CN115551285A - Vapor chamber, heat sink, and electronic apparatus - Google Patents

Abstract

The application provides a soaking plate, a radiator and an electronic device. The vapor chamber comprises a shell, a first supporting structure and a cooling working medium, wherein the shell is provided with an accommodating cavity, the shell comprises a first part and a second part, the second part is connected with the first part in a bent mode, the first part is provided with a fin area used for being in contact with a radiating fin, and the second part is provided with a heat source area used for being in contact with a heat source; the first support structure is located between the top wall of the containing cavity and the bottom wall of the containing cavity, and the first support structure extends from the heat source area to the fin area; the cooling working medium is arranged in the first support structure. The technical scheme of this application can improve the heat dissipation reliability of soaking plate under the miniaturized, frivolous development trend of electronic equipment.

Description

Vapor chamber, heat sink, and electronic apparatus

Technical Field

The application relates to the technical field of heat dissipation, especially relates to a soaking plate, radiator and electronic equipment.

Background

With the performance of electronic equipment such as mobile phones and notebook computers being improved gradually, chips with stronger computing and processing capabilities generate more heat, and the excessive heat easily causes the temperature rise of the shells of the electronic equipment, thereby affecting the use experience of consumers and further causing the restriction on the performance of the electronic equipment. To solve the heat dissipation challenge of electronic devices, vapor chambers with high heat dissipation capability are gradually applied to electronic devices. How to improve the heat dissipation reliability of the soaking plate under the trend of miniaturization and light weight of the electronic equipment is a subject of continuous search in the industry.

Disclosure of Invention

Embodiments of the present application provide a vapor chamber, a heat sink and an electronic device, which can improve the heat dissipation reliability of the vapor chamber under the development trend of miniaturization and lightness and thinness of the electronic device.

With the development of electronic devices such as terminals and notebook computers, the electronic devices are developed towards high speed and high power density, the heat dissipation density of the electronic devices is also higher and higher, the heat dissipation becomes an important challenge for the design of the electronic devices, and whether the electronic devices can perform good heat dissipation directly affects the working reliability and the comprehensive performance of the electronic devices. At present, under the development requirements of miniaturization and light weight of electronic equipment, the layout of a soaking plate in the electronic equipment easily causes that the heat dissipation efficiency is reduced in a scene of large power consumption, the heat dissipation performance is reduced, and the requirements on high performance and excellent experience of the electronic equipment are difficult to support.

The technical solution provided by the present application can effectively solve the above problems, which will be further described below.

In a first aspect of the present application, there is provided a vapor chamber, comprising:

the shell is provided with a containing cavity and comprises a first part and a second part, the second part is connected with the first part in a bent mode, the first part is provided with a fin area used for being in contact with a heat dissipation fin, and the second part is provided with a heat source area used for being in contact with a heat source;

a first support structure located between a top wall of the containment cavity and a bottom wall of the containment cavity, the first support structure extending from the heat source region to the fin region; and

a cooling working medium disposed within the first support structure.

Based on the above description, it should be understood that, by dividing the casing into the first portion and the second portion and bending and connecting the first portion and the second portion, the overall shape of the casing can be an unconventional special-shaped structure, and the special-shaped structure can make the vapor chamber more suitable for the limited spatial layout inside the electronic equipment when being applied to the electronic equipment, so that a more compact electronic device can be laid inside the limited spatial layout, and the spatial utilization rate inside the electronic equipment can be effectively improved.

And because the radiating fins and the heat source need to be connected to the outer surface of the shell, the shell can be correspondingly provided with areas capable of contacting with the radiating fins and the heat source. Thus, the first portion has a fin area for contact with the heat dissipating fin, and the second portion has a heat source area for contact with a heat source. It should be understood that the fin region is only a partial region of the first portion and does not represent that the first portion is entirely composed of the fin region. The heat source area is only a partial area of the second portion, and does not mean that the second portion is entirely composed of the heat source area.

The case where the first support structure extends to the heat source region includes the case where a portion of the first support structure is located in the heat source region, and also includes the case where the first support structure and the heat source region are close to each other but do not have an overlapping area.

The first support structure thus has a greater extension distance for evaporation and condensation due to the longer extension distance, wherein the extension distance is understood to be the extension distance of the heat source region from the fin region. Under this setting, can guarantee that the soaking plate no matter is under the low-power consumption condition or under the high-power consumption condition, the cooling working medium that all can make after the condensation is pulled back smoothly to the heat source region, will be because of the unable quilt of condensate liquid is pulled back to heat source department in time to lead to the fact supercooling district hydrops at forced air cooling both ends, lead to the liquid temperature reduction to appear at forced air cooling both ends, but heat source department does not in time return the liquid, can't evaporate and scatter the heat and lead to the possibility that the problem that heat source department burns out takes place to reduce minimum, can guarantee the operational reliability of soaking plate.

Also promptly, first bearing structure's structure setting, on the one hand, can fully guarantee the liquid that returns of cooling working medium, reduces the possibility that the problem that the liquid cooling board leads to the performance to descend because of returning the liquid not enough takes place to the minimum, is showing the radiating efficiency who improves the soaking plate, is favorable to making the surface temperature of soaking plate more unanimous, fully guarantees the temperature uniformity of soaking plate, and can support the demand that electronic equipment is experienced to high performance, excellent. On the other hand, the soaking plate can have high heat dissipation performance under the condition of keeping small size, the thickness of the soaking plate can be reduced to the maximum extent under the development trend of miniaturization of electronic equipment, and the thinning of the soaking plate is effectively realized.

In a possible embodiment, the second portion is bent with respect to the first portion to form a receiving space for receiving a refrigeration member, and the fin region faces the refrigeration member.

That is, the second portion and the first portion can cooperate to allow for the layout space of the refrigeration piece to be stepped out, so that the refrigeration piece can be arranged opposite to the fin region. Specifically, the air outlet of the refrigeration piece can face the radiating fins arranged in the fin area, so that air can enter from the air inlet of the refrigeration piece and is exhausted from the air outlet facing the radiating fins. For example, the refrigeration element may be oriented vertically at 90 ° to provide the air.

Under this setting, the wind that the refrigeration piece blew out can directly blow to radiating fin to when the heat source generates heat, the heat source region can spread the heat conduction of heat source to the fin region, and carry the heat through blowing to the wind that sets up the radiating fin in the fin region, with take away the heat and for the radiating of the piece that generates heat.

In a possible embodiment, the first support structure comprises a first section at least partially located in the fin region and a second section at least partially located in the heat source region, the first section being disposed at an angle to the second section.

Wherein, the angle range of the included angle can be in the range of 0-180 degrees. It should be understood that the first segment may be disposed only partially in the fin region and partially in the transition region between the fin region and the heat source region. The second section may also be provided only partially in the heat source region and partially in the transition region between the fin region and the heat source region. Illustratively, the first segment and the second segment are connected in a bendable manner, wherein the bendable connection can be, but is not limited to, a right-angled bend, a rounded bend, a bevel bend, and the like.

