WO2021213391A1

WO2021213391A1 - Vapor chamber and electronic device

Info

Publication number: WO2021213391A1
Application number: PCT/CN2021/088437
Authority: WO
Inventors: 孙振; 杨杰; 施健
Original assignee: 华为技术有限公司
Priority date: 2020-04-22
Filing date: 2021-04-20
Publication date: 2021-10-28
Also published as: CN113532171A

Abstract

Provided in the embodiments of the present application are a vapor chamber (VC) and an electronic device. The vapor chamber comprises a housing having an accommodating cavity, wherein the accommodating cavity is internally provided with a second capillary structure and a first capillary structure; a first end and a second end of the first capillary structure abut against the inner bottom wall and the inner top wall of the accommodating cavity, respectively; and after absorbing heat, a working liquid in the first capillary structure is vaporized from the side surface of the first capillary structure, such that the thickness of the vapor chamber is reduced without the need to reserve a cavity for vapor circulation in the vertical direction. The second capillary structure at least covers a heat source region corresponding to a heating device, and a gap is provided between the side of the second capillary structure away from the heat source and the inner top wall of the accommodating cavity, such that the working liquid absorbing the heat can be evaporated from the side surfaces of the first capillary structure and the second capillary structure, and can be evaporated from the side of the second capillary structure away from the heat source region, thereby increasing the evaporation area, and improving the temperature equalization and heat dissipation performance of the vapor chamber.

Description

A uniform temperature board and electronic equipment

This application claims the priority of a Chinese patent application filed with the Chinese Patent Office on April 22, 2020, the application number is 202010321430.9, and the application name is "a uniform temperature plate and electronic equipment", the entire content of which is incorporated into this application by reference middle.

Technical field

This application relates to the field of terminal technology, and in particular to a temperature equalizing plate and electronic equipment.

Background technique

With the miniaturization of terminal electronic equipment (such as mobile phones, tablets, PCs, etc.), the integration and assembly density of electronic components continue to increase. While providing powerful functions, they also lead to their work power consumption and development. The rapid increase of heat, so the demand of terminal electronic equipment for chip heat dissipation will increase accordingly.

At present, more and more electronic devices use a uniform temperature plate as a heat dissipation element. The uniform temperature plate is mainly composed of a shell, a capillary structure and a working fluid. Capillary structure, the capillary structure divides the containing cavity into multiple vapor channels, one end of the capillary structure abuts on the inner top surface of the containing cavity, the other end of the capillary structure abuts on the inner bottom surface of the containing cavity, the capillary structure adsorbs working fluid . The outer bottom surface of the uniform temperature plate is in contact with the heating device. When the heat is conducted from the heating device to the inner bottom surface of the containing cavity, the working liquid in the capillary structure absorbs the heat, and the phase change of vaporization and boiling begins to occur in a low vacuum environment. The liquid phase becomes the gas phase. The working liquid in the gas phase will quickly fill the entire cavity. When the working liquid in the gas phase comes into contact with the colder shell area, it will condense, which will release the heat accumulated during evaporation. The capillary adsorption effect of the capillary structure returns to the heat source. This process will be repeated in the cavity. This cycle can bring the heat generated by the heat source to the external environment, and play a role in good heat conduction and uniform temperature.

However, in the above-mentioned thin-shaped uniform temperature plate, since the two ends of the capillary structure abut on the inner top surface and the inner bottom surface of the containing cavity respectively, the working liquid inside the capillary structure can only evaporate from the side surface of the capillary structure, and the evaporation area is small. , When the power consumption increases, the evaporation heat resistance and the vapor circulation pressure drop are relatively large, resulting in poor temperature uniformity performance of the uniform temperature plate.

Summary of the invention

The present application provides a uniform temperature plate and electronic equipment, which solves the problem of the existing thin-shaped uniform temperature plate. The small evaporation area makes the evaporation heat resistance and the vapor circulation pressure drop larger, resulting in poor temperature uniformity performance. At the same time, it cannot meet the problem of heat dissipation requirements.

The first aspect of the embodiments of the present application provides a uniform temperature plate, which is used to contact a heating device to dissipate heat of the heating device. There is a heat source area corresponding to the heating device; a first capillary structure is provided in the containing cavity, the first end of the first capillary structure abuts against the inner bottom wall of the containing cavity, and the first capillary The second end of the structure abuts against the inner top wall of the containing cavity, and the working fluid in the first capillary structure evaporates and enters the containing cavity from the side of the first capillary structure; in the containing cavity A second capillary structure is also provided, the second capillary structure at least covers the heat source area, and there is a gap between the side of the second capillary structure facing away from the heat source area and the inner top wall of the accommodating cavity . By arranging the first capillary structure and the second capillary structure in the accommodating cavity of the uniform temperature plate, wherein the first end and the second end of the first capillary structure are respectively abutted on the inner bottom wall and the inner top wall of the accommodating cavity , The working liquid in the first capillary structure evaporates from the side of the first capillary structure after absorbing heat and vaporizing, so that the vertical height of the first capillary structure itself is utilized, and there is no need to reserve in the vertical direction for vapor circulation Cavity, thereby reducing the thickness of the uniform temperature plate. In addition, the capillary of the second capillary structure is covered on the heat source area, and there is a gap between the side of the second capillary structure away from the heat source area and the inner top wall of the accommodating cavity, so that the working fluid that absorbs heat can not only flow from the first capillary structure and The side surface of the second capillary structure evaporates, and the evaporation can be performed from the side of the second capillary structure away from the heat source area, which effectively increases the evaporation area and improves the temperature uniformity and heat dissipation performance of the uniform temperature plate.

In a possible implementation manner, the first vapor cavity is formed between the side surface of the first capillary structure and the side surface of the second capillary structure and the inner wall of the containing cavity. After the working liquid in the first capillary structure and the second capillary structure absorbs heat and vaporizes, it can enter the first vapor chamber, and contact the cooler part in the containing chamber to condense and release heat, thereby realizing heat dissipation.

In a possible implementation manner, at least one second vapor cavity is formed between the second capillary structure and the inner top wall of the containing cavity. After the working liquid in the second capillary structure absorbs heat and vaporizes, it can evaporate from the side of the second capillary structure away from the heat source area into the second vapor chamber, and contact the cooler part of the containing chamber to achieve heat dissipation. The setting can effectively increase the available evaporation area of the working liquid and improve the heat dissipation performance of the uniform temperature plate.

