JP2020009977A - Imaging apparatus, imaging method, positioning device, and die bonder - Google Patents

Abstract

To provide a positioning device and a positioning method, excellent in work efficiency, capable of stable high-precision positioning, and capable of being reduced in cost.SOLUTION: The imaging apparatus for imaging a plurality of imaging parts of a workpiece includes: a camera capable of imaging an area of at least one imaging part in the workpiece; and moving means capable of relative movement between the camera and the workpiece. During a relative movement between the camera and the workpiece by the moving means, line imaging is performed on an imaging part.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an imaging device, an imaging method, a positioning device, and a die bonder.

  In the manufacture of semiconductor devices, a chip bonding method in which a wafer in which a large number of elements are manufactured together is diced and separated into individual semiconductor chips, which are bonded one by one to predetermined positions such as a lead frame. Has been adopted. A die bonder (bonding device) (for example, Patent Document 1) is used for this chip bonding.

  As shown in FIG. 11, the die bonder picks up a chip 2 cut out from a wafer 1 (see FIG. 12) at a pickup position P and transfers (mounts) it to a bonding position Q of a substrate 3 such as a lead frame. It is. The wafer 1 is divided (divided) into a number of chips 2 by a dicing process. Therefore, the chips 2 are arranged in a matrix as shown in FIG.

  This die bonder includes a collet (adsorption collet) 4 as shown in FIG. The collet 4 is raised by a moving mechanism (not shown) in the direction of arrow A and lowered in the direction of arrow B on the pickup position P, and raised in the direction of arrow C and lowered in the direction of arrow D on the bonding position Q. Reciprocation in the directions of arrows E and F between the pickup position P and the bonding position Q is enabled. The movement mechanism controls the movement of the arrows A, B, C, D, E, and F by control means including, for example, a microcomputer. Note that the moving mechanism can be constituted by various mechanisms such as a cylinder mechanism, a ball screw mechanism, and a linear motor mechanism.

  The suction collet 4 includes a head 6 having a suction hole 5 opened on the lower surface thereof. The chip 2 is vacuum-sucked through the suction hole 5, and the chip 2 is suctioned to a lower end surface (a front end surface) of the head 6. When the vacuum suction (vacuum evacuation) is released, the chip 2 comes off the head 6.

  The wafer 1 divided (divided) into a large number of chips 2 is placed on, for example, an XYθ table 8 (see FIG. 12), and the XYθ table 8 is provided with a push-up unit having push-up pins. That is, the push-up means pushes up the chip 2 to be picked up from below, and makes it easy to peel off from the adhesive sheet. In this state, the chip 2 is sucked by the sucking collet 4 that has been lowered.

  That is, after the collet 4 is positioned above the chip to be picked up, the collet 4 is lowered as shown by the arrow B to pick up the chip 2. Thereafter, the collet 4 is raised as shown by the arrow A.

  Next, the collet 4 is moved in the direction of arrow E to be positioned above the island portion, and then the collet 4 is moved downward as indicated by arrow D to supply the chip 2 to the island portion. After the chip 2 is supplied to the island portion, the collet is raised as shown by the arrow C, and then returned to the standby position above the pip-up position as shown by the arrow F.

  That is, the chip is picked up by the collet 4 at the pickup position by sequentially moving the collet 4 as indicated by arrows A, E, D, C, F, and B, and the chip 2 is mounted on the chip 2 at the bonding position. Will do.

  As described above, it is necessary to confirm the position of the chip 2 to be picked up (position detection) at the pickup position, and to confirm the position of the island portion of the lead frame to be bonded (position detection) also at the bonding position. For this reason, generally, the chip 2 to be picked up is observed by a confirmation camera arranged above the pickup position, and the collet 4 is positioned above the chip 2 to be picked up. The island portion of the lead frame is observed with the confirmation camera arranged at the upper position, and the collet 4 is positioned above the island.

  For this reason, in this die bonder, a positioning device including a confirmation camera or the like is arranged at the pickup position and the bonding position. FIG. 10 shows a conventional positioning method at a bonding position. In this case, the position of the island portion 10 formed on the substrate (lead frame) 3 transferred to the bonding position is confirmed. In FIG. 10, arrow Y indicates the direction in which the substrate 3 is transported, and arrow X indicates the direction in which the confirmation camera 11 moves.

  As the confirmation camera 11, an area sensor camera is used. Here, the area sensor camera is a camera in which image sensors are arranged in the vertical and horizontal directions and can capture an image two-dimensionally as shown in FIG. In FIG. 10, H indicates the field of view of the camera 11. Cameras include a line sensor camera in addition to the area sensor camera. Since a line sensor camera has imaging devices arranged in a line, it can only capture a one-dimensional image without sub-scanning.

