TW202243093A - Method for quick positioning chips - Google Patents

Abstract

A method for quick positioning chips includes the following steps: preparing, fixing, position adjusting and transferring. In the fixing step, the suction device sucks a periphery of the main target area by a negative pressure, and the pushing member is moved to the main target area. In the position adjusting step, the suction device moves the main target area by the negative pressure until the axis of the target chip is aligned with the axis of the chip placing area. In the transferring step, the pushing member pushes the target chip towards the base plate by the carrier film until the target chip is transferred on the chip placing area. Such that, the axis of the target chip is aligned with the axis of the chip placing area precisely without moving whole carrier film, and a moving mass of the carrier film when offsetting position is reduced, so the moving speed is fast.

Description

Die high-speed positioning method

The invention relates to a crystal grain positioning method, in particular to a high-speed grain positioning method for fixing and moving a main target block in a small range by negative pressure so that the target grain can reach a fixed point.

Integrated circuits are fabricated on semiconductor wafers through multiple procedures in a large number of ways, and the wafers are further divided into multiple crystal grains. In other words, a die is a small unpackaged integrated circuit body made of semiconductor material. A plurality of divided crystal grains are neatly attached on a carrier film, and then a carrier frame is responsible for transporting the carrier film to the top of a substrate, and then at least one target in the main target area of the carrier film is moved by at least one pusher The crystal grains are transferred to at least one grain placement area of the substrate, so as to facilitate subsequent processing procedures.

In the process of die transfer, because the horizontal position of the ejector is fixed, the entire carrier film must be moved so that the axis of the target die is aligned with the axis of the die placement area, and then the ejector passes through the carrier film. The film pushes the target die to move close to the substrate until the target die is transferred to the die placement area.

However, the prior art has the following problems: one, the mass required to move the entire carrier film is quite large, and the moving speed is very slow; two, the axis of the target grain is difficult to align with the axis of the grain placement area. Some deviations make it difficult for the target grains to be completely located in the grain placement area, thereby affecting subsequent processing procedures; third, once some grains are arranged unevenly, the above two problems will become more serious.

The main purpose of the present invention is to provide a high-speed die positioning method, which can fix the main target block through negative pressure in a small range, and then move the main target block through negative pressure, so that the axis of the target die can be accurately aligned with the die. The axis of the particle placement area does not need to move the entire carrier film, which greatly reduces the mass that the carrier film needs to move when the position is compensated, and the moving speed is fast.

In order to achieve the aforementioned purpose, the present invention provides a method for high-speed positioning of crystal grains, comprising the following steps:

In the preparatory step, a first surface of a carrier film faces a suction device and at least one pusher, a second surface of the carrier film faces a substrate and has a plurality of crystal grains, and the carrier film is divided into A plurality of blocks, wherein one block is defined as a main target block, and the remaining blocks are defined as a plurality of other target blocks, at least one of the plurality of dies in the main target block is defined as at least one target die, and the substrate has At least one die placement area, the adsorption device is aimed at the periphery of the main target block, and an axis of the at least one target die is deviated from an axis of the at least one die placement area.

In the fixing step, the suction device moves to the surrounding of the main target block and absorbs the surrounding of the main target block by a negative pressure, and at least one pushing member moves to the main target block.

In the position adjustment step, the adsorption device moves the main target block by negative pressure until the axis of at least one target die is aligned with the axis of at least one die placement area, and the adsorption device stops moving.

In the transferring step, at least one pushing member pushes at least one target die to move towards the substrate through the carrying film until the at least one target die is transferred to at least one die placement area.

In some embodiments, in the preparation step, the first surface of the carrier film faces a pusher, one of the plurality of dies in the main target area is defined as a target die, and the substrate has a die placement area , the axis of the target grain and the axis of the grain placement area are staggered; wherein, in the fixing step, the pusher moves to the main target area; wherein, in the position adjustment step, the adsorption device moves the main target area by negative pressure Block until the axis of the target die is aligned with the axis of the die placement area; and wherein, in the transfer step, the pusher pushes the target die through the carrier film to move towards the direction close to the substrate until the target die is transferred to the die until the grain storage area.

