CN216966645U

CN216966645U - Laser marking apparatus

Info

Publication number: CN216966645U
Application number: CN202122676766.XU
Authority: CN
Inventors: 韩德; 徐宁; 袁铁青; 刘航; 张念; 李慧
Original assignee: Shenzhen Tete Laser Technology Co Ltd
Current assignee: Shenzhen Tete Laser Technology Co Ltd
Priority date: 2021-11-03
Filing date: 2021-11-03
Publication date: 2022-07-15
Anticipated expiration: 2031-11-03

Abstract

The utility model discloses laser marking equipment which comprises a transfer platform, a lifting arm, a processing assembly, a CCD positioning camera and a control assembly, wherein the transfer platform is provided with a plurality of positioning holes; through set up a plurality of tools on transporting the platform, the top of transporting the platform sets up processing platform and processing subassembly, set up the jacking subassembly below transporting the platform, the work piece rotates to processing subassembly along with the carousel under, the jacking subassembly is with the work piece along with tool jacking to processing platform, CCD camera acquires the real-time image information of work piece simultaneously, control module is based on real-time image information, obtain the positional information of the below work piece, and finely tune laser mark's mirror that shakes skew angle according to above-mentioned positional information, with the deviation between the real-time position of compensation work piece and the settlement position. Carry out mark processing and rough sweep and sweep light processing with the essence afterwards, the work piece falls to the carousel along with the jacking subassembly back afterwards, and the carousel rotates and shifts the work piece of accomplishing the mark, and machining efficiency and processingquality promote greatly.

Description

Laser marking apparatus

Technical Field

The utility model belongs to the technical field of laser processing, and particularly relates to laser marking equipment.

Background

With the popularization of smart phones, the improvement and innovation of the functions of the smart phones gradually enter a minimally invasive new era, customers are more and more inclined to use products with good experience, and the excellent performance of the zirconia ceramic material is expected to become a main mobile phone backboard material in the future. The ceramic material has the characteristics of beautiful glass appearance, no signal shielding, high hardness and the like, and meanwhile, the heat dissipation performance of the ceramic material is close to that of metal, so that the ceramic material is more and more widely applied to the mobile phone back plate.

The existing ceramic processing means can be classified into a mechanical processing method, an electric spark processing method, an ultrasonic processing method and the like according to different processing principles. The machining process has the common problem that the ceramic material is easy to break, and cannot meet the processing requirements of fixed point, complex structure and high precision. Pollutants such as gas, material scraps, carbon black and the like are continuously generated in the electric spark machining process, are difficult to discharge, and easily cause adverse effects on the machining efficiency, the machining result and the environment. Ultrasonic machining is slow, requires different abrasives for different materials, and wears more heavily on the tool. The above methods cannot meet the requirements for processing the zirconia ceramic surface.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide laser marking equipment which can realize high-quality marking processing on the surface of zirconia ceramics.

To solve the above technical problem, the present invention is achieved by providing a laser marking apparatus comprising:

the transfer platform comprises a turntable and a plurality of jigs arranged on the turntable, and the jigs are used for mounting workpieces and are symmetrically arranged;

the lifting arm is arranged on one side of the turntable;

the processing assembly comprises a laser generator and a lens assembly which are arranged on the lifting arm and positioned above the turntable;

the CCD positioning camera is arranged above the turntable and used for carrying out coordinate positioning on the surface of the zirconia ceramics;

and the control assembly is electrically connected with the transfer platform, the lifting arm, the processing assembly and the CCD positioning camera respectively.

In one embodiment, the lens assembly includes a galvanometer assembly and a field lens sequentially arranged along the optical path direction; the galvanometer component is used for controlling the laser beam to deflect, and the field lens is used for focusing the laser beam on a workpiece.

In one embodiment, the galvanometer assembly includes a first galvanometer that deflects a focal point of the laser beam in a first plane and a second galvanometer that deflects the laser beam in a second plane, the second plane being perpendicular to the first plane.

In one embodiment, the galvanometer assembly and the field lens are arranged horizontally; the lens assembly further comprises a reflector arranged on one side of the field lens, and the laser beam is vertically reflected downwards through the reflector; the CCD positioning camera is positioned above the reflective mirror.

In an embodiment, the laser marking apparatus further comprises: the processing platform is arranged between the turntable and the processing assembly, and a through hole for laser to pass through is formed in the processing platform;

the jacking assembly is used for jacking the workpiece from the turntable to a processing platform;

and the power measuring assembly comprises a driving piece arranged on the processing platform and a testing piece arranged on the driving piece.

