TWI766646B - Method for quick positioning chips - Google Patents

Abstract

A method for quick positioning chips includes the following steps: preparing, fixing, position adjusting and transferring. In the fixing step, the suction device sucks a periphery of the main target area by a negative pressure, and the pushing member is moved to the main target area. In the position adjusting step, the suction device moves the main target area by the negative pressure until the axis of the target chip is aligned with the axis of the chip placing area. In the transferring step, the pushing member pushes the target chip towards the base plate by the carrier film until the target chip is transferred on the chip placing area. Such that, the axis of the target chip is aligned with the axis of the chip placing area precisely without moving whole carrier film, and a moving mass of the carrier film when offsetting position is reduced, so the moving speed is fast.

Description

Die high-speed positioning method

The present invention relates to a die positioning method, in particular to a high-speed die positioning method for fixing and moving a main target block in a small range through negative pressure to make the target die to a fixed point.

Integrated circuits are fabricated on a semiconductor wafer in a large number of ways and through multiple procedures, and the wafer is further divided into a plurality of dies. In other words, a die is a small piece of an integrated circuit body made of semiconductor material that is not packaged. The divided plural dies are neatly attached to a carrier film, and then a carrier frame is responsible for transporting the carrier film to the top of a substrate, and then at least one target in the main target area of the carrier film is pushed by at least one pusher The die is transferred to at least one die placement area of the substrate to facilitate subsequent processing procedures.

In the process of die transfer, since the horizontal position of the ejector is fixed, the entire carrier film must be moved so that an axis of the target die is aligned with an axis of the die placement area, and then the ejector passes through the carrier. The film pushes the target die to move toward the substrate until the target die is transferred to the die placement area.

However, the prior art has the following problems: firstly, the mass required to move the entire carrier film is quite large, and the moving speed is very slow; secondly, the axis of the target die is difficult to align with the axis of the die placement area. There is a slight deviation, which makes it difficult for the target die to be completely located in the die placement area, thereby affecting the subsequent processing procedures; third, once some of the grains are unevenly arranged, the above two problems will become more serious.

The main purpose of the present invention is to provide a high-speed positioning method for die, which can first fix the periphery of the main target block in a small range through negative pressure, and then move the main target block through negative pressure, so that the axis of the target die can be accurately aligned with the crystal. The axis of the particle placement area does not need to move the entire carrier film, which greatly reduces the mass of the carrier film to move when compensating the position, and the moving speed is fast.

In order to achieve the aforementioned purpose, the present invention provides a method for high-speed positioning of die, comprising the following steps:

In the preparation step, a first surface of a carrier film faces an adsorption device and at least one pusher, a second surface of the carrier film faces a substrate and has a plurality of crystal grains, and the carrier film is divided according to the number of the crystal grains. a plurality of blocks, wherein one block is defined as a main target block, the other blocks are defined as a plurality of other target blocks, at least one of the plurality of dies in the main target block is defined as at least one target die, the substrate has In at least one die placement area, the adsorption device is aligned around the main target block, and an axis of the at least one target die is offset from an axis of the at least one die placement area.

In the fixing step, the adsorption device moves to the periphery of the main target block and absorbs the periphery of the main target block by a negative pressure, and at least one pusher moves to the main target block.

In the position adjustment step, the adsorption device moves the main target block by negative pressure until the axis of the at least one target die is aligned with the axis of the at least one die placement area, and the adsorption device stops moving.

In the transferring step, the at least one pusher pushes the at least one target die to move toward the substrate through the carrier film until the at least one target die is transferred to the at least one die placement area.

In some embodiments, in the preparation step, the first surface of the carrier film faces a pusher, one of the plurality of dies in the main target area is defined as a target die, and the substrate has a die placement area , the axis of the target die is staggered from the axis of the die placement area; wherein, in the fixing step, the pusher moves to the main target area; wherein, in the position adjustment step, the adsorption device moves the main target area by negative pressure block until the axis of the target die is aligned with the axis of the die placement area; and wherein, in the transfer step, the pusher pushes the target die through the carrier film to move in a direction close to the substrate, until the target die is transferred to the die up to the particle placement area.

