WO2023272898A1

WO2023272898A1 - Chip-scale wafer level marking system and laser marking method

Info

Publication number: WO2023272898A1
Application number: PCT/CN2021/112895
Authority: WO
Inventors: 孙丰; 张宝峰; 吴斌; 刘斌
Original assignee: 苏州赛腾精密电子股份有限公司
Priority date: 2021-06-28
Filing date: 2021-08-17
Publication date: 2023-01-05
Also published as: CN113275758B; CN113275758A

Abstract

A chip-scale wafer level marking system and a laser marking method. The marking system comprises: a loading apparatus (1) configured to store a wafer (3); a marking device (2) comprising a placement platform (21) for placing the wafer (3), and a laser marking apparatus (22) provided below the placement platform (21) for marking a first surface of the wafer (3), the placement platform (21) being provided with a first avoidance hole (21a) for avoiding the first surface of the wafer (3); and a handling apparatus provided between the loading apparatus (1) and the marking device (2) to transport the wafer (3). The marking device (2) further comprises a warpage adjusting apparatus (23). The warpage adjusting apparatus (23) comprises a pressing mechanism (24) and a flattening mechanism (25). The pressing mechanism (24) can move toward the wafer (3) to compact a second surface of the wafer (3). The first surface of the wafer (3) comprises a marking area and a non-marking area. The flattening mechanism (25) can move toward the first surface of the wafer (3) to support the non-marking area of the wafer (3). The marking system and the laser marking method can realize automatic handling and marking of the wafer and improve the production efficiency. By providing the pressing mechanism and the flattening mechanism, the wafer on the placement platform can be fixed and flattened, such that the wafer bending deformation is effectively avoided, and the wafer marking precision is improved.

Description

Chip-scale wafer-level marking system and laser marking method

This application claims the priority of a Chinese patent application with a filing date of June 28, 2021 and an application number of 202110718609.2, the entire contents of which are incorporated herein by reference.

technical field

The present application relates to the technical field of laser marking, for example, to a chip-scale wafer-level marking system and a laser marking method.

Background technique

Wafer marking is to use high-energy-density laser beams to irradiate the surface of the wafer locally, so that the surface material rapidly vaporizes or undergoes a color change, thereby exposing deep-layer substances, or engraving traces by chemically and physically changing the surface materials, or through light energy. Burn off part of the material to reveal the graphics and text to be etched.

The marking equipment in the related art usually includes a placement table for placing wafers and a laser marking device corresponding to the placement table. In actual production, manual handling of wafers is required, which is not conducive to efficient operation. In addition, there are defects in the structure of the placement table. Since the end face of the wafer needs to be marked, an avoidance hole needs to be opened on the placement table so that the laser marking device can inject the laser beam into the end face of the wafer. When the wafer is placed on the placement table, Only the edge of the wafer is supported on the placement table, and most of the middle of the wafer is suspended, resulting in a large overall deformation of the wafer, which has a great impact on the accuracy, quality and speed of marking.

Contents of the invention

The present application provides a chip-scale wafer-level marking system and a laser marking method, which can effectively avoid warping and deformation of the wafer while automatically marking the wafer.

One embodiment provides a chip-scale wafer-level marking system, including: a loading device; marking equipment, including a placement table, a laser marking device and a warpage adjustment device arranged under the placement table, the placement The platform is provided with a first avoidance hole; the handling device is arranged between the loading device and the marking equipment; wherein, the warpage adjustment device includes a pressing mechanism and a flattening mechanism; the pressing mechanism can move toward the The first side of the placement platform moves; the leveling mechanism can move toward the second side of the placement platform; wherein, the first side of the placement platform is opposite to the second side of the placement platform .

An embodiment also provides a chip-scale wafer-level laser marking method, including:

Make the handling device move the wafer to be marked from the loading device to the placement table of the marking equipment;

moving the pressing mechanism toward the placement table to press and fix the wafer, while moving the flattening mechanism toward the wafer to support the non-marking area of the wafer;

Drive the placement platform to move, and the placement platform drives the first positioning part located on the placement platform to move to the upper camera and the lower camera respectively, so as to locate and unify the coordinates of the upper camera and the lower camera system, determining the marking position of the wafer;

Turn on the laser marking device, so that the marking head of the laser marking device shoots the laser beam to the upper camera, and the upper camera detects the deviation of the marking head, and adjusts parameters according to the deviation to compensate the marking head;

moving the placement table so that the wafer to be marked moves with the placement table to a position directly above the marking head, so that the marking head marks the marking area of the wafer;

After marking is completed, causing the clamping mechanism to release the wafer, and causing the handling device to move the marked wafer back to the loading device; and

The above actions are repeated to achieve continuous marking of the wafer.

Description of drawings

Fig. 1 is a schematic structural diagram of the marking system of the present application.

Fig. 2 is a schematic diagram of the structure of Fig. 1 after removing the casing.

FIG. 3 is a schematic structural diagram of the first wafer loading mechanism in the present application.

FIG. 4 is a schematic diagram of the mating of the Z-axis lifting assembly and the protective cover in FIG. 3 .

Fig. 5 is a schematic structural diagram of Fig. 4 after the protective cover is removed.

FIG. 6 is a schematic structural view of the mesa of the first carrier in the present application.

FIG. 7 is a schematic diagram of mating between the first wafer cassette and the first carrier in the present application.

FIG. 8 is a schematic view of the connection between the second wafer cassette and the first carrier in the present application.

Fig. 9 is a schematic structural diagram of the turntable device in the present application.

Fig. 10 is a schematic structural diagram of the marking device in the present application.

Fig. 11 is a schematic diagram of the mating of the placement platform and the warpage adjustment device in the present application.

FIG. 12 is a schematic view of the structure of FIG. 11 in another direction.

FIG. 13 is a schematic diagram of the exploded structure of FIG. 11 .

Fig. 14 is a schematic structural view of the pressure plate in the present application.

Fig. 15 is a schematic structural view of the positioning disc in the present application.

FIG. 16 is a schematic structural view of FIG. 11 after removing the pressing substrate and the pressing plate.

FIG. 17 is a schematic cross-sectional view of FIG. 11 .

Fig. 18 is a schematic structural view of the leveling mechanism in the present application.

Fig. 19 is a schematic diagram of the mating of the laser marking device and the Y-axis translation assembly in the present application.

Fig. 20 is a schematic structural diagram of a laser marking device in the present application.

Fig. 21 is a principle diagram of laser spot position correction in the present application.

Fig. 22 is a flowchart of the laser marking method in the present application.

Fig. 23 is a schematic diagram of the positional relationship among the loading device, the marking device and the conveying device provided by an embodiment of the present application.

detailed description

The terms "comprising" and "having" and any variations thereof in this application are intended to cover a non-exclusive inclusion. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the listed steps or units, but optionally also includes unlisted steps or units, or optionally further includes For other steps or units inherent in these processes, methods, products or apparatuses.

