TWI812980B - Transfer apparatus - Google Patents

Transfer apparatus Download PDF

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Publication number
TWI812980B
TWI812980B TW110126865A TW110126865A TWI812980B TW I812980 B TWI812980 B TW I812980B TW 110126865 A TW110126865 A TW 110126865A TW 110126865 A TW110126865 A TW 110126865A TW I812980 B TWI812980 B TW I812980B
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Taiwan
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pushing
piece
target object
bearing
pressing member
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TW110126865A
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Chinese (zh)
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TW202306010A (en
Inventor
賴燦雄
陳光誠
陳揚傑
周維亮
汪秉龍
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久元電子股份有限公司
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Abstract

The present disclosure provides a transfer apparatus including: a movable placement device configured to place a first carrying sheet in a first carrying area and place a second carrying sheet in a second carrying area; a pressing member movably arranged on one side of the first carrying area away from the second carrying area and configured to press the first carrying sheet in a predetermined moving direction from the first carrying area towards the second carrying area; and a pushing device movably arranged on the side of the first carrying area away from the second carrying area. The pushing device includes a pushing member configured to pass through the pressing member in the predetermined moving direction to push a target object. The pressing member includes a sidewall of which one side away from the first carrying area having a first opening which allows the pushing device to pass through.

Description

轉移設備Transfer device

本揭露涉及半導體製造技術領域,特別地,涉及一種轉移設備。The present disclosure relates to the field of semiconductor manufacturing technology, and in particular, to a transfer device.

在半導體的製程中,會通過晶粒轉移機構對切割完成的多個晶粒依其外觀、品質或特性進行挑撿分類。目前,大多數的晶粒轉移機構多採用通過一頂推裝置中的頂推針將晶粒從一薄膜轉移至印刷電路板(PCB:Printed Circuit Board)上。但是,在轉移過程中,由於用於承載晶粒的薄膜的面積較大且具有彈性,如果頂推裝置直接頂推到薄膜進而來頂推晶粒的話,無法實現精準對位,容易出現翻晶或置下歪斜等情況,從而導致良率較低。In the semiconductor manufacturing process, multiple cut dies are sorted and sorted according to their appearance, quality or characteristics through a die transfer mechanism. Currently, most die transfer mechanisms use an ejection pin in an ejection device to transfer die from a film to a printed circuit board (PCB). However, during the transfer process, due to the large area and elasticity of the film used to carry the die, if the ejection device directly pushes the film and then the die, precise alignment cannot be achieved and crystal flipping is prone to occur. Or the placement may be skewed, resulting in lower yield.

本揭露是鑒於上述問題而完成的,提供一種能夠實現精準對位,避免出現翻晶或置下歪斜等情況,且良率高的轉移設備。This disclosure is completed in view of the above problems, and provides a transfer device that can achieve precise alignment, avoid flipping or placing skew, and has a high yield.

為解決上述問題,本揭露提供一種轉移設備,其用於將第一承載片上的至少一個目標物轉移至第二承載片,所述轉移設備包括:移動放置裝置,其用於將所述第一承載片放置於第一承載區域和將所述第二承載片放置於第二承載區域,使得所述第一承載片和所述第二承載片相向間隔且可相對平移;按壓件,其可移動地設置於所述第一承載區域的背離所述第二承載區域的一側,所述按壓件用於沿預設移動方向按壓所述第一承載片,使得所述第一承載片的待頂推的所述目標物的設置區域靠近所述第二承載片,所述預設移動方向為所述第一承載區域朝向所述第二承載區域的方向;以及頂推裝置,其可移動地設置於所述第一承載區域的背離所述第二承載區域的一側,所述頂推裝置包括頂推件,所述頂推件的前端用於沿所述預設移動方向穿過所述按壓件以頂推所述目標物,其中,所述按壓件包括側壁,所述側壁遠離所述第一承載區域的一側開設有第一缺口,所述第一缺口用於供所述頂推裝置穿過。In order to solve the above problem, the present disclosure provides a transfer device for transferring at least one target object on a first carrier sheet to a second carrier sheet. The transfer device includes: a moving placement device for moving the first carrier sheet. The bearing piece is placed in the first bearing area and the second bearing piece is placed in the second bearing area, so that the first bearing piece and the second bearing piece are spaced apart from each other and can move relative to each other; the pressing member is movable is disposed on the side of the first load-bearing area away from the second load-bearing area, and the pressing member is used to press the first load-bearing piece along the preset movement direction, so that the first load-bearing piece to be lifted The setting area of the pushed target object is close to the second bearing piece, and the preset moving direction is the direction of the first bearing area toward the second bearing area; and a pushing device is movably arranged. On the side of the first load-bearing area away from the second load-bearing area, the push device includes a push piece, the front end of the push piece is used to pass through the pressing force along the preset movement direction. A piece is used to push the target object, wherein the pressing piece includes a side wall, and a first notch is opened on the side of the side wall away from the first bearing area, and the first notch is used for the pushing device to pass through.

在一實施方式中,所述按壓件形成一第二缺口,所述第二缺口設置於所述按壓件靠近所述第一承載區域的一側。In one embodiment, the pressing member forms a second notch, and the second notch is provided on a side of the pressing member close to the first bearing area.

在一實施方式中,所述按壓件進一步包括按壓環和安裝部,所述按壓環限定了所述第二缺口,所述安裝部且與所述按壓環相對設置,所述安裝部和所述按壓環分別設置於所述側壁的兩側。In one embodiment, the pressing member further includes a pressing ring and a mounting part, the pressing ring defines the second notch, the mounting part is arranged opposite to the pressing ring, the mounting part and the Pressing rings are respectively arranged on both sides of the side wall.

在一實施方式中,所述按壓環的底表面與側表面的連接處形成倒圓角。In one embodiment, the connection between the bottom surface and the side surface of the pressing ring forms a rounded corner.

在一實施方式中,所述第二缺口為圓孔。In one embodiment, the second notch is a circular hole.

在一實施方式中,所述側壁上還形成一穿孔,所述穿孔與所述第一缺口相對設置。In one embodiment, a perforation is also formed on the side wall, and the perforation is arranged opposite to the first notch.

所述轉移設備還包括影像擷取裝置,其固定地設置於所述第一承載區域的背離所述第二承載片的一側,用於對要頂推的所述目標物進行取像。The transfer equipment further includes an image capturing device, which is fixedly disposed on a side of the first bearing area away from the second bearing sheet, and is used for capturing an image of the target object to be pushed.

在一實施方式中,在所述頂推裝置頂推所述目標物時,所述頂推裝置、所述按壓件以及所述影像擷取裝置彼此間的相對位置為同軸。In one embodiment, when the pushing device pushes the target object, the relative positions of the pushing device, the pressing member and the image capturing device are coaxial with each other.

在一實施方式中,所述頂推裝置包括頂針蓋,所述頂推件可凸伸出所述頂針蓋。In one embodiment, the pushing device includes an ejector pin cover, and the pushing member can protrude from the ejector pin cover.

在一實施方式中,所述移動放置裝置包括第一放置部及第二放置部,所述第一放置部及所述第二放置部以相向間隔且可相對平移的方式設置。In one embodiment, the mobile placement device includes a first placement part and a second placement part, and the first placement part and the second placement part are spaced apart from each other and can be relatively translated.

相較於現有技術,通過設置按壓件按壓第一承載片,使得在頂推目標物時,第一承載片的要頂推的目標物的設置區域向第二承載片靠近,容易對要頂推的目標物的設置區域的張力進行控制,且調整第一承載片的要頂推的目標物的設置區域與第二承載片之間的距離,從而使得頂推裝置能夠精準地頂推目標物,避免出現翻晶或置下歪斜等情況,且良率高。Compared with the existing technology, by arranging a pressing member to press the first carrying piece, when pushing the target object, the setting area of the target object to be pushed is closer to the second carrying piece, making it easier to push the target object. The tension of the setting area of the target object is controlled, and the distance between the setting area of the first carrying piece for the target object to be pushed and the second carrying piece is adjusted, so that the pushing device can accurately push the target object. Avoid flipping the crystal or placing it in a skewed state, and achieve a high yield rate.

以下敘述含有與本揭露中的示例性實施例相關的特定資訊。本揭露中的附圖和其隨附的詳細敘述僅為示例性實施例。然而,本揭露並不局限於此些示例性實施例。本領域技術人員將會想到本揭露的其它變化與實施例。除非另有說明,否則附圖中的相同或對應的元件可由相同或對應的附圖標號指示。此外,本揭露中的附圖與例示通常不是按比例繪製的,且非旨在與實際的相對尺寸相對應。The following description contains specific information related to the exemplary embodiments of the present disclosure. The drawings and accompanying detailed description in this disclosure are merely exemplary embodiments. However, the present disclosure is not limited to these exemplary embodiments. Other variations and embodiments of the present disclosure will occur to those skilled in the art. Unless otherwise stated, the same or corresponding elements in the drawings may be designated by the same or corresponding reference numerals. Furthermore, the drawings and illustrations in the present disclosure are generally not to scale and are not intended to correspond to actual relative dimensions.

出於一致性和易於理解的目的,在示例性附圖中藉由標號以標示相同特徵(雖在一些示例中並未如此標示)。然而,不同實施方式中的特徵在其它方面可能不同,因此不應狹義地局限於附圖所示的特徵。For purposes of consistency and ease of understanding, identical features are identified by reference numbers in the illustrative drawings (although in some examples they are not). However, features in different embodiments may differ in other respects and therefore should not be narrowly limited to those shown in the drawings.

本揭露的說明書及上述附圖中的術語“第一”、“第二”和“第三”等是用於區別不同物件,而非用於描述特定順序。此外,術語“包括”以及它們任何變形,意圖在於覆蓋不排他的包含。The terms “first”, “second” and “third” in the description of the present disclosure and the above-mentioned drawings are used to distinguish different objects, rather than describing a specific sequence. Furthermore, the term "includes" and any variations thereof are intended to cover non-exclusive inclusion.

