TWM608734U - Mobile device with heat dissipation module - Google Patents
Mobile device with heat dissipation module Download PDFInfo
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- TWM608734U TWM608734U TW109216138U TW109216138U TWM608734U TW M608734 U TWM608734 U TW M608734U TW 109216138 U TW109216138 U TW 109216138U TW 109216138 U TW109216138 U TW 109216138U TW M608734 U TWM608734 U TW M608734U
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Abstract
本創作係關於一種具有散熱模組的行動裝置,此行動裝置包括一本體及一散熱模組,本體包含一底座,底座內部具有一內壁面,內壁面凹設有一凹陷槽;散熱模組包含一熱管及一散熱鰭片組,熱管的其一部分嵌設於凹陷槽,散熱鰭片組貼附於熱管且對應凹陷槽設置。藉此,熱管與散熱鰭片組堆疊的厚度部分嵌設在底座內部,使行動裝置維持體積輕薄之優點。This creation is about a mobile device with a heat dissipation module. The mobile device includes a main body and a heat dissipation module. The main body includes a base. The base has an inner wall and a recessed groove on the inner wall. The heat dissipation module includes a The heat pipe and a heat dissipation fin group, a part of the heat pipe is embedded in the concave groove, and the heat dissipation fin group is attached to the heat pipe and arranged corresponding to the concave groove. Thereby, the thickness of the stack of heat pipe and heat dissipation fin set is partially embedded in the base, so that the mobile device maintains the advantages of lightness and thinness.
Description
本創作是有關於一種散熱結構,且特別是有關於一種具有散熱模組的行動裝置。This creation is about a heat dissipation structure, and especially about a mobile device with a heat dissipation module.
現在筆記型電腦、平板、手機等行動裝置具備更多功能,使行動裝置內的運算單元數量更多及效能發揮更大,造成運算單元運作時會產生大量熱量,因此行動裝置內部會安裝散熱結構,進而透過散熱結構將熱量導引至行動裝置外部。Now mobile devices such as laptops, tablets, and mobile phones have more functions, so that the number of computing units in the mobile device is greater and the performance is greater. As a result, a large amount of heat is generated when the computing unit is in operation. Therefore, a heat dissipation structure is installed inside the mobile device. , And then guide the heat to the outside of the mobile device through the heat dissipation structure.
然而,隨著行動裝置追求整體外型輕薄短小,使得行動裝置內部的空間也會跟隨縮減,故如何在有限的空間中有效地配置熱管、散熱鰭片及風扇等散熱元件,並同時提供足夠的散熱效率,即為業界積極研究的重點。However, as the overall appearance of mobile devices is light, thin and short, the space inside the mobile device will also be reduced. Therefore, how to effectively configure heat pipes, fins, fans and other heat dissipation components in a limited space while providing sufficient Heat dissipation efficiency is the focus of active research in the industry.
有鑑於此,本創作人遂針對上述現有技術,特潛心研究並配合學理的運用,盡力解決上述之問題點,即成為本創作人改良之目標。In view of this, the creator has focused on the above-mentioned existing technology, specially researched and cooperated with the application of academic theory, and tried his best to solve the above problems, which became the goal of the creator's improvement.
本創作提供一種具有散熱模組的行動裝置,其係利用熱管與散熱鰭片組堆疊的厚度部分嵌設在底座內部,使行動裝置維持體積輕薄之優點。This invention provides a mobile device with a heat dissipation module, which uses the thickness of the heat pipe and the heat dissipation fin group to be partially embedded in the base, so that the mobile device maintains the advantages of lightness and thinness.
於本創作實施例中,本創作係提供一種具有散熱模組的行動裝置,包括:一本體,包含一底座,該底座內部具有一內壁面,該內壁面凹設有至少一凹陷槽;以及一散熱模組,包含至少一熱管及至少一散熱鰭片組,該熱管的其一部分嵌設於該凹陷槽,該散熱鰭片組貼附於該熱管且對應該凹陷槽設置。In this creative embodiment, this creative system provides a mobile device with a heat dissipation module, including: a body including a base, the base has an inner wall surface, and the inner wall surface is recessed with at least one recessed groove; and a The heat dissipation module includes at least one heat pipe and at least one heat dissipation fin group, a part of the heat pipe is embedded in the concave groove, and the heat dissipation fin group is attached to the heat pipe and arranged corresponding to the concave groove.