  As described above, when the area sensor camera is used as the confirmation camera 11, if the field of view H of the camera 11 is equal to the size of the positioning target (in this case, the island portion 10 of the substrate), the field of view H of the camera 11 is The movement and the stop are sequentially repeated so that the positioning target (island portion 10) enters. As described above, the position of the island portion 10 can be confirmed by the confirmation camera 11, and when the chip 2 is bonded, it can be accurately bonded to each island portion 10.

JP 2008-124382 A

  However, if the camera 11 repeatedly moves and stops, the camera 11 vibrates at the time of stopping, and an image with poor accuracy is obtained. This results in poor positioning accuracy. In addition, since the vibration stops after a while, if the image is obtained after waiting for the stop, accurate positioning can be performed. However, if a step of waiting until the vibration stops is provided, the throughput (processing capacity per unit time) deteriorates due to the delay of the vibration stop.

  By the way, it is also possible to use a line sensor camera as the camera 11 instead of such an area sensor camera, and obtain a positioning image of each island portion by relatively moving the camera and the object.

  However, when such a line sensor camera is used, it is necessary to move the camera even when imaging the entire island portion which is the first object. For this reason, a processing time for obtaining an image for initial adjustment (image for illumination adjustment or the like) is required, resulting in deterioration of work efficiency. Moreover, line sensor cameras are more expensive than area sensor cameras.

  The present invention has been made in view of the above problems, and provides an imaging apparatus, an imaging method, a positioning apparatus, and a die bonder that are excellent in work efficiency, capable of performing stable high-precision imaging, and capable of reducing costs.

  An imaging apparatus according to the present invention is an imaging apparatus for imaging a plurality of imaging parts of a work, and a camera capable of imaging an area of at least one imaging part of the work, and a relative movement between the camera and the work. The camera performs line imaging on an imaging part during relative movement between the camera and the workpiece by the moving unit.

  ADVANTAGE OF THE INVENTION According to the imaging device of this invention, one imaging | photography site | part of a workpiece | work can be area-photographed, after that, the line imaging of each imaging | photography site | part can be performed using the camera, and the image observation of all the imaging | photography sites | parts It can be performed. In line imaging, there is no need to stop the camera, and no vibration is caused by stopping the camera.

  The moving means may be constituted by only the first moving mechanism as the work conveying means for moving the work side, only the second moving mechanism for moving the camera, or the first moving mechanism and the second moving mechanism. In this case, the first moving mechanism can move the work in the X direction and the Y direction orthogonal to the X direction, and the second moving mechanism also moves the camera in the X direction and the Y direction orthogonal to the X direction. What can be made is preferable. The moving means may include electronic scanning performed inside the camera.

  It is preferable that the possible range of the line imaging by the camera is set to be equal to or longer than the entire length of one imaging region in the line imaging direction. By setting in this way, it is possible to stably shoot the entire range of the imaging region by line imaging.

  The relative movement between the camera and the work includes a return operation unit. In this return operation unit, line imaging can be performed by switching the line imaging direction. For this reason, the imaging of the folding operation unit can be performed by line imaging. Thus, the trajectory of the relative movement between the camera and the work can be a rectangular spiral shape or a right-angle zigzag shape. For this reason, it is possible to take an image (photograph) along various trajectories according to the size of the work, the arrangement pitch of the imaging parts provided on the work, the number of arrangements, and the like.

  Further, the return operation unit may perform area imaging without switching the line imaging direction. In this case, since it is not necessary to switch the line imaging direction in the turnback unit, the operation can be simplified.

  Before the image processing operation, the image processing apparatus further includes a recipe adjustment unit that performs a recipe adjustment on the image captured by the area imaging or the line imaging. An image processing operation may be performed using an image captured in an area. Here, the recipe adjustment is to adjust imaging parameters (exposure time, camera gain, illumination light emission condition, lens focus / aperture) and image processing parameters (positioning, inspection threshold, and the like). This is an adjustment for performing image processing.

  As described above, in the pre-process of performing the positioning and inspection processing, the recipe is adjusted for the image captured in the area, the line is captured using the recipe, and the positioning and inspection processing is performed on the image. Recipe adjustment is performed on the captured image, an area is captured using this recipe, positioning and inspection processing can be performed on the image, and workability can be improved. For example, for positioning and inspection processing, a recipe adjustment is performed on an image captured in an area, and when line imaging is performed using this recipe, imaging parameters and image processing parameters can be adjusted while performing live display, As a result, feedback of parameter change can be obtained, and line imaging can be performed under optimal conditions. It should be noted that, even when recipe adjustment is performed on an image obtained by line imaging and area imaging is performed using this recipe, live display can be performed discontinuously by continuously scanning.