Preferably, in the preparation step, the plurality of dies in the main target block are arranged neatly or irregularly.

In some embodiments, in the preparation step, the first surface of the carrier film faces the plurality of pushers, the plurality of dies in the main target area are aligned, and the plurality of dies in the main target area are defined as the plurality of target dies , the substrate has a plurality of die placement areas, the axes of the target dies are respectively staggered from the axes of the die placement areas; wherein, in the fixing step, the pushers move to the main target block and wherein, in the position adjustment step, the adsorption device moves the main target block by negative pressure until the axes of the target dies are respectively aligned with the axes of the die placement regions.

Preferably, in the transfer step, the pushing members respectively push the target dies to move towards the substrate through the carrier film until the target dies are transferred to the die placement areas sequentially or together .

In some embodiments, in the preparation step, the first surface of the carrier film faces the plurality of pushers, the plurality of dies in the main target area are arranged unevenly, and the plurality of dies in the main target area are defined as the plurality of targets Die, the substrate has a plurality of die placement areas, the axes of the target dies are respectively staggered from the axes of the die placement areas; wherein, in the fixing step, the pushers move to the main target block; wherein, in the position adjustment step, the adsorption device moves the main target block by negative pressure until the axis of one of the target dies is aligned with the axis of one of the die placement regions ; Wherein, in the transfer step, one of the pushing members pushes one of the target dies through the carrier film to move towards the direction close to the substrate until one of the target dies is transferred to the until one of the die placement areas; and wherein the position adjustment step and the transfer step are repeated until the target dies are sequentially transferred to the die placement areas.

In some embodiments, in the fixing step, an image capture device captures an image of at least one target die, at least one pusher and at least one die placement area to obtain a first image information, and The first image information is sent to a control device, and the control device judges a distance and an orientation between the axis of at least one target die and the axis of at least one die placement area according to the first image information, so as to obtain an adjustment message; And wherein, in the position adjustment step, the control device controls the adsorption device to move the main target block by negative pressure according to the adjustment information until the axis of at least one target die is aligned with the axis of at least one die placement area, and the control device controls The adsorption device stops moving, and further starts to execute the transfer step, so that the control device further controls at least one pushing member to move toward the direction of the film.

Preferably, in the position adjustment step, during the movement of the plurality of dies in the main target block along the second surface of the carrier film, the image capture device captures at least one target die, at least one pusher and an image of at least one die placement area to obtain a second image information, and transmit the second image information to the control device, and the control device judges whether the axis of at least one target die is consistent with at least one The axes of the die placement area are aligned; wherein, when the control device determines that the axis of at least one target die is aligned with the axis of at least one die placement area according to the second image information, the control device controls the adsorption device to stop moving, and further starts Executing the transfer step, so that the control device further controls at least one push member to move toward the direction of the carrier film; and wherein, when the control device determines that the axis of at least one target die has not been aligned with the at least one die placement area according to the second image information When the axes are aligned, the control device judges a distance and an orientation between the axis of at least one target die and the axis of at least one die placement area according to the second image information to obtain a correction message, and the control device controls the The adsorption device moves the main target block by negative pressure until the axis of at least one target grain is aligned with the axis of at least one die placement area, the control device controls the adsorption device to stop moving, and further starts to perform the transfer step, so that the control device Further controlling at least one push member to move towards the direction of carrying the film.

In some embodiments, in the preparation step, an axis of at least one ejector is aligned with an axis of at least one die placement area; and wherein, in the position adjustment step, the suction device moves the main target area by negative pressure , until the axis of at least one target die is aligned with the axis of at least one pusher and the axis of at least one die placement area at the same time, the adsorption device stops moving.

In some embodiments, after the transfer step, a step of converting the target is further included, the adsorption device stops absorbing the surroundings of the main target block by negative pressure, at least another one of the plurality of crystal grains in the main target block is defined as at least another the target die, moving the entire carrier film and the substrate until an axis of at least another target die is aligned with an axis of at least another die placement area; wherein the transferring step is performed after the step of converting the target; And wherein, the step of converting the target and the step of transferring are repeated until all the dies in the main target block are transferred to the substrate.

