TWM608734U - Mobile device with heat dissipation module - Google Patents

Mobile device with heat dissipation module Download PDF

Info

Publication number
TWM608734U
TWM608734U TW109216138U TW109216138U TWM608734U TW M608734 U TWM608734 U TW M608734U TW 109216138 U TW109216138 U TW 109216138U TW 109216138 U TW109216138 U TW 109216138U TW M608734 U TWM608734 U TW M608734U
Authority
TW
Taiwan
Prior art keywords
heat dissipation
mobile device
dissipation module
base
heat
Prior art date
Application number
TW109216138U
Other languages
Chinese (zh)
Inventor
陳志賢
陳俞
錢鵬仲
Original Assignee
志合訊息股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 志合訊息股份有限公司 filed Critical 志合訊息股份有限公司
Priority to TW109216138U priority Critical patent/TWM608734U/en
Publication of TWM608734U publication Critical patent/TWM608734U/en

Links

Images

Abstract

本創作係關於一種具有散熱模組的行動裝置,此行動裝置包括一本體及一散熱模組,本體包含一底座,底座內部具有一內壁面,內壁面凹設有一凹陷槽;散熱模組包含一熱管及一散熱鰭片組,熱管的其一部分嵌設於凹陷槽,散熱鰭片組貼附於熱管且對應凹陷槽設置。藉此,熱管與散熱鰭片組堆疊的厚度部分嵌設在底座內部,使行動裝置維持體積輕薄之優點。This creation is about a mobile device with a heat dissipation module. The mobile device includes a main body and a heat dissipation module. The main body includes a base. The base has an inner wall and a recessed groove on the inner wall. The heat dissipation module includes a The heat pipe and a heat dissipation fin group, a part of the heat pipe is embedded in the concave groove, and the heat dissipation fin group is attached to the heat pipe and arranged corresponding to the concave groove. Thereby, the thickness of the stack of heat pipe and heat dissipation fin set is partially embedded in the base, so that the mobile device maintains the advantages of lightness and thinness.

Description

具有散熱模組的行動裝置Mobile device with heat dissipation module

本創作是有關於一種散熱結構,且特別是有關於一種具有散熱模組的行動裝置。This creation is about a heat dissipation structure, and especially about a mobile device with a heat dissipation module.

現在筆記型電腦、平板、手機等行動裝置具備更多功能,使行動裝置內的運算單元數量更多及效能發揮更大,造成運算單元運作時會產生大量熱量,因此行動裝置內部會安裝散熱結構,進而透過散熱結構將熱量導引至行動裝置外部。Now mobile devices such as laptops, tablets, and mobile phones have more functions, so that the number of computing units in the mobile device is greater and the performance is greater. As a result, a large amount of heat is generated when the computing unit is in operation. Therefore, a heat dissipation structure is installed inside the mobile device. , And then guide the heat to the outside of the mobile device through the heat dissipation structure.

然而,隨著行動裝置追求整體外型輕薄短小,使得行動裝置內部的空間也會跟隨縮減,故如何在有限的空間中有效地配置熱管、散熱鰭片及風扇等散熱元件,並同時提供足夠的散熱效率,即為業界積極研究的重點。However, as the overall appearance of mobile devices is light, thin and short, the space inside the mobile device will also be reduced. Therefore, how to effectively configure heat pipes, fins, fans and other heat dissipation components in a limited space while providing sufficient Heat dissipation efficiency is the focus of active research in the industry.

有鑑於此,本創作人遂針對上述現有技術,特潛心研究並配合學理的運用,盡力解決上述之問題點,即成為本創作人改良之目標。In view of this, the creator has focused on the above-mentioned existing technology, specially researched and cooperated with the application of academic theory, and tried his best to solve the above problems, which became the goal of the creator's improvement.

本創作提供一種具有散熱模組的行動裝置,其係利用熱管與散熱鰭片組堆疊的厚度部分嵌設在底座內部,使行動裝置維持體積輕薄之優點。This invention provides a mobile device with a heat dissipation module, which uses the thickness of the heat pipe and the heat dissipation fin group to be partially embedded in the base, so that the mobile device maintains the advantages of lightness and thinness.