Under this setting, can more adapt to the holistic special-shaped structure of soaking plate on first bearing structure extends to the basis in heat source district from the fin region for first bearing structure can be through turning round in order to extend to the heat source position, thereby makes first bearing structure be difficult for the rupture, and can effectively reduce coolant's liquid back resistance.

In a possible embodiment, the fin area comprises a first edge facing the refrigeration element and a second edge facing away from the refrigeration element, the first support structure is arranged between the first edge and the second edge, and the distance between the first support structure and the second edge is smaller than or equal to the distance between the first support structure and the first edge.

That is, the first support structure is spaced from the edge by a distance less than or equal to one-half the width of the fin region. In other words, first bearing structure presses close to refrigeration piece air outlet one side, on the one hand, can let out more spaces and give the steam condensation of cooling working medium, and the space of this part steam condensation can be closer to the air intake of refrigeration piece, and refrigeration efficiency is better, can reduce the pressure drop resistance of the place that the condensation volume is big simultaneously, makes the pressure drop of first bearing structure both sides tend to the balance, is favorable to strengthening the liquid that returns, improves the holistic radiating efficiency of soaking plate. On the other hand, can provide bigger turning radius for first bearing structure can possess great radian when turning round, is favorable to improving first bearing structure's structural stability and reliability.

In a possible embodiment, a coverage ratio of the first support structure with respect to the heat source region is in a range of 0% to 80%.

Wherein the coverage ratio refers to a ratio of an area of the heat source region occupied by the first support structure to a total area of the heat source region. That is, the coverage ratio of the first support structure with respect to the heat source is in the range of 0% to 80%.

Therefore, the first supporting structure can extend to the heat source area, on one hand, the condensed cooling working medium can smoothly flow back to the heat source area, the liquid return resistance is reduced, and the working medium circulation of 'evaporation-condensation-. Evaporation' of the cooling working medium is guaranteed. On the other hand, the vapor diffusion space for evaporating the cooling working medium in a certain proportion in the heat source area can be ensured, and the reduction of the vapor pressure drop of the heat source area is facilitated.

In a possible embodiment, the first supporting structure may have a plurality of steam passages, and the plurality of steam passages are communicated with the accommodating cavity and are arranged at intervals.

For example, the cross-sectional shape of the steam channel may be rectangular, oval, trapezoidal, and the like, and may be adjusted according to the actual situation, which is not limited strictly.

From this, through set up a plurality of steam passage on first bearing structure, can select adjacent steam passage to get into nearby when making steam diffusion, compare because of first bearing structure is solid structure among the prior art, and the structure setting that separates completely the space of accepting the chamber of first bearing structure both sides, can show the distance that shortens steam diffusion, effectively reduce the steam pressure drop of accepting the intracavity.

In a possible embodiment, the heights of the plurality of steam channels are all the same, and the heights are the sizes of the steam channels along the direction perpendicular to the bottom wall of the accommodating cavity; alternatively, the first and second liquid crystal display panels may be,

the heights of the steam channels are different, and the heights of the steam channels are the same as the sizes of the steam channels in the direction perpendicular to the bottom wall of the accommodating cavity.

Based on the above description, it should be understood that the plurality of steam channels can flexibly select the stepped layout with equal height or different heights according to actual conditions, which is beneficial to adapting to application requirements in multiple scenes and improving the overall comprehensive performance of the soaking plate.

In one possible embodiment, the plurality of vapor channels are each located in the heat source area; alternatively, the plurality of steam channels are all located in the fin region; alternatively, the plurality of vapor channels are located in the heat source region and the fin region.

It will be appreciated that, ideally, the steam channels may be evenly arranged on the first support structure. In practical applications, however, the actual arrangement of the steam channel on the first support structure may be adjusted according to the specific application environment. In the limit case, for example, when the number of steam passages is set to the minimum, the heat source region and the fin region are preferably set. Based on this, the quantity of steam channel can carry out nimble adjustment along with concrete application environment, only need guarantee can leave enough certain space for steam diffusion can, this embodiment does not do strict limitation to this.

In a possible implementation manner, the bottom wall of the accommodating cavity is an inner wall of the accommodating cavity on a side close to the heat source, one end of the first supporting structure is connected to the bottom wall of the accommodating cavity, and at least a part of the other end of the first supporting structure is connected to the top wall of the accommodating cavity.

Therefore, at least part of the first supporting structure can not contact the shell, a certain space can be reserved for steam diffusion under the condition of playing a certain supporting effect, the steam pressure drop in the accommodating cavity is effectively reduced, and the soaking plate has good working stability and reliability.

In a possible implementation manner, the bottom wall of the accommodating cavity is an inner wall of the accommodating cavity on a side close to the heat source, one end of the first supporting structure is connected to the bottom wall of the accommodating cavity, and the other end of the first supporting structure is spaced from the top wall of the accommodating cavity.

Thereby, one end of the first support structure can be completely free from contact with the housing, i.e. the first support structure is completely free from supporting effect inside the receiving cavity. Under this setting, can show to reduce and accept the inside steam pressure drop of chamber under the holistic intensity of soaking plate satisfies the condition of requirement.

In a possible implementation manner, the vapor chamber is characterized in that the bottom wall of the accommodating chamber is that the accommodating chamber is close to the inner wall on one side of the heat source, the vapor chamber further comprises a first capillary layer and a second capillary layer, the first capillary layer is arranged on the bottom wall of the accommodating chamber and is connected with one end of the first supporting structure, and the second capillary layer is arranged on the top wall of the accommodating chamber and is in contact with or spaced from the other end of the first supporting structure.

Based on the above description, it should be understood that the capillary layer may be disposed on the top wall of the receiving cavity, may also be disposed on the bottom wall of the receiving cavity, and may also be disposed on both the top wall of the receiving cavity and the bottom wall of the receiving cavity, so as to enhance the liquid returning capability and increase the heat transfer amount.

In a possible embodiment, the first capillary layer comprises a plurality of first sub-capillary layers which are stacked, and the mesh number of the first sub-capillary layers which are in contact with the bottom wall of the accommodating cavity is smaller than or equal to that of the first sub-capillary layers which are not in contact with the bottom wall of the accommodating cavity.

Namely, when the multi-layer capillary layer structure is used in a matching manner, the capillary layer with the small mesh number close to the heat source side and the capillary layer with the large mesh number far away from the heat source side are arranged, so that the capillary layer with the small mesh number can store more liquid, the liquid return resistance is small, the capillary layer with the large mesh number has larger capillary force, and the liquid return capacity can be enhanced.