The effect of the present invention is that the high-speed positioning method of the present invention can fix the main target area around the main target area through the negative pressure, and then move the main target area through the negative pressure, so that the axis of the target grain can be accurately aligned with the crystal grain. The axis of the particle placement area does not need to move the entire carrier film, which greatly reduces the mass that the carrier film needs to move when the position is compensated, and the moving speed is fast.

The implementation of the present invention will be described in more detail below with reference to the drawings and reference symbols, so that those skilled in the art can implement it after studying this specification.

Please refer to Fig. 1 to Fig. 10, the present invention provides a kind of grain high-speed positioning method, comprises the following steps:

Preparation step S1, as shown in FIG. 1 and FIG. 2A to FIG. 2E, a first surface 11 of a carrier film 10 faces a suction device 20 and a push member 30, and a second surface 12 of the carrier film 10 faces a substrate 40 and has a plurality of crystal grains 50, the carrier film 10 is divided into a plurality of blocks according to the number of these crystal grains 50, wherein one block is defined as a main target block 13, and the remaining blocks are defined as a plurality of other target blocks 14 , the plurality of dies 50 in the main target block 13 are arranged in order, and one of the plurality of dies 50 in the main target block 13 is defined as a target die 51 . The substrate 40 has a die placement area 41 . The adsorption device 20 is aimed at the periphery of the main target block 13 . An axis 31 of the ejector 30 is aligned with an axis 411 of the die placement area 41 , and an axis 511 of the target die 51 is deviated from the axis 31 of the ejector 30 and the axis 411 of the die placement area 41 .

More specifically, the two ends of the carrier film 10 are respectively located on a carrier frame 90, two clamps (not shown) clamp the carrier frame 90, and a control device 80 controls the carrier frame 90 to move the entire carrier film 10 until the adsorption device 20 until the periphery of the main target block 13 is aligned.

Preferably, as shown in Fig. 2C, Fig. 3 and Fig. 4, the adsorption device 20 is annular to form a shaft hole 21 and a plurality of air holes 22 are opened, and these air holes 22 are connected to a vacuum device 60, and the pusher 30 is movable Located in the shaft hole 21. As shown in FIG. 2E and FIG. 4 , an image capture device 70 is located on a side of the substrate 40 opposite to the carrier film 10 .

Fixing step S2, as shown in Figures 1 and 5, a control device 80 controls the adsorption device 20 to move to the periphery of the main target block 13, and the vacuum device 60 pumps air to the air holes 22 to generate a vacuum and provide a negative pressure 601 , the adsorption device 20 adsorbs around the main target block 13 through the negative pressure 601 , and the control device 80 controls the pusher 30 to move to the main target block 13 . As shown in FIGS. 5 to 7 , the image capture device 70 captures an image of the target die 51, the pusher 30 and the die placement area 41 to obtain a first image information 71, and the first image information 71 is transmitted to the control device 80, and the control device 80 judges a distance and a distance between the axis 511 of the target die 51 and the axis 31 of the pusher 30 and the axis 411 of the die placement area 41 according to the first image information 71. orientation to obtain an adjustment message 81 .

