TW201424561A - Electronic device - Google Patents

Abstract

An electronic device comprises a housing, a heat source, and a heat dissipation device. The heat source and the heat dissipation device dispose in the housing. The heat dissipation device is thermal contact with the heat source. The heat dissipation device includes a casing which a heat dissipation material disposed in. The heat dissipation material includes 15 to 30 volume percent of copper materials, 50 to 85 volume percent of phase change material, and 15 to 20 volume percent of air. Wherein a surface of the heat dissipation device is contact with the heat source, and the surface of the heat dissipation device defines a central area and a peripheral area. The peripheral area surrounds the central area. The heat source is thermal contact with the peripheral area. The heat dissipation device absorbs the heat of the heat source via thermal conduction.

Description

Electronic device

The present invention relates to an electronic device, and more particularly to an electronic device having a heat sink.

With the continuous advancement of technology, the daily necessities of modern people are moving towards digitalization and informationization. For example, a mobile computing device, such as a notebook computer or a tablet computer, has the advantage of being convenient for the user to carry, so that the user can freely use it regardless of the occasion.

In addition, the general mobile computing device internally removes thermal energy generated by the mobile computing device by providing a heat sink fin set and a fan. However, since the performance of the mobile computing device is continuously increased, the thermal energy generated by the mobile computing device in the arithmetic processing process is also increased. In this regard, the rate of heat removal of the mobile computing device is generally increased by increasing the heat dissipation area of the heat sink fins and increasing the power of the fan.

However, under the trend of technology development, R&D personnel are working hard to make mobile computing devices continue to move toward high-performance and thin, light and small volumes. The above-mentioned heat dissipation means for increasing the heat dissipation area of the heat dissipation fins and increasing the power of the fan will result in an additional increase in the internal volume of the mobile computing device to accommodate larger heat dissipation fins and high power fans. As a result, the development of the thinning of the mobile computing device will be hindered.

The present invention is to provide an electronic device, in order to reduce the volume of the action The heat dissipation requirements of the computing device.

The electronic device disclosed in the present invention comprises a casing, a heat source and a heat sink. The heat source is located inside the enclosure. The heat sink is disposed in the outer casing, and the heat sink is in thermal contact with the heat source. The heat sink includes a housing having a heat dissipating material therein. The heat dissipating material comprises 15% to 30% by volume of a plurality of copper materials, 50% to 85% by volume of a phase change material, and 15% to 20% by volume of an air. The housing has a surface that is in thermal contact with the heat source, and the surface defines a central region and an outer ring region. The outer ring zone surrounds the central zone, and the geometric midpoint of the central zone overlaps with the geometric midpoint of the surface, and the area of the central zone is 10% to 50% of the surface area. The heat source is located in the outer ring zone, and the heat sink absorbs the heat of the heat source through heat conduction.

According to the electronic device disclosed in the present invention, the heat dissipating material comprises 15% to 30% by volume of a plurality of copper materials, 50% to 85% by volume of phase change material, and 15% to 20% by volume of air. So that heat can be quickly transferred to the heat sink through these copper materials. Thereby, the phase change material in the interior of the heat sink can uniformly absorb heat to perform phase change to improve the heat absorption efficiency of the heat sink. Moreover, since the heat sink does not need to be equipped with an exhaust fan, the heat sink can be used for thin electronic devices and can reduce noise.

The features, implementations, and utilities of the present invention are described in detail below with reference to the drawings.

1 and 2, FIG. 1 is a cross-sectional view showing the structure of an electronic device according to an embodiment of the present invention, and FIG. 2 is a bottom view showing the structure of the heat sink according to FIG. 1.

The electronic device 10 of the embodiment includes a housing 11, a heat source 12 and a heat sink 13. The electronic device 10 can be a tablet computer, a mobile phone or other electronic products.

A circuit board 14 is disposed in the outer casing 11, and the heat source 12 is disposed on the circuit board 14 and located in the outer casing 11. The heat source 12 described above may be an arithmetic processing chip of a tablet computer, a mobile phone or other electronic products.