下面,結合附圖及實施例對本揭露進行詳細說明。Below, the present disclosure will be described in detail with reference to the accompanying drawings and embodiments.

參照圖1~圖4,本揭露一實施方式提供一種轉移設備100,包括基座10、移動放置裝置20、頂推裝置30、按壓件40及影像擷取裝置50,其中,移動放置裝置20、頂推裝置30、按壓件40及影像擷取裝置50均設置於基座10上。Referring to FIGS. 1 to 4 , an embodiment of the present disclosure provides a transfer device 100 , including a base 10 , a mobile placement device 20 , a pushing device 30 , a pressing member 40 and an image capture device 50 , wherein the mobile placement device 20 , The pushing device 30 , the pressing member 40 and the image capturing device 50 are all arranged on the base 10 .

本實施方式中的轉移設備100用於轉移至少一目標物200,在本實施方式中,目標物200以晶粒為例進行說明,在其它實施方式中,轉移設備100還可以用於轉移其它目標物,在此不作限定。具體地,轉移設備100用於將第一承載片60及第二承載片70設置於移動放置裝置20,並通過頂推裝置30、按壓件40及影像擷取裝置50將第一承載片60上的目標物200轉移至第二承載片70上。The transfer device 100 in this embodiment is used to transfer at least one target object 200. In this embodiment, the target object 200 is explained by taking a grain as an example. In other embodiments, the transfer device 100 can also be used to transfer other targets. Things are not limited here. Specifically, the transfer equipment 100 is used to place the first carrier sheet 60 and the second carrier sheet 70 on the mobile placement device 20 , and move the first carrier sheet 60 onto the mobile placement device 20 through the pushing device 30 , the pressing member 40 and the image capturing device 50 The target object 200 is transferred to the second carrier sheet 70 .

在本實施方式中,第一承載面60的面向第二承載片70的表面用於放置至少一目標物200,具體地,第一承載片60具有用於承載目標物200的承載面61及與承載面61相背的接觸面62,承載面61面向第二承載片70。第二承載片70具有供目標物200設置的設置面71,設置面71面向第一承載片60。In this embodiment, the surface of the first bearing surface 60 facing the second bearing sheet 70 is used to place at least one target object 200. Specifically, the first bearing sheet 60 has a bearing surface 61 for bearing the target object 200 and a The bearing surface 61 is opposite to the contact surface 62 , and the bearing surface 61 faces the second bearing piece 70 . The second carrier sheet 70 has a setting surface 71 on which the target 200 is placed, and the setting surface 71 faces the first carrier sheet 60 .

可以理解,在頂推件31頂推目標物200且並未刺破第一承載片60的情況下,第一承載片60的黏度可能會因第一承載片60表面被拉伸而降低,此時,承載面61的黏度低於設置面71的黏度的情況下,目標物200較容易脫離第一承載片60,而黏至於第二承載片70。當然,在其它時期,例如,後述的按壓件30未按壓第一承載片60時,承載面61的黏度也可以不低於設置面71的黏度,在此不作限定。It can be understood that when the pushing member 31 pushes the target object 200 without piercing the first carrier sheet 60 , the viscosity of the first carrier sheet 60 may be reduced due to the stretching of the surface of the first carrier sheet 60 . When the viscosity of the bearing surface 61 is lower than the viscosity of the setting surface 71 , the target object 200 is easier to separate from the first bearing sheet 60 and stick to the second bearing sheet 70 . Of course, at other times, for example, when the pressing member 30 described below does not press the first carrying sheet 60, the viscosity of the carrying surface 61 may not be lower than the viscosity of the setting surface 71, which is not limited here.

本實施方式中,第二承載片70可以為印刷電路板(PCB),且在可以在印刷電路板上形成一層黏接層,例如膠水。在本實施方式中,目標物200即晶粒以發光二極體晶粒為例,第一承載片60以及第二承載片70以藍膜(blue tape)為例進行說明。在本實施方式中,第一承載片60是通過擴張環(expand ring)63進行固定,擴張環63包括內環631及外環632,第一承載片60的周緣通過內環631及外環632固定。In this embodiment, the second carrier sheet 70 may be a printed circuit board (PCB), and an adhesive layer, such as glue, may be formed on the printed circuit board. In this embodiment, the target object 200 , that is, the die, takes a light-emitting diode die as an example, and the first carrier sheet 60 and the second carrier sheet 70 take a blue tape as an example. In this embodiment, the first carrier piece 60 is fixed through an expansion ring 63 . The expansion ring 63 includes an inner ring 631 and an outer ring 632 . The periphery of the first carrier piece 60 passes through the inner ring 631 and the outer ring 632 . fixed.

可以理解,通過擴張環63拉伸第一承載片60的周緣,使得第一承載片60擴張而降低其黏度,以便於後續轉移目標物200。It can be understood that the peripheral edge of the first carrier sheet 60 is stretched by the expansion ring 63, so that the first carrier sheet 60 expands and reduces its viscosity, so as to facilitate the subsequent transfer of the target object 200.

當然,在其它實施方式中,第一承載片60還可以通過其它結構進行固定拉伸,在此不作限定。Of course, in other embodiments, the first carrier sheet 60 can also be fixed and stretched through other structures, which is not limited here.

移動放置裝置20包括相向間隔且可相對平移的第一放置部21及第二放置部22,第一放置部21及第二放置部22分別用於放置第一承載片60和第二承載片70,使得第一承載片60和第二承載片70相向間隔且可相對平移,第一承載片60上的目標物200位於第一承載片60和第二承載片70之間。The mobile placement device 20 includes a first placement part 21 and a second placement part 22 that are spaced apart from each other and relatively translatable. The first placement part 21 and the second placement part 22 are used to place the first carrier sheet 60 and the second carrier sheet 70 respectively. , so that the first carrying piece 60 and the second carrying piece 70 are spaced apart from each other and can move relatively translationally, and the target 200 on the first carrying piece 60 is located between the first carrying piece 60 and the second carrying piece 70 .

請結合參閱圖1~圖3,在本實施方式中,第一放置部21有第一承載區域23,用於放置第一承載片60,第二放置部22有第二承載區域24,用於放置第二承載片70。在本實施方式中,第一承載區域23為在第一承載片60放置於第一放置部21的情況下,與第一承載片60所在的平面一致的區域,第二承載區域24為在第二承載片70放置於第二放置部22的情況下,與第二承載片所在的平面一致的區域。換言之,第一承載區域23和第二承載區域24各自被定義為虛擬的平面區域,分別用於反映第一承載片60和第二承載片70放置於移動放置裝置20時的位置。故可以理解的是,當移動放置裝置20改變第一承載片60和/或第二承載片70的位置,第一承載區域23和第二承載區域24的位置也會相應的改變。Please refer to FIGS. 1 to 3 . In this embodiment, the first placement part 21 has a first bearing area 23 for placing the first bearing piece 60 , and the second placement part 22 has a second bearing area 24 for placing the first bearing piece 60 . The second carrier sheet 70 is placed. In this embodiment, the first bearing area 23 is an area consistent with the plane where the first bearing piece 60 is located when the first bearing piece 60 is placed on the first placement part 21 , and the second bearing area 24 is an area on the first bearing part 21 . When the two carrying pieces 70 are placed on the second placement part 22, the area is consistent with the plane where the second carrying piece is located. In other words, the first bearing area 23 and the second bearing area 24 are each defined as a virtual plane area, respectively used to reflect the positions of the first bearing piece 60 and the second bearing piece 70 when placed on the mobile placement device 20 . Therefore, it can be understood that when the moving and placing device 20 changes the position of the first bearing piece 60 and/or the second bearing piece 70 , the positions of the first bearing area 23 and the second bearing area 24 will also change accordingly.

進一步地,第一放置部21設置於基座10的一側,第一放置部21包括第一基台211及承載盤212,第一基台211可相對於基座10在第一方向X上移動地設置,承載盤212可在第二方向Y上移動地設置於第一基台211上,如此,使得擴張環63上的目標物200能夠沿第一方向X和第二方向Y往返移動,從而便於放置、拿取、平移擴張環63。Further, the first placement part 21 is provided on one side of the base 10. The first placement part 21 includes a first base 211 and a bearing tray 212. The first base 211 can be positioned in the first direction X relative to the base 10. movably disposed, the bearing plate 212 is movably disposed on the first base 211 in the second direction Y, so that the target 200 on the expansion ring 63 can move back and forth along the first direction X and the second direction Y, This makes it easy to place, pick up, and translate the expansion ring 63 .

第二放置部22設置於基座10的另一側,第二放置部22包括第二基台221及夾持件222,第二基台221可相對於基座10在第一方向X上移動地設置,夾持件222用於夾持第二承載片70,夾持件222可在第二方向Y上移動地設置於第二基台221上,如此,第二承載片70能夠沿第一方向X和第二方向Y往返移動,從而便於放置、拿取、平移第二承載片70。The second placement part 22 is provided on the other side of the base 10. The second placement part 22 includes a second base 221 and a clamping member 222. The second base 221 can move in the first direction X relative to the base 10. is disposed, the clamping member 222 is used to clamp the second carrying piece 70, the clamping member 222 is disposed on the second base 221 movably in the second direction Y, so that the second carrying piece 70 can move along the first The direction X and the second direction Y move back and forth, thereby facilitating placement, picking up, and translation of the second carrier sheet 70 .