Position adjustment step S3, as shown in FIG. 1 , FIG. 8A and FIG. 8B , the control device 80 controls the adsorption device 20 to move the main target block 13 by the negative pressure 601 according to the adjustment message 81 until the axis 511 of the target grain 51 coincides with the axis 511 at the same time. The control device 80 controls the suction device 20 to stop moving until the axis 31 of the pushing member 30 and the axis 411 of the die placement area 41 are aligned. Further, as shown in FIG. 9, during the movement of the plurality of dies 50 in the main target block 13 along the second surface 12 of the carrier film 10, the image capture device 70 captures the target dies 51, top An image of the push piece 30 and the die placement area 41 to obtain a second image information 72, and transmit the second image information 72 to the control device 80, and the control device 80 judges the target die 51 according to the second image information 72 Whether the axis 511 of the pusher 30 is aligned with the axis 31 of the pusher 30 and the axis 411 of the die placement area 41 at the same time. When the control device 80 determines that the axis 511 of the target die 51 is aligned with the axis 31 of the ejector 30 and the axis 411 of the die placement area 41 according to the second image information 72 , the control device 80 controls the adsorption device 20 to stop moving. When the control device 80 judges according to the second image information 72 that the axis 511 of the target die 51 has not been aligned with the axis 31 of the ejector 30 and the axis 411 of the die placement area 41 at the same time, the control device 80 according to the second image information 72 A distance and an orientation between the axis 511 of the target die 51 and the axis 31 of the pusher 30 and the axis 411 of the die placement area 41 are determined simultaneously to obtain a correction message 82 . The control device 80 controls the negative pressure 601 of the adsorption device 20 to move the main target block 13 according to the correction message 82 until the axis 511 of the target die 51 is aligned with the axis 31 of the ejector 30 and the axis 411 of the die placement area 41 at the same time.

Transfer step S4, as shown in FIG. 1 and FIG. 10 , the control device 80 controls the pusher 30 to move toward the direction of the carrier film 10, and the pusher 30 pushes the target die 51 to move toward the direction close to the substrate 40 through the carrier film 10, until the target die 51 is transferred to the die placement area 41 .

Further, as shown in FIGS. 2A to 2E, before the method of the present invention is carried out, in the preparatory step S1, the adsorption device 20 and the push member 30 do not contact the first surface 11 of the carrier film 10, so as As shown in FIG. 5 , in the fixing step S2 , the control device 80 needs to firstly control the adsorption device 20 and the pushing member 30 to move to the first surface 11 of the carrier film 10 along a vertical direction.

The preparation step S1, the fixing step S2, the position adjustment step S3 and the transfer step S4 are repeated until all the dies 50 on the first main target block 13 are transferred to the plurality of die placement areas 41. After all the dies 50 on the first main target block 13 are transferred to these die placement areas 41, one of the other target blocks 14 is selected as the next main target block 13, and at this time, return to Up to the preparation step S1 , the adsorption device 20 and the pushing member 30 are kept against the first surface 11 of the carrier film 10 . In the fixing step S2, there are two ways for the adsorption device 20 and the pusher 30 to move to the next main target block 13: first, the carrier film 10 remains still, and the control device 80 controls the adsorption device 20 and the pusher 30 Move directly to the next main target block 13 along the first surface 11 of the carrier film 10; secondly, the adsorption device 20 and the pusher 30 remain motionless, and the control device 80 controls the carrier film 10 to move, so that the adsorption device 20 and the ejector The pusher 30 moves indirectly to the next main target block 13 . The subsequent position adjustment step S3 and transfer step S4 are as described above.

After all the dies 50 are transferred to the substrate 40 , the control device 80 controls the adsorption device 20 and the pusher 30 to move away from the carrier film 10 .

Please refer to FIG. 11 . FIG. 11 is a schematic diagram of the position change of the image capture device 70 according to the first embodiment of the present invention. The position of the image capture device 70 can also be changed to be located on a side of the adsorption device 20 and the pushing member 30 relative to the carrier film 10 .

It is worth mentioning that in the preparation step S1 of the first embodiment, even if the arrangement of the plurality of dies 50 in the main target block 13 is uneven (not shown), the fixing step of the first embodiment can also S2 , the position adjustment step S3 and the transfer step S4 accomplish the purpose of transferring the target die 51 to the die placement area 41 .

In addition, in the preparation step S1 of other embodiments, the axis 31 of the pushing member 30 may also be offset from the axis 411 of the die placement area 41 . Therefore, in the position adjustment step S3 , the adsorption device 20 moves the main target block 13 by negative pressure until the axis 511 of the target die 51 is aligned with the axis 411 of the die placement area 41 , and then the adsorption device 20 stops moving.

