連接處形成倒圓角。In one embodiment, the connection between the bottom surface and the side surface of the pressing ring forms a rounded corner.

在一實施方式中,所述第二缺口為圓孔。In one embodiment, the second notch is a round hole.

在一實施方式中,所述側壁上還形成一穿孔,所述穿孔與所述第一缺口相對設置。In one embodiment, a through hole is formed on the side wall, and the through hole is disposed opposite to the first notch.

所述轉移設備還包括影像擷取裝置,其固定地設置於所述第一承載區域的背離所述第二承載片的一側,用於對要頂推的所述目標物進行取像。The transfer equipment further includes an image capturing device, which is fixedly arranged on a side of the first bearing area away from the second bearing sheet, and is used to capture images of the target to be pushed.

在一實施方式中,在所述頂推裝置頂推所述目標物時,所述頂推裝置、所述按壓件以及所述影像擷取裝置彼此間的相對位置為同軸。In one embodiment, when the pushing device pushes the target, the relative positions of the pushing device, the pressing member, and the image capturing device are coaxial with each other.

在一實施方式中,所述頂推裝置包括頂針蓋,所述頂推件可凸伸出所述頂針蓋。In one embodiment, the pushing device includes a thimble cover, and the pushing member can protrude from the thimble cover.

在一實施方式中,所述移動放置裝置包括第一放置部及第二放置部,所述第一放置部及所述第二放置部以相向間隔且可相對平移的方式設置。In one embodiment, the mobile placement device includes a first placement portion and a second placement portion, and the first placement portion and the second placement portion are arranged in a manner of being spaced apart from each other and relatively translationally movable.

相較於現有技術,通過設置按壓件按壓第一承載片,使得在頂推目標物時,第一承載片的要頂推的目標物的設置區域向第二承載片靠近,容易對要頂推的目標物的設置區域的張力進行控制,且調整第一承載片的要頂推的目標物的設置區域與第二承載片之間的距離,從而使得頂推裝置能夠精準地頂推目標物,避免出現翻晶或置下歪斜等情況,且良率高。Compared with the prior art, the first supporting sheet is pressed by the pressing member, so that when the target is pushed, the area of the first supporting sheet to be pushed is closer to the second supporting sheet, which makes it easier to push the target. The tension of the setting area of the target is controlled, and the distance between the setting area of the target to be pushed by the first supporting sheet and the second supporting sheet is adjusted, so that the pushing device can accurately push the target, Avoid flipping the crystal or placing the bottom skew, and the yield rate is high.

以下敘述含有與本揭露中的示例性實施例相關的特定資訊。本揭露中的附圖和其隨附的詳細敘述僅為示例性實施例。然而,本揭露並不局限於此些示例性實施例。本領域技術人員將會想到本揭露的其它變化與實施例。除非另有說明,否則附圖中的相同或對應的元件可由相同或對應的附圖標號指示。此外,本揭露中的附圖與例示通常不是按比例繪製的,且非旨在與實際的相對尺寸相對應。The following description contains specific information related to the exemplary embodiments in this disclosure. The drawings in this disclosure and the detailed description accompanying them are only exemplary embodiments. However, the present disclosure is not limited to these exemplary embodiments. Those skilled in the art will think of other variations and embodiments of this disclosure. Unless otherwise specified, the same or corresponding elements in the drawings may be indicated by the same or corresponding reference numerals. In addition, the drawings and illustrations in this disclosure are generally not drawn to scale, and are not intended to correspond to actual relative sizes.

出於一致性和易於理解的目的,在示例性附圖中藉由標號以標示相同特徵(雖在一些示例中並未如此標示)。然而,不同實施方式中的特徵在其它方面可能不同,因此不應狹義地局限於附圖所示的特徵。For the purpose of consistency and ease of understanding, the same features are indicated by reference numerals in the exemplary drawings (although not so indicated in some examples). However, the features in different embodiments may be different in other aspects, and therefore should not be narrowly limited to the features shown in the drawings.

本揭露的說明書及上述附圖中的術語“第一”、“第二”和“第三”等是用於區別不同物件,而非用於描述特定順序。此外,術語“包括”以及它們任何變形,意圖在於覆蓋不排他的包含。The terms "first", "second", and "third" in the specification of the present disclosure and the above-mentioned drawings are used to distinguish different objects, rather than to describe a specific sequence. In addition, the term "including" and any variations of them are intended to cover non-exclusive inclusion.

下面,結合附圖及實施例對本揭露進行詳細說明。Hereinafter, the disclosure will be described in detail with reference to the accompanying drawings and embodiments.

參照圖1~圖4,本揭露一實施方式提供一種轉移設備100,包括基座10、移動放置裝置20、頂推裝置30、按壓件40及影像擷取裝置50,其中,移動放置裝置20、頂推裝置30、按壓件40及影像擷取裝置50均設置於基座10上。1 to 4, an embodiment of the present disclosure provides a transfer device 100, including a base 10, a mobile placement device 20, a pushing device 30, a pressing member 40, and an image capturing device 50, wherein the mobile placement device 20, The pushing device 30, the pressing member 40 and the image capturing device 50 are all disposed on the base 10.

本實施方式中的轉移設備100用於轉移至少一目標物200,在本實施方式中,目標物200以晶粒為例進行說明,在其它實施方式中,轉移設備100還可以用於轉移其它目標物,在此不作限定。具體地,轉移設備100用於將第一承載片60及第二承載片70設置於移動放置裝置20,並通過頂推裝置30、按壓件40及影像擷取裝置50將第一承載片60上的目標物200轉移至第二承載片70上。The transfer device 100 in this embodiment is used to transfer at least one target 200. In this embodiment, the target 200 is described by taking a crystal grain as an example. In other embodiments, the transfer device 100 can also be used to transfer other targets. Objects are not limited here. Specifically, the transfer device 100 is used to set the first carrier sheet 60 and the second carrier sheet 70 on the mobile placement device 20, and place the first carrier sheet 60 on the first carrier sheet 60 through the pushing device 30, the pressing member 40, and the image capturing device 50 The target 200 of is transferred to the second carrier 70.

在本實施方式中,第一承載面60的面向第二承載片70的表面用於放置至少一目標物200,具體地,第一承載片60具有用於承載目標物200的承載面61及與承載面61相背的接觸面62,承載面61面向第二承載片70。第二承載片70具有供目標物200設置的設置面71,設置面71面向第一承載片60。In this embodiment, the surface of the first bearing surface 60 facing the second bearing sheet 70 is used to place at least one target 200. Specifically, the first bearing sheet 60 has a bearing surface 61 for bearing the target 200 and The supporting surface 61 is opposite to the contact surface 62, and the supporting surface 61 faces the second supporting sheet 70. The second supporting sheet 70 has a setting surface 71 for setting the target 200, and the setting surface 71 faces the first supporting sheet 60.

可以理解,在頂推件31頂推目標物200且並未刺破第一承載片60的情況下,第一承載片60的黏度可能會因第一承載片60表面被拉伸而降低,此時,承載面61的黏度低於設置面71的黏度的情況下,目標物200較容易脫離第一承載片60,而黏至於第二承載片70。當然,在其它時期,例如,後述的按壓件30未按壓第一承載片60時,承載面61的黏度也可以不低於設置面71的黏度,在此不作限定。It can be understood that when the pushing member 31 pushes the target 200 and does not pierce the first carrier sheet 60, the viscosity of the first carrier sheet 60 may be reduced due to the stretching of the surface of the first carrier sheet 60. When the viscosity of the supporting surface 61 is lower than the viscosity of the setting surface 71, the target 200 is easier to separate from the first supporting sheet 60 and stick to the second supporting sheet 70. Of course, in other periods, for example, when the pressing member 30 described later does not press the first supporting sheet 60, the viscosity of the supporting surface 61 may not be lower than the viscosity of the setting surface 71, which is not limited here.

本實施方式中,第二承載片70可以為印刷電路板(PCB),且在可以在印刷電路板上形成一層黏接層,例如膠水。在本實施方式中,目標物200即晶粒以發光二極體晶粒為例,第一承載片60以及第二承載片70以藍膜(blue tape)為例進行說明。在本實施方式中,第一承載片60是通過擴張環(expand ring)63進行固定,擴張環63包括內環631及外環632,第一承載片60的周緣通過內環631及外環632固定。In this embodiment, the second carrier sheet 70 may be a printed circuit board (PCB), and an adhesive layer, such as glue, may be formed on the printed circuit board. In this embodiment, the target 200, that is, the die, is a light-emitting diode die as an example, and the first carrier sheet 60 and the second carrier sheet 70 are described by using a blue tape as an example. In this embodiment, the first carrier sheet 60 is fixed by an expand ring 63. The expansion ring 63 includes an inner ring 631 and an outer ring 632. The periphery of the first carrier sheet 60 passes through the inner ring 631 and the outer ring 632. fixed.