Preferably, in the preparation step, the plurality of crystal grains in the main target block are arranged neatly or unevenly.

In some embodiments, in the preparation step, the first surface of the carrier film faces the plurality of pushers, the plurality of dies in the main target area are arranged in order, and the plurality of dies in the main target area are defined as the plurality of target dies , the substrate has a plurality of die placement areas, the axes of the target die are respectively staggered from the axes of the die placement areas; wherein, in the fixing step, the push pieces move to the main target block ; and wherein, in the position adjustment step, the adsorption device moves the main target block by negative pressure until the axes of the target die are aligned with the axes of the die placement areas respectively.

Preferably, in the transfer step, the push elements push the target die to move toward the substrate through the carrier film, respectively, until the target die is transferred to the die placement area sequentially or together .

In some embodiments, in the preparation step, the first surface of the carrier film faces the plurality of pushers, the arrangement of the plurality of dies in the main target area is uneven, and the plurality of dies in the main target area is defined as the plurality of targets For the die, the substrate has a plurality of die placement areas, and the axes of the target die are respectively staggered from the axes of the die placement areas; wherein, in the fixing step, the pushers move to the main target block; wherein, in the position adjustment step, the adsorption device moves the main target block by negative pressure until the axis of one of the target die is aligned with the axis of one of the die placement areas ; Wherein, in the transfer step, one of the push pieces pushes one of the target die to move in a direction close to the substrate through the carrier film, until one of the target die is transferred to the wait until one of the die placement areas; and wherein, the position adjustment step and the transfer step are repeatedly performed until the target die are sequentially transferred to the die placement areas.

In some embodiments, in the fixing step, an image capture device captures an image of at least one target die, at least one pusher, and at least one die placement area to obtain a first image information, and The first image information is sent to a control device, and the control device determines a distance and an orientation between the axis of the at least one target die and the axis of the at least one die placement area according to the first image information, so as to obtain an adjustment information; And wherein, in the position adjustment step, the control device controls the adsorption device to move the main target block by negative pressure according to the adjustment information until the axis of at least one target die is aligned with the axis of at least one die placement area, and the control device controls The adsorption device stops moving, and further starts to perform the transfer step, so that the control device further controls the movement of the at least one pusher in the direction of the carrier film.

Preferably, in the position adjustment step, the image capture device captures at least one target die and at least one pusher during the movement of the plurality of dies in the main target block along the second surface of the carrier film. and an image of at least one die placement area to obtain a second image information, and transmit the second image information to the control device, and the control device determines whether the axis of the at least one target die is in line with the at least one according to the second image information. The axes of the die placement area are aligned; wherein, when the control device determines that the axis of the at least one target die is aligned with the axis of the at least one die placement area according to the second image information, the control device controls the adsorption device to stop moving, and further starts Execute the transfer step, so that the control device further controls the at least one pusher to move in the direction of the carrier film; and wherein, when the control device determines according to the second image information that the axis of the at least one target die has not been aligned with the axis of the at least one die placement area When the axes are aligned, the control device determines a distance and an orientation between the axis of the at least one target die and the axis of the at least one die placement area according to the second image information, so as to obtain a calibration information, and the control device controls the control device according to the calibration information The adsorption device moves the main target block by negative pressure until the axis of at least one target die is aligned with the axis of at least one die placement area, the control device controls the adsorption device to stop moving, and further starts to perform the transfer step, so that the control device Further control the movement of at least one pushing member toward the direction of the carrier film.

In some embodiments, in the preparation step, an axis of the at least one pusher is aligned with the axis of the at least one die placement area; and wherein, in the position adjustment step, the adsorption device moves the main target block by negative pressure , until the axis of at least one target die is simultaneously aligned with the axis of at least one pusher and the axis of at least one die placement area, the adsorption device stops moving.