Please refer to Fig. 12 to Fig. 16, the difference between the second embodiment and the first embodiment is that: as shown in Fig. The plurality of dies 50 in the block 13 are arranged neatly, the plurality of dies 50 in the main target block 13 are defined as a plurality of target dies 51, the substrate 40 has a plurality of die placement areas 41, and the pushers 30 of the The axes 31 are respectively aligned with the axes 411 of the die placement areas 41, and the axes 511 of the target dies 51 are respectively aligned with the axes 31 of the pushing members 30 and the die placement areas respectively. The equiaxes 411 of 41 are staggered. As shown in FIGS. 13 and 14 , in the fixing step S2 , the control device 80 controls the pushers 30 to move to the main target block 13 . As shown in FIG. 6 and FIG. 15 , in the position adjustment step S3, the control device 80 controls the adsorption device 20 to move the main target block 13 through the negative pressure 601 according to the adjustment message 81 until the axes of the target crystal grains 51 511 are respectively aligned with the axes 31 of the pushing members 30 and the axes 411 of the die placing regions 41 at the same time. As shown in FIGS. 16A to 16E , in the transferring step S4, the pushers 30 push the target dies 51 through the carrier film 10 to move toward the substrate 40 in sequence until the target dies 51 The sequence is transferred to the die placement areas 41. In other words, the control device 80 can also control one push member 30 to push one target die 51 through the carrier film 10 at a time.

It is worth mentioning that, in another operation mode of the transfer step S4 of the second embodiment, the control device 80 controls the pushing members 30 to push the target dies 51 through the carrier film 10 to the direction close to the substrate 40 moving until the target dies 51 are transferred to the die placement areas 41 together. In other words, the control device 80 can control all the pushers 30 to push all the target dies 51 synchronously through the carrier film 10 at one time.

Please refer to FIG. 1 and FIG. 17 , after the transfer step S4, it further includes the conversion target step S5, the control device 80 controls the vacuum device 60 to stop pumping, so that the adsorption device 20 stops adsorbing the surroundings of the main target block 13 by the negative pressure 601, Several other dies in the main target block 13 are defined as a plurality of target dies 51, and the control device 80 controls the carrier frame 90 to move the entire carrier film 10 and the substrate 40 to move until the axes of the target dies 51 511 are aligned with the iso-axes 31 of the pushing members 30 and the iso-axes 411 of the other several die placement areas 41 respectively. After the conversion target step S5 is completed, the transfer step S4 follows. The conversion target step S5 and the transfer step S4 are repeated until all the dies 50 in the main target block 13 are transferred to the substrate 40 .

Please refer to FIG. 18 and FIG. 19 , the difference between the third embodiment and the second embodiment is: as shown in FIG. 18 , in the preparation step S1 , the plurality of dies 50 in the main target block 13 are arranged unevenly. As shown in FIG. 19 , in the position adjustment step S3, the control device 80 controls the adsorption device 20 to move the main target block 13 by negative pressure 601 according to the adjustment information 81 until the axis 511 of one of the target grains 51 At the same time, it is aligned with the axis 31 of one of the pushing members 30 and the axis 411 of one of the die placement regions 41 . As shown in FIG. 20, in the transfer step S4, one of the pushing members 30 pushes one of the target dies 51 to move toward the substrate 40 through the carrier film 10 until the target dies One of the grains 51 is transferred to one of the die placement areas 41 . As shown in FIG. 1 , the position adjustment step S3 and the transfer step S4 are repeated until the target dies 51 are transferred to the die placement regions 41 in sequence.

To sum up, the high-speed die positioning method of the present invention can fix the main target block 13 in a small range through the negative pressure 601, and then move the main target block 13 through the negative pressure 601, so that the axis 511 of the target die 51 The axis 411 of the die placement area 41 can be precisely aligned without moving the entire carrier film 10 , and the moving mass of the carrier film 10 is greatly reduced when the position is compensated, and the moving speed is fast.