可以理解,通過擴張環63拉伸第一承載片60的周緣,使得第一承載片60擴張而降低其黏度,以便於後續轉移目標物200。It can be understood that the peripheral edge of the first supporting sheet 60 is stretched by the expansion ring 63, so that the first supporting sheet 60 is expanded and its viscosity is reduced, so as to facilitate the subsequent transfer of the target 200.

當然,在其它實施方式中,第一承載片60還可以通過其它結構進行固定拉伸,在此不作限定。Of course, in other embodiments, the first supporting sheet 60 can also be fixed and stretched by other structures, which is not limited herein.

移動放置裝置20包括相向間隔且可相對平移的第一放置部21及第二放置部22,第一放置部21及第二放置部22分別用於放置第一承載片60和第二承載片70,使得第一承載片60和第二承載片70相向間隔且可相對平移,第一承載片60上的目標物200位於第一承載片60和第二承載片70之間。The mobile placement device 20 includes a first placement portion 21 and a second placement portion 22 that are spaced apart and can be relatively translated. The first placement portion 21 and the second placement portion 22 are used to place the first carrier sheet 60 and the second carrier sheet 70, respectively. , So that the first supporting sheet 60 and the second supporting sheet 70 are spaced apart from each other and can be relatively translated, and the target 200 on the first supporting sheet 60 is located between the first supporting sheet 60 and the second supporting sheet 70.

請結合參閱圖1~圖3,在本實施方式中,第一放置部21有第一承載區域23,用於放置第一承載片60,第二放置部22有第二承載區域24,用於放置第二承載片70。在本實施方式中,第一承載區域23為在第一承載片60放置於第一放置部21的情況下,與第一承載片60所在的平面一致的區域,第二承載區域24為在第二承載片70放置於第二放置部22的情況下,與第二承載片所在的平面一致的區域。換言之,第一承載區域23和第二承載區域24各自被定義為虛擬的平面區域,分別用於反映第一承載片60和第二承載片70放置於移動放置裝置20時的位置。故可以理解的是,當移動放置裝置20改變第一承載片60和/或第二承載片70的位置,第一承載區域23和第二承載區域24的位置也會相應的改變。Please refer to FIGS. 1 to 3 in combination. In this embodiment, the first placement portion 21 has a first supporting area 23 for placing the first supporting sheet 60, and the second placement portion 22 has a second supporting area 24 for placing Place the second carrier sheet 70. In this embodiment, the first bearing area 23 is an area that is consistent with the plane on which the first bearing sheet 60 is located when the first bearing sheet 60 is placed on the first placement portion 21, and the second bearing area 24 is located on the first bearing sheet 60. When the two supporting sheets 70 are placed on the second placement portion 22, an area consistent with the plane where the second supporting sheets is located. In other words, the first supporting area 23 and the second supporting area 24 are each defined as a virtual plane area, which respectively reflect the positions of the first supporting sheet 60 and the second supporting sheet 70 when placed on the mobile placement device 20. Therefore, it can be understood that when the mobile placement device 20 changes the positions of the first supporting sheet 60 and/or the second supporting sheet 70, the positions of the first supporting area 23 and the second supporting area 24 will also change accordingly.

進一步地,第一放置部21設置於基座10的一側,第一放置部21包括第一基台211及承載盤212,第一基台211可相對於基座10在第一方向X上移動地設置,承載盤212可在第二方向Y上移動地設置於第一基台211上,如此,使得擴張環63上的目標物200能夠沿第一方向X和第二方向Y往返移動,從而便於放置、拿取、平移擴張環63。Further, the first placement portion 21 is disposed on one side of the base 10. The first placement portion 21 includes a first base 211 and a carrier plate 212. The first base 211 can be in the first direction X relative to the base 10 The carrier plate 212 is movably arranged on the first base 211 in the second direction Y, so that the target 200 on the expansion ring 63 can move back and forth in the first direction X and the second direction Y. Thereby, it is convenient to place, take, and translate the expansion ring 63.

第二放置部22設置於基座10的另一側,第二放置部22包括第二基台221及夾持件222,第二基台221可相對於基座10在第一方向X上移動地設置,夾持件222用於夾持第二承載片70,夾持件222可在第二方向Y上移動地設置於第二基台221上,如此,第二承載片70能夠沿第一方向X和第二方向Y往返移動,從而便於放置、拿取、平移第二承載片70。The second placement portion 22 is disposed on the other side of the base 10, and the second placement portion 22 includes a second base 221 and a clamping member 222. The second base 221 can move in the first direction X relative to the base 10 The clamping member 222 is used to clamp the second carrier sheet 70, and the clamping member 222 is movably arranged on the second base 221 in the second direction Y. In this way, the second carrier sheet 70 can move along the first The direction X and the second direction Y move back and forth, thereby facilitating the placement, taking, and translation of the second carrier sheet 70.

頂推裝置30可移動地設置於第一承載區域23的背離第二承載片70的一側。在本實施方式中,頂推裝置30在水平面和/或垂直面能夠移動。具體地,在頂推目標物200之前,頂推裝置30位於頂推準備位置,在要對待頂推的目標物200進行頂推時,頂推裝置30從頂推準備位置移動至頂推工作位置,待頂推動作結束之後,頂推裝置30從頂推工作位置返回至頂推準備位置,如此,進行往返移動。在本實施方式中,目標物200是指承載於第一承載片60上的晶粒,待頂推的目標物200是指第一承載片60上的晶粒中,在頂推裝置30位於頂推工作位置時,位於頂推件31正下方的晶粒,頂推準備位置是指頂推裝置30的預設的初始位置,頂推工作位置是指頂推裝置30頂推目標物200時所處的位置。The pushing device 30 is movably disposed on a side of the first carrying area 23 away from the second carrying sheet 70. In this embodiment, the pushing device 30 can move on a horizontal plane and/or a vertical plane. Specifically, before pushing the target 200, the pushing device 30 is in the pushing preparation position. When the target 200 to be pushed is to be pushed, the pushing device 30 moves from the pushing preparation position to the pushing working position After the pushing action ends, the pushing device 30 returns from the pushing working position to the pushing ready position, and in this way, it moves back and forth. In this embodiment, the target 200 refers to the crystal grains carried on the first supporting sheet 60, and the target 200 to be pushed refers to the crystal grains on the first supporting sheet 60, and the pushing device 30 is located on the top. When pushing the working position, the die located directly below the pushing member 31, the pushing preparation position refers to the preset initial position of the pushing device 30, and the pushing working position refers to the position when the pushing device 30 pushes the target 200 Location.

具體地,頂推裝置30包括頂推件31及頂針蓋32,頂推件31可凸伸出頂針蓋32的腔體320內,以頂推目標物200,從而將第一承載片60上的目標物200轉移至第二承載片70。在本實施方式中,頂推件31可為頂針(Needle)。Specifically, the pushing device 30 includes a pushing member 31 and a thimble cover 32. The pushing member 31 can protrude out of the cavity 320 of the thimble cover 32 to push the target 200, so as to push the target 200 on the first carrier sheet 60. The target 200 is transferred to the second carrier sheet 70. In this embodiment, the pushing member 31 may be a needle (Needle).

具體而言,當頂推件31要頂推目標物200時,頂針蓋32的腔體320內成為真空狀態,如此,頂針蓋32的底部將吸附第一承載片60,使得頂針蓋32的底部與第一承載片60的接觸面62接觸,之後頂推件31伸出頂針蓋32並頂推目標物200,以將目標物200從第一承載片60轉移至第二承載片70,之後,頂推件31返回至頂針蓋32內。可以理解,通過將頂推件31可凸伸出地設置於頂針蓋32內,當頂推件31頂推目標物200之後,頂針蓋32的底部與第一承載片60的接觸面62接觸,從而能夠防止第一承載片60黏附於頂推件31的前端而發生偏移,如此,能夠有效地提高頂推效率。Specifically, when the pushing member 31 pushes the target 200, the cavity 320 of the thimble cover 32 becomes a vacuum state. In this way, the bottom of the thimble cover 32 will absorb the first carrier sheet 60, so that the bottom of the thimble cover 32 Contact with the contact surface 62 of the first supporting sheet 60, and then the pushing member 31 extends out of the thimble cover 32 and pushes the target 200 to transfer the target 200 from the first supporting sheet 60 to the second supporting sheet 70, and then, The ejector 31 returns to the ejector cover 32. It can be understood that by arranging the ejector 31 protrudingly in the ejector cover 32, after the ejector 31 pushes the target 200, the bottom of the ejector cover 32 contacts the contact surface 62 of the first carrier sheet 60, Therefore, it is possible to prevent the first carrier sheet 60 from sticking to the front end of the pushing member 31 and shifting. In this way, the pushing efficiency can be effectively improved.

進一步地,請結合參閱圖5,按壓件40可移動地設置於第一承載區域23的背離第二承載區域24的一側,用於按壓第一承載片60,使得第一承載片60上的待頂推的目標物200的設置區域靠近第二承載片70。Further, referring to FIG. 5, the pressing member 40 is movably disposed on the side of the first supporting area 23 away from the second supporting area 24, and is used to press the first supporting sheet 60 so that the pressure on the first supporting sheet 60 The setting area of the target 200 to be pushed is close to the second carrier sheet 70.