In some embodiments, after the transferring step, a target switching step is further included, the adsorption device stops adsorbing the surrounding of the main target block by negative pressure, and at least another one of the plurality of dies in the main target block is defined as at least another For the target die, the entire carrier film and the substrate are moved until an axis of at least another target die is aligned with an axis of at least another die placement area; wherein, the transfer step is performed after the conversion of the target step is completed; And wherein, the conversion target step and the transfer step are repeatedly performed until all the die in the main target area are transferred to the substrate.

The effect of the present invention is that the high-speed positioning method of the die of the present invention can first fix the periphery of the main target block through a small range of negative pressure, and then move the main target block through the negative pressure, so that the axis of the target die can be accurately aligned with the die. The axis of the particle placement area does not need to move the entire carrier film, which greatly reduces the mass of the carrier film to move when compensating the position, and the moving speed is fast.

The embodiments of the present invention will be described in more detail below with reference to the drawings and component symbols, so that those skilled in the art can implement them after studying the description.

Please refer to FIG. 1 to FIG. 10 , the present invention provides a high-speed die positioning method, which includes the following steps:

In preparation step S1 , as shown in FIGS. 1 and 2A to 2E , a first surface 11 of a carrier film 10 faces an adsorption device 20 and a pusher 30 , and a second surface 12 of the carrier film 10 faces a substrate 40 and has a plurality of dies 50, the carrier film 10 is divided into a plurality of blocks according to the number of the dies 50, one of the blocks is defined as a main target block 13, and the other blocks are defined as a plurality of other target blocks 14 , the plurality of dies 50 in the main target block 13 are arranged in order, and one of the plurality of dies 50 in the main target block 13 is defined as a target die 51 . The substrate 40 has a die placement area 41 . The adsorption device 20 is aimed around the main target block 13 . An axis 31 of the ejector 30 is aligned with an axis 411 of the die placement area 41 , and an axis 511 of the target die 51 is simultaneously offset from the axis 31 of the ejector 30 and an axis 411 of the die placement area 41 .

More specifically, both ends of the carrier film 10 are respectively located on a carrier frame 90, two clamps (not shown) clamp the carrier frame 90, and a control device 80 controls the carrier frame 90 to move the entire carrier film 10 until the adsorption device 20 is aligned around the main target block 13.

Preferably, as shown in FIG. 2C , FIG. 3 and FIG. 4 , the adsorption device 20 is annular to form a shaft hole 21 and open a plurality of air holes 22 . in the shaft hole 21 . As shown in FIG. 2E and FIG. 4 , an image capturing device 70 is located on one side of the substrate 40 opposite to the carrier film 10 .

In the fixing step S2, as shown in FIG. 1 and FIG. 5 , a control device 80 controls the adsorption device 20 to move around the main target block 13 , and the vacuum device 60 evacuates the air holes 22 to generate vacuum and provide a negative pressure 601 , the adsorption device 20 uses the negative pressure 601 to adsorb the surrounding of the main target block 13 , and the control device 80 controls the pusher 30 to move to the main target block 13 . As shown in FIG. 5 to FIG. 7 , the image capturing device 70 captures an image of the target die 51 , the pusher 30 and the die placement area 41 to obtain a first image information 71 , and the first image information is 71 is sent to the control device 80 , and the control device 80 determines a distance and a distance between the axis 511 of the target die 51 and the axis 31 of the ejector 30 and the axis 411 of the die placement area 41 at the same time according to the first image information 71 . orientation to obtain an adjustment message 81 .