Furthermore, regardless of whether the plurality of dies 50 in the main target block 13 are arranged neatly or unevenly, the high-speed die positioning method of the present invention can make the axis 511 of the target die 51 accurately align with the axis of the die placement area 41 411.

In addition, the high-speed die positioning method of the present invention can be applied to a single pusher 30, and can also be applied to multiple pushers 30, and it is provided in conjunction with the alignment or unevenness of the plurality of dies 50 in the main target block 13. different modes of operation.

In addition, the high-speed die positioning method of the present invention can accurately determine the relative position of the target die 51 and the die placement area 41 through the image capture device 70 and the control device 80, which helps the control device 80 to accurately control the adsorption The device 20 moves the target die 51 to the correct position, so that the axis 511 of the target die 51 can be aligned with the axis 411 of the die placement area 41, ensuring that the pusher 30 can accurately transfer the target die 51 to the die placement District 41.

In addition, during the process of moving the plurality of dies 50 in the main target block 13 along the second surface 12 of the carrier film 10, the high-speed die positioning method of the present invention can continuously use the image capture device 70 and the control device 80 to The relative position of the target die 51 and the die placement area 41 is accurately corrected, so that the final position of the target die 51 and the correct position have zero error.

Also, if the axis 31 of the pushing member 30 can be aligned with the axis 411 of the die placement area 41 , the pushing member 30 can transfer the target die 51 to the die placement area 41 at the most precise angle.

The above-mentioned ones are only preferred embodiments for explaining the present invention, and are not intended to limit the present invention in any form. Therefore, any modification or change of the present invention made under the same spirit of the invention , all should still be included in the category that the present invention intends to protect.

10: Carrier film 11: First surface 12: Second surface 13: Main target block 14: Other target blocks 20: Adsorption device 21: shaft hole 22: stomata 30: Pusher 31: axis 40: Substrate 41: Die placement area 411: axis 50: grain 51: target grain 511: axis 60: Vacuum device 601: negative pressure 70: Image capture device 71: First image information 72: Second image information 80: Control device 81:Adjust message 82: Calibration message 90: Bearing frame S1: Preparatory steps S2: Fixed step S3: Position adjustment step S4: transfer step S5: Conversion Goal Step

[FIG. 1] is a flow chart of the high-speed crystal grain positioning method of the present invention. [ FIG. 2A ] to [ FIG. 2E ] are schematic views of the preparatory steps of the first embodiment of the present invention. [ Fig. 3 ] is a bottom view of the suction device and the pusher according to the first embodiment of the present invention. [FIG. 4] is a structural schematic diagram of the adsorption device, pusher, image capture device, and control device of the first embodiment of the present invention. [ Fig. 5 ] is a schematic diagram of a fixing step in the first embodiment of the present invention. [ FIG. 6 ] is a schematic diagram of transmission of the first image information and adjustment information in the first embodiment of the present invention. [FIG. 7] is a bottom view of the carrier film of the first embodiment of the present invention, wherein the plurality of grains in the target block are arranged neatly, and an axis of a target grain is simultaneously aligned with an axis of a pusher and a grain. One axis of the particle placement area is staggered. [ FIG. 8A ] is a perspective view of the main target block for moving the adsorption device according to the first embodiment of the present invention. [FIG. 8B] is a bottom view of the carrier film according to the first embodiment of the present invention, wherein the plurality of crystal grains in the target block are arranged neatly, and an axis of a target crystal grain is simultaneously aligned with an axis of a pusher and a crystal grain. Align with one axis of the particle placement area. [ FIG. 9 ] is a schematic diagram of the transmission of the second image information and correction information in the first embodiment of the present invention. [ Fig. 10 ] is a schematic diagram of a transfer step in the first embodiment of the present invention. [ FIG. 11 ] is a schematic diagram of the position change of the image capturing device according to the first embodiment of the present invention. [ Fig. 12 ] is a schematic diagram of the preparatory steps of the second embodiment of the present invention. [ Fig. 13 ] is a schematic diagram of a fixing step of the second embodiment of the present invention. [Fig. 14] is a bottom view of the carrier film according to the second embodiment of the present invention, wherein the plurality of crystal grains in the target block are arranged neatly, and the multiple axes of the multiple target crystal grains are respectively simultaneously with the multiple axes and the multiple axes of the multiple pushers. The plural axes of the die placement areas are staggered. [FIG. 15] is a bottom view of the carrier film according to the second embodiment of the present invention, wherein the plurality of crystal grains in the target block are arranged neatly, and the multiple axes of the multiple target crystal grains are simultaneously aligned with the multiple axes of the multiple pushers and the multiple crystal grains. The plural axes of the particle placement area are aligned. [ FIG. 16A ] to [ FIG. 16E ] are schematic diagrams of transfer steps of the second embodiment of the present invention. [ Fig. 17 ] is a schematic diagram of the conversion target step of the second embodiment of the present invention. [Fig. 18] is a bottom view of the carrier film according to the third embodiment of the present invention, wherein the arrangement of the plurality of crystal grains in the target block is uneven, and the plurality of axes of the plurality of target crystal grains are simultaneously with the plurality of axes of the plurality of pushers. And the multiple axes of the multiple grain placement areas are staggered. [FIG. 19] is a bottom view of the carrier film according to the second embodiment of the present invention, wherein the plurality of crystal grains in the target block are arranged unevenly, and the axis of one of the target crystal grains and the axis of one of the pushing members and among them The axes of one die placement area are aligned, and the plural axes of the remaining target dies are respectively and simultaneously staggered from the plural axes of the rest of the pushers and the plural axes of the rest of the die placement areas. [ Fig. 20 ] is a schematic diagram of a transfer step in the third embodiment of the present invention.