基於上述,底座的內壁面凹設有凹陷槽,熱管的其一部分嵌設於凹陷槽,散熱鰭片組貼附於熱管且對應凹陷槽設置,使熱管與散熱鰭片組堆疊的厚度部分嵌設在底座內部,讓本體的內部空間更有效地配置熱管、散熱鰭片組及風扇等散熱元件,以達到行動裝置同時具有體積輕薄短小及散熱效率良好之功效。Based on the above, the inner wall surface of the base is recessed with a recessed groove, a part of the heat pipe is embedded in the recessed groove, and the heat dissipation fin set is attached to the heat pipe and arranged corresponding to the recessed groove, so that the thickness of the stack of the heat pipe and the heat dissipation fin set is partially embedded Inside the base, the internal space of the main body is more effectively configured with heat pipes, fin sets, fans and other heat-dissipating elements, so that the mobile device has the advantages of lightness, thinness, and small size and good heat dissipation efficiency.
基於上述,底座的外壁面凸伸有凸塊,凹陷槽設置在凸塊的內部,且凸塊的表面貼附有腳墊片,即熱管的其一部分嵌設於底座的支腳內部,使熱管更有效率地藏收在本體的內部空間。Based on the above, the outer wall surface of the base protrudes with a convex block, the recessed groove is arranged inside the convex block, and the surface of the convex block is attached with a foot pad, that is, a part of the heat pipe is embedded in the foot of the base to make the heat pipe It is more efficiently hidden in the internal space of the body.
有關本創作之詳細說明及技術內容,將配合圖式說明如下,然而所附圖式僅作為說明用途,並非用於侷限本創作。The detailed description and technical content of this creation will be explained as follows with the drawings. However, the attached drawings are only for illustrative purposes and are not used to limit this creation.
請參考圖1至圖5所示,本創作係提供一種具有散熱模組的行動裝置,此行動裝置10主要包括一本體1及一散熱模組2。Please refer to FIG. 1 to FIG. 5. The author provides a mobile device with a heat dissipation module. The
如圖1、圖3至圖5所示,本體1包含一底座11、一蓋板12及一發熱元件13,蓋板12罩蓋於底座11,發熱元件13容置於底座11。As shown in FIGS. 1 and 3 to 5, the
另外,底座11內部具有一內壁面111及外部具有一外壁面112,內壁面111凹設有一或複數凹陷槽113,外壁面112凸伸有一或複數凸塊114,凹陷槽113設置在凸塊114的內部。In addition, the
如圖1至圖5所示,散熱模組2包含一或複數熱管21、一或複數散熱鰭片組22及一或複數風扇23,熱管21的其一部分嵌設於凹陷槽113及另一部分貼附於發熱元件13,散熱鰭片組22貼附於熱管21且對應凹陷槽113設置,風扇23容置於底座11且對應散熱鰭片組22設置。As shown in FIGS. 1 to 5, the
如圖5所示,本創作行動裝置10更包括一或複數腳墊片3,腳墊片3貼附在凸塊114的表面,此腳墊片3可為布質、海綿、矽膠、橡膠、塑膠或金屬等材質所構成。As shown in Figure 5, the creative
其中,本實施例之凹陷槽113、熱管21、散熱鰭片組22、風扇23與腳墊片3的數量分別為二,發熱元件13設置在二凹陷槽113之間,其一熱管21的左端嵌設於其一凹陷槽113及右端貼附於發熱元件13,另一熱管21的左端貼附於發熱元件13及右端嵌設於另一凹陷槽113,二熱管21並列在發熱元件13的下方且完全貼附於發熱元件13,即發熱元件13的底面全部皆與二熱管21相互貼接,各散熱鰭片組22貼附於各熱管21且對應各凹陷槽113設置,各風扇23對應各散熱鰭片組22設置,使發熱元件13產生的熱量經由各熱管21傳遞至各散熱鰭片組22,再經由各風扇23產生的氣流將各散熱鰭片組22上的熱量散逸至本體1外部。Among them, the number of the
此外,本實施例之蓋板12具有一鍵盤121,使本體1為一鍵盤座,如圖4所示,本創作行動裝置10更包括一螢幕模組4,螢幕模組4包含一殼體41及安裝於殼體41的一螢幕42,殼體41樞接於本體1,使行動裝置10由螢幕模組4與鍵盤座結合而構成一筆記型電腦,但不以此為限制,本創作行動裝置10可為筆記型電腦、平板、手機等可跟隨使用者行動之裝置。In addition, the
如圖3至圖5所示,本創作行動裝置10之使用狀態,其係利用底座11的內壁面111凹設有凹陷槽113,熱管21的其一部分嵌設於凹陷槽113,散熱鰭片組22貼附於熱管21且對應凹陷槽113設置,使熱管21與散熱鰭片組22堆疊的厚度部分嵌設在底座11內部,讓本體1的內部空間更有效地配置熱管21、散熱鰭片組22及風扇23等散熱元件,以達到行動裝置10同時具有體積輕薄短小及散熱效率良好之功效。As shown in FIGS. 3 to 5, the use state of the creative
另外,底座11的外壁面112凸伸有凸塊114,凹陷槽113設置在凸塊114的內部,且凸塊114的表面貼附有腳墊片3,即熱管21的其一部分嵌設於底座11的支腳內部,使熱管21更有效率地藏收在本體1的內部空間。In addition, the