頂推裝置30可移動地設置於第一承載區域23的背離第二承載片70的一側。在本實施方式中,頂推裝置30在水平面和/或垂直面能夠移動。具體地,在頂推目標物200之前,頂推裝置30位於頂推準備位置,在要對待頂推的目標物200進行頂推時,頂推裝置30從頂推準備位置移動至頂推工作位置,待頂推動作結束之後,頂推裝置30從頂推工作位置返回至頂推準備位置,如此,進行往返移動。在本實施方式中,目標物200是指承載於第一承載片60上的晶粒,待頂推的目標物200是指第一承載片60上的晶粒中,在頂推裝置30位於頂推工作位置時,位於頂推件31正下方的晶粒,頂推準備位置是指頂推裝置30的預設的初始位置,頂推工作位置是指頂推裝置30頂推目標物200時所處的位置。The pushing device 30 is movably disposed on a side of the first bearing area 23 away from the second bearing piece 70 . In this embodiment, the pushing device 30 is movable in the horizontal plane and/or the vertical plane. Specifically, before pushing the target object 200, the pushing device 30 is located in the pushing preparation position. When the target object 200 to be pushed is pushed, the pushing device 30 moves from the pushing preparation position to the pushing working position. , after the pushing action is completed, the pushing device 30 returns from the pushing working position to the pushing preparation position, and thus moves back and forth. In this embodiment, the target object 200 refers to the die carried on the first carrier sheet 60 , and the target object 200 to be pushed refers to the die on the first carrier sheet 60 . When the ejection device 30 is located in the pusher, When the pushing working position is in place, for the die located directly below the pushing member 31, the pushing preparation position refers to the preset initial position of the pushing device 30, and the pushing working position refers to the position when the pushing device 30 pushes the target object 200. location.

具體地,頂推裝置30包括頂推件31及頂針蓋32,頂推件31可凸伸出頂針蓋32的腔體320內,以頂推目標物200,從而將第一承載片60上的目標物200轉移至第二承載片70。在本實施方式中,頂推件31可為頂針(Needle)。Specifically, the pushing device 30 includes a pushing member 31 and a ejector pin cover 32 . The pushing member 31 can protrude out of the cavity 320 of the ejector pin cover 32 to push the target object 200 , thereby pushing the target object 200 on the first carrier sheet 60 . The target object 200 is transferred to the second carrier sheet 70 . In this embodiment, the pushing member 31 may be a needle (Needle).

具體而言,當頂推件31要頂推目標物200時,頂針蓋32的腔體320內成為真空狀態,如此,頂針蓋32的底部將吸附第一承載片60,使得頂針蓋32的底部與第一承載片60的接觸面62接觸,之後頂推件31伸出頂針蓋32並頂推目標物200,以將目標物200從第一承載片60轉移至第二承載片70,之後,頂推件31返回至頂針蓋32內。可以理解,通過將頂推件31可凸伸出地設置於頂針蓋32內,當頂推件31頂推目標物200之後,頂針蓋32的底部與第一承載片60的接觸面62接觸,從而能夠防止第一承載片60黏附於頂推件31的前端而發生偏移,如此,能夠有效地提高頂推效率。Specifically, when the pusher 31 pushes the target object 200 , the cavity 320 of the ejector pin cover 32 becomes a vacuum state. In this way, the bottom of the ejector pin cover 32 will absorb the first carrier piece 60 , so that the bottom of the ejector pin cover 32 After contacting the contact surface 62 of the first carrier sheet 60, the pushing member 31 extends out of the ejector pin cover 32 and pushes the target object 200 to transfer the target object 200 from the first carrier sheet 60 to the second carrier sheet 70. After that, The push piece 31 returns to the ejector pin cover 32 . It can be understood that by disposing the pushing member 31 protrudingly inside the ejector pin cover 32, after the pushing member 31 pushes the target object 200, the bottom of the ejector pin cover 32 contacts the contact surface 62 of the first carrier piece 60, Therefore, the first carrying piece 60 can be prevented from adhering to the front end of the pushing member 31 and being deflected. In this way, the pushing efficiency can be effectively improved.

進一步地,請結合參閱圖5,按壓件40可移動地設置於第一承載區域23的背離第二承載區域24的一側,用於按壓第一承載片60,使得第一承載片60上的待頂推的目標物200的設置區域靠近第二承載片70。Further, please refer to FIG. 5 , the pressing member 40 is movably disposed on the side of the first bearing area 23 away from the second bearing area 24 for pressing the first bearing piece 60 so that the first bearing piece 60 is The target object 200 to be pushed is disposed close to the second carrier sheet 70 .

可以理解,在本實施方式中,按壓件40能夠在垂直面移動。It can be understood that in this embodiment, the pressing member 40 can move in the vertical plane.

具體地,在頂推目標物200之前,按壓件40位於按壓準備位置,在要對目標物200進行頂推時,按壓件40從按壓準備位置移動至按壓工作位置,直至第一承載片60的所有目標物200都轉移至第二承載片70之後,按壓件40從按壓工作位置返回至按壓準備位置。當然,也可以在每頂推完一個(或數個)目標物200之後,按壓件40從按壓工作位置返回至按壓準備位置,對此不作限定。按壓準備位置是指按壓件40的默認的初始位置,按壓工作位置是指按壓件40按壓第一承載片60時所處的位置。Specifically, before pushing the target object 200, the pressing member 40 is located in the pressing preparation position. When the target object 200 is to be pushed, the pressing member 40 moves from the pressing preparation position to the pressing working position until the first carrying piece 60 is After all the targets 200 are transferred to the second carrier sheet 70 , the pressing member 40 returns from the pressing working position to the pressing preparation position. Of course, after pushing one (or several) target objects 200 each time, the pressing member 40 may return from the pressing working position to the pressing preparation position, which is not limited. The pressing preparation position refers to the default initial position of the pressing member 40 , and the pressing working position refers to the position where the pressing member 40 presses the first carrying piece 60 .

當然,在其它實施方式中,按壓件40也能夠在水平面及垂直面移動,在此不作限定。Of course, in other embodiments, the pressing member 40 can also move in the horizontal plane and the vertical plane, which is not limited here.

可以理解,在本實施方式中,只要確保第一承載片60中的與按壓件40接觸的區域即對應於頂推裝置30頂推目標物200的區域在按壓件40的按壓作用下向第二承載片70靠近即可,在此不作限定。It can be understood that in this embodiment, as long as it is ensured that the area of the first carrier piece 60 that is in contact with the pressing member 40 , that is, the area corresponding to the area where the pushing device 30 pushes the target object 200 , will push toward the second object 200 under the pressing action of the pressing member 40 . The carrier piece 70 only needs to be close to each other, and there is no limitation here.

具體地,請結合參閱圖5~圖8,按壓件40形成一第二缺口411,第二缺口411設置於按壓件40靠近第一承載區域23的一側,用於供頂推裝置30的頂推件31的前端沿預設移動方向穿過以頂推至少一個目標物200。在本實施方式中,第二缺口411用於供頂針蓋32的底部和頂推件31穿過。在本實施方式中,預設移動方向為後述的第三方向Z,也可以說是第一承載區域23朝向第二承載區域24的方向。當然,在其它實施方式中,可以根據需求進行相應的調整,在此不作限定。Specifically, please refer to FIGS. 5 to 8 . The pressing member 40 forms a second notch 411 . The second notch 411 is provided on the side of the pressing member 40 close to the first bearing area 23 for the pushing device 30 . The front end of the pushing member 31 passes along the preset moving direction to push at least one target object 200 . In this embodiment, the second notch 411 is used for the bottom of the ejector pin cover 32 and the pusher 31 to pass through. In this embodiment, the preset movement direction is the third direction Z described below, which can also be said to be the direction in which the first bearing area 23 faces the second bearing area 24 . Of course, in other implementations, corresponding adjustments can be made according to requirements, and there is no limitation here.

進一步地,第二缺口411可為封閉式缺口,例如呈“O”字狀、“口”字狀等。在其它實施方式中,第二缺口411也可以為開放式的缺口,例如呈“C”、“ㄈ”字狀等。在本實施方式中,該第二缺口411為圓孔,即呈“O”字狀。在一些實施方式中,該第二缺口411雖大致呈圓孔或其他封閉式缺口,但該第二缺口411的邊緣可包含一或多個切口。進一步說,以該第二缺口411的邊緣具有一個切口的情況為例,該第二缺口411會呈“C”字狀,以此類推。當然,在其它實施方式中,該第二缺口411還可為其它的形狀,在此不作限定。Furthermore, the second gap 411 may be a closed gap, such as an "O" shape, a "mouth" shape, etc. In other embodiments, the second notch 411 may also be an open notch, for example, in the shape of a "C" or a "U". In this embodiment, the second notch 411 is a round hole, that is, in an "O" shape. In some embodiments, although the second notch 411 is generally in the shape of a circular hole or other closed notch, the edge of the second notch 411 may include one or more cuts. Furthermore, taking the case where the edge of the second notch 411 has a cutout as an example, the second notch 411 will be in a "C" shape, and so on. Of course, in other implementations, the second notch 411 can also have other shapes, which are not limited here.

進一步地,按壓件40包括按壓環41、側壁42及安裝部43,按壓環41限定第二缺口411。Further, the pressing member 40 includes a pressing ring 41 , a side wall 42 and a mounting part 43 . The pressing ring 41 defines a second notch 411 .