In the position adjustment step S3, as shown in FIG. 1 , FIG. 8A and FIG. 8B , the control device 80 controls the adsorption device 20 to move the main target block 13 by the negative pressure 601 according to the adjustment message 81 , until the axis 511 of the target die 51 is at the same time Until the axis 31 of the pushing member 30 and the axis 411 of the die placement area 41 are aligned, the control device 80 controls the adsorption device 20 to stop moving. Further, as shown in FIG. 9 , during the movement of the plurality of dies 50 in the main target block 13 along the second surface 12 of the carrier film 10 , the image capturing device 70 captures the target dies 51 , top An image of the pusher 30 and the die placement area 41 is obtained to obtain a second image information 72 , and the second image information 72 is sent to the control device 80 , and the control device 80 determines the target die 51 according to the second image information 72 Whether the axis 511 of the pusher 30 is aligned with the axis 31 of the ejector 30 and the axis 411 of the die placement area 41 at the same time. When the control device 80 determines that the axis 511 of the target die 51 is aligned with the axis 31 of the ejector 30 and the axis 411 of the die placement area 41 according to the second image information 72 , the control device 80 controls the adsorption device 20 to stop moving. When the control device 80 determines according to the second image information 72 that the axis 511 of the target die 51 has not been aligned with the axis 31 of the ejector 30 and the axis 411 of the die placement area 41 at the same time, the control device 80 determines according to the second image information 72 A distance and an orientation between the axis 511 of the target die 51 and the axis 31 of the ejector 30 and the axis 411 of the die placement area 41 are determined to obtain a calibration message 82 . The control device 80 controls the negative pressure 601 of the adsorption device 20 to move the main target block 13 according to the calibration information 82 until the axis 511 of the target die 51 is aligned with the axis 31 of the ejector 30 and the axis 411 of the die placement area 41 at the same time.

In transfer step S4, as shown in FIG. 1 and FIG. 10 , the control device 80 controls the pusher 30 to move in the direction of the carrier film 10 , and the pusher 30 pushes the target die 51 to move toward the substrate 40 through the carrier film 10 , Until the target die 51 is transferred to the die placement area 41 .

Further, as shown in FIGS. 2A to 2E , before the method of the present invention is performed, in the preparation step S1 , the adsorption device 20 and the pusher 30 do not contact the first surface 11 of the carrier film 10 , so as As shown in FIG. 5 , in the fixing step S2 , the control device 80 needs to first control the adsorption device 20 and the pusher 30 to move to the first surface 11 of the carrier film 10 along a vertical direction.

The preparation step S1 , the fixing step S2 , the position adjustment step S3 and the transfer step S4 are repeatedly performed until all the dies 50 on the first main target area 13 are transferred to the multiple die placement areas 41 . After all the dies 50 on the first main target block 13 are transferred to the die placement areas 41, one of the other target blocks 14 is selected as the next main target block 13, and the After the preparation step S1 , the adsorption device 20 and the pushing member 30 are kept against the first surface 11 of the carrier film 10 . In the fixing step S2, there are two ways for the adsorption device 20 and the ejector 30 to move to the next main target block 13: first, the carrier film 10 remains stationary, and the control device 80 controls the adsorption device 20 and the ejector 30 Move directly to the next main target block 13 along the first surface 11 of the carrier film 10; secondly, the adsorption device 20 and the ejector 30 remain stationary, the control device 80 controls the carrier film 10 to move, so that the adsorption device 20 and the ejector The pusher 30 moves indirectly to the next main target block 13 . The subsequent position adjustment step S3 and transfer step S4 are as described above.

After all the die 50 are transferred to the substrate 40 , the control device 80 controls the adsorption device 20 and the pusher 30 to move away from the carrier film 10 .

Please refer to FIG. 11 . FIG. 11 is a schematic diagram of the position change of the image capturing device 70 according to the first embodiment of the present invention. The position of the image capturing device 70 can also be changed to be located on one side of the adsorption device 20 and the pushing member 30 relative to the carrier film 10 .

It is worth mentioning that in the preparation step S1 of the first embodiment, even if the arrangement of the plurality of dies 50 in the main target block 13 is uneven (not shown), the fixing step of the first embodiment can be used. S2 , the position adjustment step S3 and the transfer step S4 complete the purpose of transferring the target die 51 to the die placement area 41 .

In addition, in the preparation step S1 in other embodiments, the axis 31 of the pushing member 30 may also be offset from the axis 411 of the die placement area 41 . Therefore, in the position adjustment step S3, the adsorption device 20 moves the main target block 13 by negative pressure until the axis 511 of the target die 51 is aligned with the axis 411 of the die placement region 41, and the adsorption device 20 stops moving.