In one embodiment, the laser marking device further comprises a suction member disposed at the periphery of the through hole and a suction pump communicated with the suction member.

In an embodiment, the laser marking device comprises two sets of processing assemblies arranged side by side, and four jigs are arranged on the turntable.

The marking process is divided into three steps, the surface of a workpiece is roughly machined by high-power laser, the outline of a first mark is mainly machined, the inner area of the first mark is subjected to preliminary material removal according to a filling line, and the first mark is subjected to rough machining. The laser power of the step is the highest, and the processing depth is the deepest. Due to the larger spacing between the filling lines, material is not cut away in the areas between the filling lines, thereby forming higher protrusions and the machined surface of the first marking is rougher. And carrying out rough scanning light treatment on the first mark by using low-power laser, removing a rough part in the first mark, and obtaining a second mark after rough scanning light, wherein the roughness in the second mark is further reduced. And then, carrying out fine scanning light treatment, wherein the interval of the filling lines in the treatment is far smaller than that of the coarse scanning light, the laser power is the lowest, and fine rough inside the second mark can be further scanned, so that the height difference between the lowest point and the highest point inside the second mark is further reduced, and the mirror surface effect is finally achieved. Compared with the existing processing method, the fineness and the smoothness of the zirconia ceramic surface mark are further improved, and the cost is lower compared with picosecond laser processing.

According to the utility model, a plurality of jigs are arranged on the transfer platform, the processing platform and the processing assembly are arranged above the transfer platform, the jacking assembly is arranged below the transfer platform, the workpiece rotates to the position right below the processing assembly along with the turntable, the workpiece is jacked to the processing platform along with the jigs by the jacking assembly, meanwhile, the CCD camera acquires real-time image information of the workpiece, the control module acquires position information of the workpiece below based on the real-time image information, and fine adjustment is carried out on the deflection angle of the galvanometer marked by the laser according to the position information so as to compensate the deviation between the real-time position and the set position of the workpiece. And then, the workpiece is subjected to marking treatment and rough sweeping and fine sweeping treatment, then the workpiece falls back to the turntable along with the jacking assembly, the turntable rotates to transfer the marked workpiece, and the processing efficiency and the processing quality are greatly improved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

FIG. 1 is a flow chart of one embodiment of a method for laser marking a zirconia ceramic;

FIG. 2 is a schematic structural diagram of a laser marking apparatus according to an embodiment of the present invention;

FIG. 3 is a schematic structural diagram of the transfer platform in the embodiment of FIG. 2;

FIG. 4 is a schematic structural view of the processing assembly and the CCD positioning camera in the embodiment of FIG. 2;

fig. 5 is a schematic structural diagram of the jacking assembly and the jig in the embodiment of fig. 2.

The reference numbers illustrate:

the objects, features and advantages of the present invention will be further explained with reference to the accompanying drawings.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the utility model and are not intended to limit the utility model.

The utility model provides a laser marking method of zirconia ceramics, which comprises the following steps with reference to fig. 1: s10, according to the first setting information, carrying out laser marking on a setting area on the surface of the workpiece, and forming a first mark; s20, according to second setting information, carrying out rough light scanning processing on the first mark and forming a second mark; and S30, performing fine scanning light processing on the second mark according to third setting information, and forming a third mark.

The marking process is divided into three steps, the surface of a workpiece is roughly machined by high-power laser, the outline of a first mark is mainly machined, the inner area of the first mark is subjected to preliminary material removal according to a filling line, and the first mark is subjected to rough machining. The laser power of the step is the highest, and the processing depth is the deepest. Due to the larger spacing between the filling lines, material is not cut away in the areas between the filling lines, thereby forming higher protrusions and the machined surface of the first marking is rougher. And carrying out rough scanning light treatment on the first mark by using low-power laser, removing a rough part in the first mark, and obtaining a second mark after rough scanning light, wherein the roughness in the second mark is further reduced. And then, carrying out fine scanning light treatment, wherein the interval of the filling lines in the treatment is far smaller than that of the coarse scanning light, the laser power is the lowest, and fine rough inside the second mark can be further scanned, so that the height difference between the lowest point and the highest point on the micro-level inside the second mark is further reduced, and the mirror surface effect is finally achieved. Compared with the existing processing method, the fineness and the smoothness of the zirconia ceramic surface mark are further improved, and the cost is lower compared with picosecond laser processing.