可以理解,在本實施方式中,按壓件40能夠在垂直面移動。It can be understood that, in this embodiment, the pressing member 40 can move on a vertical surface.

具體地,在頂推目標物200之前,按壓件40位於按壓準備位置,在要對目標物200進行頂推時,按壓件40從按壓準備位置移動至按壓工作位置,直至第一承載片60的所有目標物200都轉移至第二承載片70之後,按壓件40從按壓工作位置返回至按壓準備位置。當然,也可以在每頂推完一個(或數個)目標物200之後,按壓件40從按壓工作位置返回至按壓準備位置,對此不作限定。按壓準備位置是指按壓件40的默認的初始位置,按壓工作位置是指按壓件40按壓第一承載片60時所處的位置。Specifically, before pushing the target 200, the pressing member 40 is located at the pressing preparation position. When the target 200 is to be pushed, the pressing member 40 moves from the pressing preparation position to the pressing working position until the first carrier sheet 60 is pressed. After all the targets 200 are transferred to the second carrier sheet 70, the pressing member 40 returns from the pressing working position to the pressing ready position. Of course, it is also possible to return the pressing member 40 from the pressing working position to the pressing ready position after every one (or several) targets 200 are pushed out, which is not limited. The pressing preparation position refers to the default initial position of the pressing member 40, and the pressing working position refers to the position where the pressing member 40 presses the first carrier sheet 60.

當然,在其它實施方式中,按壓件40也能夠在水平面及垂直面移動,在此不作限定。Of course, in other embodiments, the pressing member 40 can also move on a horizontal plane and a vertical plane, which is not limited here.

可以理解,在本實施方式中,只要確保第一承載片60中的與按壓件40接觸的區域即對應於頂推裝置30頂推目標物200的區域在按壓件40的按壓作用下向第二承載片70靠近即可,在此不作限定。It can be understood that, in this embodiment, as long as it is ensured that the area of the first carrier sheet 60 that is in contact with the pressing member 40 corresponds to the area where the pushing device 30 pushes the target 200 under the pressing action of the pressing member 40, it moves toward the second The supporting sheet 70 only needs to be close, and it is not limited here.

具體地,請結合參閱圖5~圖8,按壓件40形成一第二缺口411,第二缺口411設置於按壓件40靠近第一承載區域23的一側,用於供頂推裝置30的頂推件31的前端沿預設移動方向穿過以頂推至少一個目標物200。在本實施方式中,第二缺口411用於供頂針蓋32的底部和頂推件31穿過。在本實施方式中,預設移動方向為後述的第三方向Z,也可以說是第一承載區域23朝向第二承載區域24的方向。當然,在其它實施方式中,可以根據需求進行相應的調整,在此不作限定。Specifically, referring to FIGS. 5 to 8, the pressing member 40 forms a second notch 411, and the second notch 411 is provided on the side of the pressing member 40 close to the first carrying area 23 for the top of the pushing device 30. The front end of the pushing member 31 passes along the preset moving direction to push at least one target 200. In this embodiment, the second notch 411 is used to allow the bottom of the thimble cover 32 and the pusher 31 to pass through. In this embodiment, the preset moving direction is the third direction Z described later, which can also be said to be the direction in which the first bearing area 23 faces the second bearing area 24. Of course, in other embodiments, corresponding adjustments can be made according to requirements, which is not limited here.

進一步地,第二缺口411可為封閉式缺口,例如呈“O”字狀、“口”字狀等。在其它實施方式中,第二缺口411也可以為開放式的缺口,例如呈“C”、“ㄈ”字狀等。在本實施方式中,該第二缺口411為圓孔,即呈“O”字狀。在一些實施方式中,該第二缺口411雖大致呈圓孔或其他封閉式缺口,但該第二缺口411的邊緣可包含一或多個切口。進一步說,以該第二缺口411的邊緣具有一個切口的情況為例,該第二缺口411會呈“C”字狀,以此類推。當然,在其它實施方式中,該第二缺口411還可為其它的形狀,在此不作限定。Further, the second gap 411 may be a closed gap, for example, in an "O" shape, a "口" shape, or the like. In other embodiments, the second gap 411 may also be an open gap, for example, in the shape of "C", "ㄈ", and the like. In this embodiment, the second notch 411 is a round hole, that is, in the shape of an "O". In some embodiments, although the second notch 411 is substantially a round hole or other closed notch, the edge of the second notch 411 may include one or more notches. Furthermore, taking the case where the edge of the second notch 411 has a notch as an example, the second notch 411 will have a "C" shape, and so on. Of course, in other embodiments, the second notch 411 can also have other shapes, which is not limited here.

進一步地,按壓件40包括按壓環41、側壁42及安裝部43,按壓環41限定第二缺口411。Further, the pressing member 40 includes a pressing ring 41, a side wall 42 and a mounting portion 43, and the pressing ring 41 defines a second notch 411.

可以理解,第二缺口411的直徑沒有特別限制,只要能夠允許頂推裝置30的至少部分穿過,在本實施方式中,第二缺口411允許頂推裝置30的頂針蓋32的底部穿過,不會妨礙到頂推件31頂推目標物200即可。更具體地,第二缺口411的直徑為6mm以上,在一優選實施方式中,第二缺口411的直徑為16mm。另外,在一具體實施方式中,按壓環41的內徑D1為13.5mm,外徑D2為16.0mm。在一些實施方式中,內徑的範圍約8mm~20mm,按壓環41的環寬度D3的範圍約1~2mm。It can be understood that the diameter of the second gap 411 is not particularly limited, as long as it can allow at least part of the ejector device 30 to pass through. In this embodiment, the second gap 411 allows the bottom of the ejector pin cover 32 of the ejector device 30 to pass through. It does not prevent the pushing member 31 from pushing the target 200. More specifically, the diameter of the second notch 411 is 6 mm or more. In a preferred embodiment, the diameter of the second notch 411 is 16 mm. In addition, in a specific embodiment, the inner diameter D1 of the pressing ring 41 is 13.5 mm, and the outer diameter D2 is 16.0 mm. In some embodiments, the inner diameter ranges from about 8 mm to 20 mm, and the ring width D3 of the pressing ring 41 ranges from about 1 to 2 mm.

可以理解,通過將第二缺口411的直徑設置為允許頂針蓋32的底部穿過,能夠降低擴張環63在水準移動時,第一承載片60與按壓環41之間的摩擦力,並使第一承載片60中的與按壓件40接觸的區域的張力更加穩定。當然,按壓環41的直徑可以根據需求進行相應地調整,在此不作限定。It can be understood that by setting the diameter of the second notch 411 to allow the bottom of the thimble cover 32 to pass through, the friction between the first carrier plate 60 and the pressing ring 41 can be reduced when the expansion ring 63 moves horizontally, and the The tension of the area in contact with the pressing member 40 in a carrier sheet 60 is more stable. Of course, the diameter of the pressing ring 41 can be adjusted accordingly according to requirements, which is not limited here.

進一步地,按壓環41的底表面412與側表面413的連接處形成倒圓角(R角),R角的圓弧角例如為0.5mm,以防止按壓環41的底表面412與第一承載片60接觸,且第一承載片60水準移動時把第一承載片60刮破。在其他實施方式中,若第一承載片60可承受按壓環41在其上移動摩擦而不被刮破,亦可允許將按壓環41的底表面412與側表面413的連接處形成為其他形狀,例如鈍角。Further, the connection between the bottom surface 412 of the pressing ring 41 and the side surface 413 forms a rounded corner (R angle), and the arc angle of the R angle is, for example, 0.5 mm to prevent the bottom surface 412 of the pressing ring 41 from being connected to the first load. The sheet 60 is in contact, and when the first supporting sheet 60 moves horizontally, the first supporting sheet 60 is scratched. In other embodiments, if the first carrier sheet 60 can bear the movement and friction of the pressing ring 41 on it without being scratched, it may also allow the connection between the bottom surface 412 and the side surface 413 of the pressing ring 41 to be formed into other shapes , Such as obtuse angles.

在本實施方式中,側壁42設置於按壓環41上,側壁42為鏤空結構。具體的,側壁42的遠離第一承載區域23的一側開設有第一缺口420,第一缺口420供頂推裝置30穿過。具體地,供頂推裝置30穿過,以從頂推準備位置到頂推工作位置之間往返移動。In this embodiment, the side wall 42 is disposed on the pressing ring 41, and the side wall 42 is a hollow structure. Specifically, a side of the side wall 42 away from the first bearing area 23 is provided with a first notch 420, and the first notch 420 allows the pushing device 30 to pass through. Specifically, the pushing device 30 is passed through to move back and forth from the pushing preparation position to the pushing working position.

可以理解,第一缺口420的大小不作限定,只要不會妨礙頂推裝置30穿過該第一缺口420而往返於頂推準備位置和頂推工作位置即可。在本實施方式中,第一缺口420貫穿側壁42的兩側,即第一缺口420從側壁42的遠離按壓環41的一側延伸至按壓環41。It can be understood that the size of the first gap 420 is not limited, as long as it does not prevent the pushing device 30 from passing through the first gap 420 to go back and forth between the pushing preparation position and the pushing working position. In this embodiment, the first notch 420 penetrates both sides of the side wall 42, that is, the first notch 420 extends from the side of the side wall 42 away from the pressing ring 41 to the pressing ring 41.