Referring to FIGS. 12 to 16 , the difference between the second embodiment and the first embodiment is: as shown in FIG. 12 , in the preparation step S1 , the first surface 11 of the carrier film 10 faces the plurality of pushing members 30 , the main target is The plurality of dies 50 in the block 13 are arranged in order, the plurality of dies 50 in the main target block 13 are defined as a plurality of target dies 51 , the substrate 40 has a plurality of die placement areas 41 , the The axes 31 are respectively aligned with the axes 411 of the die placement areas 41 , and the axes 511 of the target dies 51 are respectively simultaneously aligned with the axes 31 of the pushers 30 and the die placement areas. The axes 411 of 41 are offset. As shown in FIGS. 13 and 14 , in the fixing step S2 , the control device 80 controls the pushers 30 to move to the main target block 13 . As shown in FIG. 6 and FIG. 15 , in the position adjustment step S3 , the control device 80 controls the adsorption device 20 to move the main target block 13 by the negative pressure 601 according to the adjustment message 81 until the axes of the target die 51 are reached 511 are respectively aligned with the axes 31 of the push members 30 and the axes 411 of the die placement areas 41 at the same time. As shown in FIGS. 16A to 16E , in the transfer step S4 , the pushers 30 push the target die 51 to move toward the substrate 40 through the carrier film 10 in sequence until the target die 51 is The sequence is transferred to the die placement areas 41 . In other words, the control device 80 can also control one pusher 30 to push one target die 51 through the carrier film 10 at a time.

It is worth mentioning that, in another operation mode of the transfer step S4 of the second embodiment, the control device 80 controls the pushers 30 to push the target die 51 toward the substrate 40 through the carrier film 10 respectively. Move until the target dies 51 are transferred to the die placement areas 41 together. In other words, the control device 80 can control all the pushing members 30 to simultaneously push all the target dies 51 through the carrier film 10 at one time.

Please refer to FIG. 1 and FIG. 17 , after the transfer step S4, it further includes a target switching step S5, the control device 80 controls the vacuum device 60 to stop pumping, so that the adsorption device 20 stops adsorbing the surrounding of the main target block 13 by the negative pressure 601, The other dies in the main target block 13 are defined as a plurality of target dies 51 , and the control device 80 controls the carrier frame 90 to move the entire carrier film 10 and the substrate 40 to move until the axes of the target dies 51 511 are respectively aligned with the axes 31 of the pushing members 30 and the axes 411 of the other several die placement areas 41 . After the transition destination step S5 ends, the transition step S4 is performed. The conversion target step S5 and the transfer step S4 are repeatedly performed until all the die 50 in the main target block 13 are transferred to the substrate 40 .

Please refer to FIG. 18 and FIG. 19 . The difference between the third embodiment and the second embodiment is that, as shown in FIG. 18 , in the preparation step S1 , the arrangement of the plurality of dies 50 in the main target block 13 is uneven. As shown in FIG. 19 , in the position adjustment step S3 , the control device 80 controls the adsorption device 20 to move the main target block 13 by the negative pressure 601 according to the adjustment message 81 until the axis 511 of one of the target dies 51 is reached At the same time, it is aligned with the axis 31 of one of the pushing members 30 and the axis 411 of one of the die placement areas 41 . As shown in FIG. 20 , in the transfer step S4 , one of the push elements 30 pushes one of the target die 51 to move toward the substrate 40 through the carrier film 10 until the target die One of the dies 51 is transferred to one of the die placement areas 41 . As shown in FIG. 1 , the position adjustment step S3 and the transfer step S4 are repeatedly performed until the target die 51 are sequentially transferred to the die placement areas 41 .

To sum up, the high-speed die positioning method of the present invention can first fix the periphery of the main target block 13 in a small range through the negative pressure 601 , and then move the main target block 13 through the negative pressure 601 , so that the axis 511 of the target die 51 The axis 411 of the die placement area 41 can be precisely aligned without moving the entire carrier film 10 , the mass of the carrier film 10 to be moved when the position is compensated is greatly reduced, and the moving speed is fast.