於本創作實施例中,本創作係提供一種具有散熱模組的行動裝置,包括:一本體,包含一底座,該底座內部具有一內壁面,該內壁面凹設有至少一凹陷槽;以及一散熱模組,包含至少一熱管及至少一散熱鰭片組,該熱管的其一部分嵌設於該凹陷槽,該散熱鰭片組貼附於該熱管且對應該凹陷槽設置。In this creative embodiment, this creative system provides a mobile device with a heat dissipation module, including: a body including a base, the base has an inner wall surface, and the inner wall surface is recessed with at least one recessed groove; and a The heat dissipation module includes at least one heat pipe and at least one heat dissipation fin group, a part of the heat pipe is embedded in the concave groove, and the heat dissipation fin group is attached to the heat pipe and arranged corresponding to the concave groove.

基於上述,底座的內壁面凹設有凹陷槽,熱管的其一部分嵌設於凹陷槽,散熱鰭片組貼附於熱管且對應凹陷槽設置,使熱管與散熱鰭片組堆疊的厚度部分嵌設在底座內部,讓本體的內部空間更有效地配置熱管、散熱鰭片組及風扇等散熱元件,以達到行動裝置同時具有體積輕薄短小及散熱效率良好之功效。Based on the above, the inner wall surface of the base is recessed with a recessed groove, a part of the heat pipe is embedded in the recessed groove, and the heat dissipation fin set is attached to the heat pipe and arranged corresponding to the recessed groove, so that the thickness of the stack of the heat pipe and the heat dissipation fin set is partially embedded Inside the base, the internal space of the main body is more effectively configured with heat pipes, fin sets, fans and other heat-dissipating elements, so that the mobile device has the advantages of lightness, thinness, and small size and good heat dissipation efficiency.

基於上述,底座的外壁面凸伸有凸塊,凹陷槽設置在凸塊的內部,且凸塊的表面貼附有腳墊片,即熱管的其一部分嵌設於底座的支腳內部,使熱管更有效率地藏收在本體的內部空間。Based on the above, the outer wall surface of the base protrudes with a convex block, the recessed groove is arranged inside the convex block, and the surface of the convex block is attached with a foot pad, that is, a part of the heat pipe is embedded in the foot of the base to make the heat pipe It is more efficiently hidden in the internal space of the body.

有關本創作之詳細說明及技術內容,將配合圖式說明如下,然而所附圖式僅作為說明用途,並非用於侷限本創作。The detailed description and technical content of this creation will be explained as follows with the drawings. However, the attached drawings are only for illustrative purposes and are not used to limit this creation.

請參考圖1至圖5所示,本創作係提供一種具有散熱模組的行動裝置,此行動裝置10主要包括一本體1及一散熱模組2。Please refer to FIG. 1 to FIG. 5. The author provides a mobile device with a heat dissipation module. The mobile device 10 mainly includes a main body 1 and a heat dissipation module 2.

如圖1、圖3至圖5所示,本體1包含一底座11、一蓋板12及一發熱元件13,蓋板12罩蓋於底座11,發熱元件13容置於底座11。As shown in FIGS. 1 and 3 to 5, the main body 1 includes a base 11, a cover plate 12 and a heating element 13. The cover plate 12 covers the base 11, and the heating element 13 is accommodated in the base 11.

另外,底座11內部具有一內壁面111及外部具有一外壁面112,內壁面111凹設有一或複數凹陷槽113,外壁面112凸伸有一或複數凸塊114,凹陷槽113設置在凸塊114的內部。In addition, the base 11 has an inner wall surface 111 inside and an outer wall surface 112 on the outside. The inner wall surface 111 is recessed with one or more concave grooves 113. The outer wall surface 112 protrudes with one or more convex blocks 114. The concave grooves 113 are arranged on the convex blocks 114. internal.