在本實施方式中,預設移動方向為縱向(或是頂推件31的長度方向),當然,在其它實施方式中,可以根據需求進行調整,在此不作限定。In this embodiment, the preset moving direction is the longitudinal direction (or the length direction of the pusher 31). Of course, in other embodiments, it can be adjusted according to requirements, which is not limited here.

進一步地,側壁42上還開設有穿孔422。穿孔422與第一缺口420相對設置。Furthermore, the side wall 42 is also provided with a through hole 422. The through hole 422 is opposite to the first notch 420.

在本實施方式中,安裝部43大致呈“C”字狀,安裝部43與按壓環41相對設置,分別設置於側壁42的兩側。In this embodiment, the mounting portion 43 is substantially shaped like a "C", and the mounting portion 43 is disposed opposite to the pressing ring 41, and is respectively disposed on both sides of the side wall 42.

進一步地,安裝部43上開設有多個安裝孔430,以通過固定機構(未圖示)安裝於基座10上。在本實施方式中,安裝部43的厚度隨著遠離側壁42增加,以便於在安裝部43上開設安裝孔430,從而安裝於基座10上。Further, the mounting portion 43 is provided with a plurality of mounting holes 430 for mounting on the base 10 by a fixing mechanism (not shown). In this embodiment, the thickness of the mounting portion 43 increases as it moves away from the side wall 42, so that a mounting hole 430 is formed on the mounting portion 43 to be mounted on the base 10.

可以理解,通過將安裝部43設置為C字狀,如此,按壓件40一側設置有側壁42,而另一側未設置形成第一缺口420,用於供頂推裝置30穿過而移動到頂推工作位置,即頂推目標物200的位置的正上方。此外,第一缺口420與側壁42中的穿孔422相對設置,有便於兩側的光源(未圖示)分別通過第一缺口420及穿孔422,從而有助於在取像時打光。It can be understood that by setting the mounting portion 43 in a C shape, the pressing member 40 is provided with a side wall 42 on one side, and the other side is not provided with a first notch 420 for the pushing device 30 to pass through and move to the top. The pushing working position is directly above the position of pushing the target 200. In addition, the first notch 420 is disposed opposite to the perforation 422 in the side wall 42 so that light sources (not shown) on both sides can pass through the first notch 420 and the perforation 422 respectively, thereby facilitating lighting during image capturing.

進一步地,在按壓件40按壓第一承載片60之前,第一承載片60與第二承載片70之間的距離為一預定值,例如1.5mm。按壓件40可沿著第三方向Z移動並按壓第一承載片60,以進一步微調第一承載片60與第二承載片70之間的距離。舉例來說,在按壓件40按壓第一承載片60時,按壓件40可沿第三方向Z下壓,使第一承載片60的要頂推的目標物200的設置區域和第二承載片70之間的距離縮短至特定值,例如0.5mm或以下,例如0.2mm、0.4mm等。Further, before the pressing member 40 presses the first supporting sheet 60, the distance between the first supporting sheet 60 and the second supporting sheet 70 is a predetermined value, for example, 1.5 mm. The pressing member 40 can move along the third direction Z and press the first supporting sheet 60 to further fine-tune the distance between the first supporting sheet 60 and the second supporting sheet 70. For example, when the pressing member 40 presses the first supporting sheet 60, the pressing member 40 can be pressed down in the third direction Z, so that the setting area of the target 200 to be pushed by the first supporting sheet 60 and the second supporting sheet The distance between 70 is shortened to a specific value, such as 0.5 mm or less, such as 0.2 mm, 0.4 mm, and so on.

當然,在其它實施方式中,按壓件40還能夠採用其它的結構,只要能夠按壓到第一承載片60,使得第一承載片60的要頂推的目標物200的設置區域向第二承載片70靠近即可,其具體結構不受限制。Of course, in other embodiments, the pressing member 40 can also adopt other structures, as long as it can be pressed to the first supporting sheet 60, so that the setting area of the target 200 to be pushed by the first supporting sheet 60 faces the second supporting sheet. 70 can be close, and its specific structure is not limited.

影像擷取裝置50通過固定元件51固定地設置於基座10上,並位於第一承載區域23的背離第二承載區域24的一側,用於對要頂推的目標物200進行取像。對於固定元件51,可以採用公知的固定結構,在此不再贅述。The image capturing device 50 is fixedly disposed on the base 10 through the fixing element 51 and is located on the side of the first bearing area 23 away from the second bearing area 24, and is used to capture images of the target 200 to be pushed. For the fixing element 51, a well-known fixing structure can be used, which will not be repeated here.

影像擷取裝置50的設置並無特別限制,只要對應目標物200設置而能對目標物200進行取像便可。在本實施方式中,影像擷取裝置50可為攝影機(CCD),但不限定於此。The setting of the image capturing device 50 is not particularly limited, as long as it is set corresponding to the target 200 so that the target 200 can be imaged. In this embodiment, the image capturing device 50 may be a camera (CCD), but it is not limited thereto.

在頂推目標物200時,影像擷取裝置50與頂推裝置30彼此間的相對位置為同軸,且在頂推裝置30頂推目標物200之前,可通過影像擷取裝置50拍照、取像進而精準地計算目標物200的位置,從而將要頂推的目標物200移動至頂推裝置30的正中心,即要頂推的目標物200與頂推裝置30、按壓件40以及影像擷取裝置50彼此間的相對位置為同軸,確保每顆要頂推的目標物200的位置精度及頂推裝置30內的頂推件31能頂推到目標物200的正中心,因目標物200為晶粒,體積較小,約為0.08~0.15mm的長方體,若頂推件31偏移0.01mm以上則容易導致在頂推過程中出現翻晶或置下歪斜等情況。When pushing the target 200, the relative position between the image capturing device 50 and the pushing device 30 is coaxial, and before the pushing device 30 pushes the target 200, the image capturing device 50 can take pictures and images Then accurately calculate the position of the target 200, so that the target 200 to be pushed is moved to the exact center of the pushing device 30, that is, the target 200 to be pushed, the pushing device 30, the pressing member 40, and the image capturing device The relative position of 50 to each other is coaxial to ensure the position accuracy of each target 200 to be pushed and the pushing member 31 in the pushing device 30 can be pushed to the exact center of the target 200, because the target 200 is a crystal. Granules, small in volume, about 0.08~0.15mm rectangular parallelepiped, if the pusher 31 is offset by more than 0.01mm, it is easy to cause the crystal turning or the lowering skew during the pushing process.

優選地,在本實施方式中,影像擷取裝置50通過直接、正視取像來對目標物200進行取像。Preferably, in this embodiment, the image capturing device 50 captures the target object 200 by directly viewing the image.

在本實施方式中,頂推裝置30、按壓件40及影像擷取裝置50同一側,當然,在其它實施方式中,頂推裝置30、按壓件40及影像擷取裝置50也可以位於不同側,只要將頂推裝置30及按壓件40設置為位於同一側即可。例如,頂推裝置30及按壓件40位於與影像擷取裝置50不同的一側,此時,影像擷取裝置50位於第二承載區域24的背離第一承載片60的一側,而頂推裝置30及按壓件40位於第一承載片60的背離第二承載區域24的一側。In this embodiment, the pushing device 30, the pressing member 40, and the image capturing device 50 are on the same side. Of course, in other embodiments, the pushing device 30, the pressing member 40, and the image capturing device 50 can also be located on different sides. , As long as the pushing device 30 and the pressing member 40 are arranged on the same side. For example, the pushing device 30 and the pressing member 40 are located on a side different from the image capturing device 50. At this time, the image capturing device 50 is located on the side of the second supporting area 24 away from the first supporting sheet 60, and the pushing The device 30 and the pressing member 40 are located on the side of the first supporting sheet 60 away from the second supporting area 24.

可以理解,頂推裝置30位於頂推準備位置時,頂推裝置30不會對影像擷取裝置50擷取按壓件40內的目標物200的影像造成影響。頂推裝置30在頂推準備位置與頂推工作位置之間移動的目的在於:影像擷取裝置50能夠輕易地擷取目標物200的影像,不需要通過額外的光學反射。It can be understood that when the pushing device 30 is in the pushing preparation position, the pushing device 30 will not affect the image capturing device 50 of the target 200 in the pressing member 40. The purpose of the pushing device 30 moving between the pushing preparation position and the pushing working position is that the image capturing device 50 can easily capture the image of the target 200 without additional optical reflection.

請結合參閱圖9的(a)~(d),對轉移設備100移動並轉移晶粒的動作流程作進一步說明。Please refer to (a) to (d) of FIG. 9 to further describe the operation flow of the transfer device 100 to move and transfer the die.