Or the mesh number of the first sub-capillary layer in contact with the bottom wall of the containing cavity is larger than that of the first sub-capillary layer not in contact with the bottom wall of the containing cavity.

In a possible embodiment, the outer surface of the first support structure is provided with grooves.

Therefore, the porosity of the first support structure can be improved, the capillary force of the first support structure is enhanced, and a good heat dissipation and cooling effect is achieved.

In a possible embodiment, the vapor chamber further comprises a plurality of second support structures, the plurality of second support structures are connected between the top wall of the containing cavity and the bottom wall of the containing cavity, and the plurality of second support structures are arranged at intervals in the fin area and the heat source area.

From this, second bearing structure can play the effect that supports the roof of accepting the chamber and the diapire of accepting the chamber, effectively improves the holistic bending rigidity of soaking board, can provide the mechanical strength of preferred for the soaking board is whole can become the harder non-deformable structure of intensity, guarantees the reliability of soaking board during operation.

It should be noted that the number and the spacing of the second support structures may be adjusted according to the actual situation of the soaking plate, and the denser second support structures may be arranged at the places with smaller local bending stiffness, and the sparser second support structures may be arranged at the places with larger local bending stiffness, which is not strictly limited in the embodiments of the present application.

In a possible embodiment, a cooling medium is also provided inside the second support structure.

In a second aspect, the present application also provides a heat sink comprising heat dissipating fins attached to the outer surface of the fin region and the heat spreader plate as described above.

In a third aspect, the present application further provides an electronic device, where the electronic device includes a heat source and the heat sink as described above, and the heat source and the heat sink are disposed on the same side.

Drawings

Fig. 1 is a schematic structural diagram of an electronic device provided in an embodiment of the present application;

fig. 2 is an exploded schematic view of a part of the structure of an electronic device provided in an embodiment of the present application;

FIG. 3 is a schematic structural diagram of a heat sink provided in an embodiment of the present application;

fig. 4 is a schematic structural view of a vapor chamber provided in the embodiment of the present application;

FIG. 5 is an angle structure of a soaking plate according to the embodiment of the present application;

fig. 6 is a schematic view of a first partial cross section of a vapor chamber provided in an embodiment of the present application;

FIG. 7 is another schematic structural view of a soaking plate provided in the embodiments of the present application;

FIG. 8 is a schematic view of another structure of the soaking plate provided by the embodiment of the application;

FIG. 9 is a schematic view of another structure of a vapor chamber provided in the embodiments of the present application;

fig. 10 is a schematic view of a fifth structure of a soaking plate provided in the embodiment of the present application;

fig. 11 is a second partial cross-sectional view of a vapor chamber provided in an embodiment of the present application;

FIG. 12 is a schematic sectional view of a third part of a soaking plate provided in the embodiment of the present application;

fig. 13 is a schematic sectional view of a fourth part of the soaking plate provided in the embodiment of the present application;

fig. 14 is a schematic sectional view of a fifth part of a vapor chamber provided in the embodiment of the present application;

fig. 15 is a schematic sectional view of a sixth partial section of a vapor chamber provided in an embodiment of the present application;

fig. 16 is a schematic sectional view of a seventh part of a vapor chamber provided in the embodiment of the present application;

fig. 17 is a schematic sectional view of an eighth partial vapor chamber provided in the embodiment of the present application;

fig. 18 is a schematic sectional view of a ninth portion of a vapor chamber provided in an embodiment of the present application;

fig. 19 is a tenth partial sectional view schematically illustrating a soaking plate according to an embodiment of the present application;

fig. 20 is an eleventh partially sectional schematic view of a vapor chamber provided in an embodiment of the present application;

fig. 21 is a schematic view, partially in section, of a twelfth vapor chamber provided in an embodiment of the present application;

fig. 22 is a schematic sectional view of a thirteenth part of a vapor chamber provided in an embodiment of the present application.

Detailed Description

For convenience of understanding, terms referred to in the embodiments of the present application are first explained.

And/or: only one kind of association relationship describing the associated object, indicates that there may be three kinds of relationships, for example, a and/or B, may indicate: a exists alone, A and B exist simultaneously, and B exists alone.

A plurality of: two or more than two.

Connecting: it should be understood that, for example, A and B are connected, either directly or indirectly through an intermediate.

Specific embodiments of the present application will be described more clearly below with reference to the accompanying drawings.

With the development of electronic devices such as terminals and notebook computers, the electronic devices are developed towards high speed and high power density, the heat dissipation density of the electronic devices is also higher and higher, the heat dissipation becomes an important challenge for the design of the electronic devices, and the working reliability and the comprehensive performance of the electronic devices are directly affected by whether the electronic devices can perform good heat dissipation. At present, under the development requirements of miniaturization and lightness and thinness of electronic equipment, the layout of a vapor chamber in the electronic equipment easily causes the reduction of heat dissipation efficiency in a scene with large power consumption, the heat dissipation performance is reduced, and the requirements on high performance and excellent experience of the electronic equipment are difficult to support.

Accordingly, embodiments of the present invention provide a soaking plate 100, a heat sink 200 using the soaking plate 100, and an electronic apparatus 300 using the heat sink 200, which can improve the heat dissipation reliability of the soaking plate 100 in the trend of miniaturization and light weight of the electronic apparatus 300.

The soaking plate 100 has a good heat dissipation performance, the heat dissipation efficiency can be always maintained at a high level, the heat dissipation requirements in the situations of low power consumption and high power consumption can be met, and the soaking plate can be suitable for special-shaped structures. It should be understood that the deformed structure refers to a structure that exhibits a non-rectangular form, as distinguished from a conventional square rectangular structure. Illustratively, the shaped structure may be T-shaped, L-shaped, C-shaped, S-shaped, or the like. It should be noted that, the shape of the special-shaped structure may be flexibly adjusted according to the layout of the devices inside the electronic device 300, and is not limited to the shape described above, and any structure that can adapt to the layout of the devices inside the electronic device 300 and has a non-rectangular shape is within the scope of protection of the embodiments of the present application, and is not strictly limited thereto.

The vapor chamber 100 may be applied to any electronic device 300 or base station requiring high heat dissipation and light weight. By way of example, the electronic device 300 may be, but is not limited to, a cell phone, a tablet computer, a laptop computer, a wireless charger, augmented Reality (AR), virtual Reality (VR), and the like.

For convenience of understanding, the electronic device 300, such as a notebook computer, having a wide use range and a rich application scenario is described as an example, but not limited thereto.

Referring to fig. 1 and fig. 2, the electronic device 300 includes a housing 310, a heat source 320 disposed inside the housing 310, a heat sink 200, and a cooling element 330.

The housing 310 is an appearance structure of the electronic device 300, and can accommodate and encapsulate various components of the electronic device 300, so that the various components of the electronic device 300 are protected from external dust, moisture, and the like, and the electronic device has a good protection function.