S1: Preparatory steps

S2: Fixed step

S3: Position adjustment step

S4: transfer step

S5: Conversion target directory step

Claims (10)

A method for high-speed positioning of crystal grains, comprising the following steps: In the preparatory step, a first surface of a carrier film faces a suction device and at least one push member, a second surface of the carrier film faces a substrate and has a plurality of crystal grains, and the carrier film is divided according to the number of the crystal grains Separated into a plurality of blocks, one of which is defined as a main target block, and the remaining blocks are defined as a plurality of other target blocks, at least one of the plurality of dies in the main target block is defined as at least one target die , the substrate has at least one die placement area, the adsorption device is aligned around the main target block, and an axis of the at least one target die is offset from an axis of the at least one die placement area; In the fixing step, the adsorption device moves to the periphery of the main target block and absorbs the periphery of the main target block by a negative pressure, and the at least one pushing member moves to the main target block; a position adjustment step, the adsorption device moves the main target block by the negative pressure until the axis of the at least one target die is aligned with the axis of the at least one die placement area, and the adsorption device stops moving; and In the transfer step, the at least one pushing member pushes the at least one target die towards the substrate through the carrier film until the at least one target die is transferred to the at least one die placement area. The high-speed die positioning method as claimed in claim 1, wherein, in the preparation step, the first surface of the carrier film faces a pusher, and one of the plurality of dies in the main target block is defined For a target die, the substrate has a die placement area, the axis of the target die is offset from the axis of the die placement area; wherein, in the fixing step, the pusher moves to the main target block; wherein, in the position adjustment step, the adsorption device moves the main target block by the negative pressure until the axis of the target die is aligned with the axis of the die placement area; and wherein, In the transfer step, the pushing member pushes the target die to move towards the substrate through the carrying film until the target die is transferred to the die placement area. The high-speed die positioning method as claimed in claim 2, wherein, in the preparation step, the plurality of dies in the main target block are arranged neatly or unevenly. The high-speed die positioning method as claimed in item 1, wherein, in the preparation step, the first surface of the carrier film faces a plurality of pushers, the plurality of dies in the main target block are arranged neatly, and the main The plurality of dies in the target block is defined as a plurality of target dies, the substrate has a plurality of die placement areas, and the axes of the target dies are respectively staggered from the axes of the die placement areas; wherein, in In the fixing step, the pushers move to the main target block; and wherein, in the position adjustment step, the adsorption device moves the main target block by the negative pressure until the target dies The iso-axes are respectively aligned with the iso-axes of the die placement regions. The high-speed die positioning method as described in Claim 4, wherein, in the transferring step, the pushing members push the target dies to move towards the substrate through the carrier film sequentially or together until The target dies are transferred to the die placement areas sequentially or together. The high-speed die positioning method as claimed in item 1, wherein, in the preparation step, the first surface of the carrier film faces a plurality of pushers, and the plurality of dies in the main target area are arranged unevenly, The plurality of dies in the main target block is defined as a plurality of target dies, the substrate has a plurality of die placement areas, and the axes of the target dies are respectively staggered from the axes of the die placement areas; wherein , in the fixing step, the pushers move to the main target block; wherein, in the position adjustment step, the adsorption device moves the main target block by the negative pressure until the target dies until the axis of one of the dies is aligned with the axis of one of the die placement regions; wherein, in the transfer step, one of the pushers pushes the target dies through the carrier film one of the dies moves toward