  In addition, the recipe temporarily adjusted using the image captured in the area is applied to the line imaging, the temporarily adjusted recipe is registered, and / or the user evaluates the result applied to the line imaging, and based on the evaluation, To register a partially modified recipe. Here, the tentative adjustment is to perform a recipe adjustment using an imaging method (in this case, line imaging) different from the imaging method at the time of actual imaging during positioning or inspection processing. With such a configuration, the user can (forcedly) check the image and obtain a stable high-precision image.

  The image processing apparatus may include a recipe adjustment unit that performs recipe adjustment on an image captured by area imaging or line imaging. The recipe adjustment unit may include a switching unit that switches between area imaging and line imaging. The area image obtained by the area imaging and the line image obtained by the line imaging do not become completely the same image due to a difference in illumination light distribution, an aberration of a lens, and the like. Further, these effects vary depending on the workpiece. When the recipe adjustment is performed, the adjustment is performed using the area imaged image in consideration of convenience. However, since it is different from the actual line image (the line image obtained by the line imaging), it is necessary to make some adjustments and then switch to the line image for confirmation, and thus switch between the area imaging and the line imaging. This is made possible by providing the switching means for performing the above. Further, if the switching means is provided, there is an advantage that it is possible to confirm that the two images (the area image and the line image) do not greatly differ before performing the recipe adjustment.

  When an error occurs during line imaging, it is preferable to perform area imaging on the imaging site where the error has occurred. In this case, even if the camera is moved to a position away from the site where the error has occurred, the camera can be returned to the site where the error has occurred and the area can be imaged, thereby improving the convenience of the user when the error occurs. Can be done. In other words, there is an advantage that live display can be performed without scanning by a camera at a site where an error has occurred by using area imaging.

  The positioning device of the present invention is a positioning device that performs image observation of a plurality of inspected sites, which are imaging sites on a substrate that has been transported, and positions each of the inspected sites. The above-mentioned image pickup device is used.

  ADVANTAGE OF THE INVENTION According to the positioning device of this invention, the image for initial adjustments, such as for illumination adjustment, can be obtained after board | substrate conveyance and an imaging parameter change, and can shorten work time. Since no vibration is caused by stopping the camera, highly accurate positioning can be performed. In addition, since the camera does not vibrate, there is no need to stop imaging until the vibration stops, and positioning with high working efficiency can be performed. Further, since a line sensor camera is not used, the cost of the apparatus can be reduced.

  A die bonder of the present invention is a die bonder that picks up a chip at a pickup position, transports the picked up chip to a bonding position, and bonds the chip at the bonding position, wherein the positioning device is located at any arbitrary position. This makes it possible to perform positioning by using.

  ADVANTAGE OF THE INVENTION According to the die bonder of this invention, the image for initial adjustments, such as for illumination adjustment, can be obtained immediately after a workpiece | work conveyance. Thereafter, line imaging of each imaging region can be performed using this camera, and imaging, observation, and positioning of all imaging regions can be performed. In this line imaging, there is no need to stop or decelerate the camera, and no vibration is caused by the stop or deceleration of the camera. By synchronizing the timing of line imaging with the position signal of the moving axis, it is possible to capture an image with a correct aspect ratio (an image can be acquired). In addition, by controlling the moving speed to be approximately constant, images may be taken at regular intervals.

  One imaging method of the present invention is an imaging method for imaging a plurality of imaging parts of a work, and an area imaging step of imaging an area of at least one imaging part of the work, and after the area imaging step, area imaging is performed. A line imaging step of performing a line imaging for each imaging region by the area sensor camera.

  Another imaging method is an imaging method for imaging a plurality of imaging parts of a work. The camera and the work relatively move using a camera capable of area imaging. The folding operation section switches the line imaging direction of the camera.

  According to the present invention, since the camera is not caused to vibrate by stopping, it is possible to capture an image with high accuracy. In addition, since the camera does not vibrate, it is not necessary to stop imaging until the vibration stops, and an image with high working efficiency can be obtained. Further, since a line sensor camera is not used, the cost of the apparatus can be reduced.

It is a simplified perspective view of the imaging device of the present invention. FIG. 1 is a block diagram illustrating a configuration of an imaging device of the present invention. It is a block diagram showing a process showing a composition of an imaging method of the present invention. FIG. 4 is a simplified diagram showing one movement locus of a camera and a work. FIG. 9 is a simplified diagram illustrating another movement locus of a camera and a work. It is a flow chart figure of the 1st imaging method of the present invention. FIG. 9 is a simplified diagram illustrating another movement locus of a camera and a work. It is a flowchart figure of the 2nd imaging method of this invention. It is a simplified diagram of the die bonder of the present invention. It is a simplified perspective view of the conventional imaging device. It is a simplified diagram of a conventional die bonder. It is a simplified perspective view showing a chip.