Reference herein to an "embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present application. The appearances of this phrase in various places in the specification are not necessarily referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is understood explicitly and implicitly by those skilled in the art that the embodiments described herein can be combined with other embodiments.

Referring to Fig. 1, Fig. 2, Fig. 10, Fig. 12 and Fig. 23, a chip-scale wafer-level marking system corresponding to an embodiment of the present application includes: a loading device 1 configured to store a wafer 3, a wafer 3 includes a first surface and a second surface, and the first surface and the second surface are arranged opposite to each other; the marking device 2 includes a placement table 21 configured to place the wafer 3, and a laser marking device 22 arranged below the placement table 21 , the laser marking device 22 is set to mark the first surface of the wafer 3, and the placement table 21 is provided with a first avoidance hole 21a for avoiding the first surface of the wafer 3; Between the equipment 2, to transport the wafer 3; wherein, the marking equipment 2 also includes a warpage adjustment device 23, and the warpage adjustment device 23 includes a pressing mechanism 24 and a flattening mechanism 25; the pressing mechanism 24 can move toward the wafer 3, To compress the second side of the wafer 3 ; the first side of the wafer 3 includes a marked area and a non-marked area, and the flattening mechanism 25 can move toward the first side of the wafer 3 to support the non-marked area of the wafer 3 .

It should be noted that, in this embodiment, the first surface of the wafer 3 is the back of the wafer 3 , the second surface is the front of the wafer 3 , and the laser marking device 22 is used to mark the back of the wafer 3 .

In one embodiment, the marking system further includes a casing 4, on which a window (not shown) for the wafer 3 to enter and exit is opened, and the loading device 1 is located outside the casing 4 and corresponds to the window. The marking device 2 and the handling device 6 are located inside the housing 4 .

In one embodiment, the loading device 1 includes at least one of the first wafer loading mechanism 11 and the second wafer loading mechanism 12, and the wafer 3 can be placed in the first wafer loading mechanism 11 and the second wafer loading mechanism 12. Pick and place on at least one of the Among them, the first wafer loading mechanism 11 is used for manual loading and unloading by operators, and the second wafer loading mechanism 12 can be matched with an external mechanism (not shown in the figure) for automatic loading and unloading. In the present application, by setting the first wafer loading mechanism 11 and the second wafer loading mechanism 12, in actual production applications, automatic or manual loading and unloading can be selected according to actual needs, thereby improving the adaptability of the marking system.

Referring to FIGS. 3 to 5 , the first wafer loading mechanism 11 includes a first stage 111 and a wafer cassette 112 configured to load wafers 3 , and the wafer cassette 112 is placed on the first stage 111 . The first wafer loading mechanism 11 further includes a protective cover 113 arranged to surround the periphery of the wafer cassette 112 . The protective cover 113 is disposed on the first platform 111 , and the protective cover 113 can move relative to the first platform 111 to approach or move away from the wafer cassette 112 .

By setting the protective cover 113 on the first carrier 111, the protective cover 113 can move relative to the first carrier 111. When it is necessary to pick and place the wafer cassette 112 on the first carrier 111, the protective cover 113 can move away from the wafer. The direction of round box 112 moves, so that pick and place wafer box 112; Operators mistakenly touch the wafer cassette 112, thereby improving production safety and improving production efficiency.

In one embodiment, a Z-axis lift assembly 114 connected to the protective cover 113 is disposed inside the first stage 111 , and the Z-axis lift assembly 114 can drive the protective cover 113 to move closer to or away from the wafer cassette 112 . In one embodiment, the Z-axis lifting assembly 114 includes a first driving motor 1141 , a screw rod 1142 connected in transmission with the first driving motor 1141 , and a screw nut 1143 fitted on the screw rod 1142 . The screw rod 1142 is arranged along the Z-axis direction. The screw nut 1143 is connected to the protective cover 113 , and the first driving motor 1141 can drive the screw rod 1142 to rotate, thereby driving the screw nut 1143 and the protective cover 113 to move along the length direction of the screw rod 1142 . Admittedly, in other embodiments, the Z-axis lifting assembly 114 can also directly push the protective cover 113 in a pneumatic manner, for example, a driving cylinder (not shown) arranged along the Z-axis direction is used, and the driving cylinder is connected to the protective cover 113 to Push the protective cover 113 to move along the Z-axis direction.

In one embodiment, as shown in FIG. 4 and FIG. 5 , the Z-axis lifting assembly 114 further includes a slide rail 1144 fixed on the first carrier 111 and a slide block 1145 slidingly mated with the slide rail 1144. The slide rail 1144 and the slide rail 1144 The screw rod 1142 is arranged in parallel, and the protective cover 113 is connected with the slide block 1145, so that the screw nut 1143 drives the protective cover 113 to move while being guided by the slide rail 1144, thereby improving the reliability of the protective cover 113 moving. The number of slide rails 1144 is two, and they are respectively located on both sides of the screw mandrel 1142. Correspondingly, the number of slide blocks 1145 corresponds to two.

In one embodiment, the protective cover 113 includes a protective cover main body 1131 and a transmission frame 1132, the protective cover main body 1131 is surrounded by the periphery of the wafer cassette 112, the transmission frame 1132 is placed in the first stage 111, and is respectively connected with the screw nut 1143 and slider 1145 join. The first stage 111 is provided with an escape slot 111 a along the moving direction of the protective cover 113 , and the transmission frame 1132 partially passes through the escape slot 111 a and connects with the main body 1131 of the protective cover.

The main body 1131 of the protective cover includes an installation frame 1133 and a plurality of transparent plates 1134. The plurality of transparent plates 1134 are embedded in the installation frame 1133 to enclose and form a transparent cavity for accommodating the wafer cassette 112. Operators can see through the protective cover 113 observes the wafer box 112 directly, so as to understand the situation of the wafer 3 in the wafer box 112 . The transparent plate 1134 can specifically be made of glass, transparent plastic and other materials.

In one embodiment, as shown in FIG. 6 , a positioning structure is provided on the table top 111 b of the first stage 111 to position the wafer cassette 112 so that the handling device 6 can precisely align the wafers in the wafer cassette 112 . Circle 3 for pick and place. The positioning structure can be a plurality of positioning blocks arranged on the table top 111b of the first carrier 111, and the positioning blocks cooperate to form a positioning space for positioning the wafer cassette 112; or, the positioning structure is set on the table of the first carrier 111 111b, the bottom of the wafer box 112 is embedded in the positioning slot; or, the positioning structure is a plurality of fixed feet 117 protruding from the table 111b of the first carrier 111, and the bottom of the wafer box 112 is shaped There are a plurality of recesses 1122 adapted to the fixing feet 117 , and the fixing feet 117 are embedded in the recesses 1122 .