請參閱圖9的(a),影像擷取裝置50進行取像,並計算晶粒1與頂推位置O之間的位置偏差d1、以及晶粒1與晶粒2之間的位置偏差d2。可以理解,頂推位置O是始終保持不變的,位置偏差d1為晶粒1的中心與頂推位置O之間的距離,位置偏差d2為晶粒1的中心與晶粒2的中心之間的距離。位置偏差d2又可稱為晶粒間距(pitch)。Referring to (a) of FIG. 9, the image capturing device 50 takes an image, and calculates the position deviation d1 between the die 1 and the pushing position O, and the position deviation d2 between the die 1 and the die 2. It can be understood that the pushing position O is always constant, the position deviation d1 is the distance between the center of the die 1 and the pushing position O, and the position deviation d2 is between the center of the die 1 and the center of the die 2. distance. The position deviation d2 can also be referred to as the pitch.

接著,請參閱圖9的(b),根據d1,晶粒1被移至頂推位置O。可以理解,將晶粒1移至頂推位置O,是指通過移動第一承載片60,使得晶粒1與頂推位置O重疊,下述將晶粒2移至頂推位置O也是同樣的。Next, referring to FIG. 9(b), according to d1, the die 1 is moved to the pushing position O. It can be understood that moving the die 1 to the pushing position O means that by moving the first carrier 60, the die 1 overlaps the pushing position O. The following is the same for moving the die 2 to the pushing position O .

接著,從頂推準備位置移至頂推工作位置的頂推裝置30頂推晶粒1,以將晶粒1從第一承載片60轉移到第二承載片70上。Then, the pushing device 30 moved from the pushing preparation position to the pushing working position pushes the die 1 to transfer the die 1 from the first supporting sheet 60 to the second supporting sheet 70.

請參閱圖9的(c),將晶粒1頂推至第二承載片70後,移動放置裝置20根據d2移動第一承載片60,以將晶粒2移至頂推位置O。不過,由於頂推裝置30在頂推晶粒1之後,無論頂推時是否有戳破第一承載片60,皆可能使第一承載片60的張力或其他特性產生變化,使得第一承載片60上的其他晶粒(例如晶粒2、晶粒3)的位置發生改變。因此,僅根據d2來移動晶粒2的話很可能無法將晶粒2精準地移至頂推位置O。如圖9的(c)所示,單憑d2來移動晶粒2,並無法使晶粒2精準地對齊頂推位置O。Please refer to FIG. 9( c ). After the die 1 is pushed to the second supporting sheet 70, the mobile placement device 20 moves the first supporting sheet 60 according to d2 to move the die 2 to the pushing position O. However, since the pushing device 30 pushes the die 1, regardless of whether the first supporting sheet 60 is punctured during the pushing process, the tension or other characteristics of the first supporting sheet 60 may change, so that the first supporting sheet 60 The position of other crystal grains on 60 (for example, crystal grain 2, crystal grain 3) changes. Therefore, if the die 2 is moved only according to d2, it is likely that the die 2 cannot be accurately moved to the pushing position O. As shown in FIG. 9(c), moving the die 2 by d2 alone cannot accurately align the die 2 with the pushing position O.

接著,類似於圖9中的(a)的動作,影像擷取裝置50對晶粒2進行取像,並計算晶粒2與頂推位置O之間的位置偏差、以及晶粒2與下一顆待頂推的晶粒(例如,晶粒3)之間的位置偏差(即pitch)。應注意的是,頂推裝置30在完成頂推晶粒1之後,會從頂推工作位置返回頂推準備位置,以避免阻礙影像擷取裝置50對晶粒2進行取像。Next, similar to the action of (a) in FIG. 9, the image capturing device 50 takes an image of the die 2, and calculates the position deviation between the die 2 and the pushing position O, and the die 2 and the next The position deviation (ie pitch) between the die to be pushed (for example, die 3). It should be noted that after the pushing device 30 has completed pushing the die 1, it will return to the pushing preparation position from the pushing working position to avoid hindering the image capturing device 50 from capturing images of the die 2.

之後,請參閱圖9的(d),類似於圖9中的(b)的動作,移動放置裝置20根據前述計算出的晶粒2與頂推位置O之間的位置偏差,移動第一承載片60以對晶粒2的位置進行微調,使得晶粒2精準地位於頂推位置O。頂推裝置30則會再次由頂推準備位置進入頂推工作位置,以對晶粒2進行頂推。Afterwards, please refer to Figure 9(d). Similar to the action of Figure 9(b), the mobile placement device 20 moves the first carrier according to the position deviation between the die 2 and the pushing position O calculated above. The sheet 60 fine-tunes the position of the die 2 so that the die 2 is accurately located at the pushing position O. The pushing device 30 will again enter the pushing working position from the pushing ready position to push the die 2.

上述圖9的(a)~(d)的動作大致包括影像擷取裝置50對晶粒進行取像的「取像階段」、根據取像結果將晶粒精準移到頂推位置O的「中心(center)定位階段」、將晶粒頂推至第二承載片70的「頂推階段」、以及根據取像階段得到的pitch來移動下一顆晶粒的「pitch定位階段」。在一些實施方式中,上述四個階段可依序並反覆地執行,以逐一將第一承載片60上的晶粒轉移至第二承載片70上。The actions of (a) to (d) in FIG. 9 roughly include the "imaging stage" in which the image capturing device 50 captures the crystal grain, and accurately moves the crystal grain to the "center (") of the pushing position O according to the imaging result. center) positioning stage", the "pushing stage" of pushing the die to the second carrier 70, and the "pitch positioning stage" of moving the next die according to the pitch obtained during the imaging stage. In some embodiments, the above four stages can be performed sequentially and repeatedly to transfer the crystal grains on the first carrier sheet 60 to the second carrier sheet 70 one by one.

轉移設備100還包括第一驅動裝置80,第一驅動裝置80用於控制按壓件40在垂直面移動。更具體地,第一驅動裝置80用於控制按壓件40在第三方向Z(即預設移動方向)上移動。The transfer device 100 further includes a first driving device 80 for controlling the pressing member 40 to move in a vertical plane. More specifically, the first driving device 80 is used to control the pressing member 40 to move in the third direction Z (ie, the preset moving direction).

進一步地,按壓件40也可以在第一驅動裝置80的控制作用下在水平面和垂直面移動。可以理解,按壓件40能夠在水平面移動,以對該按壓件40進行維修或者更換。換言之,除了沿垂直面(即包含第一移動方向的平面)移動,亦允許按壓件40在水平面上移動(例如從維護位置移動至按壓準備位置,或從按壓準備位置返回維護位置),以方便人員對該按壓件40進行維修或者更換。Further, the pressing member 40 can also be moved on a horizontal plane and a vertical plane under the control of the first driving device 80. It can be understood that the pressing member 40 can be moved on a horizontal plane to repair or replace the pressing member 40. In other words, in addition to moving along the vertical plane (that is, the plane containing the first movement direction), the pressing member 40 is also allowed to move on the horizontal plane (for example, from the maintenance position to the pressing preparation position, or from the pressing preparation position back to the maintenance position) for convenience The person repairs or replaces the pressing member 40.

更具體地,在擴張環63載置於承載盤212後,要對第一承載片60上的目標物200進行頂推時,按壓件40在第一驅動裝置80的控制下,移動至第一承載片60上並按壓第一承載片60,使得第一承載片60的要頂推的目標物200的設置區域向第二承載片70靠近,且持續保持按壓第一承載片60,直至第一承載片60上的目標物200全部轉移至第二承載片70上,在第一驅動裝置80的控制下,移動至按壓準備位置。待作業人員更換下一擴張環63後,重複上述動作。More specifically, after the expansion ring 63 is placed on the carrier plate 212, when the target 200 on the first carrier sheet 60 is to be pushed, the pressing member 40 moves to the first under the control of the first driving device 80. On the supporting sheet 60 and pressing the first supporting sheet 60, so that the setting area of the target 200 to be pushed by the first supporting sheet 60 approaches the second supporting sheet 70, and the first supporting sheet 60 is continuously pressed until the first supporting sheet 60 is pressed. All the objects 200 on the supporting sheet 60 are transferred to the second supporting sheet 70, and under the control of the first driving device 80, they are moved to the pressing preparation position. After the operator replaces the next expansion ring 63, the above actions are repeated.

轉移設備100還包括第二驅動裝置90,其用於控制頂推裝置30沿特定軌跡移動。所述特定軌跡可對應所述頂推裝置30在第一方向X、第二方向Y、及/或第三方向上的位置改變。舉例來說,所述特定軌跡可大致呈弧線狀。然而本揭露並不限於此,所述特定軌跡亦可呈直線或其他形狀,只需所述特定軌跡可供頂推裝置30往返移動於不同特定位置(例如,頂推準備位置、頂推工作位置等)即可。The transfer device 100 further includes a second driving device 90 which is used to control the pushing device 30 to move along a specific trajectory. The specific trajectory may correspond to changes in the position of the pushing device 30 in the first direction X, the second direction Y, and/or the third direction. For example, the specific trajectory may be substantially arc-shaped. However, the present disclosure is not limited to this. The specific trajectory can also be linear or other shapes, as long as the specific trajectory can be used for the pushing device 30 to move back and forth to different specific positions (for example, the pushing preparation position, the pushing working position Etc.).