如圖1至圖5所示,散熱模組2包含一或複數熱管21、一或複數散熱鰭片組22及一或複數風扇23,熱管21的其一部分嵌設於凹陷槽113及另一部分貼附於發熱元件13,散熱鰭片組22貼附於熱管21且對應凹陷槽113設置,風扇23容置於底座11且對應散熱鰭片組22設置。As shown in FIGS. 1 to 5, the heat dissipation module 2 includes one or more heat pipes 21, one or more heat dissipation fin groups 22, and one or more fans 23. A part of the heat pipe 21 is embedded in the recessed groove 113 and the other part is attached. Attached to the heating element 13, the heat dissipation fin group 22 is attached to the heat pipe 21 and disposed corresponding to the recessed groove 113, and the fan 23 is accommodated in the base 11 and disposed corresponding to the heat dissipation fin group 22.

如圖5所示,本創作行動裝置10更包括一或複數腳墊片3,腳墊片3貼附在凸塊114的表面,此腳墊片3可為布質、海綿、矽膠、橡膠、塑膠或金屬等材質所構成。As shown in Figure 5, the creative mobile device 10 further includes one or more foot pads 3, which are attached to the surface of the bump 114. The foot pads 3 can be cloth, sponge, silicone, rubber, Made of materials such as plastic or metal.

其中,本實施例之凹陷槽113、熱管21、散熱鰭片組22、風扇23與腳墊片3的數量分別為二,發熱元件13設置在二凹陷槽113之間,其一熱管21的左端嵌設於其一凹陷槽113及右端貼附於發熱元件13,另一熱管21的左端貼附於發熱元件13及右端嵌設於另一凹陷槽113,二熱管21並列在發熱元件13的下方且完全貼附於發熱元件13,即發熱元件13的底面全部皆與二熱管21相互貼接,各散熱鰭片組22貼附於各熱管21且對應各凹陷槽113設置,各風扇23對應各散熱鰭片組22設置,使發熱元件13產生的熱量經由各熱管21傳遞至各散熱鰭片組22,再經由各風扇23產生的氣流將各散熱鰭片組22上的熱量散逸至本體1外部。Among them, the number of the recessed groove 113, the heat pipe 21, the heat dissipation fin group 22, the fan 23, and the foot pad 3 of this embodiment are two respectively, and the heating element 13 is arranged between the two recessed grooves 113, one of which is at the left end of the heat pipe 21 It is embedded in one of the recessed grooves 113 and the right end is attached to the heating element 13, the left end of the other heat pipe 21 is attached to the heating element 13 and the right end is embedded in the other recessed groove 113, and the two heat pipes 21 are juxtaposed below the heating element 13. And it is completely attached to the heating element 13, that is, all the bottom surfaces of the heating element 13 are attached to the two heat pipes 21. Each heat dissipation fin group 22 is attached to each heat pipe 21 and is arranged corresponding to each recessed groove 113, and each fan 23 corresponds to each The heat dissipation fin group 22 is arranged so that the heat generated by the heating element 13 is transferred to each heat dissipation fin group 22 through each heat pipe 21, and then the heat on each heat dissipation fin group 22 is dissipated to the outside of the body 1 through the airflow generated by each fan 23 .

此外,本實施例之蓋板12具有一鍵盤121,使本體1為一鍵盤座,如圖4所示,本創作行動裝置10更包括一螢幕模組4,螢幕模組4包含一殼體41及安裝於殼體41的一螢幕42,殼體41樞接於本體1,使行動裝置10由螢幕模組4與鍵盤座結合而構成一筆記型電腦,但不以此為限制,本創作行動裝置10可為筆記型電腦、平板、手機等可跟隨使用者行動之裝置。In addition, the cover 12 of this embodiment has a keyboard 121, so that the main body 1 is a keyboard dock. As shown in FIG. 4, the creative mobile device 10 further includes a screen module 4, and the screen module 4 includes a housing 41 And a screen 42 mounted on the housing 41. The housing 41 is pivotally connected to the main body 1, so that the mobile device 10 is composed of the screen module 4 and the keyboard dock to form a notebook computer, but it is not limited by this. The creative action The device 10 may be a device such as a notebook computer, a tablet, a mobile phone, etc., which can follow the user's actions.