In one embodiment, the first setting information includes: the laser power is 1W-1.5W, the laser frequency is 300KHZ, the scanning speed is 1000mm/s, the space between filling lines is 0.01mm, and the angles of the filling lines are 0 degree and 90 degree. The workpiece surface is marked by using a laser of higher power, the maximum depth of the first mark being 5.0-5.2 μm. The second setting information includes: the laser power is 0.5W-1W, the laser frequency is 400KHZ, the scanning speed is 50mm/s, the space between filling lines is 0.02mm, and the angle of the filling lines is 0 degree. After the first scanning, the height difference between the peaks and the valleys in the second mark is 1.9-2.0 μm. The finish of the second mark is further improved. The third setting information includes: the laser power is 0.25W-0.5W, the laser frequency is 400KHZ, the scanning speed is 50mm/s, the space between filling lines is 0.008mm, and the angle of the filling lines is 90 degrees. After the second scanning, the height difference between the peaks and the valleys in the third mark is 1.2-1.3 μm. The smoothness of the second mark is further improved, and the mirror surface effect is achieved.

In one embodiment, the zirconia ceramic is a black zirconia ceramic or a white zirconia ceramic. The wavelength of the laser is 355nm, and the pulse width is 10-20 ns. Compared with the existing picosecond laser with the wavelength of 535nm, the equipment cost related to the scheme is lower.

The present invention also provides a laser marking apparatus for performing the above-described zirconia ceramic laser marking method, including, with reference to fig. 1 to 5: a transfer platform, a lifting arm 90, a processing assembly 30, a CCD positioning camera 40 and a control assembly. The transferring platform comprises a rotating disc 11 and a plurality of jigs 13 arranged on the rotating disc 11, the rotating disc 11 is driven to rotate by a transferring motor 12, and the jigs 13 are used for installing workpieces and are symmetrically arranged; the lifting arm 90 sets up one side of carousel 11, including the mounting bracket and gliding slider about on the mounting bracket, set up the lead screw between slider and the mounting bracket, the lead screw rotates and drives the slider lift, is provided with the hand (hold) wheel on the top of lead screw, and through rotating the height of hand (hold) wheel with adjust the slider, the processing subassembly then sets up on the slider. The sliding block can also be driven to automatically slide by arranging a driving motor connected with the screw rod. The processing assembly 30 comprises a laser generator 31 and a lens assembly which are arranged on the lifting arm 90 and are positioned above the turntable 11; the CCD positioning camera 40 is arranged above the turntable 11 and is used for carrying out coordinate positioning on the surface of the zirconia ceramics; the control assembly is electrically connected to the transfer platform, the lifting arm 90, the processing assembly 30 and the CCD positioning camera 40, respectively. Can go up unloading processing to the tool 13 that finishes processing in the course of working through setting up rotary platform, further promote machining efficiency. The lift arm 90 is used to control the lifting of the processing assembly 30 to accommodate workpieces at different height positions. Set up CCD camera and conveniently carry out the position deviation that produces when accurate location in order to compensate carousel 11 rotation to the work piece to and the position deviation that the installation clearance between work piece and the tool leads to.

In an embodiment, referring to fig. 2 to 5, the lens assembly includes a galvanometer assembly 32 and a field lens 33 sequentially arranged along an optical path direction; the galvanometer assembly 32 is used for controlling the deflection of the laser beam, and the field lens 33 is used for focusing the laser beam on a workpiece.

The lens assembly also includes a beam expander, which is a lens assembly capable of changing the diameter and divergence angle of the laser beam. The laser beam emitted from the laser has a certain divergence angle, and for laser processing, only when the laser beam is changed into a collimated beam through the adjustment of the beam expander, a focusing lens can be utilized to obtain fine high-power-density light spots, and the beam diameter can be changed through the beam expander so as to be used for different optical instrument devices.

The laser beam is controlled to deflect by the vibrating mirror assembly 32, so that the focus of the laser beam can realize rapid cutting on one surface of a workpiece, the laser beam has a certain focal depth, the laser beam is reflected by the vibrating mirror assembly 32 and then passes through the field lens 33 to be projected on the surface of the workpiece, and even if the distance between the field lens 33 and a projection point is changed due to the deviation of the laser beam, the projection point is still in the focal depth range, and the cutting effect cannot be influenced.