Furthermore, regardless of whether the plurality of dies 50 in the main target block 13 are arranged neatly or unevenly, the high-speed die positioning method of the present invention can make the axis 511 of the target die 51 precisely align with the axis of the die placement area 41 . 411.

In addition, the high-speed die positioning method of the present invention can be applied to a single pusher 30 or a plurality of pushers 30, and is provided in accordance with the alignment or unevenness of the plurality of dies 50 in the main target block 13 different operating modes.

In addition, the high-speed die positioning method of the present invention can accurately determine the relative position of the target die 51 and the die placement area 41 by the image capture device 70 and the control device 80 , which is helpful for the control device 80 to accurately control the adsorption The device 20 moves the target die 51 to the correct position, so that the axis 511 of the target die 51 can be aligned with the axis 411 of the die placement area 41 , so as to ensure that the ejector 30 can accurately transfer the target die 51 to the die placement area District 41.

In addition, during the process of the plurality of dies 50 in the main target block 13 moving along the second surface 12 of the carrier film 10 , the high-speed die positioning method of the present invention can be continuously performed by the image capturing device 70 and the control device 80 . The relative positions of the target die 51 and the die placement area 41 are properly corrected, so that there is zero error between the final position of the target die 51 and the correct position.

Also, if the axis 31 of the ejector 30 and the axis 411 of the die placement area 41 can be aligned, the ejector 30 can transfer the target die 51 to the die placement area 41 at the most precise angle.

The above descriptions are only used to explain the preferred embodiments of the present invention, and are not intended to limit the present invention in any form. Therefore, any modification or change of the present invention should be made under the same spirit of the invention. , all should still be included in the intended protection scope of the present invention.

10: Carrier film 11: The first surface 12: Second surface 13: Main target block 14: Other target blocks 20: Adsorption device 21: Shaft hole 22: Stomata 30: Push pieces 31: Axis 40: Substrate 41: Die placement area 411: Axis 50: grain 51: target die 511: Axis 60: Vacuum device 601: Negative pressure 70: Image capture device 71: First Image Information 72: Second Image Information 80: Control device 81: Adjust the message 82: Correction message 90: carrying frame S1: Preparation steps S2: Fixed step S3: Position adjustment steps S4: Transfer step S5: Conversion target step

[ Fig. 1 ] is a flowchart of the high-speed die positioning method of the present invention. [ FIG. 2A ] to [ FIG. 2E ] are schematic diagrams of preparation steps of the first embodiment of the present invention. [ Fig. 3 ] is a bottom view of the adsorption device and the pusher according to the first embodiment of the present invention. [ FIG. 4 ] is a schematic structural diagram of an adsorption device, a pusher, an image capture device, and a control device according to the first embodiment of the present invention. [ Fig. 5 ] is a schematic diagram of the fixing step of the first embodiment of the present invention. [FIG. 6] is a schematic diagram of the transmission of the first image information and the adjustment information according to the first embodiment of the present invention. [ FIG. 7 ] is a bottom view of the carrier film according to the first embodiment of the present invention, wherein the plurality of crystal grains in the target area are arranged in order, and an axis of a target crystal grain is simultaneously connected with an axis of a pusher and a crystal grain. One axis of the particle placement area is staggered. [ Fig. 8A ] is a perspective view of the main target block for moving the adsorption device according to the first embodiment of the present invention. [ FIG. 8B ] is a bottom view of the carrier film according to the first embodiment of the present invention, wherein the plurality of crystal grains in the target block are arranged in order, and an axis of a target crystal grain is simultaneously connected with an axis of a pusher and a crystal grain. One axis of the particle placement area is aligned. [ FIG. 9 ] is a schematic diagram of the transmission of the second image information and the correction information according to the first embodiment of the present invention. [ FIG. 10 ] is a schematic diagram of the transfer step of the first embodiment of the present invention. [ FIG. 11 ] is a schematic diagram of the position change of the image capturing device according to the first embodiment of the present invention. [ Fig. 12 ] is a schematic diagram of a preparation step of the second embodiment of the present invention. [ Fig. 13 ] is a schematic diagram of the fixing step of the second embodiment of the present invention. [ FIG. 14 ] is a bottom view of the carrier film according to the second embodiment of the present invention, wherein the plurality of crystal grains in the target block are arranged neatly, and the plurality of axes of the plurality of target crystal grains are respectively at the same time as the plurality of the plurality of push pieces. The plural axes of the die placement areas are offset. [FIG. 15] is a bottom view of the carrier film according to the second embodiment of the present invention, wherein the plurality of crystal grains in the target area are arranged neatly, and the plurality of axes of the plurality of target crystal grains are simultaneously with the plurality of axes of the plurality of ejectors and the plurality of crystal grains. The plural axes of the grain placement area are aligned. [FIG. 16A] to [FIG. 16E] are schematic diagrams of transfer steps of the second embodiment of the present invention. [ FIG. 17 ] is a schematic diagram of the conversion target step of the second embodiment of the present invention. [ FIG. 18 ] is a bottom view of the carrier film according to the third embodiment of the present invention, wherein the plurality of crystal grains in the target block are unevenly arranged, and the plurality of axes of the plurality of target crystal grains are respectively simultaneously with the plurality of axes of the plurality of ejectors. and the plural axes of the plural grain placement areas are staggered. [FIG. 19] is a bottom view of the carrier film according to the second embodiment of the present invention, wherein the plurality of crystal grains in the target area are unevenly arranged, and the axis of one of the target crystal grains and the axis of one of the push members and the The axes of one die placement area are aligned, and the multiple axes of the remaining target die are simultaneously offset from the multiple axes of the remaining push members and the multiple axes of the remaining die placement areas. [ FIG. 20 ] is a schematic diagram of the transfer step of the third embodiment of the present invention.