In a possible implementation manner, the first capillary structure includes a plurality of capillary structure members arranged at intervals, the capillary structure members extend from the end of the non-heat source region to the end of the heat source region, and at least part of the capillary structure members It includes a first capillary structure and a second capillary structure connected to the first capillary structure; the first capillary structure is located in the heat source area, and the second capillary structure is located in the inner bottom of the accommodating cavity The non-heat source area on the wall; the second capillary structure is located between two adjacent first-stage capillary structures, the second capillary structure, the first-stage capillary structure, and the inner top of the accommodating cavity The wall defines at least one second vapor cavity communicating with the first vapor cavity. By arranging the second capillary structure between two adjacent first-segment capillary structures, and making the second capillary structure, the first-segment capillary structure and the inner top wall of the containing cavity jointly define a second vapor chamber, this works The liquid can evaporate from the side of the second capillary structure away from the heat source area and the side of the first section of the capillary structure into the second vapor chamber, and exchange heat with the colder part of the containing chamber, ensuring that the heat source area has a larger Evaporation area to improve the thermal performance of the uniform temperature plate.

In a possible implementation manner, the first capillary structure includes a plurality of capillary structure members arranged at intervals, the capillary structure members extend from the end of the non-heat source region to the end of the heat source region, and at least part of the capillary structure members It includes a first capillary structure and a second capillary structure connected to the first capillary structure; the first capillary structure is located on the side of the second capillary structure facing away from the heat source region, and the second capillary structure The section of capillary structure is located in the non-heat source area on the inner bottom wall of the containing cavity; the second capillary structure, the first section of capillary structure, and the inner top wall of the containing cavity define at least one contact with the first vapor The second vapor chamber communicated with the chamber. The first capillary structure is located on the side of the second capillary structure away from the heat source area, that is, the second capillary structure is arranged between the first capillary structure and the inner bottom wall of the accommodating cavity, and the second capillary structure, the first section The capillary structure and the inner top wall of the containing chamber jointly define a second vapor chamber, so that the working fluid can evaporate from the side of the second capillary structure away from the heat source area and the side of the first section of capillary structure into the second vapor chamber and interact with the containing chamber. The colder part is in thermal contact, which effectively increases the evaporation area and improves the thermal performance of the uniform temperature plate.

In a possible implementation manner, the orthographic projection area of the second capillary structure on the inner bottom wall of the accommodating cavity is 70%-130% of the orthographic projection area of the heating element on the housing. In this way, it can be ensured that the heat emitted by the heating device is basically absorbed by the working liquid in the second capillary structure, and the evaporation area for dissipating the heat source area is increased in a targeted manner, and the heat dissipation effect of the heating device is enhanced.

In a possible implementation manner, the first capillary structure and the second capillary structure are in communication. Connecting the first capillary structure with the second capillary structure improves the circulation of the working fluid, helps to improve the heat exchange effect of the working fluid, and accelerates heat dissipation.

In a possible implementation manner, it further includes: at least one first support structure, one end of the first support structure abuts on the second capillary structure, and the other end of the first support structure abuts on the second capillary structure. The inner top wall of the accommodating cavity. Since there is a gap between the side of the second capillary structure facing away from the heat source area and the inner top wall of the containing cavity, the first support structure is located between the second capillary structure and the inner top wall of the containing cavity, which can play a supporting role and avoid the The pressure difference between the inside and outside of the cavity causes the cavity above the heat source area to collapse.

In a possible implementation manner, the first supporting structure is a solid structure, or the first supporting structure is a capillary structure. Wherein, when the first supporting structure is a capillary structure, it can play a supporting role and at the same time can also play a role in transporting working fluid.

In a possible implementation manner, the first support structure is a mesh, fiber or sintered copper powder.

In a possible implementation manner, the cross-sectional shape of the first support structure includes a circle, a rectangle, or a structure with a groove on the outer wall.

In a possible implementation manner, the first capillary structure and the second capillary structure are integrally formed.

In a possible implementation manner, the maximum thickness of the second capillary structure is 10%-90% of the minimum thickness of the first capillary structure.

In this way, the thickness of the second capillary structure is smaller than the thickness of the first capillary structure, which ensures that there is a gap between the side of the second capillary structure facing away from the heat source area and the top wall of the containing cavity, thereby forming the second vapor chamber.

In a possible implementation manner, the first capillary structure and the second capillary structure are porous structures, and the porous structures include sintered copper mesh, sintered copper powder, etched grooves or micropillars.

In a possible implementation manner, a second support structure is further included, the second support structure is located between two adjacent first capillary structures, and one end of the second support structure is connected to the accommodating cavity The inner bottom wall of the second support structure abuts, and the other end of the second support structure abuts the inner top wall of the accommodating cavity.

When the gap between the first capillary structures is large, the second supporting structure can play a supporting role to avoid the collapse of the containing cavity and improve the stability of the temperature equalization plate.

In a possible implementation manner, the housing includes: a first housing and a second housing, and inner walls of the first housing and the second housing form the sealed accommodating cavity.

The second aspect of the embodiments of the present application also provides an electronic device, including a heating device and any one of the above-mentioned uniform temperature plates, the heating device is in contact with the outer surface of the uniform temperature plate, and the heating device is in contact with The heat source area of the uniform temperature plate corresponds to it.

By arranging the above-mentioned uniform temperature plate in the electronic device, the uniform temperature plate not only has a relatively thin vertical thickness, but also has good uniform temperature and heat dissipation performance, which helps to meet the needs of thinning electronic devices, and at the same time provides electronic devices Good heat dissipation performance ensures the service life of electronic equipment and improves user experience.

In a possible implementation manner, the heating device is a chip, a battery or a battery circuit board.