如圖3至圖5所示,本創作行動裝置10之使用狀態,其係利用底座11的內壁面111凹設有凹陷槽113,熱管21的其一部分嵌設於凹陷槽113,散熱鰭片組22貼附於熱管21且對應凹陷槽113設置,使熱管21與散熱鰭片組22堆疊的厚度部分嵌設在底座11內部,讓本體1的內部空間更有效地配置熱管21、散熱鰭片組22及風扇23等散熱元件,以達到行動裝置10同時具有體積輕薄短小及散熱效率良好之功效。As shown in FIGS. 3 to 5, the use state of the creative mobile device 10 is that the inner wall surface 111 of the base 11 is recessed with a recessed groove 113, a part of the heat pipe 21 is embedded in the recessed groove 113, and the heat dissipation fin group 22 is attached to the heat pipe 21 and arranged corresponding to the recessed groove 113, so that the thickness of the heat pipe 21 and the heat dissipation fin set 22 is partially embedded in the base 11, so that the internal space of the body 1 is more effectively configured with the heat pipe 21 and the heat dissipation fin set The heat dissipation components such as 22 and fan 23 can achieve the functions of the mobile device 10 having a small size and a good heat dissipation efficiency at the same time.

另外,底座11的外壁面112凸伸有凸塊114,凹陷槽113設置在凸塊114的內部,且凸塊114的表面貼附有腳墊片3,即熱管21的其一部分嵌設於底座11的支腳內部,使熱管21更有效率地藏收在本體1的內部空間。In addition, the outer wall 112 of the base 11 protrudes with a protrusion 114, and the recess 113 is provided inside the protrusion 114, and the surface of the protrusion 114 is attached with a foot pad 3, that is, a part of the heat pipe 21 is embedded in the base. The inside of the feet 11 makes the heat pipe 21 more efficiently concealed in the internal space of the body 1.

請參考圖6所示,係本創作行動裝置10另一實施例,圖6之實施例與圖1至圖5之實施例大致相同,圖6之實施例與圖1至圖5之實施例不同之處在於行動裝置10未包括螢幕模組,且蓋板12具有一螢幕122,螢幕122為一觸控式螢幕,使行動裝置10形成一平板,但不以此為限制,本創作行動裝置10可為筆記型電腦、平板、手機等可跟隨使用者行動之裝置。藉此,以達到相同於圖1至圖5之實施例的功能及功效。Please refer to FIG. 6, which is another embodiment of the creative mobile device 10. The embodiment of FIG. 6 is substantially the same as the embodiment of FIGS. 1 to 5, and the embodiment of FIG. 6 is different from the embodiment of FIGS. 1 to 5 The point is that the mobile device 10 does not include a screen module, and the cover 12 has a screen 122, which is a touch screen, so that the mobile device 10 forms a tablet, but it is not limited to this. The mobile device 10 is created. It can be a device that can follow the user's actions such as a notebook computer, a tablet, a mobile phone, etc. In this way, the same functions and effects as the embodiments in FIGS. 1 to 5 can be achieved.

綜上所述,本創作之具有散熱模組的行動裝置,確可達到預期之使用目的,而解決習知之缺失,並具有產業利用性、新穎性與進步性,完全符合專利申請要件,爰依專利法提出申請,敬請詳查並賜准本案專利,以保障創作人之權利。In summary, the mobile device with a heat dissipation module created by this creation can indeed achieve the intended purpose of use, and solve the lack of conventional knowledge. It is also industrially usable, novel and progressive, and fully meets the requirements of a patent application. If you file an application under the Patent Law, please check and grant the patent for this case in order to protect the rights of the creator.