the substrate until one of the target dies is transferred to one of the die placement regions; and wherein the position adjusting step and the transferring step are repeated until the target dies are sequentially transferred to the die placement areas. The high-speed die positioning method as described in claim 1, wherein, in the fixing step, an image capture device captures images of the at least one target die, the at least one pusher and the at least one die placement area an image to obtain a first image information, and transmit the first image information to a control device, and the control device judges the axis of the at least one target die and the at least one die according to the first image information an interval and an orientation between the axes of the placement areas to obtain an adjustment message; and wherein, in the position adjustment step, the control device controls the adsorption device to move the main target area by the negative pressure according to the adjustment information block, until the axis of the at least one target grain is aligned with the axis of the at least one grain placement area, the control device controls the adsorption device to stop moving, and further starts to perform the transferring step, so that the control device further controls The at least one pushing member moves towards the direction of the carrying film. The high-speed die positioning method as claimed in claim 7, wherein, in the position adjustment step, during the movement of the plurality of die in the main target block along the second surface of the carrier film, the image The capture device captures an image of the at least one target die, the at least one pusher and the at least one die placement area to obtain a second image information, and transmits the second image information to the control device , the control device determines whether the axis of the at least one target die is aligned with the axis of the at least one die placement area according to the second image information; wherein, when the control device determines the When the axis of at least one target die is aligned with the axis of the at least one die placement area, the control device controls the adsorption device to stop moving, and further starts to perform the transfer step, so that the control device further controls the at least one top The pusher moves towards the direction of the carrier film; and wherein, when the control device judges according to the second image information that the axis of the at least one target die is not aligned with the axis of the at least one die placement area, the The control device judges a distance and an orientation between the axis of the at least one target die and the axis of the at least one die placement area according to the second image information, so as to obtain a correction message. The message controls the adsorption device to move the main target block by the negative pressure until the axis of the at least one target die is aligned with the axis of the at least one die placement area, and the control device controls the adsorption device to stop moving , and further start to execute the transferring step, so that the control device further controls the at least one pushing member to move towards the direction of the carrier film. The high-speed die positioning method as claimed in claim 1, wherein, in the preparation step, an axis of the at least one pushing member is aligned with the axis of the at least one die placement area; and wherein, in the position adjustment In the step, the adsorption device moves the main target block by the negative pressure until the axis of the at least one target die is simultaneously aligned with the axis of the at least one pusher and the axis of the at least one die placement area Alignment, the adsorption device stops moving. The high-speed crystal grain positioning method as described in Claim 1, wherein, after the transfer step, it further includes a target conversion step, the adsorption device stops absorbing the surroundings of the main target block by the negative pressure, and the main target block At least another one of the plurality of crystal grains is defined as at least another target grain, and the entire carrier film and the substrate are moved until an axis of the at least another target grain is aligned with an axis of at least another die placement area wherein the transfer step is performed after the conversion target step is completed; and wherein the conversion target step and the transfer step are repeated until all the dies in the main target block are transferred to the substrate.

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