請參考圖6所示,係本創作行動裝置10另一實施例,圖6之實施例與圖1至圖5之實施例大致相同,圖6之實施例與圖1至圖5之實施例不同之處在於行動裝置10未包括螢幕模組,且蓋板12具有一螢幕122,螢幕122為一觸控式螢幕,使行動裝置10形成一平板,但不以此為限制,本創作行動裝置10可為筆記型電腦、平板、手機等可跟隨使用者行動之裝置。藉此,以達到相同於圖1至圖5之實施例的功能及功效。Please refer to FIG. 6, which is another embodiment of the creative
綜上所述,本創作之具有散熱模組的行動裝置,確可達到預期之使用目的,而解決習知之缺失,並具有產業利用性、新穎性與進步性,完全符合專利申請要件,爰依專利法提出申請,敬請詳查並賜准本案專利,以保障創作人之權利。In summary, the mobile device with a heat dissipation module created by this creation can indeed achieve the intended purpose of use, and solve the lack of conventional knowledge. It is also industrially usable, novel and progressive, and fully meets the requirements of a patent application. If you file an application under the Patent Law, please check and grant the patent for this case in order to protect the rights of the creator.
10:行動裝置 1:本體 11:底座 111:內壁面 112:外壁面 113:凹陷槽 114:凸塊 12:蓋板 121:鍵盤 122:螢幕 13:發熱元件 2:散熱模組 21:熱管 22:散熱鰭片組 23:風扇 3:腳墊片 4:螢幕模組 41:殼體 42:螢幕 10: Mobile device 1: body 11: Base 111: inner wall 112: Outer wall 113: Depressed Groove 114: bump 12: Cover 121: keyboard 122: screen 13: Heating element 2: Cooling module 21: Heat pipe 22: cooling fin set 23: Fan 3: Foot gasket 4: Screen module 41: shell 42: screen
圖1 係本創作行動裝置之立體分解圖。Figure 1 is a three-dimensional exploded view of this creative mobile device.
圖2 係本創作散熱模組之立體分解圖。Figure 2 is a three-dimensional exploded view of the cooling module of this creation.
圖3 係本創作底座與散熱模組之立體組合圖。Figure 3 is a three-dimensional assembly diagram of the creative base and the heat dissipation module.
圖4 係本創作行動裝置之組合示意圖。Figure 4 is a schematic diagram of the combination of this creative mobile device.
圖5 係本創作行動裝置之剖面示意圖。Figure 5 is a schematic cross-sectional view of this creative mobile device.
圖6 係本創作行動裝置另一實施例之剖面示意圖。Fig. 6 is a schematic cross-sectional view of another embodiment of the mobile authoring device.
10:行動裝置 10: Mobile device
1:本體 1: body
11:底座 11: Base
111:內壁面 111: inner wall
112:外壁面 112: Outer wall
113:凹陷槽 113: Depressed Groove
114:凸塊 114: bump
12:蓋板 12: Cover
121:鍵盤 121: keyboard
2:散熱模組 2: Cooling module
21:熱管 21: Heat pipe
22:散熱鰭片組 22: cooling fin set
23:風扇 23: Fan
3:腳墊片 3: Foot gasket
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW109216138U TWM608734U (en) | 2020-12-07 | 2020-12-07 | Mobile device with heat dissipation module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW109216138U TWM608734U (en) | 2020-12-07 | 2020-12-07 | Mobile device with heat dissipation module |
Publications (1)
Publication Number | Publication Date |
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TWM608734U true TWM608734U (en) | 2021-03-01 |
Family
ID=76036734
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TW109216138U TWM608734U (en) | 2020-12-07 | 2020-12-07 | Mobile device with heat dissipation module |
Country Status (1)
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TW (1) | TWM608734U (en) |
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2020
- 2020-12-07 TW TW109216138U patent/TWM608734U/en unknown
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