Description of the drawings

Fig. 1 is a schematic diagram of the structure of an existing uniform temperature plate;

FIG. 2 is a schematic structural diagram of a temperature equalizing plate provided by an embodiment of the present application after being split;

FIG. 3 is a schematic diagram of the internal structure of a uniform temperature plate provided by an embodiment of the present application;

Fig. 4 is a schematic top view of Fig. 3;

5 is a schematic cross-sectional view of a temperature equalization plate provided by an embodiment of the present application along the line A-A in FIG. 4;

Fig. 6 is a schematic cross-sectional view of a temperature equalizing plate provided by an embodiment of the present application along the line B-B in Fig. 4;

FIG. 7 is a partial cross-sectional schematic diagram of a temperature equalization plate provided by an embodiment of the present application along the line C-C of FIG. 6;

FIG. 8 is a schematic cross-sectional view of another first supporting structure provided by an embodiment of the present application;

9 is a schematic cross-sectional view of still another first support structure provided by an embodiment of the present application;

10 is a schematic cross-sectional view of another temperature equalizing plate along the line B-B according to an embodiment of the present application;

FIG. 11 is a schematic diagram of the internal structure of another uniform temperature plate provided by an embodiment of the present application;

Fig. 12 is a schematic top view of Fig. 11;

Fig. 13 is a schematic cross-sectional view of another temperature equalizing plate provided by an embodiment of the present application along the line B-B in Fig. 12;

Figure 14 is a simulation cloud diagram of vapor pressure drop of the uniform temperature plate in Figure 1;

Figure 15 is a simulation cloud diagram of vapor pressure drop of the uniform temperature plate in Figure 4;

16 is a schematic diagram of the internal structure of yet another temperature equalizing plate provided by an embodiment of the present application;

Fig. 17 is a schematic top view of Fig. 16;

FIG. 18 is a schematic cross-sectional view of yet another temperature equalizing plate provided by an embodiment of the present application along the line A-A in FIG. 17;

Fig. 19 is a schematic cross-sectional view of another temperature equalizing plate provided by an embodiment of the present application along the line B-B in Fig. 17.

Description of reference signs:

10-Average temperature board; 11-shell; 111-first shell;

112-Second shell; 12-Receiving cavity; 121-Heat source area;

13-First capillary structure; 131-Capillary structure; 132-Connecting part;

13a-The first capillary structure; 13b-The second capillary structure; 14-The second capillary structure;

141-groove; 15-first vapor chamber; 16-second vapor chamber;

17-First support structure; 18-Capillary structure components; 20-heating device.

Detailed ways

The terminology used in the implementation mode part of this application is only used to explain the specific embodiments of the application, and is not intended to limit the application. The implementation manners of the embodiments of the application will be described in detail below with reference to the accompanying drawings.

The equalizing plate is also called the equalizing plate, which is a common heat dissipation element in electronic equipment. Fig. 1 is a schematic structural diagram of an existing temperature equalizing plate. Specifically, referring to Fig. 1, the equalizing plate 100 includes a housing 101, a capillary structure 110 and a working fluid. The housing 101 includes a first housing 101a and a first housing 101a. The two housings 101b, the first housing 101a and the second housing 101b jointly enclose the containing cavity 102, and the containing cavity 102 is evacuated. A plurality of capillary structures 110 are provided in the accommodating cavity 102. The two ends of the capillary structure 110 abut on the first housing 101a and the second housing 101b respectively, and divide the accommodating cavity 102 to form a plurality of vapor chambers. The capillary structure 110 adsorbs working fluid. The heat dissipation principle of the uniform temperature plate 100 is roughly the same as that of the heat pipe. Taking the thermal contact between the outer bottom surface of the first housing 101a and the heating device as an example, when the heat generated by the heating device is conducted into the uniform temperature plate 100, the uniform temperature plate 100 is close to the heating element The working fluid at the position will quickly evaporate and vaporize after absorbing heat, while taking away a lot of heat. The vaporized working fluid fills the vapor chamber. When the working fluid in the gas phase contacts the inner wall of the second housing 101b with a lower temperature, it will quickly Condenses into a liquid state and releases heat, thereby dissipating the heat generated by the heating device uniformly. At the same time, the working liquid condensed into a liquid state returns to the heat source under the capillary action of the capillary structure 110 to complete a heat conduction cycle to form a Two-way circulation system in which gas and liquid coexist.

As the functions of electronic equipment products become more and more powerful, and people’s demand for light, thin and convenient electronic equipment is increasing, the development of electronic equipment towards high integration and assembly density has led to a sharp increase in the power consumption and heat generation of electronic equipment. The uniform temperature and heat dissipation performance of the uniform temperature plate is more demanding. The above-mentioned uniform temperature plate, because the two ends of the capillary structure abut on the inner walls of the first shell and the second shell respectively, the working liquid in the capillary structure can only evaporate from the side of the capillary structure, and the evaporation area is small. When the consumption increases, the evaporation heat resistance and the vapor circulation pressure drop are large, and the temperature equalization performance of the temperature equalization plate is poor, which seriously affects the service life of the electronic equipment and the user experience.

In order to improve the heat dissipation performance of the temperature equalizing plate, an embodiment of the present application provides a temperature equalizing plate applied to electronic equipment. Electronic devices can include, but are not limited to, mobile phones, tablets, laptops, ultra-mobile personal computers (UMPC), handheld computers, walkie-talkies, netbooks, POS machines, and personal digital assistants (PDAs) , Wearable devices, virtual reality devices and other mobile or fixed terminals. The heating device can be a chip, a battery, a battery circuit board, and the like.

The temperature equalization plate provided by the embodiment of the present application, by making the capillary structure in the containing cavity include a first capillary structure and a second capillary structure, wherein the first end and the second end of the first capillary structure respectively abut against the inside of the containing cavity On the bottom wall and the inner top wall, the working liquid in the first capillary structure vaporizes and evaporates from the side of the first capillary structure. There is no need to reserve a cavity for vapor circulation in the vertical direction, and the thickness of the uniform temperature plate can be reduced. The second capillary structure at least covers the heat source area to dissipate heat from the heat source area, and there is a gap between the side of the second capillary structure facing away from the heat source area and the inner top wall of the accommodating cavity, so that the working fluid that absorbs heat can be removed from In addition to the side surface evaporation of the first capillary structure and the second capillary structure, it can also evaporate from the side of the second capillary structure that faces away from the heat source area, effectively increasing the evaporation area and further improving the temperature uniformity performance of the uniform temperature plate. The following describes in detail the temperature equalizing plate of the embodiment of the present application through two different scenarios.

scene one

In the embodiment of the present application, as shown in FIG. 2 and FIG. 3, the uniform temperature plate 10 includes a housing 11, and the housing 11 has a containing cavity 12, the uniform temperature plate 10 and the heating device 20 (for example, as shown in FIG. 5). ) Thermal contact, there is a heat source area 121 corresponding to the heating device 20 on the inner bottom wall of the accommodating cavity 12 of the uniform temperature plate 10. Specifically, in the embodiment of the present application, the heat source area refers to the heating device 20 on the uniform temperature plate 10 The orthographic projection area on the bottom wall of the housing 11. Correspondingly, other areas of the inner bottom wall of the accommodating cavity 12 are non-heat source areas.