In one embodiment, referring to fig. 2-5, the galvanometer assembly 32 includes a first galvanometer 32a that deflects the focal point of the laser beam in a first plane, and a second galvanometer 32b that deflects the laser beam in a second plane, the second plane being perpendicular to the first plane. In this embodiment, the surface of the workpiece is a projection plane, and the first plane, the second plane and the surface of the workpiece are perpendicular to each other to form a coordinate system. The first galvanometer 32a controls the light spot to move on the surface of the workpiece along the X-axis direction, and the second galvanometer 32b controls the light spot to move on the surface of the workpiece along the Y-axis direction, so that the control of the coordinates of the light spot on the surface of the workpiece is realized. A common single-chip convex lens only forms a circular focusing light spot when light vertically passes through the center. When the light rays are obliquely incident into the light rays of the common single-chip convex lens, the light rays are not coaxially incident. The focused spot must then be deformed. More importantly, the focal point of the light rays is not in the focal plane when the light rays are perpendicular. The focal length changes with the focal position as the deflection angle changes. When the galvanometer scans, light rays are obliquely incident, and if a common lens is adopted, the focal point cannot be maintained in a plane, so that the galvanometer scanning galvanometer cannot work. When the flat field lens 33 is used, a flat field image plane can be obtained, and curvature of field and distortion of the system can be compensated in terms of aberration correction.

In an embodiment, referring to fig. 2 to 5, the lens assembly further includes a reflective mirror disposed at one side of the field lens 33, through which the laser beam is reflected vertically downward; the CCD positioning camera 40 is positioned above the mirror and is arranged coaxially with the laser beam. In this embodiment, the mirror reflects the horizontally irradiated laser beam vertically downward to the surface of the workpiece, and the CCD positioning camera 40 captures the light from bottom to top that passes through the mirror. In order to enhance the lower workpiece image obtained by the CCD positioning camera 40, a light supplement lamp 41 may be further disposed on the processing platform 20 to enhance the brightness of the image information, so as to improve the positioning accuracy.

In an embodiment, referring to fig. 2 to 5, the laser marking apparatus further includes: processing platform 20, jacking subassembly, brake subassembly and power measurement subassembly. The processing platform 20 is arranged between the turntable 11 and the processing assembly 30, and a through hole for laser to pass through is formed in the processing platform 20; the jacking assembly is used for jacking the workpiece from the turntable 11 to the processing platform 20; the power measuring assembly comprises a drive member arranged on the processing platform 20 and a test piece arranged on the drive member. Because other components are required to be arranged on the working platform, and a certain distance exists between the working platform and the rotary table 11, when the distance between the rotary table 11 and the processing component 30 is greater than the focal depth of the laser, the jacking component is required to jack the jig 13 and the workpiece therein to the through hole of the processing platform 20, so that the processing surface of the workpiece is positioned in the focal depth of the laser. Specifically, the lower part of the rotating disc 11 is provided with a jacking assembly, and the jacking assembly is positioned below the through hole. The turntable 11 is provided with a positioning pin, the jig 13 is provided with a positioning hole 13a matched with the positioning pin, the turntable 11 is further provided with a material pushing hole, and the material pushing hole corresponds to the mounting position of the jig 13.

Jacking assembly includes jacking cylinder 61, and the one end of jacking cylinder 61's push rod is provided with the docking mechanism who docks with tool 13, and this department docking mechanism is including setting up the butt joint hole 13b at tool 13 lower surface to and set up the butt joint arch 62 on the push rod. When the sensor detects that the jig 13 moves to the position below the jacking assembly, the rotary table 11 stops rotating, the brake assembly is in butt joint with the notch 14 arranged on the periphery of the rotary table 11, and brake positioning of the rotary table 11 is achieved. The brake assembly comprises a brake cylinder 51 arranged on one side of the turntable 11, and a brake piece 52 arranged on a push rod of the brake cylinder 51, wherein the brake piece 52 is butted with the notch 14. And a push rod of the jacking cylinder 61 moves upwards, passes through the material pushing hole and is in butt joint with the jig 13, and then the workpiece and the jig 13 are continuously jacked to the through hole.