  Hereinafter, embodiments of the present invention will be described with reference to FIGS. FIG. 9 shows a die bonder (bonding apparatus: semiconductor device manufacturing apparatus) according to the present invention. Such a bonding apparatus picks up a chip (semiconductor chip) 21 cut out from a wafer at a pickup position P with a collet (adsorption collet) 23 and transfers (mounts) it to a bonding position Q of a substrate 22 such as a lead frame. Things. The wafer is adhered onto a wafer sheet 24 stretched over a metal ring (wafer ring), and is divided (divided) into a number of chips 21 by a dicing process.

  The collet 23 of the die bonder is supported by a bonding arm (not shown), and the bonding arm is driven by a moving mechanism (moving means 25) (see FIG. 2) so that the collet 23 is positioned above the pickup position P. In the direction of arrow A and downward in the direction of arrow B, upward in the direction of arrow C and downward in the direction of arrow D on the bonding position Q, and in the directions of arrows E and F between the pickup position P and the bonding position Q. Reciprocation is possible. The moving mechanism (moving means) 25 is controlled by the control means 26 (see FIG. 2) to move the arrows A, B, C, D, E and F. Note that the moving mechanism 25 can be constituted by various mechanisms such as a cylinder mechanism, a ball screw mechanism, and a linear motor mechanism. The control unit 26 is, for example, a microcomputer in which a ROM (Read Only Memory), a RAM (Random Access Memory), and the like are connected to each other via a bus centering on a CPU (Central Processing Unit). The ROM stores programs and data to be executed by the CPU.

  The collet 23 is formed with a suction hole (not shown) that opens to a suction surface 23a, which is a lower surface, and a vacuum generator (not shown) is connected to the suction hole. For this reason, if the suction surface 23a of the collet 23 is brought into contact with the chip 21 and the vacuum generator is driven, the air in the suction hole is sucked and the chip 21 can be sucked to the suction surface 23a. The vacuum generator may be a vacuum generator using a vacuum pump or an ejector type vacuum generator composed of a nozzle and a basic part called a diffuser.

  Next, the operation of this die bonder will be described. First, after the collet 23 is positioned above the chip to be picked up, the collet 23 is lowered as shown by arrow B to pick up the chip 21. Thereafter, the collet 23 is raised as indicated by the arrow A.

  Next, the collet 23 is moved in the direction of arrow E to be positioned above the island portion of the substrate 22, and then the collet 23 is moved down as indicated by arrow D to supply the chip 21 to the island portion. . After the chip 21 is supplied to the island portion, the collet is raised as shown by the arrow C, and then returned to the standby position above the pip-up position as shown by the arrow F.

  That is, by moving the collet 4 sequentially as indicated by arrows A, E, D, C, F, and B, the chip is picked up by the collet 23 at the pickup position, and the chip 2 is mounted on the chip 21 at the bonding position. Will do. By the way, the substrate 22 is supplied to the bonding position. In this case, the substrate 22 is transported by a first moving mechanism 27 (see FIG. 2) which will be described later as transporting means. The transporting means (first moving mechanism) 27 can be configured by various mechanisms such as a cylinder mechanism, a ball screw mechanism, and a linear motor mechanism.

  As described above, it is necessary to confirm the position of the chip 21 to be picked up (position detection) at the pickup position, and to confirm the position of the island portion of the lead frame to be bonded (position detection) also at the bonding position. Therefore, generally, a chip 2 to be picked up is observed by a confirmation camera arranged above the pickup position, the collet 23 is positioned above the chip 21 to be picked up, and The island portion of the lead frame 22 is observed with the confirmation camera arranged at the upper position, and the collet 23 is positioned above the island portion.

  For this reason, in this die bonder, an imaging device including a confirmation camera or the like is arranged at the pickup position and the bonding position. The present invention includes an imaging device capable of confirming the position of the island portion 30 formed on the substrate (lead frame) as the work 22 transported to the bonding position.

  As shown in FIG. 2, the imaging apparatus according to the present invention includes the camera (area sensor camera) 28 that captures an area of an imaging part, which is the first part to be inspected, on the substrate that has been transported, A second moving mechanism 29 and the first moving mechanism 27; For this reason, the first moving mechanism 27 and the second moving mechanism 29 can constitute a moving means 31 for moving the camera 28 and the work 22 (substrate) in two orthogonal directions that are relatively perpendicular to each other. The moving means includes electronic scanning performed inside the camera. Further, the camera 28 performs line imaging for each imaging region (island portion 30) while the moving unit 31 relatively moves (conveys) the camera 28 and the work 22.