As shown in FIG. 2, the housing 11 may include a first shell 111 and a second shell 112. The inner walls of the first shell 111 and the second shell 112 jointly define a sealed accommodating cavity 12. See FIG. 4, which is an embodiment of the application. A top view of the internal structure of a temperature equalizing plate is provided. FIGS. 5 and 6 are a cross-sectional view of AA and a cross-sectional view of BB formed along the line AA and BB on the basis of FIG. 4. Specifically, as shown in Figs. 5 and 6, the temperature equalization plate 10 may be a plate-like structure with a small thickness. The first housing 111 and the second housing 112 form two opposite surfaces of the equalization plate 10, The distance between the outer wall of the shell 111 and the outer wall of the second shell 112 is the vertical thickness of the temperature equalizing plate 10, wherein the direction from the outer wall of the first shell 111 to the outer wall of the second shell 112 is the vertical direction.

4 and 5, a first capillary structure 13 is provided in the containing cavity 12. The first end of the first capillary structure 13 abuts the inner bottom wall of the containing cavity 12, and the first capillary structure 13 The second end abuts against the inner top wall of the accommodating cavity 12. Specifically, in the embodiment of the present application, the first end of the first capillary structure 13 abuts against the inner wall of the first housing 111, and the second end abuts against the inner wall of the first housing 111. As an example, the inner wall of the two housings 112 abuts against each other, and the outer wall of the first housing 111 may be in thermal contact with the heating element 20 (as shown in FIG. 6).

After the working fluid in the first capillary structure 13 evaporates, it enters the containing cavity 12 from the side of the first capillary structure 13. Specifically, the heat of the heating device 20 is conducted to the first housing 111, and the inside of the first capillary structure 13 is close to the first housing The working fluid of 111 absorbs heat and vaporizes, and evaporates from the vertical side of the first capillary structure 13 into the containing cavity 12. The vaporized working fluid will condense and condense when it contacts the inner wall of the second housing 112 with a relatively low temperature. The heat is released, and the uniform heat dissipation of the heating device 20 is realized. Since the first end and the second end of the first capillary structure 13 abut on the inner bottom wall and the inner top wall of the containing cavity 12, respectively, there is no need to reserve a cavity for vapor circulation in the vertical direction. As a result, the thickness of the uniform temperature plate 10 can be reduced (that is, the vertical dimension of the uniform temperature plate 10 can be reduced). At the same time, after the working fluid is heated and evaporated, it can evaporate from the side of the first capillary structure 13 (that is, the surface that does not contact the inner bottom wall and the inner top wall of the containing cavity 12) to ensure the reliability of heat dissipation.

It should be noted that the working fluid in the first capillary structure 13 evaporates from the side surface of the first capillary structure 13. There may be a gap inside the first capillary structure 13 that can form an evaporation cavity, so that the liquid in the first capillary structure 13 After the working fluid is vaporized, it can enter the gap from the side (that is, into the containing cavity). Specifically, as shown in FIGS. 3 and 4, the first capillary structure 13 may include a plurality of capillary structures 131 arranged at intervals (as shown in FIG. 3), there is a gap between two adjacent capillary structure members 131, and the working fluid in the capillary structure member 131 can enter the gap from the side after vaporization. Alternatively, there may be a gap between the side surface of the first capillary structure 13 and the inner wall of the containing cavity 12 so that the working fluid in the first capillary structure 13 vaporizes and enters the containing cavity 12 from the side.

Among them, the first capillary structure 13 is used to adsorb the working fluid for heat conduction circulation on the one hand, and on the other hand, the first capillary structure 13 can also play a supporting role to prevent the accommodating cavity 12 of the uniform temperature plate 10 from being caused by internal and external Collapse caused by pressure difference.

In order to effectively improve the heat dissipation performance of the temperature equalization plate, the temperature equalization plate 10 provided by the embodiment of the present application enhances the heat dissipation for the heat source area 121 corresponding to the heating device 20. For details, see FIG. 3 and FIG. The accommodating cavity 12 of the plate 10 is also provided with a second capillary structure 14 which at least covers the heat source area 121 (for example, it can cover partly or completely), for example, the second capillary structure 14 is located in the first housing 11上 and corresponding to the heating device 20.

As shown in FIGS. 3 and 6, there is a gap between the side of the second capillary structure 14 facing away from the heat source area 121 and the inner top wall of the containing cavity 12. When the heat of the heating device 20 is conducted to the first housing 111, it is located in the heat source area 121 The working fluid in the upper second capillary structure 14 absorbs heat and then vaporizes. The vaporized working fluid can evaporate from the side of the second capillary structure 14 away from the heat source region 121 into the gap. The vaporized working fluid in the gap and The part with a lower temperature in the receiving cavity contacts and releases heat, so that targeted heat dissipation of the heat source area 121 is realized, and the heat dissipation performance of the heat source area 121 is effectively improved.

In addition, the working fluid that absorbs heat can not only evaporate from the vertical sides of the first capillary structure 13 and the second capillary structure 14, but also evaporate from the side of the second capillary structure 14 away from the heat source region 121, effectively increasing the evaporation area. , Which reduces the steam overflow resistance and reduces the vapor circulation pressure drop, thereby improving the temperature uniformity and heat dissipation performance of the uniform temperature plate 10.

Wherein, the first capillary structure 13 and the second capillary structure 14 may be separately formed and then arranged in the receiving cavity 12, or the first capillary structure 13 and the second capillary structure 14 may be integrally formed and arranged in the receiving cavity 12.