可以理解,第二缺口411的直徑沒有特別限制,只要能夠允許頂推裝置30的至少部分穿過,在本實施方式中,第二缺口411允許頂推裝置30的頂針蓋32的底部穿過,不會妨礙到頂推件31頂推目標物200即可。更具體地,第二缺口411的直徑為6mm以上,在一優選實施方式中,第二缺口411的直徑為16mm。另外,在一具體實施方式中,按壓環41的內徑D1為13.5mm,外徑D2為16.0mm。在一些實施方式中,內徑的範圍約8mm~20mm,按壓環41的環寬度D3的範圍約1~2mm。It can be understood that the diameter of the second notch 411 is not particularly limited as long as it allows at least part of the ejection device 30 to pass through. In this embodiment, the second notch 411 allows the bottom of the ejector pin cover 32 of the ejection device 30 to pass through. It is sufficient that it does not hinder the pushing member 31 from pushing the target object 200 . More specifically, the diameter of the second notch 411 is more than 6 mm. In a preferred embodiment, the diameter of the second notch 411 is 16 mm. In addition, in a specific embodiment, the inner diameter D1 of the pressing ring 41 is 13.5 mm, and the outer diameter D2 is 16.0 mm. In some embodiments, the inner diameter ranges from about 8 mm to 20 mm, and the ring width D3 of the pressing ring 41 ranges from about 1 to 2 mm.

可以理解,通過將第二缺口411的直徑設置為允許頂針蓋32的底部穿過,能夠降低擴張環63在水準移動時,第一承載片60與按壓環41之間的摩擦力,並使第一承載片60中的與按壓件40接觸的區域的張力更加穩定。當然,按壓環41的直徑可以根據需求進行相應地調整,在此不作限定。It can be understood that by setting the diameter of the second notch 411 to allow the bottom of the ejector pin cover 32 to pass through, the friction between the first carrier piece 60 and the pressing ring 41 can be reduced when the expansion ring 63 moves horizontally, and the second gap can be The tension of the area in contact with the pressing member 40 in the carrier sheet 60 is more stable. Of course, the diameter of the pressing ring 41 can be adjusted accordingly according to requirements, and is not limited here.

進一步地,按壓環41的底表面412與側表面413的連接處形成倒圓角(R角),R角的圓弧角例如為0.5mm,以防止按壓環41的底表面412與第一承載片60接觸,且第一承載片60水準移動時把第一承載片60刮破。在其他實施方式中,若第一承載片60可承受按壓環41在其上移動摩擦而不被刮破,亦可允許將按壓環41的底表面412與側表面413的連接處形成為其他形狀,例如鈍角。Further, the connection between the bottom surface 412 of the pressing ring 41 and the side surface 413 forms a rounded corner (R angle). The arc angle of the R corner is, for example, 0.5 mm, to prevent the bottom surface 412 of the pressing ring 41 from contacting the first bearing. The pieces 60 are in contact with each other, and the first carrying piece 60 is scratched when the first carrying piece 60 moves horizontally. In other embodiments, if the first carrier piece 60 can withstand the friction of the pressing ring 41 moving on it without being scratched, the connection between the bottom surface 412 and the side surface 413 of the pressing ring 41 can also be formed into other shapes. , such as an obtuse angle.

在本實施方式中,側壁42設置於按壓環41上,側壁42為鏤空結構。具體的,側壁42的遠離第一承載區域23的一側開設有第一缺口420,第一缺口420供頂推裝置30穿過。具體地,供頂推裝置30穿過,以從頂推準備位置到頂推工作位置之間往返移動。In this embodiment, the side wall 42 is provided on the pressing ring 41 and has a hollow structure. Specifically, a first notch 420 is opened on the side of the side wall 42 away from the first bearing area 23 , and the first notch 420 allows the pushing device 30 to pass through. Specifically, the pushing device 30 passes through to move back and forth from the pushing preparation position to the pushing working position.

可以理解,第一缺口420的大小不作限定,只要不會妨礙頂推裝置30穿過該第一缺口420而往返於頂推準備位置和頂推工作位置即可。在本實施方式中,第一缺口420貫穿側壁42的兩側,即第一缺口420從側壁42的遠離按壓環41的一側延伸至按壓環41。It can be understood that the size of the first notch 420 is not limited as long as it does not prevent the ejection device 30 from passing through the first notch 420 and traveling between the ejection preparation position and the ejection working position. In this embodiment, the first notch 420 runs through both sides of the side wall 42 , that is, the first notch 420 extends from the side of the side wall 42 away from the pressing ring 41 to the pressing ring 41 .

在本實施方式中,預設移動方向為縱向(或是頂推件31的長度方向),當然,在其它實施方式中,可以根據需求進行調整,在此不作限定。In this embodiment, the preset movement direction is the longitudinal direction (or the length direction of the pushing member 31). Of course, in other embodiments, it can be adjusted according to needs, and is not limited here.

進一步地,側壁42上還開設有穿孔422。穿孔422與第一缺口420相對設置。Further, the side wall 42 is also provided with a through hole 422 . The through hole 422 is arranged opposite to the first notch 420 .

在本實施方式中,安裝部43大致呈“C”字狀,安裝部43與按壓環41相對設置,分別設置於側壁42的兩側。In the present embodiment, the mounting part 43 is generally in a "C" shape. The mounting part 43 is opposite to the pressing ring 41 and is respectively arranged on both sides of the side wall 42 .

進一步地,安裝部43上開設有多個安裝孔430,以通過固定機構(未圖示)安裝於基座10上。在本實施方式中,安裝部43的厚度隨著遠離側壁42增加,以便於在安裝部43上開設安裝孔430,從而安裝於基座10上。Furthermore, a plurality of mounting holes 430 are opened in the mounting portion 43 for mounting on the base 10 through a fixing mechanism (not shown). In this embodiment, the thickness of the mounting portion 43 increases away from the side wall 42 so as to open a mounting hole 430 in the mounting portion 43 for mounting on the base 10 .

可以理解,通過將安裝部43設置為C字狀,如此,按壓件40一側設置有側壁42,而另一側未設置形成第一缺口420,用於供頂推裝置30穿過而移動到頂推工作位置,即頂推目標物200的位置的正上方。此外,第一缺口420與側壁42中的穿孔422相對設置,有便於兩側的光源(未圖示)分別通過第一缺口420及穿孔422,從而有助於在取像時打光。It can be understood that by arranging the mounting portion 43 in a C-shape, the pressing member 40 is provided with a side wall 42 on one side, and the other side is not provided with a first gap 420 for the pushing device 30 to pass through and move to the top. The pushing working position is directly above the position of pushing target 200 . In addition, the first notch 420 is arranged opposite to the through hole 422 in the side wall 42, which facilitates the light sources (not shown) on both sides to pass through the first notch 420 and the through hole 422 respectively, thereby facilitating lighting during image capture.

進一步地,在按壓件40按壓第一承載片60之前,第一承載片60與第二承載片70之間的距離為一預定值,例如1.5mm。按壓件40可沿著第三方向Z移動並按壓第一承載片60,以進一步微調第一承載片60與第二承載片70之間的距離。舉例來說,在按壓件40按壓第一承載片60時,按壓件40可沿第三方向Z下壓,使第一承載片60的要頂推的目標物200的設置區域和第二承載片70之間的距離縮短至特定值,例如0.5mm或以下,例如0.2mm、0.4mm等。Further, before the pressing member 40 presses the first carrying piece 60, the distance between the first carrying piece 60 and the second carrying piece 70 is a predetermined value, such as 1.5 mm. The pressing member 40 can move along the third direction Z and press the first carrying piece 60 to further finely adjust the distance between the first carrying piece 60 and the second carrying piece 70 . For example, when the pressing member 40 presses the first carrier sheet 60, the pressing member 40 may press down along the third direction Z, so that the area where the target object 200 is to be pushed and the second carrier sheet are disposed. The distance between 70 is shortened to a specific value, such as 0.5mm or less, such as 0.2mm, 0.4mm, etc.

當然,在其它實施方式中,按壓件40還能夠採用其它的結構,只要能夠按壓到第一承載片60,使得第一承載片60的要頂推的目標物200的設置區域向第二承載片70靠近即可,其具體結構不受限制。Of course, in other embodiments, the pressing member 40 can also adopt other structures, as long as it can press the first carrying piece 60 so that the area of the first carrying piece 60 where the target 200 is to be pushed moves toward the second carrying piece. 70 is sufficient, and its specific structure is not restricted.

影像擷取裝置50通過固定元件51固定地設置於基座10上,並位於第一承載區域23的背離第二承載區域24的一側,用於對要頂推的目標物200進行取像。對於固定元件51,可以採用公知的固定結構,在此不再贅述。The image capturing device 50 is fixedly installed on the base 10 through the fixing element 51 and is located on the side of the first bearing area 23 away from the second bearing area 24 for capturing images of the target object 200 to be pushed. For the fixing element 51, a known fixing structure can be used, which will not be described again.

影像擷取裝置50的設置並無特別限制,只要對應目標物200設置而能對目標物200進行取像便可。在本實施方式中,影像擷取裝置50可為攝影機(CCD),但不限定於此。The arrangement of the image capturing device 50 is not particularly limited, as long as it is arranged corresponding to the target object 200 and can capture the image of the target object 200 . In this embodiment, the image capturing device 50 may be a camera (CCD), but is not limited thereto.

在頂推目標物200時,影像擷取裝置50與頂推裝置30彼此間的相對位置為同軸,且在頂推裝置30頂推目標物200之前,可通過影像擷取裝置50拍照、取像進而精準地計算目標物200的位置,從而將要頂推的目標物200移動至頂推裝置30的正中心,即要頂推的目標物200與頂推裝置30、按壓件40以及影像擷取裝置50彼此間的相對位置為同軸,確保每顆要頂推的目標物200的位置精度及頂推裝置30內的頂推件31能頂推到目標物200的正中心,因目標物200為晶粒,體積較小,約為0.08~0.15mm的長方體,若頂推件31偏移0.01mm以上則容易導致在頂推過程中出現翻晶或置下歪斜等情況。When pushing the target object 200, the relative positions of the image capturing device 50 and the pushing device 30 are coaxial, and before the pushing device 30 pushes the target object 200, the image capturing device 50 can take pictures and capture images. Then, the position of the target object 200 is accurately calculated, thereby moving the target object 200 to be pushed to the center of the pushing device 30, that is, the target object 200 to be pushed, the pushing device 30, the pressing member 40 and the image capturing device The relative positions of 50 to each other are coaxial, ensuring the position accuracy of each target 200 to be pushed and the pushing piece 31 in the pushing device 30 to push to the center of the target 200, because the target 200 is a crystal. The particles are small in size, about 0.08~0.15mm rectangular parallelepiped. If the pushing piece 31 is offset by more than 0.01mm, it will easily cause the crystal to turn over or be skewed during the pushing process.