  Here, the area sensor camera is a camera in which image sensors are arranged in the vertical and horizontal directions, and can take a two-dimensional image as shown by the imaginary line in FIG. The range H of the virtual line in FIG. 1 indicates the field of view of the camera. On the other hand, there is a line sensor camera. In the line sensor camera, the imaging devices are arranged in a horizontal line, and can only take a primary image. However, the camera 28, which is an area sensor camera, can also acquire a line image. That is, since the imaging elements of the camera 28 are arranged in the vertical and horizontal directions, the use of an imaging element in an arbitrary row (one line) enables acquisition of line imaging. Therefore, the camera 28 can be switched between an area mode functioning as an area sensor camera and a line mode functioning as a line sensor camera. This switching can be controlled by the control means 26.

  In this case, the work 22 as a substrate is transported in the Y (Y1) direction shown in FIG. 1 by the first moving mechanism 27, and the camera 28 is moved by the second moving mechanism 29 in the transport direction Y (Y1). It moves along the orthogonal X (X1, X2) direction. The second moving mechanism 29 can be constituted by various mechanisms such as a cylinder mechanism, a ball screw mechanism, and a linear motor mechanism. The timing of line imaging can be set using position information such as an encoder value of a rotary encoder or a linear encoder or a position command value.

  By the way, as shown in FIG. 2, the imaging apparatus includes a recipe adjustment unit 32, an image display unit 33 that displays an image captured by the camera 28, and a registration unit 35. Here, the recipe adjustment is to adjust imaging parameters (exposure time, camera gain, illumination light emission condition, lens focus / aperture) and image processing parameters (positioning, inspection threshold, and the like). This is an adjustment for performing image processing. For this reason, the recipe adjusting means 32 performs such an adjustment. The recipe adjusting means 32 performs a recipe adjustment on the image captured in the area, performs line imaging using the recipe, and performs positioning and positioning on the image. Inspection processing may be performed, or a recipe adjustment may be performed on an image captured in a line, an area may be captured using the recipe, and positioning and inspection processing may be performed on the image.

  Further, the recipe adjustment unit 32 can be configured to include a switching unit 34 that switches between area imaging and line imaging. The area image obtained by the area imaging and the line image obtained by the line imaging do not become completely the same image due to a difference in illumination light distribution, an aberration of a lens, and the like. Further, these effects vary depending on the workpiece. When the recipe adjustment is performed, the adjustment is performed using the area imaged image in consideration of convenience. However, since it is different from the actual line image (the line image obtained by the line imaging), it is necessary to make some adjustments and then switch to the line image for confirmation, and thus switch between the area imaging and the line imaging. By providing the switching means 34 for performing the above, it becomes possible to cope with the situation. Further, if the switching means 34 is provided, it is possible to confirm that the two images (the area image and the line image) do not greatly differ before performing the recipe adjustment.

  In this case, the recipe adjustment by the recipe adjustment unit 32 and the switching between the area imaging and the line imaging are performed by a command from the control unit 26.

  The image display unit 33 has a monitor that displays an area image or a line image captured by the area sensor camera 28, and the registration unit 35 registers (stores) the recipe or the like adjusted by the recipe adjustment unit 32. Things. The registration means 35 can be constituted by a storage device, such as an HDD (Hard Disc Drive), a DVD (Digital Versatile Disk) drive, a CD-R (Compact Disc-Recordable) drive, and an EEPROM (Electronically Erasable and Programmable Read Only Memory). Consists of

  Next, an imaging method using the imaging device configured as described above will be described. In this case, as shown in FIG. 4, the relative movement between the camera 28 and the work 22 may be a case where a right-angle zigzag trajectory K1 is drawn or a case where a rectangular spiral trajectory K2 is drawn as shown in FIG. I will draw.

  A case where the right-angle zigzag locus K1 in FIG. 4 is drawn will be described with reference to FIGS. As shown in FIG. 1, the substrate (work) 22 is transported along the direction of the arrow Y (Y1) and stops at a predetermined position. In this state, the camera 28 is arranged at a position where the area of the island 30 of the substrate 22 can be imaged. The island 30 in FIG. 1 is located at the downstream end in the transport direction and at the upstream end in the camera movement direction.