There are various specific implementations of the gap between the second capillary structure 14 and the top wall of the containing cavity 12, for example, the vertical thickness of the second capillary structure 14 can be made lower than that of the first capillary structure 13, and the second capillary structure 13 The capillary structure 14 is arranged on the first housing 11, so that a gap is maintained between the side of the second capillary structure 14 facing away from the heat source area 121 and the top wall of the containing cavity 12.

Alternatively, the vertical thickness of the second capillary structure 14 and the first capillary structure 13 are originally the same, that is, the two ends of the second capillary structure 14 can also abut on the inner bottom wall and the inner top wall of the accommodating cavity 12 respectively, and then A groove 141 is opened at a position corresponding to the heat source area 121 to form the second capillary structure 14, so that a gap is maintained between the side of the second capillary structure 14 facing away from the heat source area 121 and the top wall of the receiving cavity 12.

Specifically, as shown in FIGS. 3 and 6, the first capillary structure 13 and the second capillary structure 14 are integrally formed to form a capillary structure component 18, and the two ends of the capillary structure component 18 respectively abut against the inner top wall of the accommodating cavity 12. And on the inner bottom wall, on the side of the capillary structure assembly 18 facing away from the heat source area 121, there is a groove 141 recessed toward the heat source area 121 at a position corresponding to the heat source area 121, and the groove bottom of the groove 141 is connected to the accommodating cavity There is a gap between the inner top wall of 12, the inner wall of the groove 141 and the inner top wall of the accommodating cavity 12 can define the second vapor chamber 16, thereby achieving an increase in the evaporation area and improving the uniform temperature effect of the uniform temperature plate 10. .

The first end and the second end of the first capillary structure 13 can be respectively attached to the inner bottom wall and the inner top wall of the containing cavity 12 through high temperature sintering or other methods. Correspondingly, the second capillary structure 14 can also be sintered through high temperature. Or it can be attached and covered on the inner bottom wall of the containing cavity 12 in other ways.

Specifically, in the embodiment of the present application, as shown in FIG. 5 and FIG. 6, the side surface of the first capillary structure 13 and the side surface of the second capillary structure 14 and the inner wall of the accommodating cavity 12 form a first vapor cavity 15 that communicates with each other. After the working fluid in the first capillary structure 13 and the second capillary structure 14 absorbs heat, it can evaporate from the side surface of the first capillary structure 13 and the side surface of the second capillary structure 14 into the first vapor chamber 15, and can interact with the containing chamber. The colder part of 12 (such as the inner wall of the end farther from the heat source) contacts and condenses to release heat.

In the embodiment of the present application, as shown in FIGS. 3 and 6, at least one second vapor chamber 16 is defined between the second capillary structure 14 and the inner top wall of the containing cavity 12, and the working liquid in the second capillary structure 14 After absorbing the heat, it can evaporate from the side of the second capillary structure 14 away from the heat source region 121 into the second vapor chamber 16, and can contact the colder part of the containing cavity 12 to condense and release heat, thus interacting with the heat source region 121 After the working liquid in the opposite second capillary structure 14 absorbs heat, in addition to evaporating from the side of the second capillary structure 14 into the first vapor chamber 15 and contacting the colder part of the containing chamber 12 for heat exchange, it can also exchange heat from The side of the second capillary structure 14 away from the heat source area 121 evaporates into the second vapor chamber 16 and exchanges heat with the cooler part of the containing chamber 12, which significantly increases the evaporation area of the working fluid, thereby improving the heat-uniform temperature plate 10 Uniform temperature performance.

The second vapor chamber 16 may be defined by the sidewall of the second capillary structure 14, the side of the second capillary structure 14 facing away from the heat source area 121, and the inner top wall of the containing chamber 12. Alternatively, the second vapor chamber 16 may be the side of the second capillary structure 14 facing away from the heat source area 121, the sidewall of the first capillary structure 13, the side of the first capillary structure 13 facing away from the heat source area 121, and the inner top wall of the containing cavity 12. Defined.

In addition, the first vapor chamber 15 may be in communication with the second vapor chamber 16, or the first vapor chamber 15 may not be in communication with the second vapor chamber 16. For example, in this example, the first vapor chamber 15 and the second vapor chamber 16 are in communication , So that the heat can be dissipated more evenly, and thus the heat dissipation performance of the uniform temperature plate 10 is improved. There may be multiple second vapor chambers 16, and multiple second vapor chambers 16 may communicate with each other, or there may be one second vapor chamber 16.

Wherein, as shown in FIG. 4, the first capillary structure 13 and the second capillary structure 14 are connected, which can improve the interoperability of the working fluid in the first capillary structure 13 and the second capillary structure 14, and enhance the circulation of the working fluid, thereby It is helpful to improve the heat exchange effect of the working fluid and accelerate the heat dissipation to improve the heat dissipation performance of the uniform temperature plate 10. As shown in FIGS. 3 and 4, in a possible implementation manner, the first capillary structure 13 may further include a connecting portion 132 (a portion distributed along the width direction of the housing in FIG. 3) through which the capillary structure 131 passes The connecting portion 132 is connected to the second capillary structure 14.

Wherein, the orthographic projection area of the second capillary structure 14 on the inner bottom wall of the accommodating cavity 12 is 70%-130% of the orthographic area of the heating element 20 on the housing 11. This can ensure that the heat emitted by the heating device 20 is basically absorbed by the working liquid in the second capillary structure 14, and the heat-absorbing working liquid evaporates from the side of the second capillary structure 14 away from the heat source area 121 into the second vapor chamber 16, which is targeted This increases the evaporation area for heat dissipation of the heat source area 121, and enhances the heat dissipation effect of the heating device 20.

In a possible implementation, as shown in FIGS. 11 and 12, the first capillary structure 13 includes a plurality of capillary structure members 131 arranged at intervals. Specifically, the plurality of capillary structure members 131 are at the level of the temperature equalization plate 10. Are arranged at intervals in the width direction, and the capillary structure 131 extends from the end of the non-heat source area (the upper part of Fig. 11) to the end of the heat source area (the lower part of Fig. 11). At least part of the capillary structure 131 includes a first section of capillary structure 13a and The second capillary structure 13b is connected to the first capillary structure 13a.