可以理解,在影像擷取裝置50對要頂推的目標物200取像之後,第二驅動裝置90控制頂推裝置30從頂推準備位置移動至頂推工作位置,頂推件31穿過按壓件40頂推目標物200之後,頂推裝置30從頂推工作位置返回至頂推準備位置,待影像擷取裝置50對下一顆要頂推的目標物200取像之後,第二驅動裝置90再次控制頂推裝置30從頂推準備位置移動至頂推工作位置,如此進行反覆,從而將第一承載片60上的目標物200轉移至第二承載片70上。It can be understood that after the image capturing device 50 captures the image of the target 200 to be pushed, the second driving device 90 controls the pushing device 30 to move from the pushing preparation position to the pushing working position, and the pushing member 31 passes through and presses After the piece 40 pushes the target 200, the pushing device 30 returns from the pushing working position to the pushing ready position. After the image capturing device 50 takes an image of the next target 200 to be pushed, the second driving device 90 again controls the pushing device 30 to move from the pushing preparation position to the pushing working position, and so on, so as to transfer the target 200 on the first supporting sheet 60 to the second supporting sheet 70.

用於放置目標物200的第一承載片60的面積較大,頂推件31直接頂推第一承載片60上的目標物200時張力不易受控制,容易波及整個第一承載片60。而在本實施方式中,在頂推目標物200時,按壓件40移動至與第一承載片60的接觸面62接觸並按壓第一承載片60,使得第一承載片60的要頂推的目標物200的設置區域向第二承載片70靠近,這樣,張力的變化不易波及整個第一承載片60,從而容易對要頂推的目標物200的設置區域的張力進行控制。The area of the first supporting sheet 60 for placing the target 200 is relatively large. When the pushing member 31 directly pushes the target 200 on the first supporting sheet 60, the tension is not easily controlled and easily spreads to the entire first supporting sheet 60. In this embodiment, when the target 200 is pushed, the pressing member 40 moves to contact with the contact surface 62 of the first supporting sheet 60 and presses the first supporting sheet 60, so that the first supporting sheet 60 is to be pushed. The setting area of the target 200 is close to the second supporting sheet 70, so that the change of tension does not easily spread to the entire first supporting sheet 60, so that the tension of the setting area of the target 200 to be pushed can be easily controlled.

進一步地,由於材料、加工等原因,第一承載片60與第二承載片70之間的間距較大,通常,第一承載片60與第二承載片70之間的間距達到1.5mm以上,而優選的作業距離,即優選的方案中,第一承載片60與第二承載片70之間的間距需要在0.5mm以下。在本實施方式中,通過設置按壓件40按壓第一承載片60,使得第一承載片60的要頂推的目標物200的設置區域向第二承載片70靠近,使得第一承載片60的要頂推的目標物200的設置區域與第二承載片70之間的間距處於預設範圍內,例如0.5mm以下,以便於頂推件31頂推目標物200。如此,通過設置按壓件40,能夠對第一承載片60與第二承載片70之間的距離進行有效地控制。當然,第一承載片60的要頂推的目標物200的設置區域與第二承載片70之間的間距可以根據需求進行相應的調整,在此不作限定。Further, due to material, processing and other reasons, the distance between the first supporting sheet 60 and the second supporting sheet 70 is relatively large. Generally, the distance between the first supporting sheet 60 and the second supporting sheet 70 reaches 1.5 mm or more. The preferred working distance, that is, in a preferred solution, the distance between the first supporting sheet 60 and the second supporting sheet 70 needs to be 0.5 mm or less. In this embodiment, the first supporting sheet 60 is pressed by the pressing member 40, so that the setting area of the target 200 to be pushed by the first supporting sheet 60 approaches the second supporting sheet 70, so that the first supporting sheet 60 The distance between the setting area of the target 200 to be pushed and the second carrier sheet 70 is within a preset range, for example, 0.5 mm or less, so that the pushing member 31 pushes the target 200. In this way, by providing the pressing member 40, the distance between the first carrier sheet 60 and the second carrier sheet 70 can be effectively controlled. Of course, the distance between the setting area of the target 200 to be pushed on the first supporting sheet 60 and the second supporting sheet 70 can be adjusted accordingly according to requirements, which is not limited herein.

在本實施方式中,由於擴張環63通常是由人工擺放並且通過固定結構進行固定,此外,擴張環63中的內環631和外環632在結合時也可能會存在公差,若通過擴張環63自身來實現高度控制,以對第一承載片60與第二承載片70之間的距離進行微調,則需要更高的成本。In this embodiment, since the expansion ring 63 is usually placed manually and fixed by a fixed structure, in addition, the inner ring 631 and the outer ring 632 in the expansion ring 63 may have tolerances when they are combined. The height control of 63 itself to fine-tune the distance between the first carrier sheet 60 and the second carrier sheet 70 requires a higher cost.

這是因為除了整個擴張環63的面積較大而難以控制外,難以確保人工擺放擴張環63的位置均一致,即每個階段的擴張環63的擺放位置存在差異,難以將第一承載片60的高度調整到一致,如此,便難以確保第一承載片60與第二承載片70之間的距離。而在本實施方式中,通過按壓件40對第一承載片60進行按壓,由於按壓件40的按壓工作位置是固定的,如此,即使每個階段的擴張環63的擺放位置存在差異,通過按壓件40按壓,能夠將第一承載片60的要頂推的目標物200的設置區域與第二承載片70之間的距離一致,即能夠容易地實現高度控制。This is because in addition to the large area of the entire expansion ring 63 which is difficult to control, it is difficult to ensure that the positions of the expansion ring 63 manually placed are consistent. The height of the sheet 60 is adjusted to be the same, so it is difficult to ensure the distance between the first supporting sheet 60 and the second supporting sheet 70. In this embodiment, the first carrier sheet 60 is pressed by the pressing member 40. Since the pressing work position of the pressing member 40 is fixed, even if the placement position of the expansion ring 63 is different at each stage, The pressing member 40 is pressed to be able to make the distance between the setting area of the target 200 to be pushed on the first supporting sheet 60 and the second supporting sheet 70 consistent, that is, the height control can be easily achieved.

例如,在不設置按壓件40的情況下,假設第一承載片60在初始人工擺放時未與第二承載片70完全平行,比如,第一承載片60左側高於右側,如此,在轉移第一承載片60的左側的目標物200時,位於左側的第一承載片60與第二承載片70之間的距離較大,反之轉移右側目標物200時,位於右側的第一承載片60 到第二承載片70之間的距離較小,如此,即使頂推裝置30在同一位置頂推目標物200,即頂推路徑相同,也會導致頂推的結果不同,也就是說,這兩種情況下實際上頂推目標物200後目標物200向第二承載片70移動的距離不同。而通過設置按壓件40對第一承載片60進行按壓,即使出現上述情況,也能確保在頂推左側和右側的目標物200時,目標物200向第二承載片70移動的距離均相同。For example, if the pressing member 40 is not provided, it is assumed that the first carrier sheet 60 is not completely parallel to the second carrier sheet 70 when initially placed manually. For example, the left side of the first carrier sheet 60 is higher than the right side. When the target 200 is on the left side of the first carrying sheet 60, the distance between the first carrying sheet 60 on the left and the second carrying sheet 70 is relatively large. On the contrary, when the target 200 on the right is transferred, the first carrying sheet 60 on the right is The distance to the second carrier sheet 70 is small. Thus, even if the pushing device 30 pushes the target 200 at the same position, that is, the same pushing path, the pushing results will be different, that is, the two In this case, the distance that the target 200 moves to the second carrier sheet 70 after the target 200 is actually pushed is different. By setting the pressing member 40 to press the first supporting sheet 60, even if the above situation occurs, it can be ensured that when the target 200 on the left and right is pushed, the distance of the target 200 moving to the second supporting sheet 70 is the same.

而且,工業用的CCD由於需要高速取像,因此,通常不具有自動對焦的功能,通過設置按壓環41按壓第一承載片60,使得第一承載片60的要頂推的目標物200的設置區域保持在固定位置,能夠維持固定的焦距,使得CCD能夠快速取像且成像清晰。Moreover, because industrial CCDs require high-speed imaging, they usually do not have the function of auto-focusing. By setting the pressing ring 41 to press the first carrier 60, the target 200 to be pushed on the first carrier 60 is set The area is kept at a fixed position, and a fixed focal length can be maintained, so that the CCD can take images quickly and image sharply.