10:行動裝置 1:本體 11:底座 111:內壁面 112:外壁面 113:凹陷槽 114:凸塊 12:蓋板 121:鍵盤 122:螢幕 13:發熱元件 2:散熱模組 21:熱管 22:散熱鰭片組 23:風扇 3:腳墊片 4:螢幕模組 41:殼體 42:螢幕 10: Mobile device 1: body 11: Base 111: inner wall 112: Outer wall 113: Depressed Groove 114: bump 12: Cover 121: keyboard 122: screen 13: Heating element 2: Cooling module 21: Heat pipe 22: cooling fin set 23: Fan 3: Foot gasket 4: Screen module 41: shell 42: screen

圖1 係本創作行動裝置之立體分解圖。Figure 1 is a three-dimensional exploded view of this creative mobile device.

圖2 係本創作散熱模組之立體分解圖。Figure 2 is a three-dimensional exploded view of the cooling module of this creation.

圖3 係本創作底座與散熱模組之立體組合圖。Figure 3 is a three-dimensional assembly diagram of the creative base and the heat dissipation module.

圖4 係本創作行動裝置之組合示意圖。Figure 4 is a schematic diagram of the combination of this creative mobile device.

圖5 係本創作行動裝置之剖面示意圖。Figure 5 is a schematic cross-sectional view of this creative mobile device.

圖6 係本創作行動裝置另一實施例之剖面示意圖。Fig. 6 is a schematic cross-sectional view of another embodiment of the mobile authoring device.

10:行動裝置 10: Mobile device

1:本體 1: body

11:底座 11: Base

111:內壁面 111: inner wall

112:外壁面 112: Outer wall

113:凹陷槽 113: Depressed Groove

114:凸塊 114: bump

12:蓋板 12: Cover

121:鍵盤 121: keyboard

2:散熱模組 2: Cooling module

21:熱管 21: Heat pipe

22:散熱鰭片組 22: cooling fin set

23:風扇 23: Fan

3:腳墊片 3: Foot gasket

Claims (10)