優選地,在本實施方式中,影像擷取裝置50通過直接、正視取像來對目標物200進行取像。Preferably, in this embodiment, the image capturing device 50 captures the image of the target object 200 through direct, front-view imaging.

在本實施方式中,頂推裝置30、按壓件40及影像擷取裝置50同一側,當然,在其它實施方式中,頂推裝置30、按壓件40及影像擷取裝置50也可以位於不同側,只要將頂推裝置30及按壓件40設置為位於同一側即可。例如,頂推裝置30及按壓件40位於與影像擷取裝置50不同的一側,此時,影像擷取裝置50位於第二承載區域24的背離第一承載片60的一側,而頂推裝置30及按壓件40位於第一承載片60的背離第二承載區域24的一側。In this embodiment, the pushing device 30 , the pressing member 40 and the image capturing device 50 are on the same side. Of course, in other embodiments, the pushing device 30 , the pressing member 40 and the image capturing device 50 can also be located on different sides. , as long as the pushing device 30 and the pressing member 40 are arranged on the same side. For example, the pushing device 30 and the pressing member 40 are located on a different side from the image capturing device 50. At this time, the image capturing device 50 is located on the side of the second bearing area 24 away from the first bearing piece 60, and the pushing device 30 is located on a side away from the first bearing piece 60. The device 30 and the pressing member 40 are located on the side of the first carrying piece 60 away from the second carrying area 24 .

可以理解,頂推裝置30位於頂推準備位置時,頂推裝置30不會對影像擷取裝置50擷取按壓件40內的目標物200的影像造成影響。頂推裝置30在頂推準備位置與頂推工作位置之間移動的目的在於:影像擷取裝置50能夠輕易地擷取目標物200的影像,不需要通過額外的光學反射。It can be understood that when the pushing device 30 is in the pushing preparation position, the pushing device 30 will not affect the image captured by the image capturing device 50 of the target object 200 in the pressing member 40 . The purpose of moving the pushing device 30 between the pushing preparation position and the pushing working position is that the image capturing device 50 can easily capture the image of the target object 200 without additional optical reflection.

請結合參閱圖9的(a)~(d),對轉移設備100移動並轉移晶粒的動作流程作進一步說明。Please refer to (a) to (d) of FIG. 9 for further explanation of the action flow of the transfer equipment 100 to move and transfer the die.

請參閱圖9的(a),影像擷取裝置50進行取像,並計算晶粒1與頂推位置O之間的位置偏差d1、以及晶粒1與晶粒2之間的位置偏差d2。可以理解,頂推位置O是始終保持不變的,位置偏差d1為晶粒1的中心與頂推位置O之間的距離,位置偏差d2為晶粒1的中心與晶粒2的中心之間的距離。位置偏差d2又可稱為晶粒間距(pitch)。Referring to (a) of FIG. 9 , the image capturing device 50 captures an image and calculates the positional deviation d1 between the die 1 and the ejection position O, and the positional deviation d2 between the die 1 and the die 2 . It can be understood that the pushing position O always remains unchanged. The position deviation d1 is the distance between the center of grain 1 and the pushing position O. The position deviation d2 is the distance between the center of grain 1 and the center of grain 2. distance. The position deviation d2 can also be called the grain spacing (pitch).

接著,請參閱圖9的(b),根據d1,晶粒1被移至頂推位置O。可以理解,將晶粒1移至頂推位置O,是指通過移動第一承載片60,使得晶粒1與頂推位置O重疊,下述將晶粒2移至頂推位置O也是同樣的。Next, please refer to (b) of Figure 9. According to d1, die 1 is moved to the push position O. It can be understood that moving the die 1 to the ejection position O means moving the first carrier sheet 60 so that the die 1 overlaps with the ejection position O. The same applies to moving the die 2 to the ejection position O as described below. .

接著,從頂推準備位置移至頂推工作位置的頂推裝置30頂推晶粒1,以將晶粒1從第一承載片60轉移到第二承載片70上。Then, the ejection device 30 moved from the ejection preparation position to the ejection working position pushes the die 1 to transfer the die 1 from the first carrier sheet 60 to the second carrier sheet 70 .

請參閱圖9的(c),將晶粒1頂推至第二承載片70後,移動放置裝置20根據d2移動第一承載片60,以將晶粒2移至頂推位置O。不過,由於頂推裝置30在頂推晶粒1之後,無論頂推時是否有戳破第一承載片60,皆可能使第一承載片60的張力或其他特性產生變化,使得第一承載片60上的其他晶粒(例如晶粒2、晶粒3)的位置發生改變。因此,僅根據d2來移動晶粒2的話很可能無法將晶粒2精準地移至頂推位置O。如圖9的(c)所示,單憑d2來移動晶粒2,並無法使晶粒2精準地對齊頂推位置O。Referring to (c) of FIG. 9 , after pushing the die 1 to the second carrier piece 70 , the mobile placement device 20 moves the first carrier piece 60 according to d2 to move the die 2 to the push position O. However, after the ejection device 30 pushes the die 1, regardless of whether the first carrier sheet 60 is punctured during the push, the tension or other characteristics of the first carrier sheet 60 may change, causing the first carrier sheet to change. The positions of other grains on 60 (such as grain 2 and grain 3) change. Therefore, if the die 2 is moved only based on d2, it is likely that the die 2 cannot be accurately moved to the ejection position O. As shown in (c) of Figure 9, moving die 2 by d2 alone cannot accurately align die 2 with the push position O.

接著,類似於圖9中的(a)的動作,影像擷取裝置50對晶粒2進行取像,並計算晶粒2與頂推位置O之間的位置偏差、以及晶粒2與下一顆待頂推的晶粒(例如,晶粒3)之間的位置偏差(即pitch)。應注意的是,頂推裝置30在完成頂推晶粒1之後,會從頂推工作位置返回頂推準備位置,以避免阻礙影像擷取裝置50對晶粒2進行取像。Next, similar to the action in (a) in FIG. 9 , the image capturing device 50 captures the image of the die 2 and calculates the positional deviation between the die 2 and the ejection position O, as well as the positional deviation between the die 2 and the next position. The position deviation (i.e. pitch) between the grains to be pushed (for example, grain 3). It should be noted that after completing pushing the die 1 , the ejection device 30 will return from the ejection working position to the ejection preparation position to avoid hindering the image capture device 50 from capturing the image of the die 2 .

之後,請參閱圖9的(d),類似於圖9中的(b)的動作,移動放置裝置20根據前述計算出的晶粒2與頂推位置O之間的位置偏差,移動第一承載片60以對晶粒2的位置進行微調,使得晶粒2精準地位於頂推位置O。頂推裝置30則會再次由頂推準備位置進入頂推工作位置,以對晶粒2進行頂推。Afterwards, please refer to (d) of FIG. 9 . Similar to the action of (b) in FIG. 9 , the moving and placing device 20 moves the first bearing according to the positional deviation between the die 2 and the pushing position O calculated above. The chip 60 is used to finely adjust the position of the die 2 so that the die 2 is accurately located at the pushing position O. The pushing device 30 will again enter the pushing working position from the pushing preparation position to push the die 2 .

上述圖9的(a)~(d)的動作大致包括影像擷取裝置50對晶粒進行取像的「取像階段」、根據取像結果將晶粒精準移到頂推位置O的「中心(center)定位階段」、將晶粒頂推至第二承載片70的「頂推階段」、以及根據取像階段得到的pitch來移動下一顆晶粒的「pitch定位階段」。在一些實施方式中,上述四個階段可依序並反覆地執行,以逐一將第一承載片60上的晶粒轉移至第二承載片70上。The above-mentioned actions in (a) to (d) of FIG. 9 generally include the "imaging stage" in which the image capturing device 50 captures images of the die, and the "center (center)" of accurately moving the die to the ejection position O based on the imaging results. center) positioning stage", the "push stage" of pushing the die to the second carrier 70, and the "pitch positioning stage" of moving the next die according to the pitch obtained in the imaging stage. In some embodiments, the above four stages can be performed sequentially and repeatedly to transfer the dies on the first carrier sheet 60 to the second carrier sheet 70 one by one.

轉移設備100還包括第一驅動裝置80,第一驅動裝置80用於控制按壓件40在垂直面移動。更具體地,第一驅動裝置80用於控制按壓件40在第三方向Z(即預設移動方向)上移動。The transfer device 100 also includes a first driving device 80, which is used to control the pressing member 40 to move in the vertical plane. More specifically, the first driving device 80 is used to control the pressing member 40 to move in the third direction Z (ie, the preset movement direction).

進一步地,按壓件40也可以在第一驅動裝置80的控制作用下在水平面和垂直面移動。可以理解,按壓件40能夠在水平面移動,以對該按壓件40進行維修或者更換。換言之,除了沿垂直面(即包含第一移動方向的平面)移動,亦允許按壓件40在水平面上移動(例如從維護位置移動至按壓準備位置,或從按壓準備位置返回維護位置),以方便人員對該按壓件40進行維修或者更換。Furthermore, the pressing member 40 can also move in the horizontal plane and the vertical plane under the control of the first driving device 80 . It can be understood that the pressing member 40 can be moved in a horizontal plane to repair or replace the pressing member 40 . In other words, in addition to moving along the vertical plane (ie, the plane including the first moving direction), the pressing member 40 is also allowed to move on the horizontal plane (for example, moving from the maintenance position to the pressing preparation position, or returning from the pressing preparation position to the maintenance position) to facilitate The personnel repair or replace the pressing member 40 .