The heat source 320 is a component that generates heat during the operation of the electronic device 300, and can transfer the heat to the heat sink 200 by directly or indirectly contacting the heat sink 200, and then radiate the heat to the external environment by various types of heat radiation of the heat sink 200, natural convection, or air cooling of a fan. The heat balance of the heat source 320 directly affects the operation performance of the electronic device 300, for example, overheating may cause the electronic device 300 to fail, and therefore a corresponding heat dissipation layout needs to be performed for the heat balance of the heat source 320. Illustratively, the heat source 320 may be a chip, a Central Processing Unit (CPU), a Graphics Processing Unit (GPU), a wireless module, a battery, or the like.

The heat sink 200 is a structure capable of conducting, diffusing, or exchanging heat generated by the heat source 320 to dissipate the heat of the heat source 320, and is capable of minimizing the possibility of interference with the normal operation of the electronic device 300 due to the excessive temperature of the heat source 320.

The cooling member 330 is a power source capable of flowing air in the electronic device 300, and is disposed near the heat sink 200, so that the cold air entering the electronic device 300 is forced by the cooling member 330 to blow toward the heat sink 200 and carries heat of the upper heat sink 200 by flowing to dissipate heat of the heat sink 200. Illustratively, the cooling member 330 may be a fan, which may be, but is not limited to, a centrifugal fan, an axial fan, and a piezoelectric fan.

It is understood that the number of the heat sources 320 may be selected according to actual conditions, and may be one or more. That is, in the case where the number of the heat sources 320 is one, the heat sink 200 may be a single heat source heat sink 200. When the number of the heat sources 320 is multiple, the heat sink 200 may be a multi-heat-source heat sink 200, wherein the number and the position layout of the heat sources 320 may be flexibly adjusted according to the hardware form, the layout, the use scenario, and the like of the electronic device 300, and the embodiment of the present application is not strictly limited thereto. Therefore, the heat sink 200 can meet the heat dissipation requirements of a single heat source and multiple heat sources, can be more suitable for multi-scenario application, and is beneficial to improving the comprehensive performance of the electronic device 300.

In addition, the number of the heat sinks 200 may be configured to be one or more according to the heat dissipation requirement of the electronic device 300, and when the heat sink 200 is configured to be plural, the plurality of heat sinks 200 may be arranged at different positions of the electronic device 300 according to the distribution of the heat source 320. Alternatively, a plurality of heat sinks 200 may be connected in series. The serial connection mode may be a simple physical stacking mode, or may be a serial connection structure formed by welding, bonding, or integrated processing, and the embodiment of the present application is not limited thereto.

It should be noted that fig. 1 and fig. 2 are only intended to schematically describe the relative position relationship of the housing 310, the heat source 320 and the heat sink 200, and do not specifically limit the connection position, the specific configuration and the number of the devices. The structure illustrated in the embodiment of the present application is not intended to specifically limit the electronic device 300. In other embodiments of the present application, the electronic device 300 may include more or fewer components than illustrated, or combine certain components, or split certain components, or a different arrangement of components. The illustrated components may be implemented in hardware, software, or a combination of software and hardware.

It is understood that during operation of the electronic device 300, the heat source 320 may generate a large amount of heat as a heat generating device, thereby forming hot spots at corresponding locations within the electronic device 300. If the temperature of the hot spot is high, the heat generated by the hot spot may not be dissipated timely and may directly affect the operation performance of the electronic device 300, for example, if the electronic device 300 fails due to local overheating. And the temperature of the shell 310 at the position corresponding to the hot spot is also relatively high, which causes local overheating of the shell 310 and seriously affects the user experience. That is, the thermal equilibrium of the electronic device 300 may directly affect the performance of the electronic device 300.

Accordingly, by providing the heat sink 200 inside the electronic device 300, it is possible to effectively solve the problem of failure of the electronic device 300 due to a large amount of heat generated by the heat source 320, and the heat dissipation performance of the electronic device 300 is excellent.

Referring to fig. 3, the heat spreader 200 includes a soaking plate 100 and heat dissipation fins 210 connected to the soaking plate 100. The soaking plate 100 can be used as a carrier of the heat dissipating fins 210, and can provide protection, support, heat dissipation, assembly, etc. to the heat dissipating fins 210, and has a good heat dissipation capability, so as to conduct the heat of the heat source 320 to the heat dissipating fins 210, thereby achieving the heat dissipation effect of the heat dissipating fins 210. For example, the heat dissipation fins 210 may have a comb shape, but the shape of the heat dissipation fins 210 is not limited to the comb shape, and the shape that can exert the heat dissipation effect and is connected to the soaking plate 100 may be within the scope of the embodiments of the present application, and is not limited thereto.

It can be understood that the vapor chamber 100 may have a special-shaped structure suitable for use in the miniaturized, light and thin electronic device 300, and the special-shaped structure may be more suitable for a limited spatial layout than the square rectangular structure of the vapor chamber 100 in the prior art, so as to effectively improve the space utilization rate inside the electronic device 300 when applied to the electronic device 300.

It should be noted that the soaking plate 100 provided in the embodiment of the present application is not only applicable to the special-shaped structure, but also applicable to the square rectangular structure, and the soaking plate 100 is taken as the special-shaped structure as an example for description, but it should be understood that the invention is not limited thereto.

Referring to fig. 4-22, the soaking plate 100 includes a casing 10, a first supporting structure 20, a second supporting structure 30 and a cooling medium, wherein the direction of the arrow in fig. 4, 7, 8 and 10 is the flow direction of the wind.

The housing 10 includes a first portion 11 and a second portion 12, and the second portion 12 is connected to the first portion 11 by bending, wherein the bending connection may be, but not limited to, a right-angled bend, a round-angled bend, a bevel bend, and the like. That is, the second portion 12 and the first portion 11 are disposed at an included angle, and the included angle may be in a range of 0 ° to 180 °.

Illustratively, the first portion 11 may have an elongated shape, the second portion 12 may have a rectangular shape, and the second portion 12 and the first portion 11 are connected by bending to form the T-shaped housing 10.

Since the heat radiating fins 210 and the heat source 320 are connected to the outer surface of the case 10, the case 10 is provided with a region capable of contacting the heat radiating fins 210 and the heat source 320. Thus, the first portion 11 has a fin region 111 for contact with the heat radiation fin 210, and the second portion 12 has a heat source region 121 for contact with the heat source 320. It should be understood that the fin region 111 is only a partial region of the first portion 11, and does not represent that the first portion 11 is entirely composed of the fin region 111. The heat source area 121 is only a partial area of the second portion 12, and does not mean that the second portion 12 is entirely composed of the heat source area 121.