S1: Preparation steps

S2: Fixed step

S3: Position adjustment steps

S4: Transfer step

S5: Conversion target step

Claims (10)

A method for high-speed positioning of crystal grains, comprising the following steps: In the preparation step, a first surface of a carrier film faces an adsorption device and at least one pusher, a second surface of the carrier film faces a substrate and has a plurality of crystal grains, and the carrier film is divided according to the number of the crystal grains It is divided into a plurality of blocks, one of which is defined as a main target block, the remaining blocks are defined as a plurality of other target blocks, and at least one of the plurality of dies in the main target block is defined as at least one target die , the substrate has at least one die placement area, the adsorption device is aligned around the main target area, and an axis of the at least one target die is offset from an axis of the at least one die placement area; a fixing step, the adsorption device moves to the periphery of the main target block and absorbs the periphery of the main target block by a negative pressure, and the at least one pusher moves to the main target block; a position adjustment step, the adsorption device moves the main target block by the negative pressure, until the axis of the at least one target die is aligned with the axis of the at least one die placement region, the adsorption device stops moving; and In the transfer step, the at least one pusher pushes the at least one target die to move toward the substrate through the carrier film until the at least one target die is transferred to the at least one die placement area. The high-speed die positioning method of claim 1, wherein, in the preparation step, the first surface of the carrier film faces a pusher, and one of the plurality of dies in the main target area defines is a target die, the substrate has a die placement area, the axis of the target die is offset from the axis of the die placement area; wherein, in the fixing step, the pusher moves to the main target block; wherein, in the position adjustment step, the adsorption device moves the main target block by the negative pressure until the axis of the target die is aligned with the axis of the die placement area; and wherein, In the transferring step, the pushing member pushes the target die to move toward the direction close to the substrate through the carrier film until the target die is transferred to the die placement area. The high-speed die positioning method according to claim 2, wherein, in the preparation step, the plurality of die in the main target block are arranged neatly or unevenly. The high-speed die positioning method according to claim 1, wherein, in the preparation step, the first surface of the carrier film faces a plurality of pushers, and the plurality of die in the main target area are arranged in order, and the main The plurality of dies in the target block is defined as a plurality of target dies, the substrate has a plurality of die placement areas, and the axes of the target die are respectively staggered from the axes of the die placement areas; wherein, in In the fixing step, the pushers move to the main target block; and wherein, in the position adjustment step, the adsorption device moves the main target block by the negative pressure until the target die is The axes are respectively aligned with the axes of the die placement areas. The high-speed die positioning method as claimed in claim 4, wherein, in the transferring step, the push elements push the target die to move toward the substrate through the carrier film in sequence or together, until The target dies are sequentially or collectively transferred to the die placement areas. The high-speed die positioning method as claimed in claim 1, wherein, in the preparation step, the first surface of the carrier film faces the plurality of ejectors, and the plurality of die in the main target area are unevenly arranged, The plurality of dies in the main target block are defined as a plurality of target dies, the substrate has a plurality of die placement areas, and the axes of the target dies are respectively staggered from the axes of the die placement areas; wherein , in the fixing step, the push pieces move to the main target block; wherein, in the position adjustment step, the adsorption device moves the main target block by the negative pressure until the target die The axis of one of them is aligned with the axis of one of the die placement areas; wherein, in the transfer step, one of the push pieces pushes the target die through the carrier film One of the grains moves in a direction close to the substrate until one of the