It should be noted that a plurality of capillary structural members 131 are arranged at intervals in the horizontal width direction of the temperature equalizing plate 10. As shown in FIGS. 11 and 12, there is a gap between two adjacent capillary structural members 131, so that the first The working fluid in the capillary structure 13 can evaporate from the side after being vaporized.

Wherein, the width of the gap between two adjacent capillary structures 131 is greater than the width of the capillary structure 131 to ensure that the evaporation force enables the working fluid to evaporate from the capillary structure 131 and flow back to the capillary structure after heat exchange. Piece 131. The width of the gap between two adjacent capillary structures 131 and the specific width of the capillary structure 131 can be obtained according to test calculations. In the embodiment of the present application, the gap width between two adjacent capillary structures 131 is the width of the capillary structure 131. 110%-130%.

In the embodiment of the present application, there is also a gap between the capillary structure 131 and the inner wall of the adjacent accommodating cavity 12, which increases the available evaporation area of the working liquid in the capillary structure 131 and improves the heat dissipation effect. Correspondingly, the width of the gap between the capillary structure 131 and the inner wall of the adjacent containing cavity 12 is greater than the width of the capillary structure 131. Specifically, the width of the gap between the capillary structure 131 and the inner wall of the adjacent containing cavity 12 is capillary. 110%-130% of the width of the structural member 131.

Among them, the first capillary structure 13a is located in the heat source area 121, the second capillary structure 13b is located in the non-heat source area on the bottom wall of the containing cavity 12, and the second capillary structure 14 is located between two adjacent first capillary structures 13a. As shown in Figures 11 and 13, the second capillary structure 14, the first section of capillary structure 13a and the inner top wall of the containing chamber 12 define at least one second vapor chamber 16 communicating with the first vapor chamber 15, so that it works The liquid can evaporate from the side of the second capillary structure 14 away from the heat source area 121 and the side of the first section of capillary structure 13a into the second vapor chamber 16, and exchange heat with the cooler part of the containing cavity 12 to ensure the heat source area 121 has a larger evaporation area to improve the heat uniformity performance of the uniform temperature plate 10. At the same time, the communication between the first capillary structure 13 and the second capillary structure 14 is facilitated.

Wherein, as shown in FIG. 13, the vertical height δ2 of the second capillary structure 14 can be lower than the vertical height δ1 of the first section of capillary structure 13a, so that the second capillary structure 14 and the inner top wall of the accommodating cavity 12 There is a gap between.

In the embodiment of the present application, the temperature equalization plate 10 further includes: at least one first support structure 17, one end of the first support structure 17 abuts on the second capillary structure 14, and the other end of the first support structure 17 abuts on the housing On the inner top wall of the cavity 12, due to the gap between the side of the second capillary structure 14 facing away from the heat source area 121 and the inner top wall of the containing cavity 12, the first support structure 17 is located in the second capillary structure 14 and the containing cavity 12 The top walls can play a supporting role to avoid the collapse of the receiving cavity 12 above the heat source area 121 due to the pressure difference between the inside and outside of the receiving cavity 12.

As shown in FIG. 6, the first support structure 17 can be integrated with the inner top wall of the accommodating cavity 12, that is, the first support structure 17 and the second housing 11 are integrally formed, and then the second housing 11 faces the first housing The first support structure 17 is formed by machining or etching on one side of the surface 11; or, the first support structure 17 and the second housing 11 are formed separately, which can be connected to the inner wall of the second housing 11 by welding or the like. connect.

Wherein, the first capillary structures 13 located in the non-heat source area may be multiple, such as three, five or more, and the specific ones can be selected and set according to the horizontal width of the temperature equalizing plate 10. In a possible implementation manner, the number of the first capillary structures 13 is small, and when the uniform temperature plate 10 is set to be more dispersed, the uniform temperature plate 10 may also include a second support structure (not shown), The second supporting structure may be located between two adjacent first capillary structures 13, one end of the second supporting structure abuts against the inner bottom wall of the containing cavity 12, and the other end of the second supporting structure is against the inner top of the containing cavity 12. The wall abuts to play a supporting role, thereby effectively avoiding the collapse of the containing cavity 12 and improving the stability of the uniform temperature plate 10 in use.

Referring to FIG. 7, in a possible embodiment, the first supporting structure 17 may be a solid structure. Wherein, the cross-sectional shape of the first support structure 17 may be a circle as shown in FIG. 7, or the cross-section of the first support structure 17 may be a rectangle as shown in FIG. 8, or the shape of the first support structure 17 The cross section may be a structure with grooves. Specifically, as shown in FIG. 9, grooves are arranged on the outer circumference of the body of the first support structure 17 at intervals.

Correspondingly, the second support structure may also be a solid structure, and the cross-sectional shape of the second support structure may be a circle, a rectangle, or a structure with grooves.

In another possible embodiment, as shown in FIG. 10, the first support structure 17 may be a capillary structure. In this way, the first support structure 17 can play a supporting role, and the first support structure 17 can also play a The role of conveying working fluid.

Wherein, the first support structure 17 may be a capillary structure with a circular, rectangular or grooved cross-sectional shape. For example, the first support structure 17 may be a capillary structure such as mesh, fiber or sintered copper powder. The first supporting structure 17 may be connected to the inner top wall of the containing cavity 12 and the second capillary structure 14 respectively through sintering, welding or other processes.

Correspondingly, in the embodiment of the present application, the second supporting structure may also be a capillary structure, and the cross-sectional shape of the second supporting structure may be a circular, rectangular or grooved capillary structure. For example, the second supporting structure may be a mesh. Material, fiber or sintered copper powder, etc.

Wherein, in the embodiment of the present application, the maximum thickness of the second capillary structure 14 is 10%-90% of the minimum thickness of the first capillary structure 13, and the second capillary structure 14 is located on the inner bottom wall of the accommodating cavity 12, so that the second The thickness of the capillary structure 14 is smaller than that of the first capillary structure 13, which ensures that there is a gap between the side of the second capillary structure 14 facing away from the heat source region 121 and the top wall of the containing cavity 12, thereby forming the second vapor chamber 16.

The first capillary structure 13 and the second capillary structure 14 are porous structures, and the porous structure includes sintered copper mesh, sintered copper powder, etched grooves or micropillars. The first capillary structure 13 and the second capillary structure 14 may be bonded to the inner bottom wall and/or inner top wall of the containing cavity 12 through sintering, spraying, or other processes.