Illustratively, as shown in fig. 5, the second portion 12 is disposed at a middle position of the first portion 11, and the second portion 12 is disposed perpendicularly with respect to the first portion 11, so that the housing 10 as a whole can assume a T-shaped configuration. Whereas in fig. 5, there are two fin regions 111 disposed at opposite ends of the horizontal portion of the T-shape, and one heat source region 121 disposed at an end of the vertical portion of the T-shape remote from the horizontal portion.

It should be noted that the position relationship between the first portion 11 and the second portion 12 can be flexibly adjusted according to the arrangement of the actual electronic devices inside the electronic device 300, and the position relationship and the number of the fin regions 111 and the heat source regions 121 can also be arranged according to the number of the heat sources 320 and the number and the position relationship of the cooling members 330 inside the electronic device 300, which is not strictly limited in the embodiment of the present application.

By dividing the casing 10 into the first portion 11 and the second portion 12 and bending and connecting the first portion 11 and the second portion 12, the overall shape of the casing 10 can be an unconventional special-shaped structure, and the special-shaped structure can enable the vapor chamber 100 to be more suitable for the internal localized spatial layout of the electronic equipment 300 when being applied to the electronic equipment 300, so that a more compact electronic device can be arranged in a limited space, and the space utilization rate in the electronic equipment 300 can be effectively improved.

For example, referring to fig. 4, the second portion 12 is bent relative to the first portion 11 to form a receiving space for receiving the refrigeration member 330, and the refrigeration member 330 faces the fin region 111. That is, the second portion 12 and the first portion 11 can cooperate to step out the layout space of the refrigeration member 330, so that the refrigeration member 330 can be disposed opposite to the fin region 111. Specifically, the air outlet of the refrigeration member 330 may face the heat dissipation fins 210 disposed in the fin region 111, so that air can be introduced from the air inlet of the refrigeration member 330 and discharged from the air outlet facing the heat dissipation fins 210. For example, the cooling member 330 may be oriented vertically at 90 ° to the air.

With this arrangement, the wind blown out from the cooling member 330 can directly blow to the heat dissipation fins 210, so that when the heat source 320 generates heat to generate heat, the heat source area 121 can conduct and diffuse the heat of the heat source 320 to the fin area 111, and the wind blowing to the heat dissipation fins 210 arranged in the fin area 111 carries the heat to take away the heat to dissipate the heat for the heat generating member.

Referring to fig. 4 and 6, the first portion 11 and the second portion 12 cooperate to form a receiving cavity 13 located in the housing 10, and the receiving cavity 13 can receive a structure for implementing the functions related to the vapor chamber 100 and allow the cooling medium to evaporate and condense therein.

Specifically, the casing 10 includes a top cover plate 14 and a bottom cover plate 15, and the top cover plate 14 and the bottom cover plate 15 together constitute an appearance of the vapor chamber 100. It should be understood that the top cover plate 14 has a first portion and a second portion, and the bottom cover plate 15 also has a first portion and a second portion, the first portion of the top cover plate 14 and the first portion of the bottom cover plate 15 being correspondingly disposed and collectively forming the first portion 11 of the housing 10, and the second portion of the top cover plate 14 and the second portion of the bottom cover plate 15 being correspondingly disposed and collectively forming the second portion 12 of the housing 10.

Illustratively, the top and bottom cover plates 14, 15 may be made of a metallic material, which may be, but is not limited to, copper, stainless steel, titanium, aluminum alloy, magnesium alloy, and the like. Can select different materials according to lightweight demand, the difficult easy demand of welding, cost demand and heat conductivity demand, for example, if need choose the optional titanium of light-weighted material for use, if need choose the optional stainless steel of the material of easily welding and cost are lower for use, if need choose the optional copper of the better material of heat conductivity for use, do not strictly limit to this. In addition, the top cover plate 14 and the bottom cover plate 15 may be formed by punching or etching.

The top cover plate 14 and the bottom cover plate 15 cooperate to form the receiving cavity 13, an inner wall of the top cover plate 14 may form one of a top wall 131 of the receiving cavity 13 or a bottom wall 132 of the receiving cavity 13, and an inner wall of the bottom cover plate 15 may form the other of the top wall 131 of the receiving cavity 13 or the bottom wall 132 of the receiving cavity 13. And the first and second support structures 20 and 30 are each located between a top wall 131 of the housing chamber 13 and a bottom wall 132 of the housing chamber 13, and the cooling medium is provided in the first and second support structures 20 and 30.

That is, the first and second support structures 20 and 30 may be regarded as capillary structures in the soaking plate 100, in which a cooling medium flows to effect vapor phase conversion. In an exemplary manner, the first and second electrodes are, the cooling medium 30 may be water, an inert fluorinated liquid, a refrigerant R134a (1, 2-tetrafluoroethane), a refrigerant R245fa (1, 3-pentafluoropropane) one or more of refrigerant R1234ze (1, 3-tetrafluoropropene), refrigerant R1233zd (1-chloro-3, 3-trifluoropropene), and combinations thereof.

The bottom wall 132 of the housing cavity 13 is used as an inner wall of the housing cavity 13 near the heat source 320 for illustration, but it should be understood that the invention is not limited thereto.

Referring to fig. 4, 11-22, in an embodiment of the present disclosure, the first supporting structure 20 is located between the top wall 131 and the bottom wall 132 of the receiving cavity 13, and the first supporting structure 20 extends from the fin region 111 to the heat source region 121. Illustratively, the first support structure 20 may be a drywall. Alternatively, the first support structure 20 may be a braided wire. Alternatively, the first support structure 20 may be a support column. Alternatively, the first support structure 20 may be a powder pillar.

It should be understood that the case where the first support structure 20 extends to the heat source region 121 includes the case where a portion of the first support structure 20 is located in the heat source region 121, and also includes the case where the first support structure 20 and the heat source region 121 are close to each other but do not have an overlapping area.

Specifically, the coverage ratio of the first support structure 20 with respect to the heat source region 121 is in the range of 0% to 80%, where the coverage ratio refers to a ratio of an area of the heat source region 121 occupied by the first support structure 20 with respect to the total area of the heat source region 121. That is, the coverage ratio of the first support structure 20 with respect to the heat source 320 is in the range of 0% to 80%.

Therefore, the first supporting structure 20 can extend to the heat source area 121, on one hand, condensed cooling working media can smoothly flow back to the heat source area 121, liquid return resistance is reduced, and working media circulation of evaporation-condensation-evaporation of the cooling working media is guaranteed. On the other hand, a certain proportion of vapor diffusion space for evaporation of the cooling working medium can be ensured in the heat source area 121 all the time, which is beneficial to reducing the vapor pressure drop of the heat source area 121.

Referring to fig. 4 and fig. 7, the fin area 111 includes a first side 112 facing the cooling element 330 and a second side 113 facing away from the cooling element 330, and the first supporting structure 20 is disposed between the first side 112 and the second side 113, wherein the first side 112 is close to the air inlet side of the cooling element 330, and the second side 113 is close to the air outlet side of the cooling element 330.