target grains is transferred to one of the grain placement areas; and wherein the position adjustment step and the transfer step are repeatedly performed , until the target dies are sequentially transferred to the die placement areas. The high-speed die positioning method of claim 1, wherein, in the fixing step, an image capture device captures the at least one target die, the at least one pusher and the at least one die placement area. an image to obtain a first image information, and transmit the first image information to a control device, and the control device determines the axis of the at least one target die and the at least one die according to the first image information a distance and an orientation between the axes of the placement area to obtain an adjustment signal; and wherein, in the position adjustment step, the control device controls the adsorption device to move the main target area by the negative pressure according to the adjustment information block until the axis of the at least one target die is aligned with the axis of the at least one die placement area, the control device controls the adsorption device to stop moving, and further starts to perform the transfer step, so that the control device further controls The at least one pusher moves toward the direction of the carrier film. The high-speed die positioning method according to claim 7, wherein, in the position adjustment step, during the movement of the plurality of dies in the main target area along the second surface of the carrier film, the image The capture device captures an image of the at least one target die, the at least one pusher and the at least one die placement area to obtain a second image information, and transmits the second image information to the control device , the control device determines whether the axis of the at least one target die is aligned with the axis of the at least one die placement area according to the second image information; wherein, when the control device determines the axis according to the second image information When the axis of the at least one target die is aligned with the axis of the at least one die placement area, the control device controls the adsorption device to stop moving, and further starts to perform the transfer step, so that the control device further controls the at least one top The pusher moves in the direction of the carrier film; and wherein, when the control device determines according to the second image information that the axis of the at least one target die has not been aligned with the axis of the at least one die placement area, the The control device determines a distance and an orientation between the axis of the at least one target die and the axis of the at least one die placement area according to the second image information, so as to obtain a calibration message, and the control device determines according to the calibration The information controls the adsorption device to move the main target block by the negative pressure until the axis of the at least one target die is aligned with the axis of the at least one die placement area, and the control device controls the adsorption device to stop moving , and further start to execute the transfer step, so that the control device further controls the at least one pusher to move in the direction of the carrier film. The high-speed die positioning method as claimed in claim 1, wherein, in the preparation step, an axis of the at least one pusher is aligned with the axis of the at least one die placement area; and wherein the position is adjusted In the step, the adsorption device moves the main target block by the negative pressure until the axis of the at least one target die is at the same time as the axis of the at least one pusher and the axis of the at least one die placement area When aligned, the suction device stops moving. The high-speed die positioning method as claimed in claim 1, further comprising a step of switching targets after the transferring step, and the adsorption device stops adsorbing the surrounding of the main target block by the negative pressure, and inside the main target block At least another of the plurality of dies is defined as at least another target die, and the entire carrier film and the substrate are moved until an axis of the at least another target die is aligned with an axis of at least another die placement area wherein, the transfer step is performed after the conversion target step is completed; and wherein the conversion target step and the transfer step are repeatedly performed until all the die in the main target block are transferred to the substrate.

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