In this embodiment, as shown in FIG. 7 and FIG. 8, the wafer box 112 includes a first wafer box 112a and a second wafer box 112b, wherein the first wafer box 112a is configured to store smaller-sized wafers. round 3, the second wafer cassette 112b is set to store larger-sized wafers 3, and operators can replace the wafer cassette 112 as needed. The first cassette 112a is provided with a first access opening (not shown) facing the window, and the second wafer cassette 112b is provided with a second access opening (not shown) facing the window. A first positioning structure for positioning the first wafer cassette 112a and a second positioning structure for positioning the second wafer cassette 112b are disposed on the table surface 111b of the first carrier 111 . In other embodiments, there may be 3, 4 or more wafer cassettes 112, which are not specifically limited in this application.

In this embodiment, the first positioning structure adopts a positioning block to realize the positioning of the first wafer cassette 112a. In one embodiment, as shown in FIG. 7 , the first positioning structure includes a first positioning block 115 and a second positioning block 116 opposite to the first positioning block 115 . The number of first positioning blocks 115 is two, and they are located on the same side, and the number of second positioning blocks 116 is two, and they are located on the same side. The first positioning blocks 115 and the second positioning blocks 116 are respectively located corner position.

As shown in FIG. 6 , the first positioning block 115 defines an abutting groove 115 a, and the abutting groove 115 a includes a first abutting surface 1151 and a second abutting surface 1152 . The first abutting surfaces 1151 of the two abutting grooves 115a are oppositely disposed to limit the movement of the first wafer cassette 112a in the X-axis direction. The second positioning block 116 includes a third abutting surface 1161 , and the second abutting surface 1152 is disposed opposite to the third abutting surface 1161 to limit the movement of the first wafer cassette 112 a in the Y-axis direction.

Due to the large bottom area of the second wafer cassette 112b, in one embodiment, the second positioning structure adopts the recessed portion 1122 and the fixing feet 117 for positioning. In one embodiment, the bottom of the second wafer cassette 112b is protruded with a plurality of protrusions 1121, and recesses 1122 are formed in the plurality of protrusions 1121, and the table surface 111b of the first carrier 111 is correspondingly protruded with embedded The fixing feet 117 in the recessed portion 1122 . In this embodiment, there are three recesses 1122 , two of which are located on the same side, the other is located on the opposite side of the same side, and is located in the middle of the two recesses 1122 on the same side.

In one embodiment, as shown in FIG. 5 , the first stage 111 includes a first mounting substrate 118 , and the first mounting substrate 118 is located on one side of the wafer cassette 112 and abuts against the casing 4 . An opening 118a is opened on the first mounting substrate 118 corresponding to the pick-and-place opening of the wafer cassette 112 for the manipulator to enter and exit the wafer cassette 112 sequentially through the window, the opening 118a and the pick-and-place opening.

Referring to FIG. 2 , the second wafer loading mechanism 12 is similar in structure to the first wafer loading mechanism 11 , and the second wafer loading mechanism 12 includes a second stage 121 for an external mechanism to automatically pick and place the wafer cassette 112 . Since the automatic pick-and-place wafer cassette 112 is adopted, workers will not frequently approach the marking system during the actual production process. Therefore, the second wafer loading mechanism 12 does not need to be provided with a protective cover 113 . Specifically, the external mechanism can adopt a manipulator that can move autonomously.

In one embodiment, the handling device 6 is specifically a manipulator, and the wafers 3 are accommodated in the wafer cassette 112 in a stacked manner at intervals. The part of the manipulator in contact with the wafer 3 is provided with a vacuum chuck (not shown), so as to Wafer 3 is held firmly. Moving the wafer 3 by the robot arm is a common method in the field, and the present invention will not repeat it here.

In order to facilitate the manipulator to put the wafer 3 into the placement table 21 at the same position, in this embodiment, a positioning gap (not shown) is provided on the edge of the wafer 3, as shown in Fig. 2 and Fig. Also provided with a turntable device 5, the turntable device 5 includes a turntable 51 arranged to place the wafer 3 and a detection head 52 positioned above the turntable 51, the detection head 52 corresponds to the edge of the wafer 3, and the wafer 3 is placed on the handling device 6 Before putting into the marking equipment 2, first put the wafer 3 into the turntable 51, the turntable 51 detects the wafer 3 and rotates automatically, when the detection head 52 detects a positioning gap, the turntable 51 stops rotating, at this time, the handling device 6 restarts The positioned wafer 3 is picked up and put into the placing table 21 of the marking device 2 .

In one embodiment, as shown in FIG. 10 , the marking device 2 further includes a frame 26 , a placement platform 21 disposed on the frame 26 , a laser marking device 22 and a warpage adjusting device 23 .

11 and 13, the pressing mechanism 24 includes a pressing base plate 241 and a pressure plate 242. The pressing base plate 241 is provided with a second avoidance hole 241a concentrically with the first escape hole 21a, and the pressure plate 242 is detachable. The platen 242 is arranged on the pressing base plate 241 so as to pass through the second escape hole 241 a and abut against the edge of the front surface of the wafer 3 . The pressing substrate 241 can move along the Z-axis direction to drive the platen 242 to press or loosen the wafer 3 . The pressure plate 242 is provided with a third avoidance hole 242a concentric with the first escape hole 21a, and the third escape hole 242a is set to avoid other parts of the wafer 3 except the edge, so as not to damage the front surface of the wafer 3. The chips are extruded. In this embodiment, there are various types of the platen 242 , and third avoidance holes 242 a with different diameters are provided according to different sizes of the wafer 3 to ensure that they correspond to the edges of the wafer 3 of different sizes.

In one embodiment, in order to facilitate the quick disassembly and assembly of the pressure plate 242, the upper end surface of the pressing base plate 241 is provided with a first sinking platform 2411 in the downward direction, and the first sinking platform 2411 is concentrically arranged in the second avoidance hole. On the outside of 241a, part of the pressure plate 242 can be embedded and positioned in the first sinking platform 2411 .

In one embodiment, as shown in FIG. 13 and FIG. 14 , the platen 242 includes a platen main body 2421 configured to press the wafer 3 and a ring of first flanges 2422 protruding along the circumference of the platen main body 2421 . The first flange 2422 is embedded in the first sinking platform 2411 to support the pressure plate main body 2421 and limit the radial movement of the pressure plate main body 2421 . The platen main body 2421 passes through the second avoidance hole 241a and is located above the placement table 21 , the pressing substrate 241 can drive the platen main body 2421 to move toward the placement table 21 to compress the wafer 3 on the placement table 21 . The outer diameter of the first flange 2422 is equal to or slightly smaller than the inner diameter of the first sinking platform 2411 .