  First, as shown in FIG. 3, an area imaging step S1 is performed. That is, the camera 28 is set to the area mode, and an image of the island portion 30 is taken to obtain an image for initial adjustment such as illumination adjustment (step S11 in FIG. 6). The field-of-view range H of the area imaging is larger than the entirety of the island 30, and at least the area 30 of the island 30 required for image processing is included in the area imaging. In addition, an image for model registration may be used as an image for initial adjustment. That is, this area image can be registered as a positioning model, or can be registered as a positioning model for positioning using a line image described later. These registrations can be registered in the registration means 35.

  Thus, when the area imaging is completed, the line imaging step S2 is performed next. That is, the camera 28 is set in the line sensor camera mode (step S12 in FIG. 6), and the camera 28 is moved in the direction of the arrow X (X1). That is, relative movement is started (step S13). In this case, the line imaging is possible over the entire length of the island portion 30 which is one inspected part in the line imaging direction. That is, the length of the field of view L for line imaging is set to be longer than the length of the island portion 30 in the substrate transport direction. Thereby, it is possible to image all the island portions 30 on the substrate 22 at the downstream end in the substrate transport direction.

  In this manner, the position of the island portion 30 where the image has been taken can be confirmed (positioned). Based on this position, the moving mechanism (moving means) 25 is adjusted by the control means 26, and the collet 23 Bonding to the island portion 30 can be performed accurately.

  Then, it is determined whether or not it has reached the turn-back operation unit (step S14). If it has been reached, the camera 28 has moved in the direction of the arrow X1, and in this case, the end point of X1 of the island unit 30 of (b) (Downstream point). If it has not reached, the camera 8 is moved in the direction of the arrow X1 until it reaches.

  In step S15, the line imaging direction is switched, and the camera 27 is moved in the arrow Y2 direction. Thereafter, it is determined whether or not the return operation unit has been completed (step 16). That is, it is determined whether or not the line imaging of the island 30 in the adjacent row C has been completed. If it has been completed, the process moves to step S17. If the processing has not been completed in step S16, the processing is performed until the processing is completed.

  In step S17, it is determined whether or not to end the operation. If it is determined that the processing is to be ended, the processing is ended. If it is determined that the processing is not to be ended, the process proceeds to step S18, in which the line imaging direction is switched and the camera is moved in the arrow X2 direction. Thereafter, the process proceeds to step S19, and it is determined whether or not the imaging of the final imaging region has been completed.

  If the operation has been completed in step S19, the operation is completed. If not, the process proceeds to step S14, and the above-described steps are sequentially performed. Thereby, it is possible to image all the islands 30 of the work (substrate 22) while drawing the right-angle zigzag locus K1 in FIG.

  Also in the case of drawing a rectangular spiral locus K2 shown in FIG. 5, it is possible to image all the islands 30 of the work (substrate 22) by operating according to the flowchart of FIG.

  Further, the relative movement between the camera 28 and the work 22 may be as shown in FIG. The case where the camera 22 is moved while the work 22 is fixed will be described with reference to FIGS. In addition, in FIG. 7, H has shown the visual field range of area imaging.

  In this case, as shown in FIG. 1, the substrate (work) 22 is transported along the direction of the arrow Y (Y1) and stops at a predetermined position. In this state, the camera 28 is arranged at a position where the area of the island 30 of the substrate 22 can be imaged. The island 30 in FIG. 1 is located at the downstream end in the transport direction and at the upstream end in the camera movement direction.

  First, as shown in FIG. 3, an area imaging step S1 is performed. In other words, the camera 28 is set to the area mode, and an image of the island section 30 is taken to obtain an image for initial adjustment such as illumination adjustment (step S21 in FIG. 8). The field-of-view range H of the area imaging is larger than the entirety of the island 30, and at least the area 30 of the island 30 required for image processing is included in the area imaging.

  Thus, when the area imaging is completed, the line imaging step S2 is performed next. That is, the camera 28 is set to the line sensor camera mode (step S22 in FIG. 8), and the camera 28 is moved in the direction of the arrow X (X1). That is, relative movement is started (step S23). In this case, line imaging is possible over the entire length in the line imaging direction of the island portion 30, which is one inspected part. That is, the length of the field of view L for line imaging is set to be longer than the length of the island portion 30 in the substrate transport direction. Thereby, it is possible to image all the island portions 30 on the substrate 22 at the downstream end in the substrate transport direction.

  It is determined whether or not an image of the last row of imaging parts has been captured (step S24). That is, when imaging of the island portion 30 at the downstream end of the substrate 22 in the substrate transport direction is completed, the substrate 22 is transported by a predetermined amount in the substrate transport direction Y (Y1), and Imaging can be performed in a similar manner.