此外,在頂推目標物200之後,頂推裝置30移動至頂推準備位置,以讓影像擷取裝置50取像從而對下一顆要頂推的目標物200進行定位,因第一承載片60為有彈性的膜,隨著時間、目標物200的數量不同,容易導致第一承載片60發生位置偏差,而在本實施方式中,通過設置按壓件40按壓第一承載片60,能夠有效地使第一承載片60在水平面平穩地移動,從而避免出現上述情況。In addition, after pushing the target 200, the pushing device 30 moves to the pushing preparation position so that the image capturing device 50 can take an image to locate the next target 200 to be pushed, because the first carrier sheet 60 is an elastic film. With time and the number of targets 200, it is easy to cause positional deviation of the first carrier sheet 60. In this embodiment, the first carrier sheet 60 is pressed by the pressing member 40, which can effectively Therefore, the first supporting sheet 60 is moved smoothly on the horizontal plane, so as to avoid the above-mentioned situation.

以下,結合圖10~圖16對本實施方式的轉移設備100的轉移目標物200的方法進行說明。Hereinafter, the method of transferring the target object 200 of the transfer device 100 of the present embodiment will be described with reference to FIGS. 10 to 16.

當使用如圖1所示的轉移設備100進行目標物200的挑撿流程時,本揭露轉移目標物200的方法的一實施例包含以下步驟,需要說明的是,對於目標物的準備及放置可以通過公知的技術進行,因此,在此不再贅述。When the transfer device 100 shown in FIG. 1 is used to perform the picking process of the target 200, an embodiment of the method for transferring the target 200 of the present disclosure includes the following steps. It should be noted that the preparation and placement of the target can be It is performed by a well-known technique, so it will not be repeated here.

首先,請結合參閱圖10,將設置有目標物200的第一承載片60與第二承載片70分別設置於第一放置部21及第二放置部22上,並讓目標物200位於第一承載片60與第二承載片70之間。此時,頂推裝置30位於頂推準備位置,按壓件40位於維護位置。在本實施方式中,頂推裝置30與按壓件40位於軸線A的兩側。換言之,頂推準備位置和維護位置位於軸線A的兩側。在一些實施例中,頂推準備位置和維護位置可以是不在軸線A上的其他位置。First, referring to FIG. 10, the first supporting sheet 60 and the second supporting sheet 70 provided with the target 200 are respectively disposed on the first placement portion 21 and the second placement portion 22, and the target 200 is positioned on the first placement portion 21 and the second placement portion 22. Between the supporting sheet 60 and the second supporting sheet 70. At this time, the pushing device 30 is in the pushing preparation position, and the pressing member 40 is in the maintenance position. In this embodiment, the pushing device 30 and the pressing member 40 are located on both sides of the axis A. In other words, the jacking preparation position and the maintenance position are located on both sides of the axis A. In some embodiments, the pushing preparation position and the maintenance position may be other positions that are not on the axis A.

接著,請結合參閱圖11,平移第一放置部21及第二放置部22,使第一承載片60上的目標物200對應移動至影像擷取裝置50的軸線A上,並通過影像擷取裝置50檢測目標物200,此時,頂推裝置30位於頂推準備位置,按壓件40位於按壓準備位置,即按壓件40與影像擷取裝置50同軸。Next, referring to FIG. 11, the first placement portion 21 and the second placement portion 22 are translated, so that the target 200 on the first carrier sheet 60 is correspondingly moved to the axis A of the image capturing device 50, and image capturing is performed The device 50 detects the target 200. At this time, the pushing device 30 is located at the pushing preparation position, and the pressing member 40 is located at the pressing preparation position, that is, the pressing member 40 and the image capturing device 50 are coaxial.

接著,請結合參閱圖12,將按壓件40移動至第一承載片60上,並按壓第一承載片60,使得第一承載片60的要頂推的目標物200的設置區域向第二承載片70靠近。此時,頂推裝置30位於頂推準備位置。Next, referring to FIG. 12, the pressing member 40 is moved to the first supporting sheet 60, and the first supporting sheet 60 is pressed, so that the setting area of the target 200 to be pushed on the first supporting sheet 60 faces the second supporting sheet. The piece 70 is close. At this time, the pushing device 30 is in the pushing preparation position.

接著,請結合參閱圖13~圖14,將頂推裝置30從頂推準備位置移動至頂推工作位置,即讓頂推件31穿過按壓環41頂推第一承載片60,並頂起對應的目標物200而直接將被頂推的目標物200轉移黏置於第二承載片70上,以完成目標物200挑撿流程。Next, referring to FIGS. 13-14, move the pushing device 30 from the pushing preparation position to the pushing working position, that is, let the pushing member 31 pass through the pressing ring 41 to push the first carrier sheet 60, and push it up The corresponding target 200 is directly transferred and adhered to the second carrying sheet 70 to complete the picking process of the target 200.

接著,請參閱圖15,將頂推件31歸位,使得頂推件31縮回至頂針蓋32內,此時,頂推裝置30位於頂推工作位置,按壓件40按壓第一承載片60。Next, referring to FIG. 15, return the pushing member 31 to the position so that the pushing member 31 is retracted into the ejector cover 32. At this time, the pushing device 30 is in the pushing working position, and the pressing member 40 presses the first carrier 60 .

接著,請結合參閱圖16,頂推裝置30返回至頂推準備位置,按壓件40按壓第一承載片60,平移第一承載片60及第二承載片70,以便於進入頂推下一顆目標物200的流程。Next, referring to FIG. 16, the pushing device 30 returns to the pushing preparation position, and the pressing member 40 presses the first supporting sheet 60, and translates the first supporting sheet 60 and the second supporting sheet 70, so as to enter and push the next one. The flow of the target 200.

此處要特別說明的是,通過前置處理步驟的初始承載片的輔助,將各目標物200的發光面覆蓋設置於第一承載片60的承載面時,使目標物200由第一承載片60轉移到第二承載片70時,讓目標物200的發光面能反向第二承載片70的設置面裸露。此外,由於是先通過將目標物200的發光面反置於第一承載片60上,使得目標物200在第一承載片60的位置相對於位在初始承載片上的位置也是對應反置,因此,在進行目標物200的轉移前,會根據已被翻轉設置的目標物200的位置,對應調整控制軟體進行位置翻轉處理。It should be particularly noted here that when the light-emitting surface of each target 200 is covered and arranged on the bearing surface of the first bearing sheet 60 with the aid of the initial bearing sheet in the pre-processing step, the target 200 is removed from the first bearing sheet 60. When 60 is transferred to the second supporting sheet 70, the light-emitting surface of the target 200 can be exposed opposite to the setting surface of the second supporting sheet 70. In addition, since the light-emitting surface of the target 200 is first placed on the first supporting sheet 60, the position of the target 200 on the first supporting sheet 60 is also correspondingly reversed relative to the position on the initial supporting sheet. Before the transfer of the target object 200, the position of the target object 200 that has been turned over will be adjusted and the control software will be adjusted to perform position reversal processing.

本揭露不限於上述的各實施方式,能夠在請求項所示的範圍內進行各種變更,對於適當組合在不同的實施方式中分別公開的技術手段而得到的實施方式也包含在本揭露的技術範圍內。進一步地,通過組合各實施方式分別公開的技術手段,能夠形成新的技術特徵。The present disclosure is not limited to the above-mentioned embodiments, and various changes can be made within the scope shown in the claims, and embodiments obtained by appropriately combining the technical means disclosed in different embodiments are also included in the technical scope of the present disclosure. Inside. Further, by combining the technical means disclosed in the respective embodiments, new technical features can be formed.

100:轉移設備 200:目標物 10:基座 20:移動放置裝置 21:第一放置部 211:第一基台 212:承載盤 22:第二放置部 221:第二基台 222:夾持件 23:第一承載區域 24:第二承載區域 30:頂推裝置 31:頂推件 32:頂針蓋 320:腔體 40:按壓件 41:按壓環 411:第二缺口 42:側壁 420:第一缺口 422:穿孔 43:安裝部 430:安裝孔 50:影像擷取裝置 51:固定組件 60:第一承載片 61:承載面 62:接觸面 63:擴張環 631:內環 632:外環 70:第二承載片 71:設置面 80:第一驅動裝置 90:第二驅動裝置 A:軸線 X:第一方向 Y:第二方向 Z:第三方向 D1:按壓環的內徑 D2:按壓環的外徑 D3:按壓環的環寬度 O:頂推位置 d1:位置偏差 d2:位置偏差 1:晶粒 2:晶粒 3:晶粒100: Transfer equipment 200: target 10: Pedestal 20: Mobile placement device 21: The first placement part 211: The first abutment 212: Carrier plate 22: The second placement part 221: second abutment 222: Clamping parts 23: The first bearing area 24: The second bearing area 30: Pushing device 31: pusher 32: thimble cover 320: Cavity 40: Pressing piece 41: Press ring 411: second gap 42: side wall 420: first gap 422: perforation 43: Installation Department 430: mounting hole 50: Image capture device 51: fixed components 60: The first carrier sheet 61: bearing surface 62: contact surface 63: expansion ring 631: inner ring 632: Outer Ring 70: second carrier sheet 71: Set the surface 80: The first drive device 90: second drive device A: axis X: first direction Y: second direction Z: Third party D1: The inner diameter of the pressing ring D2: Outer diameter of pressing ring D3: The ring width of the pressing ring O: Push position d1: position deviation d2: position deviation 1: Die 2: Die 3: Die