In one possible embodiment, as shown in fig. 4, the distance between the first support structure 20 and the second edge 113 is less than or equal to the distance between the first support structure 20 and the first edge 112. That is, the first support structure 20 is spaced from the edge by a distance less than or equal to one-half the width of the fin region 111.

In other words, first bearing structure 20 is pressed close to refrigeration piece 330 air outlet one side, on the one hand, can let out more spaces and give the steam condensation of cooling working medium, and the space of this part steam condensation can be more close to the air intake of refrigeration piece 330, and refrigeration efficiency is better, can reduce the pressure drop resistance of the place that the condensation volume is big simultaneously, makes the pressure drop of first bearing structure 20 both sides tend to balance, is favorable to strengthening the liquid that returns, improves the holistic radiating efficiency of soaking plate 100. On the other hand, can provide bigger turning radius for first bearing structure 20 can possess great radian when turning round, is favorable to improving first bearing structure 20's structural stability and reliability.

In another possible embodiment, as shown in fig. 7, the distance between the first support structure 20 and the second edge 113 is greater than the distance between the first support structure 20 and the first edge 112. That is, the first support structure 20 is proximate to the air inlet side of the cooling member 330.

Based on the above description, it should be understood that the position of the first support structure 20 can be flexibly adjusted according to the actual condition of the cooling medium condensation, the overall layout of the soaking plate 100, and the like, without being strictly limited thereto.

It can be understood that, in the embodiment of the present application, the heat source 320 is disposed on the same side as the heat dissipation fins 210, and evaporation and condensation of the soaking plate 100 can be maintained in the same horizontal direction, so that the cooling medium can absorb heat to become steam and pull it away from the left and right, the steam condenses into liquid and pulls it back to the left and right, and this process is repeated and cycled to form a complete working medium cycle, so that the soaking plate 100 can improve the temperature equalization performance and the heat conduction capability of the soaking plate 100 through the phase change of gas and liquid.

Based on the above description, it should be understood that the first support structure 20 has a greater pulling distance for evaporation and condensation due to having a longer pulling distance, wherein the pulling distance can be understood as a pulling distance of the heat source region 121 from the fin region 111. Under this setting, no matter can guarantee that vapor chamber 100 is under the low-power consumption condition or under the high-power consumption condition, the cooling working medium that all can make after the condensation is drawn back to heat source region 121 smoothly, will be because of the unable timely drawn back of condensation liquid is to heat source 320 department to cause the supercooling district hydrops at forced air cooling both ends, lead to the forced air cooling both ends to appear the liquid temperature reduction, but heat source 320 department does not return the liquid in time, unable evaporation is scattered the heat and is leaded to the possibility that the problem that heat source 320 department burns out to take place to reduce minimum, can guarantee vapor chamber 100's operational reliability.

Also promptly, the structure setting of first bearing structure 20, on the one hand, can fully guarantee the liquid that returns of cooling working medium, reduce the possibility that the problem that the liquid cooling board leads to the performance to descend because of returning the liquid not enough takes place to the minimum, show the radiating efficiency who improves vapor chamber 100, be favorable to making vapor chamber 100's surface temperature more unanimous, fully guarantee vapor chamber 100's temperature uniformity nature, and can support electronic equipment 300 to high performance, excellent demand of experiencing. On the other hand, the heat spreader 100 can have high heat dissipation performance while maintaining a small volume, which is advantageous for reducing the thickness of the heat spreader 100 to the maximum extent in the trend of miniaturization of the electronic device 300, and thus, the heat spreader 100 can be made thinner and lighter.

Referring to fig. 4, the first supporting structure 20 includes a first section 21 at least partially located in the fin region 111 and a second section 22 at least partially located in the heat source region 121, and the first section 21 and the second section 22 form an included angle, where the included angle may be in a range of 0 ° to 180 °. It should be understood that the first segment 21 may be disposed only partially in the fin region 111 and partially in the transition region between the fin region 111 and the heat source region 121. The second segment 22 may be disposed only partially in the heat source region 121 and partially in the transition region between the fin region 111 and the heat source region 121. Illustratively, the first segment 21 and the second segment 22 are bendable, wherein the bending connection can be, but is not limited to, a right-angled bend, a rounded bend, a bevel bend, and the like.

With this arrangement, the first support structure 20 can be more adapted to the overall irregular structure of the soaking plate 100 on the basis that the first support structure 20 extends from the fin region 111 to the heat source region 121, so that the first support structure 20 can extend to the position of the heat source 320 by turning, and thus the first support structure 20 is not easily broken, and the liquid return resistance of the cooling medium can be effectively reduced.

For example, as shown in fig. 4, the soaking plate 100 may be T-shaped, the number of the first supporting structures 20 may be two, and the two first supporting structures 20 are respectively disposed at the left and right ends of the T-shaped soaking plate 100, so as to ensure that the liquid returns can be realized at both the left and right ends of the T-shaped soaking plate 100, which is beneficial to improving the working performance of the soaking plate 100.

Alternatively, as shown in fig. 8, the soaking plate 100 may have a T-shape, and the first support structure 20 may be one in number but have two branches. That is, the first support structure 20 extends from the heat source region 121 to the fin region 111, branches off during the extension, and extends to both left and right ends of the T-shaped soaking plate 100.

Alternatively, as shown in fig. 9, the soaking plate 100 may have a T-shape, the number of the first support structures 20 may be plural, and the plural first support structures 20 may be equally divided into two parts, one part being disposed at one end of the soaking plate 100 of the T-shape, and the other part being disposed at the other end of the soaking plate 100 of the T-shape.

Alternatively, as shown in fig. 10, the soaking plate 100 may have a T shape, the number of the first support structures 20 may be two, and two first support structures 20 are provided at the left and right ends of the T-shaped soaking plate 100, respectively. Each first supporting structure 20 has a plurality of substructures 24, and two adjacent substructures 24 are spaced apart from each other. That is, each of the first support structures 20 is not a continuously extending structure but an intermittently extending structure.

It should be noted that fig. 4, 8, 9 and 10 only schematically illustrate the number and arrangement of the first support structures 20, and the position, specific configuration and number of the first support structures 20 are not specifically limited, and the position, specific configuration and number of the first support structures 20 may be arranged according to the actual shape and configuration of the soaking plate 100, which is not strictly limited in the embodiment of the present application.

In a possible embodiment, at least part of the first support structure 20 is supported between the top wall 131 of the housing cavity 13 and the bottom wall 132 of the housing cavity 13. Illustratively, as shown in fig. 12, one end of the first supporting structure 20 is connected to the bottom wall 132 of the receiving cavity 13, and at least a portion of the other end of the first supporting structure 20 is connected to the top wall 131 of the receiving cavity 13.