In other embodiments, the first sinking platform 2411 can also be eliminated, and the outer diameter of the pressure plate main body 2421 is set to be equal to or slightly smaller than the inner diameter of the second escape hole 241a, so that the pressure plate main body 2421 and the second escape hole 241a are closely matched, so that the quick installation and positioning of the pressure plate 242 can be realized. Alternatively, the first flange 2422 cooperates with the first sinking platform 2411 to achieve positioning, and the pressure plate main body 2421 cooperates with the second avoidance hole 241a to achieve positioning, so that the pressure plate 242 and the pressing base plate 241 cooperate more closely .

In one embodiment, as shown in FIG. 13 and FIG. 15 , in order to ensure that the placement table 21 can accommodate and position wafers 3 of different sizes, the placement table 21 is detachably provided with a positioner for accommodating the wafer 3 . Disk 211, the positioning disk 211 is provided with a through hole 211a concentric with the first escape hole 21a, the through hole 211a is set to avoid the laser beam injected by the laser marking device 22, so as to ensure that the laser beam can be smoothly injected into the wafer 3 in the back. The upper end surface of the positioning plate 211 is provided with a second sinking platform 2111 in the downward direction, and the second sinking platform 2111 is concentrically arranged outside the through hole 211a, and the wafer 3 can be embedded and positioned in the second sinking platform 2111 .

In this embodiment, there are various types of positioning discs 211 , and second sinking platforms 2111 with different inner diameters are provided according to different sizes of wafers 3 to ensure that wafers 3 of different sizes can be positioned.

In one embodiment, the positioning disc 211 includes a positioning disc main body 2112 and a second flange 2113, the second flange 2113 is protruding along the circumferential direction of the positioning disc main body 2112, and the outer diameter of the positioning disc main body 2112 is equal to or slightly The inner diameter is smaller than the inner diameter of the first avoidance hole 21a, so that the main body 2112 of the positioning disc fits closely with the first escape hole 21a, and the second flange 2113 is in contact with the upper end surface of the placement table 21 to support the main body 2112 of the positioning disc.

In addition, a plurality of detection sensors 27 are provided on the pressing substrate 241 , and the detection sensors 27 correspond to the positioning plate 211 to detect the presence or absence of the wafer 3 on the positioning plate 211 .

Since the pressing substrate 241 is arranged above the positioning plate 211, in order to prevent the pressing substrate 241 from restricting the transfer device 6 from taking and placing the wafer 3, in this embodiment, the transfer device 6 sends the wafer 3 in or out along the X-axis direction. Positioning plate 211.

As shown in Figure 15 and Figure 16, in order to facilitate the handling device 6 to extend into the positioning plate 211, the positioning plate 211 is provided with a first avoidance groove 211b for the handling device 6 to extend into, and the first avoidance groove 211b extends from the second flange 2113 The outer side of the through hole 211a extends along the X-axis direction to the inner wall of the through hole 211a. A second avoidance groove 21b is defined on the placement platform 21 corresponding to the first escape groove 211b, and the second escape groove 21b is arranged along the X-axis direction. The transport device 6 can extend into or leave the through hole 211a through the second avoidance groove 21b and the first avoidance groove 211b to pick and place the wafer 3 .

In one embodiment, as shown in FIG. 11 , FIG. 16 and FIG. 17 , the pressing mechanism 24 further includes a lifting assembly 243 installed on the placement platform 21 , the lifting assembly 243 is connected to the pressing base plate 241 in transmission, and drives the pressing The tight base plate 241 is automatically raised and lowered along the Z-axis direction.

The lifting assembly 243 includes a guiding assembly 244 , a second driving motor 245 and a first transmission assembly 246 . The guide assembly 244 is set to receive the pressing substrate 241 and the placement table 21 to guide the pressing substrate 241 to move along the Z-axis direction, the first transmission assembly 246 is respectively matched with the second drive motor 245 and the pressing substrate 241, and the second The driving motor 245 can drive the first transmission assembly 246 to drive the pressing substrate 241 to approach or move away from the placing table 21 along the Z-axis direction.

As shown in FIG. 17 , the guide assembly 244 includes a linear bearing 2441 fixedly mounted on the placement table 21 and a guide shaft 2442 passed through the linear bearing 2441 , the guide shaft 2442 is fixedly connected to the lower end surface of the pressing base plate 241 , The guide shaft 2442 can slide in the linear bearing 2441 along the Z-axis direction. There are multiple sets of guide assemblies 244, which are evenly spaced to receive multiple positions of the pressing substrate 241, so that the pressing substrate 241 moves smoothly along the Z-axis direction.

The first transmission assembly 246 includes a synchronous pulley set 2461 and a cam assembly 2462. The cam assembly 2462 is located below the pressing base plate 241. The two ends of the synchronous pulley set 2461 are respectively connected to the cam assembly 2462 and the second drive motor 245. The second The driving motor 245 can drive the synchronous pulley set 2461 to rotate, so as to drive the cam assembly 2462 to rotate. The cam assembly 2462 includes a cam 2463 and a camshaft 2464, and the two ends of the camshaft 2464 are connected to the cam 2463 and the synchronous pulley set 2461 respectively. By rotating the cam 2463 , the protruding portion of the cam 2463 contacts or moves away from the pressing substrate 241 , thereby driving the pressing substrate 241 to approach or move away from the placing table 21 along the Z-axis direction.

In this embodiment, as shown in FIG. 16 and FIG. 17 , there are two sets of synchronous pulley sets 2461 and cam assemblies 2462 , which are respectively located on opposite sides of the pressing base plate 241 to improve driving stability. A transmission shaft 2465 is connected between the two sets of synchronous pulleys 2461 , and the end of the transmission shaft 2465 is connected to the second drive motor 245 to realize synchronous rotation of the two sets of synchronous pulleys 2461 .

In one embodiment, as shown in FIG. 12 and FIG. 18 , the flattening mechanism 25 includes a translation assembly 251 placed under the placement table 21, a Z-axis lifting part 252 and a pallet 253, wherein the Z-axis lifting part 252 is installed on On the translation assembly 251 , the support plate 253 is fixed on the Z-axis lifting part 252 . When working, the translation component 251 can drive the Z-axis lifting part 252 and the supporting plate 253 to move to the bottom of the wafer 3 along the X-axis direction, and the Z-axis lifting part 252 can drive the supporting plate 253 to move along the Z-axis direction to contact and level the wafer 3 Non-marking area on the back. In this embodiment, the dimension of the end surface of the support plate 253 is smaller than that of the wafer 3 so as to support a part of the wafer 3 . In this embodiment, the supporting plate 253 is made of high-strength plastic material.