更具體地,在擴張環63載置於承載盤212後,要對第一承載片60上的目標物200進行頂推時,按壓件40在第一驅動裝置80的控制下,移動至第一承載片60上並按壓第一承載片60,使得第一承載片60的要頂推的目標物200的設置區域向第二承載片70靠近,且持續保持按壓第一承載片60,直至第一承載片60上的目標物200全部轉移至第二承載片70上,在第一驅動裝置80的控制下,移動至按壓準備位置。待作業人員更換下一擴張環63後,重複上述動作。More specifically, after the expansion ring 63 is placed on the carrier plate 212 and the target object 200 on the first carrier sheet 60 is to be pushed, the pressing member 40 moves to the first position under the control of the first driving device 80 . on the carrier piece 60 and press the first carrier piece 60 so that the area where the target 200 is to be pushed is closer to the second carrier piece 70 , and continue to press the first carrier piece 60 until the first All the target objects 200 on the carrier sheet 60 are transferred to the second carrier sheet 70 and moved to the pressing ready position under the control of the first driving device 80 . After the operator replaces the next expansion ring 63, the above action is repeated.

轉移設備100還包括第二驅動裝置90,其用於控制頂推裝置30沿特定軌跡移動。所述特定軌跡可對應所述頂推裝置30在第一方向X、第二方向Y、及/或第三方向上的位置改變。舉例來說,所述特定軌跡可大致呈弧線狀。然而本揭露並不限於此,所述特定軌跡亦可呈直線或其他形狀,只需所述特定軌跡可供頂推裝置30往返移動於不同特定位置(例如,頂推準備位置、頂推工作位置等)即可。The transfer device 100 also includes a second driving device 90 for controlling the pushing device 30 to move along a specific trajectory. The specific trajectory may correspond to the position change of the pushing device 30 in the first direction X, the second direction Y, and/or the third direction. For example, the specific trajectory may be roughly arc-shaped. However, the present disclosure is not limited thereto. The specific trajectory may also be in a straight line or other shape, as long as the specific trajectory allows the ejection device 30 to move back and forth to different specific positions (for example, ejection preparation position, ejection working position). etc.).

可以理解,在影像擷取裝置50對要頂推的目標物200取像之後,第二驅動裝置90控制頂推裝置30從頂推準備位置移動至頂推工作位置,頂推件31穿過按壓件40頂推目標物200之後,頂推裝置30從頂推工作位置返回至頂推準備位置,待影像擷取裝置50對下一顆要頂推的目標物200取像之後,第二驅動裝置90再次控制頂推裝置30從頂推準備位置移動至頂推工作位置,如此進行反覆,從而將第一承載片60上的目標物200轉移至第二承載片70上。It can be understood that after the image capturing device 50 captures an image of the target object 200 to be pushed, the second driving device 90 controls the pushing device 30 to move from the pushing preparation position to the pushing working position, and the pushing member 31 passes through the pushing position. After the object 40 pushes the target object 200, the pushing device 30 returns from the pushing working position to the pushing preparation position. After the image capturing device 50 captures an image of the next target object 200 to be pushed, the second driving device 90 again controls the ejection device 30 to move from the ejection preparation position to the ejection working position, and repeats this process to transfer the target object 200 on the first carrier sheet 60 to the second carrier sheet 70 .

用於放置目標物200的第一承載片60的面積較大,頂推件31直接頂推第一承載片60上的目標物200時張力不易受控制,容易波及整個第一承載片60。而在本實施方式中,在頂推目標物200時,按壓件40移動至與第一承載片60的接觸面62接觸並按壓第一承載片60,使得第一承載片60的要頂推的目標物200的設置區域向第二承載片70靠近,這樣,張力的變化不易波及整個第一承載片60,從而容易對要頂推的目標物200的設置區域的張力進行控制。The area of the first carrier sheet 60 for placing the target object 200 is relatively large. When the pushing member 31 directly pushes the target object 200 on the first carrier sheet 60, the tension is not easily controlled and may easily affect the entire first carrier sheet 60. In this embodiment, when pushing the target object 200, the pressing member 40 moves to contact the contact surface 62 of the first carrying piece 60 and presses the first carrying piece 60, so that the part of the first carrying piece 60 to be pushed is The installation area of the target object 200 is close to the second supporting sheet 70 , so that the change in tension is less likely to affect the entire first supporting sheet 60 , thereby making it easy to control the tension in the installation area of the target object 200 to be pushed.

進一步地,由於材料、加工等原因,第一承載片60與第二承載片70之間的間距較大,通常,第一承載片60與第二承載片70之間的間距達到1.5mm以上,而優選的作業距離,即優選的方案中,第一承載片60與第二承載片70之間的間距需要在0.5mm以下。在本實施方式中,通過設置按壓件40按壓第一承載片60,使得第一承載片60的要頂推的目標物200的設置區域向第二承載片70靠近,使得第一承載片60的要頂推的目標物200的設置區域與第二承載片70之間的間距處於預設範圍內,例如0.5mm以下,以便於頂推件31頂推目標物200。如此,通過設置按壓件40,能夠對第一承載片60與第二承載片70之間的距離進行有效地控制。當然,第一承載片60的要頂推的目標物200的設置區域與第二承載片70之間的間距可以根據需求進行相應的調整,在此不作限定。Furthermore, due to reasons such as materials and processing, the distance between the first load-bearing piece 60 and the second load-bearing piece 70 is relatively large. Usually, the distance between the first load-bearing piece 60 and the second load-bearing piece 70 reaches more than 1.5 mm. The preferred working distance, that is, in the preferred solution, the distance between the first carrying piece 60 and the second carrying piece 70 needs to be less than 0.5 mm. In this embodiment, the pressing member 40 is provided to press the first carrying piece 60 so that the area where the target 200 to be pushed is closer to the second carrying piece 70 so that the area of the first carrying piece 60 is moved closer to the second carrying piece 70 . The distance between the area where the target object 200 is to be pushed and the second carrier sheet 70 is within a preset range, for example, 0.5 mm or less, so that the pushing member 31 can push the target object 200 easily. In this way, by providing the pressing member 40, the distance between the first carrying piece 60 and the second carrying piece 70 can be effectively controlled. Of course, the distance between the area where the target object 200 to be pushed is located on the first carrier piece 60 and the second carrier piece 70 can be adjusted accordingly according to requirements, and is not limited here.

在本實施方式中,由於擴張環63通常是由人工擺放並且通過固定結構進行固定,此外,擴張環63中的內環631和外環632在結合時也可能會存在公差,若通過擴張環63自身來實現高度控制,以對第一承載片60與第二承載片70之間的距離進行微調,則需要更高的成本。In this embodiment, since the expansion ring 63 is usually placed manually and fixed by a fixed structure, in addition, there may also be tolerances when the inner ring 631 and the outer ring 632 in the expansion ring 63 are combined. 63 itself to achieve height control to fine-tune the distance between the first carrier piece 60 and the second carrier piece 70 will require higher costs.

這是因為除了整個擴張環63的面積較大而難以控制外,難以確保人工擺放擴張環63的位置均一致,即每個階段的擴張環63的擺放位置存在差異,難以將第一承載片60的高度調整到一致,如此,便難以確保第一承載片60與第二承載片70之間的距離。而在本實施方式中,通過按壓件40對第一承載片60進行按壓,由於按壓件40的按壓工作位置是固定的,如此,即使每個階段的擴張環63的擺放位置存在差異,通過按壓件40按壓,能夠將第一承載片60的要頂推的目標物200的設置區域與第二承載片70之間的距離一致,即能夠容易地實現高度控制。This is because in addition to the large area of the entire expansion ring 63 making it difficult to control, it is also difficult to ensure that the manual placement of the expansion ring 63 is consistent. That is, the placement position of the expansion ring 63 at each stage is different, and it is difficult to place the first load-bearing The heights of the pieces 60 are adjusted to be consistent. In this case, it is difficult to ensure the distance between the first carrying piece 60 and the second carrying piece 70 . In this embodiment, the first carrier piece 60 is pressed by the pressing member 40. Since the pressing working position of the pressing member 40 is fixed, even if the placement position of the expansion ring 63 in each stage is different, the first carrying piece 60 can be pressed by By pressing the pressing member 40, the distance between the installation area of the target object 200 to be pushed on the first carrying piece 60 and the second carrying piece 70 can be consistent, that is, the height control can be easily realized.

例如,在不設置按壓件40的情況下,假設第一承載片60在初始人工擺放時未與第二承載片70完全平行,比如,第一承載片60左側高於右側,如此,在轉移第一承載片60的左側的目標物200時,位於左側的第一承載片60與第二承載片70之間的距離較大,反之轉移右側目標物200時,位於右側的第一承載片60 到第二承載片70之間的距離較小,如此,即使頂推裝置30在同一位置頂推目標物200,即頂推路徑相同,也會導致頂推的結果不同,也就是說,這兩種情況下實際上頂推目標物200後目標物200向第二承載片70移動的距離不同。而通過設置按壓件40對第一承載片60進行按壓,即使出現上述情況,也能確保在頂推左側和右側的目標物200時,目標物200向第二承載片70移動的距離均相同。For example, in the case where the pressing member 40 is not provided, it is assumed that the first carrying piece 60 is not completely parallel to the second carrying piece 70 during the initial manual placement. For example, the left side of the first carrying piece 60 is higher than the right side. In this way, during transfer When the target object 200 is on the left side of the first carrying piece 60, the distance between the first carrying piece 60 and the second carrying piece 70 on the left side is larger. On the contrary, when the target object 200 on the right side is transferred, the distance between the first carrying piece 60 on the right side is larger. The distance to the second carrying piece 70 is small. In this way, even if the pushing device 30 pushes the target object 200 at the same position, that is, the pushing path is the same, the pushing results will be different. That is to say, the two pushing devices 30 push the target object 200 at the same position. In this case, the actual distance that the target 200 moves to the second carrier piece 70 after pushing the target 200 is different. By arranging the pressing member 40 to press the first carrier sheet 60 , even if the above situation occurs, it can be ensured that when pushing the left and right target objects 200 , the target objects 200 move to the second carrier sheet 70 by the same distance.