Therefore, at least part of the first supporting structure 20 does not contact the shell 10, and a certain space is reserved for steam diffusion under the condition of playing a certain supporting role, so that the steam pressure drop in the accommodating cavity 13 is effectively reduced, and the vapor chamber 100 has good working stability and reliability.

In another possible embodiment, one end of the first supporting structure 20 is connected to one of the top wall 131 or the bottom wall 132 of the receiving cavity 13, and the other end of the first supporting structure 20 is connected to the other of the top wall 131 or the bottom wall 132 of the receiving cavity 13. Illustratively, as shown in fig. 13, one end of the first supporting structure 20 is connected to the bottom wall 132 of the receiving cavity 13, and the other end of the first supporting structure 20 is spaced from the top wall 131 of the receiving cavity 13.

Thereby, one end of the first support structure 20 can be completely free from contact with the housing 10, i.e. the first support structure 20 does not support at all inside the housing cavity 13. With this arrangement, the vapor pressure drop inside the storage chamber 13 can be significantly reduced when the strength of the entire soaking plate 100 satisfies the requirement.

Referring to fig. 14-17, in an embodiment of the present application, the first supporting structure 20 may have a plurality of steam channels 23, the plurality of steam channels 23 are communicated with the receiving cavity 13 and are arranged at intervals, and the steam channels 23 may be used for the passage of steam of the cooling medium. For example, the cross-sectional shape of the steam channel 23 may be rectangular, oval, or trapezoidal, and may be adjusted according to actual conditions, which is not limited strictly.

Therefore, by providing the plurality of steam passages 23 in the first support structure 20, it is possible to select the adjacent steam passages 23 to enter when the steam is diffused, and compared with the structure in which the space of the housing chamber 13 on both sides of the first support structure 20 is completely partitioned because the first support structure 20 is a solid structure in the prior art, it is possible to significantly shorten the distance of the steam diffusion and effectively reduce the steam pressure drop in the housing chamber 13.

Illustratively, a plurality of steam channels 23 are each located in the heat source area 121. Alternatively, the plurality of steam channels 23 are each located in the fin region 111. Alternatively, the plurality of steam passages 23 are located in the heat source region 121 and the fin region 111. It will be appreciated that, ideally, the steam channels 23 may be evenly arranged on the first support structure 20. In practical applications, however, the actual arrangement of the steam channel 23 on the first support structure 20 will be adjusted according to the specific application environment. In a limit case, for example, when the number of the steam passages 23 is set to the minimum, the arrangement in the heat source region 121 and the fin region 111 is prioritized. Based on this, the number of the steam channels 23 can be flexibly adjusted along with the specific application environment, and only a certain space is required to be reserved for steam diffusion, which is not strictly limited in this embodiment.

In a possible embodiment, as shown in fig. 14 and 15, the heights of the plurality of steam channels 23 are all the same, and the height is the dimension of the steam channel 23 along the direction perpendicular to the bottom wall 132 of the containing cavity 13. In the present embodiment, the first support structure 20 may be supported completely between the top wall 131 and the bottom wall 132 of the housing cavity 13, may be supported partially between the top wall 131 and the bottom wall 132 of the housing cavity 13, or may not support the entire housing 10.

In another possible embodiment, as shown in fig. 16 and 17, the heights of the plurality of steam channels 23 are different, and the height is the dimension of the steam channel 23 along the direction perpendicular to the bottom wall 132 of the accommodating cavity 13. In the present embodiment, the first support structure 20 may be supported completely between the top wall 131 and the bottom wall 132 of the housing cavity 13, may be supported partially between the top wall 131 and the bottom wall 132 of the housing cavity 13, or may not support the entire housing 10.

Based on the above description, it should be understood that the plurality of steam channels 23 can flexibly select the stepped layout with equal height or different heights according to actual situations, which is beneficial to adapting to application requirements in multiple scenes and improving the overall performance of the vapor chamber 100.

Illustratively, the outer surface of the first support structure 20 is provided with grooves. Therefore, the porosity of the first support structure 20 can be improved, the capillary force of the first support structure 20 is enhanced, and a good heat dissipation and cooling effect is achieved.

Referring to fig. 4 and 11, a plurality of second support structures 30 are connected between the top wall 131 of the receiving cavity 13 and the bottom wall 132 of the receiving cavity 13, and the plurality of second support structures 30 are arranged at intervals in the fin region 111 and the heat source region 121. Therefore, the second support structure 30 can support the top wall 131 of the accommodating cavity 13 and the bottom wall 132 of the accommodating cavity 13, effectively improve the overall bending rigidity of the soaking plate 100, provide better mechanical strength for the soaking plate 100 as a whole, enable the soaking plate 100 as a whole to be a non-deformable structure with harder strength, and ensure the reliability of the soaking plate 100 during operation.

It should be noted that the number and the spacing of the second support structures 30 may be adjusted according to the actual situation of the soaking plate 100, and the denser second support structures 30 may be disposed at the places with smaller local bending stiffness, and the sparser second support structures 30 may be disposed at the places with larger local bending stiffness, which is not strictly limited in the embodiment of the present application.

In one possible embodiment, as shown in fig. 18, the vapor chamber 100 further comprises a first capillary layer 40, and the first capillary layer 40 is disposed on the bottom wall 132 of the containing cavity 13 and connected to one end of the first supporting structure 20. In the present embodiment, the first support structure 20 and the second support structure 30 may be embedded in the first capillary layer 40, or the first support structure 20 and the second support structure 30 may not be embedded in the first capillary layer 40, which is not limited strictly.

Illustratively, the first capillary layer 40 may be composed of a porous type structure such as a mesh, a wire, a powder, a foam, and the like. The material may be a metal material, for example, the material of the first capillary layer 40 may include one or more metal composite materials such as copper, titanium, stainless steel, aluminum alloy, magnesium alloy, and the like, or other composite materials such as flexible polyimide, plastic, and the like.

Under the arrangement, the whole capillary acting force of the soaking plate 100 can be enhanced, the liquid returning capacity of the cooling working medium is enhanced, and the heat dissipation performance of the soaking plate 100 is improved.

Illustratively, as shown in fig. 19, the first capillary layer 40 includes a plurality of first sub-capillary layers 41 stacked in layers, and the mesh number of the first sub-capillary layers 41 contacting the bottom wall 132 of the housing cavity 13 is smaller than or equal to that of the first sub-capillary layers 41 not contacting the bottom wall 132 of the housing cavity 13. That is, when the multi-layer capillary layer structure is used in combination, the capillary layer with small mesh number close to the heat source 320 side and the capillary layer with large mesh number far away from the heat source 320 side are arranged, so that the capillary layer with small mesh number can store more liquid, the liquid return resistance is also small, the capillary layer with large mesh number has larger capillary force, and the liquid return capacity can be enhanced. Of course, the mesh number of the first sub-capillary layer 41 contacting the bottom wall 132 of the housing cavity 13 can be larger than the mesh number of the first sub-capillary layer 41 not contacting the bottom wall 132 of the housing cavity 13.