Among them, in the embodiment of the present application, the first capillary structure 13, the second capillary structure 14, and the first support structure 17 and the second support structure that are the capillary structures, the working liquid adsorbed in the work liquid may be a liquid with a high latent heat of vaporization, for example Water, methanol, acetone and other simple substances or their mixed working fluid liquids.

In the embodiment of the present application, the thickness of the uniform temperature plate 10 is less than or equal to 0.22 mm, and has a small thickness. When it is installed in an electronic device, it helps to reduce the overall thickness of the electronic device, and meets the requirements for the lightness and thinness of the electronic device. Development needs, and at the same time has a good uniform temperature and heat dissipation performance.

Referring to FIG. 2 and FIG. 3, the housing 11 may include a first shell 111 and a second shell 112, and inner walls of the first shell 111 and the second shell 112 define a sealed receiving cavity 12. Wherein, the molding material of the first shell 111 and the second shell 112 can be metal or alloy, such as copper alloy, etc., and recessed grooves are formed on the first shell 111 and the second shell 112 by etching, and the first shell 111 The sealed cavity can be formed with the second shell 112 through diffusion welding, brazing or other welding processes.

Figure 14 is a simulation cloud diagram of the vapor pressure drop of the uniform temperature plate in Figure 1, and Figure 15 is a simulation cloud diagram of the vapor pressure drop of the uniform temperature plate in Figure 4, as shown in Figures 14 and 15, the above-mentioned existing uniform temperature plate, which The vapor pressure drop and the liquid pressure drop are 2440 Pa and 1200 Pa, respectively, while the vapor pressure drop and liquid pressure drop of the temperature equalizing plate in the embodiment of the application are 2280 Pa and 814 Pa, respectively. Compared with the existing uniform temperature plate, the embodiment of the application The evaporation area of the provided temperature equalization plate is increased by about four times, and the total pressure drop is reduced by about 500 Pa. This indicates that the temperature equalization plate provided by the present application includes the first capillary structure 13 and the second capillary structure 14, wherein The first end and the second end of the capillary structure 13 abut on the inner bottom wall and the inner top wall of the accommodating cavity 12 of the temperature equalizing plate 10, respectively. The second capillary structure 14 covers the heat source area 121 and makes the second capillary structure 14 There is a gap between at least a part of the side facing away from the heat source area 121 and the inner top wall of the accommodating cavity 12. After the working fluid absorbs heat and vaporizes, it can not only evaporate from the sides of the first capillary structure 13 and the second capillary structure 14, but It can also evaporate from the side of the second capillary structure 14 away from the heat source area 121, which effectively increases the evaporation area and reduces the vapor pressure drop, thereby improving the temperature uniformity performance of the uniform temperature plate 10.

Scene two

In the embodiment of the present application, as shown in FIGS. 16 and 17, the difference from scene one is that at least part of the capillary structure includes a first section of capillary structure 13a and a second section of capillary structure connected to the first section of capillary structure 13a. Structure 13b. Wherein, as shown in FIGS. 18 and 19, the first capillary structure 13a is located on the side of the second capillary structure 14 away from the heat source area 121, that is, the second capillary structure 14 is located on the inner bottom wall of the containing cavity 12 and the first section Between the capillary structures 13a, the second capillary structure 13b is located in the non-heat source area on the inner bottom wall of the containing cavity 12, and the second capillary structure 14, the first capillary structure 13a and the inner top wall of the containing cavity 12 define at least one The second vapor chamber 16 communicates with the first vapor chamber 15, so that the working fluid can evaporate from the side of the second capillary structure 14 away from the heat source region 121 and the side of the first section of capillary structure 13a into the second vapor chamber 16, and is The cooler part of the cavity 12 contacts and exchanges heat, which effectively increases the evaporation area and improves the heat uniformity of the uniform temperature plate 10.

Wherein, as shown in FIG. 19, the lowest vertical thickness δ2 of the second capillary structure 14 is smaller than the maximum vertical thickness δ1 of the first capillary structure 13, and the first section of capillary structure 13a is located in the second capillary structure 14 away from the heat source region 121 On one side, specifically, the vertical thickness of the first-stage capillary structure 13a can be made smaller than that of the second-stage capillary structure 13b, and the vertical height of the first-stage capillary structure 13a facing the heat source region 121 is higher than that of the second-stage capillary structure 13b. The vertical height of the section of capillary structure 13b facing the heat source area 121, the two ends of the second section of capillary structure 13b abut on the inner bottom wall and the inner top wall of the accommodating cavity 12, at this time, the first section of capillary structure 13a faces There is a certain gap between one side of the heat source area 121 and the inner bottom wall of the accommodating cavity 12, and the second capillary structure 14 can be inserted into the gap, thereby fixing the second capillary structure 14 on the first section of the capillary structure 13a and the accommodating chamber. Between the inner bottom walls of the cavity 12, the communication between the first capillary structure 13 and the second capillary structure 14 can also be facilitated.

It should be noted that since the second capillary structure 14 covers the heat source area 121, the first capillary structure 13a is located on the side of the second capillary structure 14 away from the heat source area 121, so that the first capillary structure 13a is located on the second capillary Between the structure 14 and the inner top wall of the containing cavity 12, there is a gap between the second capillary structure 14 and the inner top wall of the containing cavity 12. The difference is that in the embodiment of the present application, the first supporting structure 17 does not need to be provided to play a supporting role in the gap.

Wherein, the orthographic projection area of the second capillary structure 14 on the inner bottom wall of the accommodating cavity 12 may be 70%-130% of the orthographic area of the heating element 20 on the housing 11, and the second capillary structure 13b is located in the second section. Between the capillary structure 14 and the inner top wall of the accommodating cavity 12, therefore, the orthographic projection area of the second capillary structure 13b on the inner bottom wall of the accommodating cavity 12 can also be 70% of the orthographic projection area of the heating element 20 on the housing 11. %-130%. The vertical thickness of the first section of capillary structure 13a is smaller than the vertical thickness of the second section of capillary structure 13b. Specifically, the minimum vertical thickness of the first section of capillary structure 13a may be 10 times the maximum vertical thickness of the second section of capillary structure 13b. %-90%.