The number of flattening mechanisms 25 is multiple, and correspondingly, the number of supporting plates 253 is also multiple, and the multiple supporting plates 253 are respectively set to correspond to different areas on the back of the wafer 3, and different marking areas can be selected according to different marking areas. The supporting plate 253 is used to support the non-marking area. In this embodiment, there are two leveling mechanisms 25 and two supporting plates 253, which are in a semi-arc structure. The back of the wafer 3 is evenly divided into two parts, one of the support plates 253 corresponds to one half of the wafer 3 , and the other support plate 253 corresponds to the other half of the wafer 3 .

In this embodiment, the translation assembly 251 is a linear module arranged along the X-axis direction, and the translation assembly 251 includes a first sliding table 2511 configured to receive the Z-axis lifting part 252 . The Z-axis lifting part 252 is a linear module arranged along the Z-axis direction, and the Z-axis lifting part 252 includes a second sliding platform 2521 and a connecting frame 2522 fixed on the second sliding platform 2521 and connected to the supporting plate 253 . In other embodiments, the translation assembly 251 and the Z-axis lifting part 252 can also be driven by pneumatic means.

In one embodiment, as shown in FIG. 10 , the marking device 2 further includes an X-axis translation assembly 28 installed on the frame 26 , and the placing table 21 is placed on the X-axis translation assembly 28 . The X-axis translation assembly 28 can drive the placing table 21 to move along the X-axis direction to approach or move away from the transport device 6 , so as to facilitate the transport device 6 to pick and place the wafer 3 . The X-axis translation assembly 28 is a linear module arranged along the X-axis direction, and is arranged under one side of the placement platform 21. In order to ensure that the placement platform 21 is stably supported, the placement platform 21 is located on the opposite side of the X-axis translation assembly 28. One side is provided with a slide rail assembly 281 . In one embodiment, the translation component 251 is connected to the placement platform 21 so as to move synchronously with the placement platform 21 driven by the X-axis translation component 28 .

The marking device 2 also includes a Y-axis translation assembly 29 installed on the frame 26. The laser marking device 22 is installed on the Y-axis translation assembly 29. The Y-axis translation assembly 29 can drive the laser marking device 22 to move along the Y-axis direction, so that the laser marking device 22 can move along the Y-axis direction. The marking device 22 cooperates with the X-axis translation assembly 28 so that the marking head 223 is located directly under the wafer 3 . The Y-axis translation assembly 29 is a linear module arranged along the Y-axis direction, and the Y-axis translation assembly 29 is connected with a mounting plate 291 for accommodating the laser marking device 22 .

In one embodiment, as shown in FIG. 10 , FIG. 19 and FIG. 20 , the laser marking device 22 is located below the warpage adjustment device 23 . The laser marking device 22 includes a laser 221, an optical path structure 222 and a marking head 223. The optical path structure 222 is configured to adjust the laser beam emitted to the marking head 223 through the laser 221. The laser beam emitted by the laser 221 follows the optical path structure 222 and the marking head 223 in sequence Shot towards the backside of wafer 3.

The optical path structure 222 includes a fixed magnification beam expander 2221 and an adjustable magnification beam expander 2222 . The light emitted from the laser 221 enters the marking head 223 through the fixed magnification beam expander 2221 and the adjustable magnification beam expander 2222 in sequence. The fixed magnification beam expander 2221 can expand the diameter of the laser beam to reduce the divergence angle of the laser beam, so that the divergent light emitted by the laser 221 can be transformed into parallel light. The adjustable magnification beam expander 2222 includes three groups of lenses (not shown) on the same axis. The position of the middle group of lenses is fixed, and the front and rear groups of lenses can move along the axis. By adjusting the distance between the first two groups of lenses, the Magnification, adjust the distance between the two groups of lenses to adjust the divergence. By setting the adjustable magnification beam expander 2222 , the adjustable magnification beam expander 2222 can adjust the line width of the laser input to the marking head 223 to meet the requirements of wafers 3 of different sizes.

The marking head 223 can adjust the deflection of the laser beam, so that the light spot of the laser beam with a preset power density moves as required on the surface of the wafer 3 to be marked, thereby leaving a permanent mark on the surface of the wafer 3 . In this embodiment, the marking head 223 is specifically a galvanometer scanning marking head, including an X-axis scanning mirror (not shown), a Y-axis scanning mirror (not shown) and a focusing mirror 2231. The laser beam entering the marking head 223 After being incident on the X-axis scanning mirror and the Y-axis scanning mirror, it shoots out from the focusing mirror 2231. The reflection angle of the scanning mirror is controlled by the computer. The X-axis scanning mirror and the Y-axis scanning mirror can scan along the X and Y axes respectively, so as to achieve the laser beam deflection.

In one embodiment, the laser 221 , the fixed magnification beam expander 2221 , the adjustable magnification beam expander 2222 and the marking head 223 are fixed on the frame 26 and roughly arranged in a "back" shape, so that the laser marking device 22 Compact layout saves space.

In one embodiment, the optical path structure 222 further includes a plurality of reflecting mirrors for reflecting the laser beam, so that the laser beam is reflected to the fixed magnification beam expander 2221 , the adjustable magnification beam expander 2222 and the marking head 223 at a predetermined angle.

In this embodiment, the mirrors include a first mirror 2223 , a second mirror 2224 , a third mirror 2225 and a fourth mirror 2226 . The first reflector 2223 is located between the output end of the laser 221 and the input end of the fixed magnification beam expander 2221 , and the laser beam emitted from the laser 221 enters the fixed magnification beam expander 2221 through the first reflector 2223 . The first mirror 2223 and the laser beam emitted by the laser 221 are arranged at an incident angle of 45°.

The second reflector 2224 is located between the output end of the fixed magnification beam expander 2221 and the input end of the adjustable magnification beam expander 2222, and the laser beam emitted from the fixed magnification beam expander 2221 is injected into the adjustable magnification beam expander 2224 through the second reflector 2224. Magnification beam expander 2222. The second mirror 2224 is arranged at an incident angle of 45° with the laser beam emitted by the fixed magnification beam expander 2221 .

The third reflector 2225 and the fourth reflector 2226 are located between the adjustable magnification beam expander 2222 and the marking head 223, and the laser beam emitted from the adjustable magnification beam expander 2222 passes through the third reflector 2225 and the fourth reflector in turn 2226 shoots into marking head 223. The laser beams emitted by the third reflector 2225 and the adjustable magnification beam expander 2222 are arranged at an incident angle of 45°, and the laser beams emitted by the fourth reflector 2226 and the third reflector 2225 are arranged at an incident angle of 45°.