而且,工業用的CCD由於需要高速取像,因此,通常不具有自動對焦的功能,通過設置按壓環41按壓第一承載片60,使得第一承載片60的要頂推的目標物200的設置區域保持在固定位置,能夠維持固定的焦距,使得CCD能夠快速取像且成像清晰。Moreover, since industrial CCDs require high-speed imaging, they usually do not have an auto-focus function. By setting the pressing ring 41 to press the first carrier sheet 60, the target object 200 to be pushed on the first carrier sheet 60 is set. The area remains in a fixed position and can maintain a fixed focal length, allowing the CCD to capture images quickly and with clear images.

此外,在頂推目標物200之後,頂推裝置30移動至頂推準備位置,以讓影像擷取裝置50取像從而對下一顆要頂推的目標物200進行定位,因第一承載片60為有彈性的膜,隨著時間、目標物200的數量不同,容易導致第一承載片60發生位置偏差,而在本實施方式中,通過設置按壓件40按壓第一承載片60,能夠有效地使第一承載片60在水平面平穩地移動,從而避免出現上述情況。In addition, after pushing the target object 200, the pushing device 30 moves to the pushing preparation position to allow the image capturing device 50 to capture an image to position the next target object 200 to be pushed. Because the first carrier piece 60 is an elastic film. As time and the number of targets 200 vary, it is easy to cause positional deviation of the first carrier sheet 60. However, in this embodiment, by setting the pressing member 40 to press the first carrier sheet 60, it can effectively Therefore, the first carrying piece 60 can move smoothly on the horizontal plane, thereby avoiding the above situation.

以下,結合圖10~圖16對本實施方式的轉移設備100的轉移目標物200的方法進行說明。Hereinafter, the method of transferring the target object 200 in the transfer device 100 of this embodiment will be described with reference to FIGS. 10 to 16 .

當使用如圖1所示的轉移設備100進行目標物200的挑撿流程時,本揭露轉移目標物200的方法的一實施例包含以下步驟,需要說明的是,對於目標物的準備及放置可以通過公知的技術進行,因此,在此不再贅述。When using the transfer device 100 as shown in Figure 1 to perform the picking process of the target object 200, an embodiment of the method for transferring the target object 200 of the present disclosure includes the following steps. It should be noted that the preparation and placement of the target object can be It is carried out by well-known technology, so it will not be described again here.

首先,請結合參閱圖10,將設置有目標物200的第一承載片60與第二承載片70分別設置於第一放置部21及第二放置部22上,並讓目標物200位於第一承載片60與第二承載片70之間。此時,頂推裝置30位於頂推準備位置,按壓件40位於維護位置。在本實施方式中,頂推裝置30與按壓件40位於軸線A的兩側。換言之,頂推準備位置和維護位置位於軸線A的兩側。在一些實施例中,頂推準備位置和維護位置可以是不在軸線A上的其他位置。First, please refer to FIG. 10 , the first carrying piece 60 and the second carrying piece 70 with the target 200 are placed on the first placing part 21 and the second placing part 22 respectively, and the target 200 is placed on the first placing part 22 . between the carrying piece 60 and the second carrying piece 70 . At this time, the pushing device 30 is in the pushing preparation position, and the pressing member 40 is in the maintenance position. In this embodiment, the pushing device 30 and the pressing member 40 are located on both sides of the axis A. In other words, the push preparation position and the maintenance position are located on both sides of the axis A. In some embodiments, the ejection preparation position and the maintenance position may be other positions not on axis A.

接著,請結合參閱圖11,平移第一放置部21及第二放置部22,使第一承載片60上的目標物200對應移動至影像擷取裝置50的軸線A上,並通過影像擷取裝置50檢測目標物200,此時,頂推裝置30位於頂推準備位置,按壓件40位於按壓準備位置,即按壓件40與影像擷取裝置50同軸。Next, please refer to FIG. 11 in conjunction with FIG. 11 to translate the first placement part 21 and the second placement part 22 so that the target object 200 on the first carrier sheet 60 moves to the axis A of the image capture device 50 and is captured through the image capture device 50 . The device 50 detects the target object 200. At this time, the pushing device 30 is in the pushing preparation position, and the pressing member 40 is in the pressing preparation position, that is, the pressing member 40 and the image capturing device 50 are coaxial.

接著,請結合參閱圖12,將按壓件40移動至第一承載片60上,並按壓第一承載片60,使得第一承載片60的要頂推的目標物200的設置區域向第二承載片70靠近。此時,頂推裝置30位於頂推準備位置。Next, please refer to FIG. 12 , move the pressing member 40 to the first bearing piece 60 , and press the first bearing piece 60 so that the area where the target 200 to be pushed is positioned toward the second bearing piece 60 . Piece 70 is close. At this time, the pushing device 30 is in the pushing preparation position.

接著,請結合參閱圖13~圖14,將頂推裝置30從頂推準備位置移動至頂推工作位置,即讓頂推件31穿過按壓環41頂推第一承載片60,並頂起對應的目標物200而直接將被頂推的目標物200轉移黏置於第二承載片70上,以完成目標物200挑撿流程。Next, please refer to Figures 13 and 14 to move the pushing device 30 from the pushing preparation position to the pushing working position, that is, let the pushing member 31 pass through the pressing ring 41 to push the first carrying piece 60 and lift it. Corresponding to the target object 200, the pushed target object 200 is directly transferred and adhered to the second carrier sheet 70 to complete the picking process of the target object 200.

接著,請參閱圖15,將頂推件31歸位,使得頂推件31縮回至頂針蓋32內,此時,頂推裝置30位於頂推工作位置,按壓件40按壓第一承載片60。Next, please refer to FIG. 15 , return the push piece 31 so that the push piece 31 retracts into the ejector pin cover 32 . At this time, the push device 30 is in the push working position, and the pressing piece 40 presses the first carrying piece 60 .

接著,請結合參閱圖16,頂推裝置30返回至頂推準備位置,按壓件40按壓第一承載片60,平移第一承載片60及第二承載片70,以便於進入頂推下一顆目標物200的流程。Next, please refer to Figure 16, the pushing device 30 returns to the pushing preparation position, the pressing member 40 presses the first carrying piece 60, and translates the first carrying piece 60 and the second carrying piece 70 to facilitate the pushing of the next pill. The process of target object 200.

此處要特別說明的是,通過前置處理步驟的初始承載片的輔助,將各目標物200的發光面覆蓋設置於第一承載片60的承載面時,使目標物200由第一承載片60轉移到第二承載片70時,讓目標物200的發光面能反向第二承載片70的設置面裸露。此外,由於是先通過將目標物200的發光面反置於第一承載片60上,使得目標物200在第一承載片60的位置相對於位在初始承載片上的位置也是對應反置,因此,在進行目標物200的轉移前,會根據已被翻轉設置的目標物200的位置,對應調整控制軟體進行位置翻轉處理。What should be particularly noted here is that with the assistance of the initial carrier sheet in the pre-processing step, when the light-emitting surface of each target 200 is covered and disposed on the carrier surface of the first carrier sheet 60, the target object 200 is formed by the first carrier sheet. When 60 is transferred to the second carrier sheet 70, the light-emitting surface of the target object 200 can be exposed opposite the setting surface of the second carrier sheet 70. In addition, since the light-emitting surface of the target object 200 is first placed upside down on the first carrier sheet 60, the position of the target object 200 on the first carrier sheet 60 is also reversed relative to the position on the initial carrier sheet. Therefore, , before the target object 200 is transferred, the corresponding adjustment control software performs position flip processing according to the position of the target object 200 that has been flipped.

本揭露不限於上述的各實施方式,能夠在請求項所示的範圍內進行各種變更,對於適當組合在不同的實施方式中分別公開的技術手段而得到的實施方式也包含在本揭露的技術範圍內。進一步地,通過組合各實施方式分別公開的技術手段,能夠形成新的技術特徵。The present disclosure is not limited to the above-described embodiments, and various changes can be made within the scope indicated in the claims. Embodiments obtained by appropriately combining technical means disclosed in different embodiments are also included in the technical scope of the present disclosure. within. Furthermore, new technical features can be formed by combining the technical means disclosed in each embodiment.