一種具有散熱模組的行動裝置,包括: 一本體,包含一底座,該底座內部具有一內壁面,該內壁面凹設有至少一凹陷槽;以及 一散熱模組,包含至少一熱管及至少一散熱鰭片組,該熱管的其一部分嵌設於該凹陷槽,該散熱鰭片組貼附於該熱管且對應該凹陷槽設置。 A mobile device with a heat dissipation module includes: A body including a base, the base has an inner wall surface, and the inner wall surface is recessed with at least one recessed groove; and A heat dissipation module includes at least one heat pipe and at least one heat dissipation fin group, a part of the heat pipe is embedded in the concave groove, and the heat dissipation fin group is attached to the heat pipe and arranged corresponding to the concave groove. 如請求項1所述之具有散熱模組的行動裝置,其中該底座外部具有一外壁面,該外壁面凸伸有至少一凸塊,該凹陷槽設置在該凸塊的內部。The mobile device with a heat dissipation module according to claim 1, wherein the base has an outer wall surface, the outer wall surface protrudes with at least one protrusion, and the recessed groove is disposed inside the protrusion. 如請求項2所述之具有散熱模組的行動裝置,其更包括至少一腳墊片,該腳墊片貼附在該凸塊的表面。According to claim 2, the mobile device with a heat dissipation module further includes at least one foot pad attached to the surface of the bump. 如請求項3所述之具有散熱模組的行動裝置,其中該本體更包含一發熱元件,該發熱元件容置於該底座,該熱管的另一部分貼附於該發熱元件。The mobile device with a heat dissipation module according to claim 3, wherein the body further includes a heating element, the heating element is accommodated in the base, and another part of the heat pipe is attached to the heating element. 如請求項4所述之具有散熱模組的行動裝置,其中凹陷槽、熱管、散熱鰭片組與腳墊片的數量分別為二,該發熱元件設置在該二凹陷槽之間,其一該熱管的左端嵌設於其一該凹陷槽及右端貼附於該發熱元件,另一該熱管的左端貼附於該發熱元件及右端嵌設於另一該凹陷槽,該二熱管並列在該發熱元件的下方且完全貼附於該發熱元件。The mobile device with a heat dissipation module according to claim 4, wherein the number of recessed grooves, heat pipes, heat dissipation fin sets and foot pads are two respectively, the heating element is arranged between the two recessed grooves, one of which The left end of the heat pipe is embedded in one of the recessed grooves and the right end is attached to the heating element, the left end of the other heat pipe is attached to the heating element and the right end is embedded in the other recessed groove, and the two heat pipes are arranged side by side in the heating element. The bottom of the element is completely attached to the heating element. 如請求項1所述之具有散熱模組的行動裝置,其中該散熱模組更包含至少一風扇,該風扇容置於該底座且對應該散熱鰭片組設置。The mobile device having a heat dissipation module according to claim 1, wherein the heat dissipation module further includes at least one fan, and the fan is accommodated in the base and arranged corresponding to the heat dissipation fin group. 如請求項1所述之具有散熱模組的行動裝置,其中該本體更包含一蓋板,該蓋板罩蓋於該底座,該蓋板具有一鍵盤。The mobile device with a heat dissipation module according to claim 1, wherein the body further includes a cover plate covering the base, and the cover plate has a keyboard. 如請求項7所述之具有散熱模組的行動裝置,其更包括一螢幕模組,該螢幕模組包含一殼體及安裝於該殼體的一螢幕,該殼體樞接於該本體。The mobile device with a heat dissipation module according to claim 7, further comprising a screen module, the screen module including a casing and a screen mounted on the casing, and the casing is pivotally connected to the body. 如請求項1所述之具有散熱模組的行動裝置,其中該本體更包含一蓋板,該蓋板罩蓋於該底座,該蓋板具有一螢幕。The mobile device with a heat dissipation module according to claim 1, wherein the body further includes a cover plate, the cover plate covers the base, and the cover plate has a screen. 如請求項9所述之具有散熱模組的行動裝置,其中該螢幕為一觸控式螢幕。The mobile device with a heat dissipation module according to claim 9, wherein the screen is a touch screen.
TW109216138U 2020-12-07 2020-12-07 Mobile device with heat dissipation module TWM608734U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW109216138U TWM608734U (en) 2020-12-07 2020-12-07 Mobile device with heat dissipation module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW109216138U TWM608734U (en) 2020-12-07 2020-12-07 Mobile device with heat dissipation module

Publications (1)

Publication Number Publication Date
TWM608734U true TWM608734U (en) 2021-03-01

Family

ID=76036734

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109216138U TWM608734U (en) 2020-12-07 2020-12-07 Mobile device with heat dissipation module

Country Status (1)

Country Link
TW (1) TWM608734U (en)

Similar Documents

Publication Publication Date Title
TWI693503B (en) Laptop computer
JP2001267771A (en) Electronic apparatus
US9277676B2 (en) Electronic apparatus
US10664026B2 (en) Portable electronic device
TWM608734U (en) Mobile device with heat dissipation module
TWM522552U (en) Handheld communication apparatus and thin heat sink thereof
TW201505534A (en) Deflection device and electronic device having the same
TWI555464B (en) Electronic device
CN107027266B (en) Portable electronic device
TWM500284U (en) Portable electronic device
US8178803B2 (en) Electronic device having key
JP2001147737A (en) Stand structure for portable computer
TW201701107A (en) Portable electronic device
TWI632841B (en) Portable electronic device
TWI736470B (en) Heat dissipation device
TW201407314A (en) Electronic device and heat dissipation module
TWM607691U (en) Electronic device
TWM570001U (en) Heat dissipation structure of mobile device
TWI777687B (en) Storage device with heat dissipation function
TWI551213B (en) Handheld device heat dissipation structure
TWM496155U (en) Heat dissipation structure for handheld device
TW201424561A (en) Electronic device
TWI746352B (en) Electronic system
US20230017904A1 (en) Protective case for mobile device and heat dissipation film thereof
TWM470167U (en) Heat dissipation fan