The heat sink 13 is disposed in the outer casing 11 and the heat sink 13 is in thermal contact with the heat source 12. Further, the heat sink 13 is attached to the heat source 12 and is in direct contact with the heat source 12. The heat sink 13 of the electronic device 10 of the present invention can effectively absorb the heat generated by the heat source 12, so that the heat source such as various electronic components can operate normally.

The heat sink 13 includes a casing 131. The outer shape of the casing 131 may be a rectangular parallelepiped or other cubes, and the material of the casing 131 may be aluminum, or copper or other suitable material. The housing 131 has a heat dissipating material 132 therein. The heat dissipating material 132 comprises 15% to 30% by volume of a plurality of copper materials, 50% to 85% by volume of a phase change material, and 15% to 20% by volume of an air. The heat dissipating material 132 preferably comprises a plurality of copper materials in a volume percentage of 15% to 20%, a phase change material in a volume percentage of 64% to 67%, and air in a volume percentage of 16% to 17%. Among them, the copper material may be a copper tube, a copper separator or other copper members. The phase change material can be an alkane such as paraffin. The phase change material of the present embodiment can be converted from a solid state to a liquid state by absorbing heat, and the phase change material can be maintained at a certain value without rising due to the heat transfer from the solid state to the liquid state. Since the phase change material is converted from a solid state to a liquid state, the volume increases, and the air has excellent compressibility and can serve as an expansion space for the phase change material. Therefore, the purpose of the heat dissipating material 132 containing air is to respond The phase change material causes a problem of volume increase due to phase change, so as to avoid the problem that the space in the casing 131 is insufficient to accommodate the heat dissipation material 132 due to the increase in volume of the phase change material.

In addition, the housing 131 of the heat sink 13 has a surface 1311 that is in thermal contact with the heat source 12 by the surface 1311. Surface 1311 defines a central region 1312 and an outer annular region 1313 that surrounds central region 1312.

Also, the central portion 1312, the surface 1311, and the heat sink 13 of the present embodiment have overlapping geometric midpoints M. The area of the central portion 1312 is, for example, 10% to 50% of the area of the surface 1311. Among them, it is preferable that the area of the central portion 1312 is 10% of the area of the surface 1311. And the area outside the central area 1312 can be scaled down beyond the area of the surface 1311. A contact range A of the heat source 12 with the surface 1311 is located in the outer ring region 1313. The heat sink 13 absorbs heat of the heat source 12 by heat conduction.

Referring to FIG. 2 , in the present embodiment, the plurality of copper materials included in the heat dissipating material 132 in the heat sink 13 are a plurality of copper tubes 1321 , and the copper tubes 1321 are located in the casing 131 . The copper tubes 1321 extend from the central portion 1312 toward the outer ring region 1313, and one of the copper tubes 1321 overlaps with the contact range A of the heat source 12 contacting the surface 1311 of the heat sink 13, and the copper tube 1321 passes through the heat sink 13 The geometric midpoint M. Moreover, a portion of the copper tubes 1321 extend to the four corner portions 1315 of the housing 131 of the heat sink 13, respectively, and a portion of the copper tubes 1321 extend to the four sides 1314 of the housing 131 of the heat sink 13. Further, the copper tubes 1321 are uniformly interlaced in the casing 131 and extend as far as possible from the central portion 1312 toward the outer ring region 1313 in a radial manner.

It should be noted that the number and length of the copper tubes 1321 shown in the above embodiment are extended. The method of stretching is not intended to limit the present invention, and those skilled in the art can appropriately design the number and extension of the copper tubes 1321 according to the appearance of the heat sink 13 and the position of the heat source 12.