In one embodiment, the first reflector 2223, the second reflector 2224, the third reflector 2225 and the fourth reflector 2226 are respectively provided with an adjustment mount 2220, and the adjustment mount 2220 can adjust the position of the reflector , to prevent mirror deviation, so as to ensure that the laser beam emitted from the laser 221 can accurately enter the fixed magnification beam expander 2221 , the adjustable magnification beam expander 2222 and the marking head 223 . The adjustment mounting base 2220 is specifically a linear slide, which includes a base body 2227, an adjustment screw 2228 arranged below the base body 2227 along the X-axis or a Y-axis direction, and a knob 2229 connected to the adjustment screw 2228. By turning the knob 2229, it It can drive the adjustment screw 2228 to rotate, and then drive the base 2227 to move along the X-axis or the Y-axis.

In one embodiment, after the marking head 223 has been used for a period of time, the position of the marking head 223 inevitably has a deviation, so that the light spot projected by the laser beam on the wafer 3 has a deviation, which affects the marking accuracy. In order to avoid the above situation, the marking device 2 further includes a detection component configured to detect and compensate for the deviation of the marking head 223 .

The detection assembly includes a second positioning part 213 and an upper camera 2241 , the second positioning part 213 is fixed on the placement table 21 , and the upper camera 2241 is fixed on the mounting plate 291 through the first bracket 2243 . The upper camera 2241 is located above the placement table 21, and the lens of the upper camera 2241 faces the upper end surface of the placement table 21, so that after the transfer device 6 transports the wafer 3 onto the placement table 21, the lens of the upper camera 2241 faces The second side of wafer 3. By driving the X-axis translation assembly 28 and the Y-axis translation assembly 29, the second positioning part 213 is moved between the marking head 223 and the upper camera 2241, so as to prevent the laser beam emitted from the marking head 223 from directly hitting the lens of the upper camera 2241. The camera 2241 is configured to detect the deviation of the marking head 223 and adjust parameters to compensate for the deviation of the marking head 223 . In one embodiment, the second positioning portion 213 is made of transparent material and coated with white paint.

As shown in FIG. 11 and FIG. 16 , a through hole 212a is opened at the position corresponding to the second positioning part 213 on the placement platform 21 and the pressing substrate 241 above the placement platform 21, so that the upper camera 2241 can pass through the pressing substrate. The through hole 212 a at 241 detects the second positioning portion 213 , and the marking head 223 passes through the through hole 212 a at the placing table 21 to emit the laser beam to the second positioning portion 213 .

The detection process of the detection component is as follows:

The marking head 223 emits laser light to form a laser spot on the second positioning portion 213 . In one embodiment, the placing table 21 drives the second positioning part 213 to move between the upper camera 2241 and the marking head 223 , and the marking head 223 emits a laser beam and forms a laser spot on the second positioning part 213 . In this process, the laser spot is enlarged by computer vision, and the laser energy center is calculated by algorithm, so as to eliminate the position deviation caused by laser irregularity.

Get the center of gravity coordinates of the laser spot. Since the laser spot is very small, at the micron level, the laser center cannot be corrected visually under normal circumstances. Therefore, it is necessary to enlarge the laser spot through computer vision, and calculate the laser energy center according to the irregular outline and energy intensity of the laser spot. Take the laser energy center as the center of gravity coordinate point. The energy intensity can be converted and calculated by the brightness of the laser spot.

Adjust the parameters of the upper camera 2241 so that the center point of the field of view of the upper camera 2241 and the coordinate point of the center of gravity of the laser spot coincide. In one embodiment, after the marking head 223 has set the parameters, it emits a beam of laser light to the second positioning part 213 to form a light spot on the second positioning part 213, and the upper camera 2241 shoots the light spot to obtain a laser spot image. Adjust the parameters of the upper camera 2241 so that the center point of the field of view of the laser spot image captured by the upper camera 2241 coincides with the coordinate point of the center of gravity of the laser spot to realize camera compensation, that is, to realize the initial positioning of the laser energy center of the marking head 223, thereby ensuring marking Head 223 precision.

Referring to Figure 21, the specific principle is as follows: Assume that the lens center point of the upper camera 2241 is at the origin (0,0), and the laser energy center is at point O(X1, Y1), then the distance between the laser energy center and the center of view of the upper camera 2241 is at X The offset of the axis is X1, and the offset of the center of laser energy from the center of view of the upper camera 2241 on the Y axis is Y1; adjust the parameters of the upper camera 2241 to make the offset of the upper camera X=X1 on the X axis, so that The offset of the upper camera on the Y axis is Y=Y1; wherein, the parameters of the upper camera 2241 include at least one of a focal length parameter, an aperture center parameter and a distortion parameter. The small box in the upper right corner of the figure is the field of view of the upper camera 2241, and the irregular figure in the box is the laser spot imaging. With the center of the image as the origin, the center of gravity O(X1, Y1) of the laser spot is calculated according to the irregular profile and energy intensity of the spot, and the upper camera 2241 is compensated by adjusting the parameters of the upper camera 2241. In one embodiment , adjust the parameters through the offset function, that is, offset X=X1, offset Y=Y1, so that the center of the field of view of the upper camera 2241 and the center of gravity of the laser spot can coincide in the Z-axis direction.

10 and 19, the detection assembly also includes a first positioning part 212 and a lower camera 2242, the first positioning part 212 is fixed on the placement table 21, and the lower camera 2242 is fixed on the mounting plate 291 through the second bracket 2244 . The lower camera 2242 is located below the placement table 21, and the lens of the lower camera 2242 faces the lower end surface of the placement table 21, so that after the transfer device 6 transports the wafer 3 onto the placement table 21, the lens of the lower camera 2242 faces the wafer 3. First side of circle 3. The X-axis translation component 28 can drive the placement table 21 to move along the X-axis direction, and then drive the first positioning part 212 to move directly below the upper camera 2241 and directly above the lower camera 2242 to position and unify the upper camera 2241 and the lower camera. 2242 coordinate system, so as to determine the marking position of wafer 3.

The first positioning part 212 is made of a transparent material, specifically a glass sheet, and has a positioning point (not shown) in the center corresponding to the center of the upper camera 2241 and the lower camera 2242 .

As shown in FIG. 11 and FIG. 16 , a through hole 212a is also opened at the position corresponding to the first positioning part 212 on the placement table 21 and the pressing base plate 241 above the placement table 21, so that the upper camera 2241 can pass through the pressing board. The through hole 212 a at the substrate 241 detects the first positioning portion 212 , and the lower camera 2242 detects the first positioning portion 212 through the through hole 212 a at the placing table 21 .