  After that, the process shifts to step S25 to determine whether or not there is an imaging part (island 30) next to the part. When there is an imaging part (island 30) next to the staple, the process proceeds to the staple S26. That is, the camera is moved in the Y2 direction from the imaging region (island 30) shown in FIG. In this case, if there is no adjacent imaging part (island 30) in step S25, the operation ends.

  If it has moved to the site corresponding to the imaging site C, the process proceeds to step S21. As a result, the camera 28 and the work 22 relatively move along the trajectory K3 shown in FIG. 7, so that all the islands 30 of the work can be imaged. In the case of the operation as shown in FIG. 7, it is not necessary to switch the line imaging direction in the turnback unit, and the operation can be simplified.

  Before the image processing operation, the recipe adjustment unit 32 can perform the recipe adjustment on the image captured by the area imaging or the line imaging. In this case, an image processing operation may be performed using an image captured by line imaging or area imaging that is different from the imaging method used in the recipe adjustment unit 32 in the recipe adjusted by the recipe adjustment unit 32. Here, the recipe adjustment is to adjust imaging parameters (exposure time, camera gain, illumination light emission condition, lens focus / aperture) and image processing parameters (positioning, inspection threshold, and the like). This is an adjustment for performing image processing.

  As described above, in the pre-process of performing the positioning and inspection processing, the recipe is adjusted for the image captured in the area, the line is captured using the recipe, and the positioning and inspection processing is performed on the image. Recipe adjustment is performed on the captured image, an area is captured using this recipe, positioning and inspection processing can be performed on the image, and workability can be improved. For example, for positioning and inspection processing, a recipe adjustment is performed on an image captured in an area, and when line imaging is performed using this recipe, imaging parameters and image processing parameters can be adjusted while performing live display, As a result, feedback of parameter change can be obtained, and line imaging can be performed under optimal conditions. It should be noted that, even when recipe adjustment is performed on an image obtained by line imaging and area imaging is performed using this recipe, live display can be performed discontinuously by continuously scanning.

  In addition, a recipe provisionally adjusted using an image captured in an area can be applied to line imaging, and a recipe temporarily adjusted can be registered. Here, the tentative adjustment is to perform a recipe adjustment using an imaging method (in this case, line imaging) different from the imaging method at the time of actual imaging during positioning or inspection processing. With such a configuration, the user can (forcedly) check the image and obtain a stable high-precision image.

  The recipe adjustment unit 32 can be configured to include a switching unit 34 that switches between area imaging and line imaging. The area image obtained by the area imaging and the line image obtained by the line imaging do not become completely the same image due to a difference in illumination light distribution, an aberration of a lens, and the like. Further, these effects vary depending on the workpiece. When the recipe adjustment is performed, the adjustment is performed using the area imaged image in consideration of convenience. However, since it is different from the actual line image (the line image obtained by the line imaging), it is necessary to make some adjustments and then switch to the line image for confirmation, and thus switch between the area imaging and the line imaging. This is made possible by providing the switching means 34 for performing the above. Further, if the switching means 34 is provided, it is possible to confirm that the two images (the area image and the line image) do not greatly differ before performing the recipe adjustment.

  When an error occurs during line imaging, it is preferable to perform area imaging on the imaging site where the error has occurred. With this configuration, when an error occurs, an image of a portion where the error has occurred can be confirmed. In this case, even if the camera is moved to a position away from the site where the error has occurred, the camera can be returned to the site where the error has occurred and the area can be imaged, thereby improving the convenience of the user when the error occurs. Can be done. In other words, by using area imaging, live display at a site where an error has occurred can be performed without scanning by a camera.

  In the image pickup apparatus of the present invention, since the area to be inspected of the first inspected portion (island portion 30) of the transferred substrate 22 can be imaged in an area, an image for initial adjustment such as illumination adjustment can be obtained after the substrate is transferred and after image pickup. It can be obtained after the parameter is changed, and the working time can be reduced. Thereafter, using this camera 28, line imaging of each inspected site can be performed, and positioning of all inspected sites (all island portions 30) can be performed. In this line imaging, there is no need to stop the camera 28, and the camera 28 does not vibrate due to the stop. For this reason, high-accuracy positioning can be performed. In addition, since the camera does not vibrate, there is no need to stop imaging until the vibration stops, and positioning with high working efficiency can be performed. Further, since a line sensor camera is not used, the cost of the apparatus can be reduced.

  For this reason, this imaging device can be used as a positioning device in a die bonder, and if used in this way, high-precision positioning can be performed. The bonding operation can be performed with high accuracy in a short time. The positioning position performed by the positioning device can be set at any position of the die bonder.