為了更清楚地說明本申請實施方式或現有技術中的技術方案,下面將對實施方式或現有技術描述中所需要使用的附圖作簡單地介紹,顯而易見地,下面描述中的附圖僅僅是本申請的一些實施方式,對於本領域普通技術人員來講,在不付出創造性勞動的前提下,還可以根據這些附圖獲得其它的附圖。 圖1是本揭露一實施方式的轉移設備的立體結構圖。 圖2是圖1所示的轉移設備的主視圖。 圖3是圖2所示的轉移設備的局部放大圖。 圖4是圖3所示的轉移設備的局部放大圖。 圖5是圖1的轉移設備中的按壓件的俯視圖。 圖6是圖5所示的按壓件的立體結構圖。 圖7是圖5所示的按壓件的主視圖。 圖8是圖5所示的按壓件的側視圖。 圖9的(a)~(d)是移動並轉移晶粒的動作流程示意圖。 圖10是轉移設備轉移目標物的流程示意圖。 圖11是轉移設備轉移目標物的流程示意圖。 圖12是轉移設備轉移目標物的流程示意圖。 圖13是轉移設備轉移目標物的流程示意圖。 圖14是轉移設備轉移目標物的流程示意圖。 圖15是轉移設備轉移目標物的流程示意圖。 圖16是轉移設備轉移目標物的流程示意圖。 In order to more clearly describe the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are merely present For some implementations of the application, for those of ordinary skill in the art, other drawings may be obtained based on these drawings without creative work. FIG. 1 is a three-dimensional structure diagram of a transfer device according to an embodiment of the present disclosure. Fig. 2 is a front view of the transfer device shown in Fig. 1. Fig. 3 is a partial enlarged view of the transfer device shown in Fig. 2. Fig. 4 is a partial enlarged view of the transfer device shown in Fig. 3. Fig. 5 is a top view of a pressing member in the transfer device of Fig. 1. Fig. 6 is a three-dimensional structural view of the pressing member shown in Fig. 5. Fig. 7 is a front view of the pressing member shown in Fig. 5. Fig. 8 is a side view of the pressing member shown in Fig. 5. (A) to (d) of FIG. 9 are schematic diagrams of the operation flow of moving and transferring the crystal grains. Fig. 10 is a schematic diagram of the process of transferring the target by the transfer device. Fig. 11 is a schematic diagram of the process of transferring the target by the transfer device. Fig. 12 is a schematic diagram of the process of transferring the target by the transfer device. Fig. 13 is a schematic diagram of the process of transferring the target by the transfer device. Fig. 14 is a schematic diagram of the process of transferring the target by the transfer device. Fig. 15 is a schematic diagram of the process of transferring the target by the transfer device. Fig. 16 is a schematic diagram of the process of transferring the target by the transfer device.

100:轉移設備 100: Transfer equipment

10:基座 10: Pedestal

20:移動放置裝置 20: Mobile placement device

21:第一放置部 21: The first placement part

211:第一基台 211: The first abutment

212:承載盤 212: Carrier plate

22:第二放置部 22: The second placement part

221:第二基台 221: second abutment

222:夾持件 222: Clamping parts

30:頂推裝置 30: Pushing device

40:按壓件 40: Pressing piece

50:影像擷取裝置 50: Image capture device

51:固定組件 51: fixed components

60:第一承載片 60: The first carrier sheet

80:第一驅動裝置 80: The first drive device

90:第二驅動裝置 90: second drive device

X:第一方向 X: first direction

Y:第二方向 Y: second direction

Claims (10)

一種轉移設備,其用於將第一承載片上的至少一個目標物轉移至第二承載片,所述轉移設備包括: 移動放置裝置,其用於將所述第一承載片放置於第一承載區域和將所述第二承載片放置於第二承載區域,使得所述第一承載片和所述第二承載片相向間隔且可相對平移; 按壓件,其可移動地設置於所述第一承載區域的背離所述第二承載區域的一側,所述按壓件用於沿預設移動方向按壓所述第一承載片,使得所述第一承載片的待頂推的所述目標物的設置區域靠近所述第二承載片,所述預設移動方向為所述第一承載區域朝向所述第二承載區域的方向;以及 頂推裝置,其可移動地設置於所述第一承載區域的背離所述第二承載區域的一側,所述頂推裝置包括頂推件,所述頂推件的前端用於沿所述預設移動方向穿過所述按壓件以頂推所述目標物, 其中,所述按壓件包括側壁,所述側壁遠離所述第一承載區域的一側開設有第一缺口,所述第一缺口用於供所述頂推裝置穿過。 A transfer device, which is used to transfer at least one target on a first carrier sheet to a second carrier sheet, the transfer device comprising: A mobile placement device for placing the first supporting sheet in a first supporting area and placing the second supporting sheet in a second supporting area so that the first supporting sheet and the second supporting sheet face each other Spaced and can be moved relatively; A pressing member, which is movably disposed on a side of the first bearing area away from the second bearing area, and the pressing member is used to press the first bearing sheet in a predetermined moving direction, so that the first bearing The setting area of the target to be pushed on a supporting sheet is close to the second supporting sheet, and the predetermined moving direction is the direction from the first supporting area to the second supporting area; and A pushing device, which is movably arranged on a side of the first bearing area away from the second bearing area, the pushing device includes a pushing piece, and the front end of the pushing piece is used to move along the The preset moving direction passes through the pressing member to push the target object, Wherein, the pressing member includes a side wall, a side of the side wall away from the first bearing area is provided with a first notch, and the first notch is used for the pushing device to pass through. 根據請求項1所述的轉移設備,其中所述按壓件形成一第二缺口,所述第二缺口設置於所述按壓件靠近所述第一承載區域的一側。The transfer device according to claim 1, wherein the pressing member forms a second notch, and the second notch is provided on a side of the pressing member close to the first carrying area. 根據請求項2所述的轉移設備,其中所述按壓件進一步包括按壓環和安裝部,所述按壓環限定了所述第二缺口,所述安裝部與所述按壓環相對設置,所述安裝部和所述按壓環分別設置於所述側壁的兩側。The transfer device according to claim 2, wherein the pressing member further includes a pressing ring and a mounting portion, the pressing ring defines the second notch, the mounting portion is disposed opposite to the pressing ring, and the mounting The part and the pressing ring are respectively arranged on both sides of the side wall. 根據請求項1所述的轉移設備,其中所述按壓環的底表面與側表面的連接處形成倒圓角。The transfer device according to claim 1, wherein the connection between the bottom surface and the side surface of the pressing ring forms a rounded corner. 根據請求項1所述的轉移設備,其中所述第二缺口為圓孔。The transfer device according to claim 1, wherein the second notch is a round hole. 根據請求項1所述的轉移設備,其中所述側壁上還形成一穿孔,所述穿孔與所述第一缺口相對設置。The transfer device according to claim 1, wherein a perforation is further formed on the side wall, and the perforation is arranged opposite to the first notch. 根據請求項1所述的轉移設備,其中所述轉移設備還包括影像擷取裝置,其固定地設置於所述第一承載區域的背離所述第二承載區域的一側,用於對要頂推的所述目標物進行取像。The transfer device according to claim 1, wherein the transfer device further includes an image capture device, which is fixedly disposed on a side of the first bearing area away from the second bearing area, and is used to The pushed target is taken for imaging. 根據請求項7所述的轉移設備,其中在所述頂推裝置頂推所述目標物時,所述頂推裝置、所述按壓件以及所述影像擷取裝置彼此間的相對位置為同軸。The transfer device according to claim 7, wherein when the pushing device pushes the target, the relative positions of the pushing device, the pressing member, and the image capturing device are coaxial with each other. 根據請求項1所述的轉移設備,其中所述頂推裝置還包括頂針蓋,所述頂推件可凸伸出所述頂針蓋。The transfer device according to claim 1, wherein the pushing device further includes a thimble cover, and the pushing member can protrude from the thimble cover. 根據請求項1所述的轉移設備,其中所述移動放置裝置包括第一放置部及第二放置部,所述第一放置部及所述第二放置部以相向間隔且可相對平移的方式設置。The transfer device according to claim 1, wherein the mobile placement device includes a first placement portion and a second placement portion, and the first placement portion and the second placement portion are arranged in a manner of being spaced apart from each other and capable of being relatively translated .
TW110208593U 2021-07-21 2021-07-21 Transfer apparatus TWM621021U (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115008007A (en) * 2022-06-15 2022-09-06 东莞市德镌精密设备有限公司 Needling type PCB welding crystal discharging machine
TWI812980B (en) * 2021-07-21 2023-08-21 久元電子股份有限公司 Transfer apparatus

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI812980B (en) * 2021-07-21 2023-08-21 久元電子股份有限公司 Transfer apparatus
CN115008007A (en) * 2022-06-15 2022-09-06 东莞市德镌精密设备有限公司 Needling type PCB welding crystal discharging machine
CN115008007B (en) * 2022-06-15 2023-09-22 东莞市德镌精密设备有限公司 Needling type PCB welding crystal arranging machine

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