By the arrangement of the copper tube 1321, when the heat source 12 transmits heat to one of the outer ring regions 1313 of the heat sink 13 through heat conduction, heat can be quickly transferred to the central portion 1312 via the copper tubes 1321, and The central zone 1312 transmits diffusion to other portions of the outer ring region 1313 of the heat sink 13. In this way, the corners of the heat sink 13 can be uniformly heated, so that the phase change materials in the interior of the heat sink 13 can uniformly absorb heat to perform phase change to improve the heat absorption efficiency of the heat sink 13. Moreover, the heat sink 13 of the present embodiment does not need to be equipped with an exhaust fan, and thus can be applied to a thinned electronic device.

In addition, since the heat dissipating material 132 in the heat sink 13 contains a phase change material, and the phase change material undergoes a phase change in the endothermic phase, the temperature of the phase change material does not increase. Therefore, as long as the appropriate phase change material is selected, for example, a phase change material having a phase transition temperature of about 37 degrees is selected, the temperature of the heat sink 13 can be maintained at a comfortable temperature of 37 degrees for a long time during the heat absorption process. . Thus, when the user holds the electronic device 10 for a long time, there is no problem that the temperature of the outer casing 11 of the electronic device 10 rises due to the heat absorption of the heat sink 13 and there is a hot hand.

In addition, in this embodiment or other embodiments, a plurality of sets of heat dissipation fins (not shown) may be disposed on the surface of the heat sink 13 to further improve the heat absorption efficiency of the heat sink 13.

Please refer to FIG. 3, which is a bottom view of the structure of the heat sink according to another embodiment of the present invention.

In this embodiment, the plurality of heat dissipation materials 132 included in the heat sink 13a are included The copper material is a plurality of copper separators 1322, and these copper separators 1322 are uniformly interwoven in the casing 131. The copper spacers 1322 extend from the central region 1312 toward the outer ring region 1313, and one of the copper spacers 1322 overlaps with the contact range A of the heat source 12 contacting the surface 1311 of the heat sink 13, and the copper spacer 1322 passes through the geometric midpoint M of the heat sink 13. Moreover, a portion of the copper spacers 1322 extend to the four corner portions 1315 of the housing 131 of the heat sink 13, respectively, and a portion of the copper spacers 1322 extend to the four sides of the housing 131 of the heat sink 13. Side 1314. Further, these copper spacers 1322 extend as far as possible from the central region 1312 toward the outer ring region 1313 in a radial manner.

In addition, a plurality of aluminum partitions 133 are disposed in the casing 131. The aluminum partitions 133 may be interposed between the central portion 1312 and the outer ring region 1313 to form a rectangular frame to surround the central portion 1312. The ring zone 1313 is separated by a phase. Further, a part of the copper spacers 1322 extend from the respective corners of the rectangular frame formed by the aluminum spacers 133 to the corner portions 1315 of the housing 131, and the partial copper spacers 1322 are respectively The corner sides of the rectangular frame formed by the aluminum partition 133 extend to the respective side edges 1314 of the casing 131. It should be noted that the position in which the aluminum spacers 133 are disposed in the housing 131 is not intended to limit the present invention. Further, the volume percentage of these aluminum separators 133 is less than 3% of the volume percentage of these copper tubes 1321 in order to avoid lowering the heat absorbing effect of the heat sink 13.

In addition, by providing the aluminum separator 133, at least two regions can be partitioned from the inside of the casing 131, and the content of the phase change material in each region of the casing 131 can be uniformly distributed. In this way, the phase change material is prevented from accumulating in a specific region (for example, the bottom) in the casing 131 after several phase changes and being affected by gravity, resulting in uneven distribution of the phase change material. The problem of the heat absorbing efficiency of the heat sink 13a is affected.

When the heat source 12 transmits heat to one of the outer ring regions 1313 of the heat sink 13a through heat conduction, heat can be quickly transferred to the central portion 1312 via the copper tubes 1321 and transmitted to the heat sink by the central portion 1312. The rest of the outer ring zone 1313 of 13. In this way, the corners of the heat sink 13 can be uniformly heated, so that the phase change materials in the interior of the heat sink 13 can uniformly absorb heat to perform phase change to improve the heat absorption efficiency of the heat sink 13.