100:轉移設備 200:目標物 10:基座 20:移動放置裝置 21:第一放置部 211:第一基台 212:承載盤 22:第二放置部 221:第二基台 222:夾持件 23:第一承載區域 24:第二承載區域 30:頂推裝置 31:頂推件 32:頂針蓋 320:腔體 40:按壓件 41:按壓環 411:第二缺口 42:側壁 420:第一缺口 422:穿孔 43:安裝部 430:安裝孔 50:影像擷取裝置 51:固定組件 60:第一承載片 61:承載面 62:接觸面 63:擴張環 631:內環 632:外環 70:第二承載片 71:設置面 80:第一驅動裝置 90:第二驅動裝置 A:軸線 X:第一方向 Y:第二方向 Z:第三方向 D1:按壓環的內徑 D2:按壓環的外徑 D3:按壓環的環寬度 O:頂推位置 d1:位置偏差 d2:位置偏差 1:晶粒 2:晶粒 3:晶粒 100:Transfer equipment 200:Target 10: base 20:Mobile placement device 21:First placement department 211:First abutment 212: Carrying tray 22:Second placement department 221:Second abutment 222: Clamping piece 23: First bearing area 24: Second load-bearing area 30: Pushing device 31: Push piece 32:Thimble cover 320:Cavity 40: Pressing parts 41:Press ring 411:Second gap 42:Side wall 420: first gap 422:Perforation 43:Installation Department 430:Mounting hole 50:Image capture device 51: Fixed components 60: First carrier film 61: Bearing surface 62:Contact surface 63: Expanding ring 631:Inner ring 632:Outer ring 70:Second carrier piece 71: Setting surface 80: First drive device 90: Second drive device A:Axis X: first direction Y: second direction Z: third direction D1: inner diameter of the pressing ring D2: outer diameter of the pressing ring D3: Ring width of the pressing ring O: push position d1: position deviation d2: position deviation 1: grain 2:Granules 3: Grains

為了更清楚地說明本申請實施方式或現有技術中的技術方案,下面將對實施方式或現有技術描述中所需要使用的附圖作簡單地介紹,顯而易見地,下面描述中的附圖僅僅是本申請的一些實施方式,對於本領域普通技術人員來講,在不付出創造性勞動的前提下,還可以根據這些附圖獲得其它的附圖。 圖1是本揭露一實施方式的轉移設備的立體結構圖。 圖2是圖1所示的轉移設備的主視圖。 圖3是圖2所示的轉移設備的局部放大圖。 圖4是圖3所示的轉移設備的局部放大圖。 圖5是圖1的轉移設備中的按壓件的俯視圖。 圖6是圖5所示的按壓件的立體結構圖。 圖7是圖5所示的按壓件的主視圖。 圖8是圖5所示的按壓件的側視圖。 圖9的(a)~(d)是移動並轉移晶粒的動作流程示意圖。 圖10是轉移設備轉移目標物的流程示意圖。 圖11是轉移設備轉移目標物的流程示意圖。 圖12是轉移設備轉移目標物的流程示意圖。 圖13是轉移設備轉移目標物的流程示意圖。 圖14是轉移設備轉移目標物的流程示意圖。 圖15是轉移設備轉移目標物的流程示意圖。 圖16是轉移設備轉移目標物的流程示意圖。 In order to more clearly explain the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings in the following description are only for the purpose of describing the embodiments or the prior art. For some embodiments of the application, those of ordinary skill in the art can also obtain other drawings based on these drawings without exerting creative efforts. FIG. 1 is a three-dimensional structural view of a transfer device according to an embodiment of the present disclosure. FIG. 2 is a front view of the transfer device shown in FIG. 1 . FIG. 3 is a partial enlarged view of the transfer device shown in FIG. 2 . FIG. 4 is a partial enlarged view of the transfer device shown in FIG. 3 . FIG. 5 is a top view of the pressing member in the transfer device of FIG. 1 . FIG. 6 is a perspective structural view of the pressing member shown in FIG. 5 . FIG. 7 is a front view of the pressing member shown in FIG. 5 . FIG. 8 is a side view of the pressing member shown in FIG. 5 . Figure 9 (a) ~ (d) is a schematic diagram of the action flow of moving and transferring crystal grains. Figure 10 is a schematic flowchart of the transfer device transferring the target object. Figure 11 is a schematic flowchart of a transfer device transferring a target object. Figure 12 is a schematic flowchart of a target object transferred by the transfer device. Figure 13 is a schematic flowchart of the transfer device transferring the target object. Figure 14 is a schematic flowchart of the transfer device transferring the target object. Figure 15 is a schematic flowchart of the transfer device transferring the target object. Figure 16 is a schematic flowchart of a target object transferred by the transfer device.

100:轉移設備 100:Transfer equipment

10:基座 10: base

20:移動放置裝置 20:Mobile placement device

21:第一放置部 21:First placement department

211:第一基台 211:First abutment

212:承載盤 212: Carrying tray

22:第二放置部 22:Second placement department

221:第二基台 221:Second abutment

222:夾持件 222: Clamping piece

30:頂推裝置 30: Pushing device

40:按壓件 40: Pressing parts

50:影像擷取裝置 50:Image capture device

51:固定組件 51: Fixed components

60:第一承載片 60: First carrier film

80:第一驅動裝置 80: First drive device

90:第二驅動裝置 90: Second drive device

X:第一方向 X: first direction

Y:第二方向 Y: second direction

Claims (9)

一種轉移設備,其用於將第一承載片上的至少一個目標物轉移至第二承載片,所述轉移設備包括:移動放置裝置,其用於將所述第一承載片放置於第一承載區域和將所述第二承載片放置於第二承載區域,使得所述第一承載片和所述第二承載片相向間隔且可相對平移;按壓件,其可移動地設置於所述第一承載區域的背離所述第二承載區域的一側,所述按壓件用於沿預設移動方向按壓所述第一承載片,使得所述第一承載片的待頂推的所述目標物的設置區域靠近所述第二承載片,所述預設移動方向為所述第一承載區域朝向所述第二承載區域的方向;以及頂推裝置,其可移動地設置於所述第一承載區域的背離所述第二承載區域的一側,所述頂推裝置包括頂推件,所述頂推件的前端用於沿所述預設移動方向穿過所述按壓件以頂推所述目標物,其中,所述按壓件包括側壁,所述側壁遠離所述第一承載區域的一側開設有第一缺口,所述第一缺口用於供所述頂推裝置穿過,所述側壁上還形成一穿孔,所述穿孔與所述第一缺口相對設置。 A transfer device for transferring at least one target object on a first carrier sheet to a second carrier sheet, the transfer device including: a moving placement device for placing the first carrier sheet in a first carrier area and placing the second bearing piece in the second bearing area, so that the first bearing piece and the second bearing piece are spaced apart from each other and relatively translatable; a pressing member is movably disposed on the first bearing piece. On the side of the area away from the second load-bearing area, the pressing member is used to press the first load-bearing piece along the preset movement direction, so that the target object to be pushed on the first load-bearing piece is positioned The area is close to the second load-bearing piece, and the preset movement direction is the direction of the first load-bearing area towards the second load-bearing area; and a pushing device is movably disposed on the first load-bearing area. On the side away from the second load-bearing area, the pushing device includes a pushing piece, and the front end of the pushing piece is used to pass through the pressing piece in the preset movement direction to push the target object , wherein the pressing member includes a side wall, and a first notch is opened on the side of the side wall away from the first bearing area. The first notch is used for the pushing device to pass through, and the side wall is also provided with a first notch. A perforation is formed, and the perforation is opposite to the first notch. 根據請求項1所述的轉移設備,其中所述按壓件形成一第二缺口,所述第二缺口設置於所述按壓件靠近所述第一承載區域的一側。 The transfer equipment according to claim 1, wherein the pressing member forms a second notch, and the second notch is provided on a side of the pressing member close to the first bearing area. 根據請求項2所述的轉移設備,其中所述按壓件進一步包括按壓環和安裝部,所述按壓環限定了所述第二缺口,所述安裝部與所述按壓環相對設置,所述安裝部和所述按壓環分別設置於所述側壁的兩側。 The transfer device according to claim 2, wherein the pressing member further includes a pressing ring and a mounting part, the pressing ring defines the second gap, the mounting part is arranged opposite to the pressing ring, and the mounting part The portion and the pressing ring are respectively arranged on both sides of the side wall. 根據請求項1所述的轉移設備,其中所述按壓環的底表面與側表面的連接處形成倒圓角。 The transfer device according to claim 1, wherein the connection between the bottom surface and the side surface of the pressing ring forms a rounded corner. 根據請求項1所述的轉移設備,其中所述第二缺口為圓孔。 The transfer device according to claim 1, wherein the second notch is a round hole. 根據請求項1所述的轉移設備,其中所述轉移設備還包括影像擷取裝置,其固定地設置於所述第一承載區域的背離所述第二承載區域的一側,用於對要頂推的所述目標物進行取像。 The transfer equipment according to claim 1, wherein the transfer equipment further includes an image capture device fixedly disposed on a side of the first load-bearing area away from the second load-bearing area for capturing the torsion. Push the target object to take the image. 根據請求項6所述的轉移設備,其中在所述頂推裝置頂推所述目標物時,所述頂推裝置、所述按壓件以及所述影像擷取裝置彼此間的相對位置為同軸。 The transfer equipment according to claim 6, wherein when the pushing device pushes the target object, the relative positions of the pushing device, the pressing member and the image capturing device are coaxial with each other. 根據請求項1所述的轉移設備,其中所述頂推裝置還包括頂針蓋,所述頂推件可凸伸出所述頂針蓋。 The transfer equipment according to claim 1, wherein the pushing device further includes an ejector pin cover, and the pushing member can protrude from the ejector pin cover. 根據請求項1所述的轉移設備,其中所述移動放置裝置包括第一放置部及第二放置部,所述第一放置部及所述第二放置部以相向間隔且可相對平移的方式設置。 The transfer equipment according to claim 1, wherein the mobile placing device includes a first placing part and a second placing part, the first placing part and the second placing part are arranged in a mutually spaced and relatively translatable manner. .
TW110126865A 2021-07-21 2021-07-21 Transfer apparatus TWI812980B (en)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180261580A1 (en) * 2015-03-20 2018-09-13 Rohinni, LLC Apparatus for direct transfer of semiconductor devices with needle retraction support
TWM621021U (en) * 2021-07-21 2021-12-11 久元電子股份有限公司 Transfer apparatus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180261580A1 (en) * 2015-03-20 2018-09-13 Rohinni, LLC Apparatus for direct transfer of semiconductor devices with needle retraction support
TWM621021U (en) * 2021-07-21 2021-12-11 久元電子股份有限公司 Transfer apparatus

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