The embodiment of the present application also provides an electronic device, including a heating device 20 and any one of the above-mentioned uniform temperature plates 10, the heating device 20 is in contact with the outer surface of the uniform temperature plate 10, and the heating device 20 is in contact with the heat source area of the uniform temperature plate 10 121 correspondingly, the heat generated by the heating device 20 is dissipated through the uniform temperature plate 10.

Wherein, in the embodiment of the present application, the heating device 20 may be a chip, or the heating device 20 may also be a battery, a battery circuit board, or the like.

In the embodiment of the present application, the above-mentioned uniform temperature plate 10 is provided in the electronic device. The uniform temperature plate 10 not only has a relatively thin vertical thickness, but also has good uniform temperature and heat dissipation performance, which helps to meet the requirements of the thinning of the electronic device. At the same time, the electronic equipment is endowed with good heat dissipation performance to ensure the service life of the electronic equipment and improve the user experience.

In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly defined and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense, for example, it may be a fixed connection or Indirect connection through an intermediate medium can be the internal communication between two elements or the interaction between two elements. For those of ordinary skill in the art, the specific meanings of the above-mentioned terms in the embodiments of the present application can be understood according to specific circumstances.

The terms "first", "second", "third", "fourth", etc. (if any) in the description and claims of the embodiments of the present application and the above-mentioned drawings are used to distinguish similar objects, and It does not have to be used to describe a specific order or sequence.

Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of the present application, not to limit them; although the embodiments of the present application are described in detail with reference to the foregoing embodiments, those of ordinary skill in the art It should be understood that: it can still modify the technical solutions described in the foregoing embodiments, or equivalently replace some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the embodiments of this application. The scope of the technical solution of each embodiment.

Claims

A temperature equalizing plate for contacting a heating device to dissipate the heating device. The heat source area corresponding to the heating device;

The containing cavity is provided with a first capillary structure, the first end of the first capillary structure is in contact with the inner bottom wall of the containing cavity, and the second end of the first capillary structure is in contact with the inner bottom wall of the containing cavity. The inner top wall abuts, the working fluid in the first capillary structure evaporates and enters the containing cavity from the side of the first capillary structure;

The containing cavity is also provided with a second capillary structure, the second capillary structure at least covers the heat source area, and the side of the second capillary structure facing away from the heat source area and the inner ceiling of the containing cavity There are gaps between the walls.
The temperature equalization plate according to claim 1, wherein the side surface of the first capillary structure, the side surface of the second capillary structure and the inner wall of the containing cavity form a first vapor cavity that communicates with each other.
The temperature equalizing plate according to claim 2, wherein at least one second vapor cavity is formed between the second capillary structure and the inner top wall of the containing cavity.
The temperature equalization plate according to claim 3, wherein the first capillary structure comprises a plurality of capillary structure members arranged at intervals, and the capillary structure members extend from the end of the non-heat source area to the end of the heat source area, at least Part of the capillary structure includes a first section of capillary structure and a second section of capillary structure connected to the first section of capillary structure;

The first-stage capillary structure is located in the heat source area, and the second-stage capillary structure is located in the non-heat source area on the inner bottom wall of the accommodating cavity;

The second capillary structure is located between two adjacent first-segment capillary structures, and the second capillary structure, the first-segment capillary structure and the inner top wall of the accommodating cavity define at least one and The second vapor chamber communicates with the first vapor chamber.
The temperature equalization plate according to claim 3, wherein the first capillary structure comprises a plurality of capillary structure members arranged at intervals, and the capillary structure members extend from the end of the non-heat source area to the end of the heat source area, at least Part of the capillary structure includes a first section of capillary structure and a second section of capillary structure connected to the first section of capillary structure;

The first capillary structure is located on a side of the second capillary structure facing away from the heat source area, and the second capillary structure is located in a non-heat source area on the inner bottom wall of the accommodating cavity;

The second capillary structure, the first section of capillary structure, and the inner top wall of the containing cavity define at least one second vapor chamber communicating with the first vapor chamber.
The temperature equalization plate according to claim 4 or 5, wherein the orthographic projection area of the second capillary structure on the inner bottom wall of the accommodating cavity is the orthographic projection of the heating element on the housing 70%-130% of the area.
The temperature equalizing plate according to any one of claims 1 to 6, wherein the first capillary structure and the second capillary structure are connected.
The temperature equalization plate according to any one of claims 1-7, further comprising: at least one first support structure, one end of the first support structure abuts on the second capillary structure, and the first support structure abuts against the second capillary structure. The other end of a supporting structure abuts on the inner top wall of the containing cavity.
The temperature equalization plate according to claim 8, wherein the first supporting structure is a solid structure, or the first supporting structure is a capillary structure.
The temperature equalizing plate according to claim 9, wherein the first supporting structure is a mesh, fiber or sintered copper powder.
The temperature equalizing plate according to claim 10, wherein the cross-sectional shape of the first supporting structure includes a circle, a rectangle, or a structure with a groove on the outer wall.
The temperature equalizing plate according to any one of claims 1-11, wherein the first capillary structure and the second capillary structure are integrally formed.
The temperature equalizing plate according to any one of claims 1-12, wherein the maximum thickness of the second capillary structure is 10%-90% of the minimum thickness of the first capillary structure.
The temperature equalization plate according to any one of claims 1-13, wherein the first capillary structure and the second capillary structure are porous structures, and the porous structures include sintered copper mesh, sintered copper powder, etching Grooves or micropillars.
The temperature equalization plate according to any one of claims 1-14, further comprising a second support structure, the second support structure is located between two adjacent first capillary structures, the first One end of the two supporting structures abuts against the inner bottom wall of the containing cavity, and the other end of the second supporting structure abuts against the inner top wall of the containing cavity.
The temperature equalization plate according to any one of claims 1-15, wherein the housing comprises: a first housing and a second housing, and the inner walls of the first housing and the second housing form a sealed述 Accommodation cavity.
An electronic device, characterized by comprising a heating device and the uniform temperature plate of any one of the above claims 1-16, the heating device is in contact with the outer surface of the uniform temperature plate, and the heating device is in contact with the The heat source area of the temperature equalizing plate corresponds to that.
The electronic device according to claim 17, wherein the heating device is a chip, a battery or a battery circuit board.