In an embodiment, referring to fig. 2 to 5, the laser marking apparatus further includes an air suction member 81 disposed at an outer periphery of the through hole and a getter pump communicating with the air suction member 81. In this embodiment, the air-extracting member 81 is a cavity with a central opening, and is communicated with the getter pump at one end of the cavity. The opening of the cavity is provided with a circular side wall, the upper end and the lower end of the circular side wall are respectively connected with the upper arm and the lower arm of the cavity, and the circular side wall is provided with an air suction hole. The openings of the air-extracting member 81 correspond to the through-holes. During laser marking, the generated dust and other micro-particles can be extracted from the suction holes.

In this embodiment, the power measurement assembly includes a power meter probe 72 disposed above the processing platform 20 and a driving cylinder 71 for driving the power meter probe 72 to move horizontally, the driving cylinder 71 is disposed on the processing platform 20, a push rod thereof is located at one side above the air pumping member 81, the power meter probe 72 is disposed on the push rod of the driving cylinder 71, when the output laser power needs to be detected, the push rod of the driving cylinder 71 is pushed out horizontally, and the power meter probe 72 is pushed above the through hole, so as to detect the laser power subsequently.

In an embodiment, referring to fig. 2 to 5, the laser marking apparatus includes two sets of processing assemblies 30 arranged side by side, four jigs 13 are arranged on the rotary table 11, the two sets of processing assemblies 30 correspond to any adjacent two of the four jigs 13 symmetrically arranged below, and when the rotary table 11 rotates 180 degrees, an unprocessed workpiece is correspondingly sent to below the two processing assemblies 30, and a processed workpiece is simultaneously sent to the workpiece taking platform.

In the specific operation process, a workpiece is firstly placed into the jig 13, the workpiece rotates to the position under the processing assembly 30 along with the rotary table 11, the workpiece is jacked to the processing platform 20 along with the jig 13 by the jacking assembly, meanwhile, the CCD camera obtains real-time image information of the workpiece, the control module obtains position information of the workpiece at the lower part based on the real-time image information, and fine adjustment is carried out on the deflection angle of the vibrating mirror marked by the laser according to the position information so as to compensate the deviation between the real-time position and the set position of the workpiece. And then, the marking treatment and the rough sweeping and fine sweeping treatment are carried out, then, the workpiece falls back to the turntable 11 along with the jacking assembly, the turntable 11 rotates to transfer the workpiece with the mark, and the processing efficiency is greatly improved.

And editing corresponding PLT (product design language) picture files on CAD (computer-aided design) or Coreldraw drawing software, importing the PLT picture files into the control assembly, storing parameter information in the three marking steps in the control module, and calling the information by the control module to complete laser marking of the workpiece.

The above description is only an alternative embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents of the technical solutions of the present invention that are made by using the contents of the specification and the drawings or directly/indirectly applied to other related technical fields are included in the scope of the present invention.

Claims

1. A laser marking apparatus, comprising:

the lifting arm is arranged on one side of the turntable;

the CCD positioning camera is arranged above the turntable and used for carrying out coordinate positioning on the surface of the workpiece;

the control assembly is electrically connected with the transfer platform, the lifting arm, the processing assembly and the CCD positioning camera respectively;

and the brake assembly is used for braking and positioning the turntable.

2. The laser marking apparatus according to claim 1, wherein the lens assembly includes a galvanometer assembly and a field lens arranged in this order along the optical path direction; the galvanometer component is used for controlling the deflection of the laser beam emitted by the laser generator, and the field lens is used for focusing the laser beam on a workpiece.

3. The laser marking apparatus of claim 2, wherein the galvanometer assembly includes a first galvanometer that deflects a focal point of the laser beam in a first plane and a second galvanometer that deflects the laser beam in a second plane, the second plane being perpendicular to the first plane.

4. The laser marking apparatus according to claim 3, wherein the galvanometer assembly and the field lens are arranged horizontally; the lens assembly further comprises a reflector arranged on one side of the field lens, and the laser beam is vertically reflected downwards through the reflector; the CCD positioning camera is positioned above the reflective mirror.

5. The laser marking apparatus according to claim 3, further comprising:

the processing platform is arranged between the turntable and the processing assembly, and a through hole for laser to pass through is formed in the processing platform;

6. The laser marking apparatus according to claim 5, further comprising a suction member provided at an outer periphery of the through hole and a suction pump communicating with the suction member.

7. The laser marking apparatus according to claim 1, wherein the laser marking apparatus comprises two sets of processing assemblies arranged side by side, and four jigs are arranged on the turntable.

8. The laser marking apparatus according to claim 1, wherein the laser has a wavelength of 355nm and a pulse width of 10-20 ns.