According to the electronic device of the above embodiment, the heat dissipation material comprises 15% to 30% by volume of copper, 50% to 85% by volume of phase change material, and 15% to 20% by volume of air, so that the heat can be Through these copper materials, it spreads rapidly to the entire area of the radiator. Thereby, the phase change material in the interior of the heat sink can uniformly absorb heat to perform phase change to improve the heat absorption efficiency of the heat sink. In addition, since the heat dissipating material contains the phase change material, the temperature of the heat sink can be maintained at a comfortable grip temperature state for a long time during the heat absorption process. Moreover, since the heat sink of the embodiment does not need to be equipped with an exhaust fan, the heat sink of the embodiment can be advantageously used for a thinned electronic device and can reduce noise generation.

While the present invention has been described above in terms of the preferred embodiments thereof, it is not intended to limit the invention, and the invention may be modified and modified without departing from the spirit and scope of the invention. The patent protection scope of the invention is subject to the definition of the scope of the patent application attached to the specification.

10‧‧‧Electronic devices

11‧‧‧Shell

12‧‧‧heat source

13‧‧‧ radiator

13a‧‧‧heatsink

131‧‧‧Shell

1311‧‧‧ surface

1312‧‧‧Central District

1313‧‧‧Outer Ring Area

1314‧‧‧ side

1315‧‧‧Corner

132‧‧‧ Heat-dissipating materials

1321‧‧‧Bronze tube

1322‧‧‧Bronze partition

133‧‧‧Aluminum partition

14‧‧‧ boards

1 is a cross-sectional view showing the structure of an electronic device according to an embodiment of the present invention.

Fig. 2 is a bottom view showing the structure of the heat sink according to Fig. 1.

Figure 3 is a structural underside view of a heat sink according to another embodiment of the present invention.

10‧‧‧Electronic devices

11‧‧‧Shell

12‧‧‧heat source

13‧‧‧ radiator

131‧‧‧Shell

1311‧‧‧ surface

132‧‧‧ Heat-dissipating materials

14‧‧‧ boards

Claims (10)

An electronic device comprising: an outer casing; a heat source located in the outer casing; and a heat sink disposed in the outer casing, wherein the heat sink is in thermal contact with the heat source, the heat sink comprising a casing having a heat dissipating material comprising: 15% to 30% by volume of a plurality of copper materials, 50% to 85% by volume of a phase change material, and 15% to 20% by volume of an air; wherein the shell Having a surface in thermal contact with the heat source, the surface defining a central region surrounding the central region, the geometric midpoint of the central region overlapping the geometric midpoint of the surface, and the central portion The area of the area is 10% to 50% of the area of the surface, and the heat source is located in the outer ring area, and the heat sink absorbs heat of the heat source through heat conduction. The electronic device of claim 1, wherein the copper material extends from the central region toward the outer ring region. The electronic device of claim 2, wherein the copper materials are a plurality of copper tubes or a plurality of copper separators. The electronic device of claim 2, wherein at least one of the copper materials overlaps with a range in which the heat source contacts the heat sink. The electronic device of claim 2, wherein at least one of the copper material passes through a geometric midpoint of the heat sink. The electronic device of claim 2, wherein the copper materials respectively extend to respective corners of the housing of the heat sink. The electronic device of claim 2, wherein the copper materials extend to respective sides of the housing of the heat sink. The electronic device of claim 1, wherein the housing is provided with a plurality of aluminum separators, the volume percentage of the aluminum separators being less than 3% of the volume percentage of the copper materials. The electronic device of claim 8, wherein the aluminum spacers surround a geometric midpoint of the heat sink, the copper materials being a plurality of copper spacers, wherein the copper spacers are respectively from the aluminum The partition extends to the corners and sides of the housing. The electronic device of claim 1, wherein the composition of the phase change material is an alkane.