During detection, move the placement table 21 so that the projection of the center of the lens of the lower camera 2242 and the center of the first positioning part 212 in the Z-axis direction coincides to complete a positioning; then control the lower camera 2242 to take pictures of the placement table 21 , to obtain the first image, since the first positioning part 212 is made of a transparent material, and the center of the first positioning part 212 is provided with a positioning point, the positioning point of the first positioning part 212 is used as a reference to establish the first coordinates for the first image system; the placing platform 21 moves to the bottom of the upper camera 2241, so that the projection of the lens center of the upper camera 2241 and the center of the first positioning part 212 in the Z-axis direction coincides, and then the upper camera 2241 is controlled to take pictures of the placing platform 21, The second image is obtained, and the corresponding overlapping area between the second image and the first image is as large as possible; a second coordinate system is established for the second image, and the first image and/or the second image are adjusted according to the positioning point of the first positioning part 212. As for the coordinate system of the image, the two coordinate systems coincide, so as to realize the first coordinate system of the upper camera 2241 and the lower camera 2242 . After the coordinate system is unified, the front image of the wafer 3 captured by the upper camera 2241 and the image of the back of the wafer 3 captured by the lower camera 2242 can accurately obtain the position of the component or chip in the corresponding front image, and the marking head 223 Marking can be carried out at designated positions on the wafer 3, avoiding components or chips. In addition, since the placement table 21 needs to move back and forth between the position where the wafer 3 is loaded and unloaded and the position where the wafer 3 is marked, for example, before marking, the placement table 21 is displaced, resulting in a deviation in the position of the placement table 21 By moving the first positioning part 212 so that the lens centers of the upper camera 2241 and the lower camera 2242 coincide with the projection of the positioning point in the center of the first positioning part 212 in the vertical direction, it is also possible to ensure that the placement table 21 is located at the correct mark Location.

In one embodiment, the marking system also includes a controller (not shown in the figure), the controller is respectively connected to the loading device 1, the marking device 2, the handling device 6 and the turntable device 5, and the controller can be a programmable PLC controller , to write a program as needed to control the automatic operation of the loading device 1, the marking device 2, the conveying device 6, and the turntable device 5 and to adjust the marking accuracy of the marking device 2.

The working process of the marking system of the present application is as follows: the wafer cassette 112 is placed on at least one of the first wafer loading mechanism 11 and the second wafer loading mechanism 12 as required, and the corresponding size Put the pressing plate 242 and the positioning plate 211 into the pressing base plate 241 and the placing table 21 respectively;

When the marking system is turned on, the transport device 6 sucks the wafer 3 in the wafer cassette 112 and moves it to the turntable 51 of the turntable device 5 , and the turntable 51 drives the wafer 3 to rotate to position the wafer 3 .

After the positioning is completed, the X-axis translation assembly 28 drives the placement table 21 to move along the X-axis direction toward the transfer device 6, and the transfer device 6 moves the wafer 3 on the turntable 51 to the positioning disk 211 of the placement table 21, and at the same time The lifting assembly 243 of the pressing mechanism 24 drives the pressing base plate 241 to move along the Z-axis direction, and makes the pressing plate 242 on the pressing base plate 241 approach the positioning plate 211, and the edge of the wafer 3 is pressed against the positioning plate 211 and the positioning plate 211. The wafer 3 is fixed between the platens 242 .

The translation component 251 cooperates with the Z-axis lifting part 252 to move the supporting plate 253 to the non-marking area on the back of the wafer 3 to support the flattening of the wafer 3 .

The X-axis translation component 28 drives the placement table 21 to move along the X-axis direction, so that the first positioning part 212 reaches directly below the upper camera 2241 and directly above the lower camera 2242, so as to unify the coordinate system of the upper camera 2241 and the lower camera 2242, and determine Marking position for wafer 3.

The X-axis translation assembly 28 and the Y-axis translation assembly 29 cooperate to make the second positioning part 213 reach between the upper camera 2241 and the marking head 223, turn on the laser marking device 22, and the laser beam shoots to the upper camera 2241 through the marking head 223, and the upper camera 2241 according to The position deviation compensates the marking head 223 to ensure the position accuracy of the marking head 223 .

The X-axis translation assembly 28 cooperates with the Y-axis translation assembly 29 so that the wafer 3 is located directly under the marking head 223 , and the marking head 223 marks the area to be marked on the back of the wafer 3 .

In one embodiment, when the area to be marked on the wafer 3 covers the area corresponding to a plurality of pallets 253, the marking head 223 can first mark the unsupported area to be marked on the wafer 3, and wait for the marking of the area to be completed. Afterwards, the pallet 253 is moved to the marking area, and at the same time, the pallet 253 in other areas to be marked is moved away from the wafer 3 to continue marking the wafer 3 .

After the marking of the wafer 3 is completed, the placement table 21 moves toward the transport device 6, and the lifting assembly 243 of the pressing mechanism 24 drives the pressing substrate 241 to move along the Z-axis direction, and loosens the pressing plate 242 on the pressing substrate 241. The wafer 3 is opened, and the transport mechanism takes the marked wafer 3 away from the placement table 21 and puts it back into the wafer cassette 112 .

The above actions are repeated to realize continuous automatic marking of the wafer 3 .

In addition, the present application also provides a chip-scale wafer-level laser marking method, as shown in FIG. 22 , including the following steps:

In S1, the transport device 6 moves the wafer 3 to be marked from the loading device 1 to the placement table 21 of the marking device 2;

In S2, the pressing mechanism 24 is moved toward the placement table 21 to press and fix the wafer 3, while the flattening mechanism 25 moves toward the wafer 3 and supports the non-marking area of the wafer 3;

In S3, drive the placement platform 21 to move, so that the placement platform 21 drives the first positioning part 212 located on the placement platform 21 to move to the upper camera 2241 and the lower camera 2242 respectively, and position and unify the positions of the upper camera 2241 and the lower camera 2242. a coordinate system to determine the marking position on wafer 3;

In S4, the laser marking device 22 is turned on, so that the marking head 223 of the laser marking device 22 shoots the laser beam to the upper camera 2241, and the upper camera 2241 detects the deviation of the marking head 223, and adjusts parameters according to the deviation to compensate the marking head 223;

In S5, the placement table 21 is driven to move, so that the wafer 3 to be marked is moved to the position directly above the marking head 223 of the laser marking device 22 with the placement table 21, and the marking head 223 is used to mark the wafer 3;

In S6 , after the marking is completed, the pressing mechanism 24 is used to release the wafer 3 , and the transfer device 6 moves the marked wafer 3 back into the loading device 1 ; the above actions are repeated to achieve continuous marking of the wafer 3 .

In one embodiment, before performing S1, according to the size of the wafer 3, the corresponding positioning plate 211 is selected to be installed on the placement table 21 to accommodate the wafer 3, and the corresponding platen 242 is selected to be installed on the pressing plate. mechanism 24 to press against the wafer 3 .

In one embodiment, when performing S1 , the transport device 6 first moves the wafer 3 to the turntable device 5 to position the wafer 3 , and the transport device 6 moves the positioned wafer 3 to the marking device 2 .