In another possible embodiment, the same contents as those in the first embodiment are not repeated, and as shown in fig. 20, unlike the first embodiment, the first capillary layer 40 is disposed on the top wall 131 of the receiving cavity 13 and connected to one end of the first supporting structure 20.

In another possible embodiment, the same contents as those in the first embodiment are not repeated, and unlike the first embodiment, as shown in fig. 21, the soaking plate 100 further includes a second capillary layer 50, and the second capillary layer 50 is disposed on the top wall 131 of the receiving cavity 13 and contacts or is spaced from the other end of the first supporting structure 20. In the present embodiment, the first support structure 20 and the second support structure 30 may be embedded in the second capillary layer 50, or the first support structure 20 and the second support structure 30 may not be embedded in the second capillary layer 50, which is not limited strictly.

Illustratively, as shown in fig. 22, the second capillary layer 50 includes a plurality of second sub-capillary layers 51 stacked in layers, and the number of the second sub-capillary layers 51 contacting the bottom wall 132 of the receiving cavity 13 is less than or equal to the number of the second sub-capillary layers 51 not contacting the bottom wall 132 of the receiving cavity 13. That is, when the multi-layer capillary layer structure is used in combination, the capillary layer with small mesh number close to the heat source 320 side and the capillary layer with large mesh number far away from the heat source 320 side are arranged, so that the capillary layer with small mesh number can store more liquid, the liquid return resistance is also small, the capillary layer with large mesh number has larger capillary force, and the liquid return capacity can be enhanced. Of course, the mesh number of the second sub-capillary layer 51 contacting the bottom wall 132 of the receiving cavity 13 can be larger than that of the second sub-capillary layer 51 not contacting the bottom wall 132 of the receiving cavity 13.

Based on the above description, it should be understood that the capillary layer may be disposed on the top wall 131 of the receiving cavity 13, or disposed on the bottom wall 132 of the receiving cavity 13, or disposed on both the top wall 131 of the receiving cavity 13 and the bottom wall 132 of the receiving cavity 13, and multiple layers of capillary layer structures may be used in combination, and for the capillary structures close to the heat source area 121 or far from the heat source area 121, different mesh numbers may be disposed, so as to achieve the effects of enhancing the liquid return capability and increasing the heat transfer amount.

The foregoing detailed description of the embodiments of the present application has been presented to illustrate the principles and implementations of the present application, and the above description of the embodiments is only provided to help understand the method and the core concept of the present application; meanwhile, for a person skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims (17)

1. A vapor chamber, comprising:

the shell is provided with a containing cavity and comprises a first part and a second part, the second part is connected with the first part in a bent mode, the first part is provided with a fin area used for being in contact with a heat dissipation fin, and the second part is provided with a heat source area used for being in contact with a heat source;

a first support structure located between a top wall of the containment cavity and a bottom wall of the containment cavity, the first support structure extending from the heat source region to the fin region; and

a cooling working medium disposed within the first support structure.

2. The vapor chamber of claim 1, wherein the second portion is bent with respect to the first portion to cooperate to form a receiving space for receiving a refrigeration member, the fin region facing the refrigeration member.

3. The heat spreader plate of claim 2 wherein the first support structure comprises a first section at least partially disposed in the fin region and a second section at least partially disposed in the heat source region, the first section being disposed at an angle to the second section.

4. The vapor chamber of claim 3, wherein the fin region includes a first edge facing the refrigeration member and a second edge facing away from the refrigeration member, the first support structure is disposed between the first edge and the second edge, and a distance between the first support structure and the second edge is less than or equal to a distance between the first support structure and the first edge.

5. The soaking plate according to any one of claims 1 to 4, wherein the coverage ratio of the first support structure with respect to the heat source region is in the range of 0% to 80%.

6. The vapor chamber of any of claims 1-5, wherein the first support structure has a plurality of vapor channels in communication with the receiving cavity and spaced apart therefrom.

7. The vapor chamber according to claim 6, wherein the plurality of vapor passages are all the same in height, which is a dimension of the vapor passages in a direction perpendicular to the bottom wall of the accommodating chamber; alternatively, the first and second electrodes may be,

the heights of the steam channels are different, and the heights of the steam channels are the same as the sizes of the steam channels in the direction perpendicular to the bottom wall of the accommodating cavity.

8. The vapor chamber of claim 6, wherein the plurality of vapor channels are each located in the heat source region; alternatively, the plurality of steam channels are all located in the fin region; alternatively, the plurality of vapor channels are located in the heat source region and the fin region.

9. The vapor chamber according to any one of claims 1 to 7, wherein the bottom wall of the housing chamber is an inner wall of the housing chamber on a side close to the heat source, one end of the first support structure is connected to the bottom wall of the housing chamber, and at least a part of the other end of the first support structure is connected to the top wall of the housing chamber.

10. The vapor chamber of any one of claims 1 to 7, wherein the bottom wall of the housing chamber is an inner wall of the housing chamber on a side thereof adjacent to the heat source, one end of the first support structure is connected to the bottom wall of the housing chamber, and the other end of the first support structure is spaced apart from the top wall of the housing chamber.

11. The vapor chamber according to any one of claims 1 to 10, wherein the bottom wall of the containing chamber is an inner wall of the containing chamber on a side close to the heat source, the vapor chamber further comprises a first capillary layer provided on the bottom wall of the containing chamber and connected to one end of the first supporting structure, and a second capillary layer provided on the top wall of the containing chamber and in contact with or spaced from the other end of the first supporting structure.

12. The vapor chamber of claim 11, wherein the first capillary layer comprises a plurality of first sub-capillary layers stacked in layers, and the number of the first sub-capillary layers contacting the bottom wall of the containing cavity is smaller than or equal to the number of the first sub-capillary layers not contacting the bottom wall of the containing cavity.

13. The soaking plate according to any one of claims 1 to 12, wherein the outer surface of the first support structure is provided with grooves.

14. The heat spreader of any one of claims 1-13, further comprising a plurality of second support structures coupled between the top wall of the containment chamber and the bottom wall of the containment chamber, the plurality of second support structures being spaced apart from the fin region and the heat source region.

15. The vapor chamber of claim 14, wherein a cooling medium is further disposed within the second support structure.

16. A heat sink characterized by comprising heat radiating fins attached to the outer surface of the fin region and the soaking plate according to any one of claims 1 to 15.

17. An electronic device characterized by comprising a heat source and the heat sink of claim 16, the heat source being disposed on the same side as the heat dissipating fins.

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