  By the way, in the embodiment, the camera 28 is moved in the direction (X1 direction) orthogonal to the substrate transfer direction (Y1 direction). However, the camera 28 is moved in the opposite direction (Y2) to the substrate transfer direction (Y1 direction). May be moved. In this case, the line imaging direction is a direction (X direction) orthogonal to the substrate transport direction (Y1 direction), and the line imaging length is set to be longer than the length of the island portion 30 in the X direction. Alternatively, the substrate 22 may be moved in the substrate transfer direction (Y1 direction) without moving the camera 28, and the camera 28 may be moved in the direction (Y2) opposite to the substrate transfer direction (Y1 direction). 22 may be moved in the substrate transport direction (Y1 direction). Note that the direction orthogonal to the X direction and the direction orthogonal to the Y direction are not strictly limited to 90 degrees, and may be, for example, directions forming an angle of about 85 degrees to 95 degrees.

  That is, the camera 28 can be moved in the X direction (X1 direction or X2 direction), the camera can be moved in the Y direction (Y1 direction or Y2 direction), and further, the Y1 direction and the direction opposite to the Y1 direction (Y2 direction). ), The camera 28 can be stopped, and the substrate 22 can be transported in the Y1 direction and the direction (Y2) opposite to the Y1 direction. The moving direction of the substrate 28, the transport direction of the substrate 22, and the like can be variously changed.

  The present invention can be variously modified without being limited to the above-described embodiment. For example, in the case of performing line imaging, a single row of imaging elements is used, but two or three rows of imaging elements may be used. . The number of the island portions 30 of the substrate 22 is arbitrary, and six in the illustrated example is for simplification of the description, and is actually a large number of six or more. The moving speed of the camera 28 is set to a speed range in which the camera 28 can perform line imaging. After the bonding operation of the chip 21, it may be used for checking the presence or absence of the chip 21 and the chip position.

21 chip 22 substrate 28 camera (area sensor camera)
30 Imaging part (part to be inspected)
31 scanning means 32 recipe adjusting means 34 switching means P pickup position Q bonding position S1 area imaging step S2 line imaging step

Claims (12)

An imaging device for imaging a plurality of imaging parts of a work,
A camera capable of imaging an area of at least one imaging part in the work,
A moving means capable of relative movement between the camera and the work,
The imaging apparatus according to claim 1, wherein the camera performs line imaging on an imaging part while the moving means moves the camera and the workpiece relative to each other.   2. The imaging apparatus according to claim 1, wherein a possible range of the line imaging by the camera is equal to or longer than an entire length of one imaging region in a line imaging direction. 3.   The relative movement between the camera and the work includes a folding operation unit, and in the folding operation unit, the line imaging is performed by switching the line imaging direction. Imaging device.   3. The method according to claim 1, wherein the relative movement between the camera and the work includes a folding operation unit, and in the folding operation unit, area imaging is performed without switching the line imaging direction. 4. An imaging device according to any one of the preceding claims.   Before the image processing operation, the image processing apparatus further includes a recipe adjustment unit that performs a recipe adjustment on the image captured by the area imaging or the line imaging. The imaging apparatus according to claim 1, wherein an image processing operation is performed using an image captured in an area.   A recipe provisionally adjusted using the image captured in the area is applied to the line imaging, a temporarily adjusted recipe is registered, and / or a user evaluates a result applied to the line imaging, and based on the evaluation, The imaging apparatus according to claim 5, wherein a partially corrected recipe is registered.   The image processing apparatus according to claim 1, further comprising: a recipe adjustment unit configured to perform a recipe adjustment on an image captured by area imaging or line imaging, wherein the recipe adjustment unit includes a switching unit configured to switch between area imaging and line imaging. The imaging device according to claim 1.   The imaging apparatus according to any one of claims 1 to 7, wherein when an error occurs during line imaging, area imaging is performed on an imaging part in which the error has occurred. A positioning device that performs image observation of a plurality of inspected sites, which are imaging sites on the conveyed substrate, and positions each inspected site,
A positioning device, wherein the imaging device according to any one of claims 1 to 8 is used for observing an image of a region to be inspected. A die bonder that picks up a chip at a pickup position, transports the picked up chip to a bonding position, and bonds the chip at the bonding position.
A die bonder wherein positioning using any one of the positioning devices according to claim 9 is enabled. An imaging method for imaging a plurality of imaging parts of a work,
Area imaging step of performing area imaging of at least one imaging region in the work,
A line imaging step of, after the area imaging step is completed, performing a line imaging for each imaging region with an area sensor camera that has captured the area. An imaging method for imaging a plurality of imaging parts of a work,
Using a camera capable of area imaging, the camera and the work relatively move, and this movement includes a folding operation unit. In this folding operation unit, switching of the line imaging direction of the camera is performed. Characteristic imaging method.

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