In one embodiment, before performing S4, the placement table 21 is moved, and the placement table 21 drives the second positioning part 213 located on it to reach between the upper camera 2241 and the marking head 223, so as to prevent the laser beam from directly hitting the upper camera 2241 .

The present application can realize the automatic handling and marking of the wafer by setting the loading device, the handling device 6 and the marking equipment, which greatly improves the production efficiency; The wafer is fixed and supported in the non-marking area of the wafer. The laser marking device can mark the marking area, which effectively avoids the bending and deformation of the wafer under the action of gravity and improves the marking accuracy of the wafer.

Claims

A chip-scale wafer-level marking system comprising:

loading device (1);

Marking equipment (2), comprising a placement table (21), a laser marking device (22) and a warpage adjustment device (23) arranged below the placement table (21), the placement table (21) is set There is a first avoidance hole (21a);

a handling device (6) arranged between said loading device (1) and said marking device (2);

Wherein, the warpage adjustment device (23) includes a pressing mechanism (24) and a flattening mechanism (25); the pressing mechanism (24) can move toward the first side of the placing table (21); the The leveling mechanism (25) can move towards the second side of the placement table (21);

Wherein, the first side of the placement platform (21) is opposite to the second side of the placement platform (21).
The chip-scale wafer-level marking system according to claim 1, wherein: the pressing mechanism (24) is arranged on the placement table (21), and the pressing mechanism (24) comprises:

compressing the substrate (241); and

The lifting assembly (243) is in transmission connection with the pressing substrate (241), and the lifting assembly (243) drives the pressing substrate (241) to approach or move away from the placing table (21) along the Z-axis direction.
The chip-scale wafer-level marking system according to claim 2, wherein: the pressing mechanism (24) further comprises a pressure plate (242) detachably mounted on the pressing substrate (241), the pressing A second avoidance hole (241a) concentric with the first avoidance hole (21a) is opened on the tight base plate (241), the pressure plate (242) can pass through the second avoidance hole (241a), and Move toward the first side of the placing table (21).
The chip-scale wafer-level marking system according to claim 2, wherein: the placing table (21) is provided with a positioning plate (211), and the positioning plate (211) is provided with a through hole (211a).
The chip-scale wafer-level marking system according to claim 1, wherein: the flattening mechanism (25) is arranged on the placement table (21), and the flattening mechanism (25) comprises:

A translation assembly (251), placed under the placing table (21);

The Z-axis lifting part (252) is installed on the translation assembly (251); and

A supporting plate (253), fixed on the Z-axis lifting part (252);

Wherein, the translation assembly (251) can drive the Z-axis lifting part (252) and the support plate (253) to approach the wafer (3) along the X-axis direction, and the Z-axis lifting part (252) The supporting plate (253) can be driven to move along the Z-axis direction.
The chip-scale wafer-level marking system according to claim 1, wherein: the marking device (2) further comprises:

The X-axis translation assembly (28), the placement table (21) is placed on the X-axis translation assembly (28), and the X-axis translation assembly (28) is set to drive the placement table (21) along the Move in the X-axis direction; and

The Y-axis translation assembly (29), the laser marking device (22) is placed on the Y-axis translation assembly (29), and the Y-axis translation assembly (29) can drive the laser marking device (22) along the Y axis Axis direction movement.
The chip-scale wafer-level marking system according to claim 6, wherein: the laser marking device (22) comprises:

laser (221);

An optical path structure (222), including a fixed magnification beam expander (2221) and an adjustable magnification beam expander (2222); and

markhead(223);

Wherein, the laser beam emitted by the laser (221) is directed to the second side of the placing table (21) along the optical path structure (222) and the marking head (223) in sequence.
The chip-scale wafer-level marking system according to claim 7, wherein: the marking device (2) further comprises a detection component, and the detection component comprises:

The second positioning part (213) is fixed on the placement table (21), and

The upper camera (2241) is relatively fixed to the marking head (223), and the lens of the upper camera (2241) corresponds to the marking head (223);

Wherein, the second positioning part (213) is set to move with the placement table (21) and placed between the upper camera (2241) and the marking head (223), the upper camera (2241 ) is arranged to detect the deviation of the marking head (223) and adjust parameters, thereby compensating for the deviation of the marking head (223).
The chip-scale wafer-level marking system according to claim 8, wherein: the detection component further comprises:

The lower camera (2242) is relatively fixed to the upper camera (2241), the lens of the upper camera (2241) faces the first side of the placement table (21), and the lens of the lower camera (2241) faces the second side of the wafer (3); and

The first positioning part (212) is arranged on the placement platform (21);

Wherein, the placement table (21) is set to drive the first positioning part (212) to move directly above the lower camera (2242) and directly below the upper camera (2241), so as to position and unify all Coordinate systems of the upper camera (2241) and the lower camera (2242).
The chip-scale wafer-level marking system according to claim 1, wherein: the loading device (1) comprises at least one of a first wafer loading mechanism (11) and a second wafer loading mechanism (12).
The chip-scale wafer-level marking system according to claim 10, wherein: the first wafer loading mechanism (11) comprises a first stage (111), a A wafer box (112) and a protective cover (113), the protective cover (113) is arranged to surround the periphery of the wafer box (112), and the protective cover (113) can be opposite to the first carrier The stage (111) moves to approach or move away from the pod (112).
A chip-scale wafer-level laser marking method comprising:

Make the handling device (6) move the wafer (3) to be marked from the loading device (1) to the placement table (21) of the marking device (2);

The pressing mechanism (24) is moved toward the placement table (21) to press and fix the wafer (3), and at the same time, the flattening mechanism (25) is moved toward the wafer (3) to support the wafer (3). the non-marking area of the wafer (3);

Drive the placement platform (21) to move, so that the placement platform (21) drives the first positioning part (212) on the placement platform (21) to move to the upper camera (2241) and the lower camera ( 2242), to locate and unify the coordinate systems of the upper camera (2241) and the lower camera (2242), and determine the marking position of the wafer (3);

Turn on the laser marking device (22), so that the marking head (223) of the laser marking device (22) shoots the laser beam to the upper camera (2241), and the upper camera (2241) detects the marking head (223 ), and adjust parameters according to the deviation to compensate the marking head (223);

Drive the placement table (21) to move, and after the wafer (3) to be marked moves to the position directly above the marking head (223) with the placement table (21), the marking The head (223) marks the marking area of the wafer (3);

After the marking is completed, the pressing mechanism (24) is used to release the wafer (3), and the handling device (6) is used to move the marked wafer (3) back to the loading device ( 1); and

The above actions are repeated to achieve continuous marking of the wafer (3).
The laser marking method according to claim 12, wherein: before starting the laser marking device (22), the placing table (21) is moved, and the placing table (21) drives the ) on the second positioning part (213) reaches between the upper camera (2241) and the marking head (223).